Chip power consumption adjusting method and device, electronic equipment and storage medium

Abstract

The invention provides a chip power consumption adjusting method and device, electronic equipment and a storage medium, and relates to the technical field of computers. The method comprises the following steps: acquiring a real-time working temperature of a target chip and an average working temperature of the target chip in a current sampling period; when the real-time working temperature is greater than a preset consumption reduction starting temperature, reducing the power consumption output value of the target chip; in the power consumption reduction process, responding to the situation that the real-time working temperature is larger than a preset temperature upper limit threshold value, and based on the real-time working temperature, the current power consumption output value and the power consumption increasing starting point, generating a corrected power consumption increasing curve; and when the average working temperature is smaller than the temperature upper limit threshold value, power consumption rising adjustment is carried out on the chip based on the corrected power consumption rising curve. According to the scheme, the power consumption recovery flexibility and reliability of the chip in a heat dissipation limited scene can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of computer technology, and more specifically, to a chip power consumption regulation method and apparatus, electronic equipment, and storage medium. Background Technology

[0002] With the rapid development of artificial intelligence and high-performance computing technologies, the integration and computing power of chips are constantly improving, which has led to a gradual increase in the operating temperature and temperature fluctuation of chips. This places higher demands on the power consumption control and temperature management of chips.

[0003] In some related power regulation technologies, when a chip is in a high-temperature critical state, its power consumption is first reduced. When the temperature drop meets a preset hysteresis temperature, power consumption recovery regulation is triggered. However, this regulation method based on a fixed hysteresis temperature is difficult to adapt to scenarios with abnormal heat dissipation. Under poor thermal design conditions or degraded heat sink performance, even if the chip has reduced its power consumption, its temperature drop may still be insufficient to reach the set hysteresis temperature, thus failing to trigger power consumption recovery regulation and causing the chip to remain in a low-power operation state for an extended period. Summary of the Invention

[0004] The purpose of this disclosure is to provide a chip power consumption adjustment method, a chip power consumption adjustment device, an electronic device, and a computer-readable storage medium. By constructing a corrected power consumption rise curve when the operating temperature exceeds the upper temperature threshold and combining it with the average temperature for power consumption recovery adjustment, the flexibility and reliability of chip power consumption recovery in heat dissipation-limited scenarios are improved.

[0005] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0006] According to a first aspect of the present disclosure, a chip power consumption adjustment method is provided, comprising:

[0007] Obtain the real-time operating temperature of the target chip and the average operating temperature of the target chip in the current sampling period;

[0008] When the real-time operating temperature is greater than the preset power reduction start temperature, the power consumption output value of the target chip is reduced.

[0009] During the power reduction process, in response to the real-time operating temperature being greater than a preset upper temperature threshold, a corrected power increase curve is generated based on the real-time operating temperature, the current power output value, and the power increase start point. The power increase start point represents the starting reference point when the power consumption of the target chip is adjusted to recover when the real-time operating temperature is not greater than the upper temperature threshold. The upper temperature threshold is greater than the power reduction start temperature.

[0010] When the average operating temperature is less than the upper temperature threshold, the power consumption of the target chip is adjusted to recover based on the corrected power consumption curve.

[0011] In some embodiments, reducing the power consumption output value of the target chip when the real-time operating temperature is greater than a preset power reduction initiation temperature includes: triggering the target chip's current operating state to enter a power reduction state when the real-time operating temperature is greater than the preset power reduction initiation temperature; in the power reduction state, reducing the power consumption output value of the target chip based on a preset power reduction curve, and determining whether the real-time operating temperature meets the requirement of being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time; in response to the real-time operating temperature being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time, maintaining the power reduction state of the target chip, otherwise exiting the power reduction state.

[0012] In some embodiments, the step of generating a corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point in response to the real-time operating temperature being greater than a preset upper temperature threshold includes: triggering the target chip's current operating state to enter an abnormal state when the real-time operating temperature is greater than the preset upper temperature threshold; and generating the corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point in the abnormal state.

[0013] In some embodiments, the above-described chip power consumption adjustment method further includes: in the abnormal state, determining whether the average operating temperature is not less than the upper temperature threshold; in response to the average operating temperature being not less than the upper temperature threshold, maintaining the target chip in the abnormal state, otherwise exiting the abnormal state.

[0014] In some embodiments, generating the corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the preset power consumption rise starting point includes: obtaining an initial curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point; and increasing the slope coefficient of the initial curve by a preset factor to obtain the corrected power consumption curve.

[0015] In some embodiments, the step of adjusting the power consumption of the target chip based on the modified power consumption curve when the average operating temperature is less than the upper temperature threshold includes: triggering the target chip's current operating state to enter a power consumption increase state when the average operating temperature is less than the upper temperature threshold; and adjusting the power consumption of the target chip based on the modified power consumption curve in the power consumption increase state.

[0016] In some embodiments, the step of adjusting the power consumption of the target chip based on the modified power consumption curve includes: performing a first-stage power consumption recovery adjustment on the target chip based on the modified power consumption curve; during the first-stage power consumption recovery adjustment, when the average operating temperature is lower than the power consumption initiation temperature corresponding to the power consumption initiation point, performing a second-stage power consumption recovery adjustment on the target chip based on the original power consumption curve; wherein, the power consumption initiation point is a common endpoint of the modified power consumption curve and the original power consumption curve.

[0017] In some embodiments, the above-mentioned chip power consumption adjustment method further includes: when the target chip is operating at full power consumption and the real-time operating temperature is not greater than the power consumption reduction starting temperature, determining that the current operating state of the target chip is a healthy state.

[0018] In some embodiments, the above-described chip power consumption adjustment method further includes: during the power consumption reduction process, when the real-time operating temperature is less than the upper temperature threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is greater than the power consumption initiation temperature, triggering the current operating state of the target chip to enter a hysteresis state; in the hysteresis state, the power consumption output value of the target chip remains unchanged, and it is determined whether the upper temperature threshold is not greater than the operating temperature at the previous sampling time, and the average operating temperature is greater than the power consumption initiation temperature; in response to the upper temperature threshold being not greater than the operating temperature at the previous sampling time, and the average operating temperature being greater than the power consumption initiation temperature, the target chip maintains the hysteresis state, otherwise it exits the hysteresis state.

[0019] In some embodiments, the above-described chip power consumption adjustment method further includes: if the real-time operating temperature is greater than the operating temperature at the previous sampling time, then exiting the hysteresis state and entering the power consumption reduction state.

[0020] In some embodiments, the above-mentioned chip power consumption adjustment method further includes: if the real-time operating temperature is not greater than the operating temperature at the previous sampling time, and the average operating temperature is not greater than the power consumption rise initiation temperature, then exiting the hysteresis state and entering the power consumption rise state.

[0021] In some embodiments, entering the power-up state includes: determining the runtime of the target chip in the hysteresis state; and entering the power-up state in response to the runtime satisfying a preset hysteresis duration.

[0022] In some embodiments, the above-described chip power consumption adjustment method further includes: during the power consumption reduction process, when the real-time operating temperature is less than the upper temperature threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is not greater than the power consumption rise initiation temperature, triggering the target chip's current operating state to enter a power consumption rise state; in the power consumption rise state, adjusting the power consumption of the target chip based on the original power consumption rise curve, and determining whether the power consumption output value determined based on the original power consumption rise curve satisfies that it is not less than a preset power consumption lower limit and not greater than a preset power consumption upper limit; in response to the upper temperature threshold not being greater than the operating temperature at the previous sampling time, and the average operating temperature being greater than the power consumption rise initiation temperature, maintaining the target chip in the power consumption rise state, otherwise exiting the power consumption rise state.

[0023] In some embodiments, the step of adjusting the power consumption of the target chip based on the original power consumption rise curve includes: generating the original power consumption rise curve based on a preset slope, the power consumption rise start temperature, and the current power consumption output value corresponding to the power consumption rise start temperature; and adjusting the power consumption of the target chip based on the original power consumption rise curve.

[0024] In some embodiments, the above-mentioned chip power consumption adjustment method further includes: if the power consumption output value is less than the lower limit of power consumption and not greater than the upper limit of power consumption, then exiting the power consumption increase state and entering the abnormal state.

[0025] In some embodiments, the above-described chip power consumption adjustment method further includes: if the power consumption output value is greater than the power consumption upper limit value, then exiting the power consumption increase state and entering a healthy state.

