A semiconductor wafer wire sawing apparatus and method for uniform surface compressive stress

Abstract

The application relates to the field of wafer semiconductor slice cutting, in particular to a semiconductor slice steel wire cutting device and method with uniform surface compressive stress, which comprises a semiconductor slice cutting steel wire with uniform surface compressive stress along the circumference, through the setting of the positioning disc and the micro-calibration disc sector structure of the multistage calibrator, the first calibration scale, the second calibration scale and the corresponding calibration head, accurate correction between straighteners is realized, micro-change errors after long-time use or repeated use are avoided, the surface tensile stress of the steel wire is changed into surface compressive stress with uniformity in the process, the abrasion of the steel wire in the wafer slicing process is reduced, and therefore the quality of wafer slicing is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer semiconductor slice cutting, in particular to a semiconductor slice steel wire cutting device and method with uniform surface compressive stress. BACKGROUND

[0002] In semiconductor processing, it is necessary to process a crystal bar into a wafer. The cutting steel wire used for wafer slicing currently generally has surface tensile stress. In the production process of traditional cutting steel wire, the steel wire is continuously thinned through cold drawing. When the steel wire is deformed by drawing, the surface temperature of the steel wire is higher than the internal temperature due to contact friction with the die. Therefore, the steel wire after typical drawing must have surface tensile stress.

[0003] The document with publication number CN112676484A provides a semiconductor slice cutting steel wire with uniform surface compressive stress and a preparation method thereof. The cutting steel wire is repeatedly stressed and bent in multiple circumferential directions to obtain uniform surface compressive stress along the circumference. The cutting steel wire with uniform surface compressive stress is obtained by repeatedly stressing and bending the cutting steel wire in multiple circumferential directions. The multiple different direction layout straighteners are at least four, and the straighteners are four, sequentially being a first straightener, a second straightener, a third straightener, and a fourth straightener. The first straightener and the second straightener are perpendicularly orthogonal. The second straightener and the third straightener are crosswise arranged at 45°. The third straightener and the fourth straightener are perpendicularly orthogonal.

[0004] In summary, in the prior art, there is a lack of correction structure between each straightener. The straightener needs to be corrected to avoid errors caused by micro changes after long-term use or repeated use. At the same time, multiple straighteners cannot quickly determine and adjust the relative position according to the demand when combined, and need to be repeatedly disassembled, which is troublesome. In the process of processing, the number of straighteners may be insufficient or excessive due to changes in distance, which cannot be adjusted and has poor flexibility. SUMMARY

[0005] The present application relates to the field of wafer semiconductor slice cutting, in particular to a semiconductor slice steel wire cutting device and method with uniform surface compressive stress.

[0006] In order to achieve the above object, the technical scheme adopted by the present application is as follows: a semiconductor wafer steel wire cutting device with uniform surface compressive stress, comprising a semiconductor wafer cutting steel wire with uniform surface compressive stress along the circumference, comprising straighteners A, B, C and D, characterized in that: a plurality of calibrators are arranged between the straighteners A, B, C and D.

[0007] The plurality of calibrators comprise a connector plate A arranged on one side of the straightener A, a positioning disc rotatably arranged outside the connector plate A, and the positioning disc is internally provided with a hollow structure.

[0008] The positioning disc is internally provided with a micro-calibration disc, and the micro-calibration disc is fixedly arranged on the outer wall of the adjacent straightener B.

[0009] The micro-calibration disc and the positioning disc are both provided with a plurality of sector structures, and the number of sector leaves is three.

[0010] The outer wall of the sector leaf of the positioning disc is fixedly provided with a first calibration scale, the outer wall of the micro-calibration disc is fixedly provided with a first calibration head, and the first calibration head corresponds to the first calibration scale.

[0011] The outer wall of the sector leaf of the positioning disc is also fixedly provided with a second calibration scale, the outer wall of the connector plate A is fixedly provided with a second calibration head, and the second calibration scale corresponds to the second calibration head.

