Laser etching device for mini LED substrate bonding pad and etching method thereof

Abstract

The invention discloses a laser etching device for a mini LED substrate bonding pad and an etching method thereof, and belongs to the technical field of circuit board processing. The laser etching device for the mini LED substrate bonding pad comprises a rack and further comprises two mounting plates, the two mounting plates are symmetrically arranged on the left side and the right side of the rack, each mounting plate is provided with a rotary clamping part, and one mounting plate is provided with a driving motor used for driving the rotary clamping part to rotate; the follow-up lifting mechanism comprises two sets of follow-up lifting assemblies correspondingly arranged on the rotary clamping parts on the same side and an etching unit arranged between the two sets of follow-up lifting assemblies; while the driving motor drives the circuit board to turn over, the laser head is driven to synchronously and reversely move and automatically adjust the distance, double-face etching can be completed by 90-degree turning over, the stroke is greatly shortened, meanwhile, the feeding channel is controlled in a linkage mode in the turning-over reset process, automatic feeding and discharging are achieved, and the equipment space utilization rate and the machining efficiency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, in particular to a laser etching device for mini LED substrate pads and an etching method thereof. BACKGROUND

[0002] MINI LED is becoming an important direction in the display field, and smaller display chips are fixed on PCB substrates to achieve more delicate display effects. The traditional PCB etching process is as follows: after the dry film / wet film without exposure is removed by the developer, the copper surface is exposed, and the exposed copper surface is dissolved and corroded by acidic copper chloride to obtain the required circuit. However, as the display technology develops towards higher pixel density (PPI), the chip pitch is continuously reduced, and the processing precision of the pads is almost harshly required.

[0003] In order to break through the limitations of traditional processes, laser direct writing etching technology has attracted attention due to its high precision and non-contact processing potential. Patent application No. 202310838372.0 discloses an invention named "laser etching device for MINI LED PCB substrate pads and etching method thereof". The device positions through a vision module, scans through a scanning module, and generates a cutting track, and finally executes etching by a ultraviolet femtosecond laser scanner. This method can theoretically significantly improve etching precision and enhance adaptability to different pad designs.

[0004] Firstly, in order to realize double-sided processing, the circuit board with completed front etching must be flipped. In order to avoid collision between the circuit board and the laser head and the motion mechanism above during the flipping process, a sufficient safety space must be reserved between the two during equipment design, which directly leads to a large overall structure of the equipment, low space utilization, and increased equipment floor space and manufacturing cost. Secondly, the existing flipping process itself is long and inefficient. The circuit board must be flipped 180 degrees first, and then the laser head completes etching on the other side. After that, the circuit board is flipped 180 degrees again to restore it to the initial state, so that the next operation of discharging and feeding a new board can be performed. This "processing-flipping-reprocessing-reflipping" operation mode makes the valuable equipment processing time be occupied by a large amount of non-productive auxiliary time (such as flipping and waiting), which reduces the production and processing efficiency. SUMMARY

[0005] The present application relates to the technical field of circuit board processing, in particular to a laser etching device for mini LED substrate pads and an etching method thereof.

[0006] In order to achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows: A laser etching device for mini LED substrate pads, comprising a rack, further comprising: The mounting plate is provided with two symmetrically arranged mounting plates on the left and right sides of the frame, each of which is provided with a rotating clamping part, and one of the mounting plates is provided with a driving motor for driving the rotating clamping part to rotate. The follow-up lifting mechanism includes two groups of follow-up lifting assemblies respectively arranged on the same side of the rotating clamping parts and an etching unit arranged between the two groups of follow-up lifting assemblies. The feeding unit includes a feeding assembly and a discharging assembly arranged on the front and rear sides of the frame, respectively. The etching unit includes a laser scanner and a displacement assembly for driving the laser scanner to displace.

[0007] Preferably, the rotating clamping part includes a rotating shaft connected to the mounting plate, a rotating disc arranged at the end of the rotating shaft, and a placing slot arranged on the rotating disc for accommodating the circuit board. The rotating discs of the rotating clamping parts on the two sides of the frame are connected by a connecting rod, and the driving motor is connected to the rotating shaft of one of the rotating clamping parts.

[0008] Preferably, a groove is arranged on the rotating disc and communicates with the placing slot. An electric push rod is fixedly arranged in the groove, and a clamping plate is connected to the movable end of the electric push rod. A rubber pad is arranged on the clamping plate.

[0009] Preferably, the follow-up lifting assembly includes a rotating shell rotatably arranged between the mounting plate and the rotating disc, a reciprocating screw rod rotatably connected to the rotating shell, and a sleeve threadedly connected to the reciprocating screw rod. The two ends of the etching unit are connected to the sleeves of the follow-up lifting assemblies on the two sides through connecting rods.

