Surface mounting module and die bonding equipment

Abstract

The invention relates to a mounting module and die bonding equipment. The mounting module comprises a material taking and mounting assembly, a first vibration reduction assembly and a second vibration reduction assembly, the material taking and mounting assembly comprises a left binding head mechanism, a right binding head mechanism and a binding head driving device connected with the left binding head mechanism and the right binding head mechanism, and the binding head driving device can drive the left binding head mechanism and the right binding head mechanism to move in the x-axis direction; the first vibration reduction assembly comprises a first fixing block, a first driving piece arranged on the first fixing block and a first vibration reduction mechanism arranged on the first driving piece, and the second vibration reduction assembly comprises a second fixing block, a second driving piece arranged on the second fixing block and a second vibration reduction mechanism arranged on the second driving piece. The first vibration reduction mechanism, the left binding head mechanism, the right binding head mechanism and the second vibration reduction mechanism are sequentially arranged along the x axis; when the binding head driving device drives the left binding head mechanism and the right binding head mechanism to move on the x axis, the first vibration reduction mechanism and the left binding head mechanism move in the opposite direction or the second vibration reduction mechanism and the right binding head mechanism move in the opposite direction or in the opposite direction.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonding, in particular to a die bonding module and a die bonding device. BACKGROUND

[0002] The die bonding process refers to a process of bonding a chip to a specified area of a substrate through a colloid to form a via or a point via to provide conditions for subsequent wire bonding connection. In the implementation of this process, a chip picking and bonding device is usually used. The suction nozzle of the first binding head of the device can pick up the chip from the wafer disc and place it on the transfer table. The suction nozzle of the second binding head can pick up the chip stored on the transfer table and bond it to the substrate.

[0003] However, the first binding head and the second binding head involve frequent acceleration and deceleration movements in the process of moving, picking and bonding. The constant change of acceleration will cause vibration of the device, mutual interference in the process of picking and bonding, poor bonding efficiency, and difficulty in meeting the high precision requirements of chip bonding. SUMMARY

[0004] To solve the technical problem of mutual interference in the process of picking and bonding of the existing die bonding module, affecting the bonding efficiency and bonding precision, the present application provides a die bonding module and a die bonding device.

[0005] The technical problem of the present application is solved by providing a die bonding module for picking up a chip and bonding it to a substrate, comprising a picking and bonding assembly, a first damping assembly and a second damping assembly. The picking and bonding assembly comprises a left binding head mechanism, a right binding head mechanism and a binding head driving device. The left binding head mechanism and the right binding head mechanism are connected to the binding head driving device. The binding head driving device can drive the left binding head mechanism and the right binding head mechanism to move in the x-axis direction respectively. The first damping assembly comprises a first fixed block, a first driving member arranged on the first fixed block and a first damping mechanism arranged on the first driving member. The second damping assembly comprises a second fixed block, a second driving member arranged on the second fixed block and a second damping mechanism arranged on the second driving member. The first damping mechanism, the left binding head mechanism, the right binding head mechanism and the second damping mechanism are arranged in sequence along the x-axis direction. When the binding head driving device drives the left binding head mechanism to move in the x-axis direction, the first damping mechanism moves towards or away from the left binding head mechanism under the drive of the first driving member. When the binding head driving device drives the right binding head mechanism to move in the x-axis direction, the second damping mechanism moves towards or away from the right binding head mechanism under the drive of the second driving member.

[0006] Preferably, the first fixed block, the binding head driving device and the second fixed block are arranged in sequence along the length direction and are collinear; the first damping assembly further comprises a first sliding rail arranged in the x-axis direction of the first fixed block, and the first damping mechanism is in sliding connection with the first sliding rail; the second damping assembly further comprises a second sliding rail arranged in the x-axis direction of the second fixed block, and the second damping mechanism is in sliding connection with the second sliding rail; the binding head driving device has a left x-axis guide rail and a right x-axis guide rail arranged adjacently in the x-axis direction, the left binding head mechanism is in sliding connection with the left x-axis guide rail, and the right binding head mechanism is in sliding connection with the right x-axis guide rail.

[0007] The application further provides a die bonding apparatus, which comprises a bearing table, a control module and a track device, a dispensing device, a die supply device, a nozzle replacement device and the above-mentioned die bonding module arranged on the bearing table, the control module is in signal connection with the track device, the dispensing device, the die supply device and the die bonding module respectively; the track device is arranged perpendicularly to the die bonding module, the dispensing device is arranged on one side of the track device, the die supply device and the nozzle replacement device are arranged oppositely on the other side of the track device, and the nozzle replacement device is located between the track device and the die supply device.

[0008] Preferably, the die bonding apparatus further comprises a feeding device and a discharging device arranged at opposite ends of the bearing table, the control module is in signal connection with the feeding device and the discharging device respectively; the track device comprises a dispensing track and a die bonding track, the dispensing track is arranged correspondingly to the dispensing device in the x-axis direction, the die bonding track is located between the dispensing track and the die bonding module in the y-axis direction, and the die bonding track, the nozzle replacement device and the die supply device are arranged in sequence in the x-axis direction; the discharge end of the feeding device is connected to the feeding end of the dispensing track, the discharge end of the dispensing track is connected to the feeding end of the die bonding track, and the discharge end of the die bonding track is connected to the feeding end of the discharging device.

[0009] Preferably, the die bonding apparatus further comprises a fixing seat mounted on the bearing table, the first fixed block, the binding head driving device and the second fixed block are arranged in sequence along the x-axis direction and are located in the fixing seat; the bottom of the fixing seat has a flow-through channel arranged through the y-axis, at least part of the die bonding track is arranged in the flow-through channel, and the discharge end of the die bonding track is in communication with the feeding end of the discharging device through the flow-through channel.

[0010] Preferably, the point glue device comprises a first base, an x-axis drive, a y-axis drive and a point glue assembly, the x-axis drive is arranged on the side of the first base, the y-axis drive is arranged on the bottom of the first base; the point glue assembly comprises a second base, a visual detector and a point glue head, the second base is connected to the side of the first base away from the y-axis drive, the visual detector and the point glue head are arranged on the second base, and the visual detector is in signal connection with the point glue head.

[0011] Preferably, the nozzle replacement device comprises a nozzle frame assembly and a rotating assembly, the nozzle frame assembly comprises a movable plate, a fixed plate and a support base arranged in sequence, the movable plate is in sliding connection with the fixed plate, and the support base is arranged on the carrying table; a plurality of limiting openings are arranged on the length direction of the fixed plate, and a plurality of nozzle mounting positions corresponding to the limiting openings are arranged on the length direction of the movable plate, each nozzle mounting position is in communication with a corresponding limiting opening, each nozzle mounting position comprises a plurality of through holes and locking holes, each through hole is in communication with each locking hole, and the hole diameter of the through hole is greater than the hole diameter of the locking hole; the rotating assembly comprises a first rotary motor, a bearing and a cam connected with the movable plate, the cam and the bearing are sequentially sleeved on the working end of the first rotary motor, the rotary motor can drive the cam and the bearing to rotate, and drive the movable plate to slide along the length direction of the movable plate, so that the limiting openings on the fixed plate correspond to the through holes, or the limiting openings correspond to the locking holes.

[0012] Preferably, the crystal supply device comprises a lifting assembly, a rotating assembly and a pin assembly; the lifting assembly comprises a pushing and lifting unit and a lifting unit, the pushing and lifting unit is mounted on the lifting unit, and the lifting unit can drive the pushing and lifting unit to move along the z-axis direction; the rotating assembly comprises an induction unit and a rotating disc unit, the induction unit is arranged in correspondence with the lifting unit in the z-axis direction, the rotating disc unit comprises an induction piece, a rotating disc, a horizontal movement module and a second rotary motor which are sequentially mounted in the z-axis direction, a plurality of induction positions are arranged on the rotating disc in the circumferential direction, the induction piece is arranged in one-to-one correspondence with the induction positions, the second rotary motor can drive the rotating disc to rotate, and the horizontal movement module can drive the rotating disc to fine adjust in the x-axis and / or y-axis direction; the pin assembly is detachably arranged in the induction position, along with the movement of the pushing and lifting unit in the z-axis direction, the pushing and lifting unit can be connected with one of the pin assemblies, and the pin assembly is taken out from the induction position, and the pin assembly is used for lifting the chip.

[0013] Preferably, the head binding driving device comprises a y-axis moving module, an x-axis moving module and a z-axis moving module which are sequentially installed, the y-axis moving module drives the x-axis moving module and the z-axis moving module to move along the y-axis, and the x-axis moving module drives the z-axis moving module to move along the x-axis; the x-axis moving module comprises left and right x-axis transmission assemblies which are adjacently arranged, the left x-axis transmission assembly comprises a left x-axis transmission seat, a left x-axis guide rail and a left x-axis transmission block, the left x-axis guide rail is installed on the left x-axis transmission seat along the x-axis direction, and the left x-axis transmission block is slidably arranged on the left x-axis guide rail; the right x-axis transmission assembly comprises a right x-axis transmission seat, a right x-axis guide rail and a right x-axis transmission block, the right x-axis guide rail is installed on the right x-axis transmission seat along the x-axis direction, and the right x-axis transmission block is slidably arranged on the right x-axis guide rail; the left x-axis transmission seat and the right x-axis transmission seat are staggered at one end adjacent to each other and at least partially overlap in the z-axis direction, and the left x-axis transmission seat and the right x-axis transmission seat can slide relative to each other in the y-axis direction; the left x-axis guide rail and the right x-axis guide rail are staggered at one end adjacent to each other and at least partially overlap in the z-axis direction.

