Integrated inductor preparation process and forming device

Abstract

The invention relates to the technical field of inductor preparation equipment, in particular to an integrated inductor preparation process and forming device which comprises a case, a pressing table is mounted on the case, a mold is mounted on the pressing table, a pressing assembly for pressing forming is mounted on the case, and an auxiliary pressing assembly for assisting operation of the pressing assembly is mounted on the case. The method has the effect of improving the convenience of the integrated inductor preparation process and the forming device in the operation process.

Description

Technical Field

[0001] This application relates to the field of inductor fabrication equipment technology, and in particular to an integrated inductor fabrication process and molding apparatus. Background Technology

[0002] As electronic devices evolve towards miniaturization, higher power, and higher frequency, higher demands are placed on the performance of inductors. Existing inductors generally suffer from the following technical defects: Traditional inductors often employ wire-wound or multilayer structures, resulting in high impedance, significant energy loss, and difficulty in improving circuit efficiency. They also exhibit poor stability under high current conditions. Insufficient magnetic shielding leads to magnetic interference during operation, affecting the normal operation of surrounding electronic components and causing noticeable buzzing, resulting in significant noise pollution. Furthermore, their unreasonable structural design results in large size, making them unsuitable for high-density circuit layouts. Under high-frequency and high-temperature environments, their temperature rise current and saturation current characteristics are prone to degradation, making it difficult to meet the long-term stable operation requirements of high-power circuits. Summary of the Invention

[0003] To improve the ease of operation of the integrated inductor fabrication and molding apparatus, this application provides an integrated inductor fabrication and molding apparatus.

[0004] This application provides an integrated inductor fabrication process and molding apparatus, employing the following technical solution: An integrated inductor manufacturing process and molding apparatus includes a chassis, a pressing table mounted on the chassis, a mold mounted on the pressing table, a pressing assembly for pressing and molding mounted on the chassis, and an auxiliary pressing assembly for assisting the pressing assembly in its operation.

[0005] By adopting the above technical solution, the chassis provides a stable installation foundation, the pressure table provides installation support for the mold, the mold is used to carry the raw materials, the pressing component realizes the core pressing and forming action, and the auxiliary pressing component assists the pressing component in operation, improving the stability and reliability of pressing and forming. The overall structure is reasonably laid out, and the components work together to effectively improve the ease of operation of the device, making it convenient for staff to carry out integrated inductor preparation work.

[0006] In one specific implementation, the pressing assembly includes a hydraulic cylinder mounted on the housing. A pressure plate is mounted on the output shaft of the hydraulic cylinder. An installation groove is provided on the pressure plate. A disassembly plate is detachably mounted on the pressure plate. The disassembly plate is installed in the installation groove. A pressure strip is mounted on the disassembly plate. A positioning assembly for positioning the disassembly plate is mounted on the pressure plate.

[0007] By adopting the above technical solution, the hydraulic cylinder, as the power source, can drive the pressure plate to perform stable lifting and lowering movements, thereby driving the pressure strip on the disassembly plate to press and shape the raw material in the mold; the disassembly plate and the pressure plate are detachably connected, which facilitates the replacement of the disassembly plate with the corresponding size pressure strip according to the preparation requirements of integrated inductors of different specifications, thereby improving the versatility of the device; the positioning component can accurately position the disassembly plate, ensuring the positional accuracy of the pressure strip after the disassembly plate is installed, and ensuring the consistency of the pressing and shaping effect.

[0008] In one specific implementation scheme, a first slider is slidably mounted on the pressure plate, and a push rod is threadedly connected to the pressure plate. The push rod is rotatably connected to the first slider, and a first positioning block for positioning the disassembly plate is mounted on the first slider. A second slider is slidably mounted on the pressure plate, and a second positioning block for positioning the disassembly plate is mounted on the second slider. A third slider is slidably mounted on the pressure plate, and a third positioning block for positioning the disassembly plate is mounted on the third slider. A fourth slider is slidably mounted on the pressure plate, and a fourth positioning block for positioning the disassembly plate is mounted on the fourth slider. The first slider, the second slider, and the fourth slider are respectively disposed on the side of the disassembly plate. A slide rod is slidably mounted on the pressure plate, and a guide rod is mounted on the slide rod. The guide rod is obliquely inserted into adjacent sliders and slidably connected to the sliders.

