Pickling device for parts of semiconductor equipment

Abstract

The invention discloses a pickling device for semiconductor equipment parts, and relates to the technical field of semiconductors. The device comprises a processing chamber and further comprises a first partition plate, the first partition plate is fixed in the processing chamber, and a pickling tank is defined between the first partition plate and the inner wall of the processing chamber and used for pickling the semiconductor equipment; the two guide rail type circulation lines are mounted on the two inner side walls of the treatment chamber correspondingly, and the guide rail type circulation lines are arranged in the pickling tank; and the multiple placement frames are evenly installed at the sliding seats of the guide rail type circulation line, and butt joint holes are formed in the outer surfaces of the placement frames. According to the device, the placement frame is arranged on the guide rail type circulation line in the treatment chamber, the semiconductor equipment parts placed in the placement box are placed in the placement frame, and the placement frame enters the pickling tank under the driving of the guide rail type circulation line, so that the immersion of the semiconductor equipment parts is realized; and the pickling quality of semiconductor equipment parts is ensured.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor-related technology, and in particular relates to an acid washing device for semiconductor equipment components. Background Technology

[0002] Semiconductor equipment components are the foundation and core of semiconductor equipment. Their technological level and supply stability directly determine the performance, quality, and self-controllability of the semiconductor equipment industry chain. They can be divided into six categories according to function: mechanical, electrical, mechatronics, gas / liquid / vacuum systems, instrumentation, and optical.

[0003] In semiconductor manufacturing, metal ions such as sodium, potassium, and calcium may remain on the surface of components. These ions can contaminate the wafer, leading to problems such as instability of MOS transistors and breakdown of the gate oxide layer, which seriously affects the chip yield. In addition, natural oxide layers (such as silicon oxide) or chemical oxides may form on the surface of components. These oxides can interfere with the uniformity and adhesion of subsequent processes (such as photolithography and thin film deposition). Therefore, acid pickling is required during the manufacturing process of semiconductor equipment components.

[0004] A Chinese invention patent with publication number CN116713250A discloses a pickling device for semiconductor equipment components. The device places the semiconductor equipment components inside a telescopic frame and then rinses them in a pickling chamber. However, the applicant believes that in the above device, when rinsing the semiconductor equipment components with pickling solution, the pickling solution stays on the surface of the semiconductor equipment components for a short time, and the contact between the pickling solution and the semiconductor equipment components may be uneven, resulting in uneven pickling of the semiconductor equipment components and affecting the pickling effect. Summary of the Invention

[0005] The purpose of this invention is to provide a pickling device for semiconductor equipment components. By setting the placement frame on a guide rail circulation line, it is convenient to put the carrying case and the internal semiconductor components into the pickling tank for immersion and pickling, thus solving the problem of pickling effect caused by the existing pickling solution rinsing.

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0007] This invention relates to an acid pickling apparatus for semiconductor equipment components, comprising a processing chamber, and further comprising:

[0008] Partition 1 is fixed inside the processing chamber, and the partition 1 and the inner wall of the processing chamber enclose an acid pickling tank for acid pickling semiconductor equipment.

[0009] Two guide rail circulation lines are respectively installed on the two inner side walls of the processing chamber, and the guide rail circulation lines are laid inside the pickling tank.

[0010] A placement frame, several of which are evenly installed on the slide of the guide rail type circulating line, and the outer surface of the placement frame is provided with a docking hole;

[0011] A placement box, placed inside the placement frame, is used to place semiconductor devices;

[0012] A drive assembly includes a mounting base, which is fixedly installed in the processing chamber. A telescopic device is fixedly connected to the mounting base. A support plate is fixedly connected to the telescopic end of the telescopic device. A rotating shaft is rotatably connected to the support plate. A drive device is fixedly connected to the drive device, and the output end of the drive device is connected to the rotating shaft.

[0013] The end of the rotating shaft penetrates the side wall of the pickling tank and is fixedly connected to a docking shaft that mates with the docking hole. The telescopic device pushes the support plate to move, so that the docking shaft is inserted into the docking hole, causing the drive device to rotate the placement frame.

[0014] The placement frame is connected to connecting shafts on both sides, and a rectangular block is fixedly connected to one end of the connecting shaft. The docking hole is opened on one side of the rectangular block.