[0014] Preferably, the x-axis moving module further comprises an x-axis driving assembly which is spaced apart from and parallel to the left and right x-axis transmission assemblies; the x-axis driving assembly comprises an x-axis motor and a motor base, the x-axis motor is arranged on the motor base, and the motor base is connected with the y-axis moving module; the x-axis motor comprises an x-axis stator, a left x-axis mover and a right x-axis mover, the transmission ends of the left and right x-axis movers are connected with the x-axis stator, and the working ends of the left and right x-axis movers are connected with the z-axis moving module.

[0015] Compared with the prior art, the paste module and the die bonding equipment provided by the application have the following advantages: 1. The embodiment of the present application provides a mounting module for picking up chips and mounting them to a substrate, a left binding head mechanism and a right binding head mechanism are connected with a binding head driving device, the binding head driving device can drive the left binding head mechanism and the right binding head mechanism to move in the x-axis direction respectively, the vacuum suction nozzle on the right binding head mechanism can pick up the chips from the wafer supply device and place them on the transfer table, and the vacuum suction nozzle on the left binding head mechanism can pick up the chips stored on the transfer table and mount them to the substrate; the first damping mechanism is movably installed on the first fixed block, and the left binding head mechanism is movably installed on the binding head driving device, so that the first damping mechanism and the left binding head mechanism can move towards or away from each other, which can ensure that the center of gravity of the left binding head mechanism does not deviate during movement, thereby offsetting the vibration generated by the left binding head mechanism during frequent acceleration or deceleration movement, and improving the movement stability and precision of the material picking and mounting assembly; the second damping mechanism is movably installed on the second fixed block, and the right binding head mechanism is movably installed on the binding head driving device, so that the second damping mechanism and the right binding head mechanism can move towards or away from each other, which can ensure that the center of gravity of the right binding head mechanism does not deviate during movement, thereby offsetting the vibration generated by the right binding head mechanism during frequent acceleration or deceleration movement, and further improving the movement stability and precision of the material picking and mounting assembly.

[0016] Understandably, the first damping mechanism cooperates with the left binding head mechanism to realize the movement towards or away from each other when the left binding head mechanism moves in the x direction, and the second damping mechanism cooperates with the right binding head mechanism to realize the movement towards or away from each other when the right binding head mechanism moves in the x direction, effectively offsetting the vibration generated by the left binding head mechanism and the right binding head mechanism during movement, greatly reducing the influence of vibration on the picking and mounting angle of the chip, and thereby improving the mounting precision; the first damping mechanism, the left binding head mechanism, the right binding head mechanism and the second damping mechanism are arranged in sequence in the x-axis direction, and the first damping mechanism and the second damping mechanism provide damping action for the left binding head mechanism and the right binding head mechanism respectively, which can avoid mutual interference of the left binding head mechanism and the right binding head mechanism during movement, and improve the work efficiency of the picking and mounting process.

[0017] 2. In the mounting module provided by the embodiment of the present application, the first fixed block, the binding head driving device and the second fixed block are arranged in sequence along the length direction and are collinear, which can avoid movement direction deviation and reduce redundant movement stroke, and improve the work efficiency of the mounting module; the first damping mechanism and the first sliding rail are connected in sliding mode, and the left binding head mechanism and the left x-axis guide rail are connected in sliding mode, which can provide stable linear motion guide for the first damping mechanism and the left binding head mechanism; the second damping mechanism and the second sliding rail are connected in sliding mode, and the right binding head mechanism and the right x-axis guide rail are connected in sliding mode, which can provide stable linear motion guide for the second damping mechanism and the right binding head mechanism; through this design, the lateral deviation during movement is effectively reduced, and the mounting precision and stability are improved.

[0018] It should be noted that the connection mode of the sliding rail or the guide rail of the embodiment of the present application can also reduce the frictional resistance during movement, so that the response of the first damping mechanism, the left binding head mechanism, the right binding head mechanism and the second damping mechanism is more rapid, and the response of the first damping mechanism compared with the left binding head mechanism and the response of the second damping mechanism compared with the right binding head mechanism is more rapid, so that the movement can be adapted to the mounting rhythm faster, the movement smoothness is significantly improved, and gapless, high acceleration and low vibration smooth movement is realized.

[0019] 3, The embodiment of the present application also provides a die bonding equipment, the die bonding equipment comprises the mounting module, that is, has the same beneficial effects as the mounting module, the mounting module has the advantages of damping stability, movement precision and the like, can ensure the precision of chip picking and mounting, and improve the die bonding reliability; the control module is signal connected with the track device, the dispensing device, the die supply device and the mounting module, and the track device, the dispensing device, the die supply device and the mounting module are coordinated by the control module, so that the automatic assembly line of the coordinated linkage of each device or module can be realized, manual intervention is greatly reduced, the die bonding process is ensured to be connected in an orderly manner, and the production continuity and efficiency are significantly improved; the track device is perpendicular to the mounting module, the dispensing device is arranged on one side of the track device, the die supply device and the nozzle replacement device are arranged on the opposite side of the track device, and the nozzle replacement device is located between the track device and the die supply device, so that the overall space layout of the die bonding equipment can be optimized, the working paths of each device or module are reasonable, the process connection distance is shortened, and the die bonding efficiency is improved; in addition, the left binding head mechanism and the right binding head mechanism on the mounting module can quickly complete nozzle replacement during material picking and mounting, the continuity of the die bonding process is ensured, and the overall operation efficiency of the die bonding equipment is further improved.

[0020] 4, In the die bonding equipment provided by the embodiment of the present application, the feeding device and the discharging device are arranged at opposite ends of the bearing table, and the control module is signal connected with the feeding device and the discharging device, so that the automatic feeding and discharging connection of the die bonding process can be realized, manual intervention can be reduced, and the production continuity and efficiency are further improved; the track device comprises a dispensing track and a mounting track, the dispensing track and the dispensing device are correspondingly arranged in the x-axis direction to realize the dispensing process, and the mounting track is located between the dispensing track and the mounting module in the y-axis direction to immediately perform the chip mounting process after the dispensing process is completed; the dispensing track, the mounting track and the mounting module are sequentially arranged in the y-axis direction, so that the substrate can flow along a straight line, the substrate does not need to be rotated or clamped twice, and the overall mounting efficiency is improved.

[0021] It can be understood that the mounting track, the nozzle replacement device and the wafer supply device are arranged in sequence in the x-axis direction, the binding head driving device of the mounting module can drive the left binding head mechanism and the right binding head mechanism to move in the x-axis direction, the right binding head mechanism can take out the chip from the wafer supply device, the left binding head mechanism can mount the chip on the substrate of the mounting track, the vacuum nozzles on the left binding head mechanism and the right binding head mechanism can be replaced through the nozzle replacement device, through the design, the movement path of the mounting module in the material taking, mounting and nozzle replacing can be shortened, the chip transfer path is shortened, and the mounting waiting time is reduced; the discharge end of the feeding device is connected with the feeding end of the dispensing track, the discharge end of the dispensing track is connected with the feeding end of the mounting track, and the discharge end of the mounting track is connected with the feeding end of the discharging device, that is, the feeding device, the dispensing track, the mounting track and the discharging device are connected in sequence through the discharge end and the feeding end to form a continuous substrate transmission process, the positioning deviation and time loss of the substrate in the transfer process are reduced, and the efficiency of the die bonding equipment is further improved.

[0022] 5、The die bonding equipment provided by the embodiment of the present application, the fixed seat can be used to carry the first fixed block, the binding head driving device and the second fixed block, the first fixed block, the binding head driving device and the second fixed block are arranged in sequence along the x-axis direction, the structural stability of the core components of the mounting module can be maintained, and the gravity centers of the first damping mechanism movably installed on the first fixed block, the left binding head mechanism and the right binding head mechanism movably installed on the binding head driving device, and the second damping mechanism movably installed on the second fixed block do not deviate during movement; the bottom of the fixed seat is provided with a flow channel, the flow channel is arranged through the y-axis, part of the track can be embedded in the flow channel, the space below the fixed seat is fully utilized, the overall space layout of the die bonding equipment is optimized, and the compact connection between the discharge end of the mounting track and the feeding end of the discharging device is realized; further, the flow channel can realize the communication between the mounting track and the discharging device, avoid the movement interference between the mounting track and the fixed seat and the components of the mounting module above the fixed seat, ensure the smoothness of the substrate flow between the mounting track and the discharging device, and reduce the transportation obstruction of the substrate on the mounting track.

[0023] 6、The die bonding equipment provided by the embodiment of the present application, the side surface of the first base is provided with an x-axis driving member, and the bottom of the first base is provided with a y-axis driving member, the layout makes the dispensing device compact and reasonable, fully utilizes the installation space, can realize independent driving in the x-axis and y-axis directions at the same time, improves the movement flexibility and dispensing precision of the dispensing assembly, the x-axis driving member and the y-axis driving member cooperate with each other to drive the dispensing assembly to realize multidimensional movement and accurately adapt to the dispensing requirements of different positions on the substrate.

[0024] It should be noted that the dispensing assembly includes a second base, a visual detector and a dispensing head, the visual detector and the dispensing head are arranged on the second base, the second base is movably mounted on the side of the first base away from the y-axis driving member, and the visual detector and the dispensing head can be moved relative to the first base in the z-axis direction, so that movement interference between the dispensing assembly and the y-axis driving member is avoided, and smooth and stable operation of each component on the dispensing device is ensured; the visual detector is signal-connected with the dispensing head, the position information of dispensing can be obtained in real time through the visual detector, and timely feedback is given to the dispensing head, so that accurate positioning of the dispensing position is realized, and the dispensing precision is further improved.

