Automatic magnetic attraction tool and method for micro-assembly bonding chip bonding connection

Abstract

The invention discloses an automatic magnetic attraction tool and method for micro-assembly die bonding connection, and belongs to the field of hybrid integrated circuit packaging. A sub-carrier assembly and a pressing plate assembly which are detachably connected in a magnetic attraction mode are arranged on a bottom plate assembly; according to the tool, a plurality of circuits are placed through the sub-carrier, and the sub-carrier assembly performs circuit circulation of subsequent procedures, so that frequent taking and placing operations in the production process can be greatly reduced, damage to the circuits in the taking and placing process is reduced, and the yield is improved. The device is pressed through the pressing plate assembly, and circuit pins are not directly contacted, so that the loading efficiency is improved, and the circuit appearance damage is reduced. Automatic production and inter-process transfer of the circuit are carried out through the tool, the problem that the yield is low due to direct contact with products is solved, time waste caused by repeated taking and placing and other operations is avoided, the production efficiency and the yield are improved, the fixing force of magnetic attraction is smaller than that of mechanical fixing, taking, placing and circulation of the circuit are facilitated, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of hybrid integrated circuit packaging, and particularly relates to a micro-assembly die-bonding wire automated magnetic attraction tooling and method. BACKGROUND

[0002] Hybrid integrated circuit products have the characteristics of various types and complex processes, and are mainly in the form of "various types and small batches", which leads to low automation degree, poor production efficiency and poor consistency. Through automatic production line construction and automatic tooling carrier design and manufacturing, the automatic flow of circuits in different single machine devices in the production line is realized, and the die-bonding and bonding process processing is completed.

[0003] Due to the fact that the die-bonding and bonding process equipment in the micro-assembly unit is of various types, the feeding and discharging, numerical control mode and built-in track of each device are different, the existing tooling fixture is not compatible, and the circuit needs to be repeatedly taken and placed and the tooling needs to be replaced when flowing in different production devices, which causes time cost waste, and there is no flexible material buffer between the product shell and the mold, and the shell surface scratch problem is serious.

[0004] In summary, the tooling fixture in the prior art has the problems of frequent replacement, high production time cost and low yield. SUMMARY

[0005] The purpose of the present application is to provide a micro-assembly die-bonding wire automated magnetic attraction tooling and method, which realizes the automatic production and process transfer of circuits through tooling, avoids the low yield problem caused by direct contact with products, and saves time through repeated taking and placing operations, thereby improving production efficiency and yield.

[0006] To achieve the above purpose, the present application provides the following technical scheme: A micro-assembly die-bonding wire automated magnetic attraction tooling, comprising a bottom plate assembly, a sub-carrier assembly mounted on the bottom plate assembly and a pressing plate assembly; The bottom plate assembly is detachably magnetically connected with the sub-carrier assembly and the pressing plate assembly, respectively; A plurality of circuits are placed on the sub-carrier assembly, and the pressing plate assembly positions and presses the plurality of circuits in the vertical direction.

[0007] Preferably, the bottom plate assembly comprises a bottom plate, a two-dimensional code sheet, a bushing and a positioning pin; A plurality of pin holes are formed in the bottom plate, and the positioning pin is mounted in the pin hole to position the sub-carrier assembly and the pressing plate assembly; A magnet is mounted on the bottom plate, so that the bottom plate is magnetically connected with the sub-carrier assembly and the pressing plate assembly; The two-dimensional code sheet and the bushing are fixed on the bottom plate outside the sub-carrier assembly and the pressing plate assembly; the two-dimensional code sheet contains flow information between each process; the bushing is used for auxiliary flow in the guide rail equipment.

[0008] Further, the bottom plate assembly further comprises a two-dimensional code plate fixing screw and a bushing fixing screw; The two-dimensional code sheet is fixedly connected with the bottom plate through the two-dimensional code plate fixing screw; and the bushing is fixedly connected with the bottom plate through the bushing fixing screw.

[0009] Further, the bottom plate is provided with a tool identification, a tool flow auxiliary hole, a foolproof groove and a plurality of irregular grooves.

[0010] Preferably, the sub-carrier assembly comprises a sub-carrier and a pressing strip mounted on the sub-carrier. The top of the sub-carrier is provided with a plurality of grooves for placing a circuit. The bottom of the sub-carrier is provided with a pin hole for positioning the bottom plate assembly. The pressing strip is mounted on both sides of the groove to position the circuit.

