Spoiler automatic polishing process based on dynamic deviation of abrasive paper

Abstract

The invention discloses an automatic spoiler polishing process based on dynamic deviation of abrasive paper. The automatic spoiler polishing process comprises a preparation stage and a polishing stage. In the preparation stage, different polishing area types are divided according to the three-dimensional model of the spoiler, and an independent polishing parameter set is set for each type. And in the polishing stage, the mechanical arm recognizes the model of the spoiler and calls the corresponding parameter set for polishing. The method is characterized in that an abrasive paper dynamic offset mechanism is introduced, when abrasion of a specific point, making contact with the workpiece, on the abrasive paper reaches the limit, the mechanical arm controls the abrasive paper to move by a preset offset d, and a new and unabraded abrasive paper polishing spot makes contact with the workpiece. Through the periodic dynamic offset, the utilization rate of the abrasive paper is greatly improved, and the problem that in traditional automatic grinding, local waste of the abrasive paper is serious is effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of industrial robot automation processing, and particularly relates to a spoiler automatic polishing process based on dynamic offset of sandpaper. BACKGROUND

[0002] In high-end manufacturing industry, such as aircraft wing surface, automobile body covering, etc., the surface quality requirement is extremely high, and fine polishing treatment is usually needed to eliminate mold joint line, surface micro-defects, and obtain consistent smoothness and streamline modeling. As a typical part with complex curved surface, the polishing work of spoiler has long relied on manual operation of skilled workers. Manual polishing has many drawbacks such as low efficiency, high labor intensity, difficult to guarantee quality consistency, dust harm to workers' health, etc. In addition, the joint line without polishing will cause uneven paint film during spraying, resulting in color difference or paint accumulation, which seriously affects the final gloss and visual effect, and cannot meet the extremely high quality requirements of the automobile industry for appearance parts. Traditional polishing methods mostly rely on manual operation, and have problems such as low efficiency, poor consistency, low utilization rate of sandpaper, and great safety hazards.

[0003] In addition, due to the characteristics of the narrow edge region of the spoiler, the polishing surface is mostly arc-shaped and the radii are inconsistent, etc., when using a mechanical arm for automatic polishing, the following problems exist. On the one hand, most polishing systems of mechanical arms use fixed polishing parameters (such as fixed polishing pressure, fixed sandpaper speed, etc.) to deal with the entire workpiece, which cannot adapt to different geometric feature areas on the spoiler, which leads to the problems of insufficient polishing in flat areas, and over-polishing, burning or even damaging the workpiece in sharp corners and curved surface areas. On the other hand, due to the fact that the polishing surface of the spoiler is mostly arc-shaped and the polishing area to be polished is relatively narrow, when using traditional methods for polishing, the area of the sandpaper in contact with the workpiece (i.e. the "sandpaper polishing spot") will be continuously worn. Due to the relatively fixed trajectory and posture of the mechanical arm, the wear is concentrated in the same local area of the sandpaper. Once the abrasive particles in this area fall off or the wear is ineffective, even if the other areas of the sandpaper are intact, it will be judged as ineffective and needs to be replaced. This leads to low utilization rate of a single sheet of sandpaper, causing huge waste of consumables, and frequent replacement of sandpaper also increases downtime and reduces overall production efficiency. In addition, the existing technology also lacks quantification of the degree of sandpaper wear and an intelligent compensation mechanism for the degree of sandpaper wear. As the polishing process progresses, the contact points between the sandpaper and the polishing area of the spoiler will gradually be worn flat. Therefore, during the middle and later stages of the life of the sandpaper, if the same polishing parameters such as polishing pressure, polishing time, etc. as in the early stage of the life of the sandpaper are continued to be used, the polishing quality will gradually decrease, eventually leading to inconsistent polishing quality between different parts of the same workpiece or between different workpieces, and making it difficult to improve product pass rate. SUMMARY

[0004] The present application aims to overcome the defects in the prior art and provide an automatic spoiler polishing process based on dynamic offset of sandpaper.

[0005] For the convenience of understanding, the following is an explanation of some concepts mentioned in this paper: Sandpaper polishing spot: the polishing spot on the sandpaper formed during the polishing process of the sandpaper and the single polished point of the spoiler.