[0026] In some embodiments, the process of obtaining the average operating temperature includes: acquiring the first operating temperature of the target chip in an initial sampling period, and multiplying the first operating temperature by a preset smoothing factor to obtain a first smoothed cumulative value; acquiring the second operating temperature of the target chip in a second sampling period, subtracting the first operating temperature from the first smoothed cumulative value and adding the second operating temperature to obtain a second smoothed cumulative value; dividing the second smoothed cumulative value by the smoothing factor to obtain the average operating temperature of the second sampling period, and using the second smoothed cumulative value as the input value of the smoothed cumulative value for the next sampling period.

[0027] In some embodiments, the above-mentioned chip power consumption adjustment method further includes: counting the number of abnormal times when the real-time operating temperature is greater than the upper temperature threshold; in response to the number of abnormal times being greater than a preset high temperature number threshold, generating a heat dissipation abnormality command, and using a preset protection power consumption value as the power consumption output value of the target chip.

[0028] According to a second aspect of the present disclosure, a chip power consumption regulation device is provided, comprising:

[0029] The temperature acquisition module is used to acquire the real-time operating temperature of the target chip and the average operating temperature of the current sampling period.

[0030] The power consumption reduction module is used to reduce the power consumption output value of the target chip when the real-time operating temperature is greater than the preset power consumption reduction start temperature.

[0031] The curve update module is used to generate a corrected power consumption curve in response to the real-time operating temperature being greater than a preset upper temperature threshold during the power consumption reduction process, based on the real-time operating temperature, the current power consumption output value, and the power consumption increase start point. The power consumption increase start point represents the starting reference point when the power consumption of the target chip is adjusted to recover when the real-time operating temperature is not greater than the upper temperature threshold. The upper temperature threshold is greater than the power consumption reduction start temperature.

[0032] The power consumption recovery module is used to adjust the power consumption of the target chip based on the corrected power consumption recovery curve when the average operating temperature is less than the upper temperature threshold.

[0033] According to a third aspect of the present disclosure, an electronic device is provided, comprising: a processor; and a memory storing computer-readable instructions that, when executed by the processor, implement the chip power consumption adjustment method as described in the first aspect.

[0034] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored, which, when executed by a processor, implements the chip power consumption adjustment method as described in the first aspect.

[0035] The technical solutions provided in this disclosure may have the following beneficial effects:

[0036] The chip power consumption adjustment method in the example embodiments of this disclosure, on the one hand, generates a corrected power consumption increase curve based on the power consumption increase start point, the current power consumption output value, and the corresponding real-time operating temperature when the real-time operating temperature exceeds the upper temperature threshold. This allows for the dynamic construction of a power consumption increase path adapted to the current heat dissipation state based on the temperature peak, i.e., the real-time operating temperature. This avoids the problem in related technologies where the fixed hysteresis temperature setting makes it difficult to trigger the power consumption increase condition due to temperature drop, resulting in the chip operating in a low-power state for extended periods under abnormal heat dissipation conditions. This improves the chip's power consumption recovery capability in abnormal heat dissipation scenarios. On the other hand, using the real-time operating temperature as the criterion for power consumption reduction adjustment enables timely power consumption reduction control when the temperature remains high. Using the average operating temperature as the criterion for power consumption recovery adjustment filters out short-term temperature fluctuations, preventing premature triggering of power consumption increase adjustment. This makes the power consumption adjustment process sensitive to temperature rise and insensitive to temperature fall. Furthermore, this improves the flexibility and reliability of power consumption recovery in heat-constrained scenarios to a certain extent.

[0037] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0039] Figure 1 The schematic diagram illustrates a flowchart of a chip power consumption regulation method according to some embodiments of the present disclosure.

[0040] Figure 2 A schematic diagram of a modified rise-loss curve according to some embodiments of the present disclosure is shown.

[0041] Figure 3 A schematic diagram of the original rise-loss curves according to some embodiments of the present disclosure is shown.

[0042] Figure 4 The schematic diagram illustrates a flow chart of a chip power consumption regulation method according to some other embodiments of the present disclosure.

[0043] Figure 5 The illustration schematically shows a logic diagram of a chip power consumption regulation method according to some other embodiments of the present disclosure.

[0044] Figure 6A schematic diagram of a chip power consumption regulation device according to some embodiments of the present disclosure is shown.

[0045] Figure 7 The schematic diagram illustrates the structural schematic of a computer system of an electronic device according to some embodiments of the present disclosure.

[0046] Figure 8 A schematic diagram of a computer-readable storage medium according to some embodiments of the present disclosure is shown.

[0047] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts. Detailed Implementation

[0048] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this specification as detailed in the appended claims.

[0049] The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this specification. The singular forms “a,” “the,” and “the” as used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0050] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0051] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0052] Furthermore, the accompanying drawings are for illustrative purposes only and are not necessarily drawn to scale. The block diagrams shown in the drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0053] In this example embodiment, a chip power consumption adjustment method is first provided. This chip power consumption adjustment method can be applied to electronic devices or electronic equipment with heat-sensitive power consumption output characteristics, such as including but not limited to central processing units, graphics processors, programmable logic devices, and embedded terminal devices. Figure 1 A schematic flowchart illustrating a chip power consumption regulation method according to some embodiments of the present disclosure is shown. (Reference) Figure 1 As shown, the chip power consumption regulation method may include the following steps:

[0054] Step S110: Obtain the real-time operating temperature of the target chip and the average operating temperature of the target chip in the current sampling period;

[0055] Step S120: When the real-time operating temperature is greater than the preset power reduction start temperature, the power consumption output value of the target chip is reduced.

[0056] Step S130: During the power consumption reduction process, in response to the real-time operating temperature being greater than the preset upper temperature threshold, a corrected power consumption curve is generated based on the real-time operating temperature, the current power consumption output value, and the power consumption increase start point. The power consumption increase start point represents the starting reference point when adjusting the power consumption of the target chip to increase when the real-time operating temperature is not greater than the upper temperature threshold. The upper temperature threshold is greater than the power consumption reduction start temperature.

[0057] Step S140: When the average operating temperature is less than the upper temperature threshold, adjust the power consumption of the target chip based on the corrected power consumption curve.

[0058] According to the chip power consumption adjustment method in this example embodiment, on the one hand, when the real-time operating temperature is greater than the upper temperature threshold, a corrected power consumption increase curve is generated based on the power consumption increase start point, the current power consumption output value, and the corresponding real-time operating temperature. This allows for the dynamic construction of a power consumption increase path adapted to the current heat dissipation state based on the temperature peak, i.e., the real-time operating temperature. This avoids the problem of the chip remaining in a low-power operating state for a long time due to the difficulty in triggering power consumption increase conditions caused by the fixed hysteresis temperature setting under abnormal heat dissipation conditions. This improves the chip's power consumption recovery capability under abnormal heat dissipation scenarios. On the other hand, using the real-time operating temperature as the criterion for power consumption reduction adjustment enables timely power consumption reduction control when the temperature remains high. Using the average operating temperature as the criterion for power consumption recovery adjustment filters short-term temperature fluctuations, preventing premature triggering of power consumption increase adjustment, making the power consumption adjustment process sensitive to temperature rise and insensitive to temperature fall. Therefore, this improves the flexibility and reliability of power consumption recovery in heat-constrained scenarios to a certain extent.

[0059] The chip power consumption adjustment method in this example embodiment will be further explained below.

[0060] In step S110, the real-time operating temperature of the target chip and the average operating temperature of the target chip in the current sampling period are obtained.

[0061] The target chip can refer to an integrated circuit component that serves as the target for power consumption adjustment. During operation, it generates heat and supports temperature-based power consumption regulation. This target chip may include a central processing unit (CPU), graphics processing unit (GPU), programmable logic device (PLC), and other electronic devices with thermal design power (TDP), such as embedded terminal devices. The current operating temperature can represent a temperature parameter value obtained in real-time from a temperature sensor located within the target chip, reflecting the chip's current thermal state. The sampling period can represent the time interval for temperature sampling and recording at a preset time interval. For example, the sampling period can be 10 milliseconds, 20 milliseconds, 50 milliseconds, or 100 milliseconds, or other time lengths set according to temperature control accuracy requirements. The average operating temperature can represent a representative temperature value calculated through smoothing iteration within a sampling period, combining the real-time operating temperature of the current sampling period with the smoothed cumulative result of the previous sampling period. This average temperature value reflects the overall thermal state of the chip across consecutive sampling periods. It comprehensively considers both the current and historical temperature changes of the target chip, avoiding instantaneous deviations caused by single sampling fluctuations.

[0062] In step S120, when the real-time operating temperature is greater than the preset power reduction starting temperature, the power consumption output value of the target chip is reduced.