[0011] Further, the bottom of the pressing strip is fixed with a magnet, and the pressing strip is detachably magnetically connected with the sub-carrier.

[0012] Preferably, the pressing plate assembly comprises a pressing plate, a positioning spring and a positioning spring fixing screw. The pressing plate is mounted on the bottom plate assembly. The pressing plate is provided with a plurality of through grooves, and the sub-carrier assembly is mounted in the through grooves to be connected with the bottom plate assembly. The positioning spring is fixedly connected with the top surface of the pressing plate through the positioning spring fixing screw, and the positioning spring is deformed by elastic force to fix the circuit on the sub-carrier assembly.

[0013] Further, the pressing plate assembly further comprises a material pushing block and a material pushing block fixing screw. The material pushing block is fixed on the pressing plate through the material pushing block fixing screw, and the material pushing block is used for auxiliary tool taking and placing.

[0014] Further, the bottom of the pressing plate is fixed with a magnet, and the pressing plate is magnetically fixed with the bottom plate assembly through the magnet.

[0015] A micro-assembly processing method is realized based on the micro-assembly die bonding and wire automatic magnetic attraction tool of any one of the above-mentioned methods, and the method comprises: Place the circuit of the die bonding process on the sub-carrier assembly, and magnetically attract and fix the sub-carrier assembly on the bottom plate assembly; Magnetic attraction and fixation of the pressing plate assembly on the bottom plate assembly for positioning and pressing on the sub-carrier assembly; During the processing, the sub-carrier assembly and the circuit are transferred together for subsequent processes.

[0016] Compared with the prior art, the present application has the following beneficial technical effects: The present application provides a kind of micro assembly die bonding bonding line automation magnetic attraction tool and method, by setting detachable magnetic attraction connection sub-carrier assembly and the pressing plate assembly on bottom plate assembly;Wherein, tool relies on sub-carrier to place multiple circuits, sub-carrier assembly carries out the circuit transfer of subsequent processes, can greatly reduce the frequent pick-and-place operation in production process, reduce the damage to circuit in pick-and-place process, improve yield.The device is pressed by pressing plate assembly, without direct contact with circuit pin, improve loading efficiency, reduce circuit appearance damage.In the present application, the maximum utilization efficiency of mold space is realized by optimization design, efficient and convenient installation is realized by magnetic attraction instead of screw fixation, fastening, stress release and circuit appearance protection are realized by spring piece pressing method.Circuit is automatically produced and transferred between processes by tool, avoid the problem of low yield caused by direct contact with product, and time waste caused by repeated pick-and-place operation, improve production efficiency and yield, the fixing force of magnetic attraction is less than mechanical fixation, facilitate circuit pick-and-place and transfer, improve production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the overall structure schematic diagram of micro assembly die bonding bonding line automation magnetic attraction tool in the embodiment of the present application; Figure 2 It is the explosion schematic diagram of bottom plate assembly in the embodiment of the present application; Figure 3 It is the structure schematic diagram of bottom plate assembly in the embodiment of the present application; Figure 4 It is the explosion schematic diagram of sub-carrier assembly in the embodiment of the present application; Figure 5 It is the structure schematic diagram of sub-carrier assembly in the embodiment of the present application; Figure 6 It is the explosion schematic diagram of pressing plate assembly in the embodiment of the present application; Figure 7 It is the structure schematic diagram of pressing plate assembly in the embodiment of the present application.

[0018] In the drawings: 1 is a bottom plate assembly, 101 is a bottom plate, 102 is a two-dimensional code sheet, 103 is a positioning pin, 104 is a bushing, 105 is a two-dimensional code plate fixing screw, 106 is a bushing fixing screw, 2 is a sub-carrier assembly, 201 is a sub-carrier, 202 is a pressing strip, 3 is a pressing plate assembly, 301 is a pressing plate, 302 is a positioning elastic sheet, 303 is a material pushing block, 304 is a positioning elastic sheet fixing screw, 305 is a material pushing block fixing screw, 4 is a magnet, 5 is an example packaging shell. Wherein a is a tooling mark on the bottom plate, b is a tooling circulation auxiliary hole, c is a foolproof groove, d is a bottom plate weight reduction groove, e is a tooling mark on the pressing plate. DETAILED DESCRIPTION

[0019] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0020] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0021] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0022] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection, or communication; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0023] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. "Under", "below" and "underneath" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is horizontally lower than the second feature.

