Metal product electroplating device and method facilitating uniform electroplating

Abstract

The invention discloses a metal product electroplating device and method facilitating uniform electroplating, and relates to the technical field of metal product electroplating devices facilitating uniform electroplating, the metal product electroplating device facilitating uniform electroplating comprises a control table, and an electroplating liquid tank is formed in the upper surface of the control table. According to the metal product electroplating device and method facilitating uniform electroplating, before a string copper part is electroplated, the string copper part is immersed and taken out in cooperation with a control block, a lifting rod, a lifting table, a clamping plate, an arc-shaped spring rod, a hook plate, a hanging handle and a filter box; and the bracelet copper piece is not clamped and shielded by the clamp after being immersed in the electroplating liquid, so that the situation that part of the region of the bracelet copper piece is difficult to electroplate due to the shielding of the clamp is avoided, and the problems that the bracelet copper piece is relatively round, the clamp is inevitably in tight contact with the bracelet copper piece during clamping, and the electroplating of the bracelet copper piece is shielded are solved.

Description

Technical Field

[0001] This invention relates to the technical field of metal plating apparatus for facilitating uniform electroplating, specifically to a metal plating apparatus and method for facilitating uniform electroplating. Background Technology

[0002] Electroplating is a key process that uses the principle of electrolysis to plate a metal or alloy layer onto the surface of metal products in order to achieve functions such as corrosion resistance, improved wear resistance, conductivity, and decoration. It is widely used in hardware, electronics, automobiles, aerospace and other fields. Common processes include rack plating, barrel plating, and continuous plating, which are suitable for workpieces of different sizes and shapes.

[0003] However, when existing electroplating equipment clamps copper bracelet parts, since the copper bracelet parts are mostly round after processing before electroplating, the clamps need to fit more tightly to the surface of the copper bracelet parts. As a result, the clamps can easily block the surface of the copper bracelet parts, leading to uneven electroplating. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an electroplating apparatus and method for metal products that facilitates uniform electroplating, thus solving the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an electroplating device for metal products that facilitates uniform electroplating, comprising a control console, an electroplating solution tank on the upper surface of the control console, a processing tank on the upper surface of the control console, a control rod passing through the control console and slidably connected at the point of penetration, a power source fixed on the upper surface of the control rod, cables fixed at both ends of the power source, the cables being electrically connected to the power source, a clamp fixed at the end of the cable away from the power source, a clamping device for facilitating the fixing of hand-held copper parts on the surface of the control rod, and an auxiliary device for increasing the uniformity of electroplating on the side of the clamping device; The clamping device includes a control block, a lifting rod, a lifting platform, a clamping plate, an arc-shaped spring rod, a hook plate, a handle, a filter box, and a limiting ring. The control block is slidably connected to the bottom surface of the control rod, and the lifting rod is hinged to the bottom surface of the control block. The control block slides to drive the lifting rod to rotate.

[0006] According to the above technical solution, the side wall of the lifting platform is hinged to the end of the lifting rod away from the control block. There are two sets of control blocks and lifting rods, which are respectively set on the left and right sides of the lifting platform. The lifting rods on the left and right sides rotate simultaneously, driving the lifting platform to move up and down.

[0007] According to the above technical solution, the clamping plate is hinged to the bottom surface of the lifting platform, one end of the arc-shaped spring rod is fixedly connected to the side wall of the lifting platform, and the other end of the arc-shaped spring rod is fixedly connected to the side wall of the clamping plate. When the clamping plate rotates, it compresses the arc-shaped spring rod.

[0008] According to the above technical solution, the hook plate is fixedly connected to the side wall of the clamping plate, the handle is attached to the upper surface of the hook plate, the filter box is fixedly connected to the side wall of the handle, and the limiting ring is rotatably connected to the side wall of the lifting rod.