[0025] 7、The activity plate and the fixed plate are connected in the solid crystal device provided by the embodiment of the present application, and the driving design of the rotating assembly is matched, the limiting opening on the fixed plate and the through hole or locking hole on the suction nozzle mounting position are quickly switched and corresponded, the unlocking and locking of the vacuum suction nozzle are efficiently completed, and the replacement efficiency of the vacuum suction nozzle is improved; the suction nozzle mounting position includes a plurality of through holes and locking holes, each through hole is in communication with each locking hole, and the diameter of the through hole is greater than the diameter of the locking hole, the through hole facilitates the quick placement of the vacuum suction nozzle into the suction nozzle mounting position, the locking hole can reliably fix the vacuum suction nozzle, and the convenience of taking and placing the vacuum suction nozzle and the connection stability of locking the vacuum suction nozzle in the locking hole are ensured.

[0026] Understandably, the rotating assembly drives the cam and the bearing to rotate through the first rotary motor, the bearing and the cam are connected with the activity plate, and the cam and the bearing are sequentially sleeved on the working end of the first rotary motor, so that the activity plate can be driven to slide along the length direction of the activity plate when the first rotary motor works, the transmission structure is simple and the movement is smooth and stable, and the working efficiency of the solid crystal device is improved; the driving mode of the rotary motor adopted in the embodiment of the present application can accurately control the sliding stroke of the activity plate, ensure that the limiting opening in the unlocking state and the through hole or the limiting opening in the locking state and the locking hole are accurately aligned, improve the positioning accuracy and efficiency of replacing the vacuum suction nozzle, and be compatible with replacing different types of suction nozzles in different scenes.

[0027] 8、The semiconductor chip is packaged in the solid crystal device provided by the embodiment of the present application, the chip needs to be lifted from below the blue film by the ejector pin and peeled off, so as to pick up and mount the chip, a plurality of ejector pins are needed when a plurality of chips are mounted on a single substrate, the crystal supply device capable of automatically replacing the ejector pin is arranged, the downtime of other devices or modules in the solid crystal device can be reduced, and the production efficiency is greatly improved; the lifting assembly includes a lifting unit and a push-eject unit mounted on the lifting unit, the lifting unit drives the push-eject unit to move along the z-axis direction, the cooperation stroke of the push-eject unit and the ejector pin assembly can be accurately controlled, the ejector pin assembly stably lifts the chip, and the process of picking up the chip and subsequent mounting is not affected.

[0028] Understandably, the rotating assembly includes an induction unit and a turntable unit, the induction unit is arranged corresponding to the lifting unit in the z-axis direction, through this design, when the turntable unit moves a certain pin assembly to the directly above the lifting unit, the induction unit can issue a work signal to the lifting unit, and timely provide response; the turntable unit includes an induction piece, a turntable, a horizontal moving module and a second rotating motor installed in the z-axis direction in turn, the rotation of the turntable can be driven by the second rotating motor, a plurality of induction positions are arranged on the turntable in the circumferential direction, the induction piece is arranged corresponding to the induction position, each induction piece can be used to sense whether there is a pin assembly on the corresponding induction position of the turntable, the horizontal moving module drives the turntable to fine tune in the x-axis and / or y-axis direction, by adjusting the position of the turntable, the driving end of the lifting unit and the pin assembly directly above it are concentric; the pin assembly can adsorb the blue film on the crystal supply device, and lift the chip on the crystal supply device along the z-axis direction, realize the separation of the blue film and the chip, the pin assembly is detachably arranged on the induction position of the turntable, it is convenient to replace the matched pin assembly according to different specifications of the chip, improve the compatibility of the crystal supply device applicable to various mounting application scenarios, at the same time, it is also convenient to maintain and replace the pin assembly, ensure the continuous and stable operation of the die bonding equipment.

[0029] 9、In the die bonding equipment provided by the embodiment of the present application, the head driving device comprises a y-axis moving module, an x-axis moving module and a z-axis moving module installed in turn, the y-axis moving module can drive the x-axis moving module and the z-axis moving module to move along the y-axis, and the x-axis moving module can drive the z-axis moving module to move along the x-axis, wherein the x-axis moving module comprises a left x-axis transmission assembly and a right x-axis transmission assembly, the left x-axis transmission assembly and the right x-axis transmission assembly arranged adjacently can realize the independent of the chip taking process and the mounting process; a left x-axis guide rail is installed along the x-axis direction on a left x-axis transmission seat, a left x-axis transmission block is slidably arranged on the left x-axis guide rail, a right x-axis guide rail is installed along the x-axis direction on a right x-axis transmission seat, and a right x-axis transmission block is slidably arranged on the right x-axis guide rail, and the ends of the left x-axis guide rail and the right x-axis guide rail adjacent to each other are staggered, which can avoid the mutual influence of the chip taking process and the mounting process, and ensure the transmission stability and precision; the ends of the left x-axis transmission seat and the right x-axis transmission seat adjacent to each other are staggered, and the left x-axis transmission seat and the right x-axis transmission seat can slide relative to each other in the y-axis direction, which improves the movement flexibility of the head driving device in the x-y plane and expands the coverage range of the chip taking and mounting of the head driving device; at least part of the ends of the left x-axis transmission seat and the right x-axis transmission seat adjacent to each other and the ends of the left x-axis guide rail and the right x-axis guide rail adjacent to each other exist in the z-axis direction, which can effectively reduce the overall space occupied by the head driving device in the x-axis direction on the premise of ensuring the x-axis transmission stroke, realize the compact design of the structure and the miniaturization design of the device.

[0030] 10、The solid crystal equipment provided by the embodiment of the application, the x-axis drive assembly and the left x-axis transmission assembly are spaced apart and arranged in parallel, so that interference between the x-axis drive assembly and the left x-axis transmission assembly can be avoided, the x-axis drive assembly and the right x-axis transmission assembly are spaced apart and arranged in parallel, so that interference between the x-axis drive assembly and the right x-axis transmission assembly can be avoided; the x-axis motor drives the z-axis moving module through the working end of the left x-axis mover and the right x-axis mover, improves the transmission stability in the x-axis direction, and further ensures the mounting precision. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0032] Figure 1 is the overall structure diagram of the mounting module of the embodiment of the present application.

[0033] Figure 2 is the overall frame diagram of the solid crystal equipment of the embodiment of the present application.

[0034] Figure 3 is the overall structure explosion diagram of the solid crystal equipment of the embodiment of the present application.

[0035] Figure 4 is the structure diagram of the dispensing device of the solid crystal equipment of the embodiment of the present application.

[0036] Figure 5 is the structure diagram of the nozzle replacement device of the solid crystal equipment of the embodiment of the present application.

[0037] Figure 6 is the structure diagram of the crystal supply device of the solid crystal equipment of the embodiment of the present application.

[0038] Figure 7 is the structure diagram of the rotating assembly of the solid crystal equipment of the embodiment of the present application.

[0039] Figure 8 is the structure diagram of the binding head driving device of the solid crystal equipment of the embodiment of the present application.

[0040] Figure 9 is the structure explosion diagram of the binding head driving device of the solid crystal equipment of the embodiment of the present application.

[0041] Explanation of the drawing mark: 10, solid crystal equipment; 100, bearing table; 200, fixed seat; 300, flow channel; 1, mounting module; 11, material taking and mounting assembly; 111, left binding head mechanism; 112, right binding head mechanism; 12, first damping assembly; 121, first fixed block; 122, first driving member; 123, first damping mechanism; 124, first sliding rail; 13, second damping assembly; 131, second fixed block; 132, second driving member; 133, second damping mechanism; 134, second sliding rail; 2, control module; 3, track device; 31, dispensing track; 32, mounting track; 4, dispensing device; 41, first base; 42, x-axis driving member; 43, y-axis driving member; 44, dispensing assembly; 441, second base; 442, visual detector; 443, dispensing head; 5, crystal supplying device; 51, lifting assembly; 511, push-up unit; 512, lifting unit; 52, rotating assembly; 521, inductive unit; 522, turntable unit; 5221, inductive member; 5222, turntable; 5223, horizontal moving module; 5224, second rotating motor; 53, thimble assembly; 6, suction nozzle replacing device; 61, suction nozzle frame assembly; 611, movable plate; 6111, suction nozzle mounting position; 61111, through hole; 61112, locking hole; 612, fixed plate; 6121, limiting port; 613, support base; 62, rotating assembly; 621, first rotating motor; 622, bearing; 623, cam; 7, feeding device; 8, discharging device; 9, binding head driving device; 91, x-axis moving module; 911, left x-axis transmission assembly; 9111, left x-axis transmission seat; 9112, left x-axis guide rail; 9113, left x-axis transmission block; 912, right x-axis transmission assembly; 9121, right x-axis transmission seat; 9122, right x-axis guide rail; 9123, right x-axis transmission block; 913, x-axis driving assembly; 9131, x-axis motor; 91311, x-axis stator; 91312, left x-axis mover; 91313, right x-axis mover; 9132, motor base; 92, y-axis moving module; 93, z-axis moving module. DETAILED DESCRIPTION

