Feeding and discharging device for silicon wafer atomic layer surface coating deposition and working method of feeding and discharging device

Abstract

The invention relates to a feeding and discharging device for silicon wafer atomic layer surface coating deposition and a working method of the feeding and discharging device, and belongs to the technical field of photovoltaic cell manufacturing. Through cooperation of the first carrying mechanism, the second carrying mechanism and the boat grabbing mechanism, accurate positioning and carrying of a silicon wafer bearing boat in the space are achieved, a synchronous belt transmission mechanism is adopted in the horizontal direction to solve the problems of long stroke and structural strength respectively, and an inverted rack module is adopted in the vertical grabbing mechanism to save the space. Double clamping in the two directions of the upper portion and the side portion is arranged, and stable carrying is guaranteed; besides, the air pipe design is adopted in the cooling position, flexible switching of gas media is supported, efficient and uniform cooling is achieved, and meanwhile the use cost of customers is remarkably reduced.

Description

Technical Field

[0001] This application relates to the technical field of photovoltaic cell manufacturing, particularly to a loading and unloading device for depositing films on the atomic layer surface of silicon wafers and its working method. Background Art

[0002] With the development of photovoltaic cell manufacturing technology, the atomic layer surface film deposition process has become a key link in improving the performance of silicon wafers. This process can enhance the stability of the P-N junction, improve the photoelectric conversion efficiency, and maintain the efficiency without attenuation in high-temperature and high-ultraviolet environments, thus providing important support for green power generation and energy transformation.

[0003] To meet the requirements of this process, a corresponding loading and unloading device needs to be configured to achieve the efficient transfer of silicon wafers between process machines. In related technologies, a dedicated loading and unloading device配套 with a single process machine is usually used to complete the transfer and positioning operations of silicon wafers.

[0004] However, the above loading and unloading method is restricted by the production capacity of the process machine itself and the equipment layout, which restricts the improvement of the overall production efficiency. Summary of the Invention

[0005] Based on this, in view of the above problems, it is necessary to provide a loading and unloading device for depositing films on the atomic layer surface of silicon wafers and its working method, which can place silicon wafers in a boat and carry them, has a high degree of handling freedom, and can cool the boat.

[0006] A loading and unloading device for depositing films on the atomic layer surface of silicon wafers includes:

[0007] A first handling mechanism configured along the length direction x, for driving the second handling mechanism to move along the length direction x;

[0008] A second handling mechanism configured along the width direction y, and cooperatively connected with the first handling mechanism, for driving the boat grasping mechanism to move along the width direction y;

[0009] A boat grasping mechanism configured along the height direction z, and cooperatively connected with the second handling mechanism. The boat grasping mechanism includes a clamping component, the clamping component has a plurality of jaws for clamping the upper part of the silicon wafer carrier boat and a clamping plate unit for clamping the side part of the silicon wafer carrier boat and symmetrically arranged. The jaws are driven by a first clamping cylinder to extend or retract in the width direction y, and the clamping plate unit is driven by a second clamping cylinder to extend or retract in the width direction y;

[0010] The boat grasping mechanism further includes a linear module, and the linear module drives a third slider to move along the height direction z through a rack and gear matching structure to drive the clamping component to lift and lower;

[0011] The first transport mechanism, the second transport mechanism, and the boat grabbing mechanism work together to transport the silicon wafer carrier boat to a cooling position or working position in the xy plane defined by the length direction x and the width direction y.

[0012] The cooling position includes a support base and a cooling duct. The cooling duct is provided with ventilation holes, and the gas medium introduced into the cooling duct cools the silicon wafer carrier boat placed on the support base through the ventilation holes.

[0013] In one embodiment, the first conveying mechanism includes a first synchronous motor, a connector, a first synchronous belt, and a first slider; the output end of the first synchronous motor is connected to the first synchronous belt through the connector, the first synchronous belt is arranged along the length direction x, and drives the first slider to move along the length direction x.

[0014] In one embodiment, the second conveying mechanism includes a first connecting plate, a first support frame, a second synchronous motor, and a second synchronous belt; wherein the first connecting plate is connected to a first slider of the first conveying mechanism, the first connecting plate is connected to the first support frame, the second synchronous motor is disposed on the first support frame, and drives the second slider to move along the width direction y through the second synchronous belt.