[0006] Spoiler polishing spot: the polishing spot on the sandpaper formed during the polishing process of the sandpaper and the single polished point of the spoiler.

[0007] To achieve the above-mentioned purpose, the technical solution of the present application is to design an automatic spoiler polishing process based on dynamic offset of sandpaper, comprising: S1: Preparation stage: S11: In the mechanical arm programming system, according to the three-dimensional model of different types of spoilers, different polishing area types are divided by manual or automatic recognition according to the different diameters of spoiler polishing spots Ø; through intelligent analysis (manual or automatic) of the three-dimensional model of the spoiler, different polishing area types are divided according to the geometric characteristics (reflected as the diameter of the spoiler polishing spot Ø) of the area to be polished.

[0008] S12: Different polishing parameter sets are set according to different polishing area types of the spoiler; the polishing parameter set at least includes the polishing spot diameter Ø corresponding to the different polishing spots of the spoiler and the distance value D between the center point of the sandpaper and the center point of the spoiler polishing spot recorded in real time; for different polishing area types, a set of polishing parameter sets is set. The core parameters of this parameter set at least include two: one is the target spoiler polishing spot diameter Ø of this area, which determines the theoretical contact area of the sandpaper and the spoiler during polishing; the other is the distance D between the center point of the sandpaper and the center point of the spoiler polishing spot. The distance D is a dynamic variable, and its initial value is set according to the process, and is updated and recorded continuously during the polishing process through dynamic offset.

[0009] S2: Polishing stage: S21: Feeding; S22: The mechanical arm recognizes the type of spoiler and calls the corresponding polishing parameter set according to the type of spoiler; S23: The mechanical arm polishes different types of polishing areas of the spoiler according to the predetermined polishing parameter set; S231: When the wear amount W of the sandpaper polishing spot reaches the wear limit for a specific distance value D, the mechanical arm controls the sandpaper to dynamically offset by a preset polishing offset d, and the distance value or , The distance value before offset; when the initial distance value D equals R-Ø1 / 2, the distance value after offset. When the initial distance value D is 0, the distance value after offset Where R is the radius of the sandpaper, and Ø1 is the diameter of the first spoiler's grinding mark.

[0010] S24: Feeding.

[0011] Specifically, the grinding parameter set also includes: actual grinding time T s The preset polishing time T for the polished point y The sanding path, sanding pressure F, and sandpaper speed V. Actual sanding time T. s Primarily used for calculating wear models to determine whether the sandpaper has reached its wear limit; preset sanding time T. y The total grinding time for a specific spoiler grinding spot is determined; the grinding path is the optimal grinding route generated based on the system's preset parameter set; the grinding pressure F is the pressure applied to the workpiece by the grinding disc during grinding; and the sandpaper rotation speed V is the rotation speed of the sandpaper grinding disc during grinding. These parameters are stored in association with the area type, enabling the system to execute completely different grinding strategies for different areas.

[0012] Specifically, the model for the amount of sandpaper wear is as follows: ; Where: W is the abrasion amount of the sandpaper, F is the sanding pressure, V is the sandpaper rotation speed, T is the sanding duration, k is the proportionality constant of the sandpaper, a is the exponential constant of the sanding pressure, and b is the exponential constant of the sandpaper rotation speed. This model provides a soft measurement method based on process parameters. The system only needs to record F, V, and T in real time to quickly calculate the current abrasion amount W through an embedded controller. This greatly reduces the system hardware cost and complexity, and improves reliability. It achieves predictable and manageable wear status.

[0013] Optionally, the initial distance value D is 0 or equal to R-Ø1 / 2, where R is the sandpaper radius and Ø1 is the diameter of the first spoiler grinding spot. When Ø1 is greater than or equal to 2R, the entire sandpaper is ground in one pass without offset. This invention mainly addresses the problem of low sandpaper utilization when Ø is less than or even much less than 2R. Setting the initial distance value D to 0 or equal to R-Ø1 / 2 are two of the most commonly used initialization strategies. First, D=0. In this case, the center of the sandpaper coincides with the center of the target grinding spot, and the initial contact area is the exact center of the sandpaper. This strategy is simple and direct, suitable for most symmetrical grinding scenarios. Second, D=R-Ø1 / 2. In this case, the edge of the sandpaper is tangent to the edge of the grinding spot, making the initial working area located at the edge of the sandpaper. Using this strategy, wear can begin from the edge of the sandpaper, reserving more space and possibilities for subsequent multiple dynamic offsets towards the center. By optimizing the starting point, a better grinding path can be planned, allowing a single sheet of sandpaper to be utilized more evenly and fully.

