Magnetic liquid sealing device for water cooling and semiconductor mixed refrigeration

Abstract

The invention discloses a magnetic liquid sealing device for water cooling and semiconductor mixed refrigeration. The magnetic liquid sealing device for water cooling and semiconductor mixed refrigeration comprises a shell, a sealing ring I, a rotating shaft, a left bearing, a left limiting piece, a left pole shoe, a sealing ring II, a sealing ring III, a permanent magnet, a right limiting piece, a right pole shoe, a sealing ring IV, a sealing ring V, magnetic liquid, a semiconductor refrigeration sheet, a right bearing, a spring, a locking nut, an end cover and a screw. The shell comprises a first cooling channel, the left limiting piece comprises a second cooling channel, the right limiting piece comprises a third cooling channel, and the cooling channels serve as an integral cooling channel for cooling the shell, the pole shoe, the semiconductor chilling plate and the magnetic liquid. The semiconductor chilling plate is placed between the pole shoe and the limiting piece, the pole shoe and the magnetic liquid are cooled at the same time, semiconductor refrigeration is fast in response, high in precision and good in reliability, and the cooling capacity of the magnetic liquid can be controlled by controlling the input current of the semiconductor chilling plate according to the real-time rotating speed. Water cooling and semiconductor refrigeration are cooperatively controlled, and the sealing capacity of the magnetic liquid at the high rotating speed and the high temperature is improved.

Description

Technical Field

[0001] This invention belongs to the field of mechanical engineering sealing, and specifically relates to a magnetic liquid sealing device suitable for high-temperature environments. Background Technology

[0002] Magnetorheological fluid (MRF) is a novel type of intelligent fluid, primarily composed of a base fluid and magnetic particles suspended within it. When subjected to a working magnetic field, the MRF undergoes a rheological effect within milliseconds, reversibly transforming from a liquid to a near-solid state, forming a pressure-resistant "O" ring to achieve a sealing function. Due to its advantages such as low friction, zero leakage, and long lifespan, magnetic fluid seals are widely used in mechanical engineering sealing. However, under high-speed rotation, shearing occurs within the magnetic fluid, causing viscous frictional heat generation. This leads to an increase in the overall seal temperature and a decrease in the saturation magnetization of the magnetic fluid, thereby reducing the pressure resistance of the seal.

[0003] Cooling high-speed magnetic liquid seals mainly involves adding water-cooling channels to the sealing structure. Patent searches revealed the following known technical solutions: Application No.: 202120355366.6, Application Date: 2021.02.08, Authorization Announcement Date: 2021.10.15. This utility model discloses a high-speed magnetic liquid sealing device. The housing includes an outer shell and an inner shell. The inner shell has a cavity, and a cooling chamber is defined between the inner shell and the outer shell. Cooling channels are disposed within the housing. Although this method cools the entire device, the radial distance between the cooling channels and the main heat source, the magnetic liquid, is too great, making it difficult to effectively cool the magnetic liquid. Patent search revealed the following known technical solutions: Application No.: 202110793530.6, Application Date: 2021.07.14. This invention discloses an integrated magnetic liquid sealing device with cooling function, which adds a water-proof ring between the two pole shoes and processes it into a single part. Cooling is achieved by processing inlet and outlet coolant pipes at the position of the permanent magnet on the outer shell. However, the water-cooling channel mainly cools the magnet and part of the pole shoes, and it is difficult to cool the magnetic liquid. Summary of the Invention

[0004] The purpose of this invention is to use semiconductor refrigeration to control the temperature of magnetic fluids and improve the pressure resistance of magnetic fluid seals under high-speed rotation.