[0042] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present application and should not be used to limit the present application. In the embodiments provided by the present application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that the determination of B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information. It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application. In various embodiments of the present application, it should be understood that the size of the serial number of the above processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. In the flowcharts and block diagrams of the drawings of the present application, the possible implementation architecture, function and operation of the system, method and computer program product according to various embodiments of the present application are illustrated. In this regard, each block in the flowchart or block diagram can represent a module, a program segment or a part of code, which includes one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks can also occur in a different order from that indicated in the drawings. For example, two blocks indicated in succession can actually be executed in parallel, and sometimes they can be executed in reverse order, which is determined based on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0043] Please refer to Figure 1 and Figure 2The embodiment of the present application provides a mounting module 1 for picking up a chip and mounting the chip to a substrate, the mounting module 1 comprises a material taking and mounting assembly 11, a first damping assembly 12 and a second damping assembly 13, the material taking and mounting assembly 11 comprises a left binding head mechanism 111, a right binding head mechanism 112 and a binding head driving device 9, the left binding head mechanism 111 and the right binding head mechanism 112 are connected with the binding head driving device 9, and the binding head driving device 9 can drive the left binding head mechanism 111 and the right binding head mechanism 112 to move in the x-axis direction respectively; the first damping assembly 12 comprises a first fixed block 121, a first driving part 122 arranged on the first fixed block 121 and a first damping mechanism 123 arranged on the first driving part 122, the second damping assembly 13 comprises a second fixed block 131, a second driving part 132 arranged on the second fixed block 131 and a second damping mechanism 133 arranged on the second driving part 132, and the first damping mechanism 123, the left binding head mechanism 111, the right binding head mechanism 112 and the second damping mechanism 133 are sequentially arranged along the x-axis direction; when the binding head driving device 9 drives the left binding head mechanism 111 to move in the x-axis direction, the first damping mechanism 123 moves towards or away from the left binding head mechanism 111 under the drive of the first driving part 122; when the binding head driving device 9 drives the right binding head mechanism 112 to move in the x-axis direction, the second damping mechanism 133 moves towards or away from the right binding head mechanism 112 under the drive of the second driving part 132.

[0044] The mounting module 1 provided by the present application can be used for picking up, transferring and mounting a chip in the automatic mounting process of the semiconductor industry, the left binding head mechanism 111 and the right binding head mechanism 112 are connected with the binding head driving device 9, the left binding head mechanism 111 and the right binding head mechanism 112 of the embodiment of the present application are arranged on the same side of the binding head driving device 9, and the binding head driving device 9 can drive the left binding head mechanism 111 and the right binding head mechanism 112 to move in the x-axis direction respectively; the right binding head mechanism 112 is mainly used for the material taking process, and the vacuum suction nozzle on the right binding head mechanism 112 can take and place the chip from the wafer supply device 5 to the transfer table, the left binding head mechanism 111 is mainly used for the mounting process, and the vacuum suction nozzle on the left binding head mechanism 111 can take down the chip stored on the transfer table and mount the chip to the substrate. The mounting module 1 is applied to occasions with high-precision mounting requirements, and when the chip is picked up and adsorbed, the features that need to be identified can be exposed, and when the chip is mounted, the mounting process of real-time alignment mounting of the upper surface of the chip and the identification point of the mounting position is realized.

[0045] Further, the first damping assembly 12 comprises a first fixed block 121, a first driving member 122 and a first damping mechanism 123, the first damping mechanism 123 is movably mounted on the first fixed block 121, and the left binding head mechanism 111 is movably mounted on the binding head driving device 9, so that the first damping mechanism 123 and the left binding head mechanism 111 can move towards or away from each other, which can ensure that the center of gravity of the left binding head mechanism 111 does not deviate during movement, thereby offsetting the vibration of the left binding head mechanism 111 during frequent acceleration or deceleration movement, and improving the movement stability and precision of the material taking and mounting assembly 11 during the mounting process.

[0046] Similarly, the second damping assembly 13 comprises a second fixed block 131, a second driving member 132 and a second damping mechanism 133, the second damping mechanism 133 is movably mounted on the second fixed block 131, and the right binding head mechanism 112 is movably mounted on the binding head driving device 9, so that the second damping mechanism 133 and the right binding head mechanism 112 can move towards or away from each other, which can ensure that the center of gravity of the right binding head mechanism 112 does not deviate during movement, thereby offsetting the vibration of the right binding head mechanism 112 during frequent acceleration or deceleration movement, and further improving the movement stability and precision of the material taking and mounting assembly 11 during the material taking process.

[0047] It can be understood that the first damping mechanism 123 cooperates with the left binding head mechanism 111 to realize the movement towards or away from each other when the left binding head mechanism 111 moves along the x direction, and the second damping mechanism 133 cooperates with the right binding head mechanism 112 to realize the movement towards or away from each other when the right binding head mechanism 112 moves along the x direction, which effectively offsets the vibration of the left binding head mechanism 111 and the right binding head mechanism 112 during movement, greatly reduces the influence of vibration on the chip picking and mounting angle, and further improves the mounting precision.

[0048] In the embodiment of the application, the first damping mechanism 123 can adjust the weight of itself, and a plurality of weight plates can be stacked on the first fixed block 121 as the first damping mechanism 123, so that the weight of the first damping mechanism 123 matches the weight of the left binding head mechanism 111, and when the left binding head mechanism 111 moves, the first damping mechanism 123 moves in the opposite direction at the same speed and distance as the left binding head mechanism 111; the second damping mechanism 133 can adjust the weight of itself, and a plurality of weight plates can be stacked on the second fixed block 131 as the second damping mechanism 133, so that the weight of the second damping mechanism 133 matches the weight of the right binding head mechanism 112, and when the right binding head mechanism 112 moves, the second damping mechanism 133 moves in the opposite direction at the same speed and distance as the right binding head mechanism 112.

[0049] It should be noted that when picking up, transferring and mounting the chip, the right binding head mechanism 112 moves to the wafer supply device 5 to suck the chip and store it to the transfer table, the left binding head mechanism 111 moves to the transfer table to suck the chip, and then moves the chip to the designated position on the substrate for mounting. In this process, the motion of the left binding head mechanism 111 and the right binding head mechanism 112 has acceleration or deceleration, which causes the overall center of gravity of the pick-and-place assembly 11 to shift and cause slight vibration. The first damping mechanism 123, the left binding head mechanism 111, the right binding head mechanism 112 and the second damping mechanism 133 of the embodiment of the present application are sequentially arranged in the x-axis direction, and the first damping mechanism 123 and the second damping mechanism 133 provide damping action for the left binding head mechanism 111 and the right binding head mechanism 112, respectively, which can avoid the mutual interference of the left binding head mechanism 111 and the right binding head mechanism 112 during movement, and improve the work efficiency of the pick-and-place process and the mounting process.

[0050] In some embodiments, the first fixed block 121, the binding head driving device 9 and the second fixed block 131 are sequentially arranged in line along the length direction, which is compact and regular in layout, can avoid motion direction deviation and reduce redundant motion stroke, and improve the work efficiency of the mounting module 1. In the embodiment of the present application, the first fixed block 121, the binding head driving device 9 and the second fixed block 131 are sequentially and closely spliced.

[0051] Further, please refer to Figure 1 、 Figure 2 and Figure 8 , the first damping assembly 12 further comprises a first sliding rail 124, the first sliding rail 124 is arranged in the x-axis direction of the first fixed block 121, and the first damping mechanism 123 is slidably connected with the first sliding rail 124; the second damping assembly 13 further comprises a second sliding rail 134, the second sliding rail 134 is arranged in the x-axis direction of the second fixed block 131, and the second damping mechanism 133 is slidably connected with the second sliding rail 134; the x-axis direction of the binding head driving device 9 has a left x-axis guide rail 9112 and a right x-axis guide rail 9122 arranged adjacent to each other, the left binding head mechanism 111 is slidably connected with the left x-axis guide rail 9112, and the right binding head mechanism 112 is slidably connected with the right x-axis guide rail 9122.

[0052] The first damping mechanism 123 and the first slide rail 124, the left binding head mechanism 111 and the left x-axis guide rail 9112 are in sliding connection, which can provide stable linear motion guide for the first damping mechanism 123 and the left binding head mechanism 111; the second damping mechanism 133 and the second slide rail 134, the right binding head mechanism 112 and the right x-axis guide rail 9122 are in sliding connection, which can provide stable linear motion guide for the second damping mechanism 133 and the right binding head mechanism 112; through the design, the lateral deviation in the movement process is effectively reduced, and the mounting precision and stability are improved.

[0053] It should be noted that the connection mode of the slide rail or the guide rail in the embodiment of the present application can also reduce the frictional resistance in the movement, so that the response of the first damping mechanism 123, the left binding head mechanism 111, the right binding head mechanism 112 and the second damping mechanism 133 is more rapid, and the response of the first damping mechanism 123 to the movement of the left binding head mechanism 111 and the response of the second damping mechanism 133 to the movement of the right binding head mechanism 112 are more rapid, so that the mounting rhythm can be adapted more quickly, the movement smoothness is significantly improved, and smooth movement with no gap, high acceleration and low vibration is realized.

[0054] In some embodiments, the surface of the first slide rail 124, the second slide rail 134, the left x-axis guide rail 9112 and / or the right x-axis guide rail 9122 is coated with wear-resistant lubricating grease, which can reduce the friction coefficient when sliding, further improve the smoothness of the movement, and prolong the service life of the slide rail and the guide rail. The first slide rail 124 and the second slide rail 134 are high-rigidity slide rails, and the left x-axis guide rail 9112 and the right x-axis guide rail 9122 are high-rigidity guide rails, which improve the overall rigidity and stability of the mounting module 1.

