Circuit board

Abstract

The invention discloses a circuit board, and relates to the technical field of circuit boards. The circuit board comprises a circuit board body, the circuit board body is provided with a through hole structure used for being matched with differential signals, the through hole structure comprises signal through holes and ground through holes, the number of the signal through holes is two, the signal through holes are arranged in a straight line, the ground through holes are of a continuous rectangular structure and surround the peripheries of the signal through holes, and the signal through holes are communicated with the ground through holes. The rectangular structure comprises two long sides and two short sides, the two long sides take a connecting line between the two signal through holes as a symmetry axis, the two short sides take a perpendicular bisector of the connecting line as a symmetry axis, and the center points of the two signal through holes are located on an extension line of the connecting line. According to the embodiment of the invention, the area occupied by the signal through hole and the ground through hole can be reduced, the utilization rate of the signal through hole is improved, the wiring difficulty is reduced, and the miniaturization design of the circuit board is facilitated.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more particularly to a circuit board. Background Technology

[0002] With the rapid development of electronic communication technology, cloud computing, artificial intelligence and other technologies, the speed of signal transmission and exchange is getting faster and faster, and circuit boards that can meet the requirements of high-speed signal transmission have emerged.

[0003] In related technologies, to configure high-speed differential signals, for a set of differential signals, in addition to two signal vias, two ground vias matching the signal vias are also required on the circuit board to provide a low-impedance return path and suppress electromagnetic interference. Although this arrangement can meet the usage requirements, half of the via area is used to arrange ground vias, which reduces the utilization rate of signal vias, increases the wiring difficulty, and is also not conducive to the miniaturization design of the circuit board. Summary of the Invention

[0004] This application provides a circuit board to at least address the problems of low utilization of signal vias, difficult wiring, and unfavorable miniaturization design of circuit boards in related technologies.

[0005] This application provides a circuit board, including:

[0006] The circuit board body has a via structure for adapting differential signals. The via structure includes signal vias and ground vias. There are two signal vias arranged in a straight line. The ground vias are a continuous rectangular structure surrounding the outer periphery of the signal vias. The rectangular structure includes two long sides and two short sides. The two long sides are symmetrical about the line connecting the two signal vias, and the two short sides are symmetrical about the perpendicular bisector of the line connecting them. The center point of the two signal vias is located on the extension line of the line connecting them.

[0007] Through this application, since the rectangular ground vias surround the signal vias, the ground vias can utilize the space surrounding the signal vias for layout, rather than occupying the space of the two signal vias. This reduces the area occupied by the ground vias. This arrangement distributes the two ground vias, which originally required strict matching of the signal vias, across the entire rectangular structure by surrounding them. While ensuring sufficient return current ground area, it saves the area occupied by the ground vias, effectively improving the utilization rate of the signal vias on the circuit board. This frees up more wiring area, supports high-density wiring requirements, and facilitates miniaturization of the circuit board. Furthermore, the rectangular ground vias can form a multi-angle symmetrical structure relative to the two signal vias. The continuity of the rectangular structure improves impedance matching of the return path, reducing signal crosstalk. Compared to the one-to-one correspondence between signal and ground vias, the ground vias in this embodiment are an integral structure surrounding the signal vias, weakening the correspondence between them and reducing wiring difficulty. Attached Figure Description

[0008] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a schematic diagram of the through-hole arrangement on a circuit board provided in an embodiment of this application;

[0010] Figure 2 This is a schematic diagram of another through-hole arrangement on a circuit board provided in an embodiment of this application;

[0011] Figure 3 A schematic diagram of another type of through-hole arrangement on a circuit board provided in an embodiment of this application;

[0012] Figure 4 A schematic diagram of another through-hole arrangement on a circuit board provided in an embodiment of this application;

[0013] Figure 5 This illustration shows a forming diagram of a rectangular structure with signal vias arranged in a horizontal direction, according to an embodiment of this application.