[0005] The technical solution adopted in this invention is:

[0006] A magnetic liquid sealing device with water cooling and semiconductor hybrid cooling, the device comprising: a housing (1), sealing ring I (2), a rotating shaft (3), a left bearing (4), a left limiting member (5), a left pole shoe (6), sealing ring II (7), sealing ring III (8), a permanent magnet (9), a right limiting member (10), a right pole shoe (11), sealing ring IV (12), sealing ring V (13), a magnetic liquid (14), a semiconductor cooling chip (15), a right bearing (16), a spring (17), a locking nut (18), an end cap (19), and a screw (20).

[0007] The connections between the various parts of the device:

[0008] A permanent magnet is installed in the middle of the inner side of the housing. A left limiting piece and a right limiting piece are installed on the two sides of the inner side of the housing near the permanent magnet. A left pole shoe and a right pole shoe are installed on the two sides of the outer side of the rotating shaft near the permanent magnet. A left bearing and a right bearing are installed on the outer side of the inner side of the housing near each limiting piece.

[0009] The interior of the housing includes a first annular cooling channel, which communicates with a second annular cooling channel on the outer side of the left limiting member and a third annular cooling channel on the outer side of the right limiting member.

[0010] A sealing ring I is embedded in the outer side of one end of the housing near the rotating shaft. Sealing rings II and III are installed between the two annular grooves on the outer side of the left limiting member and the inner side of the housing. Sealing rings IV and V are installed between the two annular grooves on the outer side of the right limiting member and the inner side of the housing.

[0011] An end cap is embedded in one end of the housing, and the end cap is fixedly connected to the housing by screws. A spring is installed between the right bearing and the end cap to press the right bearing. A lock nut is installed on the outside of the shaft by threads to press the right bearing.

[0012] Several pole teeth are machined on the side of the left and right pole shoes near the rotating shaft. There is a gap between the pole teeth and the rotating shaft, which is filled with magnetic fluid. The magnetic fluid forms an O-ring with pressure resistance between the pole teeth and the rotating shaft.

[0013] The outer end face of the housing is provided with a wire port, through which power wires of several circumferentially arranged semiconductor cooling chips connected in series are led out, and the wire port is sealed with sealant.

[0014] The beneficial effects of this invention are:

[0015] This invention utilizes both water cooling and semiconductor refrigeration to cool the entire device. Semiconductor refrigeration cools the magnetic fluid and pole shoes, and the cooling capacity of the magnetic fluid is controlled by adjusting the input current of the semiconductor refrigeration chip based on the real-time rotation speed. Coolant is injected into the overall cooling channel through the inlet, cooling the heat-generating surfaces of the housing and the semiconductor refrigeration chip, and discharged through the outlet. This coordinated control of water cooling and semiconductor refrigeration improves the sealing capability of the magnetic fluid under high rotation speed and high temperature conditions. Attached Figure Description

[0016] Figure 1 A cross-sectional schematic diagram of a magnetic liquid sealing device that combines water cooling and semiconductor cooling;

[0017] Figure 2 for Figure 1 Right view of the left limiting component, semiconductor cooling chip, and left pole shoe at point A;

[0018] In the figure: housing (1), sealing ring I (2), rotating shaft (3), left bearing (4), left limiting piece (5), left pole shoe (6), sealing ring II (7), sealing ring III (8), permanent magnet (9), right limiting piece (10), right pole shoe (11), sealing ring IV (12), sealing ring V (13), magnetic fluid (14), semiconductor cooling chip (15), right bearing (16), spring (17), locking nut (18), end cap (19), screw (20). Detailed Implementation

[0019] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0020] A magnetic liquid sealing device with hybrid cooling of water and semiconductors, such as Figure 1 As shown, the device includes: housing (1), sealing ring I (2), rotating shaft (3), left bearing (4), left limiting member (5), left pole shoe (6), sealing ring II (7), sealing ring III (8), permanent magnet (9), right limiting member (10), right pole shoe (11), sealing ring IV (12), sealing ring V (13), magnetic fluid (14), semiconductor cooling chip (15), right bearing (16), spring (17), locking nut (18), end cap (19), and screw (20).