[0024] It should be understood that the terms "comprises" and "comprising", when used in this specification and the following claims, indicate the presence of the described features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0025] It should also be understood that the terms used in the present application specification are only for the purpose of describing particular embodiments and are not intended to limit the present application. As used in the present application specification and the following claims, unless otherwise clearly indicated by the context, the singular forms "a", "an" and "the" are intended to include the plural forms as well.

[0026] It should be further understood that the term "and / or" used in the present application specification and the following claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0027] Various structural diagrams according to the disclosed embodiments of the present application are shown in the accompanying drawings. These diagrams are not drawn to scale, in which certain details are exaggerated for clarity of presentation and may omit certain details. The shapes and relative sizes of the various regions, layers, and their relative positions illustrated in the drawings are merely exemplary, and in actuality may deviate due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes, and relative positions can be additionally designed by those skilled in the art according to actual needs.

[0028] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0029] Embodiment 1 The present application provides a micro-assembly die bonding and wire bonding automatic magnetic attraction tool, comprising a bottom plate assembly 1, a sub-carrier assembly 2 mounted on the bottom plate assembly 1, and a pressing plate assembly 3.

[0030] The bottom plate assembly 1 is detachably connected to the sub-carrier assembly 2 and the pressing plate assembly 3 through magnetic attraction; the sub-carrier assembly 2 is provided with a plurality of circuits, and the pressing plate assembly 3 is used for positioning and pressing the circuits in the vertical direction.

[0031] The universal die bonding and wire bonding automatic magnetic attraction tool of the micro-assembly unit is provided with the detachable magnetic attraction sub-carrier assembly and the pressing plate assembly on the bottom plate assembly 1; the tool places a plurality of circuits on the sub-carrier, and the sub-carrier assembly 2 is used for transferring the circuits in the subsequent process, so that the frequent pick-and-place operation in the production process is greatly reduced, the damage to the circuits in the pick-and-place process is reduced, and the yield is improved. The device is pressed by the pressing plate assembly 3, and the circuit pins are not directly contacted, so that the loading efficiency is improved, and the appearance damage of the circuit is reduced. In the present application, the space utilization efficiency of the mold is maximized through optimization design, the installation and pick-and-place are realized through magnetic attraction instead of screw fixing, the fastening, stress release and circuit appearance protection are realized through the spring sheet pressing method. The automatic production and process transfer of the circuit are realized through the tool, the low yield problem caused by direct contact with the product is avoided, the time waste caused by repeated pick-and-place operation is avoided, the production efficiency and yield are improved, the fixing force of magnetic attraction is smaller than that of mechanical fixing, the pick-and-place and transfer of the circuit are facilitated, and the production efficiency is improved.

[0032] In the two automatic production process transfers, the combined carrier is assembled together for transfer, and the production process (inspection, screening, etc.) after the die bonding is transferred by relying on the sub-carrier assembly, which is light and does not directly contact the circuit. In the die bonding and wire bonding, automatic production is realized by using the combined tool for production transfer; the subsequent production is offline, and only the sub-carrier assembly is relied on for transfer.

[0033] The die bonding and wire bonding automatic magnetic attraction tool is used for realizing the automatic production (die bonding, wire bonding and inspection) of the circuit through the tool and the process transfer of the circuit, avoiding the low yield problem caused by direct contact with the product, avoiding the time waste caused by repeated pick-and-place operation, improving the production efficiency and yield.

[0034] The die bonding and wire bonding automatic magnetic attraction tool is used for realizing the automatic production (die bonding, wire bonding and inspection) of the circuit through the tool and the process transfer of the circuit, avoiding the low yield problem caused by direct contact with the product, avoiding the time waste caused by repeated pick-and-place operation, improving the production efficiency and yield. The die bonding and wire bonding automatic magnetic attraction tool is used for realizing the automatic production (die bonding, wire bonding and inspection) of the circuit through the tool and the process transfer of the circuit, avoiding the low yield problem caused by direct contact with the product, avoiding the time waste caused by repeated pick-and-place operation, improving the production efficiency and yield.

