Wave soldering furnace with adjustable nozzle
By setting an adjustable perturbation wave and smoothing wave width structure in the wave soldering oven, the problem that existing equipment cannot flexibly adapt to different PCB sizes is solved, and efficient and stable soldering results are achieved.
Patent Information
- Application Number
- CN202511987190.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-26
- Publication Date
- 2026-02-27
AI Technical Summary
The existing wave soldering furnaces have fixed nozzle widths for the disturbance wave and smoothing wave devices, which cannot be flexibly adjusted. This results in poor adaptability, low production efficiency, and unstable soldering quality, making it difficult to meet the needs of multi-variety, small-batch production.
An adjustable structure for the width of the disturbance wave and the smoothing wave was designed, including a sliding cover plate and an adjustment plate. The nozzle width of the disturbance wave and the smoothing wave device can be adjusted independently, and the height of the solder pot can be adjusted in combination with the worm gear assembly, so as to achieve flexible adaptation to different PCBs.
It improves the adaptability and production efficiency of wave soldering ovens, avoids solder waste and welding defects, enhances the wettability and smoothness of solder joints, and ensures the consistency of welding quality.
Smart Images
Figure CN121571752A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of wave soldering furnace, in particular to a wave soldering furnace with adjustable nozzle. BACKGROUND
[0002] Wave soldering technology is a core process widely used in surface mount and through-hole mount welding of printed circuit boards (PCB), which realizes efficient welding through the synergistic effect of disturbance wave and flat wave: the disturbance wave uses dynamic tin flow to break the solder oxide layer and enhance the pad wettability, ensuring reliable welding of complex pins (such as dense pin components), while the flat wave uses smooth tin flow to trim the solder joint shape and suppress bridging defects, improving the consistency of solder joint appearance.
[0003] However, the nozzle width of the disturbance wave device and the flat wave device of the existing wave soldering furnace is mostly fixed structure, when processing PCBs of different width specifications, the fixed nozzle cannot match the PCB welding area, which causes some problems: 1. Poor adaptability: if the nozzle width is too wide, the excess solder will cause increased energy consumption and is also prone to cause adjacent pad bridging; if the nozzle is too narrow, it cannot completely cover the pad, causing defects such as missed welding and virtual welding; 2. Low efficiency of debugging: even if some devices try to set adjustment mechanisms, there are limitations: either only the disturbance wave or the flat wave single structure is designed, which cannot meet the width adaptation needs of both; or the adjustment method is complex and lacks precision, making it difficult to quickly respond to the model change needs of multi-variety small-batch production, resulting in low production efficiency; 3. Unstable quality: due to the lack of precise control of the width of the disturbance wave and the flat wave, the welding quality of different width PCBs varies greatly, making it difficult to guarantee the yield. In summary, the traditional wave soldering furnace lacks independent and convenient adjustment structures for adjusting the width of the disturbance wave and the flat wave, and cannot flexibly adapt to the welding needs of PCBs of different sizes. SUMMARY
[0004] In view of the deficiencies of the prior art, the present application provides a wave soldering furnace with adjustable nozzle to solve the problem that the traditional wave soldering furnace lacks adjustment structures for adjusting the width of the disturbance wave and the flat wave.
[0005] To achieve the above-mentioned purpose, the present application provides a wave soldering furnace with adjustable nozzle, which comprises a soldering furnace, a disturbance wave device, a flat wave device, and a heating assembly for heating the disturbance wave device and the flat wave device. The disturbance wave device and the flat wave device each comprise a tin channel chamber, an impeller, a motor for driving the impeller to operate, and a top plate arranged at the top of the tin channel chamber. A plurality of nozzles are arranged on the top plate. The disturbance wave device is provided with a first adjustment structure for adjusting the width of the disturbance wave, and the flat wave device is provided with a second adjustment structure for adjusting the width of the flat wave.