[0009] By adopting the above technical solution, rotating the push rod can push the first slider to move. The first slider, through the transmission action of the guide rod and the slide rod, can drive the second slider, the third slider and the fourth slider to move synchronously towards the disassembly plate. This allows the first positioning block, the second positioning block, the third positioning block and the fourth positioning block to be positioned and clamped simultaneously from four directions of the disassembly plate, achieving rapid and accurate positioning of the disassembly plate. The operation is convenient and efficient, and the positioning stability is strong, effectively preventing the disassembly plate from shifting during installation and ensuring the accuracy of the pressure strip pressing position.

[0010] In one specific implementation, the pressure plate has a first sliding groove, which is a dovetail groove, through which the first slider is slidably mounted on the pressure plate; the pressure plate has a second sliding groove, which is a dovetail groove, through which the pressure plate is slidably mounted on the second slider; the pressure plate has a third sliding groove, which is a dovetail groove, through which the pressure plate is slidably mounted on the third slider; and the pressure plate has a fourth sliding groove, which is a dovetail groove, through which the pressure plate is slidably mounted on the fourth slider.

[0011] By adopting the above technical solution, the dovetail groove structure can play a good guiding and limiting role for the corresponding slider, preventing the slider from falling off or deviating during the sliding process, ensuring the stability and accuracy of the slider driving the positioning block to perform positioning action, thereby improving the working reliability of the entire positioning component and ensuring the positioning effect of the disassembly and assembly plate.

[0012] An integrated inductor fabrication process includes the following steps: Step 1: Raw material pretreatment. Select elemental metal powders and mix them. Then dry the mixed raw materials to remove impurities and lumps. Step 2: Annealing treatment. The mixed powder is placed in an annealing furnace and annealed in a vacuum environment to reduce the oxide film on the powder surface. Step 3: Insulation coating. Disperse the annealed powder in a special solvent to form a suspension. Add an insulation coating agent to the suspension and stir thoroughly. Finally, dry to remove the solvent and obtain the insulation-coated powder. Step 4: Die casting pre-assembly: Place the powder and the coil to be embedded on the molding mold, and use the molding device to die cast the powder to compact it and tightly wrap the coil to form a magnetic core; Step 5: Pin soldering. The die-cast integrated inductor blank is sent to the soldering station, and the soldering ends of the leads from both ends of the coil are soldered to the copper pads for fixation.

[0013] By adopting the above technical solutions, raw material pretreatment can ensure the purity and dispersibility of the raw materials, laying a good foundation for subsequent processes; annealing can reduce the oxide film on the powder surface and improve the magnetic properties of the powder; insulation coating can reduce eddy current losses between powder particles and improve the energy efficiency of the inductor; die casting pre-assembly achieves a tight bond between the powder and the coil through a molding device, forming a structurally stable magnetic core; pin soldering achieves a reliable connection between the coil and the copper pad, ensuring the electrical performance of the inductor. The entire process is coherent and reasonable, easy to operate, and can efficiently produce high-performance integrated inductors.

[0014] In one specific feasible implementation, after completing step one, the mixed raw materials are ball-milled. First, the mixed raw materials are coarsely ground, and then finely ground. Then, the metal impurities generated during the ball milling process are removed. Through screening, powders that are too coarse and too fine are removed, and only powders with the required particle size are retained.

[0015] By adopting the above technical solutions, ball milling can further refine powder particles, making the raw materials more uniformly mixed, improving the powder's molding performance and magnetic properties; removing metal impurities and screening out powders with the required particle size can avoid the adverse effects of impurities and unqualified particle size on the performance of integrated inductors, ensuring the quality stability of the final product.

[0016] In one specific implementation scheme, step five, the pin soldering process, employs a reflow soldering process.

[0017] By adopting the above technical solutions, the reflow soldering process has the advantages of uniform soldering temperature, high soldering quality, and reliable solder joints. It can achieve a firm connection between the pins and the copper pads, reduce the occurrence of defects such as cold solder joints and false solder joints, and improve the electrical connection stability and service life of integrated inductors.

