Compensation turning machining method for micro V-groove array structure

Abstract

The invention discloses a compensation turning machining method for a micro V-groove array structure in the technical field of ultra-precision turning. The compensation turning machining method comprises the steps that a V-shaped tool is designed and machined according to the two-dimensional theoretical contour line size of the micro V-groove array structure; a tool disc is designed according to error requirements, and the surface of the tool disc is turned; a workpiece to be machined is fixed to the turned tool disc, and surface rough machining is conducted; according to the two-dimensional theoretical contour line of the micro-V-groove array structure, the V-shaped cutter is adopted for conducting rough machining on the surface of a machining element; contour data of the micro-V-groove array structure on the surface of the to-be-machined workpiece are detected and obtained through a spectrum confocal displacement sensor; and on the basis of the contour data, compensation finish machining is conducted on the surface of the machined element, and compensation turning machining of the micro V-groove array structure is completed. According to the method, a feasible solution is provided for processing the submicron V-groove array, and the method has important theoretical significance and practical application value for processing the micro V-groove array structure.

Description

Technical Field

[0001] This invention relates to a compensation turning method for a micro V-groove array structure, belonging to the field of ultra-precision turning technology. Background Technology

[0002] Micro-V-groove array structures possess excellent optical properties, such as reducing visible light reflection, enhancing electromagnetic wave absorption, and adjusting transmittance, and are widely used in optical devices and information security.

[0003] However, traditional processing methods such as optical lithography, electron beam writing, and focused ion beam etching have significant drawbacks. Optical lithography is limited by the wavelength of the light source, making it difficult to process complex three-dimensional structures; electron beam writing is slow and has limited material selection; focused ion beam etching equipment is expensive and slow, making it difficult to meet the needs of large-scale production. Currently, flying slitting can process micro-V-groove structures with dimensions larger than micrometers, but the surface uniformity is poor. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a compensated turning method for micro V-groove array structures. This method utilizes single-point turning technology to precisely process micro V-groove structures, resulting in high processing efficiency, excellent surface quality, and wide material adaptability, thus overcoming the limitations of traditional methods.

[0005] To achieve the above objectives, the present invention is implemented using the following technical solution:

[0006] In a first aspect, the present invention provides a compensated turning method for a micro V-groove array structure, comprising:

[0007] V-shaped cutting tools are designed and manufactured based on the two-dimensional theoretical contour dimensions of the micro-V-groove array structure.

[0008] Design the tooling tray according to the error requirements and machine the surface of the tooling tray;

[0009] The workpiece to be processed is fixed on the tooling plate after turning, and rough surface machining is performed.

[0010] Based on the two-dimensional theoretical contour line of the micro-V-groove array structure, the V-shaped tool is used to rough-machine the surface of the processing element.

[0011] Contour data of the micro-V-groove array structure on the surface of the workpiece to be processed were obtained by using a spectral confocal displacement sensor.

[0012] Based on the contour data, the surface of the machining element is compensated and finished to complete the compensated turning of the micro V-groove array structure.

[0013] Furthermore, V-shaped cutting tools are designed and machined based on the two-dimensional theoretical contour dimensions of the micro-V-groove array structure, including:

[0014] Based on the included angle of the two-dimensional contour line of the micro V-groove array structure to be machined on the cross-section, a diamond tip cutting tool with a corresponding angle and cutting edge length is designed, wherein the cutting tip angle of the diamond tip cutting tool is equal to the included angle of the two-dimensional contour line of the micro V-groove array structure on the cross-section.

[0015] Furthermore, the tooling disc is designed according to the error requirements, and the surface of the tooling disc is machined, including:

[0016] Based on the lateral dimensions and angles of the micro-V-groove array structure, and the maximum error requirement for the linear deviation of the micro-V-groove dimensions, the diameter of the tooling tray and the installation and fixing position of the workpiece on the tooling tray are designed. The maximum linear error of the micro-V-groove array structure satisfies the formula:

[0017]

[0018] In the formula, ε is the maximum linear deviation error of the micro-V groove array structure size, R is the distance between the fixed position of the workpiece and the center of the rotation axis, and D is the size of the workpiece.

