A soldering jig for manufacturing a circuit board

Abstract

The application discloses a soldering jig for manufacturing a circuit board and relates to the technical field of circuit board soldering.The soldering jig comprises a tin brushing auxiliary part, an assembling partition is installed on the tin brushing auxiliary part, and the assembling partition is used for positioning a patch device; a pressing stabilizing part is installed on the assembling partition; a spacing gasket part is slidingly inserted into the assembling partition; and the spacing gasket part is used for keeping the gap between the patch device and the circuit board.The assembling partition and the pressing stabilizing part can be used for limiting each patch device and keeping the stability during soldering, and the structure can be used for facilitating subsequent heating and soldering work and stable transfer by limiting the patch device and keeping the stability, so as to solve the problems of poor stability of the soldering jig for manufacturing a circuit board during the transfer of the circuit board, easy shaking and displacement of the patch device and inconvenient keeping of the soldering gap of the patch device.

Description

Technical Field

[0001] This invention relates to the field of circuit board welding technology, specifically to a welding fixture for circuit board manufacturing. Background Technology

[0002] In actual circuit board manufacturing, surface mount devices (SMDs) are installed by soldering, such as LEDs. Circuit board soldering typically involves applying tin followed by reflow soldering to melt the tin plating and promote the connection between the SMDs and the circuit board. Current circuit board manufacturing soldering fixtures usually use grooved bases to limit the circuit board's position. However, during the transfer to the reflow soldering machine after tinning and placement of the SMDs, stability is poor, easily causing the SMDs to wobble and shift. Furthermore, traditional soldering fixtures are not conducive to maintaining the soldering gap between SMDs, resulting in poor soldering precision control. Additionally, after traditional circuit board heating and soldering, because the solder is not fully cured, manual handling can easily cause SMDs to loosen and wobble, making it difficult to control cooling before releasing the limiting circuit board and SMDs.

[0003] Therefore, the present invention proposes a welding fixture for circuit board manufacturing. Summary of the Invention

[0004] The purpose of this invention is to provide a soldering fixture for circuit board manufacturing, so as to solve the problems mentioned in the background art, such as poor stability when transferring circuit boards, easy wobbling and displacement of surface mount devices, and difficulty in maintaining the soldering gap of surface mount devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a soldering fixture for circuit board manufacturing, comprising a soldering auxiliary component, wherein an assembly separator is mounted on the soldering auxiliary component for positioning surface mount devices; a pressure stabilizing component is mounted on the assembly separator; a spacer is slidably inserted into the assembly separator; the spacer is used to maintain the gap between the surface mount devices and the circuit board; a heating control component is mounted on the soldering auxiliary component, and an elastic positioning component is sleeved inside the heating control component; the soldering auxiliary component includes: a mounting base and a soldering plate, wherein the mounting base has a groove; the soldering plate is placed in the groove on the mounting base; and the soldering plate has mesh holes for soldering.

[0006] Preferably, the soldering auxiliary component further includes: an embedding plate and a support partition, the embedding plate being inserted into the mounting base; a row of support partitions being fixedly installed on the embedding plate; the row of support partitions being used to support the circuit board; and threaded holes being provided on the side of the mounting base.

[0007] Preferably, the assembly separator includes: an assembly separator frame, isolation strips, and mounting strips. The assembly separator frame is rotatably mounted on a mounting base. A row of isolation strips is fixedly installed on the assembly separator frame, and each row of isolation strips has a row of through slots. The through slots on the isolation strips are used to insert surface mount devices. Two rows of mounting strips are fixedly installed at the bottom of each row of isolation strips. The mounting strips are used to adhere to the circuit board.

[0008] Preferably, the pressure stabilizing component includes: a pressure cover, a positioning groove, and a positioning bolt. The pressure cover is rotatably mounted on the assembly partition frame. The pressure cover has an L-shaped structure. The pressure cover has a positioning groove. A positioning bolt is inserted into the pressure cover, and the positioning bolt has a handwheel. The positioning bolt is threaded into a threaded hole on the side of the mounting base. The positioning groove is aligned with the elastic positioning component.

