Silicon wafer surface grinding method and device

By using a dual-feeding mode to automatically switch between different abrasive particle sizes on the same equipment, the problem of balancing efficiency and quality in a single mortar bucket system is solved, achieving high-efficiency silicon wafer surface grinding, improving product quality and reducing cost risks.

CN121589710APending Publication Date: 2026-03-03ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202511755651.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-26
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

Existing single-mortar barrel grinding systems struggle to achieve both high grinding efficiency and low surface roughness on the same equipment. This forces manufacturers to compromise when faced with demands for high efficiency and high surface quality, increasing equipment investment costs and introducing the risks of errors and contamination.

Method used

The dual-feed mode automatically switches between different abrasive particle sizes on the same equipment for coarse grinding and fine grinding stages. Large-particle abrasives are used to improve material removal efficiency, while small-particle abrasives are switched to remove surface damage during the fine grinding stage, thus achieving efficient surface quality improvement.

Benefits of technology

Achieve efficient material removal and reduce surface roughness on a single machine, improve product yield and quality, and avoid the costs and risks associated with processing on multiple machines.

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Abstract

The invention provides a silicon wafer surface grinding method and device. The method comprises the steps that a first supply unit is controlled to supply a first grinding material to a grinding area; receiving and responding to the switching signal; controlling a second supply unit to supply a second grinding material to the grinding area; wherein the first grinding material and the second grinding material are different in particle size. An automatic switching double-mortar-barrel liquid supply mode is adopted in a single process of the same equipment, large-particle-size grinding materials are adopted in the coarse grinding stage so that the material removal efficiency can be improved, small-particle-size grinding materials are automatically switched in the fine grinding stage so that surface damage generated in the coarse grinding stage can be removed, the product yield and quality are improved, and the product quality is improved. And the cost and the risk caused by multi-equipment processing are avoided, and the silicon wafer with high surface quality is efficiently obtained.
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