Aggregate substrate, method for manufacturing same, and method for manufacturing circuit substrate

Abstract

Provided is a collective substrate capable of improving work efficiency for obtaining individual circuit boards from a collective substrate in which circuit boards are arranged in parallel in a lattice shape. The assembly substrate is provided with: a product part (3) in which a plurality of circuit substrates (17) each having a circuit pattern (15) on an insulating substrate (13) are arranged in parallel in a lattice pattern in a first direction and a second direction that intersect each other; a slit (7) extending in the first direction across at least the end of the product section (3) and penetrating between the circuit substrates (17) adjacent in the second direction in the plate thickness direction; a joining part (9) that joins the circuit boards (17) adjacent in the second direction to each other in at least one end of the product part (3) in the first direction; and grooves (11) that do not penetrate in the plate thickness direction, extend across the ends of the product section (3) in the second direction, and are positioned between the circuit substrates (17) and the bonding section (9) that are adjacent in the first direction, and between the adjacent circuit substrates (17).

Description

Technical Field

[0001] This invention relates to an aggregate substrate formed by arranging multiple circuit boards in a grid pattern side by side, a method for manufacturing the same, and a method for manufacturing circuit boards. Background Technology

[0002] One method for manufacturing circuit boards is to divide individual circuit boards from a composite substrate in which multiple circuit boards are arranged in a grid pattern side by side.

[0003] When dividing individual circuit boards, V-grooves are formed by V-cutting, as in Patent Document 1, for example. The V-grooves create thin-walled sections between adjacent circuit boards, allowing them to break. By breaking these thin-walled sections, individual circuit boards can be obtained by dividing them.

[0004] However, in a set of circuit boards arranged in a grid pattern, a series of circuit boards are first separated from the grid pattern of circuit boards, and then individual circuit boards are separated from the set.

[0005] Therefore, existing circuit board manufacturing methods lead to an increase in the number of slitting points and slitting times, resulting in a decrease in the efficiency of obtaining individual circuit boards.

[0006] [Existing Technical Documents]

[0007] [Patent Literature]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2016-63201 Summary of the Invention

[0009] [The problem the invention aims to solve]

[0010] The problem to be solved is the poor efficiency of obtaining individual circuit boards from a set of circuit boards arranged in a grid pattern.

[0011] [Methods used to solve problems]

[0012] The present invention provides an assembly substrate, characterized in that it comprises: a product section in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged side by side in a grid pattern in mutually intersecting first and second directions; a slit extending in the first direction at least across the ends of the product section and penetrating in the thickness direction between the portions of the circuit boards adjacent to each other in the second direction of the product section; a joining portion joining the circuit boards adjacent to each other in the second direction at least one end of the product section in the first direction; and a groove not penetrating in the thickness direction extending in the second direction across the ends of the product section and located between the circuit boards adjacent to each other in the first direction and the joining portion and between the adjacent circuit boards.

[0013] Furthermore, the present invention provides a method for manufacturing an aggregate substrate, the aggregate substrate comprising: a product section in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged side by side in a grid pattern in mutually intersecting first and second directions; a slit extending in the first direction at least across the ends of the product section and penetrating in the thickness direction between the portions of the circuit boards adjacent to each other in the second direction of the product section; a joining portion joining the circuit boards adjacent to each other in the second direction at least one end of the product section in the first direction; and a groove not penetrating in the thickness direction extending in the second direction across the ends of the product section and located between the circuit boards adjacent to each other in the first direction and the joining portion and between adjacent circuit boards, the method for manufacturing the aggregate substrate being characterized in that the slit and the groove are formed on a semi-finished product having the product section.

