Ultrathin silica gel beauty mask and preparation method thereof

Abstract

The invention relates to the technical field of beauty masks, and discloses an ultrathin silica gel beauty mask and a preparation method thereof.The ultrathin silica gel beauty mask comprises a silica gel body layer, an FPC circuit layer and a transparent optical layer, and the FPC circuit layer is located between the silica gel body layer and the transparent optical layer to form a sandwich structure; the silica gel main body layer and the transparent optical layer are integrally injected and fused in a non-FPC circuit layer area through liquid silica gel to form a seamless sealed whole body, bridles are integrally formed on the two sides of the silica gel main body layer, the transparent optical layer comprises a protective layer, and a plurality of optical salient points are integrally formed on the side, not facing the FPC circuit layer, of the protective layer. According to the ultrathin silica gel beauty mask, the transparent optical layer and the silica gel main body layer are integrally fused in the peripheral area of the FPC circuit layer through a secondary injection molding process, a seamless sealed whole is formed, the service life of the ultrathin silica gel beauty mask is prolonged, and the problem that a traditional multi-layer attaching structure is prone to being damaged due to gaps is solved.

Description

Technical Field

[0001] This invention relates to the field of beauty mask technology, specifically to an ultra-thin silicone beauty mask and its preparation method. Background Technology

[0002] Phototherapy technology based on light-emitting diodes (LEDs) has been widely used in home beauty devices. Among them, photon beauty masks are a common product form. These devices use light of a specific wavelength to irradiate the facial skin to achieve a beauty effect that improves skin texture.

[0003] However, the current photon beauty masks on the market have general limitations in structural design and manufacturing process. Existing photon beauty masks are supported by a rigid or semi-rigid plastic shell, with a printed circuit board (PCB) or flexible circuit board (FPC) containing LED beads installed inside. In order to transmit light and improve wearing comfort, the surface of the circuit board is covered with a layer of transparent silicone pad and fixed to the user's head by a separate elastic strap. This multi-part, multi-level assembly structure directly leads to the following technical defects of photon beauty masks.

[0004] First, existing photon beauty masks employ a complex structure consisting of a rigid shell, circuit boards, and a covering silicone pad, resulting in a bulky and heavy product that causes noticeable pressure on the face and poor comfort. Second, in terms of optical performance, the limited physical size of traditional LED beads restricts their density on the mask, and the silicone pad is typically not optically designed. This leads to insufficient uniformity of light distribution on the skin, with areas of varying brightness between light-emitting points, affecting the phototherapy effect. Most importantly, this multi-component assembly and layered structure inherently creates gaps, making effective sealing difficult. Sweat or moisture during cleaning can easily seep in through these gaps, causing short circuits or component corrosion, resulting in a low level of protection and limiting the overall reliability and lifespan of the structure.

[0005] Therefore, this invention proposes an ultra-thin silicone beauty mask and its preparation method to overcome the shortcomings of the prior art. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides an ultra-thin silicone beauty mask and its preparation method, which solves the problems of existing photon beauty masks, such as heavy equipment, poor wearing experience, uneven light effects, poor overall sealing, and insufficient long-term circuit reliability, due to limitations in structural design, material selection, and manufacturing process.

[0007] To achieve the above objectives, the present invention provides the following technical solution: In a first aspect, the present invention provides an ultra-thin silicone beauty mask.

[0008] The basic structure of the ultra-thin silicone beauty mask consists of a sandwich structure made up of a silicone main body layer, an FPC circuit layer, and a transparent optical layer, from the outside in. Multiple micro LED light-emitting chips are arranged on the FPC circuit layer. The silicone main body layer and the transparent optical layer are not combined by simple adhesive or physical assembly, but are integrated by liquid silicone injection molding in the area around the FPC circuit layer. This forms a completely sealed whole without any physical gaps, which solves the problem of water and dust ingress caused by assembly gaps in traditional products. This improves the protection level of the ultra-thin silicone beauty mask. At the same time, flexible straps are directly integrally molded on both sides of the silicone main body layer, simplifying the structure and improving the convenience and overall feel of wearing it.