[0006] The technical scheme has the beneficial effects that: in the above technology, the disturbance wave width adjustment (i.e., the first adjustment structure) and the flat wave width adjustment (i.e., the second adjustment structure) are independently arranged, which solves the technical problem of "single wave type or no precise adjustment" in the traditional wave-soldering machine; on the one hand, the two types of wave types can be independently adapted according to the PCB width and the characteristics of the soldering points (such as dense pins or sparse pins), thereby avoiding the problems of "waste of wide waves and missed soldering of narrow waves"; on the other hand, the dynamic activity of the disturbance wave and the static trimming function of the flat wave can be optimized respectively, which not only guarantees the wettability of complex pins, but also improves the flatness of the soldering points, thereby widening the compatibility of the equipment for multiple specifications of PCBs from the core structure, and promoting the upgrade of the wave-soldering machine from "fixed adaptation" to "flexible regulation and control".
[0007] The application further provides that the first adjustment structure comprises a cover plate for closing the plurality of nozzles of the disturbance wave device, and the cover plate is movably arranged on the top plate along the opening direction of the top plate.
[0008] The technical scheme has the beneficial effects that: in the above technology, the sliding cover plate realizes the disturbance wave width adjustment, the cover plate is directly matched with the top plate, and no complex transmission parts are needed, thereby reducing the design and maintenance costs; meanwhile, the cover plate can quickly close or expose the nozzles by sliding along the top plate, that is, the cover plate is slid to close part of the nozzles according to the size requirements of different PCBs, thereby realizing the function of adjusting the disturbance wave width, real-time adapting to different PCB widths, shortening the changeover time, and directly restricting the tin flow width by the closing effect of the cover plate on the nozzles, thereby avoiding the "excessive diffusion" of the disturbance wave, reducing the loss of tin liquid, strengthening the "targeted impact" of the disturbance wave on the soldering pad, and improving the efficiency of breaking the oxide layer.
[0009] The application further provides that the two side walls of the cover plate are both bent to form limiting edges, limiting portions are arranged on the inner walls of the limiting edges along the opening direction of the cover plate, the two limiting edges are respectively arranged in contact with the two side walls of the top plate, the two side walls of the top plate are both opened to form limiting grooves along the opening direction of the top plate, and the two limiting portions are respectively arranged in clamping cooperation with the adjacent limiting grooves and are arranged to slide in the limiting grooves.
[0010] The technical scheme has the beneficial effects that: in the above technology, the clamping and sliding cooperation of the limiting edges and the limiting grooves of the cover plate and the top plate forcibly restricts the movement track of the cover plate, avoids the deviation or inclination of the cover plate during the adjustment process, and ensures the regularity of the closed area of the nozzles; meanwhile, the double-side limiting design forms a guide sliding rail, improves the smoothness and consistency of the sliding of the cover plate, and even after long-term high-frequency adjustment, the stable width control precision can still be maintained; and the bent limiting edges have a protection effect, can shield the splashing of the tin liquid, prolong the service life of the top plate and the cover plate, and guarantee the structural reliability.
[0011] The application further provides that the top plate of the disturbance wave device is uniformly provided with a plurality of bosses along the opening direction of the top plate, and the plurality of nozzles are separately arranged on the plurality of bosses, and the bosses are arranged in relative inclination with the top plate.
[0012] The technical scheme has the beneficial effects that: in the above-mentioned technology, the top plate of the disturbance wave device is uniformly provided with a plurality of inclined bosses, the direction of tin liquid outflow is changed, the tin flow forms an oblique impact, the disturbance wave turbulence and penetration are enhanced, the oxidation layer of the solder pad is more efficiently broken, the wettability of the soldering of the pinless component is improved, the nozzles are distributed on the bosses, the tin flow velocity difference is generated by the difference in flow guide of the bosses, the disturbance effect is further amplified, and the tin liquid backflow path is optimized by the inclined structure, tin accumulation in the chamber is reduced, the maintenance frequency is reduced, and the continuous operation capacity of the equipment is improved.