[0014] Furthermore, the present invention provides a method for manufacturing a circuit board, which is a method for manufacturing a circuit board using an aggregated substrate, the aggregated substrate comprising: a product section in which a plurality of circuit boards, each having a circuit pattern on an insulating substrate, are arranged side by side in a grid pattern in mutually intersecting first and second directions; a slit extending in the first direction at least across the ends of the product section and penetrating in the thickness direction between the portions of the circuit boards adjacent to each other in the second direction of the product section; a joining portion joining the circuit boards adjacent to each other in the second direction at least at one end of the product section in the first direction; and a groove not penetrating in the thickness direction extending in the second direction across the ends of the product section and located between the adjacent circuit boards and the joining portion and between adjacent circuit boards in the first direction, the method for manufacturing the circuit board being characterized in that the two sides of the groove are respectively held in the first direction, and the adjacent circuit boards and the joining portion and the adjacent circuit boards are broken apart.

[0015] [The effects of the invention]

[0016] This invention can improve the efficiency of obtaining individual circuit boards from a set of substrates in which circuit boards are arranged in a grid pattern. Attached Figure Description

[0017] Figure 1 This is a schematic perspective view of the substrate assembly according to Embodiment 1 of the present invention.

[0018] Figure 2 yes Figure 1 A top view of the assembled substrate.

[0019] Figure 3 yes Figure 2 A cross-sectional view of the substrate along line III-III.

[0020] Figure 4 yes Figure 2 A cross-sectional view of the substrate along line IV-IV.

[0021] Figure 5 This is a schematic perspective view illustrating the formation of a slit in an assembly substrate according to an embodiment of the present invention.

[0022] Figure 6 This is a schematic perspective view illustrating the formation of grooves in the assembly substrate according to an embodiment of the present invention.

[0023] Figure 7 It means Figure 5 A side view of the cutter when the slit is formed.

[0024] Figure 8 It means Figure 7 A magnified front view of section VIII.

[0025] Figure 9 yes Figure 7 A schematic cross-sectional view of the cutter.

[0026] Figure 10 yes Figure 6 A side view of the cutter when the groove is formed.

[0027] Figure 11 yes Figure 10 A schematic cross-sectional view of the cutter.

[0028] Figure 12 This is a schematic perspective view showing the cleaning of the substrate assembly in Embodiment 1.

[0029] Figure 13 (A) and (B) are magnified photographs showing the intersection of the slit and groove of the assembly substrate of Example 1.

[0030] Figure 14 (A) to (C) are perspective views showing the manufacturing method of the circuit board of Embodiment 1.

[0031] Figure 15 This is a schematic cross-sectional view illustrating the manufacturing method of the circuit board of Embodiment 1.

[0032] Figure 16 This is a top view of the substrate assembly of Embodiment 2 of the present invention.

[0033] Figure 17 This is a top view of the substrate of a modified example of Embodiment 2.

[0034] Figure 18 This is a top view of the substrate of another variation of Embodiment 2. Detailed Implementation

[0035] By combining and configuring slits and slots between adjacent circuit boards, the efficiency of obtaining individual circuit boards from a set of boards arranged in a grid pattern is improved.

[0036] The substrate 1 includes a product section 3, a slit 7, a joint section 9, and a groove 11.

[0037] Product section 3 is formed by arranging a plurality of circuit boards 17, each having a circuit pattern 15 on an insulating substrate 13, in a grid pattern side by side in intersecting first and second directions. A slit 7 extends across at least the ends of product section 3 in the first direction and penetrates the portion between adjacent circuit boards 17 in the second direction of product section 3 in the thickness direction. A joining portion 9 joins adjacent circuit boards 17 in the second direction at least at one end of product section 3 in the first direction. A groove 11 extends across the ends of product section 3 in the second direction and is located between adjacent circuit boards 17 and joining portion 9 in the first direction and between adjacent circuit boards 17, but does not penetrate in the thickness direction.

[0038] In one embodiment, the connecting portion 9 may be provided at each end of the product portion 3 in the first direction along the second direction. In another embodiment, the connecting portion 9 may be provided at one end of the product portion 3 in the first direction along the second direction. In yet another embodiment, the connecting portion 9 may be provided partly at one end of the product portion 3 in the first direction and partly at the other end of the product portion 3 in the first direction.