[0009] The ultra-thin silicone beauty mask features micro-sized optical bumps integrally molded on the outer surface of the transparent optical layer, on the side not facing the FPC circuit layer, corresponding to the position of each micro LED light-emitting chip. These optical bumps function similarly to a microlens array. When the circuit is turned on and the micro LED light-emitting chips are lit, the light emitted by the micro LED light-emitting chips is refracted as it penetrates the transparent optical layer and reaches the curved surface of the optical bumps. The direct result of the refraction effect is to expand the original beam angle of a single LED chip, allowing the light to diffuse outward at a wider angle. Since the LED chips on the FPC circuit layer are themselves arranged in a high density, adjacent light spots diffused by the optical bumps can achieve full overlap and fusion within a short distance. This design, through active optical path control, effectively eliminates the dark areas caused by the spacing between LED point sources, achieving uniform full-area illumination, with effects far superior to traditional diffuser plate solutions that rely on reflection.

[0010] To achieve the above structure, the present invention has also optimized the material selection and specific construction. The FPC circuit layer uses a special flexible substrate that is resistant to high temperature and folding. This ensures that the FPC circuit layer will not experience performance degradation when subjected to the high temperature injection molding process of liquid silicone. In the scenario of repeated wearing and bending by users, the conductive copper foil of the circuit is not prone to metal fatigue fracture, thus ensuring the long-term electrical reliability of the ultra-thin silicone beauty mask. The physical size of the micro LED light-emitting chip used is controlled to be less than 0.3 mm, which is a prerequisite for achieving high-density arrangement and ultra-thin design.

[0011] Preferably, in order to achieve precise positioning of the FPC circuit layer during the injection molding process, an embedding groove is pre-formed on the inner surface of the silicone body layer. The contour of the embedding groove matches the shape of the FPC circuit layer, and during the manufacturing process, the FPC circuit layer is first placed in the embedding groove.

[0012] Preferably, to ensure that the FPC circuit layer does not shift during the subsequent high-temperature and high-pressure liquid silicone injection molding process, a high-strength silicone adhesive is used to pre-bond and fix the FPC circuit layer inside the embedding groove. This pre-fixation is a key process step to ensure that the optical bumps and LED chips in the ultra-thin silicone beauty mask are aligned.

[0013] Preferably, to ensure safety and comfort in contact with the skin, the silicone body layer is made of medical-grade silicone. The white material helps to reflect some of the light transmitted through the FPC circuit layer back to the skin surface, thus playing an auxiliary role in improving light utilization efficiency.

[0014] Preferably, the specific optical structure of the optical bump can be designed according to the required light field distribution. It can be a standard convex lens structure, or an aspherical lens structure or Fresnel lens structure that can achieve more complex optical path control, in order to adapt to different cosmetic phototherapy needs.

[0015] Secondly, the present invention provides a method for preparing an ultra-thin silicone beauty mask.

[0016] The core of the manufacturing method for ultra-thin silicone beauty masks is to construct the aforementioned integrated sandwich structure through two independent injection molding processes combined with an intermediate positioning step. Specifically, this includes the following steps: First, the first injection molding process is performed. Liquid silicone raw material is injected into the first mold to form the silicone main body layer, which serves as the base of the mask, and the integrated straps connected to it, in one step. Preferably, in this step, the inner surface of the silicone body layer is simultaneously formed with an embedding groove for subsequently accommodating and positioning the FPC circuit layer.

[0017] Next, the FPC circuit layer is fixed. The FPC circuit layer, which has been soldered with multiple micro LED light-emitting chips, is placed in the preset position of the silicone body layer, that is, in the embedding groove. In order to prevent the FPC circuit layer from moving in subsequent processes, the FPC circuit layer is pasted and fixed on the silicone body layer by applying high-strength silicone adhesive, forming a semi-finished product to be packaged.

[0018] Then, a second injection molding process is performed, placing the semi-finished product into a second mold. The surface of the cavity of the second mold is precisely machined with microstructures corresponding to the shape of the optical bumps, i.e., recessed structures. Subsequently, liquid transparent silicone is injected into the second mold. During this process, the high-temperature and high-pressure liquid silicone flows through and completely covers the FPC circuit layer, encapsulating the FPC circuit layer as a whole. At the same time, the silicone fills the microstructure cavity of the mold, thereby integrally replicating and molding the optical bumps directly above each micro LED light-emitting chip. More importantly, the newly injected liquid transparent silicone will chemically or physically fuse with the silicone body layer as the base at the contact interface. After curing, the silicone body layer, FPC circuit layer, and transparent optical layer form a seamless whole. Thus, the mask body integrating circuitry and optical systems and possessing high sealing performance is completed.

