Thinning process for preventing wafer surface from being damaged

Abstract

The invention belongs to the technical field of wafer surface thinning, and particularly relates to a thinning process for preventing wafer surface damage. An operation table is included, an adjusting groove is formed in the top of the operation table, a sliding block is slidably mounted in the adjusting groove, a mounting disc is fixedly mounted at the top of the sliding block, and a plurality of clamping blocks are arranged at the top of the mounting disc; a rubber pad is fixedly mounted on one side of the clamping block; and the two U-shaped frames are fixedly installed at the top of the operation table, electric push rods are fixedly installed in the U-shaped frames, driving boxes are fixedly installed at the output ends of the electric push rods, and first driving motors are fixedly installed in the driving boxes. The clamping assembly can adapt to the processing requirements of wafers with different sizes, avoids frequent disassembly and replacement of the whole set of clamping assembly, remarkably simplifies the operation process, shortens the remodeling time, reduces the loss of the clamping assembly, and reduces the equipment maintenance and production auxiliary cost.

Description

Technical Field

[0001] This invention belongs to the field of wafer surface thinning technology, and particularly relates to a thinning process to prevent wafer surface damage. Background Technology

[0002] In the semiconductor manufacturing field, as chips develop towards higher integration and miniaturization, wafer thinning has become one of the key processes. The core purpose of wafer thinning is to reduce device thickness, improve heat dissipation performance, and meet the precise requirements of packaging processes for wafer thickness. Its process quality directly determines the electrical performance and reliability of subsequent chips. Currently, most mainstream wafer thinning processes rely on mechanical grinding methods. However, in practical applications, existing technologies still have three major pain points, making it difficult to adapt to the semiconductor industry's dual requirements for wafer processing precision and efficiency.

[0003] The clamping adaptability of wafers of different sizes is poor. Existing clamping devices are mostly designed for single-size wafers. When processing wafers of different sizes, the entire clamping assembly needs to be disassembled and replaced, which is not only cumbersome and time-consuming, but also lacks the ability to control wafer surface damage. Existing processes often use grinding for thinning operations, but grinding easily forms microcracks and scratches on the surface, requiring an additional grinding repair process, which increases production costs and reduces wafer yield. In addition, the grinding disc is difficult to replace and inefficient. As a core consumable, the grinding disc will experience a decrease in grinding accuracy due to abrasive wear over long-term use. In view of this, we propose a thinning process to prevent wafer surface damage. Summary of the Invention

[0004] The purpose of this invention is to provide a thinning process that prevents damage to the wafer surface, thereby solving the problems mentioned in the background art.

[0005] In view of this, the present invention provides a thinning process to prevent damage to the wafer surface, comprising the following steps: S1: Use isopropanol solution to ultrasonically clean the wafer surface to remove residual dust and organic impurities, and avoid impurities causing surface scratches in subsequent processes. After cleaning, use nitrogen to dry to prevent water stains from affecting the fixation stability. S2: Place the pre-processed wafer face down and use a fixing device to fix the wafer on the carrier, ensuring that the wafer is aligned with the center of the carrier, while also avoiding wafer deformation or damage due to uneven pressure. S3: Use a diamond grinding wheel to rough grind the wafer, while leaving a 50μm margin for subsequent fine processing. During the rough grinding process, continuously spray deionized water for cooling. This reduces the contact temperature between the grinding wheel and the wafer to avoid thermal damage and washes away grinding debris to prevent secondary scratches on the wafer surface. S4: A high-precision diamond polishing wheel is selected, and colloidal silica polishing slurry is used to polish the wafer. Closed-loop control is adopted during the polishing process. The wafer surface condition is monitored in real time by an optical surface inspection instrument. When no scratches, chipping or other defects are detected on the surface, polishing is automatically stopped to ensure that the wafer surface is undamaged and meets the precision requirements. S5: After the thinning is completed, the wafer is removed and then placed in an ultrapure water ultrasonic cleaner to remove the residual polishing liquid and impurities on the surface. After cleaning, the wafer surface is inspected by a metallographic microscope to confirm that there are no scratches, dents or other damage. At the same time, the wafer thickness uniformity and warpage are checked. If it passes the test, it will proceed to the next process.