[0039] The manufacturing method of this substrate 1 forms a slit 7 and a groove 11 on a semi-finished product 27 having a product section 3. Preferably, the groove 11 is formed after the slit 7 is formed. After the slit 7 and the groove are formed, fluid F can be sprayed onto the product section 3. In this case, the slit 7 may also gradually narrow in width toward the middle portion in the thickness direction of the product section 3.

[0040] The method for manufacturing the circuit board 17 using the assembly substrate 1 involves holding both sides of the groove 11 in a first direction, and breaking adjacent circuit boards 17 from the joint portion 9 and from each other. Preferably, the holding is performed along each column in a second direction.

[0041] [Example 1]

[0042] [Collection substrate]

[0043] Figure 1 This is a schematic perspective view of the substrate assembly according to Embodiment 1 of the present invention. Figure 2 yes Figure 1 A top view of the assembled substrate. Figure 3 yes Figure 2 A cross-sectional view of the substrate along line III-III. Figure 4 yes Figure 2 A cross-sectional view of the substrate along line IV-IV.

[0044] like Figures 1 to 4 Thus, the substrate 1 includes a product section 3, a frame section 5, multiple slits 7, a joint section 9, and multiple grooves 11. Furthermore, in Figure 1 The illustrations of slit 7 and groove 11 are omitted in the text.

[0045] Product section 3 is formed by arranging multiple circuit boards 17, each having a circuit pattern 15 on an insulating substrate 13, in a grid-like arrangement in a first direction and a second direction that intersect each other. In this embodiment, the insulating substrate 13 is a metal substrate formed by laminating an insulating layer 21 onto a metal substrate 19. However, the insulating substrate 13 can also be other insulating substrates such as ceramic substrates.

[0046] A frame portion 5 is provided around the outer periphery of the product section 3. The frame portion 5 has a frame portion 5A at the end of the product section 3 in a first direction and a frame portion 5B at the end of the product section 3 in a second direction. This frame portion 5 will become a waste board outside the product. In addition, the frame portion 5B at the end of the second direction can also be omitted.

[0047] The circuit board 17 of product section 3 is divided into a grid pattern by multiple slits 7 and multiple slots 11.

[0048] Multiple slits 7 extend across the ends of the product section 3 in a first direction. These slits 7 are arranged side by side with spacing in a second direction. Each slit 7 is located between adjacent frame portions 5B and circuit boards 17 in the second direction or between adjacent circuit boards 17, and penetrates the product section 3 in the thickness direction in this portion.

[0049] Thus, the slit 7 cuts apart adjacent circuit boards 17 in the second direction. The circuit board 17 located at the end in the second direction is cut apart relative to the adjacent circuit board 17 and the frame portion 5B in the second direction. Between adjacent slits 7, a plurality of circuit boards 17 are continuous in the first direction via grooves 11.

[0050] The slit 7 only needs to penetrate the assembly substrate 1 in the thickness direction, and its cross-sectional shape can be appropriately set within this range. In this embodiment, the width of the cross-sectional shape of the slit 7 gradually narrows from both sides of the product section 3 in the thickness direction toward the middle section.

[0051] In this embodiment, the slit 7 reaches both ends of the frame portion 5A in the first direction, but does not completely cut off the frame portion 5A, leaving a continuous portion in the second direction. Thus, the frame portions 5A at each end in the first direction are divided into joint portions 9. Alternatively, the slit 7 may not reach the frame portions 5A but only extend between the ends of the product portions 3.

[0052] The joining portion 9 joins adjacent circuit boards 17 in the second direction at least one end of the product portion 3 in the first direction. In this embodiment, the joining portion 9 is provided along the second direction at each end of the product portion 3 in the first direction according to the frame portion 5A. The joining portion 9 joins the circuit boards 17 arranged in a row along the second direction at each end of the product portion 3 into one piece.

[0053] Multiple slots 11 are arranged side-by-side on both sides of the assembly substrate 1 in the thickness direction, spaced apart in a first direction. The slots 11 on both sides in the thickness direction are arranged corresponding to each other in the thickness direction. Alternatively, the slots 11 may be provided only on one side of the assembly substrate 1 in the thickness direction.