[0019] Furthermore, the workpiece to be processed is fixed on the tooling disc after turning, and rough surface machining is performed, including:

[0020] A circular arc tool is selected for rough machining of the component to be machined, and the accuracy of the PV value of its base surface shape is controlled within the set threshold. Then, the workpiece surface is turned.

[0021] Furthermore, based on the two-dimensional theoretical contour line of the micro-V-groove array structure, the V-shaped tool is used to rough-machine the surface of the machining element, including:

[0022] Select the designed V-shaped cutting tool, set the machining parameters according to the transverse dimension of the micro V groove, generate the machining program, perform rough machining, and control the single turning depth to be greater than the longitudinal depth of the micro V groove.

[0023] Furthermore, a spectral confocal displacement sensor is used to detect and obtain the contour data of the micro-V-groove array structure on the surface of the workpiece to be processed, including:

[0024] A spectral confocal displacement sensor is installed above the lathe tool position. Online detection is performed by scanning and measuring along the direction perpendicular to the micro-V-groove marking, obtaining a discrete set of two-dimensional coordinate points. The data is expressed as follows:

[0025] P={( , ), ( , ), ..., ( , ), ..., ( , )}

[0026] Where: P is a set of two-dimensional coordinate points. Let N be the displacement coordinate of the i-th sampling point along the feed direction, and N be the number of sampling points. The surface height value measured at the i-th sampling point.

[0027] Furthermore, based on the contour data, the surface of the processed element is subjected to compensation finishing, including:

[0028] Traverse the two-dimensional coordinate point set to identify the peak points of each micro-V groove unit, thus obtaining the peak point set;

[0029] The least squares method was used to perform polynomial fitting on the peak point set to remove the high-frequency micro-V groove shape and retain the low-frequency shape error that reflects the macroscopic undulation of the substrate surface, thus obtaining the fitted dataset.

[0030] Invert the values ​​in the fitted dataset to obtain the inverted dataset;

[0031] After discretizing the roughing path into a set of target coordinate points, it is superimposed with the inverted dataset to obtain the set of data points for the compensated processing path.

[0032] Import the compensation machining path data point set into the machine tool and perform compensation finishing on the surface of the machining component.

[0033] Furthermore, the expression for the set of peak points is:

[0034] ={( , ), ( , ), ..., ( , ), ..., ( , )}

[0035] In the formula, For the set of peak points, Let i be the coordinates of the peak point of the i-th sampling point along the feed direction. Let be the surface height value of the peak point of the i-th sampling point.

[0036] Furthermore, the expression for the fitted dataset is:

[0037] Q={( , ), ( , ), ..., ( , ), ..., ( , )}

[0038] In the formula, Q represents the fitted dataset. These are the displacement coordinates of the i sampling points along the feed direction after fitting. This represents the surface height value measured at the i-th sampling point after fitting.

[0039] The expression for the inverted dataset is:

[0040] ={( , ), ( , ), ..., ( , ), ..., ( , )}

[0041] In the formula, To invert the dataset.

[0042] Furthermore, the expression for the target coordinate point set is:

[0043] O={( , ), ( , ), ..., ( , ), ..., ( , )}

[0044] In the formula, O is the set of target coordinate points. These are the displacement coordinates of the i sampling points along the feed direction after discretization. This represents the surface height value measured at the i-th sampling point after discretization.

[0045] The expression for the data point set of the compensation processing path is:

[0046] R={( , ), ( , ), ..., ( , ), ..., ( , )}

[0047] =

[0048]

[0049] In the formula, R is the set of data points for the compensation processing path. Let be the displacement coordinates of the i-th compensated machining path data point along the feed direction. The surface height value is the value measured at the i-th compensated machining path data point along the feed direction.