[0010] Preferably, the sleeve moves axially along the reciprocating screw rod. Before the circuit board is turned to an angle of 45 degrees, the sleeve drives the etching unit to move axially along the reciprocating screw rod and away from the circuit board. When the circuit board is turned to an angle of 45 degrees to 90 degrees, the sleeve drives the etching unit to move axially along the reciprocating screw rod and back to the circuit board, so that the circuit board is turned to an angle of 90 degrees and the preset working distance between the laser scanner and the surface to be etched of the circuit board is maintained.

[0011] Preferably, a driving gear is fixedly arranged on the rotating shaft, an idle gear meshing with the driving gear is rotatably arranged on the mounting plate through a fixed rod, and a gear ring meshing with the idle gear is arranged on the rotating shell. One end of the reciprocating screw rod arranged inside the rotating shell is fixedly provided with a driven bevel gear, and a fixed bevel gear meshing with the driven bevel gear is fixedly arranged on the mounting plate.

[0012] Preferably, the feeding assembly includes an arc-shaped elastic telescopic rod fixed to the frame by a support plate and a feeding channel fixed to the top of the arc-shaped elastic telescopic rod; When the circuit board in the placement slot rotates between 0 and 30 degrees, the arc-shaped elastic telescopic rod is in a compressed state, and the feeding channel of the loading component, the feeding channel of the unloading component, and the placement slot are in a straight line.

[0013] Preferably, L-shaped baffles are provided at the discharge end of the feeding channel of the feeding component and the inlet end of the feeding channel of the unloading component. An elastic telescopic tube is provided between the L-shaped baffle and the bottom wall of the feeding channel. A force plate is connected to the L-shaped baffle. Two actuating rods are provided on the rotating shaft. The two actuating rods move against the force plate on the same side respectively.

[0014] Preferably, the displacement assembly includes a fixed frame fixedly connected to a sleeve via a connecting rod, a longitudinal screw rotatably disposed within the fixed frame, a first nut seat threadedly connected to the longitudinal screw, a transverse screw rotatably disposed on the bottom side plate of the first nut seat, a second nut seat threadedly connected to the transverse screw, a first driving member fixed to the fixed frame for driving the longitudinal screw to rotate, and a second driving member fixed to the first nut seat for driving the transverse screw to rotate, wherein the laser scanner is disposed on the second nut seat.

[0015] This invention also discloses a laser etching method for mini LED substrate pads, which involves etching using a laser etching apparatus for mini LED substrate pads, and includes the following steps: S10: Initial state and first surface etching: The circuit board is placed horizontally in the placement slot of the rotating disk and clamped and fixed by the clamping plate driven by the electric push rod. The laser scanner is located at the preset focal length position directly above the circuit board. The drive motor is not started and the rotating shaft is at 0 degrees. The displacement component operates, driving the laser scanner to perform precision etching on the front of the circuit board along a predetermined trajectory; S20: Synchronous flipping and preparation for second-side etching: After the front etching is completed, the drive motor is started, which drives the rotating shaft and the rotating disk to start rotating, thereby causing the clamped circuit board to flip. The drive gear on the rotating shaft drives the movable gear to rotate, which in turn drives the gear ring fixed to the rotating shell, causing the rotating shell and the entire etching unit to rotate in the opposite direction relative to the rotating shaft, and the circuit board and the laser scanner to move synchronously in opposite directions. 0°-45° Reversal Period: The rotation of the rotating shell drives the reciprocating lead screw to revolve. Since the fixed bevel gear is stationary, the driven bevel gear meshing with it is forced to rotate, driving the reciprocating lead screw to rotate. This causes the sleeve to drive the etching unit away from the circuit board along the axis of the reciprocating lead screw, thus avoiding collision. 45°-90° flipping period: The mechanical linkage is reversed, and the sleeve drives the etching unit to return to the circuit board along the reciprocating screw axis. During this process, the circuit board to be etched is placed in the feeding channel of the feeding assembly. When the circuit board is flipped to a 90° vertical position, the laser scanner automatically adjusts the preset working distance from the original bottom surface of the circuit board through the above-mentioned linkage, and is ready. S30: Second surface etching: The displacement component then drives the laser scanner to etch the second side of the circuit board; S40: Reset and Flipping with Automated Loading and Unloading: After the second side is etched, the drive motor reverses, causing the rotating shaft and circuit board to reset and flip from 90° to 0°. When the reset rotation reaches the 0°-30° range, the actuating rod on the rotating shaft begins to contact and push the force plate at the end of the feeding channel. The force plate is pushed and compresses the elastic telescopic tube through the L-shaped baffle, causing the L-shaped baffle to release the blockage at the end of the feeding channel. As the rotating shaft continues to reset and rotate, the arc-shaped elastic telescopic rod is compressed, ensuring that the feeding channel outlet end of the loading assembly, the placement slot, and the feeding channel inlet end of the unloading assembly are aligned in a straight line for a long time. During this period, the electric push rod is released, and the processed circuit board slides into the feeding channel of the unloading assembly under the action of gravity, completing the unloading. At the same time, the new circuit board that was pre-placed in the feeding channel of the loading assembly slides into the empty placement slot under the action of gravity, completing the loading. When the circuit is reset to the initial 0° position, the electric push rod is activated, driving the clamping plate to clamp the new circuit board, restoring the state described in step S10, and starting a new etching cycle.

