Power module with enhanced heat dissipation structure

Abstract

The invention relates to a power module with an enhanced heat dissipation structure. According to the technical scheme provided by the invention, the power module with the enhanced heat dissipation structure comprises a power module body which at least comprises a packaging base and a power unit assembled on the packaging base, so that a required electric energy conversion circuit topology is formed by using the power unit; the enhanced heat dissipation structure at least comprises a heat dissipation unit arranged in the packaging base, the heat dissipation unit comprises a plurality of heat dissipation pieces distributed in an array mode, and the end portion of one end of each heat dissipation piece is fixedly connected with the corresponding inner wall of the packaging base; during heat dissipation, cooling liquid is injected into one end of the packaging base, and the cooling liquid flows in the packaging base and flows through the heat dissipation piece in the heat dissipation unit, so that heat dissipation is carried out on the packaging base and the power unit bodies on the packaging base through the heat dissipation piece. The power module is high in heat dissipation efficiency, and the working stability and reliability of the power module can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a kind of power modules, especially a kind of power module with enhanced heat dissipation structure. BACKGROUND

[0002] Power module is that semiconductor device is combined into a module according to certain function.Power module can realize the required function such as rectification, inversion according to the different combination of packaged semiconductor components, and is widely used in various inverter power supply scenes needing to carry out electric energy conversion due to the characteristics of convenient function switching, stability and reliability of power.

[0003] Since there is heating phenomenon in the work of power module, the power module needs to be cooled to ensure the stability and reliability of the work of power module.In the prior art, the heat dissipation of power module can adopt air cooling or liquid cooling form, but the heat dissipation is mostly in external form, and the heat dissipation efficiency is low, which is difficult to meet the heat dissipation demand of power module. SUMMARY

[0004] The purpose of the present application is to overcome the deficiencies in the prior art, and to provide a power module with enhanced heat dissipation structure, which has high heat dissipation efficiency and can effectively improve the stability and reliability of the work of power module.

[0005] According to the technical scheme provided by the present application, a power module with enhanced heat dissipation structure comprises: Power module body, at least including packaging base and power unit assembled on the packaging base, to form the required electric energy conversion circuit topology by using power unit; Enhanced heat dissipation structure, at least including heat dissipation unit arranged in packaging base, the heat dissipation unit includes a plurality of array distributed heat dissipation pieces, wherein, The end of each heat dissipation piece is fixedly connected with the inner wall corresponding to the packaging base; When cooling, cooling liquid is injected into one end of the packaging base, and the cooling liquid flows in the packaging base and flows through the heat dissipation pieces in the heat dissipation unit, so as to dissipate heat from the packaging base and the power unit body on the packaging base by using the heat dissipation pieces.

[0006] In the length direction of the packaging base, the heat dissipation pieces in the heat dissipation unit form first heat dissipation queue and second heat dissipation queue arranged alternately, First heat dissipation queue and second heat dissipation queue both include a plurality of heat dissipation pieces, and the arrangement direction of heat dissipation pieces in first heat dissipation queue and second heat dissipation queue is perpendicular to the length direction of packaging base; The first end of the heat dissipation piece in the first heat dissipation queue is fixedly connected with the first inner wall of the packaging base, and the second end of the heat dissipation piece in the first heat dissipation queue is gap matched with the second inner wall of the packaging base; The first end of the heat dissipation member in the second heat dissipation queue is gap-fitted with the first inner wall of the packaging base, and the second end of the heat dissipation member in the second heat dissipation queue is fixedly connected with the second inner wall of the packaging base.

[0007] The heat dissipation unit is located in the central region in the packaging base; The buffer regions are further arranged at both ends in the packaging base, and the heat dissipation unit is located between the buffer regions at both ends in the packaging base; During heat dissipation, the injected cooling liquid first enters the buffer region at one end in the packaging base, flows through the heat dissipation unit, and then enters the buffer region at the other end in the packaging base.

[0008] The enhanced heat dissipation structure further comprises a heat dissipation plate located outside the packaging base, wherein, The cooling liquid can be injected into one end of the packaging base through the heat dissipation plate, and the cooling liquid entering the packaging base can flow out through the heat dissipation liquid outlet pipe at the other end of the packaging base; A bus capacitor is arranged between the heat dissipation plate and the packaging base, the bus capacitor is in contact with the power unit on the heat dissipation plate and the packaging base, and the bus capacitor is adaptively electrically connected with the power unit.

[0009] The power unit comprises a plurality of power components arranged in sequence, wherein, For any power component, the power component comprises a component first unit body and a component second unit body electrically connected with the component first unit body, The component first unit body is distributed on the base first surface, and the component second unit body is distributed on the base second surface, and the base first surface and the base second surface are two corresponding surfaces of the packaging base.

[0010] When the power conversion circuit topology formed based on the power unit is an inverter, the power unit comprises three power components, and the three power components are arranged in sequence along the length direction of the packaging base. For any power component, the component first unit body and the component second unit body are in positive correspondence.

[0011] The component first unit body comprises a first backing plate, a first power device unit arranged on the first backing plate, and a first plastic encapsulation body for plastic encapsulating the first backing plate and the first power device unit on the base first surface; The component second unit body comprises a second backing plate, a second power device unit arranged on the second backing plate, and a second plastic encapsulation body for plastic encapsulating the second backing plate and the second power device unit on the base second surface; The first power device unit and the second power device unit are electrically connected through an alternating current terminal member in the power component.

[0012] The first unit body of the assembly further comprises a first unit body signal terminal group electrically connected with the first power device unit, wherein the first unit body signal terminal group comprises a plurality of parallelly distributed first unit body signal terminals; The second unit body of the assembly further comprises a second unit body signal terminal group electrically connected with the second power device unit, wherein the second unit body signal group comprises a plurality of parallelly distributed second unit body signal terminals; The first unit body signal terminals and the second unit body signal terminals are parallel to each other, The first unit body signal terminals and the second unit body signal terminals are distributed outside the first side of the packaging base, and the ends of the first unit body signal terminals and the corresponding ends of the second unit body signal terminals are located below the second surface of the packaging base.