[0009] Preferably, the pressure stabilizing component further includes: a pressure strip, and a row of through slots is formed on the pressure cover; the row of through slots on the pressure cover is used for heat dissipation; a row of pressure strips is fixedly installed at the bottom of the pressure cover, and the row of pressure strips is used to press and adhere the top of the patch device.

[0010] Preferably, the spacer includes: a plug plate and a handheld tube, wherein the plug plate is slidably plugged into the mounting base; the plug plate is located below the assembly partition frame; and the handheld tube is provided at the tail of the plug plate.

[0011] Preferably, the spacer further includes: a gap gasket, a row of gap gaskets is fixedly installed on the plug plate, and the ends of the row of gap gaskets are respectively chamfered; the row of gap gaskets is slidably attached to the bottom of a row of isolation strips; the two sides of the row of gap gaskets are respectively attached to the side of the plate strip; the row of gap gaskets is respectively used to attach to the top of the circuit board; the sides of the row of gap gaskets respectively protrude from the inner sidewall of a row of through grooves on the isolation strip.

[0012] Preferably, the heating control component includes: a heating water storage tank, a sealing bolt, and a tension spring; the heating water storage tank is fixedly installed on the mounting base; the tail end of the heating water storage tank is threaded with a sealing bolt; a tension spring is sleeved inside the heating water storage tank; and water is stored inside the heating water storage tank.

[0013] Preferably, the elastic positioning component includes: a positioning piston, a positioning sleeve, and a positioning shaft. The positioning piston is slidably sleeved inside the heating water storage tank. One end of the tension spring is fixedly installed inside the heating water storage tank, and the other end of the tension spring is connected to the side of the positioning piston. The tension spring is located inside the heating water storage tank. The positioning sleeve is fixedly installed on the positioning piston. The positioning shaft is slidably sleeved on the positioning sleeve, and the positioning shaft is used to insert into the positioning groove.

[0014] Preferably, the elastic positioning element further includes: an adapter spring, the adapter spring being located inside the positioning sleeve; one end of the adapter spring is fixedly installed inside the positioning sleeve, and the other end of the adapter spring is fixedly installed inside the positioning shaft.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] This invention employs assembly separators and pressure stabilizers to facilitate the positioning of individual surface mount devices, ensuring stability during soldering. Simultaneously, the structure's design, by limiting the positioning of surface mount devices to maintain stability, facilitates subsequent heating and soldering operations, and provides a more stable transport process, preventing surface mount devices from detaching. Spacer pads are used to support and space the surface mount devices, ensuring accurate gaps between the devices and circuit board contacts, guaranteeing subsequent soldering precision, and improving the consistency of surface mount device soldering quality. Furthermore, they allow for quick disassembly after soldering, preventing the inconsistency of solder gaps that is difficult to guarantee after soldering, as is the traditional method of directly holding surface mount devices with tweezers on the circuit board.

[0017] By using a combination of elastic positioning components and heating control components, the lower pressure cover can be automatically positioned after the structure is heated in a reflow soldering machine. This avoids the problem of directly disassembling the circuit board before the solder has solidified after heating, which can lead to loosening of surface mount components and affect the soldering quality. This structure uses the high temperature during soldering to assist in automatic positioning, and then automatically releases the positioning after cooling. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a welding fixture for circuit board manufacturing according to the present invention;

[0019] Figure 2 This is a cross-sectional view of the internal structure of a welding fixture for circuit board manufacturing according to the present invention;

[0020] Figure 3 This is a schematic diagram of the bottom structure of a welding fixture for circuit board manufacturing according to the present invention;

[0021] Figure 4 This is a schematic diagram of the soldering auxiliary component structure of the present invention;

[0022] Figure 5 This is a schematic diagram of the support partition installation position structure of the present invention;

[0023] Figure 6 This is a schematic diagram of the assembly separator structure of the present invention;

[0024] Figure 7 For the present invention Figure 6 Enlarged view of the structure of region C in the middle;

[0025] Figure 8 This is a schematic diagram of the downward stabilizing component structure of the present invention;

[0026] Figure 9 This is a schematic diagram of the heating control component of the present invention;

[0027] Figure 10 This is a schematic diagram of the elastic positioning component structure of the present invention.