[0006] The above technical solution further includes: The operating table has an adjustment groove on its top, a sliding block is slidably installed in the adjustment groove, an installation plate is fixedly installed on the top of the sliding block, a number of clamping blocks are provided on the top of the installation plate, and a rubber pad is fixedly installed on one side of the clamping block. Two U-shaped frames are fixedly installed on the top of the operating table. An electric push rod is fixedly installed inside the U-shaped frame. A drive box is fixedly installed at the output end of the electric push rod. A drive motor is fixedly installed inside the drive box. The output end of the drive motor passes through the bottom of the drive box and is fixedly installed with a rotating disk. A rectangular groove is opened at the bottom of the rotating disk. A plug-in block is inserted into the rectangular groove. A grinding disc is fixedly installed at the bottom of the plug-in block. A limiting component, located within the operating table, is used to limit the movement of the sliding block; A drive assembly, located within the mounting disk, is used to drive a plurality of clamping blocks to move.

[0007] In this technical solution, during use, personnel can first place the wafer to be thinned on the mounting tray. Then, personnel can drive the drive component to move several clamping blocks, causing the clamping blocks to move closer to the center of the mounting tray until the rubber pads on the clamping blocks press against the periphery of the wafer, thereby clamping the wafer. At this time, the rubber pads will deform, and under the action of friction of the rubber pads, the wafer can be firmly fixed to the top of the mounting tray. At the same time, by moving the clamping blocks, wafers of different sizes can be clamped and fixed, which can adapt to the processing needs of wafers of different sizes, avoid frequent disassembly and replacement of the entire set of clamping components, significantly simplify the operation process, shorten the changeover time, reduce the wear of clamping components, and reduce equipment maintenance and production auxiliary costs. Subsequently, one of the drive motors can be activated. The output shaft of drive motor one will drive the rotating disk to rotate. The rotation of the rotating disk will drive the insertion block to rotate through the rectangular slot. The rotation of the insertion block will drive the polishing disk to rotate. Then, one of the electric push rods will be activated. The output shaft of the electric push rod will drive the drive box to move downward, thereby moving the polishing disk downward. The downward movement of the polishing disk can perform rough grinding on the surface of the wafer, thereby achieving the thinning effect. Then, the limiting component will release the sliding block from the limiting position. The operator can then move the mounting plate. The mounting plate will drive the sliding block to slide in the adjustment slot until the sliding block moves from one side of the adjustment slot to the other side. At this time, the limiting component can fix the sliding block. Then, the operator can use another high-precision polishing disk to polish the wafer surface through the above operation. This ensures that the wafer surface is effectively protected after thinning, without the need for additional grinding and repair processes. This reduces material waste and process costs, and significantly improves the wafer processing yield, laying the foundation for the stability of the subsequent chip electrical performance.

[0008] In the above technical solution, the limiting component further includes: Two sliding grooves are symmetrically arranged inside the operating table and located on one side of the adjustment groove. A limit block is slidably installed in the sliding groove. One end of the limit block passes through one side of the sliding groove and extends into the adjustment groove. A pull rod is fixedly installed at the other end of the limit block and located inside the sliding groove. One end of the pull rod passes through the other side of the sliding groove and extends to the outside and is rotatably fitted with a pull ring. A spring is sleeved on the pull rod and located inside the sliding groove. A limit hole is opened on one side of the sliding block.

[0009] In this technical solution, an operator can activate one of the drive motors. The output shaft of the drive motor will drive the rotating disk to rotate. The rotation of the rotating disk will drive the insertion block to rotate through the rectangular slot. The rotation of the insertion block will drive the grinding disk to rotate. Then, an electric push rod will be activated. The output shaft of the electric push rod will drive the drive box to move downward, thereby moving the grinding disk downward. The downward movement of the grinding disk can perform rough grinding on the surface of the wafer, thereby achieving a thinning effect. Subsequently, pulling one of the pull rings will drive the pull rod to move. The movement of the pull rod will drive the limit block to move. The movement of the limit block will compress the spring and retract it until one end of the limit block moves out of the limit hole. At this time, the limit block can release the sliding block, and the operator can move the mounting plate. The loading process causes the sliding block to slide within the adjustment groove until it moves from one side to the other. Simultaneously, the sliding block compresses another limiting block, causing it to retract. This retraction compresses a spring, and once the sliding block reaches its designated position, the spring's rebound force compresses the other limiting block, moving it until one end of the other limiting block inserts into a limiting hole, thus fixing the sliding block in place. Subsequently, personnel can use a high-precision polishing disc to polish the wafer surface using the above operation. This ensures that wafer surface damage is effectively avoided after wafer thinning, eliminating the need for additional grinding and repair processes. This reduces material waste and process costs while significantly improving wafer processing yield, laying the foundation for stable electrical performance of subsequent chips.