[0054] Multiple slots 11 on each side extend across the ends of the product section 3 in the second direction. In this embodiment, the slots 11 reach the end edges of both sides of a pair of frame sections 5B in the second direction.

[0055] Each slot 11 is located between adjacent frame portions 5A and circuit boards 17 in the first direction, or between adjacent circuit boards 17. In this portion, a thin-walled portion 23 is formed that thins the product portion 3 in the thickness direction and does not penetrate through it. The circuit boards 17 can be divided into individual circuit boards 17 by breaking through this thin-walled portion 23. "Not penetrating" simply means having a non-penetrating portion, but also includes portions such as through holes.

[0056] The groove 11 only needs to form a thin-walled portion 23 in the product section 3, and the cross-sectional shape can be appropriately set within this range. In this embodiment, the groove 11 is a V-groove, and the cross-sectional shape is a triangle whose width gradually narrows towards the middle of the thin-walled portion 23 in the thickness direction of the product section 3.

[0057] [Manufacturing Method]

[0058] Figure 5 This is a schematic perspective view showing the formation of the slit in the assembly substrate 1 according to an embodiment of the present invention. Figure 6 This is a schematic perspective view showing the formation of the groove 11 on the substrate 1 of the assembly. Figure 7 It means Figure 5 Side view of cutter 25 when slit 7 is formed. Figure 8 It means Figure 7 A magnified front view of section VIII. Figure 9 yes Figure 7 A schematic cross-sectional view of the cutter 25. Figure 10 yes Figure 6 Side view of cutter 25 when groove 11 is formed. Figure 11 yes Figure 10 A schematic cross-sectional view of the cutter.

[0059] The manufacturing method of the substrate 1 in this embodiment produces a semi-finished product 27, which has a frame 5 around the product section 3 and no slits 7 or grooves 11. Figure 5 (etc.). The semi-finished product 27 is manufactured by laminating the circuit conductor 15a onto the metal substrate 19 through the insulating layer 21 (see reference). Figure 3 and Figure 4 ).

[0060] The stacking of circuit conductors 15a can be performed by using a resin layer as an adhesive layer. The stacked circuit conductors 15a can be either unpatterned or patterned conductors. If the circuit conductors 15a are unpatterned, they can be patterned by etching or other methods after stacking.

[0061] The semi-finished product 27 thus manufactured is formed with slits 7 and grooves 11 to obtain the assembly substrate 1. In this embodiment, the grooves 11 are formed after the slits 7 are formed. However, the slits 7 can also be formed after the grooves 11 are formed.

[0062] When forming slit 7, as Figure 5 In this manner, a pair of cutters 25 clamp the semi-finished product 27 from both sides in the thickness direction and move it relative to each other in the first direction. At this time, in order not to completely cut off the frame portions 5A at both ends in the first direction, the pair of cutters 25 are positioned away from each other in a way that avoids the frame portions 5A, and bring them closer together between the ends of the product portions 3 in the first direction. Furthermore, although the slits 7 are formed simultaneously from both sides of the semi-finished product 27 in this embodiment, the slits 7 can also be formed by cutting each side individually with the cutters 25.

[0063] like Figures 7 to 9 Thus, at the proximity of the pair of cutters 25, the teeth 25a of the cutters 25 will overlap each other in the first direction. This reliably forms a slit 7 through the semi-finished product 27. In this embodiment, the frame portion 5A is also partially cut, but a joint portion 9 remains in the frame portion 5A (see reference). Figure 2 Furthermore, slit 7 can be installed only in the part that becomes product section 3.

[0064] While the semi-finished product 27 is offset relative to each other in the second direction, the slit 7 is formed between the circuit boards 17 in the second direction. The slit 7 thus formed, as... Figure 3 In this way, it has a cross section whose width gradually narrows across the middle part from the surface of the semi-finished product 27 in the plate thickness direction, according to the shape of the teeth 25a of the cutter 25.