[0050] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0051] This solution utilizes online inspection to achieve an integrated "measurement-compensation-reprocessing" process. Combined with a designed high-rigidity, high-flatness tooling tray, it enables efficient and precise machining of micro-V-groove structures, solving the problems of slow processing speed, expensive equipment, and low dimensional accuracy of traditional micro-V-groove machining methods. It achieves high-quality machining of micro-V-groove structures and is a versatile and easily replicable method for machining micro-V-groove array structures. It boasts high machining efficiency, excellent surface quality, and broad material adaptability. Compensation turning further enhances surface consistency, providing a feasible solution for sub-micron-level V-groove array machining. This solution has significant theoretical and practical application value for machining micro-V-groove array structures. Attached Figure Description

[0052] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0053] Figure 1 This is a flowchart illustrating a compensation turning method for a micro V-groove array structure provided in an embodiment of the present invention. Detailed Implementation

[0054] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0055] The following detailed description is exemplary and intended to provide further detailed explanation of the invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention.

[0056] Example:

[0057] Please see Figure 1 This embodiment proposes a compensation turning method for a micro V-groove array structure, including the following steps:

[0058] S01: Design the V-shaped cutting tool required for machining based on the two-dimensional theoretical contour dimensions of the micro-V-groove array structure. Specifically, this includes designing a diamond-tipped cutting tool with a corresponding angle and cutting edge length based on the included angle of the two-dimensional contour line of the micro-V-groove array structure to be machined on the cross-section. The cutting tip angle of the diamond-tipped cutting tool is equal to the included angle of the two-dimensional contour line of the micro-V-groove array structure on the cross-section. In this embodiment, the lateral dimension of the micro-V-groove array is 2 micrometers and the angle is 90°, and the cutting tip angle of the tool is designed to be 90°.

[0059] S02: Design the tooling tray according to the error requirements and machine the surface of the tooling tray. Specifically, this includes: designing the tooling tray diameter and the workpiece mounting position on the tooling tray based on the lateral dimensions and angles of the micro-V-groove array structure, as well as the maximum linear deviation error requirement of the micro-V-groove dimensions. The tooling tray diameter is slightly larger than the workpiece mounting position on the tooling tray. The maximum linear error of the micro-V-groove array structure satisfies the formula:

[0060]

[0061] In the formula, ε is the maximum linear deviation error of the micro-V groove array structure size, R is the distance between the fixed position of the workpiece and the center of the rotation axis, and D is the size of the workpiece.

[0062] S03: Fix the workpiece to be processed at the tooling design position and perform rough surface machining using a circular arc tool. Specifically, this includes: selecting a circular arc tool to perform rough machining on the component to be processed, controlling the surface shape of its base, and turning the workpiece surface. In this embodiment, the accuracy of the PV value (i.e., the vertical distance between the highest peak and the lowest valley of the surface profile) of the tooling disk is controlled to be less than 0.5 micrometers to ensure that the subsequent workpiece surface shape error is within a certain range and does not affect the consistency of the microstructure surface.

[0063] S04: Rough machining of the component surface is performed according to the two-dimensional theoretical contour line of the micro-V groove array structure. Specifically, this includes: selecting the designed V-shaped tip, setting the machining parameters according to the transverse dimension of the micro-V groove, generating the machining program, and performing rough machining; in micron-level cutting, the machine tool's repeated positioning error will cause irregular secondary grooves to be generated on the side of the micro-V groove, and controlling the single turning depth to be greater than the longitudinal depth of the micro-V groove.

[0064] S05: The contour data of the micro-V-groove array structure on the surface of the workpiece to be machined is obtained by using a spectral confocal displacement sensor. Specifically, this includes: installing a spectral confocal displacement sensor above the lathe tool position, performing online detection on the machined micro-V-groove array structure, obtaining contour data, and obtaining the xz curve of the contour data.

