Testing device and testing method for manufacturing power management chip

Abstract

The invention relates to the technical field of chip testing, and discloses a testing device and a testing method for manufacturing a power management chip, the testing device comprises a mounting cover, an overturning seat, a driving mechanism and a compression resistance testing mechanism, the compression resistance testing mechanism is fixedly mounted at the top of the mounting cover, one end of the overturning seat is in transmission connection with the driving mechanism, and the other end of the overturning seat is in transmission connection with the driving mechanism. The other end of the overturning seat is in transmission connection with the transmission gear set; according to the technical scheme, the driving mechanism drives the conveyor and the overturning seat, the overturning seat is in transmission with the compression resistance testing mechanism through the transmission gear set and the second transmission belt wheel set, is in transmission with the taking and placing mechanism through the transmission gear set, and is in cooperative work with the negative pressure conveying mechanism through the negative pressure tank and synchronous operation of the industrial camera mechanism. The whole process of conveying, adsorbing, transferring, detecting and testing the chip does not need manual intervention, integrity photographing detection, compression resistance durability testing and integrity reinspection after stress can be completed by a single device, and the single testing period is greatly shortened.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a testing apparatus and testing method for manufacturing power management chips. Background Technology

[0002] Power management chips, as an indispensable key component in modern electronic devices, undertake the important task of efficiently distributing and managing power supply. Their performance directly affects the energy efficiency, battery life, and operational stability of the device under different usage scenarios. Therefore, mobile phones, laptops, and other portable electronic devices all place higher demands on power management chips. These devices require long standby times and high-performance operation, both of which rely on the support of efficient and reliable power management chips. To ensure that power management chips work stably in various practical application environments and meet the diverse needs of users, they must undergo comprehensive quality testing during the manufacturing process to ensure their performance and reliability.

[0003] The announcement number CN114354371B discloses a testing device and method for manufacturing power management chips. It has solved the technical drawbacks of general power management chip testing devices, which test one aspect first and then transport the power management chip to the next testing area. This not only wastes manpower and resources but also results in low testing efficiency. However, similar structures still have many defects in actual use. For example, existing chip testing devices have a high degree of separation in chip transportation, positioning, and testing, resulting in low efficiency and easy introduction of human error. Existing chip testing devices have single functions and cannot simultaneously realize multi-dimensional testing such as chip integrity detection, pressure resistance durability verification, and integrity re-inspection after packaging material is subjected to stress, resulting in a lack of comprehensive test results.

[0004] Therefore, the aforementioned technical problems need to be solved. Summary of the Invention

[0005] To overcome the shortcomings of existing technologies, this invention proposes a testing device and method for power management chip manufacturing. This addresses the problems of existing chip testing devices having high separation in chip transport, positioning, and testing stages, resulting in low efficiency and susceptibility to human error; existing chip testing devices having limited functionality, making it difficult to simultaneously perform multi-dimensional testing such as chip integrity detection, pressure resistance durability verification, and integrity re-inspection of packaging materials after stress, and the lack of comprehensive test results.

[0006] To solve the above-mentioned technical problems, the basic technical solution proposed by this invention is as follows: A testing device for manufacturing power management chips includes a mounting cover, a flip base, a drive mechanism, and a pressure testing mechanism. The pressure testing mechanism is fixedly mounted on the top of the mounting cover and extends into the interior of the mounting cover. The flip base is rotatably mounted inside the mounting cover. One end of the flip base is driven by the drive mechanism, and the other end of the flip base is driven by a transmission gear set. The transmission gear set is driven by a second transmission pulley set, and the second transmission pulley set is driven by the pressure testing mechanism. A bracket is fixedly installed on one side of the mounting cover, a conveyor is fixedly installed at the bottom inside the mounting cover, a negative pressure conveying mechanism is fixedly installed on the top of the bracket, and one end of the negative pressure conveying mechanism extends into the interior of the flipping seat and is rotatably connected to the inner wall of the flipping seat; a pick-and-place mechanism is rotatably installed on the front of the mounting cover, and the pick-and-place mechanism is connected to the transmission gear set. The outer wall of the flipping seat is equidistantly equipped with four adsorption seats, and the inner wall of the flipping seat is equidistantly equipped with four negative pressure seats. The four negative pressure seats are respectively connected to the four adsorption seats one by one. The compression testing mechanism consists of a right-angle converter, a stroke adjustment component, and a pressure plate. A transmission rod is fixedly installed at one end of the right-angle converter. The top of the stroke adjustment component is connected to the bottom of the right-angle converter via a shaft drive. The bottom end of the stroke adjustment component is fixedly connected to the top of the pressure plate.

[0007] Preferably, the adsorption seat consists of a perforated seat, a perforated plate, and several negative pressure adsorption seats. The perforated plate is fixedly installed inside the perforated seat, and several negative pressure adsorption seats are arranged in an array on the top of the perforated plate.