[0063] The power derating initiation temperature represents the temperature threshold that triggers the chip to enter a power derating state. It indicates that when the chip reaches this temperature during operation, it needs to initiate power derating to prevent further temperature increases. The power output value represents the power output level of the target chip set by the power control module. The power derating initiation temperature can be configured based on the chip's thermal design parameters, workload characteristics, and target safe upper temperature limit. For example, the power derating initiation temperature can be set to 75°C, 80°C, 85°C, or other values ​​suitable for the chip's operating requirements. (Reference) Figure 3 As shown, the vertical axis represents the power output value in milliwatts (mW), and the horizontal axis represents the current operating temperature in millidegrees per second (m°C). a0 is the starting point for power reduction. When the real-time operating temperature exceeds the value corresponding to a0, the power output value of the chip is reduced using the power reduction curve a0b3. In this step, the real-time operating temperature is used as the criterion for power reduction adjustment, enabling timely power reduction control when the temperature remains high, ensuring a fast power reduction response.

[0064] In step S130, during the power consumption reduction process, in response to the real-time operating temperature being greater than the preset upper temperature threshold, a corrected power consumption increase curve is generated based on the power consumption increase start point, the current power consumption output value, and the corresponding real-time operating temperature. Here, the power consumption increase start point represents the starting reference point when adjusting the power consumption of the target chip to increase when the real-time operating temperature is not greater than the upper temperature threshold, and the upper temperature threshold is greater than the power consumption reduction start temperature.

[0065] The upper temperature threshold represents the temperature value used to determine whether the chip's current operating state is at the thermal anomaly boundary. This value is higher than the power reduction initiation temperature and can be set based on the chip's thermal design and historical peak temperatures. For example, the upper temperature threshold can be 95℃, 98℃, or 100℃, or other temperature values ​​that meet actual adjustment requirements. The current power output value represents the current power output level of the target chip in its current operating state, set by the power control module. This can be determined based on the average operating temperature and real-time operating temperature collected in the previous sampling cycle. Furthermore, the current power output value corresponding to the initial sampling cycle can be the initial power value preset when power adjustment is initiated. This initial power value can be set based on the chip's rated operating power or factory default configuration. The power increase initiation point represents the starting reference point for power recovery adjustment of the target chip when the real-time operating temperature is not greater than the upper temperature threshold. This point includes the corresponding power increase initiation temperature and power increase initiation value. The power increase initiation point serves as the starting point of the original power increase curve and the ending point of the corrected power increase curve. The corrected power consumption rise curve represents the power consumption recovery curve recalculated based on the current chip temperature peak and corresponding power output value after the real-time operating temperature exceeds the upper temperature threshold. Its endpoint coincides with the power consumption rise start point, while the start point is constructed based on the temperature peak to dynamically adapt to changes in heat dissipation capacity. (Reference) Figure 2 As shown, B1 is the temperature peak point, where the corresponding temperature value is greater than the upper temperature threshold. c1 represents the starting point of the temperature rise. c1d1 is the original temperature rise curve. B1c1 is the corrected temperature rise curve. b1c1 represents the hysteresis interval.

[0066] In step S140, when the average operating temperature is less than the upper temperature threshold, the power consumption of the target chip is adjusted based on the corrected power consumption curve.

[0067] Specifically, when the average operating temperature is below the upper temperature threshold, the chip can be considered to be in a temperature drop-off state, meeting the conditions for power consumption recovery. When adjusting the chip's power consumption recovery, the corresponding power output value on the corrected power consumption rise curve can be determined based on the average operating temperature for each sampling period. This power output value is then used as a reference to adjust the chip's actual power output, achieving gradual recovery. Using the average operating temperature as the criterion for power consumption recovery adjustment in this step filters out short-term temperature fluctuations and avoids premature triggering of power consumption rise adjustment.

[0068] The contents of steps S110 to S140 will be described in detail below.

[0069] In some embodiments, the average operating temperature in step S110 can be obtained by the following steps: acquiring the first operating temperature of the target chip in the initial sampling period, and multiplying the first operating temperature by a preset smoothing factor to obtain a first smoothed cumulative value; acquiring the second operating temperature of the target chip in the second sampling period, subtracting the first operating temperature from the first smoothed cumulative value and adding the second operating temperature to obtain a second smoothed cumulative value; dividing the second smoothed cumulative value by the smoothing factor to obtain the average operating temperature of the second sampling period, and using the second smoothed cumulative value as the input value of the smoothed cumulative value for the next sampling period.

[0070] The initial sampling period can represent the first temperature sampling period during the power consumption regulation process's startup or re-initialization phase. The first operating temperature value can represent the real-time operating temperature obtained within the initial sampling period, serving as the initial input for subsequent smoothing processing. The smoothing factor can represent an integer used to control the sensitivity to temperature changes; a larger smoothing factor value results in stronger filtering of temperature fluctuations. The first smoothing cumulative value can represent the intermediate variable obtained by multiplying the first operating temperature value by the smoothing factor, providing an initial cumulative benchmark for subsequent smoothing calculations. The second sampling period can represent the next temperature sampling period immediately following the initial sampling period. The second operating temperature value can represent the real-time operating temperature obtained within the second sampling period. The second smoothing cumulative value can represent the temperature smoothing cumulative result corresponding to the second sampling period, serving as the input value for the smoothing cumulative value of the next sampling period. The smoothing process following the second sampling period can be recursively performed based on the sampling period. Specifically, in the nth (n≥3) sampling period, the nth operating temperature is obtained; the smoothed cumulative value of the previous sampling period is subtracted from the operating temperature of the previous sampling period, and then the nth temperature value is added to obtain the nth smoothed cumulative value; the nth smoothed cumulative value is divided by the smoothing factor to obtain the current operating temperature of the nth sampling period, and the nth smoothed cumulative value is used as the input value for the smoothed cumulative value of the next sampling period. In this embodiment, the average operating temperature is calculated by iteratively updating the smoothed cumulative value, making the chip's response to single temperature fluctuations more stable, thereby improving the stability and reliability of power consumption regulation.

[0071] In some embodiments, the step S120 of reducing the power consumption output value of the chip when the real-time operating temperature is greater than the preset power reduction start temperature can be achieved through the following steps: when the real-time operating temperature is greater than the preset power reduction start temperature, the target chip is triggered to enter the power reduction state in its current operating state; in the power reduction state, the power consumption output value of the target chip is reduced based on the preset power reduction curve, and it is determined whether the real-time operating temperature meets the condition of being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time; in response to the real-time operating temperature being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time, the target chip is kept in the power reduction state, otherwise it exits the power reduction state.

[0072] The power reduction initiation temperature represents the temperature threshold used to trigger the chip to enter the power reduction process. It is typically set slightly below the chip's safe temperature limit, used to determine if the chip has reached the point where it needs to actively reduce power consumption to suppress temperature rise. The power reduction state represents a reduced power output operating mode that the chip enters to lower the temperature when it detects that the real-time operating temperature exceeds the power reduction initiation temperature. The power reduction curve represents a reference curve in the power reduction process, used to determine the corresponding power reduction reference value based on the current operating temperature when the real-time operating temperature is higher than the power reduction initiation temperature, guiding the chip to gradually reduce power consumption. The operating temperature at the previous sampling moment represents the chip's real-time operating temperature recorded in the previous sampling period relative to the current sampling period. (Reference) Figure 3 As shown, a0 is the starting point for power consumption reduction, and its corresponding temperature value is the starting temperature for power consumption reduction. When the real-time operating temperature is greater than the temperature value corresponding to a0, the power consumption output value of the chip is reduced using the power consumption reduction curve a0b3.

[0073] Furthermore, if the current operating temperature is below the upper temperature threshold, it indicates that the chip temperature is within the tolerance range. Conversely, if the current operating temperature is higher than the operating temperature at the previous sampling time, it indicates that the chip is in a continuous heating process. In this case, maintaining the power-saving state helps control the temperature rise. Conversely, if the current operating temperature does not meet either of the aforementioned two conditions—that is, if the current operating temperature is lower than the operating temperature at the previous sampling time or higher than the upper temperature threshold—it indicates that the chip may already be cooling down or is at risk of overheating. Therefore, it is no longer suitable to maintain the power-saving state and should promptly exit the power-saving state and enter another power control state.