[0065] S06: Based on the contour data, perform compensation finishing on the surface of the machined component. Specifically, this includes: detecting the contour line of the cross-section of the micro-V groove obtained online; inverting the xz curve of the obtained contour data to obtain the compensation curve x-(-z); superimposing the compensation curve x-(-z) onto the roughing path to obtain the compensation machining path; and using a V-shaped tool to perform compensation finishing on the surface of the machined component according to the compensation machining path. Similarly, to suppress the generation of secondary grooves, the machining parameters are the same as those for roughing, and the depth of a single turning operation is controlled to be greater than the longitudinal depth of the micro-V groove.

[0066] It should be noted that this scheme is based on the maximum linear error formula of the micro-V-groove array structure, combined with a simulation example of the distance R between the fixed position of the workpiece and the center of the rotation axis. This embodiment uses a 14mm square 6061 aluminum optical element. Through the difference between the tool cutting path and the ideal straight path, simulation calculations show that when the maximum linear error ε is less than 0.2, the distance R between the fixed position of the workpiece and the center of the rotation axis is 163.41mm with minimal variation. The workpiece is fixed to the fixture at a fixed position 163.41mm from the center using adhesive. A diamond tool with a circular arc tip is used for surface turning. A profilometer is used to detect the surface shape and compensate for machining, controlling the surface shape PV value to be less than 0.2 micrometers.

[0067] This solution employs a V-shaped diamond tool, sets the machining trajectory to a straight line, and sets the feed rate to 2 mm / min and the spindle speed to 1000 r / min. In micron-level cutting, machine tool repeatability errors can lead to irregular secondary grooves on the sides of the micro-V groove. The minimum critical cutting depth should be greater than the micro-V groove depth to effectively suppress the formation of secondary grooves. Therefore, the turning depth is set to 1.2 microns, and roughing is performed according to the set parameters. After roughing, a spectral confocal displacement sensor is used to obtain the contour data of the micro-V groove online. Based on the detection results, the sag curve xz of the micro-V groove cross-sectional contour line is extracted. The obtained contour data xz curve is inverted to obtain the compensation curve x-(-z). The compensation curve x-(-z) is superimposed on the roughing path to obtain the compensated machining path. Compensation machining is performed according to the compensation path, realizing an integrated process of "measurement-compensation-remachining".

[0068] It should be noted that, addressing the challenge of secondary groove formation caused by multiple coupled factors in the machining of existing micro-V-groove array structures, this embodiment establishes a composite mathematical model that comprehensively considers the randomness of machine tool repeatability errors, the micro-geometry of the cutting edge, and the elastic recovery behavior of the workpiece material at the nanoscale. This model unifies these factors within a theoretical framework through analytical methods and calibrates key coupling coefficients in the model using experimental data, thereby achieving high-precision prediction of the critical cutting depth. This method fundamentally changes the previous passive mode relying on single error compensation or trial-and-error, realizing proactive and precise control of the machining process. Furthermore, this invention seamlessly embeds this dynamic model into a closed-loop control system of "online detection-intelligent decision-making-compensation machining." The system can dynamically call upon the model for calculation based on real-time acquired machine tool status and workpiece contour information, instantly generating the optimal compensation machining command. This method not only suppresses the formation of secondary grooves at their source but also significantly enhances the adaptive robustness of the machining system to fluctuations in machining conditions, ensuring excellent uniformity and consistency in large-scale micro-V-groove array machining. The core calculation formula established in this invention is as follows:

[0069]

[0070] In the formula, is the dynamic critical depth of cut, representing the minimum single cutting depth required to completely suppress secondary grooves under the current machining conditions; k is the statistical confidence coefficient, used to set the confidence level for covering repeatability errors; The standard deviation of the machine tool's repeatability error represents the random fluctuation range of the machine tool's repeatability on the target machining trajectory. denoted as α, where α is the effective cutting edge radius of the tool; f is the feed per revolution used in the current machining process; Δr is the real-time wear increment of the tool cutting edge radius; and α is the elastic recovery coefficient of the workpiece material. This refers to the average height of the micro-unevenness of the workpiece surface in the direction perpendicular to the cutting direction after the previous machining pass.