[0009] According to the above technical solution, the auxiliary device includes a rack, a sliding rod, a float, a gear, a rotating rod, and a striking rod. The rack is fixedly connected to the front of the filter box, the sliding rod passes through the side wall of the filter box and fits snugly at the penetration point, and the float is fixedly connected to the side end of the sliding rod, with the float filled with air.

[0010] According to the above technical solution, the sliding rod passes through the gear and is fixedly connected at the point of penetration. The gear meshes with the rack. The rotating rod is fixedly connected to the side wall of the gear. The striking rod is hinged to the side wall of the rotating rod. The rotation of the rotating rod drives the striking rod to strike the filter box.

[0011] According to the above technical solution, the clamping device is provided with a turbulence device in the middle for cleaning the electroplating solution on the surface of the copper parts of the bracelet. The turbulence device includes an iron rod, a magnetic block, a connecting rod and a turbulence plate. The sliding rod passes through the iron rod and is rotatably connected at the point of penetration.

[0012] According to the above technical solution, the magnetic block is slidably connected to the front of the lifting platform, the connecting rod is hinged to the side wall of the magnetic block, the spoiler is hinged to the bottom surface of the lifting platform, and the end of the connecting rod away from the lifting platform is hinged to the side wall of the spoiler.

[0013] A method for electroplating metal products to facilitate uniform electroplating includes the following steps: S1: The wet wax casting process is used to create the molded shell in the shape of the bracelet pieces; S2: Select real gold leaf and apply it to the predetermined position on the surface of the copper part, cover or electro-fill with glass powder, and then put it into a high-temperature furnace for firing. S3: Clean the copper parts that have been laminated with gold foil and protect the gold foil area using a partial shielding technique; S4: Electroplating of the copper parts of the bracelet is performed using an electroplating solution containing real gold. S5: Remove the electroplated copper parts of the bracelet and clean, dry and inspect them.

[0014] This invention provides an electroplating apparatus and method for metal products that facilitates uniform electroplating. It offers the following advantages: (1) The present invention is equipped with a clamping device. Before electroplating the copper bracelet, the control block, lifting rod, lifting platform, clamping plate, arc spring rod, hook plate, hanging handle and filter box are used to immerse and remove the copper bracelet. At the same time, since the copper bracelet is held in the filter box, the copper bracelet will not be blocked by the clamp after being immersed in the electroplating solution. This avoids the problem that some areas of the copper bracelet are difficult to electroplat due to the clamp blocking. It solves the problem that the copper bracelet is round and the clamp inevitably comes into close contact with the copper bracelet during clamping, thus blocking the electroplating of the copper bracelet. When the copper bracelet is taken out after electroplating, the limiting ring is used to lengthen the path of the cable to the electroplating solution. This avoids the copper plate connected by the cable from being immersed in the electroplating solution. This would cause the gold in the electroplating solution to be electroplated onto the surface of the copper plate, which would increase the cost of gold in the processing. This solves the problem that the copper plate is always in the electroplating solution and the electroplating solution reacts, which would easily waste the gold element in the electroplating solution.

[0015] (2) The present invention is equipped with an auxiliary device that, when electroplating the copper bracelet parts, works in conjunction with a rack, sliding rod, float, gear, rotating rod and striking rod to vibrate the filter box, causing the copper bracelet parts inside the filter box to shake in the electroplating solution, so that the copper bracelet parts intermittently detach from the bottom plate of the filter box, thereby making the surface of the copper bracelet parts more evenly electroplated, solving the problem that the bottom surface of the copper bracelet parts is difficult to electroplat when it is stationary in the electroplating solution.