[0016] Compared with the prior art, the present invention provides a laser etching apparatus and etching method for mini LED substrate pads, which has the following advantages: 1. In this invention, by meshing the drive gear and the movable gear, when the drive motor drives the rotating shaft to rotate, the rotating shell drives the etching unit and the circuit board to achieve synchronous reverse flipping, so that the motion trajectories between the laser scanner and the circuit board avoid each other, shortening the traditional 180° flipping path to a 90° effective stroke. At the same time, the meshing mechanism of the reciprocating screw and the fixed bevel gear adjusts the laser head spacing in real time through the axial movement of the sleeve during the flipping process, which not only ensures safe avoidance but also maintains the optimal working distance, making the equipment structure layout more compact, significantly reducing the equipment manufacturing cost and space requirements, and effectively solving the problem that traditional equipment needs to reserve a huge safety space due to flipping interference.

[0017] 2. In this invention, by optimizing the flipping angle required for double-sided processing from 2×180° to 2×90° per cycle, the effective processing time ratio is increased to over 85%. Secondly, the feeding unit, through the linkage design of the arc-shaped elastic telescopic rod and the L-shaped baffle, automatically opens the feeding channel by the push rod when the rotating shaft resets and flips, so that the circuit board can complete automatic loading and unloading within the 0°-30° flipping range. This achieves the overlap of processing and material flow time, shortening the single batch processing cycle by about 60%, and solving the problems of long auxiliary time and low processing efficiency in traditional processes.

[0018] 3. In this invention, the stability and repeatability of the processing process are ensured by adopting a pure mechanical transmission system. The meshing design of the drive gear and the movable gear, and the meshing design of the fixed bevel gear and the driven bevel gear, makes the displacement of the etching unit during the flipping process strictly correspond to the flipping angle of the circuit board. This mechanical hard linkage method avoids the signal delay or misjudgment problem that may occur in electronic sensors, and ensures that the laser scanner can still maintain the preset working distance after the circuit board is flipped 90°.

[0019] 4. In this invention, the entire process from processing to loading and unloading is automated through mechanical linkage. After double-sided etching is completed, the reverse rotation of the drive motor drives the entire system into the reset process. At this time, the contact between the lever and the force plate enables the L-shaped baffle to achieve precise opening and closing of the feeding channel through the deformation of the elastic telescopic tube. The timely release and clamping of the electric push rod, combined with the gravity sliding mechanism, ensures that the circuit board completes orderly flow within the preset trajectory. The automated operation reduces the number of manual intervention links from multiple to one. Operators only need to replenish the material rack periodically, which greatly reduces the labor intensity and skill requirements. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 for Figure 1 Enlarged structural diagram of section A in the middle; Figure 3 for Figure 1 The main view; Figure 4 This is a cross-sectional structural diagram of the present invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the rotating disk of the present invention; Figure 6 This is a cross-sectional structural diagram of the mounting plate of the present invention; Figure 7 for Figure 6 Enlarged structural diagram of section B in the middle; Figure 8 This is a schematic diagram of the external structure of the mounting plate of the present invention; Figure 9This is a schematic diagram of the feeding assembly of the present invention. Figure 1 ; Figure 10 This is a schematic diagram of the feeding assembly of the present invention. Figure 2 ; Figure 11 This is a schematic diagram of the etching unit of the present invention.