[0021] like Figure 1As shown, a permanent magnet is installed in the middle of the inner side of the housing. A left limiting member and a right limiting member are installed on the inner side of the housing near the permanent magnet. A left pole shoe and a right pole shoe are installed on the outer side of the rotating shaft near the permanent magnet. A semiconductor cooling chip is installed on the outer side of the left pole shoe and the inner side of the left limiting member, with several semiconductor cooling chips arranged circumferentially along the left pole shoe. A semiconductor cooling chip is installed on the outer side of the right pole shoe and the inner side of the right limiting member, with several semiconductor cooling chips arranged circumferentially along the right pole shoe. A left bearing and a right bearing are installed on the inner side of the housing near the outer side of each limiting member. The rotating shaft runs through the inner sides of the housing, left bearing, left pole shoe, right pole shoe, right bearing, and locking nut. An end cap is embedded in the right end of the housing, and the end cap is fixed to the housing by screws. A spring is installed between the right bearing and the end cap to press the right bearing. A locking nut is threaded onto the outer side of the rotating shaft to press the right bearing.

[0022] like Figure 1 As shown, cooling water enters from two inlets on the lower side of the shell, flows through the first annular cooling channel, the second annular cooling channel and the third annular cooling channel, and flows out through two outlets on the other side of the shell, simultaneously cooling the shell, the limiting component and the semiconductor cooling chip.

[0023] like Figure 1 As shown, there is a gap on the left end face of the left limiting member. It is necessary to ensure that the gap of the left limiting member is aligned with the wire opening on the outer end face of the housing. It is also necessary to ensure that the second annular cooling channel of the left limiting member is aligned with the water inlet and outlet on the left side of the outer end face of the housing. There is a gap on the right end face of the right limiting member. It is necessary to ensure that the gap of the right limiting member is aligned with the wire opening on the outer end face of the housing. It is also necessary to ensure that the third annular cooling channel of the right limiting member is aligned with the water inlet and outlet on the right side of the outer end face of the housing.

[0024] like Figure 1 As shown, a sealing ring I is embedded on the left side of the housing. Sealing rings II and III are installed between the two annular grooves on the outside of the left limiting member and the inside of the housing to prevent leakage between the left limiting member and the housing. Sealing rings IV and V are installed between the two annular grooves on the outside of the right limiting member and the inside of the housing to prevent leakage between the right limiting member and the housing.

[0025] like Figure 1 As shown, several circumferentially arranged thermoelectric coolers are connected in series, and a series power line is led out through a wire port on the outer end face of the housing. The cooling capacity of the magnetic fluid is controlled by controlling the input current of the thermoelectric coolers. The series-connected thermoelectric coolers can also be powered by a battery.

[0026] like Figure 1 As shown, a groove is provided inside the right side of the rotating shaft, and the groove is connected to the motor to drive the rotating shaft to rotate at high speed.

[0027] like Figure 2As shown, several thermoelectric coolers are sandwiched between the left pole shoe and the left limiting member, arranged circumferentially along the left pole shoe. The cooling effect can be adjusted by changing the number of thermoelectric coolers installed.

[0028] like Figure 2 As shown, the outer side of the left pole shoe is machined with several rectangular planes that fit against the inner side of the semiconductor cooling chip, so that the heat generated by the left pole shoe and the magnetic liquid can be conducted to the cooling end face of the semiconductor cooling chip as much as possible. The inner side of the left limiting member is correspondingly machined with several rectangular planes that fit against the outer side of the semiconductor cooling chip, so that the heat generated by the heat-generating end face of the semiconductor cooling chip can be conducted to the second annular cooling channel as much as possible. At the same time, the left limiting member has several protrusions arranged circumferentially on both sides of the semiconductor cooling chip to fix the semiconductor cooling chip circumferentially.