[0018] In a specific feasible implementation, after the pin soldering step is completed, the product needs to be post-processed. The integrated inductor that has been soldered is visually inspected to remove products with defects such as surface cracks and poor solder joints. At the same time, the qualified products are subject to performance sampling inspection to test impedance and magnetic shielding performance indicators.

[0019] By adopting the above technical solutions, visual inspection can quickly eliminate products with obvious defects, while performance sampling can ensure that the key performance indicators of qualified products meet the requirements. Through dual inspection methods, the quality of products leaving the factory is effectively guaranteed, and the market competitiveness of products is enhanced.

[0020] In summary, this application includes at least one of the following beneficial technical effects: 1. The molding device, through the coordinated operation of the chassis, pressing table, mold, pressing component and auxiliary pressing component, combined with the detachable disassembly plate and precise positioning component, not only improves the ease of operation, but also adapts to the preparation of integrated inductors of different specifications, and has strong versatility.

[0021] 2. The manufacturing process is coherent and reasonable. Each step from raw material pretreatment to posttreatment is designed to improve product performance. Processes such as ball milling, vacuum annealing, and reflow soldering are used to effectively reduce inductive impedance, improve magnetic shielding performance and structural stability. The integrated inductor produced can meet the development needs of miniaturization, high power and high frequency of electronic devices. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a molding apparatus according to an embodiment of this application.

[0023] Figure 2 This is a schematic diagram of the molded top plate according to an embodiment of this application.

[0024] Figure 3 This is a schematic diagram of the disassembly and assembly plate according to an embodiment of this application.

[0025] Figure 4 This is a schematic diagram of the positioning component according to an embodiment of this application.

[0026] Figure 5 This is a schematic diagram of the guide rod according to an embodiment of this application.

[0027] Reference numerals: 1. Chassis; 2. Pressing table; 21. Mold; 3. Auxiliary pressing assembly; 31. Cylinder; 32. Lifting plate; 321. Insertion hole; 33. Forming top plate; 4. Pressing assembly; 41. Hydraulic cylinder; 42. Pressing plate; 421. Mounting groove; 422. First slide groove; 423. Second slide groove; 424. Third slide groove; 425. Fourth slide groove; 426. Fifth slide groove; 43. Disassembly plate; 431. Pressing strip; 44. Positioning assembly; 441. First slider; 442. Push rod; 443. First positioning block; 444. Second slider; 4441. Second positioning block; 445. Third slider; 4451. Third positioning block; 446. Fourth slider; 4461. Fourth positioning block; 447. Slide rod; 448. Guide rod. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0029] This application discloses an integrated inductor fabrication apparatus, referring to... Figure 1 and Figure 2 It includes a chassis 1, a pressing platform 2 fixedly installed on the chassis 1, a mold 21 for holding powder fixedly installed on the pressing platform 2, an auxiliary pressing component 3 for assisting pressing and forming installed on the chassis 1, and a pressing component 4 installed on the chassis 1.

[0030] In this embodiment, mold 21 is a conventional tool used in inductor production and processing to hold powder, which is prior art. As it does not affect the understanding of this solution, the accompanying drawings do not show the specific shape of mold 21.

[0031] Reference Figure 1 , Figure 2 and Figure 3 The pressing component 4 includes a hydraulic cylinder 41, which is fixedly mounted on the housing 1. The output shaft of the hydraulic cylinder 41 is detachably mounted with a pressure plate 42. The pressure plate 42 has an installation groove 421. The pressure plate 42 is detachably mounted with a disassembly plate 43 by bolts. The disassembly plate 43 is installed in the installation groove 421. A pressure strip 431 is fixedly mounted on the disassembly plate 43. A positioning component 44 for positioning the disassembly plate 43 is mounted on the pressure plate 42.

[0032] Reference Figure 3 , Figure 4 and Figure 5The pressure plate 42 is provided with a first sliding groove 422, which is a dovetail groove. The positioning component 44 includes a first slider 441, which is slidably mounted on the pressure plate 42 through the first sliding groove 422. A push rod 442 is threadedly connected to the pressure plate 42. One end of the push rod 442 near the first slider 441 is rotatably connected to the first slider 441. A first positioning block 443 for positioning the disassembly plate 43 is fixedly mounted on the first slider 441.