[0014] Figure 6 This illustration shows a forming diagram of a rectangular structure with signal vias arranged vertically according to an embodiment of this application;

[0015] Figure 7This illustration shows a forming diagram of a rectangular structure with signal vias arranged in an inclined direction, according to an embodiment of this application.

[0016] Figure 8 A diagram showing the forming of another rectangular structure with signal vias arranged in an inclined direction, according to an embodiment of this application, is provided.

[0017] The above figures include the following reference numerals:

[0018] 100 - Circuit board body;

[0019] 200 - Through-hole structure; 210 - Signal through-hole; 220 - Ground through-hole; 221 - Long side; 222 - Short side; 221a - First long side; 221b - Second long side; 222a - First short side; 222b - Second short side;

[0020] 300-microgroove structure;

[0021] 10 - Connecting line; 20 - Extension line; 30 - Perpendicular line;

[0022] a - First drilling point; b - Second drilling point; c - Third drilling point; d - Fourth drilling point. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0024] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] With the rapid development of electronic communication technology, cloud computing, artificial intelligence and other technologies, the speed of signal transmission and exchange is getting faster and faster, and circuit boards that can meet the requirements of high-speed signal transmission have emerged.

[0026] The aforementioned circuit boards are suitable for electronic communication equipment requiring high density, miniaturization, and high performance. For example, in scenarios such as 5G communication base stations, high-performance computing servers, data center switches, and high-speed data acquisition systems, the circuit boards need to support stable transmission of high-speed signals (such as USB 3.0, PCIe 4.0, Ethernet 25G / 100G, etc.). In these scenarios, the impedance continuity, signal integrity, and return path design of high-speed differential signals directly affect the performance and reliability of the equipment.

[0027] In related technologies, to achieve the configuration of high-speed differential signals, for a set of differential signals, in addition to setting two signal vias on the circuit board (the function of signal vias is to switch differential signals to different layers, such as from the surface layer to the inner layer, in order to maintain the symmetry and impedance matching of differential signals), two ground vias that match the signal vias are also required. The two signal vias and the two ground vias usually present a layout of signal via-ground via-signal via-ground via to provide a low-impedance return path and suppress electromagnetic interference.

[0028] While the above arrangement can meet the usage requirements, half of the area of ​​the via arrangement is used to arrange ground vias, which reduces the utilization rate of signal vias. Furthermore, since there is a strict correspondence between signal vias and ground vias, it will increase the difficulty of wiring. The reduced utilization rate of signal vias and the increased difficulty of wiring are not conducive to the miniaturization design of circuit boards.

[0029] Understandably, as signal transmission rates continue to increase, the limitations of the aforementioned via arrangement in terms of space utilization and electrical performance will become increasingly apparent, necessitating optimization of the via arrangement to meet ever-increasing usage demands.

[0030] In view of the above-mentioned situation and problems, this application provides a circuit board that adopts a new via arrangement to configure differential signals. This reduces the area occupied by signal vias and ground vias and improves the utilization rate of signal vias, reduces wiring difficulty, and also facilitates the miniaturization design of the circuit board.

[0031] To achieve the above objectives, the circuit board in this embodiment optimizes the arrangement and structure of the ground vias. Specifically, the ground vias surround the two signal vias and are constructed into a rectangular structure. This arrangement distributes the two ground vias, which originally required strict matching of the signal vias, across the entire rectangular structure by surrounding them. This saves the area occupied by the ground vias while ensuring sufficient return ground area, thereby effectively improving the utilization rate of the signal vias on the circuit board and facilitating the miniaturization of the circuit board design. Furthermore, compared to the one-to-one correspondence between signal vias and ground vias, the overall structure of the ground vias surrounding the signal vias in this embodiment weakens the correspondence between them, thus reducing wiring difficulty.

[0032] In this application embodiment, the arrangement relationship between signal vias and ground vias will be described in detail using three typical signal via arrangement methods as examples. These three typical signal via arrangement methods include two signal vias arranged horizontally, two signal vias arranged vertically, and two signal vias arranged at an angle.