[0071] In this embodiment, the workpiece to be processed is a planar aluminum substrate with a length of L=10mm. A V-shaped microgroove array with a spacing of 2um needs to be processed on its surface. The processing flow is as follows:

[0072] (i) Obtaining the contour data of the micro V-groove. The specific steps are as follows: the roughing trajectory is a straight line z=f(x), where x is the displacement coordinate along the feed direction (unit: mm), and z is the surface height value at the corresponding x position (unit: μm). The machining parameters are: feed speed F is set to 2 mm / min, spindle speed S is set to 1000 r / min, and turning depth is set to 1.2 μm. The tool moves along the trajectory line to complete the machining. After the roughing is completed, the workpiece is kept in place, and the spectral confocal displacement sensor integrated on the machine tool is used to scan and measure along the direction perpendicular to the micro V-groove marking (X-axis direction).

[0073] Specific data format: Obtain a discrete set of two-dimensional coordinate points P, which contains N sampling points (e.g., N=10000). The data representation format is as follows:

[0074] P={( , ), ( , ), ..., ( , ), ..., ( , )}

[0075] Where: P is a set of two-dimensional coordinate points. Here, N represents the displacement coordinates (in mm) of the i-th sampling point along the feed direction, and N is the number of sampling points. The surface height value (unit: μm) measured at the i-th sampling point includes the micro-geometry of the micro-V groove and the macro-contour error caused by machine tool guide straightness error or workpiece clamping deformation.

[0076] (ii) Based on the contour data of the micro-V groove, extract the sag curve xz of the micro-V groove cross-sectional contour line. The extraction method includes:

[0077] 1) Feature point extraction: Traverse the two-dimensional coordinate point set P to identify the peak points of each micro-V-groove unit (i.e., the top positions between each micro-V-groove). Let the extracted peak point set be... ={( , ), ( , ), ..., ( , ), ..., ( , )}, For the set of peak points, Let i be the coordinates of the peak point of the i-th sampling point along the feed direction. Let be the surface height value of the peak point of the i-th sampling point.

[0078] 2) Curve fitting: The least squares method is used to fit the set of peak points. Polynomial fitting is performed to remove high-frequency micro-V-groove shapes, retaining only low-frequency shape errors reflecting the macroscopic undulations of the substrate surface. The fitted sag variation curve xz is a new dataset Q={( , ), ( , ), ..., ( , ), ..., ( , Q is the fitted dataset. These are the displacement coordinates of the i sampling points along the feed direction after fitting. This represents the surface height value measured at the i-th sampling point after fitting.

[0079] (iii) Invert the obtained contour data xz curve to obtain the compensation curve x-(-z), which is the curve in the fitted dataset Q. Multiplying the value by a coefficient -1 yields the inverted dataset. ={( , ), ( , ), ..., ( , ), ..., ( , )}

[0080] (iv) Superimpose the compensation curve x-(-z) onto the roughing path to obtain the compensated machining path. The superposition method is as follows: Discretize the roughing path z=f(x) into the target coordinate point set O={( , ), ( , ), ..., ( , ), ..., ( , O is the set of target coordinate points. These are the displacement coordinates of the i sampling points along the feed direction after discretization. This represents the surface height value measured at the i-th sampling point after discretization.