[0015] The two connecting shafts are respectively connected to the slides of two guide rail circulating lines, which are used to drive the placement frame to move cyclically through the guide rail circulating lines, so that the placement frame and the placement box and semiconductor equipment contained inside can enter and exit the pickling tank to achieve pickling.

[0016] As a preferred embodiment of the present invention, a partition two is fixed inside the placement frame, which divides the inside of the placement frame into two holding chambers, thereby enabling the simultaneous holding of two placement boxes.

[0017] As a preferred embodiment of the present invention, two pairs of sliding rods are symmetrically connected to the outer surface of the placement frame, and each pair of sliding rods is movably inserted with a baffle; each sliding rod is fitted with two springs, which are located on both sides of the baffle respectively. The springs support the baffle, and the baffle seals the opening of the holding chamber, so that the placement box is kept inside the placement frame.

[0018] As a preferred embodiment of the present invention, there are several partitions, which together with the inner wall of the processing chamber form a drying chamber and a pretreatment chamber, and the drying chamber and the pretreatment chamber are respectively located on both sides of the pickling tank, and the guide rail circulation line is arranged inside the drying chamber and the pretreatment chamber.

[0019] As a preferred embodiment of the present invention, there are multiple rotating shafts, each corresponding to a pickling tank, a drying chamber, and a pretreatment chamber.

[0020] As a preferred embodiment of the present invention, the multiple rotating shafts are connected by a transmission, and the multiple rotating shafts synchronously drive the placement frame in the pickling tank, drying chamber and pretreatment chamber to rotate.

[0021] As a preferred embodiment of the present invention, an air suction hood is installed inside the pickling tank, an air suction pipe is installed on the top of the air suction hood, one end of the air suction pipe extends to the outside of the processing chamber, a processor is installed on the top of the processing chamber, and one end of the air suction pipe is connected to the processor, so that the waste gas generated during pickling is discharged through the air suction hood.

[0022] As a preferred embodiment of the present invention, a water supply pipe is provided outside the processing chamber, and a connecting pipe is connected in parallel at the end of the water supply pipe. The two connecting pipes extend into the interior of the drying chamber and are connected to the partition. Several nozzles are connected in series on one side of the two connecting pipes to spray the semiconductor equipment.

[0023] As a preferred embodiment of the present invention, a drying device is installed at both ends of the processing chamber, and the air outlets of the two drying devices are respectively located in the drying chamber and the pretreatment chamber, and the placement frame, the mounting box and the semiconductor equipment are dried by the drying device.

[0024] The present invention has the following beneficial effects:

[0025] 1. This invention sets up a placement frame on a guide rail circulation line inside the processing chamber. Semiconductor equipment components placed in the placement box are placed in the placement frame. The placement frame enters the pickling tank under the drive of the guide rail circulation line, thereby immersing the semiconductor equipment components and ensuring the pickling quality of the semiconductor equipment components.

[0026] 2. This invention sets up an acid pickling tank, a drying chamber, and a pretreatment chamber in the processing room. The parts are sprayed and dried in the drying chamber and the pretreatment chamber, which ensures that the parts entering the acid pickling tank are clean and dry. This avoids the parts carrying impurities, dust, etc. into the acid pickling tank and causing pollution of the acid pickling solution. It also avoids water adhering to the surface of the parts diluting the acid pickling solution and thus affecting the acid pickling effect. At the same time, the post-acid pickling cleaning also avoids the acid pickling solution remaining on the parts for a long time and being unevenly distributed, which could cause damage.

[0027] 3. The present invention, by engaging the docking shaft in the drive assembly into the docking hole of the placement frame, drives the placement frame to rotate inside the pickling tank, thereby agitating the pickling solution and making the pickling solution contact all parts of the semiconductor equipment component surface, thus improving the pickling efficiency.

[0028] 4. This invention uses a rectangular block to hold the placement frame in the drying chamber and the pretreatment chamber, causing the placement frame and parts to rotate inside the drying chamber. The nozzle can spray and clean them evenly, and excess water can be shaken off. The drying device can dry the placement frame and parts more quickly.

