Packaging structure, forming method of packaging structure and optical machine

Abstract

The invention discloses a packaging structure, a forming method of the packaging structure and an optical machine, the packaging structure comprises a micro display chip, the micro display chip comprises a light emitting surface, and the micro display chip comprises a display area and a non-display area surrounding the display area; and the supporting structure is positioned on the light-emitting surface and is positioned in the non-display area. The size of the packaging structure is reduced.

Description

Technical Field

[0001] This invention relates to the field of microdisplay chip packaging, and more particularly to a packaging structure, a method for forming the packaging structure, and an optomechanical system. Background Technology

[0002] Inorganic micropixel light-emitting diodes, also known as micro LEDs or μ-LEDs, have become increasingly important since their application in various fields, including self-emissive microdisplays, visible light communication, and optogenetics. Compared to traditional LEDs, Micro LEDs offer advantages such as better strain relaxation, higher light extraction efficiency, more uniform current diffusion, and higher output performance. Micro LEDs also boast improved thermal effects, faster response times, a wider operating temperature range, higher resolution, a broader color gamut, higher contrast, lower power consumption, and higher current density, making them widely used in near-eye display applications.

[0003] However, as the size of devices in the near-eye display field becomes smaller and smaller, there are also higher requirements for the packaging structure size of inorganic micro-pixel light-emitting diodes. Summary of the Invention

[0004] The technical problem solved by the present invention is to provide a packaging structure and a method for forming the packaging structure, as well as an optomechanical system, so as to further reduce the packaging structure size of inorganic micro-pixel light-emitting diodes.

[0005] To address the aforementioned technical problems, the present invention provides a packaging structure comprising: a microdisplay chip, the microdisplay chip including a display area and a non-display area surrounding the display area; a carrier plate, the microdisplay chip being fixed to the carrier plate; a circuit board electrically connected to the microdisplay chip, the circuit board being fixed to the carrier plate and adjacent to the non-display area on one side of the microdisplay chip; and an encapsulation layer located on the carrier plate, the encapsulation layer exposing the display area, the encapsulation layer extending from the non-display area to the surface of the carrier plate, and the encapsulation layer also extending from the non-display area to the surface of the circuit board.

[0006] Optionally, the microdisplay chip further includes: a plurality of connection boards, wherein the plurality of connection boards are located on a non-display area adjacent to the circuit board, and the encapsulation layer is located on the surface of the connection boards.

[0007] Optionally, the packaging structure further includes: a plurality of gold wires connecting the connecting board and the circuit board, wherein the plurality of gold wires are located within the packaging layer.

[0008] Optionally, the encapsulation layer is located on a portion of the non-display area; the encapsulation layer located on the non-display area has a gap between it and the display area, the gap being greater than or equal to 250 micrometers.

[0009] Optionally, the microdisplay chip includes a light-emitting surface and a non-light-emitting surface, and the encapsulation layer is located on the light-emitting surface.

[0010] Optionally, the top surface of the encapsulation layer is higher than the light-emitting surface of the microdisplay chip.

[0011] Optionally, the top surface of the encapsulation layer is greater than or equal to 200 micrometers above the light-emitting surface of the microdisplay chip.

[0012] Optionally, the microdisplay chip further includes: a light-shielding layer located on the surface of the non-display area, and the encapsulation layer is located on the light-shielding layer.

[0013] Optionally, the material of the encapsulation layer is different from the material of the light-shielding layer.

[0014] Optionally, the encapsulation layer may be made of thermosetting epoxy resin and silicon dioxide.

[0015] Optionally, the material of the light-shielding layer includes: thermosetting epoxy resin and ultraviolet-curable epoxy resin.

[0016] Optionally, the display area includes a pixel array, the pixel array including multiple light-emitting units, each light-emitting unit including at least one light-emitting platform, and the multiple light-emitting platforms being stacked on top of each other in a direction perpendicular to the display area.

[0017] Optionally, the pixel array has a size between 500 μm and 50,000 μm in the direction parallel to the surface of the display area.