[0033] To achieve an overall layout structure of vias on a circuit board, this application embodiment also provides a via arrangement method, which can achieve the purpose of surrounding two signal vias with ground vias.

[0034] The core of this via arrangement method lies in planning the optimal position of the ground via based on the diameter and distance of the two signal vias and the existing manufacturing process, thereby achieving miniaturized circuit board design.

[0035] Figure 1 This is a schematic diagram of the through-hole arrangement on a circuit board provided in an embodiment of this application; Figure 2 This is a schematic diagram of another through-hole arrangement on a circuit board provided in an embodiment of this application; Figure 3 A schematic diagram of another type of through-hole arrangement on a circuit board provided in an embodiment of this application; Figure 4 This is a schematic diagram of another through-hole arrangement on a circuit board provided in an embodiment of this application.

[0036] In the embodiments of this application, please refer to Figures 1 to 4 The circuit board includes a circuit board body 100, which may be a plate-like structure formed using polyimide, Teflon, or the like as a substrate. The design and manufacture of the circuit board body 100 may refer to relevant technologies.

[0037] To enable differential signal transmission, a via structure 200 needs to be configured on the circuit board. This via structure 200 is used to adapt to the transmission of differential signals.

[0038] You can refer to this. Figures 1 to 4 The via structure 200 includes two signal vias 210. The function of the signal vias 210 is to switch the differential signal between layers, such as from the surface layer to the inner layer, in order to maintain the symmetry and impedance matching of the differential signal.

[0039] The signal via 210 in this embodiment can use the existing signal via 210 design. The two signal vias 210 can be arranged in a straight line, for example, in Figure 1 In the example shown, the two signal vias 210 are arranged horizontally. Figure 2 In the example shown, the two signal vias 210 are arranged vertically. Figure 3 and Figure 4 In the example shown, the two signal vias 210 are arranged in an inclined direction.

[0040] It should be noted that the two signal vias 210 are configured for a set of differential signals. Figures 1 to 4 In the example shown, the circuit board can accommodate four sets of differential signals; therefore, eight signal vias 210 are provided on the circuit board. This application embodiment is mainly described using one set of differential signals as an example.

[0041] In this embodiment, the ground via 220 is a continuous rectangular structure surrounding the signal via 210. The rectangular structure includes two long sides 221 and two short sides 222. The two long sides 221 are symmetrical about the line 10 connecting the two signal vias 210, and the two short sides 222 are symmetrical about the perpendicular bisector 30 of the line 10. The center point of the two signal vias 210 is located on the extension line 20 of the line 10 (the line 10 and the perpendicular bisector 30 can be referenced). Figure 5 ).

[0042] In this embodiment, the rectangular ground via 220 surrounds the signal via 210. The ground via 220 can utilize the space around the signal via 210 for layout, instead of occupying the space of the two signal vias 210. This reduces the area occupied by the ground via 220. This arrangement distributes the two ground vias 220, which originally needed to be strictly matched with the signal via 210, to the entire rectangular structure by surrounding the signal via 210. This can save the area occupied by the ground via 220 while ensuring sufficient return ground area, thereby effectively improving the utilization rate of the signal via 210 on the circuit board area, freeing up more wiring area, supporting high-density wiring requirements, and thus facilitating the miniaturization design of the circuit board. On the other hand, the rectangular ground via 220 can form a multi-angle symmetrical structure relative to the two signal vias 210. The continuity of the rectangular structure can improve the impedance matching of the return path and reduce signal crosstalk. Compared with the one-to-one correspondence between the signal via 210 and the ground via 220, the ground via 220 in this embodiment is an integral structure surrounding the signal via 210, which can weaken the correspondence between the signal via 210 and the ground via 220, thereby reducing the difficulty of wiring.

[0043] In some embodiments, the long side 221 and the short side 222 have the same width, thereby forming a uniform return path around the signal via 210, which helps to reduce signal crosstalk.