[0035] Specifically, as shown in Figures 1 to 7 The micro-assembly die bonding wire automation magnetic attraction tool includes a base plate assembly 1, a sub-carrier assembly 2, and a pressing plate assembly 3.

[0036] The sub-carrier assembly 2 is positioned by the positioning pin 103 and magnetically attracted and fixed by the respective magnet 4, forming a base plate sub-carrier combined assembly; the pressing plate assembly 3 is magnetically attracted and fixed by the magnet 4 and the base plate sub-carrier combined assembly, forming the automation magnetic attraction tool.

[0037] In addition to the positioning pin 103 and various fastening screws, the remaining components are recommended to use lightweight alloys to reduce the overall weight of the tool, such as aluminum alloys.

[0038] Specifically, as shown in Figure 2 and Figure 3 The base plate assembly 1 in the embodiment of the present application includes a base plate 101, a two-dimensional code sheet 102, a bushing 104, and a positioning pin 103.

[0039] A plurality of pin holes are provided on the base plate 101, and the positioning pin 103 is installed in the pin holes to position the sub-carrier assembly 2 and the pressing plate assembly 3; the magnet 4 is installed on the base plate 101 to magnetically connect the base plate 101 with the sub-carrier assembly 2 and the pressing plate assembly 3.

[0040] The two-dimensional code sheet 102 and the bushing 104 are fixed on the base plate 101 outside the sub-carrier assembly 2 and the pressing plate assembly 3; the two-dimensional code sheet 102 contains flow information between each process; the bushing 104 is used for auxiliary flow in the guide rail equipment.

[0041] It needs to be further explained that the base plate assembly 1 in the embodiment of the present application further includes a two-dimensional code plate fixing screw 105 and a bushing fixing screw 106.

[0042] The two-dimensional code sheet 102 is fixedly connected with the base plate 101 by the two-dimensional code plate fixing screw 105; the bushing 104 is fixedly connected with the base plate 101 by the bushing fixing screw 106.

[0043] It needs to be further explained that the base plate 101 is mainly used to place various other components, and the bottom surface is smooth for directional flow in the automation production line.

[0044] The sink groove is diagonally arranged on the top surface of the bottom plate 101, the two-dimensional code sheet 102 is connected with the bottom plate 101 through a two-dimensional code plate fixing screw 105, and the two-dimensional code sheet 102 is used for reporting work cooperation and circulation among different devices; two through holes are arranged on the lower side of the top surface of the bottom plate 101, a bushing 104 is connected with the bottom plate 101 through a bushing fixing screw 106, and the bushing 104 is mainly used for assisting circulation in the device without a sliding guide rail, and the material of the bushing 104 is stainless steel.

[0045] The top surface of the bottom plate 101 is provided with a plurality of grooves, the magnet 4 is bonded on the bottom plate 101 by using an adhesive, and a pin hole is further arranged on the top surface of the bottom plate 101; the positioning pin 103 is in interference fit with the bottom plate 101, and the sub-carrier assembly 2 is limited. The sink groove is diagonally arranged on the top surface of the bottom plate 101, the two-dimensional code sheet 102 is connected with the bottom plate 101 through a two-dimensional code plate fixing screw 105, and the two-dimensional code sheet 102 is used for reporting work cooperation and circulation among different devices; two through holes are arranged on the lower side of the top surface of the bottom plate 101, a bushing 104 is connected with the bottom plate 101 through a bushing fixing screw 106, and the bushing 104 is mainly used for assisting circulation in the device without a sliding guide rail, and the material of the bushing 104 is stainless steel.

[0046] Specifically, the bottom plate 101 in the embodiment of the present application is provided with a tool identification, a tool circulation auxiliary hole, a foolproof groove and a plurality of irregular grooves.

[0047] It needs to be further explained that the tool identification a on the top surface of the bottom plate 101 is used for marking the product type suitable for the tool, and the tool circulation auxiliary holes b on the upper and lower sides are used for assisting the tool to circulate among different devices; the edge of the bottom plate 101 is provided with a foolproof groove, and the edge is provided with a foolproof groove c for preventing the parts from being inverted. The irregular grooves d are arranged at a plurality of positions on the bottom plate 101 to reduce the weight of the entire tool.