[0010] In the above technical solution, one end of the limiting block is inserted into the limiting hole, one end of the limiting block has an inclined structure, and the pull rod is slidably connected to the sliding groove and the operating table.

[0011] In this technical solution, it is ensured that one end of the limiting block can be inserted into the limiting hole, that the movement of the sliding block can squeeze the limiting block to move, and that the pull rod can slide normally in the sliding groove and the operating table.

[0012] In the above technical solution, the driving component further includes: A plurality of limiting grooves are formed on the top of the mounting plate. A sliding rod is slidably installed in each limiting groove. The top end of the sliding rod passes through the top of the limiting groove and is fixed to a corresponding clamping block. A rotating groove is formed in the mounting plate. A turntable is rotatably installed in the rotating groove. A plurality of arc-shaped grooves are formed on the turntable. The bottom end of the sliding rod extends into the corresponding arc-shaped groove. A drive groove is formed in the mounting plate and below the rotating groove. A second drive motor is fixedly installed in the drive groove. The output end of the second drive motor passes through the top of the drive groove and is coaxially connected to the turntable.

[0013] In this technical solution, during use, the operator first places the wafer to be thinned on the mounting tray. Then, the operator starts the second drive motor, whose output shaft drives the turntable to rotate. The rotation of the turntable causes several arc-shaped grooves to rotate, which in turn press several sliding rods to move. Under the limiting action of several limiting grooves, the sliding rods can move within the limiting grooves. At the same time, the movement of the sliding rods causes the clamping blocks to move, bringing the clamping blocks closer to the center of the mounting tray until the rubber pads on the clamping blocks abut against the periphery of the wafer, thus clamping the wafer. At this time, the rubber pads deform, and under the action of friction, the wafer is firmly fixed to the top of the mounting tray. At the same time, by moving the clamping blocks, wafers of different sizes can be clamped and fixed, which can adapt to the processing needs of wafers of different sizes. This avoids frequent disassembly and replacement of the entire clamping assembly, significantly simplifies the operation process, shortens changeover time, reduces wear and tear on the clamping components, and lowers equipment maintenance and production auxiliary costs.

[0014] In the above technical solution, the bottom end of the sliding rod is movably connected to the arc-shaped groove, and the output shaft of the second drive motor is rotatably connected to the mounting plate.

[0015] In this technical solution, it is ensured that the bottom end of the sliding rod can rotate and slide within the arc groove, thus ensuring that the output shaft of the second drive motor can rotate normally within the mounting plate.

[0016] Furthermore, the above technical solution also includes: A plug rod is inserted and installed inside the rotating disk. One end of the plug rod passes through the plug block. Both sides of the rotating disk and the plug block are threaded with hexagonal socket screws, one end of which passes through the plug rod.

[0017] In this technical solution, the insertion rod and plug block ensure that personnel can easily replace the severely worn grinding disc, so that the grinding disc will not affect the grinding effect.

[0018] In the above technical solution, one end of the internal hexagon screw is threadedly connected to the insert rod.

[0019] In this technical solution, it is ensured that the internal hex screw can be screwed into the insert.

[0020] The beneficial effects of this invention are: 1. This thinning process to prevent wafer surface damage can clamp and fix wafers of different sizes by moving several clamping blocks. It can adapt to the processing needs of wafers of different sizes, avoid frequent disassembly and replacement of the entire set of clamping components, significantly simplify the operation process, shorten the changeover time, reduce the wear of clamping components, and reduce equipment maintenance and production auxiliary costs.

[0021] 2. This wafer thinning process, which prevents damage to the wafer surface, allows personnel to polish the wafer surface using another high-precision polishing disc. This ensures that wafer surface damage can be effectively avoided after thinning, eliminating the need for additional grinding and repair processes. This reduces material waste and process costs, significantly improves wafer processing yield, and lays the foundation for stable electrical performance of subsequent chips.