[0016] (3) The present invention is equipped with a turbulence device, which, together with the iron rod, magnetic block, connecting rod and turbulence plate, turbulents the air above the copper parts of the bracelet when the electroplating is completed, increases the air flow speed on the surface of the copper parts of the bracelet, and improves the separation rate of the copper parts of the bracelet from the electroplating solution. This avoids the electroplating solution from continuing to adhere to the surface of the copper parts of the bracelet after they are taken out, and the metal in the electroplating solution from the copper parts of the bracelet is excessively adhered to the copper parts of the bracelet. This solves the problem that it is difficult to remove the electroplating solution adhering to the surface of the copper parts of the bracelet in time when they are taken out, and the problem of uneven electroplating caused by excessive adhesion of the electroplating solution. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the control rod structure of the present invention; Figure 3 This is a schematic diagram of part of the clamping device structure of the present invention; Figure 4 This is a schematic diagram of the structure of some of the clamping devices and auxiliary devices of the present invention; Figure 5 This is a schematic diagram of the structure of part of the clamping device and the turbulence device of the present invention; Figure 6 This is a partial cross-sectional view of the present invention; Figure 7This is a schematic diagram of the structure of some auxiliary devices of the present invention.

[0018] In the diagram: 1. Control console; 2. Electroplating solution tank; 3. Processing tank; 4. Control lever; 5. Power supply; 6. Cable; 71. Control block; 72. Lifting lever; 73. Lifting platform; 74. Clamping plate; 75. Arc-shaped spring rod; 76. Hook plate; 77. Handle; 78. Filter box; 79. Limiting ring; 81. Rack; 82. Sliding rod; 83. Float; 84. Gear; 85. Rotating rod; 86. Striking rod; 91. Iron rod; 92. Magnetic block; 93. Connecting rod; 94. Baffle. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1-7 One embodiment of the present invention is: a metal product electroplating device for easy uniform electroplating, including a control console 1, an electroplating solution tank 2 opened on the upper surface of the control console 1, an electroplating solution for electroplating copper parts of a bracelet is poured into the electroplating solution tank 2, a processing tank 3 opened on the upper surface of the control console 1, a control rod 4 passing through the control console 1 and slidably connected at the passing point, a power supply 5 fixed on the upper surface of the control rod 4, cables 6 fixed at both ends of the power supply 5, the cables 6 being electrically connected to the power supply 5, a clamp fixed at the end of the cable 6 away from the power supply 5, two sets of copper plates are clamped by the clamps at the top of the cables 6 at both ends of the power supply 5, the weight of the copper plates themselves straightens the cables 6, and a clamping device is provided on the surface of the control rod 4 for easy fixing of the copper parts of the bracelet.

[0021] A method for electroplating metal products to facilitate uniform electroplating, the method comprising the following steps: S1: The wet wax casting process is used to create the molded shell in the shape of the bracelet pieces; S2: Select real gold leaf and apply it to the predetermined position on the surface of the copper part, cover or electro-fill with glass powder, and then put it into a high-temperature furnace for firing. S3: Clean the copper parts that have been laminated with gold foil and protect the gold foil area using a partial shielding technique; S4: Electroplating of the copper parts of the bracelet is performed using an electroplating solution containing real gold. S5: Remove the electroplated copper parts of the bracelet and clean, dry and inspect them.