[0014] Optionally, the grinding offset d is equal to the diameter Ø of the spoiler grinding spot after offset. This offset method can be used when the diameter Ø of the spoiler grinding spot corresponding to different grinding area types differs slightly, that is, the grinding offset d is equal to the diameter Ø of the spoiler grinding spot after offset.

[0015] Optionally, the grinding offset d is equal to the average or maximum value of the grinding spot diameter Ø of the disturbance flow plate. When the grinding spot diameter Ø of the disturbance flow plate corresponding to different grinding area types is not significantly different, this offset method can be adopted, that is, the grinding offset d is equal to the average or maximum value of the grinding spot diameter Ø of the disturbance flow plate, to simplify the program.

[0016] Furthermore, in the S2: polishing stage, the abrasion amount of the sandpaper is reduced from the initial abrasion amount. (New sandpaper has an initial wear of 0) to the sanding limit The entire process is divided into three stages: pre-polishing, mid-polishing, and post-polishing. to To refine the initial stage, to To refine the mid-term, to To ensure consistent sanding results in the later stages, the sanding pressure F is dynamically adjusted at each stage, gradually increasing from the early to the late stages. As the sanding process continues, the wear on the sandpaper marks deepens. In the later stages of sandpaper wear, the grit size on the sandpaper surface gradually decreases. Using the previous sanding pressure F at this point may result in insufficient sanding force and a poorer sanding effect. Therefore, increasing the sanding pressure F ensures consistent sanding throughout the process.

[0017] Furthermore, S23: the robotic arm polishes the spoiler according to a predetermined set of polishing parameters, including... S232: The robotic arm uses coarse sandpaper for the first round of polishing. When the total wear W of the coarse sandpaper reaches the polishing limit... At that time, the robotic arm automatically moves to the replacement point to replace the new coarse sandpaper; S233: The robotic arm uses fine sandpaper for a second round of polishing. When the total wear W of the fine sandpaper reaches the polishing limit... At this time, the robotic arm automatically moves to the replacement point to replace the fine sandpaper. Generally, during sanding, coarse sandpaper is used for the first pass, followed by fine sandpaper for the second pass, thus improving the sanding quality. During the sanding process, the overall wear W of the sandpaper reaches its sanding limit. When the time comes, the robotic arm automatically moves to the replacement point (sandpaper quick change station) to replace the sandpaper. At this time, the grinding head used is a double grinding head, with the coarse sandpaper grinding disc and the fine sandpaper grinding disc installed on both sides of the end of the robotic arm. The grinding head is switched by rotating during use.

[0018] The advantages and beneficial effects of this invention are as follows: 1. By dividing the surface of the spoiler to be polished into different polishing zone types according to the different diameters of the polishing spots, and independently configuring each zone including the actual polishing time T. s The preset polishing time T for the polished point y The optimal parameter set, including grinding path, grinding pressure F, and sandpaper rotation speed V, effectively improves the problem of insufficient adaptability in traditional robotic arm grinding, which often uses fixed grinding parameters. This zoned grinding strategy enables the robotic arm to intelligently adapt to the complex changes in the workpiece surface, achieving high-quality grinding of complex curved workpieces.

[0019] 2. This invention controls the sandpaper to continuously shift a certain distance (sanding offset) throughout its lifespan, transforming sandpaper wear from traditional single-point sanding wear to wear on all sanding surfaces. This maximizes the utilization of every sandpaper surface capable of participating in sanding, thus directly reducing the high cost of sandpaper consumables and minimizing production downtime caused by sandpaper replacements, bringing considerable economic and time benefits to enterprises.

[0020] 3. This invention quantifies sandpaper wear, automatically identifies the early, middle, and late stages of the sandpaper's life cycle, and adjusts the grinding pressure accordingly. This proactive compensation strategy offsets the decrease in cutting force caused by sandpaper passivation, ensuring consistent workpiece surface quality across the early, middle, and late stages of the sandpaper's lifespan, thus improving the consistency of finished products.