[0029] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of an acid washing device for semiconductor equipment components according to the present invention;

[0032] Figure 2 for Figure 1 The rear view of the structure shown;

[0033] Figure 3 for Figure 1 The structural cross-sectional view shown;

[0034] Figure 4 for Figure 1 The diagram shows the structure of the placement frame, mounting box, and drive assembly.

[0035] Figure 5 for Figure 4 The diagram shows the structure of the placement frame.

[0036] Figure 6 for Figure 4 The diagram shows a partial structure of the placement frame and a structural diagram of the placement box.

[0037] Figure 7 for Figure 6 The diagram shows the unfolded shape of the placement box;

[0038] Figure 8 for Figure 4 The diagram shows the structure of the driving component.

[0039] The attached diagram lists the components represented by each number as follows: 1. Processing chamber; 2. Guide rail type circulation line; 3. Placement frame; 32. Connecting shaft; 33. Rectangular block; 34. Docking hole; 35. Partition two; 36. Slide rod; 37. Baffle; 38. Spring; 4. Placement box; 41. Buffer block; 5. Drive assembly; 51. Mounting base; 52. Telescopic device; 53. Support plate; 54. Rotating shaft; 55. Drive unit; 56. Connecting shaft; 6. Partition 1; 7. Pickling tank; 8. Drying chamber; 9. Buffer block; 10. Suction hood; 11. Suction pipe; 12. Processor; 13. Water supply pipe; 14. Connecting pipe; 15. Nozzle; 16. Drying device; 17. Waterproof cover; 18. Angled hole. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0042] Please see Figure 1 , 2As shown in Figure 3, this invention is a pickling device for semiconductor equipment components, including a processing chamber 1. The processing chamber 1 has an outlet and an inlet at each end, facilitating loading and unloading by operators from both ends. It also includes a partition 6, fixed inside the processing chamber 1. The partition 6 and the inner wall of the processing chamber 1 enclose a pickling tank 7 for pickling semiconductor equipment components. An inlet pipe and a drain pipe are fixed outside the processing chamber 1. The inlet pipe is positioned high, allowing pickling solution to be discharged into the pickling tank 7. The amount of pickling solution injected into the pickling tank 7 can be controlled according to the position of the inlet pipe. After a period of use, the pickling solution in the pickling tank 7 is discharged through the drain pipe to replace the pickling solution and ensure its quality. The partition 6 is... Two chambers, together with the inner wall of the processing chamber 1, form a drying chamber 8 and a pretreatment chamber 9. The drying chamber 8 and the pretreatment chamber 9 are located on both sides of the pickling tank 7. The space of the pickling tank 7 is twice the space of the drying chamber 8. The space inside the pretreatment chamber 9 is the same size as that of the drying chamber 8. A guide rail circulation line 2 is installed inside the drying chamber 8 and the pretreatment chamber 9. When the guide rail circulation line 2 moves the semiconductor equipment components, the semiconductor equipment components first enter the pretreatment chamber 9 for pretreatment to prevent human fingerprints, grease, or dust on the surface of the semiconductor equipment components from being directly immersed in the pickling solution and affecting the quality of the pickling solution. After pretreatment, the semiconductor equipment components enter the pickling tank 7 for agitation and pickling, and then enter the drying chamber 8 for cleaning and drying.

[0043] Please see Figure 1 , 2 As shown in Figure 3, a specific application of this embodiment is: a guide rail type circulation line 2, two guide rail type circulation lines 2 are respectively installed on the two inner side walls of the processing chamber 1, the guide rail type circulation lines 2 are laid inside the pickling tank 7, and the semiconductor equipment components are carried by the placement frame 3 and immersed in the pickling solution in the pickling tank 7 along the guide rail type circulation line 2, so as to ensure that the semiconductor equipment components can be effectively immersed in the pickling solution for pickling.