[0019] Finally, the controller is electrically connected to the FPC circuit layer on the mask body via wires, completing the fabrication of the entire ultra-thin silicone beauty mask.

[0020] This invention provides an ultra-thin silicone beauty mask and its preparation method. It has the following beneficial effects: 1. This invention utilizes a secondary injection molding process to achieve integrated fusion of the transparent optical layer and the silicone body layer in the area surrounding the FPC circuit layer, forming a seamless, sealed whole. This completely encapsulates the FPC circuit layer, effectively preventing the intrusion of sweat, moisture, and dust, thus improving the product's protection level and reliability in humid environments. Consequently, it extends the lifespan of the ultra-thin silicone beauty mask and solves the problem of easy damage caused by gaps in traditional multi-layer bonding structures.

[0021] 2. This invention combines high-density arranged micro LED light-emitting chips with integrally formed optical bumps, which improves the uniformity of illumination. The optical bumps, as microlenses, can effectively expand the light-emitting angle of a single LED chip, enabling adjacent light spots to fully overlap and mix within a short distance. This eliminates the dark areas caused by the spacing between point light sources in traditional solutions, ensuring a uniform distribution of the light field irradiated on the skin surface.

[0022] 3. This invention adopts an integral silicone material and an integrated structural design, which reduces the weight of the ultra-thin silicone beauty mask. This ultra-thin and lightweight characteristic, combined with the soft and skin-friendly properties of silicone material itself, reduces the user's sense of weight and pressure when wearing it. At the same time, the strap structure integrally formed with the ultra-thin silicone beauty mask simplifies the wearing method, and together improves the user's overall comfort. Attached Figure Description

[0023] Figure 1 This is a perspective view of the present invention; Figure 2 This is an exploded view of the present invention; Figure 3 This is a schematic diagram of the silicone body layer in this invention; Figure 4 This is a schematic diagram of the transparent optical layer in this invention; Figure 5 This is a schematic diagram of the FPC circuit in this invention; Figure 6 This is a flowchart of the method in this invention.

[0024] Legend 1. Silicone body layer; 11. Base layer; 12. Embedding groove; 2. FPC circuit layer; 21. Transparent flexible circuit board; 22. Micro LED light-emitting chip; 3. Transparent optical layer; 31. Protective layer; 32. Optical bumps; 4. Strap; 5. Controller; 6. Wire. Detailed Implementation

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see the appendix Figure 1 To be continued Figure 3 The ultra-thin silicone beauty mask provided in this embodiment includes a silicone body layer 1, an FPC circuit layer 2 and a transparent optical layer 3. The FPC circuit layer 2 is located between the silicone body layer 1 and the transparent optical layer 3, forming a sandwich structure. Among them, the parameters of the lens optical layer 3 are: light transmittance greater than 95%, light emission angle of 120 degrees to 160 degrees, hardness of 20-30, and platinum catalytic process to resist yellowing; the substrate of the FPC circuit layer 2 is glue-free rolled copper process, with an overall thickness of less than 0.2 mm and a complete radius of less than 2 mm.

[0027] The silicone body layer 1 and the transparent optical layer 3 are fused together in the non-FPC circuit layer 2 area by liquid silicone injection molding to form a seamless sealed whole. The silicone body layer 1 has straps 4 integrally formed on both sides. The transparent optical layer 3 includes a protective layer 31. The protective layer 31 has multiple optical bumps 32 integrally formed on the side not facing the FPC circuit layer 2. The FPC circuit layer 2 is electrically connected to the controller 5 through wires 6.

[0028] The silicone body layer 1 includes a base layer 11, and an embedding groove 12 is provided on the inner side of the base layer 11.