[0012] One of the sector leaves of the micro-calibration disc is provided with an incomplete worm gear, the outer wall of the incomplete worm gear is meshed with a worm, the worm is rotatably arranged inside the positioning disc, the cylindrical end of the worm extends out of the positioning disc and is fixedly provided with a handle.

[0013] A positioning rotating groove is formed in the outer wall of the connector plate A, the positioning disc is rotatably arranged inside the positioning rotating groove, a first bevel gear A is coaxially fixedly arranged in the middle of the positioning disc, the first bevel gear A is arranged inside the driving cavity formed in the connector plate A, the outer wall of the first bevel gear A is meshed with a second bevel gear B, the shaft of the second bevel gear B extends to the outside and is fixedly provided with a positioning handle.

[0014] Preferably, a fixed distance arm is fixedly arranged on the outer wall of the connector plate A, the fixed distance arm is slidably arranged inside the sliding groove formed on one side of the straightener A, a threaded groove A is formed in the inside of the fixed distance arm, a fixed distance screw rod is threadedly arranged inside the threaded groove A, one end of the fixed distance screw rod extends to the outside and is fixedly provided with a third bevel gear C, the outer wall of the third bevel gear C is meshed with a fourth bevel gear D, the shaft of the fourth bevel gear D extends to the outside and is fixedly provided with a fixed distance handle.

[0015] Preferably, one side of the straightener A, the straightener B, the straightener C and the straightener D is provided with a straightening shaft through a fixing frame, the outer wall of the straightening shaft is fixedly provided with a displacement block, the displacement block is slidingly arranged in a displacement groove in the outer wall of the fixing frame, a threaded groove B is formed in the middle of the displacement block, and a hexagonal socket head cap screw is threadedly arranged in the threaded groove B and extends from the surface of the fixing frame.

[0016] By the positioning disc of the multi-stage calibrator, the micro-calibration disc fan structure, the first calibration scale, the second calibration scale and the corresponding calibration head, the accurate correction between the straighteners is realized, the micro-change error after long-term use or repeated use is avoided, the surface tensile stress of the steel wire is changed into the uniform surface compressive stress in the process, the abrasion of the steel wire in the wafer slicing process is reduced, and therefore the quality of wafer slicing is improved.

[0017] Preferably, the method comprises the following steps:

[0018] S1, preparing a plurality of straighteners required;

[0020] S2, during preparation, the straightener A, the straightener B, the straightener C and the straightener D are arranged in sequence, and the positioning disc is positioned in the rotating adjusting disc of the connector plate A through the positioning handle to realize the angle positioning.

[0021] S3, at this time, the rotating handle can drive the micro-calibration disc to swing for small-angle fine adjustment, and then the position of the fixed arm is adjusted for positioning to ensure the tightness.

[0022] S4, at this time, the steel wire is placed in the straightener A and the straightener D at both ends, the position of the displacement block is adjusted through the adjustment of the hexagonal socket head cap screw, the semiconductor wafer slicing steel wire with uniform surface compressive stress along the circumference is obtained, and the bending deformation is obtained through repeated stress in multiple directions along the circumference, so that the uniform surface compressive stress along the circumference is obtained.

[0023] Compared with the prior art, the present application has the following beneficial effects:

[0024] 1. By the positioning disc of the multi-stage calibrator, the micro-calibration disc fan structure, the first calibration scale, the second calibration scale and the corresponding calibration head, the accurate correction between the straighteners is realized, the micro-change error after long-term use or repeated use is avoided, the surface tensile stress of the steel wire is changed into the uniform surface compressive stress in the process, the abrasion of the steel wire in the wafer slicing process is reduced, and therefore the quality of wafer slicing is improved.

[0025] 2. By the positioning disc rotating adjustment, the micro-calibration disc swinging adjustment and the fixed arm sliding adjustment linkage mechanism, the relative position is quickly determined and adjusted, without repeated disassembly, especially for more straighteners, the operation efficiency is improved.