[0048] It needs to be further explained that the grooves for mounting the magnets 4 on the bottom plate 101 in the embodiment of the present application are not limited to circular or square shapes, and the shape and size of the magnets 4 are specially designed according to the required magnetic force; since the mold needs to be heated during bonding or bonding, the bonding material of the magnets 4 is selected to be an adhesive that can withstand a temperature above 150 DEG C, and the magnets 4 are selected to be materials that will not degrade in magnetic properties at about 150 DEG C. In the example, all the magnets 4 to be installed are selected under the same conditions as the above method.

[0049] Specifically, as shown in Figure 4 and Figure 5 The sub-carrier assembly 2 in the embodiment of the present application comprises a sub-carrier 201 and a pressing strip 202 mounted on the sub-carrier 201.

[0050] The top of the sub-carrier 201 is provided with a plurality of grooves for placing circuits; the bottom of the sub-carrier 201 is provided with a pin hole for positioning the bottom plate assembly 1; and the pressing strip 202 is mounted on both sides of the groove to position the circuit.

[0051] Specifically, a groove is formed on the sub-carrier 201, and the circuit is placed in the groove, the groove on the sub-carrier 201 provides X positioning; the pressing strip 202 is in contact with the side wall of the circuit for limiting and providing Y positioning; the pressing strip 202 is not in contact with the pin of the circuit, the positioning spring 302 is in contact with the sealing ring on the upper surface of the shell, and Z limiting is provided (the XYZ direction is observed from the upper surface). The circuit cannot be moved during the bonding process, so the automatic tooling is required to cooperate with the positioning and fixing in the XYZ three directions.

[0052] The sub-carrier assembly 2 in the embodiment of the present application does not contact the pin of the circuit, and only contacts the shell, thereby protecting the pin and avoiding the problem that the pin of the existing circuit is deformed when being contacted during circulation.

[0053] The pin of the circuit in the embodiment of the present application is laterally extended (perpendicular to the opening direction of the circuit), and the pressing strip 202 is required for protection; when the pin of the circuit is directly deep (parallel to the opening direction of the circuit), the pin can directly penetrate into the sub-carrier 201, and the pressing strip 202 is not required for protection.

[0054] It needs to be further explained that the bottom of the sub-carrier 201 is provided with a groove and a pin hole for mounting a magnet, which corresponds to the groove and the pin hole on the top surface of the bottom plate 101; the top of the sub-carrier 201 is provided with a groove for mounting a magnet, and the pressing strip 202 is also provided with a groove for mounting a magnet, and the magnets 4 are installed in corresponding positions, and the magnets on both sides of the circuit placement position are magnetically attracted to the sub-carrier 201 to fix the circuit.

[0055] It needs to be further explained that the upper surface of the pin of the circuit in the embodiment of the present application is lower than the adsorption surface of the pressing strip 202, the pressing strip 202 is directly in contact with the packaging shell 5, and the pin of the packaging shell 5 is not in contact with the pressing strip 202, thereby protecting the circuit.

[0056] The array number of the product placement position of the sub-carrier assembly is determined according to the packaging form and size of the circuit, and the pressing strip 202 can not be used for the circuit with downward pin.

[0057] Specifically, as shown in Figure 6 and Figure 7 The pressing plate assembly 3 includes a pressing plate 301, a positioning spring 302 and a positioning spring fixing screw 304; the pressing plate 301 is installed on the bottom plate assembly 1; a plurality of through grooves are formed in the pressing plate 301, and the sub-carrier assembly 2 is installed in the through grooves and connected with the bottom plate assembly 1; the positioning spring 302 is fixedly connected with the top surface of the pressing plate 301 through the positioning spring fixing screw 304, and the positioning spring 302 is fixed on the circuit on the sub-carrier assembly 2 through elastic deformation.

[0058] It needs to be further explained that the positioning spring sheet 302 is connected with the top surface of the pressing plate 301 through the positioning spring sheet fixing screw 304, the positioning spring sheet is preferably made of stainless steel to ensure that it has a certain elastic deformation amount, the top surface of the positioning spring sheet 302 is slightly lower than the highest point of the circuit, and the circuit is fixed through elastic deformation; the bottom surface of the pressing plate 301 is provided with a magnet groove, which is in position correspondence with the magnet groove of the bottom plate 101. The pressing plate 301 is magnetically fixed with the bottom plate sub-carrier assembly through the magnet 4. The tool mark e on the pressing plate 301 is also used to mark the product model suitable for the tool.