[0055] Please continue to refer to Figure 1 and Figure 2 The embodiment of the present application also provides a die bonding equipment 10, which comprises a bearing table 100, a control module 2, an orbit device 3, a dispensing device 4, a die supply device 5, a suction nozzle replacement device 6 and the above-mentioned mounting module 1, the control module 2 is signal-connected with the orbit device 3, the dispensing device 4, the die supply device 5 and the mounting module 1 respectively; the orbit device 3 is vertically arranged with the mounting module 1, the dispensing device 4 is arranged on one side of the orbit device 3, the die supply device 5 and the suction nozzle replacement device 6 are oppositely arranged on the other side of the orbit device 3, and the suction nozzle replacement device 6 is located between the orbit device 3 and the die supply device 5.

[0056] It should be noted that the die bonding equipment 10 of the embodiment of the present application includes the mounting module 1 described above, has the same beneficial effects as the mounting module 1 described above, and has the advantages of vibration damping stability, precise movement, etc., which can ensure the precision of chip picking and mounting and improve the die bonding reliability.

[0057] In the die bonding equipment 10 provided by the embodiment of the present application, the control module 2 is signal-connected with the track device 3, the dispensing device 4, the die supplying device 5 and the mounting module 1 respectively, and the track device 3, the dispensing device 4, the die supplying device 5 and the mounting module 1 can be coordinated by the control module 2, so as to realize the automatic assembly line of the collaborative linkage of each device or module, greatly reduce the manual intervention, ensure the orderly connection of the die bonding process, and significantly improve the production continuity and efficiency. In some embodiments, the control module 2 can be arranged at any position on the carrying table 100 or at any position outside the carrying table 100, and the process of substrate circulation, substrate dispensing and chip picking and mounting is controlled by the control module 2. In the embodiment of the present application, the control module 2 is arranged on the carrying table 100.

[0058] Specifically, the track device 3 is arranged perpendicular to the mounting module 1, the dispensing device 4 is arranged on one side of the track device 3, the die supplying device 5 and the nozzle replacing device 6 are arranged on the opposite side of the track device 3, and the nozzle replacing device 6 is located between the track device 3 and the die supplying device 5. By this design, the overall space layout of the die bonding equipment 10 can be optimized, the working paths of each device or module can be reasonably arranged, the process connection distance can be shortened, and the die bonding efficiency can be improved. In the embodiment of the present application, the first damping mechanism 123, the left binding head mechanism 111, the right binding head mechanism 112 and the second damping mechanism 133 of the mounting module 1 are arranged in sequence along the x-axis direction, the track device 3 is arranged perpendicular to the left binding head mechanism 111 and located within the movement range of the left binding head mechanism 111, the die supplying device 5 is located within the movement range of the right binding head mechanism 112, the movement ranges of the left binding head mechanism 111 and the right binding head mechanism 112 overlap, and the nozzle replacing device 6 is located within the movement ranges of the left binding head mechanism 111 and the right binding head mechanism 112.

[0059] It can be understood that the nozzle replacing device 6 is located between the track device 3 and the die supplying device 5, which is also convenient for the left binding head mechanism 111 and the right binding head mechanism 112 on the mounting module 1 to quickly complete the nozzle replacement during the picking and mounting process, ensures the continuity of the die bonding process, and further improves the overall operation efficiency of the die bonding equipment 10.

[0060] Please continue to refer to Figure 1 and Figure 2, the fixed crystal equipment 10 further includes a feeding device 7 and a discharging device 8 arranged at opposite ends of the bearing table 100, and the control module 2 is signal connected with the feeding device 7 and the discharging device 8 respectively; the track device 3 includes a dispensing track 31 and a mounting track 32, the dispensing track 31 is arranged in correspondence with the dispensing device 4 in the x-axis direction, the mounting track 32 is located between the dispensing track 31 and the mounting module 1 in the y-axis direction, and the mounting track 32, the suction nozzle replacement device 6 and the crystal supply device 5 are sequentially arranged in the x-axis direction; the discharging end of the feeding device 7 is connected with the feeding end of the dispensing track 31, the discharging end of the dispensing track 31 is connected with the feeding end of the mounting track 32, and the discharging end of the mounting track 32 is connected with the feeding end of the discharging device 8.

[0061] In the fixed crystal equipment 10 provided by the embodiment of the application, the feeding device 7 and the discharging device 8 are arranged at opposite ends of the bearing table 100 respectively, and the control module 2 is signal connected with the feeding device 7 and the discharging device 8 respectively, so that the automatic feeding and discharging connection of the fixed crystal process is realized, manual intervention is reduced, and the production continuity and efficiency are further improved.

[0062] Specifically, the track device 3 includes the dispensing track 31 and the mounting track 32, the dispensing track 31 is arranged in correspondence with the dispensing device 4 in the x-axis direction to realize the dispensing process, the mounting track 32 is located between the dispensing track 31 and the mounting module 1 in the y-axis direction, so that the chip mounting process can be immediately performed after the dispensing process is completed, and the dispensing track 31, the mounting track 32 and the mounting module 1 are sequentially arranged in the y-axis direction, so that the substrate can flow along a straight line, the substrate does not need to be rotated or clamped twice, and the overall mounting efficiency is improved.

[0063] Understandably, the mounting track 32, the suction nozzle replacement device 6 and the crystal supply device 5 are sequentially arranged in the x-axis direction, the head driving device 9 of the mounting module 1 can drive the left head mechanism 111 and the right head mechanism 112 to move in the x-axis direction respectively, the right head mechanism 112 can take the chip from the crystal supply device 5, the left head mechanism 111 can mount the chip on the substrate of the mounting track 32, and the vacuum suction nozzles on the left head mechanism 111 and the right head mechanism 112 can be replaced through the suction nozzle replacement device 6, so that the movement path of the mounting module 1 in the processes of taking, mounting and replacing the suction nozzle can be shortened, the chip transfer path is shortened, and the mounting waiting time is reduced.

[0064] It should be noted that the discharge end of the feeding device 7 is connected with the feeding end of the dispensing track 31, the discharge end of the dispensing track 31 is connected with the feeding end of the mounting track 32, and the discharge end of the mounting track 32 is connected with the feeding end of the discharging device 8, that is, the feeding device 7, the dispensing track 31, the mounting track 32 and the discharging device 8 are connected in sequence through the discharge end and the feeding end to form a continuous substrate transmission process, so as to reduce the positioning deviation and time loss of the substrate in the transfer process and further improve the efficiency of the die bonding equipment 10. In the embodiment of the application, the feeding end of the feeding device 7 and the feeding end of the discharging device 8 are both provided with a pushing assembly. The feeding end of the feeding device 7 is provided with a pushing assembly to push the substrate into the dispensing track 31, and the feeding end of the discharging device 8 is provided with a pushing assembly to send the substrate with mounted chips out for the next process.

[0065] Please refer to Figure 1 and Figure 3 , the die bonding equipment 10 further comprises a fixing seat 200 mounted on the bearing table 100, the first fixing block 121, the binding head driving device 9 and the second fixing block 131 are sequentially arranged along the x-axis direction on the fixing seat 200; the bottom of the fixing seat 200 has a flow-through channel 300 penetrating through the y-axis, and at least part of the mounting track 32 is arranged in the flow-through channel 300, and the discharge end of the mounting track 32 communicates with the feeding end of the discharging device 8 through the flow-through channel 300.

[0066] In the die bonding equipment 10 provided by the embodiment of the application, the fixing seat 200 can be used to bear the first fixing block 121, the binding head driving device 9 and the second fixing block 131, and the first fixing block 121, the binding head driving device 9 and the second fixing block 131 are sequentially arranged along the x-axis direction, so as to keep the structure of the core components of the mounting module 1 stable and ensure that the center of gravity of the first damping mechanism 123 movably mounted on the first fixing block 121, the left binding head mechanism 111 and the right binding head mechanism 112 movably mounted on the binding head driving device 9, and the second damping mechanism 133 movably mounted on the second fixing block 131 does not deviate during movement.

[0067] It can be understood that the bottom of the fixing seat 200 is provided with the flow-through channel 300, the flow-through channel 300 penetrates through the y-axis, so that part of the mounting track 32 is embedded in the flow-through channel 300, the space below the fixing seat 200 is fully utilized, the overall space layout of the die bonding equipment 10 is optimized, and the compact connection between the discharge end of the mounting track 32 and the feeding end of the discharging device 8 is realized. In the embodiment of the application, the fixing seat 200 comprises two mounting blocks at the bottom and a mounting plate at the top, wherein the two mounting blocks are arranged on the bearing table 100, and the mounting plate is arranged above the two mounting blocks, so that the flow-through channel 300 is formed between the two mounting blocks and the mounting plate.

[0068] It should be noted that the flow channel 300 not only realizes the communication between the mounting track 32 and the unloading device 8, but also avoids the movement interference between the mounting track 32 and the fixed seat 200 and each component of the mounting module 1 above the fixed seat 200, ensures the smooth flow of the substrate between the mounting track 32 and the unloading device 8, and reduces the transportation obstruction of the substrate on the mounting track 32.

[0069] Please refer to Figure 2 , Figure 3 and Figure 4 , the dispensing device 4 comprises a first base 41, an x-axis driving member 42, a y-axis driving member 43 and a dispensing assembly 44, the x-axis driving member 42 is arranged on the side surface of the first base 41, and the y-axis driving member 43 is arranged on the bottom of the first base 41; the dispensing assembly 44 comprises a second base 441, a visual detector 442 and a dispensing head 443, the second base 441 is connected to the side of the first base 41 away from the y-axis driving member 43, the visual detector 442 and the dispensing head 443 are arranged on the second base 441, and the visual detector 442 is in signal connection with the dispensing head 443.