[0044] Please see Figure 1 , 2As shown in Figures 3, 4, 5, 6, and 7, a specific application of this embodiment is as follows: Eight placement frames 3 are evenly installed on the slide of the guide rail circulating line 2. The guide rail circulating line 2 drives the eight placement frames 3 to move. According to the shape of the guide rail circulating line 2, two placement frames 3 can be simultaneously placed in the central pickling tank 7. Two other placement frames 3 are respectively placed in the drying chamber 8 and the pretreatment chamber 9 on both sides. When the placement frames 3 are in the drying chamber 8, the pickling solution on the surface of the placement frames 3 and the semiconductor equipment components is cleaned off, preventing the pickling solution from remaining on the components for a long time and causing uneven distribution, thus preventing damage. The outer surface of the placement frames 3 is provided with docking holes 34; both sides of the placement frames 3 are... A connecting shaft 32 is connected, with a rectangular block 33 fixedly connected to the end of one of the connecting shafts 32. A mating hole 34 is opened on one side of the rectangular block 33. The two connecting shafts 32 are respectively connected to the slides of the two guide rail type circulation lines 2, and are used to drive the placement frame 3 to circulate through the guide rail type circulation lines 2 to realize the pickling, cleaning and drying of the placement box 4 and semiconductor equipment components in the placement frame 3. The two connecting shafts 32 are respectively rotatably connected to the two slides, and the two slides are connected to the guide rails in the guide rail type circulation lines 2. A rectangular block 33 is fixed to the end of one of the connecting shafts 32, and the rectangular block 33 faces the drive assembly 5. A partition 2 35 is fixed in the middle inside the placement frame 3. The placement frame 3 is divided into upper and lower parts to allow simultaneous placement of two storage boxes 4. Two pairs of sliding rods 36 are symmetrically connected to the outer surface of the placement frame 3, and each pair of sliding rods 36 is movably inserted with a baffle 37. Each sliding rod 36 is fitted with two springs 38, located on either side of the baffle 37. The springs 38 support the baffle 37, and the baffle 37 seals the opening of the storage chamber, keeping the storage box 4 inside the placement frame 3. Lifting or pressing the baffle 37 upwards or downwards facilitates the placement and removal of the storage box 4. Two springs 38 are fitted on the surface of the sliding rods 36, with one end of each spring 38 connected to the surface of the baffle 37. 38 limits the position of baffle 37 so that when the placement frame 3 rotates, the two baffles 37 are in the middle of the opening end of the placement frame 3, stabilizing the position of the two placement boxes 4 inside the placement frame 3. The placement box 4 is placed inside the placement frame 3 and is used to place semiconductor equipment components. The placement box 4 is equipped with a buffer block 9. The placement box 4 contacts the semiconductor equipment components through the buffer block 9, so that the position of the semiconductor components is stable. The two spaces separated by the partition 35 inside the placement frame 3 are adapted to the size of the placement box 4, so as to prevent the placement box 4 from shaking inside the placement frame 3 when the placement frame 3 rotates. At the same time, the position of the semiconductor equipment components can also be stabilized by the buffer block 41 inside the placement box 4.

[0045] Please see Figure 1 , 3As shown in Figures 4 and 8, a specific application of this embodiment is: a drive assembly 5, which includes a mounting base 51, fixedly installed in the processing chamber 1, a telescopic device 52 fixedly connected to the mounting base 51, a support plate 53 fixedly connected to the telescopic end of the telescopic device 52, a rotating shaft 54 ​​rotatably connected to the support plate 53, and a drive device 55 fixedly connected thereto, with the output end of the drive device 55 connected to the rotating shaft 54. The telescopic device 52 is an electric telescopic rod, fixed to the mounting base 51 by bolts. The drive device 55 is a servo motor, which can pause for a certain period of time after rotating a certain number of revolutions, ensuring that the placement frame 3, the placement box 4, and the internal semiconductor equipment can be flipped, ensuring that the semiconductor equipment can be pickled in the pickling solution for a sufficient time; the end of the rotating shaft 54 ​​penetrates the side wall of the pickling tank 7, and A sealing ring is provided at the hole between the rotating shaft 54 ​​and the pickling tank 7 to prevent the pickling solution from leaking out and to prevent corrosion by the pickling solution. A docking shaft 56 is fixedly connected to the hole 34 to mate with it. The docking shaft 56 is a rectangular shaft, and the docking hole 34 is also a rectangular groove. The two are similarly matched. The telescopic device 52 pushes the support plate 53 to move, so that the docking shaft 56 is inserted into the docking hole 34, and the drive device 55 drives the placement frame 3 to flip. There are multiple rotating shafts 54, which correspond to the pickling tank 7, the drying chamber 8 and the pretreatment chamber 9 respectively. The multiple rotating shafts 54 are connected by transmission. The multiple rotating shafts 54 synchronously drive the placement frame 3 in the pickling tank 7, the drying chamber 8 and the pretreatment chamber 9 to rotate. The semiconductor equipment parts rotate in the pickling solution, which can agitate the pickling solution and make the semiconductor equipment parts fully contact the pickling solution to ensure the pickling quality.