[0028] In the diagram: 1. Tinning auxiliary component; 101. Mounting base; 102. Tinning plate; 103. Embedding plate; 1031. Supporting partition; 2. Assembled partition component; 201. Assembled partition frame; 202. Isolation strip; 2021. Plate strip; 3. Lower pressure stabilizing component; 301. Lower pressure cover; 3011. Positioning groove; 302. Positioning bolt; 303. Lower pressure strip; 4. Spacer shim component; 401. Insert plate; 4011. Handheld tube; 402. Gap shim; 5. Heating control component; 501. Heating water tank; 502. Sealing bolt; 503. Tension spring; 6. Elastic positioning component; 601. Positioning piston; 602. Positioning sleeve; 603. Positioning shaft; 604. Adaptor spring. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1: Please refer to Figures 1 to 10 As shown:

[0031] This invention provides a technical solution: a soldering fixture for circuit board manufacturing, including a soldering auxiliary component 1, an assembly separator 2 mounted on the soldering auxiliary component 1 for positioning surface mount devices; a pressure stabilizing component 3 mounted on the assembly separator 2; a spacer 4 slidably inserted into the assembly separator 2; the spacer 4 for maintaining the gap between the surface mount devices and the circuit board; a heating control component 5 mounted on the soldering auxiliary component 1, and an elastic positioning component 6 sleeved inside the heating control component 5; the soldering auxiliary component 1 includes: a mounting base 101 and a soldering plate 102, the mounting base 101 having a groove; the soldering plate 102 being placed in the groove on the mounting base 101; and the soldering plate 102 having mesh holes for soldering.

[0032] The soldering auxiliary component 1 further includes: an embedding plate 103 and a support partition 1031. The embedding plate 103 is inserted into the mounting base 101. A row of support partitions 1031 is fixedly installed on the embedding plate 103. The row of support partitions 1031 is used to support the circuit board. The mounting base 101 has threaded holes on its side. The assembly separator 2 includes: an assembly separator frame 201, a partition strip 202, and a mounting strip 2021. The assembly separator frame 201 is rotatably installed on the mounting base 101. A row of partition strips 202 is fixedly installed on the assembly separator frame 201. Each partition strip 202 has a row of through slots. The slots on the separator strips 202 are used to insert surface mount devices; two rows of mounting strips 2021 are fixedly installed at the bottom of each row of separator strips 202; the mounting strips 2021 are used to adhere to the circuit board; the pressure stabilizing component 3 includes: a pressure cover 301, a positioning groove 3011, and a positioning bolt 302. The pressure cover 301 is rotatably mounted on the assembly partition frame 201; the pressure cover 301 has an L-shaped structure; the pressure cover 301 has a positioning groove 3011; the pressure cover 301 is inserted with a positioning bolt 302, and the positioning bolt 302 is equipped with a handwheel; the positioning bolt 302 is threaded to the side of the mounting base 101. In some threaded holes; the positioning groove 3011 aligns with the elastic positioning element 6; the pressure stabilizing element 3 also includes: a pressure strip 303, and a row of through slots is opened on the pressure cover 301; the row of through slots on the pressure cover 301 is used for heat dissipation; a row of pressure strips 303 is fixedly installed at the bottom of the pressure cover 301, and the row of pressure strips 303 is used to press and adhere the top of the surface mount device; the support partition 1031 can support the bottom of the circuit board, and at the same time, when the surface mount device is soldered on both sides, it can support the bottom of the circuit board, avoid the surface mount device, and prevent the circuit board from being suspended, ensuring the stability of the circuit board after surface mount soldering; The structure employs assembly separator 2 and pressure stabilizing component 3 to facilitate the positioning of each surface mount device, maintaining stability during soldering. Simultaneously, by positioning the surface mount devices and maintaining stability, this structure facilitates subsequent heating and soldering operations, ensuring more stable transport, preventing surface mount devices from falling off, simplifying operation, and improving soldering quality. In double-sided soldering of circuit boards, after single-sided soldering is completed, the circuit board can be flipped over, with the soldered side facing down, and placed on the mounting base 101. The support partition 1031 supports the circuit board, which can then be re-tinned, and surface mount devices installed before soldering.