[0065] When forming groove 11, such as Figure 6In this way, by interchangeding the first and second directions of the semi-finished product 27, the semi-finished product 27 is rotated relative to the cutter 25. As a result, the direction of movement of the cutter 25 is aligned with the second direction of the semi-finished product 27.

[0066] In this state, a pair of cutters 25 clamp the semi-finished product 27 from both sides in the thickness direction and move it relative to each other in a second direction. For example... Figure 10 and Figure 11 In this way, when forming the groove 11, the cutter 25 is separated beforehand with a gap S corresponding to the thin-walled portion 23, and in this state, the cutter 25 is moved relative to the semi-finished product 27. Alternatively, the groove 11 can also be formed by cutting each side with the cutter 25.

[0067] While offsetting the semi-finished product 27 relative to each other in a first direction, the groove 11 is formed between each circuit board 17 in the first direction. The groove 11 thus formed, as... Figure 4 In this way, the V-groove of the thin-walled portion 23 is formed in the semi-finished product 27 according to the shape of the tooth 25a of the cutter 25.

[0068] Figure 12 This is a schematic three-dimensional view showing the cleaning of the substrate 1. Figure 13 This is a magnified photograph showing the intersection of the slit 7 and the groove 11 on the substrate. Figure 13 (A) is the surface, Figure 13 (B) is the reverse side. Furthermore, in Figure 12 The slit 7 and groove 11 are represented by only dashed lines. Figure 14 The same applies.

[0069] like Figure 12 In this way, the substrate 1 with slits 7 and grooves 11 is cleaned by spraying fluid F. In this embodiment, the cleaning is high-pressure water washing, and pure water is used as the fluid F. Fluid F can be used for cleaning by spraying, and is not limited to pure water; it can also be an aqueous solution of isopropanol, etc.

[0070] This cleaning process removes burrs or shavings from the substrate 1 formed during the formation of the slits 7 and grooves 11. In this embodiment, since the grooves 11 are formed after the slits 7 are formed, the burrs or shavings can be removed as follows: Figure 13 That would place the rough edge B in a position that protrudes into the slit 7.

[0071] Therefore, the burrs B can be reliably removed by the fluid F passing through the slit 7. In particular, in this embodiment, the slit 7 gradually narrows in width toward the middle portion in the plate thickness direction, so the flow rate of the fluid F increases and the burrs are easily removed.

[0072] Figure 14 (A) to Figure 14(C) is a perspective view showing the manufacturing method of the circuit board 17. Figure 15 This is a schematic cross-sectional view showing the manufacturing method of the circuit board 17.

[0073] like Figure 14 (A) to Figure 14 (C) In this manner, individual circuit boards 17 are obtained from the cleaned assembly substrate 1. In this embodiment, as... Figure 15 In this way, by holding both sides of the groove 11 from one end of the assembly substrate 1 in the first direction and bending the assembly substrate 1 along the groove 11, the frame portion 5A and the circuit board 17 are sequentially divided.

[0074] Specifically, firstly, such as Figure 14 (A) Divide the frame portion 5A as described in section A. Figure 15 In this manner, the division involves holding the frame portion 5A at one end in the first direction and the circuit board 17 adjacent to it in the first direction, which is sandwiched by the groove 11, and bending it along the groove 11. As a result, the thin-walled portion 23 between the frame portion 5A and the circuit board 17 breaks, and the frame portion 5A is divided.

[0075] The holding is performed along each column along the second direction, with the frame portion 5A, which is divided on one side, being held as a whole along the second direction, and the circuit board 17, which is adjacent to it in the first direction, being held in a concentrated manner on the other side.

[0076] Through the dividing frame portion 5A, the circuit board 17 located at one end in the first direction is joined in the second direction only through the joining portion 9 on the frame portion 5A located at the other end in the first direction.

[0077] In this state, such as Figure 14 (B) In this manner, the circuit board 17 located at one end of the assembly substrate 1 in the first direction is divided. This division is consistent with... Figure 14 (A) Similarly, the circuit board 17 at one end in the first direction and the circuit board 17 adjacent to it in the first direction are grasped and bent along the groove 11. As a result, the thin-walled portion 23 breaks and the circuit board 17 at one end in the first direction is divided.