[0081] The compensation amount is the compensation curve x-(-z), i.e., the inverted dataset. The data points are directly superimposed onto the target coordinate point set O to obtain the compensation processing path data point set R={( , ), ( , ), ..., ( , ), ..., ( , R is the set of data points for the compensation processing path. Let be the displacement coordinates of the i-th compensated machining path data point along the feed direction. The surface height value is measured at the i-th compensated machining path data point along the feed direction. The mathematical expression and processing procedure are as follows:

[0082] R=O+

[0083] Where, the x-axis and If the values ​​are equal, simply place O and... at the same x-coordinate position. Adding the ordinate values ​​of both, we get:

[0084] =

[0085]

[0086] (v) Perform compensation processing based on the compensation path. The resulting compensation processing path data point set R = {( , ), ( , ), ..., ( , ), ..., ( , Import the tool into the machine tool, and the tool will be positioned according to the coordinate points ( , The tool moves along the workpiece surface to complete the compensation machining. The machining parameters are set as follows: feed rate F = 2 mm / min, spindle speed S = 1000 r / min, and depth of cut = 1.2 micrometers. During the cutting process, the tool follows a "bowl-shaped" trajectory, which precisely cancels out the "arched" error of the workpiece surface. The final machining result is that the top line (envelope) of the micro V-groove array is close to the ideal horizontal straight line, achieving a smooth compensation machining result.

[0087] In summary, this solution employs a roughing-then-finish turning approach, which not only improves the machining accuracy of the micro-V-groove array structure but also effectively reduces tool wear. Compared to traditional micro-V-groove array structure machining methods, the process flow is shorter, significantly reducing machining time and costs. It also offers broad material adaptability, ensures high dimensional consistency of the microstructures throughout the machining area, and is suitable for mass production of micro-V-groove array structures. By using a conventional single-point diamond turning machine and compensating for machining accuracy through online detection, high-quality machining of the micro-V-groove array structure is achieved, demonstrating strong versatility and ease of replication. By controlling the depth of each turning pass, the formation of secondary grooves can be effectively suppressed.

[0088] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative and not exhaustive. All modifications within the scope of this invention or its equivalents are included in this invention.

[0089] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0090] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0091] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0092] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0093] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A method for compensated turning of a micro V-groove array structure, characterized in that, include: V-shaped cutting tools are designed and manufactured based on the two-dimensional theoretical contour dimensions of the micro-V-groove array structure. Design the tooling tray according to the error requirements and machine the surface of the tooling tray; The workpiece to be processed is fixed on the tooling plate after turning, and rough surface machining is performed. Based on the two-dimensional theoretical contour line of the micro-V-groove array structure, the V-shaped tool is used to rough-machine the surface of the processing element. Contour data of the micro-V-groove array structure on the surface of the workpiece to be processed were obtained by using a spectral confocal displacement sensor. Based on the contour data, the surface of the machining element is compensated and finished to complete the compensated turning of the micro V-groove array structure.

2. The compensation turning method for the micro V-groove array structure according to claim 1, characterized in that, Design and process V-shaped cutting tools based on the two-dimensional theoretical contour dimensions of the micro-V-groove array structure, including: Based on the angle between the two-dimensional contour lines of the micro-V-groove array structure to be machined on the cross-section, a diamond tip cutting tool with a corresponding angle and a cutting edge length is designed, wherein the cutting tip angle of the diamond tip cutting tool is equal to the angle between the two-dimensional contour lines of the micro-V-groove array structure on the cross-section.

3. The compensation turning method for the micro V-groove array structure according to claim 1, characterized in that, Design the tooling tray according to the error requirements and machine the surface of the tooling tray, including: Based on the lateral dimensions and angles of the micro-V-groove array structure, and the maximum error requirement for the linear deviation of the micro-V-groove dimensions, the diameter of the tooling tray and the installation and fixing position of the workpiece on the tooling tray are designed. The maximum linear error of the micro-V-groove array structure satisfies the formula: ； In the formula, ε is the maximum linear deviation error of the micro-V groove array structure size, R is the distance between the fixed position of the workpiece and the center of the rotation axis, and D is the size of the workpiece.