[0044] It's important to understand that for the longer side 221, you can refer to the relevant reference. Figure 5 Its width refers to the dimension along the Y direction, while for the short side 222, its width refers to the dimension along the X direction.

[0045] Specifically, given the existing manufacturing process of circuit boards, it is impossible to reduce the diameter of various through holes on the circuit board indefinitely. Under the condition of satisfying the existing process, the through holes on the circuit board body 100 have a minimum diameter, and the aforementioned width is greater than or equal to the minimum diameter.

[0046] In some embodiments, there is a minimum spacing between two adjacent through holes on the circuit board body 100 that meets the process requirements, and the distance between the long side 221 and the signal through hole 210 and the distance between the short side 222 and the signal through hole 210 are greater than or equal to the minimum spacing.

[0047] The aforementioned spacing refers to the boundary distance between two vias, i.e., the shortest distance between two vias. The minimum spacing is the tightest design achievable with modern technology. Setting the distance between the long side 221 and the signal via 210, and the distance between the short side 222 and the signal via 210, to be greater than or equal to the minimum spacing can optimize the boundary of the rectangular structure, forming a via layout with the smallest possible range.

[0048] In some specific embodiments, reference can be made to Figure 5 The minimum diameter is d, the minimum spacing is m, the diameter of the signal via is D, the distance between two signal vias is L, and the short side 222 includes a first short side 222a and a second short side 222b that are parallel to each other. The first short side 222a has a first drilling point a located on the extension line 20, and the second short side 222b has a second drilling point b located on the extension line 20. The distances of the first drilling point a and the second drilling point b from the perpendicular bisector 30 are... .

[0049] After forming the first drilling point a and the second drilling point b, the first short side 222a and the second short side 222b can be formed by drilling holes on the circuit board. Specifically, the first drilling point a and the second drilling point b can be used as references to form the first drilling hole and the second drilling hole respectively, and then the first short side 222a can be formed with the first drilling hole as the reference and the second short side 222b can be formed with the second drilling hole as the reference.

[0050] Since the first drilling point a and the second drilling point b are based on the minimum diameter d and the minimum spacing m, the first short side 222a and the second short side 222b form the two short sides 222 in the minimum rectangular structure.

[0051] The width of the first short side 222a and the second short side 222b is d, and the length of the first short side 222a and the second short side 222b is D+2m+2d.

[0052] In some specific embodiments, reference can be made to Figure 5 The long side 221 includes a first long side 221a and a second long side 221b that are parallel to each other. The first long side 221a has a third drilling point c located on the perpendicular bisector 30, and the second long side 221b has a fourth drilling point e located on the perpendicular bisector 30. The distances of the third drilling point c and the fourth drilling point e from the line 10 are... .

[0053] After the third drilling point c and the fourth drilling point e are formed, the first long side 221a and the second long side 221b can be formed by drilling holes on the circuit board. Specifically, the third drilling point c and the fourth drilling point e can be used as references to form the third drilling point and the fourth drilling point respectively, and then the first long side 221a can be formed with the third drilling point as the reference and the second long side 221b can be formed with the fourth drilling point as the reference.

[0054] Since the third drilling point d and the fourth drilling point e are based on the minimum diameter d and the minimum spacing m, the first long side 221a and the second long side 221b form the two long sides 221 of the minimum rectangular structure.

[0055] The width of the first long side 221a and the second long side 221b is d, and the length of the first long side 221a and the second long side 221b is 2D+L+2m+2d.

[0056] It is understandable that by using the first short side 222a, the second short side 222b, the first long side 221a, and the second long side 221b, the smallest rectangular structure can be formed, so that the ground via 220 surrounds the outer periphery of the signal via 210 with the smallest area, thereby effectively improving the utilization rate of the signal via 210 on the circuit board area, freeing up more wiring area, supporting high-density wiring requirements, and thus facilitating the miniaturization design of the circuit board.