[0021] In the diagram: 1. Frame; 101. Support plate; 2. Mounting plate; 201. Drive motor; 202. Fixing rod; 2021. Movable gear; 203. Fixed bevel gear; 3. Rotating clamping part; 301. Rotating shaft; 3011. Drive gear; 3012. Actuating lever; 302. Rotary disk; 3021. Placement slot; 3022. Connecting rod; 4. Circuit board; 5. Etching unit; 501. Laser scanner; 6. Groove; 601 602. Electric push rod; 703. Clamping plate; 804. Feeding unit; 705. Arc-shaped elastic telescopic rod; 706. Feeding channel; 807. Rotating shell; 808. Reciprocating screw; 809. Driven bevel gear; 8002. Sleeve; 8003. Gear ring; 900. L-shaped baffle; 901. Elastic telescopic tube; 902. Force plate; 10. Fixed frame; 11. Longitudinal screw; 111. First nut seat; 12. Transverse screw; 121. Second nut seat. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] like Figure 1 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, this embodiment proposes a laser etching apparatus for mini LED substrate pads, including a frame 1, and further including: a mounting plate 2, a follow-up lifting mechanism, and a feeding unit 7; two mounting plates 2 are provided and symmetrically arranged on the left and right sides of the frame 1, each mounting plate 2 is provided with a rotating clamping part 3, and one of the mounting plates 2 is provided with a drive motor 201 for driving the rotating clamping part 3 to rotate; the follow-up lifting mechanism includes two sets of follow-up lifting components respectively arranged on the rotating clamping part 3 on the same side, and an etching unit 5 arranged between the two sets of follow-up lifting components; the feeding unit 7 includes a loading component and a unloading component with the same structure arranged on the front and rear sides of the frame 1; wherein, the etching unit 5 includes a laser scanner 501 and a displacement component for driving the laser scanner 501 to move; Specifically, circuit board 4 is clamped and fixed by rotating clamping part 3. At this time, circuit board 4 is in a horizontal state, and etching unit 5 is located at a preset processing position directly above circuit board 4. First side etching: Etching unit 5 is started, and laser scanner 501, driven by displacement component, performs laser etching on the front side of circuit board 4 according to a predetermined trajectory. The predetermined trajectory is formed by the vision module, scanning module, and processing module in prior art CN202310838372.0. After the first side etching is completed, drive motor 201 is started, driving rotating clamping part 3 to rotate circuit board 4. At the same time, follow-up lifting mechanism starts working, controlling etching unit 5 to move relative to the rotating circuit board 4 to prepare for processing the other side. When the circuit board 4 is flipped to 90 degrees, the circuit board 4 is perpendicular to the etching unit 5. The displacement component drives the laser scanner 501 to etch the second side of the circuit board 4 again. After the second side is etched, the rotating clamping part 3 drives the processed circuit board 4 to flip and reset to a convenient unloading position. The unloading component of the feeding unit 7 picks up the processed circuit board 4, and at the same time, the loading component can feed in a new circuit board 4. After the rotating clamping part 3 clamps the new board, the device returns to the initial state and is ready to start the next processing cycle. By optimizing the flipping angle required for double-sided processing from 2×180° to 2×90° at a time, the effective processing time ratio is increased to more than 85%, which solves the problems of long auxiliary time and low processing efficiency in traditional processes.

[0025] like Figure 1 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, in a preferred embodiment, based on the above method, the rotating clamping part 3 further includes a rotating shaft 301 rotatably connected to the mounting plate 2, a rotating disk 302 disposed at the end of the rotating shaft 301, and a placement groove 3021 opened on the rotating disk 302 for accommodating the circuit board 4. A connecting rod 3022 is provided between the rotating disks 302 of the rotating clamping parts 3 on both sides of the frame 1. The drive motor 201 is connected to the rotating shaft 301 of one of the rotating clamping parts 3. Furthermore, the rotating disk 302 has a groove 6 that communicates with the placement groove 3021. An electric push rod 601 is fixed in the groove 6. The movable end of the electric push rod 601 is connected to a clamping plate 602. A rubber pad is provided on the clamping plate 602. Specifically, in the initial state, the circuit board 4 is placed manually or by automated equipment into the placement slot 3021 of the rotary disk 302. The placement slot 3021 provides basic positioning. At this time, the electric push rod 601 can be controlled to push the clamping plate 602 to fix the circuit board 4. The rubber pad can prevent wear on the circuit board 4 during clamping. When it is necessary to flip the circuit board 4, the drive motor 201 starts and drives the rotating shaft 301 connected to it to rotate. The rotating shaft 301 drives the rotary disk 302 at its end to rotate. The rotary disk 302 transmits the rotational motion to the rotary disk 302 on the other side through the connecting rod 3022. Thus, the rotating clamping parts 3 on both sides act as a whole, synchronously and at the same angle, driving the clamped circuit board 4 to flip. After processing is completed, the drive motor 201 reverses and drives the entire rotating clamping part 3 and the circuit board 4 to rotate back to the initial position through the same transmission path, ready for unloading and the next loading.