[0018] Optionally, the plurality of light-emitting units in the pixel array are distributed in an m×n array, and the value of the m×n array includes one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440.

[0019] Optionally, the size of the light-emitting mesa in the direction parallel to the surface of the display area is between 15 nm and 15 μm.

[0020] Optionally, the circuit board is located on a portion of the surface of the carrier board; the circuit board includes a rigid-flex plate and a flexible plate connected to the rigid-flex plate, the flexible plate includes a first region and a second region and a third region at both ends of the first region, the second region is fixed to the carrier board and electrically connected to the microdisplay chip, and the third region is connected to the rigid-flex plate.

[0021] Optionally, the width of the first region is less than or equal to the width of the second region; the width of the first region is greater than, less than or equal to the width of the third region.

[0022] Optionally, the shape of the first region may include a straight strip or a bent shape.

[0023] Accordingly, the present invention also provides an optical engine, comprising: the packaging structure described above.

[0024] Accordingly, the present invention also provides a method for forming a package structure, comprising: providing a microdisplay chip, the microdisplay chip including a display area and a non-display area surrounding the display area; providing a carrier plate and a circuit board fixed on the carrier plate; fixing the microdisplay chip on the carrier plate; electrically connecting the microdisplay chip to the circuit board, the circuit board being adjacent to the non-display area on one side of the microdisplay chip; forming a package layer on the carrier plate, the package layer exposing the display area, the package layer extending from the non-display area to the surface of the carrier plate, and the package layer also extending from the non-display area to the surface of the circuit board.

[0025] Optionally, the microdisplay chip further includes: a light-shielding layer located on the surface of the non-display area, and the encapsulation layer is located on the light-shielding layer.

[0026] Optionally, the method for forming the encapsulation layer includes: forming an encapsulation material layer on the carrier board, the surface of the microdisplay chip, and a portion of the circuit board surface; and pressing the encapsulation material layer onto the carrier board using a molding process to form the encapsulation layer.

[0027] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0028] The packaging structure of this invention includes a packaging layer that extends from the non-display area to the surface of the carrier board, and further extends from the non-display area to the surface of the circuit board. This single packaging layer completely covers the area of ​​the carrier board except for the display area, achieving overall protection of the carrier board. On one hand, the packaging structure has a significantly reduced thickness, thus reducing its overall volume and facilitating miniaturization of the optical engine. On the other hand, the single packaging layer reduces the number of assembly steps, thereby reducing tolerance accumulation and improving module assembly accuracy. Attached Figure Description

[0029] Figure 1 and Figure 2 This is a schematic diagram of the packaging structure in one embodiment;

[0030] Figures 3 to 5 This is a schematic diagram of the packaging structure in one embodiment of the present invention;

[0031] Figures 6 to 8 This is a schematic diagram of the packaging structure in one embodiment of the present invention;

[0032] Figure 9 and Figure 10 This is a schematic diagram of the packaging structure in one embodiment of the present invention;

[0033] Figure 11 and Figure 12 This is a schematic diagram of the packaging structure in one embodiment of the present invention;

[0034] Figure 13 and Figure 14 This is a schematic diagram of the packaging structure in one embodiment of the present invention;

[0035] Figure 15 and Figure 16 This is a schematic diagram of the packaging structure in one embodiment of the present invention. Detailed Implementation

[0036] As described in the background section, the packaging structure of inorganic micropixel light-emitting diodes needs to be miniaturized. This will now be analyzed and explained with reference to specific embodiments.

[0037] Figure 1 and Figure 2 This is a schematic diagram of the encapsulation structure in one embodiment.