[0013] The first unit body of the assembly further comprises a direct current first terminal member for leading out the first power device unit, and the second unit body of the assembly further comprises a direct current second terminal member for leading out the second power device unit, wherein, The direct current first terminal member comprises a direct current first terminal main body, The direct current second terminal member comprises a direct current second terminal main body; The direct current first terminal main body and the direct current second terminal main body are distributed outside the second side of the packaging base, and the direct current first terminal main body and the direct current second terminal main body are in a stacked distribution state.

[0014] The bus capacitor comprises at least three capacitor terminal assemblies, and one capacitor terminal assembly corresponds to one power assembly, and the capacitor terminal assembly is electrically connected with the corresponding power assembly, wherein, The capacitor terminal assembly comprises a bus capacitor first end plate and a bus capacitor second end plate; When the capacitor terminal assembly is electrically connected with the corresponding power assembly, the bus capacitor first end plate is electrically connected with the direct current first terminal member, and the bus capacitor second end plate is electrically connected with the direct current second terminal member.

[0015] The power unit is packaged on the packaging base, the power unit comprises a plurality of power assemblies, each power assembly can be divided into a first unit body and a second unit body, the first unit body is molded on the first surface of the base, compared with the existing packaging, the size of the packaging module can be reduced, thereby the volume of the power conversion circuit topology can be reduced, when the power conversion circuit topology forms an inverter, the volume of the formed inverter can be reduced.

[0016] When the power assembly is split into the first unit body and the second unit body, the size of the first back plate and the second back plate can be reduced, the utilization rate of the back plate cutting can be improved, and the packaging cost can be reduced. When the size of the first back plate and the second back plate is reduced, the size of the first plastic package body and the second plastic package body can be reduced, the warping degree of the first plastic package body and the second plastic package body can be reduced, and the warping degree of the plastic package module can be reduced.

[0017] The heat dissipation unit is arranged in the packaging base, the heat dissipation unit includes arrayed heat dissipation members, and forms the first heat dissipation queue and the second heat dissipation queue. The cooling liquid flows in the packaging base and flows through the heat dissipation members in the heat dissipation unit, so that the heat dissipation members effectively dissipate heat of the packaging base and the power unit body on the packaging base, and the stability and reliability of the power module in operation can be effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a perspective view of an embodiment of the power module of the present application.

[0019] Figure 2 It is a structural schematic view of an embodiment of the power module of the present application.

[0020] Figure 3 It is a perspective view of an embodiment of the power module of the present application. Figure 1 It is a schematic view of an embodiment in which the power unit is hidden and the first seat body and the second seat body are separated.

[0021] Figure 4 It is a schematic view of an embodiment in which the power unit is hidden in the power module. Figure 1 It is a sectional view of an embodiment in which the power unit is hidden in the power module.

[0022] Figure 5 It is a perspective view of an embodiment of the power module of the present application.

[0023] Figure 6 It is a schematic view of an embodiment in which the second plastic package body is removed in the power module. Figure 5 It is a schematic view of an embodiment in which the second plastic package body is removed in the power module.

[0024] Figure 7 It is a structural schematic view of an embodiment of the power module of the present application.

[0025] Explanation of reference signs: 1 - package base, 2 - heat dissipation plate, 3 - bus capacitor, 4 - heat dissipation liquid inlet pipe, 5 - heat dissipation liquid outlet of the plate, 6 - heat dissipation liquid outlet pipe, 7 - second unit body signal terminal group, 8 - first unit body signal terminal group, 9 - unit body connecting piece, 10 - AC terminal plate, 11 - first seat body, 12 - component second unit body, 13 - bus capacitor first longitudinal plate, 14 - bus capacitor second longitudinal plate, 15 - bus capacitor first transverse plate, 16 - bus capacitor second transverse plate, 17 - bus capacitor fourth transverse plate, 18 - DC second terminal main body, 19 - bus capacitor third transverse plate, 20 - DC first terminal main body, 21 - second seat body, 22 - first type heat dissipation member, 23 - seat body sealing groove, 24 - buffer zone, 25 - second type heat dissipation member, 26 - second unit body signal terminal, 27 - first unit body signal terminal, 28 - second plastic package body, 29 - terminal groove, 30 - second terminal connecting plate, 31 - first terminal connecting plate, 32 - second lining plate, 33 - bonding wire, 34 - DC first terminal member, 35 - first plastic package body, 36 - base liquid hole, 37 - component first unit body, 38 - DC second terminal connecting part, 39 - DC second terminal transition part. DETAILED DESCRIPTION

[0026] The application will be further described below in connection with specific drawings and examples.

[0027] In order to effectively improve the stability and reliability of the power module, the application provides a power module with enhanced heat dissipation structure, which comprises: A power module body, which at least comprises a package base 1 and a power unit assembled on the package base 1, so as to form a required power conversion circuit topology by using the power unit; An enhanced heat dissipation structure, which at least comprises a heat dissipation unit arranged in the package base 1, and the heat dissipation unit comprises a plurality of arrayed heat dissipation members, wherein, The end of each heat dissipation member is fixedly connected with the inner wall of the package base 1 corresponding to the end of the package base 1; During heat dissipation, cooling liquid is injected into one end of the package base 1, and the cooling liquid flows in the package base 1 and through the heat dissipation members in the heat dissipation unit, so as to dissipate heat of the package base 1 and the power unit on the package base 1 by using the heat dissipation members.

[0028] It should be understood that the power module specifically refers to the packaging structure formed by packaging the power unit, and the power module can be consistent with the prior art. The power module of the present application should include the power module body, that is, the power unit itself packaged to form a packaging structure. In specific implementation, the power module plate body generally should include a packaging base 1 and a power unit packaged on the packaging base 1. The packaging base 1 serves as a support for packaging and should have a base first surface and a base second surface. After the power unit is arranged on the packaging base 1, the power unit can form the required electric energy conversion circuit topology. The formed electric energy conversion circuit topology can be selected as required, such as forming a rectifier, an inverter or other electric energy conversion forms. The specific implementation should meet the actual application requirements.