[0026] like Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, in a preferred embodiment, based on the above method, the follow-up lifting assembly further includes a rotating shell 8 rotatably disposed between the mounting plate 2 and the rotating disk 302, a reciprocating screw 801 rotatably connected to the rotating shell 8, and a sleeve 802 threadedly connected to the reciprocating screw 801. The two ends of the etching unit 5 are respectively connected to the sleeves 802 of the follow-up lifting assembly on both sides through connecting rods. Furthermore, a drive gear 3011 is fixed on the rotating shaft 301, and a movable gear 2021 that meshes with the drive gear 3011 is rotatably mounted on the mounting plate 2 via a fixing rod 202. A gear ring 803 that meshes with the movable gear 2021 is provided on the rotating housing 8. A driven bevel gear 8011 is fixedly mounted on one end of the reciprocating screw 801 inside the rotating housing 8, and a fixed bevel gear 203 that meshes with the driven bevel gear 8011 is fixedly mounted on the mounting plate 2. Specifically, the drive motor 201 drives the rotating shaft 301 to rotate, thereby driving the circuit board 4 to flip. The rotation of the rotating shaft 301 is transmitted through the meshing of the drive gear 3011 and the movable gear 2021. The movable gear 2021 drives the gear ring 803 to rotate, which in turn drives the rotating housing 8 to generate rotational motion. This motion is transmitted through rigid gear meshing, ensuring a strict and delay-free synchronous relationship between the laser scanner 501 and the circuit board 4. This purely mechanical hard connection method avoids the potential problems that may occur with electronic sensors and servo systems. Response delay, signal interference, or drift are significantly reduced, greatly improving the long-term operational stability and reliability of the system. When the rotating housing 8 begins to revolve around the rotating shaft 301, the stationary fixed bevel gear 203 meshes with the driven bevel gear 8011, which rotates accordingly, forcing the driven bevel gear 8011 to rotate. This, in turn, drives the reciprocating screw 801, which is fixed to it, to rotate. The rotation of the reciprocating screw 801 drives the sleeve 802 to move axially via a threaded drive. The sleeve 802, through a connecting rod, drives the etching unit 5 and the laser scanner. 501 makes radial linear motion; before the circuit board 4 flips to 45 degrees, the sleeve 802 drives the etching unit 5 to move axially along the reciprocating screw 801 and away from the circuit board 4; when the circuit board 4 flips between 45 degrees and 90 degrees, the sleeve 802 drives the etching unit 5 to move axially along the reciprocating screw 801 and approach the circuit board 4, so that after the circuit board 4 flips to 90 degrees, the preset working distance between the laser scanner 501 and the surface to be etched on the circuit board 4 is maintained, making the equipment structure layout more compact, significantly reducing the equipment manufacturing cost and space requirements, and effectively solving the problem that traditional equipment needs to reserve a huge safety space due to flipping interference; the purely mechanical structure realizes the automatic control of the laser scanner 501 moving away from the circuit board 4 in the first half of the flipping process to avoid collision, and the laser scanner 501 approaching the circuit board 4 in the second half of the flipping process to restore the working focal length; it ensures that in a compact space, the laser scanner 501 can automatically avoid the risk of collision and automatically restore to the accurate processing focal length at the end of the flipping process, solving the problem that traditional equipment needs to manually refocus or rely on a complex electronic control system.

[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 9 and Figure 10 As shown, in a preferred embodiment, based on the above method, the feeding assembly further includes an arc-shaped elastic telescopic rod 701 fixed to the frame 1 by a support plate 101 and a feeding channel 702 fixed to the top of the arc-shaped elastic telescopic rod 701. When the circuit board 4 in the placement slot 3021 rotates between 0 and 30 degrees, the arc-shaped elastic telescopic rod 701 is in a compressed state, and the feeding channel 702 of the loading component, the feeding channel 702 of the unloading component, and the placement slot 3021 are in a straight line. Furthermore, L-shaped baffles 9 are provided at the discharge end of the feeding channel 702 of the feeding component and the inlet end of the feeding channel 702 of the unloading component. An elastic telescopic tube 901 is provided between the L-shaped baffle 9 and the bottom wall of the feeding channel 702. A force plate 902 is connected to the L-shaped baffle 9. Two actuating rods 3012 are provided on the rotating shaft 301. The two actuating rods 3012 are respectively moved against the force plate 902 on the same side. Specifically, when the circuit board 4 is rotated at an angle greater than 30°, the arc-shaped elastic telescopic rod 701 is not compressed, the feeding channel 702 is not aligned, and at the same time, the actuating rod 3012 does not contact the force plate 902. The L-shaped baffle 9, under the action of the elastic telescopic tube 901, closes the end of the feeding channel 702. When the circuit board 4 is finished processing and rotated back to its original position with the rotating disk 302, entering the 0°-30° range, the actuating rod 3012 on the rotating shaft 301 abuts against the force plate 902 and applies force, causing the force plate 902 to drive the L-shaped baffle 9 away from the feeding channel 702. The elastic telescopic tube 901 is stretched. As the rotating shaft 301 continues to rotate back to its original position, the force acting on the feeding channel 702 is transmitted to the arc-shaped elastic telescopic rod 701, forcibly pushing the feeding channel 702 to move, so that the feeding channel 702 of the loading assembly, the placement slot 3021, and the feeding channel 702 of the unloading assembly are aligned into a straight line for a relatively long time. After the conduit is aligned and opened, the processed circuit board 4 in the placement slot 3021 has sufficient time to slide into the feeding channel 702 of the unloading component under the action of gravity; at the same time, the new circuit board 4 prepared in the feeding channel 702 of the loading component slides into the emptied placement slot 3021 under the action of gravity, completing the automatic loading and unloading; by mechanically linking the alignment and opening actions of the feeding channel 702 with the rotation angle of the rotating shaft 301 from 0 to 30 degrees, it is ensured that the loading and unloading operations can only be carried out at the most appropriate time and position. This mechanical hard limit method avoids the timing errors that may be caused by the delay of sensor detection and control program, and has extremely high reliability; the control of the entire loading and unloading process does not rely on additional motors or cylinders. The opening, closing and alignment power of the channel comes entirely from the main drive motor 201 of the equipment and the flipping action itself, which greatly simplifies the system structure and reduces manufacturing costs and failure rate.