[0038] Please refer to Figure 1 and Figure 2 , Figure 2 for Figure 1 A cross-sectional view along section line AA1 illustrates the process of forming the encapsulation structure, which includes: providing a microdisplay chip 101, the microdisplay chip 101 including a display area and a non-display area surrounding the display area; fixing a glass plate 102 onto the microdisplay chip 101; forming a light-shielding layer 103 on the surface of the glass plate 102 in the non-display area; providing a carrier plate 100 and a circuit board 104 fixed to the carrier plate 100, fixing the microdisplay chip 101 onto the carrier plate 100, with the glass plate 102 located on the side of the microdisplay chip 101 away from the carrier plate 100; electrically connecting the microdisplay chip 101 to the circuit board 104, the circuit board 104 being adjacent to the non-display area on one side of the microdisplay chip 101; and forming a protective layer 105 in the area where the microdisplay chip 101 and the circuit board 104 are electrically connected.

[0039] The glass plate 102 serves as a support structure for the subsequent fixed light-combining prism structure and also protects the microdisplay chip. The subsequent light-combining prism structure and the packaging structure constitute an optomechanical structure. The glass plate has a certain thickness, at least several hundred micrometers, to ensure its strength. Therefore, the overall thickness of the packaging structure is relatively large.

[0040] To address the aforementioned problems, the present invention provides a packaging structure, a method for forming the packaging structure, and an optomechanical system. The packaging layer extends from the non-display area to the surface of the carrier board, and further extends from the non-display area to the surface of the circuit board. By fully covering the area on the carrier board except for the display area with a single packaging layer, overall protection of the carrier board is achieved. On one hand, the packaging structure thickness is significantly reduced, thereby reducing the overall volume of the packaging structure and facilitating the miniaturization of the optomechanical system. On the other hand, the single packaging layer reduces the number of assembly steps in the packaging structure, thereby reducing the accumulation of tolerances and improving the accuracy of module assembly.

[0041] To make the above-mentioned objectives, features and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0042] Figures 3 to 5 This is a schematic diagram of the packaging structure in one embodiment of the present invention.

[0043] Please refer to Figures 3 to 5 , Figure 3 This is a schematic diagram of the package structure excluding the encapsulation layer 206. Figure 4 In order to be in Figure 3 A schematic diagram of the packaging structure including the packaging layer 206 is shown below. Figure 5 for Figure 4 A cross-sectional view along section line AA1 shows the encapsulation structure, which includes:

[0044] Microdisplay chip 201, the microdisplay chip 201 includes a display area and a non-display area surrounding the display area;

[0045] The microdisplay chip 201 is fixed on the carrier plate 200.

[0046] A circuit board 30 electrically connected to the microdisplay chip 201 is fixed on the carrier plate 200 and is adjacent to the non-display area on one side of the microdisplay chip 201.

[0047] An encapsulation layer 206 is located on the carrier board 200, the encapsulation layer 206 exposes the display area, the encapsulation layer 206 extends from the non-display area to the surface of the carrier board 200, and the encapsulation layer 206 also extends from the non-display area to the surface of the circuit board 30.

[0048] The encapsulation structure includes an encapsulation layer 206 extending from the non-display area to the surface of the carrier plate 200, and further extending from the non-display area to the surface of the circuit board 30. This single encapsulation layer 206 completely covers the area of ​​the carrier plate 200 except for the display area, achieving overall protection of the carrier plate 200. On one hand, the encapsulation structure has a significantly reduced thickness, thus reducing its overall volume and facilitating miniaturization of the optical engine. On the other hand, the single encapsulation layer reduces the number of assembly steps, thereby reducing tolerance accumulation and improving module assembly accuracy.

[0049] Please continue to refer to this. Figure 3 The microdisplay chip 201 further includes a light-shielding layer 202 located on the surface of the non-display area, and the encapsulation layer 206 is located on the light-shielding layer 202.

[0050] The surface of the non-display area has a light-shielding layer 202. When the light from the subsequent optomechanical structure is reflected onto the surface of the non-display area, the light-shielding layer 202 makes it difficult for the reflected light to be reflected again, thereby reducing the generation of "ghosting" of the optomechanical structure.

[0051] In this embodiment, the material of the encapsulation layer 206 is different from the material of the light-shielding layer 202, in order to meet the different performance requirements of the encapsulation layer 206 and the light-shielding layer 202.

[0052] In this embodiment, the encapsulation layer 206 is made of thermosetting epoxy resin and silicon dioxide.