[0074] In some embodiments, the following steps can be used to implement step S130: responding to a real-time operating temperature exceeding a preset upper temperature threshold, generating a corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise start point. Specifically, generating the corrected power consumption curve includes: when the real-time operating temperature exceeds the preset upper temperature threshold, triggering the chip's current operating state to enter an abnormal state; and in the abnormal state, generating a corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise start point.

[0075] The abnormal state indicates that the chip's real-time operating temperature exceeds the upper temperature threshold during operation. In this state, the chip is considered to have an abnormal heat dissipation problem, potentially failing to trigger power recovery due to the inability to meet the hysteresis interval, resulting in the chip remaining in a low-power state. Therefore, the power recovery curve needs to be updated. The real-time operating temperature at the latest sampling moment represents the operating temperature value obtained in the last temperature sampling operation before entering the abnormal state. The current power output value represents the power output value corresponding to the latest sampling moment.

[0076] Furthermore, if the target chip is in an abnormal state, it can be determined whether the average operating temperature meets the requirement of not being less than the upper temperature threshold. If the real-time operating temperature is less than the upper temperature threshold but greater than the operating temperature at the previous sampling time, the target chip is kept in the abnormal state; otherwise, it exits the abnormal state. Further, if the average operating temperature is not less than the upper temperature threshold, it indicates that the chip's overall heat has not been effectively released, and the abnormal state must still be maintained. When the average operating temperature drops below the upper temperature threshold, it indicates that the chip has the conditions for power consumption recovery, at which point it can exit the abnormal state and enter the subsequent power consumption recovery adjustment phase. In addition, in the abnormal state, if the real-time operating temperature is greater than the operating temperature at the previous sampling time in each sampling cycle, the chip's power consumption can be further reduced based on the power reduction curve. A new corrected power consumption curve is generated based on the real-time operating temperature corresponding to the highest temperature point and the power consumption output value, combined with the power consumption recovery starting point. If the real-time operating temperature in the current sampling period is higher than the operating temperature at the previous sampling time, it indicates that the chip is experiencing a continuous temperature rise. In this case, the chip's power consumption output value can be further reduced based on the power consumption reduction curve. Simultaneously, using the real-time operating temperature corresponding to the highest temperature point in the current sampling period and its corresponding power consumption output value as a reference, and combining it with the starting point of the power consumption rise, a new corrected power consumption rise curve is generated for dynamic adaptation during subsequent power consumption recovery adjustments. This processing mechanism enables further reduction of power consumption under abnormal conditions while dynamically updating the power consumption rise curve, enhancing the chip's adaptive adjustment capability under degraded heat dissipation conditions.

[0077] In some embodiments, a modified power consumption curve is generated based on the real-time operating temperature, the current power consumption output value, and a preset power consumption rise starting point. Specifically, the technical steps include: obtaining an initial curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point; and increasing the slope coefficient of the initial curve by a preset factor to obtain the modified power consumption curve.

[0078] The initial curve represents the relationship between temperature and power consumption calculated based on the latest sampling time's real-time operating temperature, the current power output value, and the power consumption rise initiation point after the real-time operating temperature exceeds the upper temperature threshold and enters an abnormal state. It reflects the initial trend of power consumption change with temperature under abnormal temperature conditions and serves as the basis for generating the corrected power consumption rise curve. The slope coefficient represents the rate of change of the power output value with the real-time operating temperature in the initial curve. Specifically, the slope coefficient can be calculated from the coordinate difference between the power consumption rise initiation point, the current power output value, and its corresponding real-time operating temperature. To avoid introducing floating-point operations during chip power consumption adjustment calculations, in this embodiment, the slope coefficient of the initial curve can be shifted left by a preset factor. For example, the slope coefficient of the initial curve can be shifted left by 20 bits. In this embodiment, by expanding the slope coefficient of the initial curve, the resource overhead caused by floating-point operations can be avoided, improving the calculation efficiency of power consumption adjustment and reducing resource consumption.

[0079] In addition, in some embodiments, in order to provide timely feedback on the thermal state of the chip, the number of times the real-time operating temperature exceeds the upper temperature threshold can be counted under abnormal conditions; in response to the number of abnormalities exceeding a preset high temperature number threshold, a heat dissipation abnormality command is generated, and a preset protection power consumption value is used as the power consumption output value of the target chip.

[0080] The high-temperature frequency threshold represents the maximum acceptable number of times the real-time operating temperature exceeds the upper temperature limit within a preset cumulative sampling period. For example, the high-temperature frequency threshold could be 3, 5, 10, or other thresholds set according to the target chip's heat dissipation capacity. The heat dissipation anomaly command is a command generated when the number of anomalies exceeds the high-temperature frequency threshold; it can be used to issue alarms or adjust the cooling equipment's operating parameters. The protection power consumption value represents a safe power consumption limit parameter set to prevent overheating damage when the target chip is detected to be in a state of continuous high temperature or heat dissipation anomaly. This protection power consumption value is lower than the chip's normal operating power consumption limit and is used to forcibly constrain the chip's maximum power output under abnormal conditions to ensure the chip's safe and stable operation. By generating the heat dissipation anomaly command and using the protection power consumption value as the target chip's power output value, rapid identification of chips operating at high temperatures for extended periods can be achieved. This helps to promptly detect abnormalities such as decreased heat dissipation capacity or cooling system failure, thereby ensuring the safety and stability of chip operation.

[0081] In some embodiments, step S140, where the average operating temperature is less than the upper temperature threshold, involves adjusting the chip's power consumption based on a modified power consumption curve to increase power consumption. Specifically, this includes: triggering the target chip's current operating state to enter a power consumption increase state when the average operating temperature is less than the upper temperature threshold; and adjusting the target chip's power consumption based on the modified power consumption curve in the power consumption increase state. The power consumption increase state represents the operating state the chip enters after meeting the power consumption recovery condition, enabling a smooth transition from low-power to high-power operation. Triggering the chip's current operating state to enter the power consumption increase state when the average operating temperature is less than the upper temperature threshold helps ensure that the chip can promptly end the previous power consumption reduction control and initiate power consumption recovery adjustment after reaching low-temperature conditions, effectively preventing the chip from maintaining low-power operation even after the temperature has returned to normal.

[0082] In some embodiments, the power consumption recovery adjustment of the chip based on the modified power consumption rise curve in step S140 can be achieved by the following steps, specifically including: performing a first-stage power consumption recovery adjustment on the target chip based on the modified power consumption rise curve; during the first-stage power consumption recovery adjustment process, when the average operating temperature is lower than the power consumption rise start temperature corresponding to the power consumption rise start point, performing a second-stage power consumption recovery adjustment on the target chip based on the original power consumption rise curve; wherein, the power consumption rise start point is the common endpoint of the modified power consumption rise curve and the original power consumption rise curve.

[0083] The first-stage power consumption recovery adjustment refers to the process of gradually restoring the chip's power output value within the temperature range where the average operating temperature is below the upper temperature threshold but not below the initial power consumption initiation temperature, based on the temperature-power consumption relationship corresponding to the modified power consumption curve. The original power consumption curve can be represented as a pre-set temperature-power consumption mapping curve based on the chip's thermal design. The second-stage power consumption recovery adjustment refers to the subsequent adjustment process of restoring the chip's power output value based on the temperature-power consumption relationship corresponding to the original power consumption curve when the average operating temperature drops below the initial power consumption initiation temperature, to achieve a complete power consumption recovery. (Reference) Figure 2 As shown, in the first-stage power consumption recovery adjustment process, the recovery adjustment can be performed based on the modified power consumption rise curve B1c1; in the second-stage power consumption recovery adjustment process, the recovery adjustment can be performed based on the original power consumption rise curve c1d1. Based on these two stages of power consumption recovery, on the one hand, when the chip temperature is just below the upper temperature threshold, the first-stage power consumption recovery adjustment based on the modified power consumption rise curve allows the power consumption recovery curve to adapt to the current temperature surge state, effectively alleviating the problem of excessively low power consumption caused by abnormal heat dissipation while controlling the temperature rise; on the other hand, the second-stage power consumption recovery adjustment based on the original power consumption rise curve ensures that the chip gradually enters steady-state operation, avoiding power consumption recovery hysteresis.

[0084] In some embodiments, when the target chip operates at full power consumption and its real-time operating temperature does not exceed the power derating initiation temperature, the target chip's current operating state is determined to be healthy. Operating at full power consumption indicates that the chip's power output capability is not limited in its current operating state. A healthy state indicates that the chip's thermal dissipation within the current operating cycle is within the expected safe range. In this embodiment, when the chip's power consumption is unrestricted and its real-time operating temperature does not exceed the power derating initiation temperature, it can be determined to be in a stable and safe operating state, thereby avoiding unnecessary power adjustment operations.