[0028] like Figure 1 and Figure 11As shown, in a preferred embodiment, based on the above method, the displacement assembly further includes a fixed frame 10 fixedly connected to the sleeve 802 via a connecting rod, a longitudinal screw 11 rotatably disposed within the fixed frame 10, a first nut seat 111 threadedly connected to the longitudinal screw 11, a transverse screw 12 rotatably disposed on the bottom side plate of the first nut seat 111, a second nut seat 121 threadedly connected to the transverse screw 12, a first driving member fixedly disposed on the fixed frame 10 for driving the longitudinal screw 11 to rotate, and a second driving member fixedly disposed on the first nut seat 111 for driving the transverse screw 12 to rotate. A laser scanner 501 is disposed on the second nut seat 121. The first and second driving members can be motors or electric motors in the prior art, used to drive the screws to rotate. Specifically, before etching begins, the first and second driving components drive the longitudinal screw 11 and the transverse screw 12 to rotate according to the instructions of the control system. This positions the laser scanner 501 at the starting point of the scanning trajectory by moving the first nut seat 111 and the second nut seat 121. During etching, the control system synchronously sends pulse signals to the first and second driving components according to the preset pad pattern trajectory. The first driving component drives the longitudinal screw 11 to rotate, causing the first nut seat 111 and the entire secondary motion module (including the laser scanner 501) to move in the longitudinal direction. At the same time, the second driving component drives the transverse screw 12 to rotate, causing the second nut seat 121 and the laser scanner 501 to move in the transverse direction relative to the first nut seat 111. By precisely controlling the rotation speed and direction of the two screws, complex planar trajectories such as straight lines and arcs can be synthesized, allowing the laser focus to scan and etch the surface of the circuit board 4 along a predetermined path.

[0029] This invention also discloses a laser etching method for mini LED substrate pads, which involves etching using the aforementioned laser etching apparatus for mini LED substrate pads, and includes the following steps: S10: Initial state and first surface etching: The circuit board 4 is placed horizontally in the placement slot 3021 of the rotating disk 302 and clamped and fixed by the clamping plate 602 driven by the electric push rod 601. The laser scanner 501 is located at the preset focal length position directly above the circuit board 4. The drive motor 201 is not started and the rotating shaft 301 is at the 0-degree position. The displacement component operates, driving the laser scanner 501 to perform precision etching on the front side of the circuit board 4 along a predetermined trajectory. S20: Synchronous flipping and preparation for second-side etching: After the front etching is completed, the drive motor 201 starts, driving the rotating shaft 301 and the rotating disk 302 to start rotating, thereby causing the clamped circuit board 4 to flip. The drive gear 3011 on the rotating shaft 301 drives the movable gear 2021 to rotate, which in turn drives the gear ring 803 fixed to the rotating shell 8, causing the rotating shell 8 and the entire etching unit 5 to rotate in the opposite direction relative to the rotating shaft 301, and the circuit board 4 and the laser scanner 501 to move synchronously in the opposite direction. 0°-45° Reversal period: The rotation of the rotating shell 8 drives the reciprocating screw 801 to revolve. Since the fixed bevel gear 203 is stationary, the driven bevel gear 8011 meshing with it is forced to rotate, driving the reciprocating screw 801 to rotate, so that the sleeve 802 drives the etching unit 5 away from the circuit board 4 along the axial direction of the reciprocating screw 801 to avoid collision. 45°-90° Reversal Period: The mechanical linkage is reversed, and the sleeve 802 drives the etching unit 5 to approach the circuit board 4 along the reciprocating screw 801 axially. During this process, the circuit board 4 to be etched is placed in the feeding channel 702 of the feeding assembly. When the circuit board 4 is flipped to a 90° vertical position, the laser scanner 501 automatically adjusts the preset working distance from the original bottom surface of the circuit board 4 through the above-mentioned linkage, and is ready. S30: Second surface etching: The displacement component drives the laser scanner 501 again to etch the second side of the circuit board 4; S40: Reset and Flipping with Automated Loading and Unloading: After the second etching is completed, the drive motor 201 reverses, driving the rotating shaft 301 and the circuit board 4 to reset and flip from 90° to 0°. When the reset rotation reaches the 0°-30° range, the actuating rod 3012 on the rotating shaft 301 begins to contact and push the force plate 902 at the end of the feeding channel 702. The force plate 902 is pushed and compresses the elastic telescopic tube 901 through the L-shaped baffle 9, so that the L-shaped baffle 9 releases the blockage of the end of the feeding channel 702. As the rotating shaft 301 continues to reset and rotate, the arc-shaped elastic telescopic rod 701 is compressed, ensuring that the discharge end of the feeding channel 702 of the loading component, the placement groove 3021, and the inlet end of the feeding channel 702 of the unloading component are aligned in a straight line for a long time. During this period, the electric push rod 601 is released, and the processed circuit board 4 slides into the feeding channel 702 of the unloading component under the action of gravity, completing the unloading. At the same time, the new circuit board 4, which was pre-placed in the feeding channel 702 of the loading component, slides into the empty placement groove 3021 under the action of gravity, completing the loading. When the circuit is reset to the initial position of 0°, the electric push rod 601 is activated, driving the clamping plate 602 to clamp the new circuit board 4, restoring the state described in step S10, and starting a new etching cycle.