[0053] The encapsulation layer 206 has high strength, good stability, is not easily deformed, and is corrosion resistant, which can improve the reliability of the encapsulation structure.

[0054] In this embodiment, the material of the light-shielding layer 202 includes: thermosetting epoxy resin and ultraviolet-curable epoxy resin.

[0055] The light-shielding layer 202 has the characteristics of light-shielding and low reflectivity, so as to reduce the reflection of light on the surface of the non-display area and the generation of "ghosting".

[0056] Please continue to refer to this. Figure 3 In this embodiment, the microdisplay chip 201 further includes: a plurality of connecting plates 203, wherein the plurality of connecting plates 203 are located on the non-display area adjacent to the circuit board 30, and the encapsulation layer 206 is located on the surface of the connecting plates.

[0057] Please continue to refer to this. Figure 3 In this embodiment, the packaging structure further includes a plurality of gold wires 204 connecting the connecting plate 203 and the circuit board 30, wherein the plurality of gold wires 204 are located within the packaging layer 206.

[0058] In this embodiment, the encapsulation layer 206 is located on a portion of the non-display area.

[0059] The encapsulation layer 206 located on the non-display area has a spacing d between it and the display area, the spacing d being greater than or equal to 250 micrometers.

[0060] The encapsulation layer 206 has a spacing d between it and the display area to provide a process window for the encapsulation layer 206, so as to prevent the encapsulation layer 206 from covering the surface of the display area and affecting the light emission effect.

[0061] In this embodiment, the microdisplay chip 201 includes a light-emitting surface and a non-light-emitting surface. The encapsulation layer 206 is located on the light-emitting surface. The non-light-emitting surface and the light-emitting surface are two opposite sides of the microdisplay chip 201. The light-emitting surface is the surface from which light can be emitted.

[0062] The microdisplay chip 201 includes LED, OLED, AMOLED, MiniLED, or MicroLED.

[0063] In this embodiment, the microdisplay chip 201 includes a MicroLED.

[0064] In this embodiment, the display area includes a pixel array, which includes a plurality of light-emitting units, each light-emitting unit including at least one light-emitting platform. In some embodiments, the light-emitting unit includes one light-emitting platform and is capable of emitting monochromatic light. In some embodiments, the light-emitting unit includes two or more light-emitting platforms, which are stacked on top of each other in a direction perpendicular to the display area, and the light-emitting unit is capable of emitting monochromatic light or colored light.

[0065] In this embodiment, the size of the pixel array in the direction parallel to the surface of the display area is between 500 μm and 50000 μm.

[0066] In this embodiment, the plurality of light-emitting units in the pixel array are distributed in an m×n array, and the value of the m×n array includes one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440.

[0067] In this embodiment, the size of the light-emitting platform in the direction parallel to the surface of the display area is between 15 nm and 15 μm.

[0068] In this embodiment, the shape of the display area includes a rectangle; the circuit board 30 is adjacent to one side of the rectangle.

[0069] In other embodiments, the shape of the display area can also be other shapes, such as a circle, an ellipse, etc.

[0070] In this embodiment, the width of the non-display area surrounding the display area is the same.

[0071] In this embodiment, the top surface of the encapsulation layer 206 is higher than the light-emitting surface of the microdisplay chip 201.

[0072] The top surface of the encapsulation layer 206 is greater than or equal to 200 micrometers above the light-emitting surface of the microdisplay chip 201.

[0073] In this embodiment, the circuit board 30 is located on a portion of the surface of the carrier board 200.

[0074] In this embodiment, the circuit board 30 includes a rigid-flex plate and a flexible plate connected to the rigid-flex plate. The flexible plate includes a first region and a second region and a third region at both ends of the first region. The second region is fixed to the carrier plate and electrically connected to the microdisplay chip. The third region is connected to the rigid-flex plate.

[0075] The width of the first region is less than or equal to the width of the second region; the width of the first region is greater than, less than or equal to the width of the third region.

[0076] The shape of the first region may be straight or bent.