[0022] 3. This thinning process to prevent wafer surface damage addresses the pain points of decreased precision and difficult replacement caused by wear of the grinding disc. By improving the grinding disc mounting structure or adopting a quick-replacement design, the process reduces the complexity of disassembling and replacing the grinding disc, shortens downtime, and, combined with a grinding disc wear monitoring mechanism, enables precise replacement, avoids excessive use affecting processing accuracy, further ensures the stability of the thinning process, and improves overall production efficiency. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the exploded drive box in this invention; Figure 3 This is a cross-sectional structural diagram of the drive box in this invention; Figure 4 This is a cross-sectional view of the operating table in this invention. Figure 5 For the present invention Figure 4 Enlarged structural diagram at point A in the middle; Figure 6 This is a schematic diagram of the regional structure of the installation disk in this invention; Figure 7 For the present invention Figure 6 Enlarged structural diagram at point B; Figure 8 This is a schematic diagram of the structure of the turntable explosion in this invention; Figure 9 For the present invention Figure 8 Enlarged structural diagram at point C; Figure 10 This is a cross-sectional structural diagram of the mounting disk in this invention.

[0024] The markings in the diagram are as follows: 1. Operating table; 2. Adjustment groove; 3. Sliding block; 4. Mounting plate; 5. U-shaped frame; 6. Electric push rod; 7. Drive box; 8. Drive motor one; 9. Rotating plate; 10. Rectangular groove; 11. Insertion block; 12. Grinding plate; 13. Insert rod; 14. Hex socket screw; 15. Sliding groove; 16. Limiting block; 17. Limiting hole; 18. Pull rod; 19. Spring; 20. Pull ring; 21. Limiting groove; 22. Sliding rod; 23. Clamping block; 24. Rubber pad; 25. Rotating groove; 26. Turntable; 27. Arc groove; 28. Drive groove; 29. ​​Drive motor two. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0026] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0027] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] It should be noted that in the description of this application, the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0029] It should be noted that, in this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0030] Example 1: Please see Figure 1 - Figure 10 As shown, this embodiment provides a wafer surface thinning process to prevent damage, including the following steps: S1: Use isopropanol solution to ultrasonically clean the wafer surface to remove residual dust and organic impurities, and avoid impurities causing surface scratches in subsequent processes. After cleaning, use nitrogen to dry to prevent water stains from affecting the fixation stability. S2: Place the pre-processed wafer face down and use a fixing device to fix the wafer on the carrier, ensuring that the wafer is aligned with the center of the carrier, while also avoiding wafer deformation or damage due to uneven pressure. S3: Use a diamond grinding wheel to rough grind the wafer, while leaving a 50μm margin for subsequent fine processing. During the rough grinding process, continuously spray deionized water for cooling. This reduces the contact temperature between the grinding wheel and the wafer to avoid thermal damage and washes away grinding debris to prevent secondary scratches on the wafer surface. S4: A high-precision diamond polishing wheel is selected, and colloidal silica polishing slurry is used to polish the wafer. Closed-loop control is adopted during the polishing process. The wafer surface condition is monitored in real time by an optical surface inspection instrument. When no scratches, chipping or other defects are detected on the surface, polishing is automatically stopped to ensure that the wafer surface is undamaged and meets the precision requirements. S5: After the thinning is completed, the wafer is removed and then placed in an ultrapure water ultrasonic cleaner to remove the residual polishing liquid and impurities on the surface. After cleaning, the wafer surface is inspected by a metallographic microscope to confirm that there are no scratches, dents or other damage. At the same time, the wafer thickness uniformity and warpage are checked. If it passes the test, it will proceed to the next process.

[0031] Example 2: This embodiment provides a wafer thinning device to prevent damage to the wafer surface. In addition to the technical solutions of the above embodiments, it also has the following technical features, including: The operating table 1 has an adjustment groove 2 on its top. A sliding block 3 is slidably installed in the adjustment groove 2. An installation plate 4 is fixedly installed on the top of the sliding block 3. Several clamping blocks 23 are provided on the top of the installation plate 4. A rubber pad 24 is fixedly installed on one side of the clamping block 23. Two U-shaped frames 5 are fixedly installed on the top of the operating table 1. An electric push rod 6 is fixedly installed inside the U-shaped frame 5. A drive box 7 is fixedly installed at the output end of the electric push rod 6. A drive motor 8 is fixedly installed inside the drive box 7. The output end of the drive motor 8 passes through the bottom of the drive box 7 and a rotating disk 9 is fixedly installed. A rectangular groove 10 is opened at the bottom of the rotating disk 9. A plug-in block 11 is inserted into the rectangular groove 10. A grinding disc 12 is fixedly installed at the bottom of the plug-in block 11. A limiting component is located inside the operating table 1 and is used to limit the sliding block 3. The drive component is located inside the mounting disk 4 and is used to drive several clamping blocks 23 to move.