[0008] Preferably, the stroke adjustment assembly consists of a slide rail frame, a lead screw, a threaded sleeve shaft frame, a lower pressure rod, and a telescopic shaft seat. The lead screw is rotated inside the slide rail frame, the threaded sleeve shaft frame is threaded onto the outside of the lead screw, one end of the lower pressure rod is connected to the bottom shaft of the threaded sleeve shaft frame, and the other end of the lower pressure rod is connected to the top shaft of the telescopic shaft seat. The bottom of the telescopic shaft seat is fixedly installed on the top of the pressure plate, and a pressure sensor is fixedly installed inside the telescopic shaft seat.

[0009] Preferably, the negative pressure conveying mechanism consists of a negative pressure pipe, a rotating seat, four control valves, and four negative pressure branch pipes. The rotating seat is rotatably installed on the outside of the negative pressure pipe, the four control valves are equidistantly installed on the outside of the rotating seat, one end of each of the four negative pressure branch pipes is connected to one of the four control valves, and the other end of each of the four negative pressure branch pipes is connected to one of the four negative pressure seats.

[0010] Preferably, the drive mechanism consists of a drive motor, a first transmission pulley set, an intermittent drive gear, and an intermittent transmission gear. The drive motor is fixedly mounted on the top of the bracket, and the output end of the drive motor is connected to the first transmission pulley set. One end of the first transmission pulley set is connected to the intermittent drive gear, and the other end of the first transmission pulley set is connected to the conveyor. The intermittent transmission gear is fixedly mounted on one end of the tilting seat and is dynamically meshed with the intermittent drive gear.

[0011] Preferably, the pick-and-place mechanism consists of a suction cup, two swing arms, a connecting rod, a linkage shaft frame, a drive rod, and a telescopic guide frame. The two sides of the suction cup are rotatably connected to one end of the two swing arms via bolts. The other ends of the two swing arms are connected to the front of the mounting cover via bolts. The connecting rod is fixedly installed between the two swing arms. The bottom end of one swing arm is fixedly connected to the linkage shaft frame. One end of the drive rod is connected to the linkage shaft frame, and the other end of the drive rod is connected to the transmission gear set. The drive rod and the transmission gear set are eccentrically connected. The telescopic guide frame is rotatably installed on the front of the mounting cover, and one end of the telescopic guide frame is fixedly connected to the suction cup.

[0012] Preferably, a negative pressure tank is fixedly installed on the top of the mounting cover, a negative pressure machine is installed at one end of the negative pressure tank through a pipe, the other end of the negative pressure tank is connected to a suction cup through a telescopic pipe, and the bottom of the negative pressure tank is connected to a negative pressure pipe through a pipe.

[0013] Preferably, an industrial camera mechanism is movably mounted on both sides of the top of the mounting cover. The industrial camera mechanism consists of a nut disc, a screw, two guide rods, and an industrial camera. The nut disc is rotatably mounted on the top of the mounting cover. The screw passes through the nut disc and is threadedly connected to it. It extends into the interior of the mounting cover and is fixedly connected to the top of the industrial camera. The two guide rods movably pass through the mounting cover, and one end of each guide rod is fixedly connected to the top of the industrial camera.

[0014] A testing method for manufacturing power management chips, comprising the following steps: Step 1: The first transmission pulley set is driven by the drive motor. The first transmission pulley set drives the intermittent drive gear and the conveyor to run synchronously. The running intermittent drive gear drives the tilting seat to rotate intermittently through the dynamically meshing intermittent transmission gear. The intermittently rotating tilting seat drives the pick-and-place mechanism and the second transmission pulley set to run through the transmission gear set respectively. The running second transmission pulley set drives the pressure testing mechanism to run. At the same time, the negative pressure machine runs to store negative pressure inside the negative pressure tank. Step 2: Open the valve of the pipe connecting the negative pressure tank and the negative pressure conveying mechanism. The negative pressure conveying mechanism will deliver negative pressure to the negative pressure seat, creating a negative pressure environment inside the negative pressure seat. The running conveyor will transport the chip to the bottom of the pick-and-place mechanism, while the running pick-and-place mechanism will transfer the chip to the adsorption seat. The pressure generated by the chip will open the adsorption seat, allowing the negative pressure inside the negative pressure seat to adsorb the chip through the adsorption seat. Step 3: The rotating flipping seat rotates the chip adsorbed by the adsorption seat to the vertical axis position of one of the industrial camera mechanisms, and the industrial camera mechanism takes pictures of the chip to check its integrity. Step 4: The rotating flipping seat continues to rotate the chip adsorbed by the adsorption seat to the bottom of the pressure resistance testing mechanism. The chip is then subjected to a pressure resistance test by the running pressure resistance testing mechanism to verify the durability of the chip packaging material under stress. Step 5: The chip that has completed the test is rotated to the vertical axis position of another industrial camera mechanism by the rotating flip stand, so that the chip can be photographed and the integrity of the chip packaging material under stress can be detected. Step Six: The rotating flipper continues to rotate the chip to the platform on the side of the mounting cover. The vacuum state of the adsorption seat for adsorbing the chip is controlled by the control valve in the negative pressure conveying mechanism, releasing the adsorption seat from adsorbing the chip and allowing the chip to be conveyed to the platform on the side of the mounting cover.