[0059] The positioning spring sheet 302 is connected with the top surface of the pressing plate 301 through a screw, one side of the top surface of the pressing plate 301 is provided with a threaded hole, and the pressing plate is connected with the material pushing block through a screw; the bottom surface is provided with a magnet hole, and the magnet is installed in the hole through an adhesive.

[0060] It needs to be further explained that the pressing plate assembly 3 further comprises a material pushing block 303 and a material pushing block fixing screw 305; the material pushing block 303 is fixed on the pressing plate 301 through the material pushing block fixing screw 305; and the material pushing block 303 is used for assisting in taking and placing the tool.

[0061] After the chip is bonded, it needs to be cured for 2-4 hours, an online nitrogen tank is placed between the chip bonding equipment, and products with a longer production cycle can be temporarily stored in the online nitrogen tank. The material pushing block 303 is mainly used for assisting in taking and placing the carrier in the online nitrogen tank.

[0062] The application provides a universal chip bonding and wiring automatic magnetic attraction tool in a micro assembly unit, maximizes the space utilization efficiency of a mold through optimized design, realizes efficient and convenient installation and taking through magnetic attraction instead of screw fixing, realizes fastening, stress release and circuit appearance protection through the spring sheet pressing method. The tool is used for automatic production (chip bonding, bonding and inspection) of the circuit and process transmission, avoids low yield caused by direct contact with the product and time waste caused by repeated taking and placing, and improves production efficiency and yield.

[0063] Embodiment 2 The embodiment of the application provides a micro assembly processing method, which is realized based on the micro assembly chip bonding and wiring automatic magnetic attraction tool in the above embodiment 1, and the method comprises the following steps. The circuit in the chip bonding process is placed on the sub-carrier assembly 2, the sub-carrier assembly 2 is magnetically fixed on the bottom plate assembly 1, the pressing plate assembly 3 is magnetically fixed on the bottom plate assembly 1, the circuit on the sub-carrier assembly 2 is positioned and pressed, and the sub-carrier assembly 2 and the circuit are subjected to subsequent flow together in the processing process.

[0064] Further, after the production process of the circuit before the circuit is pasted, the circuit is placed in the sub-carrier, the pressing strip is installed, and the circuit is fixed on the bottom plate assembly by magnetic attraction, and then the pressing plate assembly is fixed on the bottom plate sub-carrier assembly by magnetic attraction, so that the circuit is fixed in the automatic magnetic tooling. After the automatic feeding machine, dispensing, pasting, bonding, and discharging machine assembly production, the pressing plate assembly is removed, and the sub-carrier assembly is removed, and the sub-carrier assembly is used together with the circuit for subsequent production.

[0065] In the present application, different components are used for the automatic production of the circuit (pasting, bonding, and inspection) through complete tooling, and the circuit is transferred through the sub-carrier assembly for subsequent processes, which can greatly reduce the frequent pick-and-place operations in the production process, reduce the damage to the circuit during pick-and-place, and improve the yield. The tooling relies on the sub-carrier to place multiple circuits, and relies on the pressing strip and the spring pressing device to press the device, without directly contacting the circuit pins, thereby improving the loading efficiency and reducing the appearance damage of the circuit. The tooling relies on the magnet to fix the different components, and the magnetic attraction force is smaller than the mechanical fixation, which facilitates the pick-and-place and transfer of the circuit, and improves the production efficiency.

[0066] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. It is obvious to those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0067] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be properly combined to form other embodiments that those skilled in the art can understand. The above is only to illustrate the technical idea of the present application, and cannot limit the protection scope of the present application. Any modification made on the basis of the technical solutions of the present application falls within the protection scope of the claims of the present application.

Claims

1. A micro-assembly die-bonding wire-connection automation magnetic attraction tool, characterized in that, The utility model provides a circuit board positioning device, including bottom plate subassembly (1), install sub carrier assembly (2) and pressing plate assembly (3) on bottom plate subassembly (1) on the bottom plate subassembly (1) respectively with sub carrier assembly (2) and pressing plate assembly (3) are carried out detachable magnetic attraction connection, The sub carrier assembly (2) is placed with a plurality of circuits, and the pressing plate assembly (3) is positioned and pressed in the vertical direction to the plurality of circuits. The bottom plate subassembly (1) includes a bottom plate (101), a two-dimensional code sheet (102), a bushing (104), and a positioning pin (103).