[0029] In order to form the electric energy conversion circuit topology, the power unit should include a plurality of power components arranged in sequence on the packaging base 1. The arrangement of the power components will be described below. Figures 5-7 An embodiment of the power module packaging structure is shown in FIG.

[0030] As can be seen from the above description, the power module will generate heat during operation. In order to ensure the stability and reliability of the power module, the power module should be cooled. In an embodiment of the present application, the power module further includes a heat dissipation structure. The heat dissipation structure can be used to efficiently cool the power module. In specific implementation, the heat dissipation structure can include a heat dissipation unit located in the packaging base 1. Since the power unit is packaged on the packaging base 1, when the heat dissipation unit is located in the packaging base 1, the heat dissipation of the power module can be effectively realized without increasing the packaging volume of the power module.

[0031] The heat dissipation structure uses liquid cooling to cool the power module. When using liquid cooling, cooling liquid should be injected into the packaging base 1. The cooling liquid can be water or other forms that can achieve liquid cooling. The specific implementation can be selected as required. After the cooling liquid is injected into the packaging base 1, it should flow unidirectionally in the packaging base 1 to use the flow of the cooling liquid to remove heat. In specific implementation, one end of the heat dissipation member should be fixedly connected to the inner wall of the packaging base 1 to achieve the required heat transfer and heat dissipation, and to form an effective heat dissipation path. The connection between the heat dissipation member and the inner wall of the packaging base 1 will be described below.

[0032] In an embodiment of the present application, along the length direction of the packaging base 1, the heat dissipation members in the heat dissipation unit form first and second heat dissipation queues arranged alternately, The first and second heat dissipation queues each include a plurality of heat dissipation members, and the arrangement direction of the heat dissipation members in the first and second heat dissipation queues is perpendicular to the length direction of the packaging base 1. The first end of the heat dissipating element in the first heat dissipating queue is fixedly connected with the first inner wall of the package base 1, and the second end of the heat dissipating element in the first heat dissipating queue is gap-fitted with the second inner wall of the package base 1. The first end of the heat dissipating element in the second heat dissipating queue is gap-fitted with the first inner wall of the package base 1, and the second end of the heat dissipating element in the second heat dissipating queue is fixedly connected with the second inner wall of the package base 1.

[0033] Figures 1-7 As shown in the middle of the figure, the package base 1 can be in the form of a rectangle, at this time, the packaging direction of the power unit on the package base 1 is generally also consistent with the length direction of the package base 1. In order to effectively dissipate heat, the arrangement length of the heat dissipation unit should also generally correspond to the length direction of the package base 1. In specific implementation, the heat dissipating elements in the heat dissipation unit can form first and second heat dissipating queues arranged alternately. It should be understood that the first and second heat dissipating queues each include a plurality of heat dissipating elements, and the arrangement direction of the heat dissipating elements in the first and second heat dissipating queues is perpendicular to the length direction of the package base 1. Figure 3 As shown in the middle of the figure, the package base 1 can be in the form of a rectangle, at this time, the packaging direction of the power unit on the package base 1 is generally also consistent with the length direction of the package base 1. In order to effectively dissipate heat, the arrangement length of the heat dissipation unit should also generally correspond to the length direction of the package base 1. In specific implementation, the heat dissipating elements in the heat dissipation unit can form first and second heat dissipating queues arranged alternately. It should be understood that the first and second heat dissipating queues each include a plurality of heat dissipating elements, and the arrangement direction of the heat dissipating elements in the first and second heat dissipating queues is perpendicular to the length direction of the package base 1.

[0034] It should be noted that after the second end of the heat dissipating element in the first heat dissipating queue is gap-fitted with the second inner wall of the package base 1, a flow channel of the cooling liquid can be formed between the second end of the heat dissipating element in the first heat dissipating queue and the second inner wall of the package base 1. Similarly, the first end of the heat dissipating element in the second heat dissipating queue can also be gap-fitted with the first inner wall of the package base 1 to form a flow channel of the cooling liquid. At this time, the flow channels corresponding to the first and second inner walls of the package base 1 can be formed, which can improve the heat dissipation efficiency of the cooling liquid.

[0035] Figure 4 As shown in the middle of the figure, the heat dissipating elements in the first heat dissipating queue can form first heat dissipating elements 22, and the heat dissipating elements in the second heat dissipating queue can form second heat dissipating elements 25. Figure 3 and Figure 4 As shown in the middle of the figure, the heat dissipating elements in the first heat dissipating queue can form first heat dissipating elements 22, and the heat dissipating elements in the second heat dissipating queue can form second heat dissipating elements 25. Figure 4As shown, of course, other arrangements can also be adopted, and the specific arrangement is subject to the need to meet the flow and heat dissipation requirements of the cooling liquid, which will not be described one by one here. In an embodiment of the present application, the heat dissipation unit is located in the central region of the packaging base 1. Buffer regions 24 are also provided at both ends of the packaging base, and the heat dissipation unit is located between the buffer regions 24 at both ends of the packaging base 1. During heat dissipation, the injected cooling liquid first enters the buffer region 24 at one end of the packaging base 1, flows through the heat dissipation unit, and then enters the buffer region 24 at the other end of the packaging base.

[0036] Figure 3 An embodiment of the formation of the buffer region 24 is shown in the figure, and as can be seen from the figure, there is no heat dissipation member in the buffer region 24. The buffer region 24 can accommodate the cooling liquid, and during heat dissipation, a driving force for the flow of the cooling liquid should be provided, such as driving the flow of the cooling liquid by a pump or the like.