[0085] In some embodiments, the power consumption adjustment method described above can also determine the hysteresis state through the following steps: During the power consumption reduction process, when the real-time operating temperature is less than the upper temperature limit threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is greater than the power consumption rise initiation temperature, the target chip's current operating state is triggered to enter the hysteresis state; in the hysteresis state, the power consumption output value of the target chip remains unchanged, and it is determined whether the upper temperature limit threshold is not greater than the operating temperature at the previous sampling time, and the average operating temperature is greater than the power consumption rise initiation temperature; in response to the upper temperature limit threshold being not greater than the operating temperature at the previous sampling time, and the average operating temperature being greater than the power consumption rise initiation temperature, the target chip is kept in the hysteresis state, otherwise it exits the hysteresis state.

[0086] The power consumption rise onset temperature represents the temperature threshold used to determine whether a chip meets the conditions for power consumption recovery. This temperature threshold corresponds to the x-axis value of the power consumption rise onset point on the power consumption rise curve. (Reference) Figure 3 As shown, the temperature value corresponding to point c1 is the initial power consumption rise temperature, and b1c1 represents the hysteresis interval. The hysteresis state can represent an intermediate operating state of the chip after the power consumption has decreased but before the power consumption recovery condition has been met. This state is used to maintain the current power consumption output value unchanged when the chip temperature has not dropped significantly but has not continued to rise, so as to suppress regulation fluctuations and improve the stability of the power consumption control process.

[0087] Specifically, during the chip power consumption reduction process, if the real-time operating temperature is lower than the upper temperature threshold and not higher than the operating temperature at the previous sampling time, while the average operating temperature is higher than the power consumption initiation temperature, the chip can be considered not yet in the safe recovery range. At this point, directly increasing power consumption may cause the chip temperature to rise again, leading to fluctuations in regulation. Therefore, by satisfying the above three conditions—low real-time temperature, no upward trend, and still relatively high average temperature—the chip is triggered to enter a hysteresis state, maintaining the current power consumption output value unchanged. When any of the conditions—the upper temperature threshold not being higher than the operating temperature at the previous sampling time, or the average operating temperature being higher than the power consumption initiation temperature—is no longer met, it indicates that the temperature is showing a significant downward trend or has not effectively decreased, and the chip exits the hysteresis state. In this embodiment, by introducing a hysteresis state, the trigger time for power consumption recovery regulation can be delayed, helping to maintain stable power consumption output before the average temperature has stabilized and avoiding fluctuations caused by premature power consumption increases.

[0088] Secondly, in hysteresis mode, if the real-time operating temperature is higher than the operating temperature at the previous sampling time, the chip exits hysteresis mode and enters power-saving mode. Specifically, when the real-time operating temperature is higher than the operating temperature at the previous sampling time, it indicates that the chip's current temperature trend has changed from decreasing to increasing, suggesting that the heat dissipation effect achieved by reducing power consumption may have weakened or failed. In this case, maintaining the current power output value may not effectively suppress the temperature rise trend, thus affecting the chip's temperature control safety. Therefore, when the above conditions are met, the chip exits hysteresis mode and re-enters power-saving mode. This ensures that the chip's power consumption regulation strategy can be adjusted in a timely manner according to temperature changes, enhancing the rapid response capability to temperature rise risks and further improving the chip's stability and safety during power consumption regulation.

[0089] Secondly, in hysteresis mode, if the real-time operating temperature is not higher than the operating temperature at the previous sampling time, and the average operating temperature is not higher than the power consumption initiation temperature, then the chip exits hysteresis mode and enters power consumption initiation mode. Specifically, in hysteresis mode, if the real-time operating temperature is not higher than the operating temperature at the previous sampling time, it indicates that the chip's current temperature has not continued to rise and has the potential to decrease further; simultaneously, if the average operating temperature is not higher than the power consumption initiation temperature, it indicates that the chip temperature has decreased to a safe range. Based on this, it can be determined that the chip currently meets the conditions for power consumption recovery, exiting hysteresis mode and entering power consumption initiation mode, which helps to release the chip's power consumption limit in a timely manner.

[0090] Furthermore, in some embodiments, when the chip exits the hysteresis state and enters the power-up state, the following conditions must be met: determine the runtime of the chip in the hysteresis state; and enter the power-up state in response to the runtime meeting a preset hysteresis duration. Here, runtime can represent the length of time the chip is in the hysteresis state. Hysteresis duration can represent the minimum duration threshold required to control the chip's transition from the hysteresis state to the power-up state. Using hysteresis duration for state determination can effectively avoid premature power-up operation triggered by short-term temperature fluctuations, thereby improving the stability and reliability of power consumption recovery judgment.

[0091] In some embodiments, the determination of the power consumption increase state can be achieved through the following steps: During the power consumption reduction process, when the real-time operating temperature is less than the upper temperature limit threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is not greater than the power consumption increase start temperature, the target chip's current operating state is triggered to enter the power consumption increase state; in the power consumption increase state, the target chip's power consumption is adjusted to increase based on the original power consumption increase curve, and it is determined whether the power consumption output value determined based on the original power consumption increase curve meets the requirement of not being less than a preset lower power consumption limit and not greater than a preset upper power consumption limit; in response to whether the power consumption output value determined based on the original power consumption increase curve meets the requirement of not being less than a preset lower power consumption limit and not greater than a preset upper power consumption limit, the target chip is kept in the power consumption increase state, otherwise it exits the power consumption increase state.

[0092] The lower power consumption limit represents the minimum power output allowed by the chip in the current operating mode, preventing performance impact from excessively low power settings. The upper power consumption limit represents the maximum power output allowed to recover under the current operating conditions, preventing overheating risks caused by excessive power recovery during the power consumption rise process.

[0093] Specifically, when the real-time operating temperature has not continued to rise compared to the previous sampling time, and its value is less than the upper temperature threshold, it indicates that the chip's current temperature has stabilized. Simultaneously, if the average operating temperature is not greater than the initial power consumption rise temperature, it indicates that the chip has cooled sufficiently and possesses certain conditions for power consumption recovery. Based on this, the chip's current operating state is triggered to enter the power consumption rise state. In the power consumption rise state, to ensure the stability and safety of the power consumption recovery process, power consumption recovery is based on the original power consumption rise curve. Furthermore, the power consumption output value determined based on the original power consumption rise curve is constrained and judged; that is, the current power consumption rise state is maintained only if the power consumption output value determined based on the original power consumption rise curve meets the conditions of not being less than a preset lower power consumption limit and not being greater than a preset upper power consumption limit, ensuring that the power consumption recovery range is reasonable and the operation is safe. Otherwise, the power consumption rise state is exited to avoid the abnormal risks caused by excessive power consumption recovery.

[0094] In some embodiments, power consumption recovery adjustment of the target chip is performed based on the original power consumption rise curve, specifically including: generating the original power consumption rise curve based on the preset slope, the power consumption rise start temperature and the current power consumption output value corresponding to the power consumption rise start temperature; and performing power consumption recovery adjustment of the target chip based on the original power consumption rise curve.

[0095] The preset slope represents the rate at which the power output value in the original power consumption curve increases with the average operating temperature. (Reference) Figure 3 The generation process of the original power consumption rise curve is described below. First, in the power consumption reduction state, power consumption is reduced based on the power consumption reduction curve a0b1. When the power consumption drops to the power output value corresponding to point b1, the chip temperature begins to decrease, entering a hysteresis state and maintaining the current power output value. When the decrease in operating temperature meets the temperature range corresponding to the hysteresis interval b1c1, the hysteresis state is exited and the power consumption rise state is entered. At this time, based on the current temperature value corresponding to point c1, the current power output value, and the preset slope, the original power consumption rise curve c1d1 is generated. Furthermore, when the temperature peaks in the power consumption reduction state are b2 and b3, the original power consumption rise curves c2d2 and c3d3 are generated similarly based on the above steps. The power consumption rise start temperatures corresponding to points c1, c2, and c3 are the same. In this embodiment, by adaptively generating the original power consumption rise curve, the adaptability of the power consumption recovery process to the current temperature and heat dissipation conditions can be improved.

[0096] Secondly, in the power consumption ramp-up state, if the power consumption output value is less than the lower power consumption limit and not greater than the upper power consumption limit, the system exits the ramp-up state and enters an abnormal state. Specifically, when the power consumption output value is less than the lower power consumption limit and not greater than the upper power consumption limit, it indicates that the power consumption recovery process is hindered, possibly due to insufficient environmental heat dissipation or an ineffective adjustment curve. In this case, the system exits the ramp-up state and enters an abnormal state to prevent the chip from continuously ramping up power consumption under unexpected conditions, ensuring operational safety.