2. The magnetic automation tooling for micro-assembly die bonding wire bonding connection according to claim 1, wherein, The bottom plate (101) is provided with a plurality of pin holes, and the positioning pin (103) is correspondingly installed in the pin hole to position the sub carrier assembly (2) and the pressing plate assembly (3). The bottom plate (101) is provided with a magnet (4) to magnetically attract the sub carrier assembly (2) and the pressing plate assembly (3). The two-dimensional code sheet (102) and the bushing (104) are fixed on the outside of the sub carrier assembly (2) and the pressing plate assembly (3) on the bottom plate (101). The two-dimensional code sheet (102) contains the flow information between each process. The bushing (104) is used for auxiliary flow in the guide rail equipment. The bottom plate subassembly (1) further includes a two-dimensional code plate fixing screw (105) and a bushing fixing screw (106).

3. The magnetic automation tooling for micro-assembly die bonding wire bonding connection according to claim 2, wherein, The two-dimensional code sheet (102) is fixedly connected with the bottom plate (101) through the two-dimensional code plate fixing screw (105), and the bushing (104) is fixedly connected with the bottom plate (101) through the bushing fixing screw (106). The bottom plate (101) is provided with a tool identification, a tool flow auxiliary hole, a foolproof groove, and a plurality of irregular grooves.

4. The magnetic automation tooling for micro-assembly die bonding wire bonding connection according to claim 2, wherein, The sub carrier assembly (2) includes a sub carrier (201) and a pressing strip (202) installed on the sub carrier (201).

5. The magnetic automated tooling for micro assembly die bonding wire bonding connection according to claim 1, wherein, The top of the sub carrier (201) is provided with a plurality of grooves for placing circuits. The bottom of the sub carrier (201) is provided with a pin hole for positioning the bottom plate subassembly (1). The pressing strip (202) is installed on both sides of the groove to position the circuit. The bottom of the pressing strip (202) is fixed with a magnet (4), and the pressing strip (202) is detachably magnetically connected with the sub carrier (201).

6. The magnetic automated tooling for micro assembly die bonding wire connection according to claim 5, wherein, The pressing plate assembly (3) includes a pressing plate (301), a positioning elastic sheet (302), and a positioning elastic sheet fixing screw (304).

7. The magnetic automated tooling for micro assembly die bonding wire bonding connection according to claim 1, wherein, The pressing plate (301) is installed on the bottom plate subassembly (1). The pressing plate (301) is provided with a plurality of through grooves, and the sub carrier assembly (2) is installed in the through groove to connect with the bottom plate subassembly (1). The positioning elastic sheet (302) is fixedly connected with the top surface of the pressing plate (301) through the positioning elastic sheet fixing screw (304), and the positioning elastic sheet (302) is fixed on the circuit on the sub carrier assembly (2) through elastic deformation. The pressing plate assembly (3) further includes a material shifting block (303) and a material shifting block fixing screw (305).

8. The magnetic automated tooling for micro assembly die bonding wire according to claim 7, wherein, ​ The poking block (303) is fixed on the pressing plate (301) through the poking block fixing screw (305); the poking block (303) is used for assisting the pick-and-place tool.

9. The magnetic automated tooling for micro assembly die bonding wire according to claim 7, wherein, The pressing plate (301) is fixed with a magnet (4) at the bottom, and the pressing plate (301) is magnetically attracted and fixed with the bottom plate assembly (1) through the magnet (4).

10. A micro-assembly processing method, characterized by, A method is realized based on the automatic magnetic attraction tool for micro-assembly die bonding and wire connection according to any one of claims 1 to 9, and the method comprises: Placing a circuit in a die bonding process on a sub-carrier assembly (2), and magnetically attracting and fixing the sub-carrier assembly (2) on a bottom plate assembly (1); Magnetic attraction and fixation of a pressing plate assembly (3) on the bottom plate assembly (1), and positioning and pressing on the sub-carrier assembly (2); During the processing, the sub-carrier assembly (2) and the circuit are subjected to subsequent flow together.

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