[0025] 3、The scheme is aimed at the problem of insufficient or excessive straightener number and poor flexibility caused by distance change in the processing process. The continuous adjustable distance between straighteners is realized through the thread adjustment of the distance arm and the fixed wire rod, and the thread cooperation of the displacement block and the internal hexagonal bolt, the number adaptation problem of "adding one more and subtracting one less" is solved, the flexibility of the preparation process is enhanced, and finally the semiconductor wafer cutting steel wire with uniform surface compressive stress along the circumference is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a whole structure schematic diagram of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0027] Figure 2 It is an exploded view of the whole structure of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0028] Figure 3 It is a positioning disc and micro-calibration disc structure schematic diagram of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0029] Figure 4 It is an enlarged view of the structure at A of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0030] Figure 5 It is an exploded view of the multi-stage calibrator structure of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0031] Figure 6 It is an enlarged view of the structure at B of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0032] Figure 7 It is a multi-stage calibrator partial structure exploded view of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0033] Figure 8 It is a straightening shaft related structure exploded view of the semiconductor wafer steel wire cutting device and method with uniform surface compressive stress.

[0034] The diagram shows: 1. Straightener A; 2. Straightener B; 3. Straightener C; 4. Straightener D; 5. Multi-stage calibrator; 51. Connector board A; 52. Positioning plate; 53. Micro-calibration plate; 54. Connector board B; 501. First calibration scale; 502. First calibration head; 503. Second calibration scale; 504. Second calibration head; 6. Incomplete worm gear; 61. Worm; 62. Calibration handle; 601. Fixed... 602. Positioning slot; 603. Drive cavity; 604. First bevel gear A; 605. Second bevel gear B; 606. Positioning handle; 7. Spacer arm; 71. Slide groove; 72. Settling screw; 73. Threaded groove A; 74. Third bevel gear C; 75. Fourth bevel gear D; 76. Spacer handle; 8. Fixing bracket; 81. Straightening shaft; 82. Displacement block; 83. Displacement groove; 84. Socket headstock bolt; 85. Threaded groove B. Detailed Implementation

[0035] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0036] like Figure 1 , Figure 2 The invention discloses a semiconductor slicing wire cutting device and method with uniform surface compressive stress, comprising a semiconductor slicing wire having uniform surface compressive stress along the circumference, including straighteners A1, B2, C3, and D4. Multiple-stage calibrators 5 are provided between each of the straighteners A1, B2, C3, and D4. By using multiple-stage calibrators 5 as connection and correction units between the straighteners, these calibrators perform intermediate calibration during wire preparation, thus solving the problem of the lack of correction structures between straighteners in existing technologies. This ensures that after long-term or repeated use, the straighteners can be corrected for errors through the multiple-stage calibrators 5, avoiding accuracy degradation caused by the accumulation of micro-changes.

[0037] like Figure 2 , Figure 5 As shown, the multi-stage calibrator 5 includes a connector plate A51 disposed on one side of the straightener A1, and a positioning disk 52 is rotatably disposed on the outer side of the connector plate A51. The positioning disk 52 has a hollow structure inside.

[0038] The positioning disc 52 is internally provided with a swing setting micro calibration disc 53, the micro calibration disc 53 is fixedly arranged on the outer wall of the connector plate B54 of the adjacent straightener B2, the positioning disc 52 is swingly arranged in the hollow structure of the positioning disc 52, the micro calibration disc 53 is fixedly arranged on the outer wall of the connector plate B54 of the adjacent straightener B2, the positioning disc 52 and the micro calibration disc 53 form a double-layer adjustable structure, the connector plate A51 and the connector plate B54 are connected by adjusting the relative position, and the accurate correction function between the straighteners is realized, and the structure basis for the corresponding calibration scale and calibration head is provided.

[0039] As shown in Figure 3 , the micro calibration disc 53 and the positioning disc 52 are provided with a plurality of sector structures, and the sector leaves are three, the micro calibration disc 53 and the positioning disc 52 are provided with three sector structures, the sector structure divides the circumferential calibration area into three independent adjustable sectors, the sector calibration dimension is a certain range, the calibration flexibility is enhanced, and the relative position is quickly determined and locally fine adjusted.

[0040] As shown in Figure 3 , the outer wall of the sector leaf of the positioning disc 52 is fixedly provided with a first calibration scale 501, the outer wall of the micro calibration disc 53 is fixedly provided with a first calibration head 502, and the first calibration head 502 corresponds to the first calibration scale 501.