[0097] Secondly, in the power-up state, if the power output value exceeds the power limit, the chip exits the power-up state and enters a healthy state. Specifically, in the power-up state, if the power output value continues to rise and exceeds the power limit, it indicates that the chip has completed the transition from a low-power state to a full-power operating state and is ready to return to a stable operating state. At this point, exiting the power-up state and entering a healthy state prevents the power regulation strategy from continuing to operate when it is no longer necessary, reduces resource consumption, and maintains the stability and energy efficiency of chip operation.

[0098] Figure 4 The schematic diagram illustrates a chip power consumption regulation method according to some other embodiments of the present disclosure, specifically including the following steps:

[0099] Step 401: Obtain the current operating temperature. Temperature parameters reflecting the current thermal state of the target chip are collected in real time using a temperature sensor installed inside the chip, providing fundamental data support for subsequent status identification and power consumption adjustment.

[0100] Step 402: Calculate the average operating temperature. Specifically, a smoothing calculation can be performed based on continuous temperature sampling results. First, obtain the smoothed cumulative value of the previous sampling period. Then, subtract the real-time operating temperature of the previous sampling period from the smoothed cumulative value of the previous sampling period, and add the real-time operating temperature of the current sampling period to obtain the smoothed cumulative value corresponding to the current sampling period. Subsequently, divide the smoothed cumulative value corresponding to the current sampling period by a preset smoothing factor to calculate the average operating temperature of the current sampling period. The smoothed cumulative value corresponding to the current sampling period is used as the input value for the smoothed cumulative value of the next sampling period. The average operating temperature helps to eliminate the interference of instantaneous temperature fluctuations and improve the stability of state determination.

[0101] Step 403, Status Identification. Based on real-time and average operating temperatures, identify whether the chip's current operating status is a power-saving state, hysteresis state, power-saving state, abnormal state, or healthy state. Different states correspond to different adjustment strategies.

[0102] Step 404, State Application. Based on the identified operating state, the corresponding power consumption adjustment mechanism is invoked. For example, in a power reduction state, a power reduction curve is applied to reduce power consumption; in a power increase state, a power increase curve is applied to increase power consumption; in a hysteresis state, the power consumption output value remains unchanged; or in an abnormal state, the power increase curve is updated to adapt to changes in heat dissipation.

[0103] Step 405: Determine the power consumption output value. Based on the current operating state and its corresponding power consumption adjustment strategy, determine the current power consumption output value of the target chip to achieve coordinated control of temperature and power consumption.

[0104] Furthermore, Figure 5 The schematic diagram illustrates a logic diagram of a chip power consumption regulation method according to some embodiments of the present disclosure, which is described in detail below:

[0105] Among them, temp represents the real-time working temperature, mean_temp represents the average working temperature, slow_down_start_temp represents the starting temperature for power consumption reduction, last_slow_down_temp represents the working temperature at the previous sampling moment, recurve_start_temp represents the starting temperature for power consumption increase, recurve_end_temp represents the temperature upper limit threshold, set_power_limit represents the current power consumption output value, max_power_limit represents the power consumption upper limit value, min_power_limit represents the power consumption lower limit value, healthy represents the healthy state, slowdown represents the power consumption reduction state, hysteresis represents the hysteresis state, return represents the power consumption increase state, and abnormal represents the abnormal state.

[0106] During the operation of the chip, the initial state is healthy. If the judgment condition temp ≤ slow_down_start_temp is satisfied, the healthy state remains unchanged; when the judgment condition temp > slow_down_start_temp holds, the current operating state of the chip switches from healthy to the slowdown state.

[0107] In the slowdown state, if the judgment condition temp < recurve_end_temp && temp > last_slow_down_temp is satisfied, the slowdown state remains unchanged. If the judgment condition temp ≥ recurve_end_temp is satisfied, the chip switches to the abnormal state; if the judgment condition temp < recurve_end_temp && temp ≤ last_slow_down_temp && mean_temp ≤ recurve_start_temp is satisfied, the chip switches to the return state; if the judgment condition temp < recurve_end_temp && temp ≤ last_slow_down_temp && mean_temp > recurve_start_temp is satisfied, the chip switches to the hysteresis state.

[0108] In the hysteresis state, if the judgment condition temp > last_slow_down_temp is satisfied, the chip switches back to the slowdown state; if the judgment conditions temp ≤ last_slow_down_temp && mean_temp ≤ recurve_start_temp are satisfied, the chip switches to the return state; if the judgment conditions temp ≤ last_slow_down_temp && mean_temp > recurve_start_temp are met, the hysteresis state remains unchanged.

[0109] In the return state, if the judgment conditions set_power_limit ≤ max_power_limit && set_power_limit ≥ min_power_limit are satisfied, the return state remains unchanged; if the judgment condition set_power_limit > max_power_limit holds, the chip switches to the healthy state; if the judgment conditions set_power_limit ≤ max_power_limit && set_power_limit < min_power_limit are satisfied, the chip switches to the abnormal state.

[0110] In the abnormal state, if the judgment condition mean_temp ≥ recurve_end_temp is satisfied, the abnormal state remains unchanged; if the judgment condition mean_temp < recurve_end_temp holds, the chip switches to the return state.

[0111] Through the above power consumption adjustment strategy, it is possible to achieve smooth adjustment of the power consumption output of the chip during high-temperature anomalies, cooling hysteresis, and temperature rise processes, thereby effectively improving the stability and reliability of the chip power consumption control in a heat dissipation-limited operating environment.

[0112] It should be noted that although the steps of the method in the present disclosure are described in a specific order in the drawings, this does not require or imply that these steps must be executed in that specific order, or that all the steps shown must be executed to achieve the desired result. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc.

[0113] In addition, in this exemplary embodiment, a chip power consumption adjustment device is also provided. Refer to Figure 6As shown, the chip power consumption adjustment device 600 includes: a temperature acquisition module 610, a power consumption reduction module 620, a curve update module 630, and a power consumption recovery module 640. Wherein:

[0114] The temperature acquisition module 610 can be used to acquire the real-time operating temperature of the target chip and the average operating temperature of the current sampling period.

[0115] The power reduction module 620 can be used to reduce the power output value of the target chip when the real-time operating temperature is higher than the preset power reduction start temperature;

[0116] The curve update module 630 can be used to generate a corrected power consumption curve in response to the real-time operating temperature being greater than the preset upper temperature threshold during the power consumption reduction process. Based on the real-time operating temperature, the current power consumption output value, and the preset power consumption increase start point, the power consumption increase start point represents the starting reference point when adjusting the power consumption of the target chip to increase when the real-time operating temperature is not greater than the upper temperature threshold. The upper temperature threshold is greater than the power consumption reduction start temperature.

[0117] The power consumption recovery module 640 can be used to adjust the power consumption of the target chip based on the corrected power consumption recovery curve when the average operating temperature is lower than the upper temperature threshold.

[0118] In some embodiments, the temperature acquisition module 610 can be configured to: acquire the first operating temperature of the target chip in the initial sampling period, and multiply the first operating temperature by a preset smoothing factor to obtain a first smoothed cumulative value; acquire the second operating temperature of the target chip in the second sampling period, subtract the first operating temperature from the first smoothed cumulative value and add the second operating temperature to obtain a second smoothed cumulative value; divide the second smoothed cumulative value by the smoothing factor to obtain the average operating temperature of the second sampling period, and use the second smoothed cumulative value as the input value of the smoothed cumulative value of the next sampling period.

[0119] In some embodiments, the power reduction module 620 can be configured to: trigger the target chip to enter a power reduction state when the real-time operating temperature is greater than a preset power reduction start temperature; in the power reduction state, reduce the power output value of the target chip based on a preset power reduction curve, and determine whether the real-time operating temperature is less than the upper temperature threshold and greater than the operating temperature at the previous sampling time; in response to the real-time operating temperature being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time, keep the target chip in the power reduction state, otherwise exit the power reduction state.

[0120] In some embodiments, the curve update module 630 can be configured to: trigger the target chip's current operating state to enter an abnormal state when the real-time operating temperature is greater than a preset upper temperature threshold; generate a corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point in the abnormal state; determine whether the average operating temperature is not less than the upper temperature threshold; and maintain the target chip in the abnormal state in response to the average operating temperature being not less than the upper temperature threshold, otherwise exit the abnormal state.