[0015] The beneficial effects of this invention are: The technical solution of this invention drives a conveyor and a flipping seat through a drive mechanism. The flipping seat is transmitted to the pressure testing mechanism through a transmission gear set and a second transmission pulley set, and to the pick-and-place mechanism through the transmission gear set. With the cooperation of the negative pressure tank and the negative pressure conveying mechanism and the synchronous operation of the industrial camera mechanism, the chip can be transferred, adsorbed, transported, detected and tested without human intervention. A single device can complete the three core testing links of integrity photograph detection, pressure durability test and integrity re-inspection after stress. The single test cycle is greatly shortened and the test efficiency and accuracy are significantly improved. By using two industrial camera mechanisms to photograph and inspect the chip before and after testing, combined with the mechanical testing of the pressure resistance testing mechanism, a closed-loop test is formed, consisting of "initial integrity inspection - pressure resistance durability verification - post-stress integrity re-inspection". This accurately identifies the changes in the chip's physical state before and after stress, enabling multi-dimensional testing of chip integrity, pressure resistance durability verification, and post-stress integrity re-inspection of packaging materials. This effectively avoids the risk of missed detections caused by a single testing method. The intermittent rotation design of the flip holder ensures precise positioning of the chip between each testing station, avoiding the accuracy deviation caused by multiple positioning in traditional testing. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the first axial side structure in this invention; Figure 2 This is a schematic diagram of the second axial side structure in the present invention; Figure 3 This is a schematic diagram of the internal structure of the present invention; Figure 4 This is a schematic diagram showing the transmission connection between the drive mechanism, the conveyor, and the tilting seat in this invention; Figure 5 This is a schematic diagram of the picking and placing mechanism in this invention; Figure 6 This is a schematic diagram of the negative pressure conveying mechanism in this invention; Figure 7 This is a schematic diagram of the flip seat structure in the present invention; Figure 8 This is a schematic diagram of the compression testing mechanism in this invention; Figure 9 This is a schematic diagram of the internal structure of the compression testing mechanism in this invention; Figure 10 This is a schematic diagram of the stroke adjustment component in this invention.

[0017] Explanation of reference numerals in the attached figures: 1. Mounting cover; 101. Bracket; 102. Conveyor; 103. Industrial camera mechanism; 2. Tilting seat; 201. Adsorption seat; 2011. Hole seat; 2012. Hole plate; 2013. Negative pressure suction seat; 202. Negative pressure seat; 3. Negative pressure conveying mechanism; 301. Negative pressure pipe; 302. Rotating seat; 303. Control valve; 304. Negative pressure branch pipe; 4. Drive mechanism; 401. Drive motor; 402. First transmission pulley set; 403. Intermittent drive gear; 404. Intermittent transmission gear; 5. Picking and placing mechanism; 50 1. Suction cup; 502. Swing arm; 503. Connecting rod; 504. Linkage shaft frame; 505. Drive rod; 506. Telescopic guide frame; 6. Negative pressure tank; 601. Negative pressure machine; 7. Pressure testing mechanism; 701. Right angle converter; 702. Stroke adjustment assembly; 7021. Slide frame; 7022. Lead screw; 7023. Screw sleeve shaft frame; 7024. Lower pressure rod; 7025. Telescopic shaft seat; 7026. Pressure sensor; 703. Pressure plate; 704. Transmission rod; 8. Transmission gear set; 9. Second transmission pulley set. Detailed Implementation

[0018] The following will be combined with the appendix Figure 1 To be continued Figure 10 The technical solutions in the embodiments of the present invention have been clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0019] A testing device for manufacturing power management chips includes a mounting cover 1, a flip base 2, a drive mechanism 4, and a pressure testing mechanism 7. The pressure testing mechanism 7 is fixedly mounted on the top of the mounting cover 1 and extends into the interior of the mounting cover 1. The flip base 2 is rotatably mounted inside the mounting cover 1. One end of the flip base 2 is connected to the drive mechanism 4, and the other end of the flip base 2 is connected to a transmission gear set 8. The transmission gear set 8 is connected to a second transmission pulley set 9, and the second transmission pulley set 9 is connected to the pressure testing mechanism 7. A bracket 101 is fixedly installed on one side of the mounting cover 1. A conveyor 102 is fixedly installed at the bottom inside the mounting cover 1. A negative pressure conveying mechanism 3 is fixedly installed on the top of the bracket 101. One end of the negative pressure conveying mechanism 3 extends into the interior of the flipping seat 2 and is rotatably connected to the inner wall of the flipping seat 2. A pick-and-place mechanism 5 is rotatably installed on the front of the mounting cover 1 and is connected to the transmission gear set 8. Four adsorption seats 201 are installed at equal intervals on the outer wall of the flipping seat 2, and four negative pressure seats 202 are installed at equal intervals on the inner wall of the flipping seat 2. The four negative pressure seats 202 are respectively connected to the four adsorption seats 201 one by one. The compression testing mechanism 7 consists of a right-angle converter 701, a stroke adjustment component 702, and a pressure plate 703. A transmission rod 704 is fixedly installed at one end of the right-angle converter 701. The top of the stroke adjustment component 702 is connected to the bottom of the right-angle converter 701 via a shaft drive. The bottom end of the stroke adjustment component 702 is fixedly connected to the top of the pressure plate 703. The stroke adjustment component 702 adjusts the travel of the pressure plate 703, thereby adjusting the downward pressure of the pressure plate 703 on the chip; the mounting cover 1 provides a closed working environment for the testing device, protecting the testing process from external interference and ensuring operational safety; the flipping seat 2 is flipped by the drive mechanism 4, enabling the power management chip placed on the adsorption seat 201 to be accurately transferred to the inspection and testing station; the negative pressure conveying mechanism 3 transmits the negative pressure inside the negative pressure tank 6 to the negative pressure seat 202. The combined use of the adsorption seat 201 and the negative pressure seat 202 can not only perform negative pressure on the power management chip, but also... The pressure adsorption ensures that the chip does not move during the test, thus guaranteeing the accuracy of the test. It also provides convenience when replacing the test chip and avoids subjecting the chip to additional mechanical stress. The conveyor 102 transports the chip to be tested to the bottom of the pick-and-place mechanism 5. The linkage between the pick-and-place mechanism 5 and the transmission gear set 8 can pick up and place the chip onto the adsorption seat 201 for adsorption and transfer as needed. The pressure test mechanism 7 uses a right-angle converter 701 to convert the rotational torque into a vertical pressure test force. By adjusting the stroke, it can test chip materials of different thicknesses and strengths, ensuring the comprehensiveness and accuracy of the test results.