[0041] The outer wall of the sector leaf of the positioning disc 52 is also fixedly provided with a second calibration scale 503, the outer wall of the connector plate A51 is fixedly provided with a second calibration head 504, the second calibration scale 503 corresponds to the second calibration head 504, the first calibration head 502 and the first calibration scale 501 are matched to realize the accurate angle positioning of the micro calibration disc 53 relative to the positioning disc 52, the second calibration head 504 and the second calibration scale 503 are matched to realize the accurate angle positioning of the positioning disc 52 relative to the connector plate A51, the calibration accuracy is improved, and the accuracy of the relative position between the straighteners is ensured by the double-scale-calibration head corresponding mechanism.

[0042] As shown in Figure 5 , Figure 6 , one of the outer walls of the sector leaf of the micro calibration disc 53 is provided with an incomplete worm gear 6, the outer wall of the incomplete worm gear 6 is engaged with a worm 61, the worm 61 is rotatably arranged in the positioning disc 52, the cylindrical end of the worm 61 extends out of the positioning disc 52 and is fixedly provided with a handle 62, the handle 62 is rotated to drive the worm 61 to rotate, and then the incomplete worm gear 6 and the micro calibration disc 53 are swingly adjusted, the micro calibration disc 53 is fine adjusted, the transmission ratio of the worm gear and the worm is used to realize the accurate adjustment of the small angle, and the locking behavior after adjustment is ensured.

[0043] As Figure 7 shown, the connector plate A51 outer wall is provided with a positioning rotation groove 601, the positioning disc 52 is rotationally arranged in the positioning rotation groove 601, the first bevel gear A603 is coaxially fixedly arranged in the middle of the positioning disc 52, the first bevel gear A603 is arranged in the driving cavity 602 arranged in the inside of the connector plate A51, the second bevel gear B604 is meshed and connected to the outer wall of the first bevel gear A603, the shaft of the second bevel gear B604 extends to the outside and is fixedly provided with a positioning handle 605, rotating the positioning handle 76 drives the bevel gear set to rotate, and then drives the positioning lead screw 72 to rotate, rotating the positioning handle 605 drives the second bevel gear B604 to rotate, and then drives the first bevel gear A603 and the positioning disc 52 to rotate and adjust in the positioning rotation groove 601, so that the positioning disc 52 is adjusted in a wide range of angle, and the wide range and fine adjustment of the relative position between the straighteners is realized by the fine adjustment function of the micro-adjusting disc 53.

[0044] As Figure 7 shown, the connector plate A51 outer wall is provided with a positioning rotation groove 601, the positioning disc 52 is rotationally arranged in the positioning rotation groove 601, the first bevel gear A603 is coaxially fixedly arranged in the middle of the positioning disc 52, the first bevel gear A603 is arranged in the driving cavity 602 arranged in the inside of the connector plate A51, the second bevel gear B604 is meshed and connected to the outer wall of the first bevel gear A603, the shaft of the second bevel gear B604 extends to the outside and is fixedly provided with a positioning handle 605, rotating the positioning handle 76 drives the bevel gear set to rotate, and then drives the positioning lead screw 72 to rotate, rotating the positioning handle 605 drives the second bevel gear B604 to rotate, and then drives the first bevel gear A603 and the positioning disc 52 to rotate and adjust in the positioning rotation groove 601, so that the positioning disc 52 is adjusted in a wide range of angle, and the wide range and fine adjustment of the relative position between the straighteners is realized by the fine adjustment function of the micro-adjusting disc 53.