[0021] 4. By dividing the production line into zones and setting parameter sets for different spoiler models during the preparatory stage, the production line can quickly switch between processing programs for different spoiler models, significantly improving the flexibility of the production line. This not only greatly reduces reliance on skilled workers and shortens the personnel training cycle, but also makes the production cycle more stable and controllable, greatly improving the production line's rapid changeover capability. Attached Figure Description

[0022] Fig. 1 This is a flow chart of the polishing process of this invention; Fig. 2 This is a detailed flowchart of step S23 of the present invention. Detailed Implementation

[0023] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solutions of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0024] according to Figs. 1-2 As shown, taking the grinding of an X1 spoiler (X1 is only used to specifically refer to a certain model of spoiler in the company and has no special meaning) as an example: The grinding head uses a dual grinding head, with coarse and fine sandpaper installed respectively. The first grinding process uses 600-grit coarse sandpaper. The second grinding process uses 800-grit fine sandpaper. Both coarse and fine sandpaper are 5-inch grinding discs, with a sandpaper radius R of approximately 63mm. The hardware mainly includes: a six-degree-of-freedom industrial robot (robotic arm), a robot controller, an end effector (which can integrate a force control sensor), a rotary grinding tool head (with a sandpaper disc), a workpiece fixture and positioning table, a loading / unloading conveyor line (or robot), an automatic sandpaper changing station, and a central control computer (including an HMI). The software system includes: offline programming and simulation software, robot control software, and process control software integrating the core grinding algorithm (region division, parameter set management, wear model calculation, offset logic judgment, and pressure segmentation control).

[0025] S1: Preparatory Phase S11: In the robotic arm programming system, based on the 3D models of different spoiler models, different grinding area types are defined according to the different grinding spot diameters Ø of the spoiler, either manually or automatically. The X1 spoiler model is imported into the software, and based on the model's geometric features, the surface to be ground is divided into areas C1, C2, C3, and C4 using the surface selection tool in the software, either manually or with the aid of feature recognition algorithms. After the division is complete, each area is assigned an independent attribute label in the software.

[0026] S12: Set different grinding parameter sets according to different grinding area types of the spoiler; the grinding parameter set includes the grinding spot diameter Ø corresponding to different grinding spots of the spoiler and the distance D between the center point of the sandpaper and the center point of the grinding spot of the spoiler, which is recorded in real time; the actual grinding time T s The preset polishing time T for the polished point y The grinding path, grinding pressure F, and sandpaper speed V.

[0027] S2: Polishing stage: S21: Loading; The operator or a cooperating robotic arm places the X1 spoiler on the tire membrane base, and the positioning pin ensures that its position is accurate.

[0028] S22: The robotic arm identifies the spoiler model and calls the corresponding grinding parameter set based on the spoiler model; the robotic arm's vision system takes a picture of the workpiece and identifies it as model X1. After receiving the model signal, the controller calls the complete set of grinding programs and related parameter sets preset for the X1 spoiler from the parameter library.

[0029] S23: The robotic arm grinds different types of grinding areas on the spoiler according to the predetermined grinding parameter set; the robotic arm carrying sandpaper begins to move along the predetermined trajectory to perform grinding.

[0030] S231: For a specific distance value D, the wear amount W of the sandpaper abrasion spot reaches the wear limit. At that time, the robotic arm controls the sandpaper to dynamically shift according to the preset sanding offset d, and the distance value after the shift is... or , This is the distance value before the offset; S232: The robotic arm uses coarse sandpaper for the first round of polishing. When the total wear W of the coarse sandpaper reaches the polishing limit... At this point, the robotic arm automatically moves to the replacement point to change to new coarse sandpaper. The robotic arm first uses the grinding disc equipped with 600-grit sandpaper to grind according to the designated areas and corresponding parameters. When all areas that can be ground with the 600-grit sandpaper have completed the grinding offset command and reached their grinding limits... At this time, the robotic arm moves to the quick-change station, removes the sanding disc, and replaces it with a new 600-grit sandpaper. The internal counter is then reset to zero.