[0033] The spacer component 4 includes: a plug-in plate 401 and a handheld tube 4011. The plug-in plate 401 is slidably plugged into the mounting base 101. The plug-in plate 401 is located below the assembly partition frame 201. The handheld tube 4011 is provided at the tail of the plug-in plate 401. The spacer component 4 also includes: gap spacers 402. A row of gap spacers 402 is fixedly installed on the plug-in plate 401. The ends of the row of gap spacers 402 are chamfered. The row of gap spacers 402 is slidably attached to the bottom of a row of isolation strips 202. The two sides of the row of gap spacers 402 are respectively attached to the sides of the mounting strip 2021. The row of gap spacers 402 is used to attach to the top of the circuit board. The sides of the row of gap spacers 402 protrude from the inner sidewall of a row of through grooves on the isolation strip 202, using spacers. The shim 4 can be used to support and space the surface mount devices, ensuring accurate gaps between the surface mount devices and the circuit board contacts, ensuring subsequent soldering precision, and improving the consistency of surface mount device soldering quality. The structure is simple to operate and can be quickly disassembled after soldering, making operation simple and convenient. This avoids the problem of inconsistent solder gaps after soldering, which is often caused by the traditional method of directly holding surface mount devices with tweezers and placing them on the circuit board. The gap shim 402 can be inserted between the assembly separator 201 and the circuit board. At this time, each surface mount device can be inserted into the through slot on the separator 202 to assist in limiting the surface mount devices. Simultaneously, the gap shim 402 protruding from the through slot on the separator 202 will stop the surface mount devices, maintaining a consistent gap between the bottom of the surface mount device and the circuit board.

[0034] In Example 2, based on Example 1, the heating control component 5 includes: a heating water storage tank 501, a sealing bolt 502, and a tension spring 503. The heating water storage tank 501 is fixedly installed on the mounting base 101; the sealing bolt 502 is threadedly connected to the tail of the heating water storage tank 501; a tension spring 503 is sleeved inside the heating water storage tank 501; water is stored between the sealing bolt 502 and the positioning piston 601 inside the heating water storage tank 501; the elastic positioning component 6 includes: a positioning piston 601, a positioning sleeve 602, and... The positioning shaft 603 and the positioning piston 601 are slidably sleeved inside the heating water storage tank 501; one end of the tension spring 503 is fixedly installed inside the heating water storage tank 501, and the other end of the tension spring 503 is connected to the side of the positioning piston 601; the tension spring 503 is located inside the heating water storage tank 501; a positioning sleeve 602 is fixedly installed on the positioning piston 601; the positioning shaft 603 is slidably sleeved on the positioning sleeve 602, and the positioning shaft 603 is used to insert into the positioning groove 3011; the elastic positioning element 6 also includes: an adapter spring 6. 04. The adapter spring 604 is located inside the positioning sleeve 602. One end of the adapter spring 604 is fixedly installed inside the positioning sleeve 602, and the other end of the adapter spring 604 is fixedly installed inside the positioning shaft 603. The elastic positioning component 6, in conjunction with the heating control component 5, can automatically control the positioning of the lower pressure cover 301 after the structure is heated in the reflow soldering machine. This prevents the circuit board from being directly disassembled after heating and soldering, when the solder has not yet solidified. Direct disassembly can easily cause problems such as loosening of the surface mount components on the circuit board, affecting the soldering quality. This structure uses high-temperature heating during soldering to assist in automatic positioning. After cooling, the positioning is automatically released. No electrical control components are required, which can ensure automatic control of positioning during high-temperature soldering. Because the temperature in the reflow soldering machine is usually around 200 degrees Celsius, the water inside the heating water tank 501 will evaporate. The vaporization of the water will cause the positioning piston 601 to shift, stretching the tension spring 503. At the same time, the positioning shaft 603 will be moved to insert into the positioning groove 3011, positioning the lower pressure cover 301.