4. The compensation turning method for the micro V-groove array structure according to claim 1, characterized in that, The workpiece to be processed is fixed on the tooling disc after turning, and rough surface machining is performed, including: A circular arc tool is selected for rough machining of the component to be machined, and the accuracy of the PV value of its base surface shape is controlled within the set threshold. Then, the workpiece surface is turned.

5. The compensation turning method for the micro V-groove array structure according to claim 1, characterized in that, Based on the two-dimensional theoretical contour line of the micro-V-groove array structure, the V-shaped tool is used to rough-machine the surface of the machining element, including: Select the designed V-shaped cutting tool, set the machining parameters according to the transverse dimension of the micro V groove, generate the machining program, perform rough machining, and control the single turning depth to be greater than the longitudinal depth of the micro V groove.

6. The compensation turning method for the micro V-groove array structure according to claim 1, characterized in that, The contour data of the micro-V-groove array structure on the surface of the workpiece to be processed is obtained by using a spectral confocal displacement sensor, including: A spectral confocal displacement sensor is installed above the lathe tool position. Online detection is performed by scanning and measuring along the direction perpendicular to the micro-V-groove marking, obtaining a discrete set of two-dimensional coordinate points. The data is expressed as follows: P={( ， )，( ， )，...，( ， )，...，( ， )} Where: P is a set of two-dimensional coordinate points. Let N be the displacement coordinate of the i-th sampling point along the feed direction, and N be the number of sampling points. The surface height value measured at the i-th sampling point.

7. The compensation turning method for the micro V-groove array structure according to claim 6, characterized in that, Based on the contour data, the surface of the machined component is compensated and finished, including: Traverse the two-dimensional coordinate point set to identify the peak points of each micro-V groove unit, thus obtaining the peak point set; The least squares method was used to perform polynomial fitting on the peak point set to remove the high-frequency micro-V groove shape and retain the low-frequency shape error that reflects the macroscopic undulation of the substrate surface, thus obtaining the fitted dataset. Invert the values ​​in the fitted dataset to obtain the inverted dataset; After discretizing the roughing path into a set of target coordinate points, it is superimposed with the inverted dataset to obtain the set of data points for the compensated processing path. Import the compensation machining path data point set into the machine tool and perform compensation finishing on the surface of the machining component.

8. The compensation turning method for the micro V-groove array structure according to claim 7, characterized in that, The expression for the set of peak points is: ={( ， )，( ， )，...，( ， )，...，( ， )} In the formula, For the set of peak points, Let i be the coordinates of the peak point of the i-th sampling point along the feed direction. Let be the surface height value of the peak point of the i-th sampling point.

9. The compensation turning method for the micro V-groove array structure according to claim 7, characterized in that, The expression for the fitted dataset is: Q={( ， )，( ， )，...，( ， )，...，( ， )} In the formula, Q represents the fitted dataset. The values ​​represent the displacement coordinates of the i sampling points along the feed direction after fitting. This represents the surface height value measured at the i-th sampling point after fitting. The expression for the inverted dataset is: ={( ， )，( ， )，...，( ， )，...，( ， )} In the formula, To invert the dataset.

10. The compensated turning method for the micro V-groove array structure according to claim 9, characterized in that, The expression for the target coordinate point set is: O={( ， )，( ， )，...，( ， )，...，( ， )} In the formula, O is the set of target coordinate points. These are the displacement coordinates of the i sampling points along the feed direction after discretization. This represents the surface height value measured at the i-th sampling point after discretization. The expression for the data point set of the compensation processing path is: R={( ， )，( ， )，...，( ， )，...，( ， )}； = ； ； In the formula, R is the set of data points for the compensation processing path. Let be the displacement coordinates of the i-th compensated machining path data point along the feed direction. The surface height value is the value measured at the i-th compensated machining path data point along the feed direction.

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