[0029] The FPC circuit layer 2 includes a transparent flexible circuit board 21, on which multiple micro LED light-emitting chips 22 are uniformly soldered in a matrix on the side facing the transparent optical layer 3.

[0030] The core lies in an innovative sandwich composite structure and an integrated optical system. The ultra-thin silicone beauty mask consists of a silicone main body layer 1, an FPC circuit layer 2, and a transparent optical layer 3. The FPC circuit layer 2 is completely sandwiched and sealed between the silicone main body layer 1 and the transparent optical layer 3. The overall structure is designed with a thickness of less than 1.5 mm and a total weight of less than 50 grams, thus achieving the product's ultra-thinness and lightweight design.

[0031] The silicone body layer 1 is the base layer 11 that comes into direct contact with the user's facial skin. In this embodiment, the silicone body layer 1 is made of medical-grade liquid silicone rubber through a precision injection molding process. The use of medical-grade materials ensures the excellent biocompatibility of the silicone body layer 1, avoids adverse reactions such as skin allergies in users, and ensures the safety of use. The softness and elasticity of the silicone material itself enable the silicone body layer 1 to form a three-dimensional curved surface that conforms to the facial contours of most users, so that it can fit closely to the skin without any foreign body sensation when worn.

[0032] The silicone body layer 1 is designed to be white, and its function is not limited to aesthetics. The white material has a high reflectivity to visible light. When the light source on the FPC circuit layer 2 emits light, some of the light that penetrates the FPC circuit layer 2 or is scattered between the layers will be reflected back to the skin by the inner surface of the silicone body layer 1. This improves the efficiency of light energy utilization to a certain extent.

[0033] It is worth noting that the straps 4 used for fixing on both sides of the ultra-thin silicone beauty mask are not connected to the mask body by traditional buckles or adhesives. Instead, they are integrally molded with the silicone body layer 1 during the first injection molding process of manufacturing the silicone body layer 1. This design eliminates the need for subsequent assembly processes, resulting in no connection gaps between the straps 4 and the ultra-thin silicone beauty mask. This results in higher structural strength and avoids the risk of breakage at the connection point of the traditional straps 4. The straps 4 themselves are also made of silicone material, which has good elasticity, allowing users to easily stretch and wear them.

[0034] For the subsequent positioning of the FPC circuit layer 2, an embedding groove 12 that matches the outline of the FPC circuit layer 2 is integrally formed on the inward side of the silicone body layer 1. The depth of the embedding groove 12 is slightly greater than the thickness of the FPC circuit layer 2, providing a physical reference for the accommodation and fixation of the FPC circuit layer 2.

[0035] FPC circuit layer 2 is the core component for realizing the phototherapy function. Unlike the ordinary FPC or rigid PCB used in traditional beauty masks, the FPC circuit layer 2 in this embodiment uses a special high-temperature resistant, foldable, transparent flexible circuit board 21. The substrate of FPC circuit layer 2 is transparent polyimide. This material has a high glass transition temperature and can withstand the secondary injection molding temperature of liquid silicone exceeding 150°C without warping, delamination, or performance degradation. Its conductive layer uses high-purity rolled copper foil, which has better resistance to bending fatigue than electrolytic copper foil. This ensures that the circuit is not easily broken during repeated wearing, bending, and storage of the ultra-thin silicone beauty mask, thus guaranteeing the long-term electrical reliability of the ultra-thin silicone beauty mask.

[0036] On the surface of the FPC circuit layer 2, a large number of micro LED light-emitting chips 22 are soldered using automated surface mount technology. These micro LED light-emitting chips 22 are bare wafers that are not encapsulated with traditional epoxy resin or silicone lenses. The physical size of the micro LED light-emitting chips 22 is small. The selected micro LED light-emitting chips 22 have a size of 0.254 mm × 0.254 mm, which is smaller than conventional surface mount LED beads.

[0037] This miniaturized design brings two key advantages: First, it enables a high-density arrangement of light sources, allowing for a far greater number of light-emitting units than traditional solutions to be arranged within a limited mask area. For example, 400 micro LED light-emitting chips 22 are evenly arranged in a matrix on the mask. This high-density point light source layout is the physical basis for achieving subsequent high uniformity illumination. Second, it reduces the overall thickness of the FPC circuit layer 2, which is one of the key factors in achieving an ultra-thin mask.