[0121] In some embodiments, the curve update module 630 may also be configured to: obtain an initial curve based on the real-time operating temperature, the current power consumption output value, and the starting point of power consumption increase; and increase the slope coefficient of the initial curve by a preset factor to obtain a corrected power consumption increase curve.

[0122] In some embodiments, the power consumption recovery module 640 can be configured to: trigger the target chip's current operating state to enter a power consumption recovery state when the average operating temperature is less than the upper temperature threshold; and adjust the power consumption of the target chip based on the corrected power consumption recovery curve in the power consumption recovery state.

[0123] In some embodiments, the power consumption recovery module 640 may also be configured to: perform a first-stage power consumption recovery adjustment on the target chip based on the corrected power consumption recovery curve; and, during the first-stage power consumption recovery adjustment, when the average operating temperature is lower than the power consumption recovery start temperature corresponding to the power consumption recovery start point, perform a second-stage power consumption recovery adjustment on the target chip based on the original power consumption recovery curve; wherein, the power consumption recovery start point is the common endpoint of the corrected power consumption recovery curve and the original power consumption recovery curve.

[0124] In some embodiments, the target chip power consumption adjustment device 600 further includes a health status module, which is used to determine that the current operating status of the target chip is a healthy state when the target chip is running at full power consumption and the real-time operating temperature is not greater than the power reduction start temperature.

[0125] In some embodiments, the chip power consumption adjustment device 600 further includes a hysteresis state module. This module is used to trigger the target chip's current operating state to enter a hysteresis state when, during the power consumption reduction process, the real-time operating temperature is less than the upper temperature limit threshold and not greater than the operating temperature at the previous sampling time, while the average operating temperature is greater than the power consumption rise initiation temperature. In the hysteresis state, the power consumption output value of the target chip remains unchanged, and it is determined whether the upper temperature limit threshold is not greater than the operating temperature at the previous sampling time, while the average operating temperature is greater than the power consumption rise initiation temperature. In response to the upper temperature limit threshold being not greater than the operating temperature at the previous sampling time, while the average operating temperature is greater than the power consumption rise initiation temperature, the target chip is kept in the hysteresis state; otherwise, it exits the hysteresis state.

[0126] In some embodiments, the hysteresis state module can also be configured to exit the hysteresis state and enter the power consumption reduction state if the real-time operating temperature is greater than the operating temperature at the previous sampling time.

[0127] In some embodiments, the hysteresis state module can also be configured to exit the hysteresis state and enter the power-up state if the real-time operating temperature is not greater than the operating temperature at the previous sampling time and the average operating temperature is not greater than the power-up start temperature.

[0128] In some embodiments, the hysteresis state module can also be configured to: determine the runtime of the target chip in the hysteresis state; and enter the power consumption increase state in response to the runtime meeting the preset hysteresis duration.

[0129] In some embodiments, the chip power consumption adjustment device 600 further includes a power consumption increase state module. This module is used to trigger the target chip's current operating state to enter a power consumption increase state when, during the power consumption reduction process, the real-time operating temperature is less than the upper temperature limit threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is not greater than the power consumption increase start temperature. In the power consumption increase state, the target chip's power consumption is adjusted to increase based on the original power consumption increase curve, and it is determined whether the power consumption output value determined based on the original power consumption increase curve meets the requirement of not being less than a preset lower power consumption limit and not greater than a preset upper power consumption limit. In response to whether the power consumption output value determined based on the original power consumption increase curve meets the requirement of not being less than the preset lower power consumption limit and not greater than the preset upper power consumption limit, the target chip is kept in the power consumption increase state; otherwise, it exits the power consumption increase state.

[0130] In some embodiments, the above-mentioned power consumption rise status module can also be configured to: generate an original power consumption rise curve based on a preset slope, the power consumption rise start temperature, and the current power consumption output value corresponding to the power consumption rise start temperature; and adjust the power consumption recovery of the target chip based on the original power consumption rise curve.

[0131] In some embodiments, the above-mentioned power consumption rise state module can also be configured to: if the power consumption output value is less than the lower limit of power consumption and not greater than the upper limit of power consumption, then exit the power consumption rise state and enter an abnormal state.

[0132] In some embodiments, the above-mentioned power consumption rise state module can also be configured to: exit the power consumption rise state and enter the healthy state if the power consumption output value is greater than the power consumption upper limit value.

[0133] In some embodiments, the chip power consumption adjustment device 600 further includes an anomaly statistics module, which is used to count the number of anomalies where the real-time operating temperature exceeds the upper temperature threshold; in response to the number of anomalies exceeding a preset high temperature number threshold, a heat dissipation anomaly command is generated, and a preset protection power consumption value is used as the power consumption output value of the target chip.

[0134] The specific details of each module of the above chip power consumption regulation device have been described in detail in the corresponding chip power consumption regulation method, so they will not be repeated here.

[0135] It should be noted that although several modules or units of the chip power consumption regulation device have been mentioned in the detailed description above, this division is not mandatory. In fact, according to embodiments of this disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0136] Furthermore, in an exemplary embodiment of this disclosure, an electronic device capable of implementing the above-described chip power consumption regulation method is also provided.

[0137] Those skilled in the art will understand that various aspects of this disclosure can be implemented as a system, method, or program product. Therefore, various aspects of this disclosure can be embodied in the following forms: a completely hardware embodiment, a completely software embodiment (including firmware, microcode, etc.), or an embodiment combining hardware and software aspects, collectively referred to herein as a "circuit," "module," or "system."

[0138] The following reference Figure 7 To describe an electronic device 700 according to such an embodiment of the present disclosure. Figure 7 The electronic device 700 shown is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments disclosed herein.

[0139] like Figure 7 As shown, the electronic device 700 is embodied in the form of a general-purpose computing device. The components of the electronic device 700 may include, but are not limited to, a processor and a memory. The processor may be configured to execute the chip power consumption adjustment method in the above embodiments by executing executable instructions. The memory may be used to store the executable instructions of the processor. The processor includes at least one processing unit 710, and the memory includes at least one storage unit 720. Furthermore, the electronic device 700 may also include a bus 730 connecting different system components (including the storage unit 720 and the processing unit 710) and a display unit 740.

[0140] The storage unit stores program code that can be executed by the processing unit 710, causing the processing unit 710 to perform the steps described in the "Exemplary Methods" section of this specification according to various exemplary embodiments of this disclosure. For example, the processing unit 710 can perform actions such as... Figure 1In step S110, the real-time operating temperature of the target chip and the average operating temperature of the target chip in the current sampling period are obtained; in step S120, when the real-time operating temperature is greater than the preset power reduction start temperature, the power output value of the chip is reduced; in step S130, during the power reduction process, in response to the real-time operating temperature being greater than the preset upper temperature threshold, a corrected power increase curve is generated based on the power increase start point, the current power output value, and the corresponding real-time operating temperature; in step S140, when the average operating temperature is less than the upper temperature threshold, the power consumption of the chip is adjusted to recover based on the corrected power increase curve.

[0141] Storage unit 720 may include readable media in the form of volatile storage units, such as random access memory (RAM) 721 and / or cache 722, and may further include read-only memory (ROM) 723.

[0142] The storage unit 720 may also include a program / utility 724 having a set (at least one) of program modules 725, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0143] Bus 730 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.

[0144] Electronic device 700 can also communicate with one or more external devices 770 (e.g., keyboard, pointing device, Bluetooth device, etc.), and with one or more devices that enable a user to interact with electronic device 700, and / or with any device that enables electronic device 700 to communicate with one or more other computing devices (e.g., router, modem, etc.). This communication can be performed via input / output (I / O) interface 750. Furthermore, electronic device 700 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 760. As shown, network adapter 760 communicates with other modules of electronic device 700 via bus 730. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with electronic device 700, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0145] Furthermore, the electronic device 700 also includes a chip 780, which serves as a power consumption regulation target and can correspond to the target chip described in the foregoing embodiments. The processing unit 710 dynamically adjusts the power consumption output value of the chip 780 by executing executable instructions stored in the storage unit 720, thereby achieving power consumption management and temperature regulation of the chip 780.

[0146] From the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, terminal device, or network device, etc.) to execute the methods according to the embodiments of this disclosure.

[0147] In exemplary embodiments of this disclosure, a computer-readable storage medium is also provided, on which a program product capable of implementing the methods described above is stored. In some possible embodiments, various aspects of this disclosure may also be implemented as a program product including program code that, when the program product is run on a terminal device, causes the terminal device to perform the steps described in the "Exemplary Methods" section of this specification according to various exemplary embodiments of this disclosure.