[0020] like Figures 6 to 7 As shown, the adsorption seat 201 is composed of a perforated seat 2011, a perforated plate 2012 and several negative pressure suction seats 2013. The perforated plate 2012 is fixedly installed inside the perforated seat 2011, and several negative pressure suction seats 2013 are arrayed on the top of the perforated plate 2012. The orifice seat 2011 serves as a basic support component, providing stable support and an installation interface for the entire device. The bottom of the orifice seat 2011 has a row of distributed holes, through which the orifice seat 2011 communicates with the negative pressure seat 202. The negative pressure inside the negative pressure seat 202 is transferred to the orifice seat 2011 through these holes, providing negative pressure suction for the several negative pressure suction seats 2013. The perforated plate 2012 is fixedly installed inside the orifice seat 2011, providing installation positions for the several negative pressure suction seats 2013 and transmitting negative pressure to ensure that the negative pressure is evenly distributed to the several negative pressure suction seats. 2013; The negative pressure suction holders 2013 array is distributed on the top of the perforated plate 2012, which can generate negative pressure adsorption force for adsorbing chips. In terms of working principle, the negative pressure holder 202 sends negative pressure to the perforated plate 2011 through the holes, so that the perforated plate 2011 forms a negative pressure environment. The perforated plate 2012 evenly distributes the negative pressure to several negative pressure suction holders 2013. When the negative pressure suction holder 2013 is resisted by the chip, the negative pressure suction holder 2013 opens, and the chip is adsorbed by the negative pressure suction holder 2013, avoiding chip displacement during the transfer process.

[0021] like Figures 8 to 10 As shown, the stroke adjustment assembly 702 consists of a slide frame 7021, a lead screw 7022, a threaded sleeve shaft frame 7023, a lowering rod 7024, and a telescopic shaft seat 7025. The rotation of the lead screw 7022 is installed inside the slide frame 7021. The threaded sleeve shaft frame 7023 is threaded onto the outside of the lead screw 7022. One end of the lowering rod 7024 is connected to the bottom shaft of the threaded sleeve shaft frame 7023, and the other end of the lowering rod 7024 is connected to the top shaft of the telescopic shaft seat 7025. The bottom of the telescopic shaft seat 7025 is fixedly installed on the top of the pressure plate 703, and a pressure sensor 7026 is fixedly installed inside the telescopic shaft seat 7025. The slide rail 7021 in the stroke adjustment assembly 702 provides a fixed mounting platform to ensure that the threaded sleeve shaft 7023 can move smoothly within the defined track. By rotating the lead screw 7022, the threaded sleeve shaft 7023 is driven to move axially along the lead screw 7022. The tilt angle of the lower pressure rod 7024 is adjusted by the moving threaded sleeve shaft 7023, thereby realizing the stroke adjustment of the telescopic movement of the lower pressure rod 7024. By adjusting the movement stroke of the lower pressure rod 7024, the pressure parameters of the pressure plate 703 are adjusted to adapt to chips of different specifications, demonstrating good expandability and adaptability. When the slide frame 7021 is subjected to rotational force, the slide frame 7021 drives the lower pressure rod 7024 to rotate eccentrically, causing the lower pressure rod 7024 to move vertically. The moving lower pressure rod 7024 drives the pressure plate 703 to move vertically and reciprocally through the telescopic shaft seat 7025. The downward pressure plate 703 is used to perform pressure testing on the chip adsorbed by the adsorption seat 201. At the same time, the pressure sensor 7026 monitors and provides feedback on the pressure change on the pressure plate 703 in real time to ensure that the pressure is kept within the set range, thereby achieving precise stroke adjustment and pressure control.