[0038] These micro LED light-emitting chips 22 can be combined with different wavelengths according to beauty needs, such as red light, blue light, and near-infrared light. Through the circuit design on the FPC circuit layer 2, the external controller 5 controls the micro LED light-emitting chips 22 to light up independently or in combination, realizing a variety of phototherapy modes.

[0039] The transparent optical layer 3 covers the FPC circuit layer 2, serving the dual purpose of protecting the internal circuit and realizing secondary optical design. The transparent optical layer 3 is made of medical-grade liquid silicone rubber with high light transmittance through a second injection molding process. The high light transmittance of the material ensures that the light energy emitted by the micro LED light-emitting chip 22 can be transmitted with minimal loss.

[0040] Please see the appendix Figure 4 To be continued Figure 5At the top of each micro LED chip 22, there is a precision optical bump 32 integrally formed. These optical bumps 32 are micro convex lenses in structure, and their curvature, height and other parameters have been precisely optically designed.

[0041] The micro LED light-emitting chip 22 itself has an original light-emitting angle, such as Lambertian light emission, with a typical beam angle of about 120°. When these light rays pass through the flat FPC circuit layer 2 substrate and the transparent optical layer 3 and reach the curved surface of the optical bump 32, the light path will be refracted due to the difference in refractive index between silicone and air. According to the lens imaging principle, the micro convex lens structure of this optical bump 32 will have a diverging effect on the light beam, thereby effectively expanding the beam angle of the emitted light. In this embodiment, by optimizing the radius of curvature of the optical bump 32, the original 120° beam angle can be expanded to more than 160°.

[0042] This expansion of the beam angle allows the light spots emitted by two adjacent high-density arranged micro LED light-emitting chips 22 to begin overlapping and merging within a very short propagation distance. The final effect is that, at a position very close to the mask surface, i.e. the user's skin surface, the light from different micro LED light-emitting chips 22 has been mixed very evenly, eliminating the light spots or dark areas caused by the spacing of point light sources, and achieving uniform and soft facial illumination across the entire area. This design, which integrates micro optical elements with the protective layer 31, solves the problems of increased thickness, light loss, and complex assembly caused by the reliance on additional diffuser plates in traditional solutions.

[0043] In this embodiment, the optical bump 32 is a spherical convex lens structure. In other embodiments, according to the higher requirements for light field distribution, the optical bump 32 can also be designed as an aspherical lens structure to correct spherical aberration and achieve more precise light control; or it can be designed as a Fresnel lens structure to further reduce the height of the bump while achieving the same optical effect, making the outer surface of the mask smoother.

[0044] Another innovation of this invention lies in the sealing structure. The transparent optical layer 3 and the silicone body layer 1 are not bonded together with glue. Instead, during the second injection molding process, the high-temperature flowing liquid transparent silicone fills the mold cavity and covers the FPC circuit layer 2. At the same time, the edge part will directly contact the edge area of ​​the already cured silicone body layer 1. Under high temperature and high pressure, the two homogeneous silicone materials will fuse at the molecular level or form physical bonds. After curing, a seamless and completely integrated sealed whole is formed.

[0045] This secondary injection molding process creates a sealed chamber for the entire ultra-thin silicone beauty mask, completely isolating the internal FPC circuit layer 2 and all electronic components from the external environment. This structure eliminates the possibility of moisture, sweat, dust, etc., entering through structural gaps. Therefore, the ultra-thin silicone beauty mask can achieve an IP67 or even higher industrial protection rating, meaning it is completely dustproof and can be immersed in water for a short time without damage. This improves the durability and reliability of the ultra-thin silicone beauty mask, allowing users to use it with confidence after sweating during exercise, and even wash it directly with water. This is something that traditional multi-part assembled beauty masks cannot match.

[0046] The ultra-thin silicone beauty mask is electrically connected to a controller 5 via a flexible wire 6. The controller 5 contains a power management circuit, a microcontroller unit, and a user interface. By operating the controller 5, the user can select different light therapy modes, adjust the light intensity, and set the usage time. In other embodiments, the controller 5 can also be replaced by a micro battery and a wireless Bluetooth control module built into the ultra-thin silicone beauty mask, which can be controlled via a mobile APP to achieve wireless operation.