[0013] The present application further provides: the flat wave device further comprises a flat wave tin guide frame surrounding the top plate of the flat wave device, the flat wave tin guide frame and the top plate of the flat wave device combine to form a tin outlet groove, the flat wave tin guide frame comprises two baffles separately arranged at both ends of the top plate to control the flat wave width, a rear end plate and a flat wave lip plate, the second adjusting structure comprises an adjusting plate and a frame plate movably arranged in the tin outlet groove, the adjusting plate and the frame plate are arranged in opposite perpendicularity and connection, the adjusting plate is arranged on the top plate of the flat wave device to close the nozzle, the adjusting plate is movably arranged along the opening direction of the top plate of the flat wave device to adjust the flat wave width, and a sliding groove is formed in any one of the baffles for the adjusting plate to pass through.
[0014] The technical scheme has the beneficial effects that: in the above-mentioned technology, the flat wave device controls the width of the tin outlet groove by sliding the adjusting plate, cooperates with the surrounding constraint of the flat wave tin guide frame, forces the tin flow to flow out along the set width, avoids flat wave overflow, suppresses the bridging defect from the source, the adjusting plate slides along the top plate to steplessly adapt to the PCB width, the adjusting precision is ensured by the sliding groove guide, and the modular design (baffle, rear end plate and flat wave lip plate) of the tin guide frame facilitates subsequent maintenance and function upgrade (such as replacing the lip plate to optimize the tin flow form), improves the iteration potential of the equipment, and realizes accurate and flexible control of the flat wave width.
[0015] The present application further provides: the frame plate is divided into a closed part and a movable part by the insertion slot, the closed part is in abutting fit with the outer wall of the rear end plate and the inner wall of the flat wave lip plate on both sides to block the tin outlet groove, the closed part is bent towards the top wall of the flat wave lip plate to form a guide part, the top wall and the outer wall of the flat wave lip plate are connected in smooth arc surface and form a guide surface, and the bottom wall of the guide part is arranged in close contact with the guide surface.
[0016] The technical scheme has the advantages that: the slot design of the technical scheme realizes quick insertion and arrangement with the rear end plate, facilitates disassembly and assembly during debugging and maintenance, the closed part separates the tin tank to prevent tin liquid backflow from interfering with the flat wave stability and guaranteeing the flat wave laminar flow characteristics; the guide part is attached to the curved surface of the flat wave lip plate, forces the tin flow to flow along the smooth curved surface, eliminates tin flow sudden change disturbance, further optimizes the flatness and gloss of the solder joint, and improves the appearance consistency from the tin flow control shape and structure adaptation angle to refine the function performance of the flat wave width adjustment.
[0017] The tin furnace is arranged in the support frame and is arranged above the adjusting seat, a lifting structure for adjusting the relative height between the tin furnace and the adjusting seat is arranged between the support frame and the adjusting seat, the lifting structure comprises two groups of oppositely arranged worm gear assemblies, the worm gear assembly comprises a worm, two lifting shafts and two worm gears in transmission cooperation with the worm, a connecting base is arranged at the bottom of the support frame, the worm is movably connected with the support frame through the connecting base, the two worm gears are separately arranged on the two lifting shafts, and the two lifting shafts are oppositely and vertically arranged with the worm.
[0018] The technical scheme has the advantages that: the worm gear driven lifting structure stably maintains the height of the tin furnace by using the self-locking characteristic, avoids falling deviation during operation, guarantees the horizontal lifting process by the symmetrical layout of the two groups, and prevents tin liquid from spilling, wherein the speed reduction ratio characteristic of the worm gear supports the micro-step adjustment of the height of the tin furnace, adapts to different PCB board thicknesses and transmission mechanism heights, and expands the application scenarios of the equipment; the connecting base integrates the transmission components, simplifies the installation layout, and improves the compactness of the structure, thereby optimizing the tin furnace height adjustment function from the transmission reliability, adjustment accuracy and space utilization.