[0032] In this system, the operator first places the wafer to be thinned on the mounting tray 4. Then, the operator can use the drive component to move several clamping blocks 23, causing the clamping blocks 23 to move closer to the center of the mounting tray 4 until the rubber pads 24 on the clamping blocks 23 press against the periphery of the wafer, thus clamping the wafer. At this time, the rubber pads 24 will deform, and under the action of the friction of the rubber pads 24, the wafer can be firmly fixed to the top of the mounting tray 4. At the same time, by moving the clamping blocks 23, wafers of different sizes can be clamped and fixed, which can adapt to the processing needs of wafers of different sizes, avoid frequent disassembly and replacement of the entire set of clamping components, significantly simplify the operation process, shorten the changeover time, reduce the wear of clamping components, and reduce equipment maintenance and production auxiliary costs. Subsequently, one of the drive motors, 8, can be activated. The output shaft of drive motor 8 will drive the rotating disk 9 to rotate. The rotation of the rotating disk 9 will drive the insertion block 11 to rotate through the rectangular slot 10. The rotation of the insertion block 11 will drive the grinding disk 12 to rotate. Then, one of the electric push rods, 6, will be activated. The output shaft of electric push rod 6 will drive the drive box 7 to move downward, thereby driving the grinding disk 12 to move downward. The downward movement of the grinding disk 12 can perform rough grinding on the surface of the wafer, thereby achieving a thinning effect. Afterward, the sliding block 3 will be released from its limit by the limiting component. Personnel can move the mounting plate 4, which will cause the sliding block 3 to slide within the adjustment groove 2 until the sliding block 3 moves from one side of the adjustment groove 2 to the other side. At this point, the limiting component can fix the sliding block 3. Subsequently, personnel can use another high-precision polishing plate 12 to polish the wafer surface through the above operation, ensuring that wafer surface damage can be effectively avoided after wafer thinning, without the need for additional grinding and repair processes. This reduces material waste and process costs, and significantly improves wafer processing yield, laying the foundation for the stable electrical performance of subsequent chips.

[0033] Example 3: This embodiment provides a thinning device to prevent damage to the wafer surface. In addition to the technical solutions of the above embodiments, it also has the following technical features, including a limiting component: Two sliding grooves 15 are symmetrically opened in the operating table 1 and located on one side of the adjustment groove 2. A limit block 16 is slidably installed in the sliding groove 15. One end of the limit block 16 passes through one side of the sliding groove 15 and extends into the adjustment groove 2. A pull rod 18 is fixedly installed at the other end of the limit block 16 and located in the sliding groove 15. One end of the pull rod 18 passes through the other side of the sliding groove 15 and extends to the outside and is rotatably installed with a pull ring 20. A spring 19 is sleeved on the pull rod 18 and located in the sliding groove 15. A limit hole 17 is opened on one side of the sliding block 3.

[0034] The process involves several steps. First, a driver can activate one of the drive motors, 8. The output shaft of drive motor 8 rotates the rotating disk 9, which in turn rotates the insertion block 11 via the rectangular slot 10. The insertion block 11 then rotates the grinding disk 12. Next, an electric push rod 6 is activated. Its output shaft moves the drive box 7 downwards, which in turn moves the grinding disk 12 downwards. This downward movement of the grinding disk 12 roughens the wafer surface, achieving a thinning effect. Then, a pull ring 20 is pulled, which moves the pull rod 18. The pull rod 18 moves the limiting block 16, which in turn compresses the spring 19 until one end of the limiting block 16 moves out of the limiting hole 17. At this point, the limiting block 16 releases the sliding block 3, allowing the driver to move the device. The mounting tray 4 will cause the sliding block 3 to slide within the adjustment groove 2 until the sliding block 3 moves from one side of the adjustment groove 2 to the other side. At the same time, the sliding block 3 will compress another limiting block 16 to retract. The retraction of the limiting block 16 will compress the spring 19 to retract. When the sliding block 3 reaches the designated position, under the action of the rebound force of the spring 19, the spring 19 will compress the other limiting block 16 to move until one end of the other limiting block 16 is inserted into the limiting hole 17, thereby fixing the sliding block 3. Subsequently, the personnel can use another high-precision polishing disc 12 to polish the wafer surface through the above operation, ensuring that wafer surface damage can be effectively avoided after wafer thinning, without the need for additional grinding and repair processes. This reduces material waste and process costs, and significantly improves wafer processing yield, laying the foundation for the stable electrical performance of subsequent chips.