[0037] In an embodiment of the present application, the enhanced heat dissipation structure further includes a heat dissipation plate 2 located outside the packaging base 1, wherein, The cooling liquid can be injected into one end of the packaging base 1 through the heat dissipation plate 2, and the cooling liquid entering the packaging base 1 can flow out through the heat dissipation liquid outlet pipe 6 at the other end of the packaging base 1. A bus capacitor 3 is provided between the heat dissipation plate 2 and the packaging base 1, the bus capacitor 3 is in corresponding contact with the power units on the heat dissipation plate 2 and the packaging base 1, and the bus capacitor 1 is in adaptive electrical connection with the power units.

[0038] It should be noted that when the formed circuit topology is an inverter, in order to meet the operation of the inverter, the bus capacitor 3 should also be included to be in adaptive electrical connection with the formed inverter, and the specific adaptive electrical connection mode and function of the inverter can be consistent with the prior art, which will not be described here. In order to simultaneously dissipate heat from the bus capacitor 3, the enhanced heat dissipation structure further includes a heat dissipation plate 2, which can be located outside the packaging base 1. The heat dissipation plate 2 is in the form of a plate, and the heat dissipation plate 2 can be parallel to the packaging base 1. The length of the heat dissipation plate 2 can be less than the length of the packaging base 1. One end of the heat dissipation plate 2 is provided with a heat dissipation liquid inlet pipe 4, and the heat dissipation plate 2 is provided with a heat dissipation plate liquid port 5. The cooling liquid can be injected into the packaging base 1 through the heat dissipation plate liquid port 5 and the heat dissipation liquid inlet pipe 4.

[0039] Figures 1-4 In the figure, the bus capacitor 3 is located between the heat dissipation plate 2 and the packaging base 1, and the bus capacitor 3 is in corresponding contact with the power units on the heat dissipation plate 2 and the packaging base 1. At this time, the heat dissipation plate 2 can be used to dissipate heat from the bus capacitor 3. In specific implementation, the bus capacitor 1 is in adaptive electrical connection with the power units, and the adaptive electrical connection between the bus capacitor 3 and the power units will be described below.

[0040] Figures 1-7 In the embodiment of the package base 1, as shown in the figure, the package base 1 can include a second base body 21 and a first base body 11 matched with the second base body 21, and the first base body 11 and the second base body 21 are connected in alignment to form the package base 1. When the package base 1 is formed by matching the second base body 21 with the first base body 11, the outer surface of the first base body 11 can form a first base surface, the outer surface of the second base body 21 can form a second base surface, and the first base surface and the second base surface are in correspondence.

[0041] Figure 1 In the embodiment, the busbar capacitor 3 is located between the second base body 21 and the heat sink 2. When the package base 1 adopts the above form, the inner wall of the first base body 11 can form a first inner wall of the package base 1, and at this time, the corresponding inner wall of the second base body 21 can form a second inner wall of the package base 1. In addition, Figure 3 In the embodiment, a base body sealing groove 23 is further arranged in the first base body 11, and a sealing ring can be assembled through the base body sealing groove 23 to improve the sealing effect after the first base body 11 and the second base body 21 are matched, and to improve the reliability of the cooling liquid during cooling.

[0042] Figure 7 In the embodiment, base liquid holes 36 are arranged at both ends of the second base body 21, and the base liquid holes 36 penetrate through the second base body 21 to communicate with the package base 1. Specifically, the heat dissipation liquid inlet pipe 4 is assembled in one base liquid hole 36, and the heat dissipation liquid outlet pipe 6 is assembled in the other base liquid hole 36, as shown in Figure 1 and Figure 2 .

[0043] In order to effectively reduce the size of the power module, in an embodiment of the present application, for the power components in the power unit, each power component can include a component first unit body 37 and a component second unit body 12, that is, each power component is split into a component first unit body 37 and a component second unit body 12. It should be noted that when the power component is split, it can be split according to the circuit function of the power component. For example, when the power component is a bridge arm circuit, it can be split according to the upper half bridge arm and the lower half bridge arm of the bridge arm circuit to form a component first unit body 37 and a component second unit body 12 after splitting. The specific splitting form can be selected as needed. It should be understood that for the component first unit body 37 and the component second unit body 12 formed by splitting, when the component first unit body 37 and the component second unit body 12 are matched and electrically connected, the circuit function of the power component can be formed, that is, the splitting of the present application is only to reduce the package size, and will not change the circuit function of the power component.

[0044] In existing packaging, the entire power component is typically packaged on the first or second surface of the base. However, arranging multiple power devices sequentially results in a large package size. In one embodiment of the present invention, the first component unit 37 is packaged on the first surface of the base, and the second component unit 12 is packaged on the second surface of the base. When the power components are arranged sequentially, only the first component unit 37 is arranged on the first surface of the base, and the second component unit 12 is arranged on the second surface of the base. Therefore, compared with existing packaging, the size and volume of the package module can be reduced.

[0045] It is understandable that, when the above-described encapsulation is used, placing the heat dissipation unit within the encapsulation base 1 allows for effective heat dissipation without affecting the size and volume of the encapsulation module. As explained above, the first type of heat dissipation element 22 contacts the first inner wall, thereby forming a heat dissipation contact between the first type of heat dissipation element 22 and the second unit body 12 of the component through the first base 11. Similarly, the second type of heat dissipation element 25 forms a heat dissipation contact with the second unit body 12 of the component through the second base 22, improving heat dissipation efficiency. Furthermore, arranging the first type of heat dissipation element 22 and the second type of heat dissipation element 25 in the above-described manner increases the distribution density of the heat dissipation elements, further enhancing the heat dissipation effect.

[0046] In one embodiment of the present invention, when the power conversion circuit topology formed based on the power unit is an inverter, the power unit includes three power components, and the three power components are arranged sequentially along the length direction of the packaging base 1. For any power component, the first unit body 37 and the second unit body 12 of the component are distributed in a positive correspondence.