[0077] Figures 6 to 8 , Figure 9 and Figure 10 , Figure 11 and Figure 12 , Figure 13 and Figure 14 , Figure 15 and Figure 16 The packaging structures of different circuit boards 30 are illustrated respectively.

[0078] Please refer to Figures 6 to 8 , Figure 6 This is a front structural view of the encapsulation structure, where the front side is the surface of the encapsulation layer 206. Figure 7 This is a schematic diagram of the back structure of the aforementioned packaging structure. Figure 8 This is a side view of the encapsulation structure. In this embodiment, the circuit board 30 includes a rigid-flex plate 31 and a flexible plate 32 connected to the rigid-flex plate 31. The flexible plate 32 includes a first region 321 and a second region 322 and a third region 323 at both ends of the first region 321. The second region 322 is fixed on the carrier plate 200 and electrically connected to the microdisplay chip 201. The third region 323 is connected to the rigid-flex plate 31.

[0079] In this embodiment, the shape of the first region 321 includes a straight strip.

[0080] In this embodiment, the width of the first region 321 is smaller than the width of the second region 322; the width of the first region 321 is smaller than the width of the third region 323.

[0081] Please continue to refer to this. Figure 7 In this embodiment, the circuit board 30 further includes a shielding film (not shown) disposed on the back of the first area 321, which can reduce electromagnetic interference.

[0082] In this embodiment, the rigid-flex plate 31 includes a shielding structure 311 disposed on the front and an interface 312 disposed on the back. The shielding structure 311 is used to shield interference, and the interface 312 is used to connect to an external interface.

[0083] In this embodiment, the number of shielding structure 311 and interface 312 is one.

[0084] In this embodiment, the display area of ​​the microdisplay chip 201 has the following dimensions: a length of 2.64 mm and a width of 2.02 mm.

[0085] In this embodiment, the microdisplay chip 201 is used to emit monochromatic light.

[0086] Please refer to Figure 9 and Figure 10 , Figure 9 This is a front structural view of the encapsulation structure, where the front side is the surface of the encapsulation layer 206. Figure 10 This is a schematic diagram of the back structure of the packaging structure. In this embodiment, the circuit board 30 includes a rigid-flex plate 41 and a flexible plate 42 connected to the rigid-flex plate 41. The flexible plate 42 includes a first region 421 and a second region 422 and a third region 423 at both ends of the first region 421. The second region 422 is fixed on the carrier plate 200 and electrically connected to the micro display chip 201. The third region 423 is connected to the rigid-flex plate 41.

[0087] In this embodiment, the shape of the first region 421 includes a bent shape.

[0088] In this embodiment, the width of the first region 421 is equal to the width of the second region 422; the width of the first region 421 is equal to the width of the third region 423.

[0089] Please continue to refer to this. Figure 10 In this embodiment, the circuit board 30 further includes a shielding film (not shown) disposed on the back of the first area 421, which can reduce electromagnetic interference.

[0090] In this embodiment, the rigid-flex plate 41 includes an interface 412 disposed on the front and a shielding structure 411 disposed on the back. The shielding structure 411 is used to shield interference, and the interface 412 is used to connect to an external interface.

[0091] In this embodiment, the number of shielding structure 411 and interface 412 is one.

[0092] In this embodiment, the display area of ​​the microdisplay chip 201 has the following dimensions: a length of 2.63 mm and a width of 1.99 mm.

[0093] In this embodiment, the microdisplay chip 201 is used to emit blue light.

[0094] Please refer to Figure 11 and Figure 12 , Figure 11 This is a front structural view of the encapsulation structure, where the front side is the surface of the encapsulation layer 206. Figure 12 This is a schematic diagram of the back structure of the packaging structure. In this embodiment, the circuit board 30 includes a rigid-flex plate 51 and a flexible plate 52 connected to the rigid-flex plate 51. The flexible plate 52 includes a first region 521 and a second region 522 and a third region 523 at both ends of the first region 521. The second region 522 is fixed on the carrier plate 200 and electrically connected to the micro display chip 201. The third region 523 is connected to the rigid-flex plate 51.