[0022] The clamping device includes a control block 71, a lifting rod 72, a lifting platform 73, a clamping plate 74, an arc-shaped spring rod 75, a hook plate 76, a handle 77, a filter box 78, and a limiting ring 79. The control block 71 is slidably connected to the bottom surface of the control rod 4. The control rod 4 is controlled by the control console 1 to slide above the electroplating bath 2. The two sets of control blocks 71 are controlled to slide towards the center of the control rod 4. When both sets of control blocks 71 slide towards the control rod 4, they move closer to each other, causing the lifting rod 72 to rotate. The lifting rod 72 is hinged to the bottom surface of the control block 71. The side of the lifting platform 73... The wall and the lifting rod 72 are hinged at the end away from the control block 71. Two sets of control blocks 71 and lifting rods 72 are provided, respectively located on the left and right sides of the lifting platform 73. The rotation of the lifting rod 72 causes the lifting platform 73 to move downwards. The clamping plate 74 is hinged to the bottom surface of the lifting platform 73. One end of the arc-shaped spring rod 75 is fixedly connected to the side wall of the lifting platform 73, and the other end is fixedly connected to the side wall of the clamping plate 74. The hook plate 76 is fixedly connected to the side wall of the clamping plate 74. The lifting platform 73 causes the clamping plate 74, arc-shaped spring rod 75, and hook plate 76 to also move downwards. The handle 77... The filter box 78 is fixedly connected to the side wall of the handle 77 and adheres to the upper surface of the hook plate 76. When the hook plate 76 moves, it drives the handle 77 and the filter box 78 to move as well, causing the filter box 78 to move the copper parts of the bracelet downwards and immerse them in the electroplating solution. The limiting ring 79 is rotatably connected to the side wall of the lifting rod 72. When the lifting rod 72 rotates, it causes the limiting rings 79 on its side wall to move closer together, and the cables 6 in the limiting rings 79 also move closer together. The path of the cables 6 to the electroplating solution becomes shorter. At the same time, because the copper plate pulls the cables 6, when the lifting rod 72 is perpendicular to the electroplating solution, the copper plate pulls the cables 6 to be perpendicular as well, and the copper plate extends into the solution. In the electroplating solution, before electroplating the copper bracelet, the clamping device, together with the control block 71, lifting rod 72, lifting platform 73, clamping plate 74, arc spring rod 75, hook plate 76, hanging handle 77 and filter box 78, immerses and removes the copper bracelet. At the same time, because the copper bracelet is contained in the filter box 78, the copper bracelet is not obstructed by the clamp after being immersed in the electroplating solution. This avoids the problem that some areas of the copper bracelet are difficult to electroplat due to the clamp obstruction. It solves the problem that the copper bracelet is relatively round and the clamp inevitably comes into close contact with the copper bracelet during clamping, thus obstructing the electroplating of the copper bracelet. When the copper parts of the bracelet are removed after electroplating, the limiting ring 79 is used to lengthen the path of the cable 6 to the electroplating solution, thereby preventing the copper plate connected to the cable 6 from being continuously immersed in the electroplating solution, which would cause the gold in the electroplating solution to be electroplated onto the surface of the copper plate, increasing the cost of gold used in the processing. This solves the problem that the copper plate is always in the electroplating solution, causing the electroplating solution to react and easily wasting the gold elements in the electroplating solution.

[0023] In this embodiment, when steps S3 and preceding steps are completed, the electroplating solution for electroplating the copper components of the bracelet is poured into the electroplating solution tank 2. The two sets of copper plates are clamped at the ends of the cables 6 at both ends of the power supply 5. The weight of the copper plates straightens the cables 6, allowing them to pass through the limiting ring 79. The control lever 4 is controlled by the control console 1, causing it to slide above the electroplating solution tank 2. The two sets of control blocks 71 are then controlled to slide towards the center of the control lever 4. When both sets of control blocks 71 slide towards the control lever 4, the phase... When the two sets of control blocks 71 approach each other, the lifting rod 72 is hinged to the bottom surface of the control block 71, and the end of the lifting rod 72 away from the control block 71 is hinged to the lifting platform 73. Therefore, when the two sets of control blocks 71 approach each other, they drive the lifting rod 72 to rotate. When the lifting rod 72 rotates, it drives the limiting rings 79 on its side wall to approach each other. The cables 6 in the limiting rings 79 also approach each other, and the path of the cables 6 to the electroplating solution becomes shorter. At the same time, because the copper plate pulls the cables 6, when the lifting rod 72 is perpendicular to the electroplating solution, the copper plate pulls the cables 6 to be perpendicular as well. The copper plate extends into the electroplating solution, and the lifting rod 72... The rotation causes the lifting platform 73 to move downwards. The lifting platform 73 also moves the clamping plate 74, the arc-shaped spring rod 75, and the hook plate 76 downwards. When the hook plate 76 moves, it moves the handle 77 and the filter box 78, causing the filter box 78 to move the copper parts of the bracelet downwards and immerse them in the electroplating solution. When it is necessary to remove the filter box 78, the clamping plate 74 is rotated away from the center of the lifting platform 73. The clamping plate 74 compresses the arc-shaped spring rod 75. The rotation of the clamping plate 74 causes the hook plate 76 to rotate as well, causing the clamping plate 74 to move downwards and immerse itself in the electroplating solution. 4. Disconnect from the handle 77 and remove the filter box 78. The copper bracelet inside the filter box 78 can be poured out. When electroplating is complete, slide the control block 71 to make the control block 71 drive the lifting rod 72 to rotate in the opposite direction. The rotation of the lifting rod 72 drives the lifting platform 73 to rise. When the lifting rod 72 rotates, it also drives the limiting ring 79 on its side wall to rotate, so that the limiting ring 79 limits the cable 6 and pulls the two sets of cables 6 away from each other. The path between the cable 6 and the electroplating solution becomes longer, and the cable 6 pulls the copper plate out of the electroplating solution.