[0078] The arrangement here is also carried out along each column of the second direction. Thus, the circuit board 17 located at one end in the first direction is divided into columns along the second direction. For example... Figure 14 (C) Thus, the multiple circuit boards 17 divided in this way are separated from the frame portion 5B and from each other by slits 7 in the second direction, so that individual circuit boards 17 that are separated from each other can be obtained.

[0079] By repeating the division process, all circuit boards 17 of the assembly substrate 1 can be separated and obtained.

[0080] As described above, the assembly substrate 1 of this embodiment includes: a product section 3 in which a plurality of circuit boards 17 are arranged side by side in a grid pattern in mutually intersecting first and second directions; a slit 7 extending through the thickness direction and extending in the first direction at least across the ends of the product section 3, cutting off adjacent circuit boards 17 in the second direction; a joining section 9 joining adjacent circuit boards in the second direction to each other in at least one end of the product section 3 in the first direction; and a groove 11 not extending through the thickness direction and extending in the second direction across the ends of the product section 3, forming thin walls between adjacent circuit boards 17 in the first direction and the joining section 9, as well as between adjacent circuit boards 17.

[0081] Therefore, the assembly substrate 1 can integrally process the circuit board 17 via the joining portion 9. Furthermore, in the assembly substrate 1, each circuit board 17 is connected only in the first direction via a groove 11, so each circuit board 17 can be easily obtained simply by breaking it at the groove 11. Therefore, the efficiency of obtaining individual circuit boards 17 from the assembly substrate 1, which is formed by arranging the circuit boards 17 in a grid pattern, can be improved.

[0082] The joint 9 is provided at each end of the product part 3 in the first direction along the second direction, so it is easier to process.

[0083] The manufacturing method of the substrate 1 forms a groove 11 after forming a slit 7 on the semi-finished product 27 having a product section 3, so that the burr B can be located in the slit 7 and can be easily removed through the slit 7.

[0084] In this embodiment, fluid F is sprayed onto the product section 3, thus reliably removing burrs B. In particular, the slit 7 gradually narrows in width toward the middle portion in the thickness direction of the product section 3, thereby increasing the flow rate and easily removing burrs B.

[0085] The method for manufacturing the circuit board 17 involves holding both sides of the groove 11 in the first direction of the assembly substrate 1, causing adjacent circuit boards 17 to break apart from the joint portion 9 and from each other. This allows for the division of individual circuit boards 17, making it easy to obtain individual circuit boards 17.

[0086] The holding is performed along each column along the second direction, so that the multiple circuit boards 17 arranged in columns along the second direction can be divided one by one by a single break.

[0087] [Example 2]

[0088] Figure 16This is a top view of the substrate assembly of Embodiment 2 of the present invention. Furthermore, the basic structure of Embodiment 2 is the same as that of Embodiment 1; therefore, the same symbols are used for corresponding components and repeated descriptions are omitted.

[0089] In this embodiment, the frame portion 5A at one end of the assembly substrate 1 in the first direction is cut off by the slit 7, and there is no continuous portion between adjacent circuit substrates 17 in the second direction at one end in the first direction. Everything else is the same as in Embodiment 1.

[0090] Figure 17 This is a top view of the substrate of a modified example of Embodiment 2. Figure 18 This is a top view of the substrate of another variation of Embodiment 2.

[0091] Figure 17 In a modified example, the frame portion 5A at one end in the first direction is omitted compared to embodiment 2. Figure 18 In a modified example, the frame portion 5A at both ends in the first direction is alternately provided with a connecting portion 9.