[0022] like Figure 6 As shown, the negative pressure conveying mechanism 3 consists of a negative pressure pipe 301, a rotating seat 302, four control valves 303 and four negative pressure branch pipes 304. The rotating seat 302 is rotatably mounted on the outside of the negative pressure pipe 301. The four control valves 303 are equidistantly mounted on the outside of the rotating seat 302. One end of each of the four negative pressure branch pipes 304 is connected to one of the four control valves 303, and the other end of each of the four negative pressure branch pipes 304 is connected to one of the four negative pressure seats 202. Among them, the negative pressure pipe 301 transports the negative pressure inside the negative pressure tank 6 to the rotating seat 302 through the pipeline. The rotating seat 302 transports the negative pressure to the corresponding four negative pressure seats 202 through the four negative pressure branch pipes 304 connected to the four control valves 303, so as to provide a negative pressure environment for the four negative pressure seats 202. Since the rotating seat 302 is rotatably connected to the negative pressure pipe 301, and the negative pressure branch pipe 304 is fixedly connected to the negative pressure seat 202, when the rotating seat 2 rotates, the rotating seat 302 rotates relative to the negative pressure pipe 301 through the connection between the negative pressure seat 202 and the negative pressure branch pipe 304. The four control valves 303 can independently open or close the negative pressure branch pipe 304, flexibly control the vacuum state of each negative pressure seat 202, and achieve precise adjustment of the adsorption seat 201. During the test, by controlling each control valve 303, the adsorption seats 201 of different chips can be controlled separately to ensure the accuracy and efficiency of the test. After the test is completed, the adsorption of the chip can be released by quickly closing the control valve 303, thereby realizing convenient transfer of the chip and improving the efficiency and flexibility of chip processing.

[0023] like Figure 4 As shown, the drive mechanism 4 consists of a drive motor 401, a first transmission pulley set 402, an intermittent drive gear 403, and an intermittent transmission gear 404. The drive motor 401 is fixedly mounted on the top of the bracket 101. The output end of the drive motor 401 is connected to the first transmission pulley set 402. One end of the first transmission pulley set 402 is connected to the intermittent drive gear 403. The other end of the first transmission pulley set 402 is connected to the conveyor 102. The intermittent transmission gear 404 is fixedly mounted on one end of the tilting seat 2 and is dynamically meshed with the intermittent drive gear 403. The drive motor 401 is responsible for providing power and is fixedly installed on the top of the bracket 101 to ensure stability and ease of maintenance; the first transmission pulley group 402 transmits the power of the drive motor 401 to the intermittent drive gear 403 and the conveyor 102. The rotating intermittent drive gear 403 drives the flipping seat 2 to rotate precisely and intermittently through the dynamically meshing intermittent transmission gear 404, ensuring that the chip is accurately positioned and flipped between each test station, thereby ensuring the accuracy and reliability of the test. The operating conveyor 102 transports the chip to the area below the pick-and-place mechanism 5, facilitating further transport by the pick-and-place mechanism 5.

[0024] like Figure 5 As shown, the pick-and-place mechanism 5 consists of a suction cup 501, two swing arms 502, a connecting rod 503, a linkage shaft frame 504, a drive rod 505, and a telescopic guide frame 506. The two sides of the suction cup 501 are rotatably connected to one end of the two swing arms 502 by shaft bolts. The other ends of the two swing arms 502 are connected to the front of the mounting cover 1 by shaft bolts. The connecting rod 503 is fixedly installed between the two swing arms 502. The bottom end of one of the swing arms 502 is fixedly connected to the linkage shaft frame 504. One end of the drive rod 505 is shaft-connected to the linkage shaft frame 504, and the other end of the drive rod 505 is shaft-connected to the transmission gear set 8. The drive rod 505 and the transmission gear set 8 are eccentrically connected. The telescopic guide frame 506 is rotatably installed on the front of the mounting cover 1, and one end of the telescopic guide frame 506 is fixedly connected to the suction cup 501. The suction cup 501 is used to adsorb or release the workpiece. Two swing arms 502 are rotatably connected to the suction cup 501 and the mounting cover 1, enabling the suction cup 501 to swing for precise alignment and adsorption of the chip. A connecting rod 503 fixes the two swing arms 502, ensuring synchronous operation and stable transmission. A linkage shaft 504 acts as a hub connecting the drive rod 505 and the swing arms 502, converting the traction force of the drive rod 505 into the swing force of the swing arms 502. The drive rod 501... 5. Through the eccentric transmission connection with the transmission gear set 8, the rotational motion is converted into traction motion, which further drives the swing arm 502 to swing. The telescopic guide frame 506 plays a guiding role in ensuring that the movement trajectory of the suction cup 501 is accurate. The overall working principle is as follows: the eccentric motion of the transmission gear set 8 drives the drive rod 505 to perform traction motion, and drives the two swing arms 502 to swing through the linkage shaft frame 504. The swing arms 502 adsorb or release the chip through the suction cup 501, and the telescopic guide frame 506 ensures the accuracy of the movement path.