[0045] As Figure 8 shown, the straightener A1, the straightener B2, the straightener C3 and the straightener D4 are provided with a straightening shaft 81 through a fixed frame 8 on one side, the displacement block 82 is fixedly arranged on the outer wall of the straightening shaft 81, the displacement block 82 is slidingly arranged in the displacement groove 83 on the outer wall of the fixed frame 8, the screw groove B85 is arranged in the middle of the displacement block 82, the internal hexagonal bolt 84 is threadedly arranged in the screw groove B85, the internal hexagonal bolt 84 extends from the surface of the fixed frame 8, the displacement block 82 is slidingly pushed along the displacement groove 83 by adjusting the rotation of the internal hexagonal bolt 84, and then the position of the straightening shaft 81 is adjusted, so that the position of the straightening shaft 81 is flexibly adjusted, the spacing adjustment function of the distance arm 7 is further improved, the flexibility of the preparation process is further improved, and the uniformity of the surface pressure stress of the steel wire is ensured.

[0046] As Figures 1-7 shown, specifically comprising the following steps:

[0047] S1, prepare the required number of straighteners;

[0048] S2, when preparing, arrange the straighteners A1, B2, C3 and D4 in sequence, and realize the rotational adjustment of the positioning disc 52 in the rotating groove 601 on the outer wall of the connector plate A51 by the positioning handle 605 to position the angle;

[0049] S3, at this time, the rotational adjustment handle 62 can drive the micro-adjusting disc 53 to swing for small-angle fine adjustment, and further adjust the position of the distance arm 7 for positioning to ensure the tightness;

[0050] S4, at this time, the steel wire is placed in the straighteners A1 and D4 at both ends, the position of the displacement block 82 is adjusted by adjusting the inner hexagonal bolt 84, the semiconductor wafer cutting steel wire with uniform circumferential surface compressive stress is obtained, and the bending deformation is obtained by repeatedly stressing in multiple circumferential directions, thereby obtaining the circumferential uniform surface compressive stress.

[0051] Working principle: when preparing the semiconductor wafer cutting steel wire with uniform surface compressive stress, the straighteners A1, B2, C3 and D4 are arranged in sequence, and multiple calibrators 5 are arranged between each straightener. First, the first calibration scale 501 on the outer wall of the positioning disc 52 blade corresponds to the first calibration head 502 on the outer wall of the micro-adjusting disc 53, the second calibration scale 503 on the outer wall of the positioning disc 52 blade corresponds to the second calibration head 504 on the outer wall of the connector plate A51, the first bevel gear A603 in the middle of the positioning disc 52 is rotated to drive the second bevel gear B604 to rotate, and the positioning handle 605 realizes the rotational adjustment of the positioning disc 52 in the rotating groove 601 on the outer wall of the connector plate A51 for angle positioning. At this time, the incomplete worm gear 6 on the outer wall of the micro-adjusting disc 53 blade meshes with the worm 61 inside the positioning disc 52, the rotational adjustment handle 62 can drive the micro-adjusting disc 53 to swing for small-angle fine adjustment, and at this time, the distance adjustment handle 76 drives the fourth bevel gear D75 to rotate to drive the third bevel gear C74 to rotate, and further adjusts the position of the distance arm 7 for positioning to ensure the tightness. At this time, the position of the displacement block 82 can be adjusted by adjusting the inner hexagonal bolt 84, and finally the semiconductor wafer cutting steel wire with uniform circumferential surface compressive stress is obtained through the linkage adjustment of the multiple calibrators 5, thereby the semiconductor wafer cutting steel wire passes through the straighteners arranged in four different directions in sequence, and the bending deformation is obtained by repeatedly stressing in multiple circumferential directions, thereby obtaining the circumferential uniform surface compressive stress.

[0052] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other present or future devices perform the same function under a different name. It must be noted that, as used in the specification and the appended claims, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component" can include a plurality of such components. In this specification and in the claims, the term "when" should be understood to mean "whereupon" or "upon" when used in contexts describing the sequential order of events, and "whenever" when used in contexts describing the sequential order of events or circumstances. The terms "comprises" and / or "comprising," or "includes" and / or "including" when used in this specification and in the following claims are used open- ended, meaning that they include the elements that follow, but not to the exclusion of other elements. The terms "coupled" and "coupling" mean to be directly or indirectly connected physically or logically, or to be directly or indirectly in communication, whether electrically, mechanically, optically, or otherwise.