[0035] Example 4: This embodiment provides a thinning device to prevent damage to the wafer surface. In addition to the technical solutions of the above embodiments, it also has the following technical features: one end of the limiting block 16 is inserted into the limiting hole 17, one end of the limiting block 16 has an inclined structure, and the pull rod 18 is slidably connected to the sliding groove 15 and the operating table 1.

[0036] Specifically, it is ensured that one end of the limiting block 16 can be inserted into the limiting hole 17, that the movement of the sliding block 3 can squeeze the limiting block 16 to move, and that the pull rod 18 can slide normally in the sliding groove 15 and the operating table 1.

[0037] Example 5: This embodiment provides a wafer surface thinning device to prevent damage. In addition to the technical solutions described in the above embodiments, it also has the following technical features: the driving component includes: A number of limiting grooves 21 are formed on the top of the mounting plate 4. A sliding rod 22 is slidably installed in the limiting groove 21. The top end of the sliding rod 22 passes through the top of the limiting groove 21 and is fixed to the corresponding clamping block 23. A rotating groove 25 is formed in the mounting plate 4. A turntable 26 is rotatably installed in the rotating groove 25. A number of arc-shaped grooves 27 are formed on the turntable 26. The bottom end of the sliding rod 22 extends into the corresponding arc-shaped groove 27. A drive groove 28 is formed in the mounting plate 4 and below the rotating groove 25. A second drive motor 29 is fixedly installed in the drive groove 28. The output end of the second drive motor 29 passes through the top of the drive groove 28 and is coaxially connected to the turntable 26.

[0038] In operation, the operator first places the wafer to be thinned onto the mounting tray 4. Then, the operator starts the drive motor 29. The output shaft of the drive motor 29 drives the turntable 26 to rotate. The rotation of the turntable 26 causes several arc-shaped grooves 27 to rotate, which in turn presses against several sliding rods 22, causing them to move. Under the control of several limiting grooves 21, the sliding rods 22 can move within the limiting grooves 21. Simultaneously, the movement of the sliding rods 22 causes the clamping blocks 23 to move, causing the clamping blocks 23 to move towards the center of the mounting tray 4. The wafer is brought closer until the rubber pads 24 on the clamping blocks 23 press against the periphery of the wafer, thus clamping the wafer. At this time, the rubber pads 24 will deform. Under the action of the friction of the rubber pads 24, the wafer can be firmly fixed on the top of the mounting plate 4. At the same time, the clamping blocks 23 can be moved to clamp and fix wafers of different sizes. It can adapt to the processing needs of wafers of different sizes, avoid frequent disassembly and replacement of the entire clamping assembly, significantly simplify the operation process, shorten the changeover time, reduce the wear of the clamping assembly, and reduce equipment maintenance and production auxiliary costs.

[0039] Example 6: This embodiment provides a thinning device to prevent damage to the wafer surface. In addition to the technical solutions of the above embodiments, it also has the following technical features: the bottom end of the sliding rod 22 is movably connected to the arc groove 27, and the output shaft of the drive motor 29 is rotatably connected to the mounting plate 4.

[0040] Specifically, it ensures that the bottom end of the sliding rod 22 can rotate and slide within the arc groove 27, and ensures that the output shaft of the drive motor 29 can rotate normally within the mounting plate 4.

[0041] Example 7: This embodiment provides a wafer thinning device to prevent damage to the wafer surface. In addition to the technical solutions of the above embodiments, it also has the following technical features, and further includes: Insert rod 13 is inserted into the rotating disk 9. One end of insert rod 13 passes through the insertion block 11. Hex socket screws 14 are threaded on both sides of the rotating disk 9 and the insertion block 11. One end of the hex socket screws 14 passes through insert rod 13.

[0042] The insertion rod 13 and the insertion block 11 ensure that personnel can easily replace the severely worn grinding disc 12, so that the grinding disc 12 will not affect the grinding effect.