[0019] The technical scheme has the advantages that: the hand wheel design facilitates on-site manual quick debugging of the height of the tin furnace without the need for an additional power source, and adapts to the requirements of different types of working conditions, the transmission gears forcibly link the two groups of worms to ensure that the two lifting shafts operate synchronously, and completely avoid the risk of tin furnace tilting and jamming; the intuitive mechanical transmission reduces the operation threshold, enables emergency adjustment even in the case of power failure, improves the adaptability of the equipment to complex working conditions, and strengthens the practicality and stability of the lifting structure from the perspective of human-computer interaction and motion synchronization.
[0020] The technical scheme has the advantages that: the hand wheel design facilitates on-site manual quick debugging of the height of the tin furnace without the need for an additional power source, and adapts to the requirements of different types of working conditions, the transmission gears forcibly link the two groups of worms to ensure that the two lifting shafts operate synchronously, and completely avoid the risk of tin furnace tilting and jamming; the intuitive mechanical transmission reduces the operation threshold, enables emergency adjustment even in the case of power failure, improves the adaptability of the equipment to complex working conditions, and strengthens the practicality and stability of the lifting structure from the perspective of human-computer interaction and motion synchronization. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 The three-dimensional view of the present application; Figure 2Figure 3 is a three-dimensional view of the wave disturbance device of the present application; Figure 3 Figure 4 is a cross-sectional view of the wave disturbance device of Figure 2 Figure 5 is a cross-sectional view of the wave disturbance device of Figure 4 Figure 6 is a three-dimensional view of the wave flattening device of the present application; Figure 5 Figure 7 is a cross-sectional view of the wave flattening device of Figure 4 Figure 8 is a cross-sectional view of the wave flattening device of Figure 6 Figure 9 is a three-dimensional view of the adjustment base of the present application; Figure 7 Figure 10 is a three-dimensional view of the worm and gear assembly of the present application. DETAILED DESCRIPTION
[0022] The application provides a wave soldering tin furnace 1 with adjustable spouts 31, which comprises a tin furnace 1, a disturbance wave device 2, a flat wave device 3 and a heating assembly for heating the disturbance wave device 2 and the flat wave device 3. The disturbance wave device 2 and the flat wave device 3 each comprise a tin channel cavity 21, an impeller 22, a motor 23 for driving the impeller 22 to operate and a top plate 24 arranged at the top of the tin channel cavity 21. A plurality of spouts 31 are arranged on the top plate 24. The disturbance wave device 2 is provided with a first adjusting structure for adjusting the width of the disturbance wave. The flat wave device 3 is provided with a second adjusting structure for adjusting the width of the flat wave. The first adjusting structure comprises a cover plate 25 for closing the plurality of spouts 31 of the disturbance wave device 2. The cover plate 25 is movably arranged on the top plate 24 along the direction in which the top plate 24 is opened. The two side walls of the cover plate 25 are each bent to form a limiting edge 251. A limiting part 252 is arranged on the inner wall of the limiting edge 251 along the direction in which the cover plate 25 is opened. The two limiting edges 251 are respectively arranged in contact with the two side walls of the top plate 24. The two side walls of the top plate 24 are each opened to form a limiting groove 26 along the direction in which the top plate 24 is opened. The two limiting parts 252 are respectively and movably arranged in the limiting groove 26 in a clamping mode. A plurality of bosses 27 are uniformly arranged on the top plate 24 of the disturbance wave device 2 along the direction in which the top plate 24 is opened. The plurality of spouts 31 are arranged on the plurality of bosses 27. The bosses 27 are arranged in an inclined mode relative to the top plate 24. The flat wave device 3 further comprises a flat wave tin guide frame 32 surrounding the top plate 24 of the flat wave device 3. The flat wave tin guide frame 32 and the top plate 24 of the flat wave device 3 are combined to form a tin outlet groove 33. The flat wave tin guide frame 32 comprises