[0024] Please see Figures 1-7In another embodiment of the present invention, based on the above embodiments, an auxiliary device for increasing the uniformity of electroplating is provided on the side of the clamping device. The auxiliary device includes a rack 81, a sliding rod 82, a float 83, a gear 84, a rotating rod 85, and a striking rod 86. The rack 81 is fixedly connected to the front of the filter box 78. The sliding rod 82 penetrates the side wall of the filter box 78 and fits snugly at the penetration point. The float 83 is fixedly connected to the side end of the sliding rod 82. When the filter box 78 is immersed in the electroplating solution, the float 83 floats above the surface of the electroplating solution because its interior is filled with air. When the filter box 78 moves downward relative to the electroplating solution, the float 83 moves upward relative to the filter box 78. The upward movement of the float 83 causes the sliding rod 82 to slide upward as well. The sliding rod 82 penetrates the gear 84 and is fixedly connected at the penetration point. When the sliding rod 82 slides upward, it causes the gear 84 to slide upward as well. The gear 84 meshes with the rack 81. When the gear 84 slides upward, it is also affected by the rack 81. The influence of the rotating rod 82 causes the sliding rod 82 to rotate, and the rotating rod 85 is fixedly connected to the side wall of the gear 84. The rotation of the sliding rod 82 causes the rotating rod 85 to rotate. The striking rod 86 is hinged to the side wall of the rotating rod 85. The rotation of the rotating rod 85 causes the striking rod 86 to rotate, and the striking rod 86 rotates to strike the bottom of the filter box 78, causing the filter box 78 to vibrate and shake the copper bracelet inside the filter box 78, causing the copper bracelet to shake in the electroplating solution. This auxiliary device, in conjunction with rack 81, sliding rod 82, float 83, gear 84, rotating rod 85 and striking rod 86, vibrates the filter box 78 during electroplating of the copper bracelet parts. This causes the copper bracelet parts inside the filter box 78 to shake in the electroplating solution, intermittently detaching them from the bottom plate of the filter box 78. This results in a more uniform electroplating of the surface of the copper bracelet parts, solving the problem that the bottom surface of the copper bracelet parts is difficult to electroplat when they are still in the electroplating solution.