[0070] In the die bonding equipment 10 provided by the embodiment of the present application, the side surface of the first base 41 is provided with the x-axis driving member 42, and the bottom of the first base 41 is provided with the y-axis driving member 43, so that the dispensing device 4 has a compact and reasonable structure, the installation space is fully utilized, the independent driving in the x-axis and y-axis directions can be realized at the same time, the movement flexibility and dispensing precision of the dispensing assembly 44 are improved, and the x-axis driving member 42 and the y-axis driving member 43 are matched with each other to drive the dispensing assembly 44 to realize multi-dimensional movement and accurately adapt to the dispensing requirements of different positions on the substrate.

[0071] Understandably, the dispensing assembly 44 comprises the second base 441, the visual detector 442 and the dispensing head 443, the visual detector 442 and the dispensing head 443 are arranged on the second base 441, the second base 441 is movably installed on the side of the first base 41 away from the y-axis driving member 43, can drive the visual detector 442 and the dispensing head 443 to move relative to the first base 41 in the z-axis direction, avoids the movement interference between the dispensing assembly 44 and the y-axis driving member 43, and ensures the smooth and stable operation of each component on the dispensing device 4.

[0072] It should be noted that the visual detector 442 is in signal connection with the dispensing head 443, the position information of dispensing can be acquired in real time through the visual detector 442, and the dispensing head 443 is fed back in time to realize accurate positioning of the dispensing position, and the dispensing precision is further improved. The glue process flow of the embodiment of the application is as follows: after the substrate is transported to the dispensing track 31, the first base 41 is moved in the x-axis and / or y-axis direction until the visual detector 442 corresponds to the substrate, the position of the position to be dispensed on the substrate is recognized by the visual detector 442, and then the second base 441 is controlled to move the dispensing head 443 in the z-axis direction, so that the dispensing head 443 dispenses or draws glue on the position.

[0073] Please refer to Figure 1 、 Figure 3 and Figure 5 , the nozzle changing device 6 includes a nozzle rack assembly 61 and a rotating assembly 62, the nozzle rack assembly 61 includes a movable plate 611, a fixed plate 612 and a support base 613 arranged in sequence, the movable plate 611 is in sliding connection with the fixed plate 612, and the support base 613 is arranged on the bearing table 100; A plurality of limiting openings 6121 are arranged in the length direction of the fixed plate 612, a plurality of nozzle mounting positions 6111 corresponding to the limiting openings 6121 are arranged in the length direction of the movable plate 611, each nozzle mounting position 6111 is in communication with a corresponding limiting opening 6121, the nozzle mounting position 6111 includes a plurality of through holes 61111 and locking holes 61112, each through hole 61111 is in communication with each locking hole 61112, and the aperture of the through hole 61111 is larger than the aperture of the locking hole 61112; the rotating assembly 62 includes a first rotating motor 621, a bearing 622 connected with the movable plate 611 and a cam 623, the cam 623 and the bearing 622 are sequentially sleeved on the working end of the first rotating motor 621, the rotating motor can drive the cam 623 and the bearing 622 to rotate, and drive the movable plate 611 to slide along the length direction, so that the limiting openings 6121 on the fixed plate 612 correspond to the through holes 61111 or the locking holes 61112 on the nozzle mounting position 6111.

[0074] In the die bonding equipment 10 provided by the embodiment of the application, the movable plate 611 is in sliding connection with the fixed plate 612, and the driving design of the rotating assembly 62 is matched, so that the limiting openings 6121 on the fixed plate 612 and the through holes 61111 or the locking holes 61112 on the nozzle mounting position 6111 are quickly switched and corresponded, the unlocking and locking of the vacuum nozzle are efficiently completed, and the replacement efficiency of the vacuum nozzle is improved.

[0075] It should be noted that each through hole 61111 on the suction nozzle mounting position 6111 is in communication with the locking hole 61112, and the hole diameter of the through hole 61111 is larger than that of the locking hole 61112. The through hole 61111 facilitates the quick placement of the vacuum suction nozzle into the suction nozzle mounting position 6111, and the locking hole 61112 can realize reliable fixation of the vacuum suction nozzle, ensuring the convenience of taking and placing the vacuum suction nozzle and the connection stability of locking the vacuum suction nozzle in the locking hole 61112.

[0076] It can be understood that the rotating assembly 62 drives the cam 623 and the bearing 622 to rotate through the first rotating motor 621. The bearing 622 and the cam 623 are connected with the movable plate 611, and the cam 623 and the bearing 622 are sequentially sleeved on the working end of the first rotating motor 621, so that the movable plate 611 can be driven to slide along its length direction when the first rotating motor 621 works, the transmission structure is simple and the movement is smooth and stable, and the working efficiency of the die bonding equipment 10 is improved. Specifically, the first rotating motor 621 of the embodiment of the present application drives the cam 623 and the bearing 622 to rotate when working. The outer peripheral surface of the cam 623 is connected with the inner side wall of the movable plate 611. Since the movable plate 611 is slidably connected with the fixed plate 612, the cam 623 drives the movable plate 611 to move synchronously when rotating, and converts the rotation into linear motion through the rotation principle. The top end surface of the bearing 622 is connected with the inner top wall of the movable plate 611, and the bottom end surface is connected with the cam 623, which can ensure that the rotation of the cam 623 does not deviate, reduces the friction between the cam 623 and the movable plate 611, and prolongs the service life.

[0077] Taking the left binding head mechanism 111 as an example, the vacuum suction nozzle dismounting process of the embodiment of the application is as follows: when the left binding head mechanism 111 moves to a position directly above a through hole 61111, the binding head driving device 9 drives the left binding head mechanism 111 to descend, and the vacuum suction nozzle provided on the left binding head mechanism 111 is placed into the through hole 61111; the working end of the first rotary motor 621 drives the movable plate 611 to slide along the length direction thereof, and the locking hole 61112 communicated with the through hole 61111 is moved to correspond to the vacuum suction nozzle, so that the vacuum suction nozzle is locked; at this time, the binding head driving device 9 drives the left binding head mechanism 111 to ascend. Taking the left binding head mechanism 111 as an example, the vacuum suction nozzle mounting process of the embodiment of the application is as follows: the left binding head mechanism 111 moves to a position directly above a locking hole 61112, and the locking hole 61112 has a vacuum suction nozzle thereon; the binding head driving device 9 drives the left binding head mechanism 111 to descend until the vacuum suction nozzle is adsorbed; the working end of the first rotary motor 621 drives the movable plate 611 to slide, and the through hole 61111 communicated with the locking hole 61112 is moved to correspond to the vacuum suction nozzle, so that the vacuum suction nozzle is unlocked; at this time, the binding head driving device 9 drives the left binding head mechanism 111 to ascend. After the left binding head mechanism 111 moves to a position directly above the locking hole 61112 or the through hole 61111 and the alignment between the left binding head mechanism 111 and the movable plate 611 is completed, the left binding head mechanism 111 only needs to be driven by the binding head driving device 9 to ascend or descend in the process of mounting or dismounting the vacuum suction nozzle.

[0078] The driving mode of the rotary motor adopted in the embodiment of the application can accurately control the sliding stroke of the movable plate 611, so as to ensure that the limiting opening 6121 in the unlocked state and the through hole 61111, or the limiting opening 6121 in the locked state and the locking hole 61112 are accurately aligned, and the positioning accuracy and efficiency of the vacuum suction nozzle replacement are improved, and different types of suction nozzles can be replaced in different scenarios.

[0079] Please refer to Figure 3 , Figure 6 and Figure 7The supply crystal device 5 comprises a lifting assembly 51, a rotating assembly 52 and a pin assembly 53; the lifting assembly 51 comprises a pushing pin unit 511 and a lifting unit 512, the pushing pin unit 511 is installed on the lifting unit 512, and the lifting unit 512 can drive the pushing pin unit 511 to move along the z-axis direction; the rotating assembly 52 comprises an induction unit 521 and a rotating disc unit 522, the induction unit 521 is arranged in correspondence with the lifting unit 512 along the z-axis direction, the rotating disc unit 522 comprises an induction piece 5221, a rotating disc 5222, a horizontal moving module 5223 and a second rotating motor 5224 which are sequentially installed along the z-axis direction, a plurality of induction positions are arranged on the rotating disc 5222 along the circumferential direction, the induction piece 5221 is arranged in one-to-one correspondence with the induction positions, the second rotating motor 5224 can drive the rotating disc 5222 to rotate, and the horizontal moving module 5223 can fine-tune the rotating disc 5222 along the x-axis and / or y-axis direction; the pin assembly 53 is detachably arranged in the induction position, with the pushing pin unit 511 moving along the z-axis direction, the pushing pin unit 511 can be connected with one of the pin assemblies 53 and take out the pin assembly 53 from the induction position, and the pin assembly 53 is used for lifting the chip.

[0080] In the supply crystal device 10 provided by the embodiment of the present application, when the semiconductor chip is packaged, the chip needs to be lifted from below the blue film by the pin and peeled off, so as to be picked up and mounted, and when a plurality of chips are mounted on a single substrate, a plurality of pins are needed, and by arranging the supply crystal device 5 capable of automatically replacing the pin, the downtime of other devices or modules in the supply crystal device 10 can be reduced, and the production efficiency can be greatly improved.

[0081] It can be understood that the lifting assembly 51 comprises the lifting unit 512 and the pushing pin unit 511 installed on the lifting unit 512, the lifting unit 512 drives the pushing pin unit 511 to move along the z-axis direction, the cooperation stroke of the pushing pin unit 511 and the pin assembly 53 can be accurately controlled, the pin assembly 53 can stably lift the chip, and the process of picking up the chip and subsequent mounting can be avoided.