[0047] As explained above, the power conversion circuit topology can be an inverter. When the power conversion circuit topology is an inverter, it can convert DC to AC. To meet the operation requirements of the inverter, the power unit should include three power components. Figure 2 , Figures 5-7 The diagram shows an embodiment of a power unit comprising three power components. The three power components within the power unit are arranged sequentially along the length of the packaging base 1. In this case, the three power components can be used to form a three-phase output during inverter operation, such as forming a three-phase U phase, V phase, and W phase.

[0048] In order to further reduce the size of the power module, the first unit body 37 and the second unit body 12 of each power component should be distributed in a positive correspondence. The situation of the first unit body 37 and the second unit body 12 will be explained in detail below.

[0049] In one embodiment of the present invention, the first unit body 37 of the component includes a first liner, a first power device unit disposed on the first liner, and a first encapsulation body 35 for encapsulating the first liner and the first power device unit on the first surface of the base. The second unit body 12 of the component includes a second liner 32, a second power device unit disposed on the second liner 32, and a second encapsulation body 28 for encapsulating the second liner 32 and the second power device unit on the second surface of the base. The first power device unit and the second power device unit are electrically connected via AC terminals within the power assembly.

[0050] Figure 6 The figure illustrates one embodiment of the second unit body 12 of the component. As shown in the figure, the second unit body 12 may include a second liner 32, which is placed on the second surface of the base of the molding base 1. A second power device unit is disposed on the second liner 32. Figure 6 It is understood that after the second substrate 32 and the second power device unit on the second substrate 32 are fixed on the second surface of the base, they can be further encapsulated by the second encapsulation body 28. The second substrate 32 can be a DBC (Direct Bonding Copper) board or an AMB (Active Metal Bonding) board. The second power device unit can include several power semiconductor devices. The power semiconductor devices are mounted on the second substrate 32 and electrically connected to the second substrate 32 through bonding wires 33 to form the required second power device unit. That is, the formed second power device unit is the circuit functional unit of the second unit body 12 of the component. Therefore, according to the above description, the circuit form of the second power device unit can be selected and determined according to the type of power component.

[0051] In practical implementation, the first unit body 37 of the component can generally adopt the same form as the second unit body 12 of the component. In this case, the first unit body 37 of the component may include a first liner, a first power device unit, and a first molding compound 35. It should be understood that... Figure 7 The first liner, being covered by the first encapsulating body 35, was not in Figure 7 Similarly, the first power device unit is not labeled. For the information on the first substrate and the first power device unit, please refer to the corresponding descriptions of the second substrate and the second power device unit mentioned above. They will not be repeated here.

[0052] When the first unit body 37 of the component and the second unit body 12 of the component adopt the same form, the first plastic package 35 and the second plastic package 28 can adopt the same form. At this time, the first plastic package 35 and the second plastic package 28 can be prepared by using the same plastic package mold, which can reduce the plastic package cost. Compared with the existing package, since the sizes of the first plastic package 35 and the second plastic package 28 will be correspondingly reduced, the warpage degree of the power module caused by the plastic package can be reduced. In addition, compared with the existing package, the corresponding sizes of the first liner and the second liner 32 in the present invention will also be greatly reduced, so as to improve the utilization rate of cutting and reduce the cost of the package structure.

[0053] In an embodiment of the present invention, the AC terminal component includes a unit body connector 9 and an AC terminal board 10 electrically connected to the unit body connector 9, wherein, The unit body connector 9 straddles the first side of the package base 1, and both ends of the unit body connector 9 are electrically connected to the first power device unit and the second power device unit respectively; The AC terminal board 10 is located outside the first side of the package base 1.

[0054] As can be seen from the above description, the first power device unit corresponds to the first surface of the base, and the second power device unit corresponds to the second surface of the base. When forming a power component, the first power device unit and the second power device unit should be electrically connected. In order to form the required electrical connection, an AC terminal should also be included in the power component. Figure 1 An embodiment of the AC terminal component is shown. As can be seen from the figure, the AC terminal component may include a unit body connector 9 and an AC terminal board 10. The unit body connector 9 is arc-shaped. By using the arc of the unit body connector 9, it can straddle the first side of the package base 1. Thereafter, both ends of the unit body connector 9 can be electrically connected to the first power device unit and the second power device unit respectively. For example, the unit body connector 9 can be in a "U" shape. The middle position of the unit body connector 9 corresponds to the first side of the package base 1. Both ends of the unit body connector 9 are electrically connected to the first power device unit and the second power device unit through appropriate power distribution connections. The specific electrical connection method can be consistent with the prior art. For example, the end of the unit body connector 9 can be electrically connected to the corresponding area positions of the first liner and the second liner 32, so as to realize the corresponding electrical connection between the first power device unit and the second power device unit.

[0055] In order to facilitate subsequent connection, the AC terminal board 10 is fixedly connected to the outer side surface of the unit body connector 9. At this time, the AC terminal board 10 is located outside the first side of the package base 1. Figure 1 In, the AC terminal board 10 can be perpendicular to the unit body connector 9. The AC terminal board 10 and the unit body connector 9 can adopt an integrally formed form.

[0056] In one embodiment of the present application, the first unit body 37 of the assembly further comprises a first unit body signal terminal group 8 electrically connected to the first power device unit, wherein the first unit body signal terminal group 8 comprises a plurality of first unit body signal terminals 27 arranged side by side; The second unit body 12 of the assembly further comprises a second unit body signal terminal group 7 electrically connected to the second power device unit, wherein the second unit body signal terminal group 7 comprises a plurality of second unit body signal terminals 26 arranged side by side; The first unit body signal terminals 27 and the second unit body signal terminals 26 are parallel to each other, The first unit body signal terminals 27 and the second unit body signal terminals 14 are arranged outside the first side of the packaging base 1, and the ends of the first unit body signal terminals 27 and the corresponding ends of the second unit body signal terminals 26 are located below the second surface of the packaging base 1.