[0033] The pressure plate 42 has a second sliding groove 423, which is a dovetail groove. The first sliding groove 422 is located on one side of the vertical sidewall of the disassembly plate 43. The second sliding groove 423 is located on the side of the vertical sidewall of the disassembly plate 43 adjacent to the first sliding groove 422. A second slider 444 is slidably mounted on the pressure plate 42 via the second sliding groove 423. A second positioning block 4441 for positioning the disassembly plate 43 is fixedly mounted on the second slider 444. The pressure plate 42 also has a third sliding groove 424, which is a dovetail groove and is opposite to the second sliding groove 423. A third slider 445 is slidably mounted on the pressure plate 42 via the third sliding groove 424. A third positioning block 4451 for positioning the disassembly plate 43 is fixedly mounted on the third slider 445. The pressure plate 42 is provided with a fourth sliding groove 425. The fourth sliding groove 425 is a dovetail groove and is arranged opposite to the first sliding groove 422. The pressure plate 42 is slidably mounted with a fourth slider 446 through the fourth sliding groove 425. A fourth positioning block 4461 for positioning the disassembly plate 43 is fixedly mounted on the fourth slider 446.

[0034] The pressure plate 42 has four fifth sliding grooves 426. The four fifth sliding grooves 426 are all located in each interval area of ​​the first slider 441, the second slider 444, the third slider 445 and the fourth slider 446. The fifth sliding groove 426 is an inverted T-shaped groove. The pressure plate 42 is slidably mounted with four sliding rods 447 through the fifth sliding grooves 426. Each sliding rod 447 is fixedly mounted with a guide rod 448. The guide rod 448 is inserted into the adjacent slider and slidably connected to the slider, such as the first slider 441 and the second slider 444. The guide rod 448 is inserted into the first slider 441 at an acute angle and simultaneously inserted into the second slider 444 at an acute angle.

[0035] When it is necessary to replace the pressure strip 431 with a different size, remove the pressure plate 42 from the hydraulic cylinder 41 and place it with the side having the mounting groove 421 facing upwards. Tighten the nut to replace the entire assembly plate 43 along with the pressure strip 431. After installing the new assembly plate 43, rotate the push rod 442. The push rod 442 will push the first slider 441 to move closer to the assembly plate 43. When the first slider 441 moves, it will push the guide rod 448 to move. The guide rod 448 will drive the second slider 444 and the third slider 445 to move closer to the assembly plate 43. The second slider 444 and the third slider 445 will drive the fourth slider 446 to move closer to the assembly plate 43 via the guide rod 448. The plate 43 moves, and the first positioning block 443, the second positioning block 4441, the third positioning block 4451 and the fourth positioning block 4461 press and position the disassembly plate 43 from four directions at the same time, so that the disassembly plate 43 is located in the center of the mounting groove 421. Then, the disassembly plate 43 is fixed to the pressure plate 42 with bolts. The center positioning of the disassembly plate 43 can prevent the disassembly plate 43 from shifting when it is installed and tightened with screws. This ensures that after the disassembly plate 43 is installed, the pressure strip 431 can be accurately aligned with the insertion hole 321 on the lifting plate 32, preventing the pressure strip 431 from colliding with the lifting plate 32.

[0036] The auxiliary pressure assembly 3 includes a cylinder 31, which is fixedly installed on the housing 1. A lifting plate 32 is fixedly installed on the output shaft of the cylinder 31. The lifting plate 32 is positioned above the mold 21. A forming top plate 33 is fixedly installed on the bottom surface of the lifting plate 32. The forming top plate 33 can press against the mold 21 to form a sealed chamber for powder molding. The lifting plate 32 and the forming top plate 33 are provided with insertion holes 321 for the insertion of the pressure strip 431.