[0047] Please see the appendix Figure 6 The preparation method of the ultra-thin silicone beauty mask provided in this embodiment includes the following steps: Step S1: Molding the bottom silicone body layer 1 and the strap 4.

[0048] This step is the first injection molding. First, a precision first mold is designed and manufactured. The cavity shape of the first mold defines the three-dimensional curved surface of the silicone body layer 1, the shape of the integrated strap 4, and the embedding groove 12 for positioning the FPC circuit layer 2.

[0049] The pre-prepared medical-grade liquid white silicone rubber raw material is pumped to the mold gate through the screw pump of the injection molding machine. Under the set temperature, such as 130℃-150℃ and pressure, the liquid silicone fills the entire mold cavity. After a period of pressure holding and vulcanization curing, once the silicone is completely cured, the first mold is opened and the molded part is taken out. This molded part is the semi-finished product that integrates the mask silicone main body layer 1, the strap 4 and the embedding groove 12.

[0050] Step S2: Fix FPC circuit layer 2.

[0051] This step is to ensure the quality of the ultra-thin silicone beauty mask. First, prepare a high-temperature and foldable FPC circuit layer 2 that has been completed with SMT patching, soldered with all micro LED light-emitting chips 22, and passed electrical testing.

[0052] Then, inside the embedding groove 12 of the silicone body layer 1 obtained in step S1, a layer of high-strength silicone adhesive is uniformly coated by automatic dispensing equipment or manually. In this embodiment, a single-component room temperature curing silicone adhesive of model K-780 is selected. This adhesive has a moderate viscosity (about 15000cps), is easy to apply, and has a wide temperature resistance range (-60℃ to 260℃). The adhesive layer formed after curing can withstand the high temperature of subsequent secondary injection molding.

[0053] The FPC circuit layer 2 is precisely aligned and placed into the adhesive-coated embedding groove 12. It is then gently pressed to ensure full contact between the FPC circuit layer 2 and the embedding groove 12. Subsequently, the adhesive is allowed to initially cure at room temperature or under slight heating conditions until the FPC circuit layer 2 is fixed in the predetermined position, forming a semi-finished product to be packaged.

[0054] This pre-fixing step effectively resists the impact and buoyancy generated on the FPC circuit layer 2 during the subsequent flow of liquid silicone, preventing any slight displacement of the FPC circuit layer 2, thereby ensuring that each optical bump 32 in the ultra-thin silicone beauty mask can be precisely aligned with the micro LED light-emitting chip 22 below.

[0055] Step S3: Secondary injection molding encapsulation of transparent optical layer 3 and optical structure. First, a more precise second mold is designed and manufactured. A key feature of the second mold is that, on the corresponding surface of the cavity of the second mold, micro-recessed structures corresponding to the optical bumps 32 are made in a matrix arrangement through ultra-precision machining (such as diamond turning, electrical discharge machining, etc.) or mold core inlay. The dimensional accuracy and surface finish of these recessed structures directly determine the optical performance of the final optical bumps 32.

[0056] The semi-finished product obtained in step S2 is accurately loaded into the cavity of the second mold. After the mold is closed, medical-grade liquid transparent silicone rubber material with high light transmittance is injected into the closed cavity of the mold using an injection molding machine.

[0057] During the injection molding process, high-temperature (e.g., 150℃-170℃) liquid transparent silicone completely covers and encapsulates the FPC circuit layer 2, filling all the tiny gaps and forming a dense insulating layer. At the same time, the silicone fills the micro-recessed structures on the mold, thereby integrally forming an array of optical bumps 32 directly above the FPC circuit layer 2. During this process, the edge of the flowing liquid transparent silicone comes into contact with and fuses with the edge of the silicone body layer 1 in the semi-finished product, forming the aforementioned seamless sealing structure.

[0058] After pressure holding and vulcanization (curing), the mold is opened and the product is taken out. What is obtained at this time is an ultra-thin silicone beauty mask that integrates circuitry, optical systems and has high sealing performance.

[0059] Step S4: Subsequent assembly.