two baffle plates 321 arranged at the two ends of the top plate 24 to control the width of the flat wave, a rear end plate 322 and a flat wave lip plate 323. The second adjusting structure comprises an adjusting plate 34 and a frame plate 35 movably arranged in the tin outlet groove 33. The adjusting plate 34 is arranged in a vertical mode relative to the frame plate 35 and is connected to the frame plate 35. The adjusting plate 34 is arranged on the top plate 24 of the flat wave device 3 to close the spouts 31. The adjusting plate 34 is movably arranged along the direction in which the top plate 24 of the flat wave device 3 is opened to adjust the width of the flat wave. A sliding groove 341 is arranged on the baffle plate 321 to allow the adjusting plate 34 to pass through. An insertion groove 351 is arranged on the frame plate 35 to be inserted into the rear end plate 322. The frame plate 35 is divided into a closed part 352 and a movable part 353 through the insertion groove 351. The two side walls of the closed part 352 are respectively in abutting contact with the outer wall of the rear end plate 322 and the inner wall of the flat wave lip plate 323 to separate the tin outlet groove 33. A guide part 354 is bent from the top wall of the flat wave lip plate 323 towards the flat wave lip plate 323. The top wall and the outer wall of the flat wave lip plate 323 are connected in a smooth arc surface mode to form a guide surface 36. The bottom wall of the guide part 354 is arranged in abutting contact with the guide surface 36. The tin furnace 1 is arranged in a support frame 11 and is arranged above the adjusting seat 4.The lifting structure for adjusting the relative height between the tin furnace 1 and the adjusting seat 4 is arranged between the supporting frame 11 and the adjusting seat 4, and comprises two groups of oppositely arranged worm gear assemblies, wherein the worm gear 421 worm gear 41 assembly comprises a worm gear 41, two lifting shafts 42 and two worm gears 421 in driving cooperation with the worm gear 41, the supporting frame 11 is provided with a connecting base 111, the worm gear 41 is movably connected with the supporting frame 11 through the connecting base 111, the two worm gears 421 are arranged on the two lifting shafts 42 respectively, the two lifting shafts 42 are arranged in opposite vertical relationship with the worm gear 41, the lifting shafts 42 are drivingly connected with the adjusting seat 4 and the supporting frame 11 respectively, and the end of each worm gear 41 is provided with a hand wheel 411 for being rotated by an external operator, the start of each worm gear 41 is provided with a transmission gear 412, and the two transmission gears 412 are drivingly cooperated.
[0023] Based on the operation process of the above-mentioned technology: the heating assembly preheats the tin cavity, after the tin liquid is melted, the motor drives the impeller to pump the tin liquid into the cavity of the disturbance wave and the flat wave device, the disturbance wave adjusts the width of the nozzle through the sliding cover plate, and the inclined boss strengthens the disturbance of the tin flow; the flat wave passes through the sliding cooperation of the adjusting plate and the tin guide frame to constrain the tin flow to form a stable wave crest, the PCB is conveyed through the transmission mechanism, and the oxidation is broken and the pins are wetted through the disturbance wave, and then the solder joint shape is trimmed through the flat wave. When the lifting height needs to be adjusted, the operator can drive the worm gear assembly through the hand wheel to adjust the relative height of the tin furnace and the transmission mechanism to match different PCB thicknesses; and before the welding process, the operator can adjust the nozzle width of the disturbance wave device through the sliding cover plate, and adjust the nozzle width of the flat wave device through the sliding adjusting plate, that is, the wave width and height are adjusted in real time, so that multiple specifications of PCBs can be stably welded, thereby improving the production efficiency and processing range.
[0024] The two transmission gears in the above-mentioned technology can be drivingly cooperated through belt transmission or chain transmission, that is, the synchronous rotation of the two is realized through transmission belts or transmission chains. This transmission connection mode is the prior art, and therefore will not be described in detail. In addition, this transmission connection mode will not be drawn in the drawings of the specification to avoid interference with the display of other components.