[0037] This application also discloses an integrated inductor fabrication process, including the following steps: Step 1: Raw material pretreatment: Select high-purity elemental metal powder according to the magnetic performance requirements and mix them. Then dry the mixed raw materials to remove the moisture adsorbed on the surface of the raw materials. Then remove impurities and lumps from the raw materials by sieving to ensure that the raw materials are evenly dispersed. Step 2: Ball milling: First, place the pre-treated mixed raw materials in an existing ball mill and coarsely grind them at a low speed to achieve initial crushing and pre-mixing of the raw materials; then increase the speed of the ball mill to carry out fine grinding until the powder particle size reaches the target standard required for production; then remove the metal impurities generated during the ball milling process, and through grading and screening, remove the powder that is too coarse and too fine, and only retain the powder with the required particle size. Step 3: Annealing treatment: Place the qualified powder into an annealing furnace and perform high-temperature annealing in a vacuum atmosphere to reduce the oxide film on the powder surface. Step 4: Insulation Coating: Disperse the annealed powder in a special solvent to form a suspension, add an insulation coating agent to the suspension and stir thoroughly, and finally dry to remove the solvent to obtain the insulation-coated powder; Step 5: Die-casting pre-assembly: Place the coil in the mold 21 filled with the above-mentioned insulating and coated magnetic powder, start the auxiliary pressure component 3 on the machine box 1, and the cylinder 31 drives the lifting plate 32 to move down, which drives the forming top plate 33 to press on the mold 21 to form a sealed cavity for powder forming.

[0038] Start the hydraulic cylinder 41 in the pressing assembly 4. The hydraulic cylinder 41 drives the pressure plate 42 to move down. The pressure strip 431 on the pressure plate 42 passes through the insertion hole 321 on the lifting plate 32 and the forming top plate 33, applying stable pressure to the magnetic powder in the mold 21, so that the powder is compacted and tightly wrapped around the coil to form a magnetic core. The pressure is held for a preset time to ensure that the magnetic core density meets the standard.

[0039] After the pressure holding is completed, the hydraulic cylinder 41 drives the pressure plate 42 to reset, and the cylinder 31 of the auxiliary pressure component 3 drives the lifting plate 32 and the forming top plate 33 to move upward. Step 6: Pin soldering: The die-cast integrated inductor blank is transferred to the soldering station. Using reflow soldering, the soldering ends of the leads at both ends of the coil are soldered to the copper pads to fix them, thus completing the reliable connection between the leads and the pads. Step 7; Post-processing: Perform visual inspection on the welded integrated inductors and reject products with defects such as surface cracks and poor solder joints; at the same time, conduct performance sampling inspection on qualified products to test their key performance indicators such as impedance and magnetic shielding to ensure that the products meet production standards. Step 8: Classify and package the qualified integrated inductor products to complete the entire integrated inductor manufacturing process.

[0040] The implementation principle of this embodiment is as follows: In the molding device, the chassis 1 provides a stable mounting base for each component. The auxiliary pressing component 3 drives the lifting plate 32 and the molding top plate 33 to press down through the cylinder 31, forming a sealed chamber with the mold 21, providing a closed environment for pressing and molding. The hydraulic cylinder 41 of the pressing component 4 serves as a power source, driving the pressure plate 42 to move the pressure strip 431 on the disassembly plate 43 to press the raw material. The detachable design of the disassembly plate 43, combined with the precise positioning of the positioning component 44, enables the rapid replacement and precise installation of pressure strips 431 of different specifications, improving the ease of operation and molding accuracy. The manufacturing process involves continuous steps such as raw material pretreatment, ball milling, annealing, insulation coating, die casting pre-assembly, lead welding, and post-processing. The entire process from raw material to finished product is optimized, effectively reducing inductive impedance, improving magnetic shielding performance and structural stability, and ultimately producing integrated inductor products that meet the high requirements of electronic devices.

[0041] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An integrated inductor fabrication and molding apparatus, characterized in that: Includes a chassis (1), on which a pressing platform (2) is installed, on which a mold (21) is installed, on which a pressing assembly (4) for pressing and forming is installed, and on which an auxiliary pressing assembly (3) to assist the pressing assembly (4) in its operation is installed.