[0057] In some embodiments, the rectangular structure is filled with a composite filler structure, which includes an inner copper layer and an outer conductive adhesive layer, with the copper layer connected to the inner wall of the rectangular structure.

[0058] By introducing a composite fill structure within the rectangular structure, the impedance characteristics of the return path can be optimized by leveraging the conductivity of different materials. Specifically, a copper layer provides a low-resistance main return path, while a conductive adhesive layer fills the edges of the vias, compensating for impedance discontinuities in the main return path through its high conductivity and low dielectric constant. This design reduces the total resistance and inductance of the vias, thereby minimizing reflections and losses of high-speed signals. Furthermore, the flexibility of the conductive adhesive absorbs internal stresses within the circuit board body 100, enhancing the long-term stability of the vias.

[0059] Therefore, the aforementioned composite fill structure not only improves return flow efficiency but also optimizes impedance mismatch, further enhancing signal integrity and extending the lifespan of the circuit board.

[0060] In some embodiments, the edges of the rectangular structure are provided with microgroove structures 300 that communicate with the rectangular structure, and the microgroove structures 300 are filled with conductive material.

[0061] The microgroove structure 300 expands the return current area and reduces the current density of the rectangular structure, thereby reducing the risk of overheating. Simultaneously, the filling with conductive material compensates for impedance discontinuities in the main return path, improving signal integrity.

[0062] In some embodiments, the microgroove structure 300 is a plurality of microgroove structures 300 that are evenly spaced along the circumference of the rectangular structure.

[0063] The uniform spacing of multiple microgroove structures 300 can further reduce the current density of the rectangular ground via 220, thereby reducing the risk of overheating and further improving signal integrity.

[0064] Figure 5 This illustration shows a pattern of a rectangular structure with signal vias 210 arranged in a horizontal direction, according to an embodiment of this application. Figure 6 This illustration shows a pattern of a rectangular structure with signal vias 210 arranged vertically according to an embodiment of this application. Figure 7 This paper shows a forming diagram of a rectangular structure with signal vias 210 arranged in an inclined direction according to an embodiment of this application; Figure 8 A diagram showing the molding of another rectangular structure with signal vias 210 arranged in an inclined direction, according to an embodiment of this application, is provided.

[0065] In the embodiments of this application, please refer to Figure 5 The methods for arranging through-holes on a circuit board include:

[0066] S100. Two signal vias 210 arranged in a straight line are set according to the diameter of the signal via 210 and the straight-line distance between the two signal vias 210.

[0067] The diameter of the signal via 210 and the straight-line distance between signal vias 210 can be set according to requirements. The straight-line distance refers to the shortest distance between two signal vias 210.

[0068] As mentioned above, the two signal vias 210 can be arranged horizontally, vertically, or obliquely.

[0069] The two signal vias 210 can be achieved using conventional drilling processes. This application does not provide a detailed description of the specific drilling process for forming the signal vias 210.

[0070] S200. A two-dimensional coordinate system is established with the line 10 connecting the two signal vias 210 as the X-axis, the perpendicular bisector of the line 10 as the Y-axis, and the center point of the line 10 as the origin.

[0071] The coordinate system is established to set a reference datum for the subsequent forming of the rectangular structure. Specifically, the X-axis of the coordinate system can be located on the line 10 connecting the two signal vias 210, and the Y-axis of the coordinate system can be located on the perpendicular bisector of the line 10.

[0072] exist Figure 5 In the example shown, the solid line on the X-axis is line 10, and the dashed line is line 20, the extension of line 10.

[0073] S300, with the X-axis as the axis of symmetry, set two long sides 221 and set the length and width of the long sides 221. With the Y-axis as the axis of symmetry, set two short sides 222 and set the length and width of the short sides 222. The two long sides 221 surround the outer periphery of the two signal vias 210.

[0074] Since the two long sides 221 are symmetrical about the X-axis, they can extend in a direction parallel to the X-axis. Since the two short sides 222 are symmetrical about the Y-axis, they can extend in a direction parallel to the Y-axis.