[0053] The foregoing description and drawings merely explain and illustrate the general principles of the application. Those skilled in the art will readily recognize various ways of adapting the principles of the application to various usages, conditions and environments without departing from the spirit of the application. The described embodiments are to be considered in all respects only as illustrative and not restrictive, and all changes coming within the meaning and equivalency range of the appended claims are reserved as the application is intended to cover all such modifications. The scope of the application is therefore indicated by the appended claims, rather than being indicated by the description or the drawings.

Claims

1. A semiconductor wafer wire sawing apparatus of uniform surface compressive stress, comprising a semiconductor wafer sawing wire having uniform surface compressive stress along the circumference, comprising straightener A (1), straightener B (2), straightener C (3) and straightener D (4), characterized in that: The straightener A (1), the straightener B (2), the straightener C (3) and the straightener D (4) are provided with a plurality of calibrators (5) therebetween; The plurality of calibrators (5) comprise a connector plate A (51) arranged on one side of the straightener A (1), a positioning disc (52) rotatably arranged outside the connector plate A (51), and the positioning disc (52) is internally provided with a hollow structure; The positioning disc (52) is internally provided with a micro-calibration disc (53) arranged to swing, and the micro-calibration disc (53) is fixedly arranged on the outer wall of the connector plate B (54) fixedly arranged on the outer wall of the adjacent straightener B (2); The micro-calibration disc (53) and the positioning disc (52) are both provided with a plurality of sector structures, and the number of sectors is three; The outer wall of the sector of the positioning disc (52) is fixedly provided with a first calibration scale (501), the outer wall of the micro-calibration disc (53) is fixedly provided with a first calibration head (502), and the first calibration head (502) corresponds to the first calibration scale (501); The outer wall of the sector of the positioning disc (52) is also fixedly provided with a second calibration scale (503), the outer wall of the connector plate A (51) is fixedly provided with a second calibration head (504), and the second calibration scale (503) corresponds to the second calibration head (504); The outer wall of one of the sectors of the micro-calibration disc (53) is provided with an incomplete worm gear (6), the outer wall of the incomplete worm gear (6) is engaged with a worm (61), the worm (61) is rotatably arranged inside the positioning disc (52), and the cylindrical end of the worm (61) extends out of the positioning disc (52) and is fixedly provided with a calibration handle (62); The outer wall of the connector plate A (51) is provided with a positioning rotating groove (601), the positioning disc (52) is rotatably arranged inside the positioning rotating groove (601), a first bevel gear A (603) is coaxially fixedly arranged in the middle of the positioning disc (52), the first bevel gear A (603) is arranged inside a driving cavity (602) formed in the connector plate A (51), the outer wall of the first bevel gear A (603) is engaged with a second bevel gear B (604), and the shaft of the second bevel gear B (604) extends to the outside and is fixedly provided with a positioning handle (605).

2. A semiconductor wafer wire sawing apparatus of uniform surface compressive stress according to claim 1, wherein: The outer wall of the connector plate A (51) is fixedly provided with a distance arm (7), the distance arm (7) is slidably arranged inside a sliding groove (71) formed on one side of the straightener A (1), a threaded groove A (73) is formed in the distance arm (7), a fixed screw rod (72) is threadedly arranged in the threaded groove A (73), one end of the fixed screw rod (72) extends to the outside and is fixedly provided with a third bevel gear C (74), the outer wall of the third bevel gear C (74) is engaged with a fourth bevel gear D (75), and the shaft of the fourth bevel gear D (75) extends to the outside and is fixedly provided with a distance handle (76).

3. A semiconductor wafer wire sawing apparatus of uniform surface compressive stress according to claim 2, wherein: The straightener A (1), straightener B (2), straightener C (3) and straightener D (4) one side are provided with straightening shaft (81) through fixed frame (8), the outer wall of straightening shaft (81) is fixedly provided with displacement block (82), the displacement block (82) is slidably arranged in the displacement groove (83) on the outer wall of fixed frame (8), the middle part of displacement block (82) is provided with threaded groove B (85), the internal thread of threaded groove B (85) is provided with internal hexagonal bolt (84), the internal hexagonal bolt (84) extends from the surface of fixed frame (8).

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