[0031] S233: The robotic arm uses fine sandpaper for a second round of polishing. When the total wear W of the fine sandpaper reaches the polishing limit... At this time, the robotic arm automatically moves to the replacement point to replace the fine sandpaper. The robotic arm uses a polishing disc with 800-grit sandpaper installed to repeat a process similar to S231, but uses a fine polishing parameter set (also set in zones, but with different corresponding parameter sets).

[0032] S24: Unloading. After all grinding processes are completed, the robotic arm or a dedicated unloading mechanism removes the ground spoiler and places it in the finished product area or transports it to the next workstation.

[0033] Explanation of the dynamic offset process: To improve sandpaper utilization, during the sanding stage, the wear amount W of the sandpaper sanding mark reaches the wear limit at a specific distance value D. At that time, the robotic arm controls the sandpaper to dynamically shift according to the preset sanding offset d, and the distance value after the shift is... or , The distance value before offset; when the initial distance value D equals R-Ø1 / 2, the distance value after offset. When the initial distance value D is 0, the distance value after offset Where R is the radius of the sandpaper, and Ø1 is the diameter of the first spoiler's grinding mark.

[0034] The two optimal initial polishing methods are as follows: The first scenario involves the initial distance value D equaling R - Ø1 / 2 (meaning the first sandpaper scratch is located on the outermost edge of the sandpaper). The sandpaper scratch shifts from the outside inwards, and the shifted distance value... Ø1 is the diameter of the first spoiler's polishing mark.

[0035] The second method involves the initial distance value D being 0 (meaning the first sandpaper scratch is at the center of the sandpaper). The sandpaper scratch shifts from the inside out, and the distance value after the shift... Where R is the radius of the sandpaper.

[0036] In addition, the first sandpaper sanding mark can also be located in the middle position (that is, any position between the center of the sandpaper and the outermost edge of the sandpaper). When offsetting, the distance value after offsetting... or The offset calculation at this point is more complex compared to the two cases mentioned above.

[0037] There are generally two ways to determine the value of d: Taking the parameter set of the X1 spoiler mentioned above as an example, the diameter Ø of the spoiler grinding spot for different grinding area types of the X1 spoiler is as follows: For region C1: the diameter of the spoiler polishing mark is 12mm; For zone C2: the diameter of the spoiler polishing mark is 9mm; For region C3: the diameter of the spoiler polishing mark is 4mm; For area C4: the diameter of the spoiler grinding mark is 3mm.

[0038] The first method involves a grinding offset d equal to the diameter Ø of the spoiler's grinding spot after the offset. In other words, the offset amount performed each time is the diameter Ø of the spoiler's grinding spot after the offset. For example, in case one: when grinding area C1 (area C1 is not yet fully ground), the wear amount W of the sandpaper grinding spot at a certain location reaches the wear limit. At this point, offsetting is required. Since area C1 is not yet fully polished, it still needs to be polished after offsetting. Therefore, the offset amount d is equal to the diameter of the spoiler polishing spot corresponding to area C1, i.e., d = 12mm. Case 2: When polishing area C1 (area C1 is just finished), the wear amount W of the sandpaper polishing spot at a certain point reaches the wear limit. At this point, offsetting is required. Since area C1 has just been polished, according to the polishing route setting, area C2 needs to be polished after offsetting. Therefore, the polishing offset d is equal to the diameter of the spoiler polishing spot corresponding to area C2, i.e., d=9mm.

[0039] The second method involves setting the grinding offset d to the average or maximum value of the grinding spot diameter Ø of the spoiler. For regions C3 and C4, the corresponding spoiler grinding spot diameters are 4mm and 3mm, respectively, which are not significantly different. Therefore, when selecting the grinding offset d, the grinding offset d for regions C3 and C4 can be directly set to the average or maximum value of the two, i.e., 3.5mm or 4mm, preferably the maximum value of 4mm.