[0092] exist Figure 18 In a modified example, the slits 7 adjacent in the second direction cut off the frame portions 5A located at different ends in the first direction, separating them in the second direction. Thus, the connecting portions 9 connect a pair of circuit boards 17 adjacent in the second direction at each end in the first direction. In this embodiment, the circuit boards 17 have three rows in the second direction. Figure 18 The upper two columns are joined at one end in the first direction by a connecting portion 9, and the lower two columns are joined at the other end in the first direction by a connecting portion 9. Furthermore, the upper and lower circuit boards 17 are connected via... Figure 18 The circuit board 17 in the upper, lower and middle columns and the two connecting parts 9 are combined.

[0093] In these Examples 2 and their variations, the same effects as in Example 1 can be achieved.

[0094] [Symbol Explanation]

[0095] 1: Assembled substrate

[0096] 3: Product Department

[0097] 7: Slit

[0098] 9: Joint

[0099] 11: Slot

[0100] 13: Insulating substrate

[0101] 15: Circuit diagram

[0102] 17: Circuit board

[0103] 23: Thin-walled section

Claims

1. A composite substrate, characterized in that, have: In the product department, multiple circuit boards, each having a circuit pattern on an insulating substrate, are arranged side by side in a grid pattern in a first direction and a second direction that intersect each other. A slit that extends at least across the ends of the product portion in the first direction and penetrates in the thickness direction between the portions of the circuit boards that are adjacent to each other in the second direction of the product portion. A joining portion, wherein at least one end of the product portion in the first direction, will join the adjacent circuit boards in the second direction to each other; and The groove, which does not extend through the thickness direction, extends across the ends of the product portion in the second direction and is located between the adjacent circuit boards and the joint portion in the first direction and between adjacent circuit boards.

2. The integrated substrate according to claim 1, characterized in that, The aforementioned joint is disposed at each end of the aforementioned product portion in the aforementioned first direction along the aforementioned second direction.

3. A method for manufacturing an assembly substrate, the assembly substrate comprising: In the product department, multiple circuit boards, each having a circuit pattern on an insulating substrate, are arranged side by side in a grid pattern in a first direction and a second direction that intersect each other. A slit that extends at least across the ends of the product portion in the first direction and penetrates in the thickness direction between the portions of the circuit boards that are adjacent to each other in the second direction of the product portion. A joining portion, wherein at least one end of the product portion in the first direction, will join the adjacent circuit boards in the second direction to each other; and The groove, which does not extend through the thickness direction, extends across the ends of the product portion in the second direction and is located between the adjacent circuit boards and the joint portion in the first direction, as well as between adjacent circuit boards. The aforementioned method for manufacturing the substrate is characterized in that, The aforementioned slit and groove are formed for semi-finished products having the aforementioned product parts.

4. The method for manufacturing an assembly substrate according to claim 3, characterized in that, The groove is formed after the slit is formed.

5. The method for manufacturing an assembly substrate according to claim 3 or 4, characterized in that, For the aforementioned product department's jet fluid.

6. The method for manufacturing an assembly substrate according to claim 5, characterized in that, The slit gradually narrows in width as it moves toward the middle of the product section in the thickness direction.

7. A method for manufacturing a circuit board, which is a method for manufacturing a circuit board using an integrated substrate, wherein the integrated substrate comprises: In the product department, multiple circuit boards, each having a circuit pattern on an insulating substrate, are arranged side by side in a grid pattern in a first direction and a second direction that intersect each other. A slit that extends at least across the ends of the product portion in the first direction and penetrates in the thickness direction between the portions of the circuit boards that are adjacent to each other in the second direction of the product portion. A bonding portion, wherein at least one end of the product portion in the first direction, bonds the adjacent circuit boards in the second direction to each other; and The groove, which does not extend through the thickness direction, extends across the ends of the product portion in the second direction and is located between the adjacent circuit boards and the joint portion in the first direction, as well as between adjacent circuit boards. The method for manufacturing the aforementioned circuit board is characterized in that, The two sides of the groove are respectively held in the first direction, and the adjacent circuit boards and the joint portion are broken and the adjacent circuit boards are broken to each other.

8. The method for manufacturing a circuit board using the method for manufacturing an assembly substrate according to claim 7, characterized in that, The aforementioned holding is performed along each column in the second direction described above.

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