[0025] The basic principles and main features of the present application and the advantages of the present application have been shown and described. It should be understood by those skilled in the art that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A wave soldering furnace with adjustable nozzles, comprising a solder furnace, a wave disturbance device, a wave smoothing device, and a heating assembly for heating the wave disturbance device and the wave smoothing device, wherein each of the wave disturbance device and the wave smoothing device comprises a solder run chamber, an impeller, a motor for driving the impeller, and a top plate disposed on the top of the solder run chamber, wherein the top plate is provided with a plurality of nozzles, characterized in that: The disturbance wave device is provided with a first adjustment structure for adjusting the width of the disturbance wave, and the smoothing wave device is provided with a second adjustment structure for adjusting the width of the smoothing wave.
2. The wave soldering furnace with adjustable nozzle according to claim 1, characterized in that: The first adjustment structure includes a cover plate for sealing a plurality of nozzles of the disturbance wave device, the cover plate being movably disposed on the top plate along the opening direction of the top plate.
3. The wave soldering furnace with adjustable nozzle according to claim 2, characterized in that: Both sides of the cover plate are bent with limiting edges. The inner wall of the limiting edge is provided with a limiting part along the opening direction of the cover plate. The two limiting edges are respectively in contact with the two sides of the top plate. Both sides of the top plate are provided with limiting grooves along the opening direction of the top plate. The two limiting parts are engaged with their respective adjacent limiting grooves and are slidably disposed in the limiting grooves.
4. The wave soldering furnace with adjustable nozzle according to claim 2, characterized in that: The top plate of the disturbance wave device has several protrusions evenly distributed along the opening direction of the top plate, and several nozzles are respectively disposed on several protrusions. The protrusions are inclined relative to the top plate.
5. The wave soldering furnace with adjustable nozzle according to claim 1, characterized in that: The smoothing device also includes a smoothing solder guide frame for surrounding the top plate of the smoothing device. The smoothing solder guide frame and the top plate of the smoothing device are combined to form a solder outlet groove. The smoothing solder guide frame includes two baffles respectively located at both ends of the top plate to control the smoothing width, a rear end plate, and a smoothing lip plate. The second adjustment structure includes an adjustment plate and a frame plate movably disposed in the solder outlet groove. The adjustment plate and the frame plate are perpendicular to each other and connected. The adjustment plate covers the top plate of the smoothing device to close the nozzle. The adjustment plate is movably disposed along the opening direction of the top plate of the smoothing device to adjust the smoothing width. A groove is provided on any one of the baffles for the adjustment plate to pass through.
6. A wave soldering furnace with adjustable nozzles according to claim 5, characterized in that: The frame plate has slots for mating with the rear end plate. The frame plate is divided into a closed part and a movable part by the slots. The two side walls of the closed part abut against the outer wall of the rear end plate and the inner wall of the flat wave lip plate to block the solder bath. The closed part is bent toward the top wall of the flat wave lip plate to form a guide part. The top wall of the flat wave lip plate and the outer wall are connected by a smooth arc surface to form a guide surface. The bottom wall of the guide part is fitted with the guide surface.
7. The wave soldering furnace with adjustable nozzle according to claim 1, characterized in that: It also includes a support frame and an adjusting seat. The solder pot is set in the support frame and positioned above the adjusting seat. A lifting structure for adjusting the relative height between the solder pot and the adjusting seat is provided between the support frame and the adjusting seat. The lifting structure includes two sets of worm gear assemblies arranged opposite each other. Each worm gear assembly includes a worm, two lifting shafts, and two worm wheels that drive with the worm. A connecting base is provided at the bottom of the support frame. The worm is movably connected to the support frame through the connecting base. The two worm wheels are respectively set on the two lifting shafts. Both lifting shafts are arranged perpendicular to the worm. The lifting shafts are respectively driven connected to the adjusting seat and the support frame.
8. A wave soldering furnace with adjustable nozzles according to claim 7, characterized in that: Each of the worm gears is provided with a handwheel for external operators to rotate, and both worm gears are provided with a transmission gear at their beginnings, and the two transmission gears are configured to drive each other.