[0040] Furthermore, because the sandpaper particles gradually wear down during sanding, using the same sanding pressure will increase the distance between the sandpaper and the workpiece surface, resulting in a decrease in sanding effectiveness. Therefore, to ensure consistent sanding results throughout the sandpaper's lifespan, the sandpaper wear level should be reduced from the initial wear level during the sanding process. To the limit of polishing The entire process is divided into three stages: pre-polishing, mid-polishing, and post-polishing. to To refine the initial stage, to To refine the mid-term, to For the later stages of polishing, the number of reciprocating polishing strokes (n) and / or the polishing pressure (F) are dynamically adjusted at each stage. From the early to the later stages of polishing, the number of reciprocating polishing strokes (n) and / or the polishing pressure (F) gradually increase. Generally, =0, At 40% Up to 50% between, At 60% Up to 80% Between. When the same batch of sandpaper is used to sand the same type of workpiece, its It can be calculated. During the grinding process, the wear monitoring unit not only calculates W, but also determines the stage of W in real time. When W enters the middle stage, the system sends a command to the force controller to smoothly switch the target pressure to the corresponding pressure value. In this way, as the sandpaper becomes duller, the pressure gradually increases, thereby compensating for the decrease in cutting force and keeping the material removal rate of the baffle relatively constant throughout the life cycle of the sandpaper. The thresholds for the early, middle, and late stages are pre-calibrated experimentally based on the specific type of sandpaper used and the grinding process requirements, and stored in the control system.

[0041] It is important to note here that, in conjunction with the sanding offset, the sanding route should preferably be divided into sanding areas with larger diameter spoiler sanding spots first, followed by sanding areas with smaller diameter spoiler sanding spots. However, it is not necessarily done sequentially from largest to smallest, but rather needs to be dynamically adjusted according to the specific sanding situation.

[0042] Specifically, taking the parameters of the X1 spoiler mentioned above as an example, after grinding the C1 area (the diameter of the spoiler grinding spot is 12mm), the wear amount W of the sandpaper grinding spot in this area has not yet reached the wear limit. The process is still in the early stages of polishing. At this point, it's necessary to switch to the next polishing area. Preferably, the next polishing area is area C3 (spoiler polishing spot diameter is 4mm) or area C4 (spoiler polishing spot diameter is 3mm). When the next polishing area is C3, since the spoiler polishing spot diameter in area C1 is 12mm, the sandpaper polishing spot diameter is also 12mm (actually composed of numerous 12mm diameter rings). After switching polishing areas, a new sandpaper polishing spot (4mm diameter) is created. To fully utilize the original 12mm diameter sandpaper polishing spot, three offsets of 4mm diameter polishing spots can be made within a 12mm range. The robotic arm needs to record and control the offset direction, the initial polishing position after switching to the new polishing area, and the wear degree of each area. Similarly, when the next polishing area is C4, four offsets can be made.

[0043] When the robotic arm calculates and selects the next grinding area, it prioritizes areas where the spoiler grinding diameter is divisible by the diameter of the previous area's spoiler grinding. If none of these are divisible, it can select multiple grinding areas where the sum of the spoiler grinding diameters equals the diameter of the previous area's spoiler grinding (e.g., C1 area 12mm = C2 area 9mm + C4 area 3mm). If none of these conditions apply, it selects the grinding area with the smallest difference between its spoiler grinding diameter (or the sum of its diameters) and the diameter of the previous area's spoiler grinding.

[0044] The sandpaper abrasion amounts mentioned above are all based on the sandpaper abrasion amount model. Calculated; Where: W is the abrasion amount of the sandpaper, F is the sanding pressure, V is the sandpaper rotation speed, T is the sanding time, k is the proportionality constant of the sandpaper, a is the exponential constant of the sanding pressure, and b is the exponential constant of the sandpaper rotation speed.

[0045] The following explains how to obtain k (the proportional constant of the sandpaper), a (the exponential constant of the sanding pressure), and b (the exponential constant of the sandpaper rotation speed): 1. Establish a unified wear endpoint, i.e., the grinding limit: Define an objective and repeatable wear endpoint as a unified termination standard for all sandpaper tests. This endpoint corresponds to a fixed, but numerically unknown, grinding limit. By observing under a microscope, we can determine whether the wear pattern of the abrasive grains has reached a certain state (such as most abrasive grains showing obvious flattening).

[0046] 2. Conduct a systematic life-end experiment. During the experiment, a brand new sample of sandpaper of the same type should be used each time, and the same material should be sanded continuously or intermittently. The condition of the sandpaper should be checked periodically according to the unified standard defined in step 1 (establishing a unified wear endpoint). Once the sandpaper reaches the unified wear endpoint, the experiment should be stopped immediately, and the total sanding time T accumulated from start to finish should be recorded (this process is a continuous sanding and checking process, especially in the later stages, requiring continuous checking; the final total sanding time T is the sum of the sanding times at each stage).