[0057] As can be seen from the above description, the first power device unit and the second power device unit each comprise a plurality of power semiconductor devices, which can be IGBT devices. Of course, the power semiconductor devices can also be other types of devices, which can be selected as needed, and will not be described one by one here. In order to configure the working state of the power semiconductor devices, the first unit body 37 of the assembly comprises a first unit body signal terminal group 8, which is electrically connected to the first power device unit. Generally, the first unit body signal terminal group 8 should comprise a plurality of first unit body signal terminals 27 arranged side by side, and the number of the first unit body signal terminals 27 can correspond to the number of the power semiconductor devices in the first power device unit. For example, one first unit body signal terminal 27 is connected to the control end of one power semiconductor device, so that the corresponding power semiconductor device can be driven to be in a conducting state or an off state through the first unit body signal terminal 27. The specific driving mode of the power semiconductor device to be in a conducting state or an off state can be consistent with the prior art, and will not be described here.

[0058] Similarly, the second unit body 12 of the assembly comprises a second unit body signal terminal group 7, and the details of the second unit body signal terminal group 7 can be referred to the corresponding description of the first unit body signal terminal group 8 above, which will not be described here.

[0059] In order to facilitate subsequent connection, Figure 5 and Figure 6 It can be seen that the first unit body signal terminals 27 and the second unit body signal terminals 26 are parallel to each other, and the corresponding extension lengths of the first unit body signal terminals 27 and the second unit body signal terminals 26 are consistent with the thickness direction of the packaging base 1. Specifically, the thickness direction of the packaging base 1 refers to the direction from the first surface of the base to the second surface of the base. In addition,Figure 5 and Figure 6 In the embodiment, the first unit body signal terminal 27 and the second unit body signal terminal 26 are distributed outside the first side edge of the packaging base 1, and the end of the first unit body signal terminal 27 and the corresponding end of the second unit body signal terminal 26 are located below the second surface of the packaging base 1. In the implementation, the end of the first unit body signal terminal 27 can be flush with the corresponding end of the second unit body signal terminal 26.

[0060] In an embodiment of the present application, for each power assembly, the AC terminal plate 10 is located between the first unit body signal terminal group 8 and the second unit body signal terminal group 7. The first end of the AC terminal plate 10 is in contact with the unit body connecting piece 9, the second end of the AC terminal plate 10 extends away from the first side edge of the packaging base 1, and the second end of the AC terminal plate 10 is located outside the first unit body signal terminal group 8 and the second unit body signal terminal group 7.

[0061] Figure 1 In the embodiment, the AC terminal plate 10 is located between the first unit body signal terminal group 8 and the second unit body signal terminal group 7, and at this time, the unit body connecting piece 9 is also located between the first unit body signal terminal group 8 and the second unit body signal terminal group 7. The first unit body signal terminal 27 and the second unit body signal terminal 26 are located between the second end of the AC terminal plate 10 and the first side edge of the packaging base 1.

[0062] In an embodiment of the present application, the first unit body 37 of the assembly further includes a direct current first terminal piece 34 for leading out the first power device unit, and the second unit body 12 of the assembly further includes a direct current second terminal piece for leading out the second power device unit, wherein, The direct current first terminal piece 34 includes a direct current first terminal body, The direct current second terminal piece includes a direct current second terminal body 18. The direct current first terminal body and the direct current second terminal body 18 are distributed outside the second side edge of the packaging base 1, and the direct current first terminal body and the direct current second terminal body 18 are in a stacked distribution state.

[0063] As can be seen from the above description, when the power conversion circuit topology is an inverter, each power assembly should be connected to an external direct current voltage. In order to realize the connection to the external direct current voltage, the first unit body 37 of the assembly should include the direct current first terminal piece 34, and the second unit body 12 of the assembly should include the direct current second terminal piece. Therefore, the direct current first terminal piece 34 and the direct current second terminal piece can be connected to the external direct current voltage, the first power device unit and the second power device unit can convert the direct current voltage into an alternating current voltage, and the alternating current voltage is output through the AC terminal plate 10.

[0064] Specifically, the first DC terminal 34 should include a first DC terminal body, which is the main part of the first DC terminal 34 that is connected to an external DC voltage; similarly, the second DC terminal may include a second DC terminal body, which can be connected to an external DC voltage. In order to reduce stray inductance, the first DC terminal body and the second DC terminal body are configured to be stacked.

[0065] Depend on Figure 1 , Figures 5-7 It can be seen that by placing the first DC terminal and the second DC terminal on the outer side of the second side of the packaging base 1, the first DC terminal and the second DC terminal will not affect the aforementioned AC terminal block 10, the first unit signal terminal group 8, and the second unit signal terminal group 7; in this case, the integration of the power components on the packaging base 1 can be improved. It should be understood that the second side of the packaging base 1 corresponds exactly to the first side of the packaging base 1, and the first side and the second side are two sides along the length direction of the packaging base 1.

[0066] In one embodiment of the present invention, the DC first terminal body 20 includes a first terminal connecting plate 31 and second terminal connecting plates 30 distributed on both sides of the first terminal connecting plate 31, wherein the direction in which one second terminal connecting plate 30 points to the other second terminal connecting plate 30 is consistent with the length direction of the packaging base 1. The DC second terminal body 18 is at least flat, and the DC second terminal body 18 corresponds directly to the first terminal connecting plate 31, and there is a gap fit between the DC second terminal body 18 and the first terminal connecting plate 31.

[0067] Figure 2 and Figure 4 The figure shows an embodiment in which the DC first terminal body 20 and the DC second terminal body 18 are stacked. As shown in the figure, the DC first terminal body 20 includes a first terminal connecting plate 31 and second terminal connecting plates 30 distributed on both sides of the first terminal connecting plate 31. In this case, the first terminal connecting plate 31 and the two second terminal connecting plates 30 can cooperate to form a strip-shaped DC first terminal body, and the length direction of the DC first terminal body 20 is consistent with the length direction of the packaging base 1.