[0075] In the above via arrangement method, a coordinate system is established with two signal vias 210 as the reference, and a rectangular structure is formed with the coordinate system as the reference. This can ultimately form a via layout scheme on the circuit board, which can adapt to the transmission of differential signals. This via arrangement method enables the via layout scheme to be constructed quickly by setting references for each layer, and has the advantage of accurate construction.

[0076] In some embodiments, the long side 221 and the short side 222 have the same width, and the through holes on the circuit board body 100 have a minimum diameter that meets the process requirements, and the width is greater than or equal to the minimum diameter.

[0077] In some embodiments, there is a minimum spacing between two adjacent through holes on the circuit board body 100 that meets the process requirements, and the distance between the long side 221 and the signal through hole 210 and the distance between the short side 222 and the signal through hole 210 are greater than or equal to the minimum spacing.

[0078] In some embodiments, for ease of understanding and simplification, the following example is used: the minimum diameter is d, the minimum spacing is m, the diameter of the signal via 210 is D, and the distance between two signal vias 210 is L.

[0079] To form a rectangular structure, this can be divided into two processes: setting two shorter sides 222 with the Y-axis as the axis of symmetry and setting two longer sides 221 with the X-axis as the axis of symmetry. The specific processes are as follows:

[0080] Please refer to Figure 5 At coordinates ( At coordinates (0), a first drilling point a is set, and a first short side 222a is set based on the first drilling point a. The width of the first short side 222a is d, and the length of the first short side 222a is D+2m+2d. At point 0, a second drilling point b is set, and a second short side 222b is set based on the second drilling point b. The width of the second short side 222b is d, and the length of the second short side 222b is D+2m+2d.

[0081] Continue to refer to Figure 5 At coordinates (0, A third drilling point c is set at (0, -( ) , and a first long side 221a is set based on the third drilling point c. The width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at coordinates (0, -( Set the fourth drilling point e at point e, and set the second long side 221b based on the fourth drilling point e. The width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d.

[0082] The above process involves forming the short side 222 first and then the long side 221. Since the long side 221 is longer than the short side 222, this method of forming the short side 222 first and then the long side 221 can ensure the orderly progress of the entire process and ensure the stability of the rectangular structure during its formation.

[0083] The above embodiments provide a detailed description of the via layout of a circuit board including signal vias 210 arranged in a horizontal direction. The following, in conjunction with... Figure 6 A detailed description is provided of the via layout of a circuit board containing signal vias 210 arranged in a vertical direction, with a focus on the portion forming a rectangular structure.

[0084] Please refer to Figure 6 To facilitate understanding and simplify the explanation, we will take the minimum diameter as d, the minimum spacing as m, the diameter of the signal via 210 as D, and the distance between the two signal vias 210 as L as an example.

[0085] To form a rectangular structure, this can be divided into two processes: setting two shorter sides 222 with the Y-axis as the axis of symmetry and setting two longer sides 221 with the X-axis as the axis of symmetry. The specific processes are as follows:

[0086] Please refer to Figure 6 At coordinates ( At coordinates (0), a first drilling point a is set, and a first short side 222a is set based on the first drilling point a. The width of the first short side 222a is d, and the length of the first short side 222a is D+2m+2d. At point 0, a second drilling point b is set, and a second short side 222b is set based on the second drilling point b. The width of the second short side 222b is d, and the length of the second short side 222b is D+2m+2d.

[0087] Continue to refer to Figure 6 At coordinates (0, A third drilling point c is set at (0, -( ) , and a first long side 221a is set based on the third drilling point c. The width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at coordinates (0, -( Set the fourth drilling point e at point e, and set the second long side 221b based on the fourth drilling point e. The width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d.

[0088] The following is combined with Figure 7 and Figure 8 A detailed description is provided of the via layout of a circuit board containing signal vias 210 arranged in a vertical direction, with a focus on the portion forming a rectangular structure.