[0095] Please continue to refer to this. Figure 12 In this embodiment, the circuit board 30 further includes a shielding film (not shown) disposed on the back of the first area 521, which can reduce electromagnetic interference.

[0096] In this embodiment, the shape of the first region 521 includes a straight strip.

[0097] In this embodiment, the width of the first region 521 is equal to the width of the second region 522; the width of the first region 521 is less than the width of the third region 523.

[0098] In this embodiment, the rigid-flex plate 51 includes a first interface 511 disposed on the front and a second interface 512 disposed on the back, wherein the first interface 511 and the second interface 512 are used to connect to an external interface.

[0099] In this embodiment, there are two first interfaces 511 and one second interface 512.

[0100] In this embodiment, the display area of ​​the microdisplay chip 201 has the following dimensions: a length of 2.63 mm and a width of 1.99 mm.

[0101] In this embodiment, the microdisplay chip 201 is used to emit green light.

[0102] Please refer to Figure 13 and Figure 14 , Figure 13 This is a front structural view of the encapsulation structure, where the front side is the surface of the encapsulation layer 206. Figure 14 This is a schematic diagram of the back structure of the packaging structure. In this embodiment, the circuit board 30 includes a rigid-flex plate 61 and a flexible plate 62 connected to the rigid-flex plate 61. The flexible plate 62 includes a first region 621 and a second region 622 and a third region 623 at both ends of the first region 621. The second region 622 is fixed on the carrier plate 200 and electrically connected to the micro display chip 201. The third region 623 is connected to the rigid-flex plate 61.

[0103] In this embodiment, the shape of the first region 621 includes a bent shape.

[0104] In this embodiment, the width of the first region 621 is equal to the width of the second region 622; the width of the first region 621 is greater than the width of the third region 623.

[0105] Please continue to refer to this. Figure 14 In this embodiment, the circuit board 30 further includes a shielding film (not shown) disposed on the back of the first area 621, which can reduce electromagnetic interference.

[0106] In this embodiment, the rigid-flex plate 61 includes an interface 612 disposed on the front and a shielding structure 611 disposed on the back. The shielding structure 611 is used to shield interference, and the interface 612 is used to connect to an external interface.

[0107] In this embodiment, the number of shielding structures 611 is 1; the number of interfaces 612 is 1.

[0108] In this embodiment, the display area of ​​the microdisplay chip 201 has the following dimensions: a length of 2.63 mm and a width of 1.99 mm.

[0109] In this embodiment, the microdisplay chip 201 is used to emit red light.

[0110] Please refer to Figure 15 and Figure 16 , Figure 15 This is a front structural view of the encapsulation structure, where the front side is the surface of the encapsulation layer 206. Figure 16This is a schematic diagram of the back structure of the packaging structure. In this embodiment, the circuit board 30 includes a rigid-flex plate 71 and a flexible plate 72 connected to the rigid-flex plate 71. The flexible plate 72 includes a first region 721 and a second region 722 and a third region 723 at both ends of the first region 721. The second region 722 is fixed on the carrier plate 200 and electrically connected to the micro display chip 201. The third region 723 is connected to the rigid-flex plate 71.

[0111] In this embodiment, the shape of the first region 721 includes a straight strip.

[0112] In this embodiment, the width of the first region 721 is smaller than the width of the second region 722; the width of the first region 721 is smaller than the width of the third region 723.

[0113] Please continue to refer to this. Figure 16 In this embodiment, the circuit board 30 further includes a first shielding film (not shown) disposed on the back of the first area 721 and a second shielding film (not shown) disposed on the front of the first area 721. The first shielding film and the second shielding film can reduce electromagnetic interference.

[0114] In this embodiment, the rigid-flex plate 71 includes a shielding structure 711 disposed on the front and an interface 712 disposed on the back. The shielding structure 711 is used to shield interference, and the interface 712 is used to connect to an external interface.