[0046] Please see Figure 1 , 2 As shown in Figure 3, a specific application of this embodiment is as follows: A suction hood 10 is installed inside the pickling tank 7, and a suction pipe 11 is installed on the top of the suction hood 10. One end of the suction pipe 11 passes through the processing chamber 1 and extends to the outside of the processing chamber 1. The positions of the suction hood 10 and the suction pipe 11 do not affect the movement of the guide rail circulation line 2 and the placement frame 3. A processor 12 is installed on the top of the processing chamber 1. One end of the suction pipe 11 is connected to the processor 12. The exhaust gas generated during pickling is discharged through the suction hood 10, and the exhaust gas that escapes into the drying chamber 8 and the pretreatment chamber 9 can also be discharged together. The processor 12 treats the exhaust gas generated by the chemical reaction between the pickling liquid and the semiconductor equipment components, avoiding the direct emission of exhaust gas and causing adverse effects on the surrounding air.

[0047] Please see Figure 2 , 3As shown, a specific application of this embodiment is as follows: A water supply pipe 13 is provided outside the processing chamber 1, and a connecting pipe 14 is connected in parallel at the end of the water supply pipe 13. The two connecting pipes 14 extend into the interior of the drying chamber 8 and the pretreatment chamber 9, respectively, and are connected to the partition 6. Several nozzles 15 are connected in series on one side of the two connecting pipes 14. The semiconductor equipment is sprayed through the several nozzles 15. The several nozzles 15 increase the spraying area. When the placement frame 3 rotates, the multiple nozzles 15 spray water evenly, and the pickling solution remaining on the surface of the placement frame 3, the placement box 4 and the semiconductor equipment components inside can be cleaned away, avoiding the pickling solution remaining on the semiconductor equipment components. Furthermore, uneven distribution of pickling solution can cause the semiconductor equipment components to be corroded by pickling solution, resulting in spots and affecting the production quality of the semiconductor equipment components.

[0048] Please see Figure 1 , 2 As shown in Figure 3, a specific application of this embodiment is as follows: Drying devices 16 are installed at both ends of the processing chamber 1. The air outlets of the two drying devices 16 are located in the drying chamber 8 and the pretreatment chamber 9, respectively. The placement frame 3, the placement box 4 and the semiconductor equipment are dried by the drying devices 16. The air outlet of the drying device 16 is covered with a waterproof cover 17. Several oblique holes 18 are evenly opened on the surface of the waterproof cover 17. The waterproof cover 17 and the oblique holes 18 prevent water from splashing into the drying device 16. After the spraying is completed, the placement frame 3 continues to rotate to shake off the residual water. At the same time, the drying device 16 blows air through the oblique holes 18 to dry the placement frame 3, the placement box 4 and the semiconductor equipment components together.

[0049] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0050] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A pickling apparatus for semiconductor equipment components, comprising a processing chamber (1), characterized in that, Also includes: Partition 1 (6) is fixed inside the processing chamber (1). The partition 1 (6) and the inner wall of the processing chamber (1) enclose an acid pickling tank (7) for pickling semiconductor equipment. The guide rail type circulation line (2) is installed on the two inner side walls of the treatment chamber (1) respectively, and the guide rail type circulation line (2) is laid inside the pickling tank (7); Placement frames (3), several of the placement frames (3) are evenly installed on the slide of the guide rail type circulation line (2), and the outer surface of the placement frames (3) is provided with docking holes (34). The placement box (4) is placed inside the placement frame (3) and is used to place semiconductor devices; The drive assembly (5) includes a mounting base (51), which is fixedly installed in the processing chamber (1). The mounting base (51) is fixedly connected to a telescopic device (52), and the telescopic end of the telescopic device (52) is fixedly connected to a support plate (53). The support plate (53) is rotatably connected to a rotating shaft (54), and a drive device (55) is fixedly connected thereto. The output end of the drive device (55) is connected to the rotating shaft (54). The end of the rotating shaft (54) penetrates the side wall of the pickling tank (7) and is fixedly connected to a docking shaft (56) that mates with the docking hole (34). The telescopic device (52) pushes the support plate (53) to move, so that the docking shaft (56) is inserted into the docking hole (34), and the driving device (55) drives the placement frame (3) to flip.