[0148] refer to Figure 8 As shown, a program product 800 for implementing the above-described chip power consumption regulation method according to an embodiment of the present disclosure is described. This product may employ a portable compact disc read-only memory (CD-ROM) and include program code, and may run on a terminal device, such as a personal computer. However, the program product of the present disclosure is not limited thereto. In this document, a readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.

[0149] The program product may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0150] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium, capable of sending, propagating, or transmitting programs for use by or in conjunction with an instruction execution system, apparatus, or device.

[0151] The program code contained on the readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0152] Program code for performing the operations of this disclosure can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0153] Furthermore, the above figures are merely illustrative of the processes included in the method according to exemplary embodiments of this disclosure and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0154] From the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, touch terminal, or network device, etc.) to execute the methods according to the embodiments of this disclosure.

[0155] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0156] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A method for regulating chip power consumption, characterized in that, include: Obtain the real-time operating temperature of the target chip and the average operating temperature of the target chip in the current sampling period; When the real-time operating temperature is greater than the preset power reduction start temperature, the power consumption output value of the target chip is reduced. During the power reduction process, in response to the real-time operating temperature being greater than a preset upper temperature threshold, a corrected power increase curve is generated based on the real-time operating temperature, the current power output value, and the power increase start point. The power increase start point represents the starting reference point when the power consumption of the target chip is adjusted to recover when the real-time operating temperature is not greater than the upper temperature threshold. The upper temperature threshold is greater than the power reduction start temperature. When the average operating temperature is less than the upper temperature threshold, the power consumption of the target chip is adjusted to recover based on the corrected power consumption curve.

2. The chip power consumption adjustment method according to claim 1, characterized in that, The step of reducing the power consumption output value of the target chip when the real-time operating temperature is greater than the preset power reduction start temperature includes: When the real-time operating temperature is greater than the preset power reduction start temperature, the target chip is triggered to enter the power reduction state in its current operating state. In the power consumption reduction state, the power consumption output value of the target chip is reduced based on the preset power consumption reduction curve, and it is determined whether the real-time operating temperature meets the requirement of being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time. In response to the real-time operating temperature being less than the upper temperature threshold and greater than the operating temperature at the previous sampling time, the target chip maintains the power reduction state; otherwise, it exits the power reduction state.

3. The chip power consumption adjustment method according to claim 1, characterized in that, In response to the real-time operating temperature exceeding a preset upper temperature threshold, a corrected power consumption curve is generated based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point, including: When the real-time operating temperature exceeds the preset upper temperature threshold, the target chip's current operating state is triggered to enter an abnormal state. In the abnormal state, the corrected power consumption curve is generated based on the real-time operating temperature, the current power consumption output value, and the power consumption rise starting point.

4. The chip power consumption adjustment method according to claim 3, characterized in that, The method further includes: Under the abnormal condition, it is determined whether the average operating temperature is not less than the upper temperature threshold. In response to the average operating temperature being not less than the upper temperature threshold, the target chip is maintained in the abnormal state; otherwise, it exits the abnormal state.

5. The chip power consumption adjustment method according to claim 3, characterized in that, The step of generating the corrected power consumption curve based on the real-time operating temperature, the current power consumption output value, and the preset power consumption rise starting point includes: Based on the real-time operating temperature, the current power consumption output value, and the starting point of the power consumption increase, an initial curve is obtained; The slope coefficient of the initial curve is increased by a preset factor to obtain the corrected rise-loss curve.

6. The chip power consumption adjustment method according to claim 1, characterized in that, When the average operating temperature is less than the upper temperature threshold, the power consumption of the target chip is adjusted based on the corrected power consumption curve to recover, including: When the average operating temperature is less than the upper temperature threshold, the target chip is triggered to enter a power consumption increase state. In the aforementioned power consumption increase state, the power consumption of the target chip is adjusted to recover based on the modified power consumption increase curve.

7. The chip power consumption adjustment method according to claim 1, characterized in that, The step of adjusting the power consumption of the target chip based on the corrected power consumption curve includes: Based on the modified power consumption curve, the target chip is subjected to a one-stage power consumption recovery adjustment. During the first-stage power consumption recovery adjustment process, when the average operating temperature is lower than the power consumption start temperature corresponding to the power consumption start point, the target chip is subjected to a second-stage power consumption recovery adjustment based on the original power consumption curve. The starting point of the rise in energy consumption is the common endpoint of the modified rise in energy consumption curve and the original rise in energy consumption curve.

8. The chip power consumption adjustment method according to claim 1, characterized in that, Also includes: When the target chip is operating at full power consumption and the real-time operating temperature is not greater than the power consumption reduction start temperature, the current operating state of the target chip is determined to be healthy.

9. The chip power consumption adjustment method according to claim 2, characterized in that, Also includes: During the power consumption reduction process, when the real-time operating temperature is less than the upper temperature threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is greater than the power consumption start temperature, the target chip is triggered to enter a hysteresis state in its current operating state. In the hysteresis state, the power consumption output value of the target chip remains unchanged, and it is determined whether the upper temperature threshold is not greater than the operating temperature at the previous sampling time, while the average operating temperature is greater than the power consumption start temperature. In response to the upper temperature threshold not being greater than the operating temperature at the previous sampling time, and the average operating temperature being greater than the power consumption initiation temperature, the target chip is kept in the hysteresis state; otherwise, it exits the hysteresis state.

10. The chip power consumption adjustment method according to claim 9, characterized in that, Also includes: If the real-time operating temperature is greater than the operating temperature at the previous sampling time, then exit the hysteresis state and enter the power consumption reduction state; or, If the real-time operating temperature is not greater than the operating temperature at the previous sampling time, and the average operating temperature is not greater than the initial temperature of power consumption rise, then exit the hysteresis state and enter the power consumption rise state.

11. The chip power consumption adjustment method according to claim 7, characterized in that, Also includes: During the power consumption reduction process, when the real-time operating temperature is less than the upper temperature threshold and not greater than the operating temperature at the previous sampling time, and the average operating temperature is not greater than the power consumption increase start temperature, the target chip is triggered to enter the power consumption increase state in its current operating state. In the power consumption rise state, the target chip is adjusted for power consumption recovery based on the original power consumption rise curve, and it is determined whether the power consumption output value determined based on the original power consumption rise curve satisfies that it is not less than the preset power consumption lower limit and not greater than the preset power consumption upper limit. In response to whether the power output value determined based on the original power consumption curve satisfies a preset power consumption lower limit and a preset power consumption upper limit, the target chip maintains the power consumption increase state; otherwise, it exits the power consumption increase state.

12. The chip power consumption adjustment method according to claim 11, characterized in that, The step of adjusting the power consumption of the target chip based on the original power consumption curve includes: The original power consumption curve is generated based on the preset slope, the power consumption rise start temperature, and the current power consumption output value corresponding to the power consumption rise start temperature. The power consumption of the target chip is adjusted based on the original power consumption curve.

13. The chip power consumption adjustment method according to claim 11, characterized in that, Also includes: If the power consumption output value is less than the lower limit of power consumption and not greater than the upper limit of power consumption, then exit the power consumption increase state and enter an abnormal state; or, If the power consumption output value is greater than the power consumption upper limit value, then exit the power consumption increase state and enter the healthy state.

14. A chip power consumption regulation device, characterized in that, include: The temperature acquisition module is used to acquire the real-time operating temperature of the target chip and the average operating temperature of the current sampling period. The power consumption reduction module is used to reduce the power consumption output value of the target chip when the real-time operating temperature is greater than the preset power consumption reduction start temperature. The curve update module is used to generate a corrected power consumption curve in response to the real-time operating temperature being greater than a preset upper temperature threshold during the power consumption reduction process. This curve is based on the real-time operating temperature, the current power consumption output value, and a preset power consumption increase starting point. The power consumption increase starting point represents the starting reference point when adjusting the power consumption of the target chip to increase when the real-time operating temperature is not greater than the upper temperature threshold. The upper temperature threshold is greater than the power consumption reduction starting temperature. The power consumption recovery module is used to adjust the power consumption of the target chip based on the corrected power consumption recovery curve when the average operating temperature is less than the upper temperature threshold.

15. An electronic device, characterized in that, include: processor; as well as Memory for storing the executable instructions of the processor; The processor is configured to execute the chip power consumption adjustment method according to any one of claims 1-13 by executing the executable instructions.

16. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the chip power consumption adjustment method according to any one of claims 1-13.

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