[0082] Further, the rotating assembly 52 comprises an induction unit 521 and a rotating disc unit 522, the induction unit 521 is arranged in correspondence with the lifting unit 512 in the z-axis direction, through this design, when the rotating disc unit 522 moves a certain pin assembly 53 to the directly above of the lifting unit 512, the induction unit 521 can send a working signal to the lifting unit 512, and provide timely response; the rotating disc unit 522 comprises an induction piece 5221, a rotating disc 5222, a horizontal moving module 5223 and a second rotating motor 5224 which are sequentially installed in the z-axis direction, the rotation of the rotating disc 5222 can be driven by the second rotating motor 5224, the rotating disc 5222 is provided with a plurality of induction positions in the circumferential direction, the induction piece 5221 is arranged in correspondence with the induction positions, each induction piece 5221 can be used to sense whether there is a pin assembly 53 in the corresponding induction position of the rotating disc 5222, the horizontal moving module 5223 drives the rotating disc 5222 to fine tune in the x-axis and / or y-axis direction, through adjusting the position of the rotating disc 5222, the driving end of the lifting unit 512 is concentric with the pin assembly 53 directly above.

[0083] It should be noted that the pin assembly 53 can adsorb the blue film on the wafer supply device 5, and lift the chip on the wafer supply device 5 along the z-axis direction, so as to realize the separation of the blue film and the chip, the pin assembly 53 is detachably arranged on the induction position of the rotating disc 5222, so as to facilitate the replacement of the pin assembly 53 matched with different specifications of chips, improve the compatibility of the wafer supply device 5 applicable to various mounting application scenarios, and also facilitate the maintenance and replacement of the pin assembly 53, and ensure the continuous and stable operation of the die bonding equipment 10. In the embodiment of the application, the top end of the pin assembly 53 has a rubber layer or an elastic buffer structure, so as to avoid damage to the chip due to stress concentration.

[0084] In some embodiments, the blue film chip on the wafer supply device 5 can be automatically replaced, compatible with 8-inch blue film, 6-inch blue film and waffle box, realize rapid model change, and adapt to the production demand of multiple varieties and small batch.

[0085] Please refer to Figure 8 and Figure 9The head binding driving device 9 comprises a y-axis moving module 92, an x-axis moving module 91 and a z-axis moving module 93 which are sequentially installed, the y-axis moving module 92 drives the x-axis moving module 91 and the z-axis moving module 93 to move along the y-axis, the x-axis moving module 91 drives the z-axis moving module 93 to move along the x-axis; the x-axis moving module 91 comprises a left x-axis transmission assembly 911 and a right x-axis transmission assembly 912 which are adjacently arranged, the left x-axis transmission assembly 911 comprises a left x-axis transmission seat 9111, a left x-axis guide rail 9112 and a left x-axis transmission block 9113, the left x-axis guide rail 9112 is installed on the left x-axis transmission seat 9111 along the x-axis direction, and the left x-axis transmission block 9113 is slidably arranged on the left x-axis guide rail 9112; the right x-axis transmission assembly 912 comprises a right x-axis transmission seat 9121, a right x-axis guide rail 9122 and a right x-axis transmission block 9123, the right x-axis guide rail 9122 is installed on the right x-axis transmission seat 9121 along the x-axis direction, and the right x-axis transmission block 9123 is slidably arranged on the right x-axis guide rail 9122; the left x-axis transmission seat 9111 and the right x-axis transmission seat 9121 are staggered at one end adjacent to each other and at least partially overlap in the z-axis direction, and the left x-axis transmission seat 9111 and the right x-axis transmission seat 9121 can slide relative to each other in the y-axis direction; the left x-axis guide rail 9112 and the right x-axis guide rail 9122 are staggered at one end adjacent to each other and at least partially overlap in the z-axis direction.

[0086] Specifically, the y-axis moving module 92, the x-axis moving module 91 and the z-axis moving module 93, the y-axis moving module 92 as a supporting base of the head binding driving device 9 can drive the x-axis moving module 91 and the z-axis moving module 93 as a whole to move along the y-axis, the x-axis moving module 91 is installed above the y-axis moving module 92 and can drive the z-axis moving module 93 to move along the x-axis, the z-axis moving module 93 is installed at the side of the x-axis moving module 91 and can respectively drive the left head binding mechanism 111 and the right head binding mechanism 112 to independently move along the z-axis, the working end of the left head binding mechanism 111 and the right head binding mechanism 112 has the same specification and replaceable vacuum nozzles for adsorbing different types of chips, and the vacuum nozzles are responsible for picking up, adsorbing and mounting the chips.

[0087] It can be understood that the left x-axis transmission assembly 911 and the right x-axis transmission assembly 912 are adjacently arranged, which can realize the independent chip picking process and mounting process; the left x-axis transmission assembly 911 comprises the left x-axis transmission seat 9111, the left x-axis guide rail 9112 and the left x-axis transmission block 9113 which are sequentially connected, the left x-axis guide rail 9112 is installed on the left x-axis transmission seat 9111 along the x-axis direction, and the left x-axis transmission block 9113 is slidably arranged on the left x-axis guide rail 9112, the left x-axis guide rail 9112 is installed on the side of the left x-axis transmission seat 9111, and the left x-axis transmission block 9113 slides on the left x-axis guide rail 9112 to drive the z-axis moving module 93 to move along the x-axis.

[0088] Similarly, the right x-axis transmission assembly 912 comprises a right x-axis transmission seat 9121, a right x-axis guide rail 9122 and a right x-axis transmission block 9123 connected in sequence, the right x-axis guide rail 9122 is installed on the right x-axis transmission seat 9121 along the x-axis direction, the right x-axis transmission block 9123 is slidably arranged on the right x-axis guide rail 9122, the right x-axis guide rail 9122 is installed on the side of the right x-axis transmission seat 9121, and the right x-axis transmission block 9123 slides on the right x-axis guide rail 9122 to drive the z-axis movement module 93 to move along the x-axis. The left x-axis guide rail 9112 and the right x-axis guide rail 9122 are staggered at one end adjacent to each other, that is, the sliding of the left x-axis transmission block 9113 and the right x-axis transmission block 9123 is independent of each other, so that the process of taking the chip and the process of mounting the chip do not affect each other, the precision of the taking and mounting process is improved, and the transmission stability of the left x-axis transmission assembly 911 and the right x-axis transmission assembly 912 driving the double binding head is ensured, meeting the high-precision requirement of chip mounting. In the embodiment of the application, the left x-axis guide rail 9112 and the right x-axis guide rail 9122 are arranged on the same side of the left x-axis transmission seat 9111 and the right x-axis transmission seat 9121, and are parallel to each other.

[0089] It should be noted that the left x-axis transmission seat 9111 and the right x-axis transmission seat 9121 are staggered at one end adjacent to each other, and the left x-axis transmission seat 9111 and the right x-axis transmission seat 9121 can slide relative to each other in the y-axis direction. Through this design, the movement flexibility of the binding head driving device 9 in the x-y plane can be improved, and the coverage range of the binding head driving device 9 driving the left binding head mechanism 111 and the right binding head mechanism 112 to take and mount the chip can be expanded. The left x-axis transmission seat 9111 and the right x-axis transmission seat 9121 are staggered at one end adjacent to each other, and the left x-axis guide rail 9112 and the right x-axis guide rail 9122 are staggered at one end adjacent to each other in the z-axis direction. At least a part of the left x-axis guide rail 9112 and the right x-axis guide rail 9122 overlap in the z-axis direction, so that the left binding head mechanism 111 and the right binding head mechanism 112 overlap in the x-axis direction. On the premise of ensuring the x-axis transmission stroke, the overall space occupied by the binding head driving device 9 in the x-axis direction can be effectively reduced, and the structure can be compact and small.

[0090] In some embodiments, the number of left x-axis guide rails 9112 is at least two, and the number of right x-axis guide rails 9122 is at least two, to ensure stable operation of the left binding head mechanism 111 and the right binding head mechanism 112. In the embodiment of the application, the number of left x-axis guide rails 9112 is two, and the number of right x-axis guide rails 9122 is two. The left x-axis guide rails 9112 and the right x-axis guide rails 9122 are cross-connected, one right x-axis guide rail 9122 is arranged between the two left x-axis guide rails 9112, and one left x-axis guide rail 9112 is arranged between the two right x-axis guide rails 9122.

[0091] Further, the x-axis moving module 91 further comprises an x-axis driving assembly 913, which is spaced apart from and parallel to the left x-axis transmission assembly 911 and the right x-axis transmission assembly 912; the x-axis driving assembly 913 comprises an x-axis motor 9131 and a motor base 9132, the x-axis motor 9131 is arranged on the motor base 9132, and the motor base 9132 is connected with the y-axis moving module 92; the x-axis motor 9131 comprises an x-axis stator 91311, a left x-axis mover 91312 and a right x-axis mover 91313, the transmission ends of the left x-axis mover 91312 and the right x-axis mover 91313 are connected with the x-axis stator 91311, and the working ends of the left x-axis mover 91312 and the right x-axis mover 91313 are connected with the z-axis moving module 93.