[0025] The clamping device includes a baffle to clean the electroplating solution from the surface of the copper parts of the bracelet. The baffle includes an iron rod 91, a magnetic block 92, a connecting rod 93, and a baffle plate 94. A sliding rod 82 passes through the iron rod 91 and is rotatably connected at the point of penetration. When the sliding rod 82 slides upward, it also moves the iron rod 91 upward. The magnetic block 92 is slidably connected to the front of the lifting platform 73. When the iron rod 91 moves to the magnetic block 92, it pushes the magnetic block 92 upward. The connecting rod 93 is hinged to the side wall of the magnetic block 92. The sliding of the magnetic block 92 causes the connecting rod 93 to rotate. The baffle plate 94 is hinged to the bottom surface of the lifting platform 73. The end of the connecting rod 93 furthest from the lifting platform 73 is connected to the baffle plate 94. The side wall of the flow plate 94 is hinged, and the rotation of the connecting rod 93 drives the baffle plate 94 to rotate as well, which turbulents the surface of the copper bracelet in the filter box 78. When the copper bracelet is electroplated, this baffle device works with the iron rod 91, the magnetic block 92, the connecting rod 93 and the baffle plate 94 to turbulent the air above the copper bracelet, increasing the air flow speed on the surface of the copper bracelet and improving the separation rate of the copper bracelet from the electroplating solution. This avoids the electroplating solution from continuing to adhere to the surface of the copper bracelet after it is taken out, and prevents the metal in the electroplating solution from excessively adhering to the copper bracelet. This solves the problem that it is difficult to remove the electroplating solution adhering to the surface of the copper bracelet in time when it is taken out, and the problem of uneven electroplating caused by excessive adhesion of the electroplating solution.

[0026] In this embodiment, when the filter box 78 is immersed in the electroplating solution, the float 83 floats above the surface of the electroplating solution because its interior is filled with air. As the filter box 78 moves downward relative to the electroplating solution, the float 83 moves upward relative to the filter box 78. The upward movement of the float 83 causes the sliding rod 82 to slide upward as well. When the sliding rod 82 slides upward, it causes the gear 84 to slide upward as well. Since the gear 84 meshes with the rack 81, the gear 84 is also affected by the rack 81 and rotates around the sliding rod 82 as it slides upward. The rotation of the gear 84 causes the sliding rod 82 to rotate as well. The rotation of the sliding rod 82 causes the rotating rod 85 to rotate as well. The rotation of the rotating rod 85 causes the striking rod 86 to rotate as well. The rotating striking rod 86 strikes the bottom of the filter box 78, causing the filter box 78 to vibrate and shake the copper bracelet inside the filter box 78, causing the copper bracelet to sway in the electroplating solution.

[0027] When the sliding rod 82 slides upward, it also drives the iron rod 91 to move upward. When the iron rod 91 moves to the magnetic block 92, the iron rod 91 pushes the magnetic block 92 to slide upward. The sliding of the magnetic block 92 drives the hinge point between the magnetic block 92 and the connecting rod 93 to move upward. The end of the connecting rod 93 away from the magnetic block 92 is hinged to the side wall of the baffle 94, and the baffle 94 is hinged to the bottom surface of the lifting platform 73. Therefore, the hinge point between the connecting rod 93 and the baffle 94 can only rotate around the hinge point between the lifting platform 73 and the baffle 94. When the magnetic block 92 slides upward, it drives the connecting rod 93 to rotate. The rotation of the connecting rod 93 drives the baffle 94 to rotate as well, thus creating a turbulence on the surface of the copper bracelet inside the filter box 78.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A metal product electroplating apparatus for facilitating uniform electroplating, comprising a control console (1), characterized in that: The upper surface of the control console (1) is provided with an electroplating solution tank (2), the upper surface of the control console (1) is provided with a treatment tank (3), the control console (1) is penetrated by a control rod (4), and the penetration is slidingly connected, the upper surface of the control rod (4) is fixedly provided with a power supply (5), both ends of the power supply (5) are fixedly provided with a cable (6), the cable (6) and the power supply (5) are electrically connected, one end of the cable (6) away from the power supply (5) is fixedly provided with a clamp, the surface of the control rod (4) is provided with a clamping device, and the side of the clamping device is provided with an auxiliary device for increasing the uniformity of electroplating. The clamping device comprises a control block (71), a lifting rod (72), a lifting table (73), a clamping plate (74), an arc-shaped spring rod (75), a hook plate (76), a hanging handle (77), a filter box (78) and a limiting ring (79), the control block (71) is slidingly connected to the bottom surface of the control rod (4), and the lifting rod (72) is hingedly connected to the bottom surface of the control block (71).