[0043] Example 8: This embodiment provides a thinning device to prevent damage to the wafer surface. In addition to the technical solution of the above embodiment, it also has the following technical features: one end of the internal hexagon screw 14 is threadedly connected to the insert rod 13.

[0044] This ensures that the internal hex screw 14 can be screwed into the insert 13.

[0045] Working principle: In use, the operator first places the wafer to be thinned on the mounting tray 4. Then, the operator starts the drive motor 29. The output shaft of the drive motor 29 drives the turntable 26 to rotate. The rotation of the turntable 26 drives several arc-shaped grooves 27 to rotate. The rotation of the arc-shaped grooves 27 will press several sliding rods 22 to move. Under the limiting action of several limiting grooves 21, the sliding rods 22 can move within the limiting grooves 21. At the same time, the movement of the sliding rods 22 will drive the clamping blocks 23 to move, so that the clamping blocks 23 move towards the center of the mounting tray 4. The wafer is brought close to the mounting plate 4 until the rubber pads 24 on the clamping blocks 23 press against the periphery of the wafer, thereby clamping the wafer. At this time, the rubber pads 24 will deform. Under the action of the friction of the rubber pads 24, the wafer can be firmly fixed on the top of the mounting plate 4. At the same time, the clamping blocks 23 can be moved to clamp and fix wafers of different sizes. It can adapt to the processing needs of wafers of different sizes, avoid frequent disassembly and replacement of the entire clamping assembly, significantly simplify the operation process, shorten the changeover time, reduce the wear of the clamping assembly, and reduce equipment maintenance and production auxiliary costs. Subsequently, personnel can activate one of the drive motors, 8. The output shaft of drive motor 8 will drive the rotating disk 9 to rotate. The rotation of the rotating disk 9 will drive the insertion block 11 to rotate through the rectangular slot 10. The rotation of the insertion block 11 will drive the grinding disk 12 to rotate. Then, activate one of the electric push rods 6. The output shaft of electric push rod 6 will drive the drive box 7 to move downward, thereby driving the grinding disk 12 to move downward. The downward movement of the grinding disk 12 can perform rough grinding on the surface of the wafer, thereby achieving a thinning effect. Then, pull one of the pull rings 20. Pull ring 20 will drive the pull rod 18 to move. The movement of pull rod 18 will drive the limit block 16 to move. The movement of limit block 16 will compress the spring 19 to retract until one end of limit block 16 moves out of the limit hole 17. At this time, limit block 16 can release the limit on sliding block 3, and personnel can move the device. The mounting tray 4 will cause the sliding block 3 to slide within the adjustment groove 2 until the sliding block 3 moves from one side of the adjustment groove 2 to the other side. At the same time, the sliding block 3 will compress another limiting block 16 to retract. The retraction of the limiting block 16 will compress the spring 19 to retract. When the sliding block 3 reaches the designated position, under the action of the rebound force of the spring 19, the spring 19 will compress the other limiting block 16 to move until one end of the other limiting block 16 is inserted into the limiting hole 17, thereby fixing the sliding block 3. Subsequently, the personnel can use another high-precision polishing disc 12 to polish the wafer surface through the above operation, ensuring that wafer surface damage can be effectively avoided after wafer thinning, without the need for additional grinding and repair processes. This reduces material waste and process costs, and significantly improves wafer processing yield, laying the foundation for the stable electrical performance of subsequent chips.

[0046] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A wafer surface thinning process to prevent damage, characterized in that, Includes the following steps: S1: Use isopropanol solution to ultrasonically clean the wafer surface to remove residual dust and organic impurities, and avoid impurities causing surface scratches in subsequent processes. After cleaning, use nitrogen to dry to prevent water stains from affecting the fixation stability. S2: Place the pre-processed wafer face down and use a fixing device to fix the wafer on the carrier, ensuring that the wafer is aligned with the center of the carrier, while also avoiding wafer deformation or damage due to uneven pressure. S3: Use a diamond grinding wheel to rough grind the wafer, while leaving a 50μm margin for subsequent fine processing. During the rough grinding process, continuously spray deionized water for cooling. This reduces the contact temperature between the grinding wheel and the wafer to avoid thermal damage and washes away grinding debris to prevent secondary scratches on the wafer surface. S4: A high-precision diamond polishing wheel is selected, and colloidal silica polishing slurry is used to polish the wafer. Closed-loop control is adopted during the polishing process. The wafer surface condition is monitored in real time by an optical surface inspection instrument. When no scratches, chipping or other defects are detected on the surface, polishing is automatically stopped to ensure that the wafer surface is undamaged and meets the precision requirements. S5: After the thinning is completed, the wafer is removed and then placed in an ultrapure water ultrasonic cleaner to remove the residual polishing liquid and impurities on the surface. After cleaning, the wafer surface is inspected by a metallographic microscope to confirm that there are no scratches, dents or other damage. At the same time, the wafer thickness uniformity and warpage are checked. If it passes the test, it will proceed to the next process.