[0035] The working principle of this embodiment is as follows: Before soldering, the circuit board is placed on the mounting base 101. At this time, the solder brush 102 can be placed in the groove on the mounting base 101. Using the mesh on the solder brush 102 and the solder scraper, solder is brushed onto the circuit board. Then, the solder brush 102 can be removed, and the assembly partition frame 201 is rotated and attached to the mounting base 101. At this time, the board strip 2021 will be pressed and attached to the upper surface of the circuit board, and the lower surface of the circuit board is attached to the support partition 1031. The gap shim 402 can be inserted into the assembly. Between the separator frame 201 and the circuit board, each surface mount device can be inserted into the through slot on the separator strip 202 to help limit the placement of the surface mount devices. At the same time, the gap shims 402 protruding from the through slots on the separator strip 202 will stop the surface mount devices, maintaining the gap between the bottom of the surface mount device and the circuit board. Then, the lower pressure cover 301 can be rotated to drive the lower pressure strip 303 to press down and adhere to the top of each surface mount device, further helping to maintain the stability of the surface mount devices. Then, the positioning bolts 302 can be threaded onto the mounting base 101. The circuit board is installed in the threaded hole; then it is transferred to the reflow soldering machine for heating and soldering; after the soldering heating is completed, the soldering auxiliary part 1 is removed. Because the temperature in the reflow soldering machine is usually around 200 degrees Celsius, the water inside the heating water tank 501 will evaporate. The vaporization of the water will cause the positioning piston 601 to shift, stretching the tension spring 503. At the same time, the positioning shaft 603 will be moved to insert into the positioning groove 3011, positioning the lower pressure cover 301. Even if the positioning bolt 302 is removed, the lower pressure cover cannot be opened. Cover 301 uses an adapter spring 604 to elastically adapt to compression when the positioning piston 601 is displaced, preventing the internal pressure of the heated water tank 501 from exceeding the limit when water evaporates; after the soldering auxiliary component 1 is removed and cooled, the surface mount device also cools down, the water vapor inside the heated water tank 501 will condense, the internal pressure will decrease, the positioning piston 601 can be pulled back by the tension spring 503, driving the positioning shaft 603 to be pulled out from the positioning groove 3011 and no longer positioned, at this time the lower cover 301 can be opened normally and the circuit board that has been soldered and cooled can be taken out;