[0025] like Figures 1 to 3As shown, a negative pressure tank 6 is fixedly installed on the top of the mounting cover 1. A negative pressure machine 601 is installed at one end of the negative pressure tank 6 through a pipe, and the other end of the negative pressure tank 6 is connected to the suction cup 501 through a telescopic pipe. The bottom of the negative pressure tank 6 is connected to the negative pressure pipe 301 through a pipe. The negative pressure tank 6, fixedly installed on the top of the mounting cover 1, is used to store and regulate negative pressure to ensure that the chip maintains a stable adsorption state during transportation. One end of the negative pressure tank 6 is connected to the negative pressure machine 601 through a pipe, which generates negative pressure and delivers it to the negative pressure tank 6. The other end of the negative pressure tank 6 is connected to the suction cup 501 through a telescopic tube to ensure that the negative pressure is accurately delivered to the suction cup 501, so that it can firmly adsorb the chip. The bottom of the negative pressure tank 6 is also connected to the negative pressure pipe 301 through a pipe. The negative pressure delivery mechanism 3 can accurately deliver the negative pressure to the adsorption seat 201 with the negative pressure seat 202, forming a stable negative pressure adsorption environment, so that the negative pressure seat 202 can firmly adsorb the chip, effectively avoiding displacement or falling off during chip transportation, thereby ensuring the stability of the testing process.

[0026] like Figures 1 to 3 As shown, an industrial camera mechanism 103 is movably mounted on both sides of the top of the mounting cover 1. The industrial camera mechanism 103 consists of a nut disc, a screw, two guide rods and an industrial camera. The nut disc is rotatably mounted on the top of the mounting cover 1. The screw passes through the nut disc and is threadedly connected, and extends into the interior of the mounting cover 1 and is fixedly connected to the top of the industrial camera. The two guide rods movably pass through the mounting cover 1, and one end of the two guide rods is fixedly connected to the top of the industrial camera. The rotating nut disk drives the screw to extend and retract, thereby adjusting the position of the industrial camera. Two guide rods provide guidance for the movement of the industrial camera, enabling it to make precise position adjustments along a fixed path. During the test, the industrial camera mechanism 103 takes two photos before and after the chip test to capture changes in the chip's state. Combined with the mechanical test results of the pressure resistance test mechanism 7, a closed-loop test logic is formed, from initial integrity detection and pressure resistance durability verification to post-stress integrity re-inspection. This logic can comprehensively evaluate the physical state changes of the chip packaging material before and after stress, accurately identify potential defects, and thus improve the quality and reliability of the product.

[0027] A testing method for manufacturing power management chips, comprising the following steps: Step 1: The first transmission pulley group 402 is driven by the drive motor 401. The first transmission pulley group 402 drives the intermittent drive gear 403 and the conveyor 102 to run synchronously. The running intermittent drive gear 403 drives the flipping seat 2 to rotate intermittently through the dynamically meshing intermittent transmission gear 404. The intermittently rotating flipping seat 2 drives the pick-and-place mechanism 5 and the second transmission pulley group 9 to run through the transmission gear group 8 respectively. The running second transmission pulley group 9 drives the pressure testing mechanism 7 to run. Specifically, the second transmission pulley group 9 drives the transmission rod 704 to rotate. The right angle converter 701 converts the horizontal rotation power of the transmission rod 704 into vertical rotation power through the stroke adjustment component 702 and transmits it to the stroke adjustment component 702. The rotation power of the stroke adjustment component 702 drives the pressure plate 703 to move vertically. Among them, the pick-and-place mechanism 5 and the second transmission pulley group 9 are synchronously driven by the transmission gear group 8, so that the pressure plate 703 in the pressure resistance testing mechanism 7 can move vertically through the right angle converter 701 and the stroke adjustment component 702, so as to adapt to the testing requirements of chips of different sizes and improve the versatility of the equipment. At the same time, the negative pressure machine 601 operates to store negative pressure inside the negative pressure tank 6; Step 2: Open the valve of the pipe connecting the negative pressure tank 6 and the negative pressure conveying mechanism 3. The negative pressure conveying mechanism 3 will convey negative pressure to the negative pressure seat 202, creating a negative pressure environment inside the negative pressure seat 202. The chip will be conveyed to the bottom of the pick-and-place mechanism 5 by the operating conveyor 102. At the same time, the operating pick-and-place mechanism 5 will open the solenoid valve at the end of the telescopic tube, so that the negative pressure of the negative pressure tank 6 will be transmitted to the pick-and-place mechanism 5 through the opened telescopic tube. The pick-and-place mechanism 5 will adsorb the chip and transfer it to the adsorption seat 201. When the pick-and-place mechanism 5 adsorbs the chip and transfers it to the adsorption seat 201, the chip will exert pressure on the adsorption seat 201 during the pick-and-place process, triggering the adsorption seat 201 to open. This allows the negative pressure inside the negative pressure seat 202 to adsorb the chip through the adsorption seat 201, achieving precise negative pressure adsorption. At the same time, close the solenoid valve at the end of the telescopic tube to quickly release the adsorption of the pick-and-place mechanism 5, ensuring that the chip is connected and adsorbed with the adsorption seat 201. Step 3: The rotating flip seat 2 rotates the chip adsorbed by the adsorption seat 201 to the vertical axis position of one of the industrial camera mechanisms 103, and takes pictures of the chip to check the integrity of the chip. Step 4: The rotating flip seat 2 continues to rotate the chip adsorbed by the adsorption seat 201 to the bottom of the pressure resistance test mechanism 7. The chip is subjected to a pressure resistance test by the running pressure resistance test mechanism 7 to verify the durability of the chip packaging material under stress. Step 5: The chip that has completed the test is rotated to the vertical axis position of another industrial camera mechanism 103 under the drive of the rotating flip seat 2, so as to take pictures of the chip and detect the integrity of the chip packaging material under force. Two industrial camera mechanisms 103 photograph and inspect the chip before and after the test, combined with the mechanical test of the pressure resistance testing mechanism 7, forming a closed-loop test. Specifically, step three uses the first industrial camera to complete the initial integrity test of the chip; step four uses the pressure resistance testing mechanism 7 to verify the durability of the packaging material under stress; and step five uses the second industrial camera to detect the integrity of the packaging material after stress. The closed-loop test accurately identifies the changes in the physical state of the chip before and after stress, improves the comprehensiveness of the test results, and effectively avoids the risk of missed detection caused by a single test method. Step Six: The rotating flipping seat 2 continues to rotate the chip to the platform on one side of the mounting cover 1. The vacuum state of the adsorption seat 201 for adsorbing the chip is controlled by the control valve 303 in the negative pressure conveying mechanism 3, and the adsorption seat 201 is released from adsorption of the chip, so that the chip is transported to the platform on one side of the mounting cover 1.