[0089] Please refer to Figure 7 and Figure 8 To facilitate understanding and simplify the explanation, we will use the minimum diameter as d, the minimum spacing as m, the diameter of the signal via 210 as D, and the distance between two signal vias 210 as L as an example.

[0090] To form a rectangular structure, this can be divided into two processes: setting two shorter sides 222 with the Y-axis as the axis of symmetry and setting two longer sides 221 with the X-axis as the axis of symmetry. The specific processes are as follows:

[0091] Please refer to Figure 7 and Figure 8 At coordinates ( At coordinates (0), a first drilling point a is set, and a first short side 222a is set based on the first drilling point a. The width of the first short side 222a is d, and the length of the first short side 222a is D+2m+2d. At point 0, a second drilling point b is set, and a second short side 222b is set based on the second drilling point b. The width of the second short side 222b is d, and the length of the second short side 222b is D+2m+2d.

[0092] Continue to refer to Figure 7 and Figure 8 At coordinates (0, A third drilling point c is set at (0, -( ) , and a first long side 221a is set based on the third drilling point c. The width of the first long side 221a is d, and the length of the first long side 221a is 2D+L+2m+2d; at coordinates (0, -( Set the fourth drilling point e at point e, and set the second long side 221b based on the fourth drilling point e. The width of the second long side 221b is d, and the length of the second long side 221b is 2D+L+2m+2d.

[0093] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0094] The foregoing has provided a detailed description of a circuit board and its through-hole arrangement method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A circuit board, characterized in that, include: The circuit board body has a via structure for adapting differential signals. The via structure includes signal vias and ground vias. There are two signal vias arranged in a straight line. The ground vias are a continuous rectangular structure surrounding the outer periphery of the signal vias. The rectangular structure includes two long sides and two short sides. The two long sides are symmetrical about the line connecting the two signal vias, and the two short sides are symmetrical about the perpendicular bisector of the line connecting them. The center point of the two signal vias is located on the extension line of the line connecting them.

2. The circuit board according to claim 1, characterized in that, The long side and the short side have the same width, and the through hole on the circuit board body has a minimum diameter that meets the process requirements, and the width is greater than or equal to the minimum diameter.

3. The circuit board according to claim 2, characterized in that, The circuit board body has a minimum spacing between two adjacent through holes that meet the process requirements, and the distance between the long side and the signal through hole and the distance between the short side and the signal through hole are greater than or equal to the minimum spacing.

4. The circuit board according to claim 3, characterized in that, The minimum diameter is d, the minimum spacing is m, the diameter of the signal via is D, the distance between two signal vias is L, the short side includes a first short side and a second short side that are parallel to each other, the first short side has a first drilling point located on the extension line, the second short side has a second drilling point located on the extension line, and the distances of the first drilling point and the second drilling point from the perpendicular bisector are [missing information]. .

5. The circuit board according to claim 4, characterized in that, The width of the first short side and the second short side is d, and the length of the first short side and the second short side is D+2m+2d.

6. The circuit board according to claim 4, characterized in that, The long side includes a first long side and a second long side that are parallel to each other. The first long side has a third drilling point located on the perpendicular bisector of the midline, and the second long side has a fourth drilling point located on the perpendicular bisector of the midline. The distances of the third drilling point and the fourth drilling point from the connecting line are: .

7. The circuit board according to claim 6, characterized in that, The width of the first long side and the second long side is d, and the length of the first long side and the second long side is 2D+L+2m+2d.

8. The circuit board according to any one of claims 1 to 7, characterized in that, The rectangular structure is filled with a composite filling structure, which includes an inner copper layer and an outer conductive adhesive layer, with the copper layer connected to the inner wall of the rectangular structure.

9. The circuit board according to any one of claims 1 to 7, characterized in that, The rectangular structure has microgrooves on its edges that communicate with the rectangular structure, and the microgrooves are filled with conductive material.

10. The circuit board according to claim 9, characterized in that, The microgroove structure consists of multiple microgroove structures that are evenly spaced along the circumference of the rectangular structure.

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