2. The wafer surface thinning device according to claim 1, characterized in that, include: The operating table (1) has an adjustment groove (2) on its top. A sliding block (3) is slidably installed in the adjustment groove (2). An installation plate (4) is fixedly installed on the top of the sliding block (3). Several clamping blocks (23) are provided on the top of the installation plate (4). A rubber pad (24) is fixedly installed on one side of the clamping block (23). Two U-shaped frames (5) are fixedly installed on the top of the operating table (1). An electric push rod (6) is fixedly installed inside the U-shaped frame (5). A drive box (7) is fixedly installed at the output end of the electric push rod (6). A drive motor (8) is fixedly installed inside the drive box (7). The output end of the drive motor (8) passes through the bottom of the drive box (7) and a rotating disk (9) is fixedly installed. A rectangular groove (10) is opened at the bottom of the rotating disk (9). A plug-in block (11) is inserted into the rectangular groove (10). A grinding disc (12) is fixedly installed at the bottom of the plug-in block (11). A limiting component is located inside the operating table (1) and is used to limit the sliding block (3); A drive assembly located within the mounting disk (4) and used to drive several clamping blocks (23) to move.

3. The wafer thinning device for preventing surface damage according to claim 2, characterized in that, The limiting component includes: Two sliding grooves (15) are symmetrically opened in the operating table (1) and located on one side of the adjustment groove (2). A limit block (16) is slidably installed in the sliding groove (15). One end of the limit block (16) passes through one side of the sliding groove (15) and extends into the adjustment groove (2). A pull rod (18) is fixedly installed at the other end of the limit block (16) and located in the sliding groove (15). One end of the pull rod (18) passes through the other side of the sliding groove (15) and extends to the outside and is rotatably installed with a pull ring (20). A spring (19) is sleeved on the pull rod (18) and located in the sliding groove (15). A limit hole (17) is opened on one side of the sliding block (3).

4. The wafer surface thinning device according to claim 3, characterized in that, One end of the limiting block (16) is inserted into the limiting hole (17), and one end of the limiting block (16) has an inclined structure. The pull rod (18) is slidably connected to the sliding groove (15) and the operating table (1).

5. The wafer surface thinning device according to claim 2, characterized in that, The driving component includes: A plurality of limiting grooves (21) are provided on the top of the mounting plate (4). A sliding rod (22) is slidably installed in the limiting groove (21). The top end of the sliding rod (22) passes through the top of the limiting groove (21) and is fixed to the corresponding clamping block (23). A rotating groove (25) is provided in the mounting plate (4). A turntable (26) is rotatably installed in the rotating groove (25). A plurality of arc-shaped grooves (27) are provided on the turntable (26). The bottom end of the sliding rod (22) extends into the corresponding arc-shaped groove (27). A drive groove (28) is provided in the mounting plate (4) and below the rotating groove (25). A second drive motor (29) is fixedly installed in the drive groove (28). The output end of the second drive motor (29) passes through the top of the drive groove (28) and is coaxially connected to the turntable (26).

6. The wafer surface thinning device according to claim 5, characterized in that, The bottom end of the sliding rod (22) is movably connected to the arc groove (27), and the output shaft of the second drive motor (29) is rotatably connected to the mounting plate (4).

7. A wafer surface thinning device according to claim 2, characterized in that, Also includes: Insert rod (13), the insert rod (13) is inserted into the rotating disk (9), one end of the insert rod (13) passes through the plug block (11), and hexagon screws (14) are threaded on both sides of the rotating disk (9) and the plug block (11), one end of the hexagon screws (14) passes through the insert rod (13).

8. The wafer surface thinning device according to claim 7, characterized in that, One end of the internal hex screw (14) is threaded to the insert (13).

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