[0028] Based on the explanations and teachings of the foregoing specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and alterations to the present invention should also fall within the protection scope of the claims of the present invention. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on the present invention.

Claims

1. A testing apparatus for manufacturing power management chips, comprising a mounting cover (1), a flip-up base (2), a driving mechanism (4), and a pressure testing mechanism (7), characterized in that: A pressure testing mechanism (7) is fixedly installed on the top of the mounting cover (1), and the pressure testing mechanism (7) extends into the interior of the mounting cover (1). The flipping seat (2) is rotatably installed inside the mounting cover (1). One end of the flipping seat (2) is connected to the drive mechanism (4) and the other end of the flipping seat (2) is connected to the transmission gear set (8). The transmission gear set (8) is connected to the second transmission pulley set (9) and the second transmission pulley set (9) is connected to the pressure testing mechanism (7). A bracket (101) is fixedly installed on one side of the mounting cover (1), and a conveyor (102) is fixedly installed at the bottom inside the mounting cover (1). A negative pressure conveying mechanism (3) is fixedly installed on the top of the bracket (101), and one end of the negative pressure conveying mechanism (3) extends into the interior of the flipping seat (2) and is rotatably connected to the inner wall of the flipping seat (2). A pick-and-place mechanism (5) is rotatably installed on the front of the mounting cover (1), and the pick-and-place mechanism (5) is connected to the transmission gear set (8). The outer wall of the flipping seat (2) is equidistantly equipped with four adsorption seats (201), and the inner wall of the flipping seat (2) is equidistantly equipped with four negative pressure seats (202). The four negative pressure seats (202) are respectively connected to the four adsorption seats (201). The compression testing mechanism (7) consists of a right-angle converter (701), a stroke adjustment component (702), and a pressure plate (703). A transmission rod (704) is fixedly installed at one end of the right-angle converter (701). The top of the stroke adjustment component (702) is connected to the bottom of the right-angle converter (701) via a shaft drive. The bottom end of the stroke adjustment component (702) is fixedly connected to the top of the pressure plate (703).

2. The testing apparatus for manufacturing power management chips according to claim 1, characterized in that: The adsorption seat (201) consists of a perforated seat (2011), a perforated plate (2012), and several negative pressure suction seats (2013). The perforated plate (2012) is fixedly installed inside the perforated seat (2011), and several negative pressure suction seats (2013) are arrayed on the top of the perforated plate (2012).

3. The testing apparatus for manufacturing power management chips according to claim 1, characterized in that: The stroke adjustment assembly (702) consists of a slide frame (7021), a lead screw (7022), a threaded sleeve shaft frame (7023), a lowering rod (7024), and a telescopic shaft seat (7025). The rotation of the lead screw (7022) is installed inside the slide frame (7021). The threaded sleeve shaft frame (7023) is threaded onto the outside of the lead screw (7022). One end of the lowering rod (7024) is connected to the bottom shaft of the threaded sleeve shaft frame (7023), and the other end of the lowering rod (7024) is connected to the top shaft of the telescopic shaft seat (7025). The bottom of the telescopic shaft seat (7025) is fixedly installed on the top of the pressure plate (703), and a pressure sensor (7026) is fixedly installed inside the telescopic shaft seat (7025).

4. The testing apparatus for manufacturing power management chips according to claim 1, characterized in that: The negative pressure conveying mechanism (3) consists of a negative pressure pipe (301), a rotating seat (302), four control valves (303) and four negative pressure branch pipes (304). The rotating seat (302) is rotatably installed on the outside of the negative pressure pipe (301). The four control valves (303) are equidistantly installed on the outside of the rotating seat (302). One end of the four negative pressure branch pipes (304) is connected to the four control valves (303) one by one, and the other end of the four negative pressure branch pipes (304) is connected to the four negative pressure seats (202) one by one.