2. The metal product electroplating apparatus for facilitating uniform electroplating of claim 1, wherein: The side wall of the lifting table (73) is hingedly connected to one end of the lifting rod (72) away from the control block (71), and the control block (71) and the lifting rod (72) are provided with two groups, which are arranged on the left and right sides of the lifting table (73) respectively.

3. The metal product electroplating apparatus for facilitating uniform electroplating of claim 2, wherein: The clamping plate (74) is hingedly connected to the bottom surface of the lifting table (73), one end of the arc-shaped spring rod (75) is fixedly connected to the side wall of the lifting table (73), and the other end of the arc-shaped spring rod (75) is fixedly connected to the side wall of the clamping plate (74).

4. The metal product electroplating apparatus for facilitating uniform electroplating of claim 3, wherein: The hook plate (76) is fixedly connected to the side wall of the clamping plate (74), the hanging handle (77) is attached to the upper surface of the hook plate (76), the filter box (78) is fixedly connected to the side wall of the hanging handle (77), the limiting ring (79) is rotatably connected to the side wall of the lifting rod (72), and the cable (6) penetrates through the limiting ring (79).

5. The metal article electroplating apparatus for facilitating uniform electroplating of claim 4, wherein: The auxiliary device comprises a rack (81), a sliding rod (82), a floating ball (83), a gear (84), a rotating rod (85) and a knocking rod (86), the rack (81) is fixedly connected to the front surface of the filter box (78), the sliding rod (82) penetrates through the side wall of the filter box (78), and the penetration is attached, the floating ball (83) is fixedly connected to the side end of the sliding rod (82), and the inside of the floating ball (83) is filled with air.

6. The metal article electroplating apparatus for facilitating uniform electroplating of claim 5, wherein: The sliding rod (82) penetrates through the gear (84), and the penetration is fixedly connected, the gear (84) is engaged with the rack (81), the rotating rod (85) is fixedly connected to the side wall of the gear (84), and the knocking rod (86) is hingedly connected to the side wall of the rotating rod (85).

7. The metal article electroplating apparatus for facilitating uniform electroplating of claim 6, wherein: A flow disturbing device is arranged in the middle of the clamping device, and the flow disturbing device comprises an iron rod (91), a magnetic block (92), a connecting rod (93) and a flow disturbing plate (94), the sliding rod (82) penetrates through the iron rod (91), and the penetration is rotatably connected.

8. The metal article electroplating apparatus for facilitating uniform electroplating of claim 7, wherein: The magnetic block (92) is slidingly connected to the front face of the lifting platform (73), the magnetic block (92) is used for adsorbing the iron rod (91), the iron rod (91) is always vertically erected upward, the connecting rod (93) is hinged to the side wall of the magnetic block (92), the spoiler (94) is hinged to the bottom face of the lifting platform (73), and the end, away from the lifting platform (73), of the connecting rod (93) is hinged to the side wall of the spoiler (94).

9. A metal product electroplating method for facilitating uniform electroplating, based on the metal product electroplating apparatus for facilitating uniform electroplating according to any one of claims 1 to 8, characterized by, The method comprises the following steps: S1: using a wet wax casting process to make a shaped shell in the shape of a hand string part; S2: selecting real gold foil to be attached to the surface of the copper part at a predetermined position, covering or electrically filling glass powder, and placing it into a high-temperature furnace for firing; S3: cleaning the copper part with the composite glass gold foil and protecting the glass area using a local shielding technique; S4: using an electroplating solution containing real gold to electroplate the hand string copper part; S5: taking out the hand string copper part after electroplating, and cleaning, drying and inspecting it.

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