2. The integrated inductor fabrication and molding apparatus according to claim 1, characterized in that: The pressing assembly (4) includes a hydraulic cylinder (41), which is mounted on the housing (1). The output shaft of the hydraulic cylinder (41) is fitted with a pressure plate (42). The pressure plate (42) has an installation groove (421). A disassembly plate (43) is detachably mounted on the pressure plate (42). The disassembly plate (43) is installed in the installation groove (421). A pressure strip (431) is mounted on the disassembly plate (43). A positioning assembly (44) for positioning the disassembly plate (43) is mounted on the pressure plate (42).

3. The integrated inductor fabrication and molding apparatus according to claim 2, characterized in that: A first slider (441) is slidably mounted on the pressure plate (42), and a push rod (442) is threadedly connected to the pressure plate (42). The push rod (442) is rotatably connected to the first slider (441), and a first positioning block (443) for positioning the disassembly plate (43) is mounted on the first slider (441). A second slider (444) is slidably mounted on the pressure plate (42), and a second positioning block (4441) for positioning the disassembly plate (43) is mounted on the second slider (444). A third slider (445) is slidably mounted on the pressure plate (42), and a second positioning block (4441) for positioning the disassembly plate (43) is mounted on the third slider (445). The third positioning block (4451) is positioned on the disassembly plate (43); a fourth slider (446) is slidably mounted on the pressure plate (42), and a fourth positioning block (4461) for positioning the disassembly plate (43) is mounted on the fourth slider (446); the first slider (441), the second slider (444) and the fourth slider (446) are respectively arranged on the side of the disassembly plate (43); a slide rod (447) is slidably mounted on the pressure plate (42), and a guide rod (448) is mounted on the slide rod (447); the guide rod (448) is inclinedly inserted into the adjacent slider and slidably connected to the slider.

4. The integrated inductor fabrication and molding apparatus according to claim 3, characterized in that: The pressure plate (42) is provided with a first sliding groove (422), which is a dovetail groove, and the first slider (441) is slidably mounted on the pressure plate (42) through the first sliding groove (422); the pressure plate (42) is provided with a second sliding groove (423), which is a dovetail groove, and the pressure plate (42) is slidably mounted on the second slider (444) through the second sliding groove (423); the pressure plate (42) is provided with a third sliding groove (424), which is a dovetail groove, and the pressure plate (42) is slidably mounted on the third slider (445) through the third sliding groove (424); the pressure plate (42) is provided with a fourth sliding groove (425), which is a dovetail groove, and the pressure plate (42) is slidably mounted on the fourth slider (446) through the fourth sliding groove (425).

5. An integrated inductor fabrication process, performed using an integrated inductor fabrication and molding apparatus according to any one of claims 1-4, characterized in that: Includes the following steps: Step 1: Raw material pretreatment. Select elemental metal powders and mix them. Then dry the mixed raw materials to remove impurities and lumps. Step 2: Annealing treatment. The mixed powder is placed in an annealing furnace and annealed in a vacuum environment to reduce the oxide film on the powder surface. Step 3: Insulation coating. Disperse the annealed powder in a solvent to form a suspension. Add an insulating coating agent to the suspension and stir thoroughly. Finally, dry to remove the solvent and obtain the insulating coated powder. Step 4: Die casting pre-assembly: Place the powder and the coil to be embedded on the molding mold, and use the molding device to die cast the powder to compact it and tightly wrap the coil to form a magnetic core; Step 5: Pin soldering. The die-cast integrated inductor blank is sent to the soldering station, and the soldering ends of the leads from both ends of the coil are soldered to the copper pads for fixation.

6. The integrated inductor fabrication process according to claim 5, characterized in that: After completing step one, the mixed raw materials are ball-milled. First, the mixed raw materials are coarsely ground, and then finely ground. Then, the metal impurities generated during the ball milling process are removed. Through screening, powders that are too coarse or too fine are removed, and only powders with the required particle size are retained.

7. The integrated inductor fabrication process according to claim 5, characterized in that: Step 5 involves pin soldering using a reflow soldering process.

8. The integrated inductor fabrication process according to claim 5, characterized in that: After the pin soldering step is completed, the product needs to be post-processed. The integrated inductor with soldered pins is visually inspected, and products with defects such as surface cracks and poor solder joints are rejected. At the same time, the qualified products are sampled for performance testing, and the impedance and magnetic shielding performance indicators are tested.

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