[0047] At the same target wear level Under these conditions, conduct at least four different combinations of F and V, and record the results. The corresponding polishing time T is used to form a dataset {( , , ),( , , ),( , , ),( , , )}; in: ≠ , ≠ .

[0048] 3. Parameter solution process Substitute the experimental data into the mathematical model and use statistical fitting methods (such as multiple linear regression or least squares method) to solve for the unknown constants k, a, and b in the model. For the same type of sandpaper polishing the same material, the exponential constant a of the polishing pressure and the exponential constant b of the sandpaper rotation speed are fixed values ​​(but in practice only approximate values ​​can be obtained, but by conducting multiple sets of experiments, the theoretical values ​​can be approximated). Once obtained through the above calculations, they can be reused in subsequent polishing of the same sandpaper and material.

[0049] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An automatic spoiler polishing process based on dynamic sandpaper offset, wherein the polishing marks on the sandpaper and on the spoiler formed during the polishing process of a single polished point on the spoiler are respectively the sandpaper polishing mark and the spoiler polishing mark, characterized in that, include, S1: Preparatory Phase S11: In the robotic arm programming system, based on the three-dimensional model of different models of spoilers, different grinding area types are divided according to the different grinding spot diameters Ø of the spoilers through manual or automatic identification. S12: Set different grinding parameter sets according to different grinding area types of the spoiler; the grinding parameter set includes at least the diameter Ø of the spoiler grinding spot and the distance D between the center point of the sandpaper and the center point of the spoiler grinding spot, which is recorded in real time; S2: Polishing stage: S21: Loading materials; S22: The robotic arm identifies the spoiler model and calls up the corresponding grinding parameter set according to the spoiler model; S23: The robotic arm grinds different types of grinding areas of the spoiler according to a predetermined grinding parameter set; S231: For a specific distance value D, the wear amount W of the sandpaper abrasion spot reaches the wear limit. At that time, the robotic arm controls the sandpaper to dynamically shift according to the preset sanding offset d, and the distance value after the shift is... or , This is the distance value before the offset; S24: Feeding.

2. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, The polishing parameter set also includes: actual polishing time T. s The preset polishing time T for the polished point y The grinding path, grinding pressure F, and sandpaper speed V.

3. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, The model for sandpaper abrasion is as follows: ; Where: W is the abrasion amount of the sandpaper, F is the sanding pressure, V is the sandpaper rotation speed, T is the sanding time, k is the proportionality constant of the sandpaper, a is the exponential constant of the sanding pressure, and b is the exponential constant of the sandpaper rotation speed.

4. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, The initial distance value D is 0 or equal to R-Ø1 / 2, where R is the radius of the sandpaper and Ø1 is the diameter of the first spoiler abrasion mark.

5. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, The grinding offset d is equal to the diameter Ø of the grinding spot on the spoiler after the offset.

6. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, The grinding offset d is equal to the average or maximum value of the grinding spot diameter Ø of the interference flow plate.

7. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, S2: The polishing stage, which reduces the abrasion of the sandpaper from the initial abrasion amount. (New sandpaper has an initial wear of 0) to the sanding limit The entire process is divided into three stages: pre-polishing, mid-polishing, and post-polishing. to To refine the initial stage, to To refine the mid-term, to To prepare for the later stages of polishing, the polishing pressure F is dynamically adjusted at each stage, with the polishing pressure F gradually increasing from the early stage to the later stage.

8. The automatic polishing process for spoilers based on dynamic sandpaper offset according to claim 1, characterized in that, S23: The robotic arm polishes the spoiler according to a predetermined set of polishing parameters, including... S232: The robotic arm uses coarse sandpaper for the first round of polishing. When the total wear W of the coarse sandpaper reaches the polishing limit... At that time, the robotic arm automatically moves to the replacement point to replace the new coarse sandpaper; S233: The robotic arm uses fine sandpaper for a second round of polishing. When the total wear W of the fine sandpaper reaches the polishing limit... At that time, the robotic arm automatically moves to the replacement point to replace the fine sandpaper.

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