5. A testing apparatus for manufacturing power management chips according to claim 1, characterized in that: The drive mechanism (4) consists of a drive motor (401), a first transmission pulley set (402), an intermittent drive gear (403), and an intermittent transmission gear (404). The drive motor (401) is fixedly installed on the top of the bracket (101). The output end of the drive motor (401) is connected to the first transmission pulley set (402). One end of the first transmission pulley set (402) is connected to the intermittent drive gear (403). The other end of the first transmission pulley set (402) is connected to the conveyor (102). The intermittent transmission gear (404) is fixedly installed on one end of the flipping seat (2) and is dynamically meshed with the intermittent drive gear (403).

6. The testing apparatus for manufacturing power management chips according to claim 1, characterized in that: The pick-and-place mechanism (5) consists of a suction cup (501), two swing arms (502), a connecting rod (503), a linkage shaft frame (504), a drive rod (505), and a telescopic guide frame (506). The two sides of the suction cup (501) are rotatably connected to one end of the two swing arms (502) by shaft bolts. The other ends of the two swing arms (502) are connected to the front of the mounting cover (1) by shaft bolts. The connecting rod (503) is fixedly installed between the two swing arms (502). One of the swing arms (502) is fixedly connected to the linkage shaft frame (504) at its bottom end, one end of the drive rod (505) is connected to the linkage shaft frame (504) shaft, and the other end of the drive rod (505) is connected to the transmission gear set (8) shaft. The drive rod (505) and the transmission gear set (8) are eccentrically connected. The telescopic guide frame (506) is rotatably mounted on the front of the mounting cover (1), and one end of the telescopic guide frame (506) is fixedly connected to the suction cup (501).

7. A testing apparatus for manufacturing power management chips according to claim 6, characterized in that: The top of the mounting cover (1) is fixedly installed with a negative pressure tank (6), one end of the negative pressure tank (6) is connected to a negative pressure machine (601) through a pipe, and the other end of the negative pressure tank (6) is connected to a suction cup (501) through a telescopic pipe, and the bottom of the negative pressure tank (6) is connected to a negative pressure pipe (301) through a pipe.

8. A testing apparatus for manufacturing power management chips according to claim 1, characterized in that: An industrial camera mechanism (103) is movably mounted on both sides of the top of the mounting cover (1). The industrial camera mechanism (103) consists of a nut disc, a screw, two guide rods and an industrial camera. The nut disc is rotatably mounted on the top of the mounting cover (1). The screw passes through the nut disc and is threadedly connected, and extends into the interior of the mounting cover (1) and is fixedly connected to the top of the industrial camera. The two guide rods movably pass through the mounting cover (1), and one end of the two guide rods is fixedly connected to the top of the industrial camera.

9. A testing method for manufacturing power management chips, comprising a testing apparatus for manufacturing power management chips as described in any one of claims 1 to 8, characterized in that, The testing method includes the following steps: Step 1: Drive the first transmission pulley group (402) through the drive motor (401). The first transmission pulley group (402) drives the intermittent drive gear (403) and the conveyor (102) to run synchronously. The running intermittent drive gear (403) drives the flipping seat (2) to rotate intermittently through the dynamically meshing intermittent transmission gear (404). The intermittently rotating flipping seat (2) drives the pick-and-place mechanism (5) and the second transmission pulley group (9) to run through the transmission gear group (8). The running second transmission pulley group (9) drives the pressure testing mechanism (7) to run. At the same time, the negative pressure machine (601) runs to store negative pressure inside the negative pressure tank (6). Step 2: Open the valve of the pipe connecting the negative pressure tank (6) and the negative pressure conveying mechanism (3). The negative pressure conveying mechanism (3) delivers negative pressure to the negative pressure seat (202), so that a negative pressure environment is formed inside the negative pressure seat (202). The chip is delivered to the bottom of the pick-and-place mechanism (5) by the running conveyor (102). At the same time, the running pick-and-place mechanism (5) transfers the chip to the adsorption seat (201). The pressure generated by the chip opens the adsorption seat (201), so that the negative pressure inside the negative pressure seat (202) adsorbs the chip through the adsorption seat (201). Step 3: Rotating flip seat (2) rotates the chip adsorbed by the adsorption seat (201) to the vertical axis position of one of the industrial camera mechanisms (103), and takes pictures of the chip to check the integrity of the chip through the industrial camera mechanism (103). Step 4: The rotating flip seat (2) continues to rotate the chip adsorbed by the adsorption seat (201) to the bottom of the pressure test mechanism (7). The chip is subjected to pressure test by the running pressure test mechanism (7) to verify the durability of the chip packaging material under stress. Step 5: The chip that has completed the test is rotated to the vertical axis position of another industrial camera mechanism (103) under the drive of the rotating flip stand (2). The chip is photographed to detect the integrity of the chip packaging material under force. Step 6: The rotating flip seat (2) continues to rotate the chip to the platform on the side of the mounting cover (1). The vacuum state of the adsorption seat (201) for adsorbing the chip is controlled by the control valve (303) in the negative pressure conveying mechanism (3), and the adsorption seat (201) adsorbs the chip, so that the chip is transported to the platform on the side of the mounting cover (1).

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