[0092] It should be noted that the x-axis driving assembly 913 can provide driving force for the z-axis moving module 93 to move in the x-axis direction, and the left x-axis transmission assembly 911 and the right x-axis transmission assembly 912 can provide guidance for the z-axis moving module 93 to move in the x-axis direction; the x-axis driving assembly 913 is spaced apart from and parallel to the left x-axis transmission assembly 911, and the x-axis driving assembly 913 is spaced apart from and parallel to the right x-axis transmission assembly 912, so that interference between the x-axis driving assembly 913 and the left x-axis transmission assembly 911 and interference between the x-axis driving assembly 913 and the right x-axis transmission assembly 912 can be avoided.

[0093] It can be understood that the motor base 9132 is used for fixing the x-axis motor 9131, so that resonance of the x-axis motor 9131 during work can be avoided, and the mounting precision can be affected; the x-axis motor 9131 drives the z-axis moving module 93 through the working ends of the left x-axis mover 91312 and the right x-axis mover 91313, so that the transmission stability in the x-axis direction can be improved, and the mounting precision can be further ensured; the x-axis motor 9131 in the embodiment of the application is a carbon fiber linear motor, which has the advantages of light load, high acceleration and high precision.

[0094] The above describes a mounting module and a die bonding device according to the embodiment of the application in detail, and the principles and implementation manners of the application are described by using specific examples in the above description, and the above description of the embodiments is only used to help understand the method of the application and the core idea thereof. Meanwhile, for those skilled in the art, according to the idea of the application, the specific implementation manner and application range can be changed, and the above description of the application should not be understood as a limitation of the application, and any modification, equivalent replacement and improvement within the principles of the application should be included in the protection scope of the application.

Claims

1. A mounting module for picking up chips and mounting them onto a substrate, characterized in that: The device includes a material pick-up and mounting assembly, a first vibration damping assembly, and a second vibration damping assembly. The material pick-up and mounting assembly includes a left binding head mechanism, a right binding head mechanism, and a binding head driving device. The left binding head mechanism and the right binding head mechanism are both connected to the binding head driving device. The binding head driving device can drive the left binding head mechanism and the right binding head mechanism to move in the x-axis direction, respectively. The first vibration damping component includes a first fixed block, a first driving member disposed on the first fixed block, and a first vibration damping mechanism disposed on the first driving member. The second vibration damping component includes a second fixed block, a second driving member disposed on the second fixed block, and a second vibration damping mechanism disposed on the second driving member. The first vibration damping mechanism, the left binding head mechanism, the right binding head mechanism, and the second vibration damping mechanism are arranged sequentially along the x-axis direction. When the head-binding drive device drives the left head-binding mechanism to move in the x-axis direction, the first vibration damping mechanism moves towards or away from the left head-binding mechanism under the drive of the first drive member; when the head-binding drive device drives the right head-binding mechanism to move in the x-axis direction, the second vibration damping mechanism moves towards or away from the right head-binding mechanism under the drive of the second drive member.

2. The mounting module as described in claim 1, characterized in that: The first fixing block, the binding head driving device, and the second fixing block are arranged collinearly along their length direction. The first vibration damping component further includes a first slide rail, which is arranged in the x-axis direction of the first fixed block, and the first vibration damping mechanism is slidably connected to the first slide rail; the second vibration damping component further includes a second slide rail, which is arranged in the x-axis direction of the second fixed block, and the second vibration damping mechanism is slidably connected to the second slide rail; The head-binding drive device has a left x-axis guide rail and a right x-axis guide rail arranged adjacent to each other in the x-axis direction. The left head-binding mechanism is slidably connected to the left x-axis guide rail, and the right head-binding mechanism is slidably connected to the right x-axis guide rail.

3. A die bonding apparatus, characterized in that: The die bonding equipment includes a carrier platform, a control module, and a track device, a dispensing device, a die supply device, a nozzle changing device, and a mounting module according to any one of claims 1-2, all disposed on the carrier platform. The control module is signal connected to the track device, the dispensing device, the die supply device, and the mounting module, respectively. The track device is arranged perpendicularly to the mounting module. The dispensing device is located on one side of the track device. The die supply device and the nozzle replacement device are located opposite each other on the other side of the track device. The nozzle replacement device is located between the track device and the die supply device.

4. The die bonding apparatus as described in claim 3, characterized in that: The die bonding equipment also includes a loading device and a unloading device located at opposite ends of the support platform, and the control module is signal-connected to the loading device and the unloading device respectively; The track device includes a dispensing track and a mounting track. The dispensing track and the dispensing device are arranged correspondingly in the x-axis direction. The mounting track is located between the dispensing track and the mounting module in the y-axis direction. The mounting track, the nozzle changing device and the die supply device are arranged sequentially in the x-axis direction. The discharge end of the feeding device is connected to the inlet end of the dispensing track, the discharge end of the dispensing track is connected to the inlet end of the mounting track, and the discharge end of the mounting track is connected to the inlet end of the unloading device.

5. The die bonding apparatus as described in claim 4, characterized in that: The die bonding equipment also includes a fixed base installed on the support platform, and the first fixing block, the binding head driving device and the second fixing block are sequentially arranged on the fixed base along the x-axis direction; The bottom of the fixed base has a flow channel that runs through the y-axis, and at least part of the mounting track is disposed in the flow channel. The discharge end of the mounting track is connected to the feed end of the feeding device through the flow channel.

6. The die bonding apparatus as described in claim 3, characterized in that: The dispensing device includes a first base, an x-axis drive, a y-axis drive, and a dispensing assembly. The x-axis drive is located on the side of the first base, and the y-axis drive is located at the bottom of the first base. The dispensing assembly includes a second base, a vision detector, and a dispensing head. The second base is connected to the side of the first base away from the y-axis drive component. The vision detector and the dispensing head are disposed on the second base, and the vision detector is signal-connected to the dispensing head.

7. The die bonding apparatus as described in claim 3, characterized in that: The nozzle replacement device includes a nozzle frame assembly and a rotating assembly. The nozzle frame assembly includes a movable plate, a fixed plate, and a support base arranged in sequence. The movable plate and the fixed plate are slidably connected, and the support base is disposed on the support platform. The fixed plate has several limiting holes along its length, and the movable plate has several corresponding suction nozzle mounting positions along its length. Each suction nozzle mounting position is connected to the corresponding limiting hole. Each suction nozzle mounting position includes several through holes and locking holes. Each through hole is connected to each locking hole. The diameter of the through hole is larger than the diameter of the locking hole. The rotating assembly includes a first rotary motor and a bearing and a cam connected to the movable plate. The cam and the bearing are sequentially sleeved on the working end of the first rotary motor. The rotary motor can drive the cam and the bearing to rotate and drive the movable plate to slide along its length direction, so that the limiting port on the fixed plate corresponds to the through hole, or the limiting port corresponds to the locking hole.

8. The die bonding apparatus as described in claim 3, characterized in that: The crystal supply device includes a lifting assembly, a rotating assembly, and a pin assembly; The lifting assembly includes a pushing unit and a lifting unit. The pushing unit is installed on the lifting unit, and the lifting unit can drive the pushing unit to move along the z-axis. The rotating assembly includes a sensing unit and a turntable unit. The sensing unit and the lifting unit are arranged correspondingly in the z-axis direction. The turntable unit includes a sensing element, a turntable, a horizontal movement module, and a second rotary motor installed sequentially in the z-axis direction. The turntable has a plurality of sensing positions along its circumference. The sensing element is arranged one-to-one with the sensing position. The second rotary motor can drive the turntable to rotate. The horizontal movement module can drive the turntable to make fine adjustments in the x-axis and / or y-axis directions. The ejector pin assembly is detachably disposed at the sensing position. As the pusher unit moves along the z-axis, the pusher unit can connect to one of the ejector pin assemblies and remove the ejector pin assembly from the sensing position. The ejector pin assembly is used to lift the chip.

9. The die bonding apparatus as described in claim 3, characterized in that: The head-binding drive device includes a y-axis moving module, an x-axis moving module, and a z-axis moving module installed in sequence. The y-axis moving module drives the x-axis moving module and the z-axis moving module to move along the y-axis, and the x-axis moving module drives the z-axis moving module to move along the x-axis. The x-axis moving module includes a left x-axis transmission assembly and a right x-axis transmission assembly arranged adjacent to each other. The left x-axis transmission assembly includes a left x-axis transmission seat, a left x-axis guide rail, and a left x-axis transmission block. The left x-axis guide rail is mounted on the left x-axis transmission seat along the x-axis direction, and the left x-axis transmission block is slidably disposed on the left x-axis guide rail. The right x-axis transmission assembly includes a right x-axis transmission seat, a right x-axis guide rail, and a right x-axis transmission block. The right x-axis guide rail is mounted on the right x-axis transmission seat along the x-axis direction, and the right x-axis transmission block is slidably disposed on the right x-axis guide rail. The left x-axis drive seat and the right x-axis drive seat are staggered at their adjacent ends and overlap at least partially in the z-axis direction. The left x-axis drive seat and the right x-axis drive seat can slide relative to each other in the y-axis direction. The left x-axis guide rail and the right x-axis guide rail are staggered at their adjacent ends and overlap at least partially in the z-axis direction.

10. The die bonding apparatus as described in claim 9, characterized in that: The x-axis moving module also includes an x-axis driving component, which is spaced apart from and parallel to the left x-axis transmission component and the right x-axis transmission component; The x-axis drive assembly includes an x-axis motor and a motor base. The x-axis motor is mounted on the motor base, and the motor base is connected to the y-axis moving module. The x-axis motor includes an x-axis stator, a left x-axis mover, and a right x-axis mover. The transmission ends of the left x-axis mover and the right x-axis mover are both connected to the x-axis stator, and the working ends of the left x-axis mover and the right x-axis mover are both connected to the z-axis moving module.

Images