[0068] Depend on Figure 5 and Figure 6 As can be seen, the DC second terminal body 18 is flat, and the DC second terminal body 18 corresponds directly to the first terminal connecting plate 31, and the DC second terminal body 18 and the first terminal connecting plate 31 are parallel to each other, thus forming a stacked distribution. In order not to affect the connection with the external DC voltage, the DC second terminal body 18 and the first terminal connecting plate 31 are in a gap fit.

[0069] In an embodiment of the present application, the joint of the first terminal connecting plate 31 and the second terminal connecting plate 30 is arc-shaped, so that the DC first terminal body 20 forms a terminal groove 29 with an opening facing the second surface of the base; When the DC first terminal body and the DC second terminal body 18 are in a stacked distribution state, the DC second terminal body 18 extends into the terminal groove 29.

[0070] As can be seen from Figure 5 and Figure 6 It can be seen that the first terminal connecting plate 31 and the second terminal connecting plate 30 are also flat plates, the surfaces of the two second terminal connecting plates 30 are coplanar, but the surfaces corresponding to the first terminal connecting plate 31 are not coplanar, the joint of the first terminal connecting plate 31 and the second terminal connecting plate 30 is arc-shaped, the first surface of the second terminal connecting plate 30 is located between the first surface of the first terminal connecting plate 31 and the second surface of the base, and the first surface of the first terminal connecting plate 31 and the second surface of the second terminal connecting plate 30 both refer to the surfaces corresponding to the second surface of the base. At this time, the DC first terminal body 20 forms a terminal groove 29 with an opening facing the second surface of the base.

[0071] As can be seen from Figure 5 It can be seen that the DC second terminal body 18 extends into the terminal groove 29, but the DC second terminal body 18 is not in contact with the first terminal connecting plate 31. Generally, the width of the DC second terminal body 18 should be less than the width of the terminal groove 29.

[0072] In order to be electrically connected with the first power device unit, the DC first terminal piece 34 further comprises a DC first terminal connecting body, one end of the DC first terminal connecting body is connected with one side of the DC first terminal piece 34, and the other end of the DC first terminal connecting body is electrically connected with the first power device unit. In order to be electrically connected with the first power device unit, the DC first terminal connecting body can be arc-shaped.

[0073] In addition, the DC second terminal piece further comprises a DC second terminal connecting part 38 and a DC second terminal transition part 39, wherein the DC second terminal transition part 39 is electrically connected with the DC second terminal body 18, and the DC second terminal transition part 39 is electrically connected with the second power device unit through the DC second terminal connecting part 38. The DC second terminal connecting part 38, the DC second terminal transition part 39 and the DC second terminal body 18 can be integrally formed.

[0074] In an embodiment of the present application, the bus capacitor 3 comprises at least three capacitor terminal assemblies, one capacitor terminal assembly corresponds to one power assembly, and the capacitor terminal assembly is electrically connected with the corresponding power assembly, wherein, The capacitor terminal assembly comprises a bus capacitor first end plate and a bus capacitor second end plate; The bus capacitor first end plate is electrically connected with the DC first terminal piece, and the bus capacitor second end plate is electrically connected with the DC second terminal piece when the capacitor terminal assembly is electrically connected with the corresponding power assembly.

[0075] It should be noted that when the circuit topology formed is an inverter, the bus capacitor 3 should be led out through three capacitor terminal assemblies so as to be connectable with three power assemblies, that is, to achieve the above-mentioned adaptive electrical connection with the power unit.

[0076] In order to realize the corresponding electrical connection with the power assembly, the capacitor terminal assembly should include a bus capacitor first end plate and a bus capacitor second end plate, and when electrically connected, the bus capacitor first end plate is electrically connected with the DC first terminal piece, and the bus capacitor second end plate is electrically connected with the DC second terminal piece. Figure 2 An embodiment of the bus capacitor first end plate and the bus capacitor second end plate is shown in FIG. 2, The bus capacitor first end plate can include a bus capacitor second longitudinal plate 14, a bus capacitor second transverse plate 16, and a bus capacitor fourth transverse plate 17, wherein one end of the bus capacitor second transverse plate 16 is electrically connected with one polar plate of the bus capacitor 3, the other end of the bus capacitor second transverse plate 16 is connected with one end of the bus capacitor second longitudinal plate 14, the other end of the bus capacitor second longitudinal plate 14 is connected with the bus capacitor fourth transverse plate 17, and the bus capacitor second longitudinal plate 14 is perpendicular to the bus capacitor second transverse plate 16 and the bus capacitor fourth transverse plate 17. The bus capacitor fourth transverse plate 17 can have the same structure as the DC first terminal body 20 described above, and the bus capacitor fourth transverse plate 17 is fixedly attached to the DC first terminal body, for example, by contacting the corresponding surfaces of the bus capacitor fourth transverse plate 17 and the DC first terminal body, and then laser welding is performed to achieve the fixed attachment.

[0077] Figure 2 In FIG. 2, the bus capacitor second end plate can include a bus capacitor first transverse plate 15, a bus capacitor first longitudinal plate 13, and a bus capacitor third transverse plate 19, wherein one end of the bus capacitor first transverse plate 15 is electrically connected with the other polar plate of the bus capacitor 3, the other end of the bus capacitor first transverse plate 15 is connected with one end of the bus capacitor first longitudinal plate 13, the other end of the bus capacitor first longitudinal plate 13 is connected with the bus capacitor third transverse plate 19, and the bus capacitor third transverse plate 19 is attached to and in contact with the DC second terminal body 18, wherein the attachment and contact specifically means that the bus capacitor third transverse plate 19 is attached to and in contact with the DC second terminal body 18 correspondingly.

[0078] In the embodiment, the first longitudinal plate 13 of the bus capacitor and the second longitudinal plate 14 of the bus capacitor are parallel to each other. Generally, a safety distance is left between the first longitudinal plate 13 of the bus capacitor and the second longitudinal plate 14 of the bus capacitor. The first transverse plate 15 of the bus capacitor and the second transverse plate 16 of the bus capacitor are also parallel to each other, and a corresponding safety distance should also be maintained. The second longitudinal plate 14 of the bus capacitor, the second transverse plate 16 of the bus capacitor and the fourth transverse plate 17 of the bus capacitor can be integrally formed. Of course, the first transverse plate 15 of the bus capacitor, the first longitudinal plate 13 of the bus capacitor and the third transverse plate 19 of the bus capacitor can also be integrally formed. The specific selection can be made according to the needs, and the specific selection will not be illustrated one by one here.