2. The pickling apparatus for semiconductor equipment components according to claim 1, characterized in that, The placement frame (3) is connected to a connecting shaft (32) on both sides, and a rectangular block (33) is fixedly connected to the end of one of the connecting shafts (32), and the docking hole (34) is opened on one side of the rectangular block (33); The two connecting shafts (32) are respectively connected to the slides of the two guide rail circulation lines (2) to drive the placement frame (3) to move cyclically through the guide rail circulation lines (2), so that the placement frame (3) and the placement box (4) and semiconductor equipment contained inside it can enter and exit the pickling tank (7) to achieve pickling.

3. The pickling apparatus for semiconductor equipment components according to claim 2, characterized in that, The placement frame (3) is fixed with a partition (35) inside, which divides the interior of the placement frame (3) into two holding chambers, so that two placement boxes (4) can be placed at the same time.

4. The pickling apparatus for semiconductor equipment components according to claim 3, characterized in that, Two pairs of sliding rods (36) are symmetrically connected to the outer surface of the placement frame (3), and each pair of sliding rods (36) is movably inserted with a baffle (37); each sliding rod (36) is fitted with two springs (38), and the two springs (38) are located on both sides of the baffle (37). The springs (38) support the baffle (37), and the baffle (37) seals the opening of the holding chamber, so that the placement box (4) is kept inside the placement frame (3).

5. A pickling apparatus for semiconductor equipment components according to claim 1 or 4, characterized in that, The partition (6) consists of several partitions, which enclose the drying chamber (8) and the pretreatment chamber (9) with the inner wall of the processing chamber (1). The drying chamber (8) and the pretreatment chamber (9) are located on both sides of the pickling tank (7), and the guide rail circulation line (2) is laid inside the drying chamber (8) and the pretreatment chamber (9).

6. The pickling apparatus for semiconductor equipment components according to claim 6, characterized in that, There are multiple rotating shafts (54), which correspond to the pickling tank (7), the drying chamber (8), and the pretreatment chamber (9), respectively.

7. The pickling apparatus for semiconductor equipment components according to claim 6, characterized in that, The multiple rotating shafts (54) are connected by a transmission, and the multiple rotating shafts (54) synchronously drive the placement frame (3) in the pickling tank (7), drying chamber (8) and pretreatment chamber (9) to rotate.

8. The pickling apparatus for semiconductor equipment components according to claim 6, characterized in that, The pickling tank (7) is equipped with a suction hood (10), and a suction pipe (11) is installed on the top of the suction hood (10). One end of the suction pipe (11) extends to the outside of the processing chamber (1). A processor (12) is installed on the top of the processing chamber (1). One end of the suction pipe (11) is connected to the processor (12). The waste gas generated during pickling is discharged through the suction hood (10).

9. The pickling apparatus for semiconductor equipment components according to claim 6, characterized in that, A water supply pipe (13) is provided outside the processing chamber (1). A connecting pipe (14) is connected in parallel at the end of the water supply pipe (13). The two connecting pipes (14) extend into the interior of the drying chamber (8) and are connected to the partition plate (6). Several nozzles (15) are connected in series on one side of the two connecting pipes (14) to spray the semiconductor equipment.

10. A pickling apparatus for semiconductor equipment components according to claim 6, characterized in that, Drying devices (16) are installed at both ends of the processing chamber (1). The air outlets of the two drying devices (16) are located in the drying chamber (8) and the pretreatment chamber (9) respectively. The placement frame (3), the placement box (4) and the semiconductor equipment are dried by the drying devices (16).

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