[0029] Finally, it should be noted that the above detailed description further elaborates on the purpose, technical solution, and beneficial effects of the invention, with the aim of helping to further understand the invention. It should be understood that the above description is only a specific embodiment of the invention and is not intended to limit the scope of protection of the invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A magnetic liquid sealing device with hybrid water cooling and semiconductor cooling, characterized in that, The device includes: housing (1), sealing ring I (2), rotating shaft (3), left bearing (4), left limiting member (5), left pole shoe (6), sealing ring II (7), sealing ring III (8), permanent magnet (9), right limiting member (10), right pole shoe (11), sealing ring IV (12), sealing ring V (13), magnetic fluid (14), semiconductor cooling chip (15), right bearing (16), spring (17), locking nut (18), end cap (19), screw (20); A permanent magnet (9) is installed in the middle of the inner side of the housing (1). A left limiting member (5) and a right limiting member (10) are installed on the inner side of the housing (1) near the permanent magnet (9). A left pole shoe (6) and a right pole shoe (11) are installed on the outer side of the rotating shaft (3) near the permanent magnet (9). A left bearing (4) is installed on the left side of the inner side of the housing (1) near the left limiting member (5). A right bearing (16) is installed on the right side of the inner side of the housing (1) near the right limiting member (10). The interior of the housing (1) includes a first annular cooling channel, which communicates with the second annular cooling channel included on the outer side of the left limiting member (5) and the third annular cooling channel included on the outer side of the right limiting member (10). A sealing ring I (2) is embedded on the outer side of one end of the housing (1) near the rotating shaft (3). A sealing ring II (7) and a sealing ring III (8) are installed between the two annular grooves on the outer side of the left limiting member (5) and the inner side of the housing (1). A sealing ring IV (12) and a sealing ring V (13) are installed between the two annular grooves on the outer side of the right limiting member (10) and the inner side of the housing. An end cap (19) is embedded in one end of the housing (1), and the end cap (19) is fixedly connected to the housing (1) by screws (20). A spring (17) is installed between the right bearing (16) and the end cap (19) to press the right bearing (16). A lock nut (18) is installed on the outside of the rotating shaft (3) by threads to press the right bearing (16). The left pole shoe (6) and the right pole shoe (11) are machined with several pole teeth on the side near the rotating shaft (3). There is a gap between the pole teeth of the pole shoe and the rotating shaft (3), and the gap is filled with magnetic liquid (14). The magnetic liquid (14) forms an "O" ring with pressure resistance between the pole teeth and the rotating shaft (3). The outer end face of the housing (1) is provided with a wire opening, through which power wires of several circumferentially arranged semiconductor cooling chips (15) connected in series are led out, and the wire opening is sealed with sealant.

2. The magnetic liquid sealing device with water cooling and semiconductor hybrid cooling according to claim 1, characterized in that, A plurality of thermoelectric coolers (15) are installed between the inner side of the left limiting member (5) and the outer side of the left pole shoe (6), and a plurality of thermoelectric coolers (15) are installed between the inner side of the right limiting member (10) and the outer side of the right pole shoe (11). The thermoelectric coolers (15) are arranged in a plurality of circumferential directions along the pole shoes. The cooling end face of the thermoelectric cooler (15) is in contact with the outer side of the pole shoe, and the heat generating end face of the thermoelectric cooler (15) is in contact with the inner side of the limiting member. By changing the magnitude of the input current, the cooling effect of the thermoelectric cooler (15) can be changed.

3. The magnetic liquid sealing device with water cooling and semiconductor hybrid cooling according to claim 1, characterized in that, The outer end face of the housing (1) is fixedly connected to a water inlet, and the other end of the housing (1) is fixedly connected to a water outlet. The first annular cooling channel, the second annular cooling channel and the third annular cooling channel are connected to form an overall cooling channel. The first annular cooling channel cools the housing (1), and the second annular cooling channel and the third annular cooling channel cool the heat-generating end face of the semiconductor refrigeration chip (15).

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