Printed circuit board laminated structure of driving mode selection controller and design method thereof

By using a 4-layer stacked structure design, the problem of resource waste in the traditional PCB layout of driving mode selection controllers is solved, achieving cost savings and product compactness, enhancing product competitiveness, and meeting the needs of the modern vehicle electronics industry.

CN121586154APending Publication Date: 2026-02-27CHINA FAW CO LTD
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Patent Information

Application Number
CN202511788892.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-30
Publication Date
2026-02-27

AI Technical Summary

Technical Problem

Traditional driving mode selection controller PCB layout designs suffer from resource waste and insufficient space utilization, resulting in high manufacturing costs and non-compact products, making it difficult to meet the modern vehicle electronics industry's demand for efficient and compact solutions.

Method used

The design employs a four-layer stacked structure, including a top layer, a ground layer, a power signal layer, and a bottom layer. The top layer houses the circuitry, the ground layer provides a reference ground signal, the power signal layer contains the critical power planes and signal traces, and the bottom layer contains the general power planes and general signal traces. Signal and power transmission is achieved through via connections, and electromagnetic interference is isolated using the ground layer.

Benefits of technology

It effectively reduces the number of printed circuit board layers, saves development costs, enhances the market competitiveness of products, and meets the needs of the modern vehicle electronics industry for efficient and compact solutions.

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Abstract

The invention discloses a printed circuit board laminated structure of a driving mode selection controller and a design method of the printed circuit board laminated structure. The laminated structure sequentially comprises a top layer, a grounding layer, a power signal layer and a bottom layer from top to bottom, wherein the top layer is used for laying circuit devices; the grounding layer is used for providing a reference ground signal; the power supply signal layer is used for laying a key power supply plane and key signal wires, and the bottom layer is used for laying a common power supply plane and common signal wires; a grounding pin of the circuit device in the top layer is connected to the grounding layer through a via hole, and a signal pin and a power supply pin of the circuit device are connected to the power supply signal layer and the bottom layer through via holes. According to the invention, through lamination planning of the power supply layer, the signal layer and the ground layer, mixed wiring of the signal lines on the power supply layer is realized, and the ground layer provides a reference plane for the device layer and the power supply signal layer, so that the number of laminated layers of the printed circuit board is effectively reduced, and the development cost can be saved.
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