[0030] The accompanying drawings in this application are for illustrative purposes only. The dimensions and shapes of the components shown are not actual limitations but are merely schematic representations. In actual implementation, the components can be reasonably configured and adjusted according to specific needs and actual conditions.

[0031] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A laser etching apparatus for pads on a mini LED substrate, comprising a frame (1), characterized in that, Also includes: Mounting plate (2), there are two mounting plates (2) and they are symmetrically arranged on the left and right sides of the frame (1). Each mounting plate (2) is provided with a rotating clamping part (3), and one of the mounting plates (2) is provided with a drive motor (201) for driving the rotating clamping part (3) to rotate. The follow-up lifting mechanism includes two sets of follow-up lifting components respectively disposed on the same side of the rotating clamping part (3) and an etching unit (5) disposed between the two sets of follow-up lifting components. And a feeding unit (7), the feeding unit (7) includes a feeding assembly and a discharging assembly with the same structure and respectively arranged on the front and rear sides of the frame (1); The etching unit (5) includes a laser scanner (501) and a displacement component for driving the laser scanner (501) to move.

2. The laser etching apparatus for mini LED substrate pads according to claim 1, characterized in that, The rotating clamping part (3) includes a rotating shaft (301) rotatably connected to the mounting plate (2), a rotating disk (302) disposed at the end of the rotating shaft (301), and a placement slot (3021) opened on the rotating disk (302) for accommodating the circuit board (4). A connecting rod (3022) is provided between the rotating disks (302) of the rotating clamping parts (3) on both sides of the frame (1). The drive motor (201) is connected to the rotating shaft (301) of one of the rotating clamping parts (3).

3. The laser etching apparatus for mini LED substrate pads according to claim 2, characterized in that, The rotating disk (302) has a groove (6) that communicates with the placement groove (3021). An electric push rod (601) is fixed in the groove (6). The movable end of the electric push rod (601) is connected to a clamping plate (602). A rubber pad is provided on the clamping plate (602).

4. The laser etching apparatus for mini LED substrate pads according to claim 3, characterized in that, The following lifting assembly includes a rotating shell (8) rotatably disposed between the mounting plate (2) and the rotating disk (302), a reciprocating screw (801) rotatably connected to the rotating shell (8), and a sleeve (802) threadedly connected to the reciprocating screw (801). The two ends of the etching unit (5) are respectively connected to the sleeves (802) of the following lifting assemblies on both sides via connecting rods.

5. The laser etching apparatus for mini LED substrate pads according to claim 4, characterized in that, The sleeve (802) moves axially along the reciprocating screw (801); Before the circuit board (4) reaches a flip angle of 45 degrees, the sleeve (802) drives the etching unit (5) to move axially along the reciprocating screw (801) and away from the circuit board (4); when the flip angle of the circuit board (4) is between 45 degrees and 90 degrees, the sleeve (802) drives the etching unit (5) to reset and move axially along the reciprocating screw (801) and approach the circuit board (4), so that after the circuit board (4) flips 90 degrees, the preset working distance between the laser scanner (501) and the surface of the circuit board (4) to be etched is maintained.

6. The laser etching apparatus for mini LED substrate pads according to claim 5, characterized in that, A drive gear (3011) is fixed on the rotating shaft (301), and a movable gear (2021) that meshes with the drive gear (3011) is rotatably arranged on the mounting plate (2) via a fixed rod (202). A gear ring (803) that meshes with the movable gear (2021) is provided on the rotating shell (8). The reciprocating screw (801) is fixed with a driven bevel gear (8011) at one end inside the rotating housing (8), and a fixed bevel gear (203) that meshes with the driven bevel gear (8011) is fixed on the mounting plate (2).

7. The laser etching apparatus for mini LED substrate pads according to claim 6, characterized in that, The feeding assembly includes an arc-shaped elastic telescopic rod (701) fixed on the frame (1) via a support plate (101) and a feeding channel (702) fixed on the top of the arc-shaped elastic telescopic rod (701). When the circuit board (4) in the placement slot (3021) rotates between 0 and 30 degrees, the arc-shaped elastic telescopic rod (701) is in a compressed state, and the feeding channel (702) of the loading component, the feeding channel (702) of the unloading component, and the placement slot (3021) are in a straight line.