[0115] In this embodiment, the number of shielding structures 711 is 1; the number of interfaces 712 is 1.

[0116] In this embodiment, the display area of ​​the microdisplay chip 201 has the following dimensions: a length of 2.63 mm and a width of 1.99 mm.

[0117] In this embodiment, the microdisplay chip 201 is used to emit monochromatic light.

[0118] Accordingly, embodiments of the present invention also provide an optical engine, the optical engine comprising, as follows: Figures 3 to 5 , Figures 6 to 8 , Figure 9 and Figure 10 , Figure 11 and Figure 12 , Figure 13 and Figure 14 ,or Figure 15 and Figure 16 The encapsulation structure in it.

[0119] Accordingly, embodiments of the present invention also provide a method for forming such Figures 3 to 5 , Figures 6 to 8 , Figure 9 and Figure 10, Figure 11 and Figure 12 , Figure 13 and Figure 14 ,or Figure 15 and Figure 16 Methods for encapsulating structures include:

[0120] A microdisplay chip 201 is provided, the microdisplay chip 201 including a display area and a non-display area surrounding the display area;

[0121] A carrier plate 200 and a circuit board 30 fixed on the carrier plate 200 are provided;

[0122] The microdisplay chip 201 is fixed onto the carrier plate 200;

[0123] The microdisplay chip 201 is electrically connected to the circuit board 30, and the circuit board 30 is adjacent to the non-display area on one side of the microdisplay chip 201;

[0124] An encapsulation layer 206 is formed on the carrier board 200, the encapsulation layer 206 exposing the display area, the encapsulation layer 206 extending from the non-display area to the surface of the carrier board 200, and the encapsulation layer 206 also extending from the non-display area to the surface of the circuit board 30.

[0125] In this embodiment, the microdisplay chip 201 further includes a light-shielding layer 202 located on the surface of the non-display area, and the encapsulation layer 206 is located on the light-shielding layer 202.

[0126] In this embodiment, the method for forming the encapsulation layer 206 includes: forming an encapsulation material layer (not shown) on the carrier plate 200, the surface of the microdisplay chip 201, and a portion of the surface of the circuit board 30; and pressing the encapsulation material layer using a molding process to form the encapsulation layer 206 on the carrier plate 200.

[0127] The encapsulation material layer is pressed together using a molding process, allowing the encapsulation layer 206 to be integrally formed. The encapsulation layer 206 completely covers the area of ​​the carrier plate 200 except for the display area, achieving overall protection of the carrier plate 200. On one hand, the encapsulation structure thickness is significantly reduced, thereby reducing the overall volume of the encapsulation structure and facilitating the miniaturization of the optical engine. On the other hand, the one-time formation of the encapsulation layer 206 reduces the number of assembly steps in the encapsulation structure, thereby reducing tolerance accumulation and improving the precision of module assembly.

[0128] In this embodiment, the carrier plate 200 and the circuit board 30 are a fixed whole when they arrive at the factory.

[0129] In other embodiments, the carrier board and the circuit board are supplied separately, and the method for forming the packaging structure further includes fixing the circuit board to the carrier board.

[0130] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A packaging structure, characterized in that, include: A microdisplay chip, the microdisplay chip including a display area and a non-display area surrounding the display area; A carrier plate, on which the microdisplay chip is fixed; A circuit board electrically connected to the microdisplay chip, the circuit board being fixed to the carrier plate, and the circuit board being adjacent to the non-display area on one side of the microdisplay chip; An encapsulation layer located on a carrier board exposes the display area and extends from the non-display area to the surface of the carrier board, and also extends from the non-display area to the surface of the circuit board.

2. The packaging structure as described in claim 1, characterized in that, The microdisplay chip further includes: a plurality of connection boards, wherein the plurality of connection boards are located on a non-display area adjacent to the circuit board, and the encapsulation layer is located on the surface of the connection boards.

3. The packaging structure as described in claim 2, characterized in that, The packaging structure further includes: a plurality of gold wires connecting the connecting board and the circuit board, wherein the plurality of gold wires are located within the packaging layer.