[0036] In the double-sided soldering of circuit boards, after the single-sided soldering is completed, the circuit board can be flipped over and placed with the soldered side down on the mounting base 101. The circuit board can be supported by the support partition 1031, which can avoid surface mount devices. Afterwards, the board can be soldered again after applying tin and installing surface mount devices.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A soldering fixture for circuit board manufacturing, comprising a soldering auxiliary component (1), wherein an assembly separator (2) is mounted on the soldering auxiliary component (1), characterized in that: The assembly separator (2) is used to position the surface mount device; a pressure stabilizer (3) is installed on the assembly separator (2); a spacer (4) is slidably inserted into the assembly separator (2); the spacer (4) is used to maintain the gap between the surface mount device and the circuit board; The tin-brushing auxiliary component (1) is equipped with a heating control component (5), and an elastic positioning component (6) is sleeved inside the heating control component (5). The soldering auxiliary component (1) includes: a mounting base (101) and a soldering plate (102). The mounting base (101) is provided with a groove. The soldering plate (102) is placed in the groove on the mounting base (101). The soldering plate (102) is provided with a mesh for soldering. The assembly separator (2) includes: an assembly separator frame (201), a separation strip (202), and a mounting strip (2021). The pressure stabilizing component (3) includes: a pressure cover (301), a positioning groove (3011), and a positioning bolt (302). The pressure cover (301) is rotatably mounted on the assembly partition frame (201). The pressure cover (301) has an L-shaped structure. The pressure cover (301) has a positioning groove (3011). The pressure cover (301) is inserted into the positioning bolt (302), and the positioning bolt (302) is provided with a handwheel. The positioning bolt (302) is threaded into a threaded hole provided on the side of the mounting base (101). The positioning groove (3011) is aligned with the elastic positioning component (6). The pressure stabilizing component (3) further includes: a pressure strip (303), and a row of through slots is provided on the pressure cover (301); the row of through slots on the pressure cover (301) is used for heat dissipation; a row of pressure strips (303) is fixedly installed at the bottom of the pressure cover (301), and the row of pressure strips (303) is used to press and bond the top of the patch device; The heating control component (5) includes: a heating water tank (501), a sealing bolt (502), and a tension spring (503). The heating water tank (501) is fixedly installed on the mounting base (101). The tail end of the heating water tank (501) is threaded with a sealing bolt (502). A tension spring (503) is sleeved inside the heating water tank (501). The heating water tank (501) stores water. The elastic positioning component (6) includes: a positioning piston (601), a positioning sleeve (602), and a positioning shaft (603). The positioning piston (601) is slidably sleeved inside the heating water storage tank (501). The end of the tension spring (503) is fixedly installed inside the heating water storage tank (501), and the other end of the tension spring (503) is connected to the side of the positioning piston (601). The tension spring (503) is located inside the heating water storage tank (501). The positioning sleeve (602) is fixedly installed on the positioning piston (601). The positioning shaft (603) is slidably sleeved on the positioning sleeve (602), and the positioning shaft (603) is used to insert into the positioning groove (3011). The elastic positioning component (6) further includes: an adapter spring (604), which is located inside the positioning sleeve (602); one end of the adapter spring (604) is fixedly installed inside the positioning sleeve (602), and the other end of the adapter spring (604) is fixedly installed inside the positioning shaft (603).

2. The soldering fixture for circuit board manufacturing according to claim 1, characterized in that: The soldering auxiliary component (1) further includes: an embedding plate (103) and a support partition (1031), wherein the embedding plate (103) is inserted into the mounting base (101); a row of support partitions (1031) is fixedly installed on the embedding plate (103); the row of support partitions (1031) is used to support the circuit board; and the mounting base (101) has threaded holes on its side.

3. The soldering fixture for circuit board manufacturing according to claim 1, characterized in that: The assembly partition frame (201) is rotatably mounted on the mounting base (101); a row of isolation strips (202) is fixedly installed on the assembly partition frame (201), and a row of through slots is provided on each row of isolation strips (202); the through slots on the isolation strips (202) are used to insert surface mount devices; two rows of mounting strips (2021) are fixedly installed at the bottom of each row of isolation strips (202); the mounting strips (2021) are used to attach to the circuit board.

4. A soldering fixture for circuit board manufacturing according to claim 3, characterized in that: The spacer (4) includes a plug plate (401) and a hand tube (4011). The plug plate (401) is slidably plugged into the mounting base (101). The plug plate (401) is located below the assembly partition frame (201). The plug plate (401) is provided with a hand tube (4011) at its tail.

5. A soldering fixture for circuit board manufacturing according to claim 4, characterized in that: The spacer component (4) further includes: a gap spacer (402), a row of gap spacers (402) is fixedly installed on the plug plate (401), and the ends of the row of gap spacers (402) are chamfered respectively; the row of gap spacers (402) is slidably attached to the bottom of a row of isolation strips (202); the two sides of the row of gap spacers (402) are respectively attached to the side of the mounting strip (2021); the row of gap spacers (402) is respectively used to attach to the top of the circuit board; the side of the row of gap spacers (402) protrudes from the inner sidewall of a row of through grooves on the isolation strip (202).

Images