8. The laser etching apparatus for mini LED substrate pads according to claim 7, characterized in that, L-shaped baffles (9) are provided at the discharge end of the feeding channel (702) of the feeding component and the inlet end of the feeding channel (702) of the unloading component. An elastic telescopic tube (901) is provided between the L-shaped baffle (9) and the bottom wall of the feeding channel (702). A force plate (902) is connected to the L-shaped baffle (9). Two actuating rods (3012) are provided on the rotating shaft (301). The two actuating rods (3012) are respectively moved against the force plate (902) on the same side.

9. The laser etching apparatus for mini LED substrate pads according to claim 8, characterized in that, The displacement assembly includes a fixed frame (10) fixedly connected to a sleeve (802) via a connecting rod, a longitudinal screw (11) rotatably disposed within the fixed frame (10), a first nut seat (111) threadedly connected to the longitudinal screw (11), a transverse screw (12) rotatably disposed on the bottom side plate of the first nut seat (111), a second nut seat (121) threadedly connected to the transverse screw (12), a first driving member fixed on the fixed frame (10) for driving the longitudinal screw (11) to rotate, and a second driving member fixed on the first nut seat (111) for driving the transverse screw (12) to rotate. The laser scanner (501) is disposed on the second nut seat (121).

10. A laser etching method for mini LED substrate pads, comprising etching using the laser etching apparatus for mini LED substrate pads as described in claim 9, characterized in that, Includes the following steps: S10: Initial state and first surface etching: The circuit board (4) is placed horizontally in the placement slot (3021) of the rotating disk (302) and clamped and fixed by the clamping plate (602) driven by the electric push rod (601). The laser scanner (501) is located at the preset focal length position directly above the circuit board (4). The drive motor (201) is not started, and the rotating shaft (301) is at the 0-degree position. The displacement component operates, driving the laser scanner (501) to perform precision etching on the front side of the circuit board (4) along a predetermined trajectory; S20: Synchronous flipping and preparation for second-side etching: After the front etching is completed, the drive motor (201) is started, which drives the rotating shaft (301) and the rotating disk (302) to start rotating, thereby causing the clamped circuit board (4) to flip. The drive gear (3011) on the rotating shaft (301) drives the movable gear (2021) to rotate, which in turn drives the gear ring (803) fixed to the rotating shell (8), causing the rotating shell (8) and the entire etching unit (5) to rotate in the opposite direction relative to the rotating shaft (301), and the circuit board (4) and the laser scanner (501) to move synchronously in the opposite direction. 0°-45° Reversal period: The rotation of the rotating shell (8) drives the reciprocating screw (801) to revolve. Since the fixed bevel gear (203) is stationary, the driven bevel gear (8011) meshing with it is forced to rotate, driving the reciprocating screw (801) to rotate, so that the sleeve (802) drives the etching unit (5) to move away from the circuit board (4) along the axial direction of the reciprocating screw (801) to avoid collision; 45°-90° Reversal Period: The mechanical linkage is reversed, and the sleeve (802) drives the etching unit (5) to approach the circuit board (4) along the reciprocating screw (801) axially. This process places the circuit board (4) to be etched in the feeding channel (702) of the feeding assembly. When the circuit board (4) is flipped to a 90° vertical position, the laser scanner (501) automatically adjusts the preset working distance from the original bottom surface of the circuit board (4) through the above linkage, and is ready; S30: Second surface etching: The displacement component drives the laser scanner (501) again to etch the second side of the circuit board (4); S40: Reset and Flipping with Automated Loading and Unloading: After the second side is etched, the drive motor (201) reverses, driving the rotating shaft (301) and the circuit board (4) to reset and flip from 90° to 0°. When the rotation is reset to the 0°-30° range, the actuating lever (3012) on the rotating shaft (301) begins to contact and push the force plate (902) at the end of the feeding channel (702). The force plate (902) is pushed and compresses the elastic telescopic tube (901) through the L-shaped baffle (9), thereby releasing the L-shaped baffle (9) from closing the end of the feeding channel (702). As the rotating shaft (301) continues to reset and rotate, the arc-shaped elastic telescopic rod (701) is compressed, ensuring the feeding of the feeding assembly. The discharge end of the channel (702), the placement groove (3021) and the feeding end of the feeding channel (702) of the unloading component are aligned in a straight line for a long time. During this period, the electric push rod (601) is released, and the processed circuit board (4) slides into the feeding channel (702) of the unloading component under the action of gravity to complete the unloading. At the same time, the new circuit board (4) that was previously placed in the feeding channel (702) of the loading component slides into the empty placement groove (3021) under the action of gravity to complete the loading. When the circuit is reset to the initial position of 0°, the electric push rod (601) is activated, driving the clamping plate (602) to clamp the new circuit board (4), restoring the state described in step S10, and starting a new etching cycle.

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