[0060] The connection terminals leading out from the FPC circuit layer 2 of the mask body are connected to the wires 6 of the controller 5 by soldering or using a special connector. The connection is insulated and stress-relieved, for example, by using heat shrink tubing or adhesive sealing.

[0061] Finally, a comprehensive functional test was conducted on the finished product, including the lighting status of the micro LED light-emitting chips 22 in various modes, light uniformity detection, controller function verification, and cleaning and packaging. At this point, the entire manufacturing process of the ultra-thin silicone beauty mask was completed.

Claims

1. An ultra-thin silicone cosmetic mask, characterized in that, It comprises a silica gel main body layer (1), an FPC circuit layer (2) and a transparent optical layer (3), the FPC circuit layer (2) is located between the silica gel main body layer (1) and the transparent optical layer (3), forming a sandwich structure; The silica gel main body layer (1) and the transparent optical layer (3) are integrally injection molded and fused in the non-FPC circuit layer (2) area by liquid silica gel, forming a seamless sealed whole, the two sides of the silica gel main body layer (1) are integrally formed with a belt (4); The transparent optical layer (3) comprises a protective layer (31), the side of the protective layer (31) not facing the FPC circuit layer (2) is integrally formed with a plurality of optical convex points (32), and the FPC circuit layer (2) is electrically connected with a controller (5) through a wire (6).

2. The ultra-thin silicone cosmetic mask according to claim 1, wherein, The silica gel main body layer (1) comprises a base layer (11), and an embedded groove (12) is arranged on the inner side of the base layer (11).

3. The ultra-thin silicone cosmetic mask of claim 1, wherein, The FPC circuit layer (2) comprises a transparent flexible circuit board (21), and a plurality of micro LED light emitting chips (22) are uniformly welded in a matrix form on the side of the transparent flexible circuit board (21) facing the transparent optical layer (3).

4. The ultra-thin silicone cosmetic mask of claim 2, wherein, The silica gel main body layer (1) is made of medical grade silica gel by injection molding.

5. The ultra-thin silicone cosmetic mask of claim 3, wherein, The FPC circuit layer (2) is made of a material resistant to high temperature and folding, and the size of the micro LED light emitting chip (22) is less than 0.3mm.

6. The ultra-thin silicone cosmetic mask of claim 3, wherein, The number of the optical convex points (32) corresponds to the number of the micro LED light emitting chips (22), and the optical convex points (32) are one of convex lens structure, aspheric lens structure or Fresnel lens structure.

7. A method for preparing an ultra-thin silicone cosmetic mask, characterized in that, It comprises the following steps: S1, using the first injection molding process, silica gel raw materials are injected into the first mold, and the silica gel main body layer (1) and the two side belts (4) are integrally formed; S2, the FPC circuit layer (2) with a plurality of micro LED light emitting chips (22) welded is fixed in the preset position of the silica gel main body layer (1), forming a semi-finished product; S3, the semi-finished product is placed in a second mold with an optical microstructure cavity, and a second injection molding process is adopted to inject transparent silica gel into the second mold to cover the FPC circuit layer (2); At the same time of covering and packaging the FPC circuit layer (2), the optical convex points (32) are integrally formed above each micro LED light emitting chip (22), and the transparent optical layer (3) and the silica gel main body layer (1) are fused into a sealed whole to form a face shield main body, and an ultra-thin silica gel beauty face shield is obtained.

8. The method of claim 7, wherein the method further comprises the step of: 8-1) applying a thin layer of a cosmetic material on the surface of the ultra-thin silicone mask. In the S1 step, the inner side surface of the silica gel main body layer (1) is integrally formed with an embedded groove (12) for accommodating and positioning the FPC circuit layer (2).

9. The method of claim 8, wherein the method further comprises the step of: 9-1) applying a thin layer of a cosmetic material on the surface of the super thin silicone mask. In the S2 step, the FPC circuit layer (2) is fixed by coating high-strength silica gel adhesive in the embedded groove (12) to paste and fix the FPC circuit layer (2).

10. The method for preparing an ultra-thin silicone beauty mask according to claim 7, characterized in that, In the S3 step, the optical microstructure cavity in the second mold is a recess structure corresponding to the optical convex points (32).

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