4. The packaging structure as described in claim 1, characterized in that, The encapsulation layer is located on a portion of the non-display area; the encapsulation layer located on the non-display area has a gap between it and the display area, the gap being greater than or equal to 250 micrometers.

5. The packaging structure as described in claim 1, characterized in that, The microdisplay chip includes a light-emitting surface and a non-light-emitting surface, and the encapsulation layer is located on the light-emitting surface.

6. The packaging structure as described in claim 5, characterized in that, The top surface of the encapsulation layer is higher than the light-emitting surface of the microdisplay chip.

7. The packaging structure as described in claim 6, characterized in that, The top surface of the encapsulation layer is greater than or equal to 200 micrometers above the light-emitting surface of the microdisplay chip.

8. The packaging structure as described in claim 1, characterized in that, The microdisplay chip further includes: a light-shielding layer located on the surface of the non-display area, and the encapsulation layer located on the light-shielding layer.

9. The packaging structure as described in claim 8, characterized in that, The material of the encapsulation layer is different from the material of the light-shielding layer.

10. The packaging structure as described in claim 9, characterized in that, The materials of the encapsulation layer include thermosetting epoxy resin and silicon dioxide.

11. The packaging structure as described in claim 9, characterized in that, The materials of the light-shielding layer include thermosetting epoxy resin and ultraviolet-curable epoxy resin.

12. The packaging structure as described in claim 1, characterized in that, The display area includes a pixel array, which includes multiple light-emitting units. Each light-emitting unit includes at least one light-emitting platform, and the multiple light-emitting platforms are stacked on top of each other in a direction perpendicular to the display area.

13. The packaging structure as described in claim 12, characterized in that, The pixel array has a size between 500 μm and 50,000 μm in the direction parallel to the surface of the display area.

14. The packaging structure as described in claim 12, characterized in that, The plurality of light-emitting units in the pixel array are distributed in an m×n array, and the value of the m×n array includes one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440.

15. The packaging structure as described in claim 12, characterized in that, The size of the light-emitting platform in the direction parallel to the surface of the display area is between 15 nm and 15 μm.

16. The packaging structure as described in claim 1, characterized in that, The circuit board is located on a portion of the surface of the carrier board; the circuit board includes a rigid-flex plate and a flexible plate connected to the rigid-flex plate, the flexible plate includes a first region and a second region and a third region at both ends of the first region, the second region is fixed to the carrier board and electrically connected to the microdisplay chip, and the third region is connected to the rigid-flex plate.

17. The packaging structure as described in claim 16, characterized in that, The width of the first region is less than or equal to the width of the second region; the width of the first region is greater than, less than or equal to the width of the third region.

18. The packaging structure as described in claim 16, characterized in that, The shape of the first region may be straight or bent.

19. An optical engine, characterized in that, include: The packaging structure as described in any one of claims 1 to 18.

20. A method for forming an encapsulation structure as described in any one of claims 1 to 18, characterized in that, include: A microdisplay chip is provided, the microdisplay chip including a display area and a non-display area surrounding the display area; Provides a carrier board and a circuit board fixed on the carrier board; The microdisplay chip is fixed to the carrier plate; The microdisplay chip is electrically connected to the circuit board, and the circuit board is adjacent to the non-display area on one side of the microdisplay chip; An encapsulation layer is formed on a carrier board, the encapsulation layer exposing the display area, the encapsulation layer extending from the non-display area to the surface of the carrier board, and the encapsulation layer also extending from the non-display area to the surface of the circuit board.

21. The method for forming the packaging structure as described in claim 20, characterized in that, The microdisplay chip further includes: a light-shielding layer located on the surface of the non-display area, and the encapsulation layer located on the light-shielding layer.

22. The method for forming the packaging structure as described in claim 20, characterized in that, The method for forming the encapsulation layer includes: forming an encapsulation material layer on the carrier board, the surface of the microdisplay chip, and a portion of the circuit board surface; and pressing the encapsulation material layer onto the carrier board using a molding process to form the encapsulation layer.

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