Claims

1. A power module with an enhanced heat dissipation structure, characterized in that, The power module includes: The power module body includes at least a packaging base and power units mounted on the packaging base, so as to form the required power conversion circuit topology using the power units; The enhanced heat dissipation structure includes at least a heat dissipation unit disposed within the packaging base, wherein the heat dissipation unit comprises a plurality of heat dissipation components arranged in an array, wherein... One end of each heat sink is fixedly connected to the inner wall of the corresponding encapsulation base; During heat dissipation, coolant is injected into one end of the package base. The coolant flows inside the package base and through the heat dissipation components in the heat dissipation unit, so that the heat dissipation components can be used to dissipate heat from the package base and the power unit on the package base.

2. The power module with enhanced heat dissipation structure according to claim 1, characterized in that: Along the length of the packaging base, the heat dissipation components within the heat dissipation unit form an alternating first heat dissipation queue and a second heat dissipation queue. Both the first and second heat dissipation queues include several heat dissipation components, and the arrangement direction of the heat dissipation components in the first and second heat dissipation queues is perpendicular to the length direction of the packaging base. The first end of the heat sink in the first heat dissipation queue is fixedly connected to the first inner wall of the encapsulation base, and the second end of the heat sink in the first heat dissipation queue is clearance-fitted with the second inner wall of the encapsulation base. The first end of the heat sink in the second heat dissipation queue is fitted with the first inner wall of the packaging base with a clearance, and the second end of the heat sink in the second heat dissipation queue is fixedly connected to the second inner wall of the packaging base.

3. The power module with enhanced heat dissipation structure according to claim 1, characterized in that: The heat dissipation unit is located in the central area within the packaging base; Buffer zones are also provided at both ends of the encapsulation base, and the heat dissipation unit is located between the buffer zones at both ends of the encapsulation base; During heat dissipation, the injected coolant first enters the buffer zone at one end of the encapsulation base, flows through the heat dissipation unit, and then enters the buffer zone at the other end of the encapsulation base.

4. The power module with enhanced heat dissipation structure according to any one of claims 1 to 3, characterized in that, The enhanced heat dissipation structure also includes a heat sink located outside the package base, wherein, Coolant can be injected into one end of the encapsulation base through the heat sink, and the coolant entering the encapsulation base can flow out through the heat dissipation outlet pipe at the other end of the encapsulation base; A bus capacitor is provided between the heat sink and the package base. The bus capacitor is in contact with the power unit on the heat sink and the package base, and the bus capacitor is electrically connected to the power unit.

5. The power module with enhanced heat dissipation structure according to claim 4, characterized in that, The power unit includes several power components arranged in sequence, wherein, For any power component, the power component includes a first component unit and a second component unit electrically connected to the first component unit. The first unit of the component is distributed on the first surface of the base, and the second unit of the component is distributed on the second surface of the base. The first surface and the second surface of the base are two corresponding surfaces of the encapsulation base.

6. The power module with enhanced heat dissipation structure according to claim 5, characterized in that, When the power conversion circuit topology formed based on the power unit is an inverter, the power unit includes three power components, and the three power components are arranged sequentially along the length of the package base. For any power component, the first unit cell and the second unit cell are distributed in a positive correspondence.

7. The power module with enhanced heat dissipation structure according to claim 6, characterized in that, The first unit body of the component includes a first liner, a first power device unit disposed on the first liner, and a first encapsulation body for encapsulating the first liner and the first power device unit on the first surface of the base. The second unit of the component includes a second liner, a second power device unit disposed on the second liner, and a second encapsulation body for encapsulating the second liner and the second power device unit on the second surface of the base. The first power device unit and the second power device unit are electrically connected via AC terminals within the power assembly.

8. The power module with enhanced heat dissipation structure according to claim 7, characterized in that, The first unit body of the component further includes a first unit body signal terminal group that is adapted to be electrically connected to the first power device unit, wherein the first unit body signal terminal group includes a plurality of first unit body signal terminals arranged in parallel. The second unit of the component also includes a second unit signal terminal group that is adapted to be electrically connected to the second power device unit, and the second unit signal group includes a plurality of second unit signal terminals arranged in parallel. The signal terminals of the first unit and the signal terminals of the second unit are parallel to each other. The first unit signal terminal and the second unit signal terminal are both distributed outside the first side of the packaging base, and the ends of the first unit signal terminal and the corresponding ends of the second unit signal terminal are both located below the second surface of the packaging base.

9. The power module with enhanced heat dissipation structure according to claim 7, characterized in that, The first unit of the component further includes a first DC terminal for leading out the first power device unit, and the second unit of the component further includes a second DC terminal for leading out the second power device unit, wherein... The DC first terminal component includes a DC first terminal body. The DC second terminal component includes a DC second terminal body; Both the main body of the first DC terminal and the main body of the second DC terminal are distributed outside the second side of the packaging base, and the main body of the first DC terminal and the main body of the second DC terminal are stacked.

10. The power module with enhanced heat dissipation structure according to claim 9, characterized in that, The bus capacitor includes at least three capacitor terminal assemblies, with one capacitor terminal assembly corresponding one-to-one with a power component, and the capacitor terminal assembly is electrically connected to the corresponding power component. The capacitor terminal assembly includes a first end plate of the bus capacitor and a second end plate of the bus capacitor. When the capacitor terminal assembly is electrically connected to the corresponding power component, the first end plate of the bus capacitor is electrically connected to the first DC terminal piece, and the second end plate of the bus capacitor is electrically connected to the second DC terminal piece.

Images