[0015] In one embodiment, the boat-grabbing mechanism further includes a second support frame, which is connected to a second slider of the second transport mechanism. The linear module is inverted and disposed at the bottom of the second support frame. The third slider cooperates with the linear module and is connected to the clamping assembly through a second connecting plate.

[0016] In one embodiment, the first support frame has two opposite sides in the length direction x, and each side is provided with a first guide rail in the width direction y. A first guide block is provided on the first guide rail and is connected to the second support frame to achieve symmetrical guidance on both sides. A second guide rail in the height direction z is fixed on the end face of the second support frame away from the linear module. A second guide block is provided on the second guide rail. The clamping assembly driven by the third slider and the second connecting plate slides linearly in the height direction z through the second guide rail and the second guide block.

[0017] In one embodiment, the clamping plate unit includes a trapezoidal clamping plate, a drive plate, a connecting block, and a second clamping cylinder; wherein, the second clamping cylinder drives the trapezoidal clamping plate to move in the width direction y through the connecting block and the drive plate; the drive plate is provided with a third guide block, which cooperates with a third guide rail provided along the width direction y.

[0018] In one embodiment, the cooling ducts of the cooling position are arranged on both sides of the support base, and the ventilation holes face the area above the support base for blowing cooling air.

[0019] On the other hand, this application provides a method for operating a loading and unloading device for depositing atomic layer films on the surface of silicon wafers, comprising the following steps:

[0020] The silicon wafer carrier boat is clamped by the clamping assembly of the gripping mechanism, wherein the first clamping cylinder drives the gripper to clamp the upper part of the silicon wafer carrier boat, and the second clamping cylinder drives the clamping plate unit to clamp the lower part of the silicon wafer carrier boat.

[0021] The silicon wafer carrier boat is transported to the cooling position or working position by the first conveying mechanism moving along the length direction x, the second conveying mechanism moving along the width direction y, and the linear module of the boat grabbing mechanism moving along the height direction z.

[0022] At the cooling position, the silicon wafer carrier boat is cooled through the ventilation holes of the cooling air duct.

[0023] In one embodiment, the linear module drives the third slider to move through a rack and pinion mechanism to achieve precise positioning of the clamping assembly in the height direction z.

[0024] In one embodiment, during the step of clamping the silicon wafer carrier boat, the grippers and clamping plate units are configured to operate synchronously to stably clamp the silicon wafer carrier boat from both the top and side portions simultaneously.

[0025] The above-mentioned loading and unloading device and its working method for silicon wafer atomic layer surface coating deposition, through the coordinated work of the first conveying mechanism along the length direction, the second conveying mechanism along the width direction and the boat grabbing mechanism along the height direction, constitute a three-dimensional conveying system, which enables the silicon wafer carrier boat to move flexibly and efficiently between any cooling position or working position in the entire working area, greatly improving the overall layout flexibility and production efficiency of the production line.

[0026] This application also has the following advantages:

[0027] The first conveying mechanism of this application uses synchronous belt drive, which is very suitable for long-distance linear motion; compared with ball screw, it does not have deflection problem in long-stroke applications and can maintain a high motion speed, making it very suitable for silicon wafer transfer scenarios.

[0028] The second handling mechanism of this application not only uses a synchronous belt motion mechanism, but also utilizes a mechanism with double guide rails on the front and back of the first support frame in the length direction, which effectively solves the problem of insufficient strength of the mechanism during handling; at the same time, the symmetrical double guide rail guiding structure on both sides can greatly enhance the torsional stiffness and overall stability of the entire moving part when it moves in the width direction, effectively preventing the overturning moment generated by the grabbing mechanism and the load, and ensuring the positioning accuracy and running stability during the handling process.

[0029] This application adopts a combination of upper gripper and side clamping plate unit. The upper gripper is driven by a first clamping cylinder to clamp the boat from above. The side clamping plate unit uses a trapezoidal clamping plate and a second clamping cylinder to clamp from the side and cooperates with a third guide to ensure smooth movement. This two-position coordinated clamping method forms a three-dimensional wrapping of the silicon wafer carrier boat, with a more uniform distribution of clamping force, which greatly improves the stability and reliability of clamping and avoids the risk of shaking or falling off during high-speed transportation.

[0030] The linear module of the present invention is inverted and disposed at the bottom of the second support frame. Placing the linear module under the second support frame can reduce the overall height, create a compact layout, and save more space when the clamping components move.

[0031] The cooling position of this application achieves directional airflow cooling of the silicon wafer carrier boat through cooling ducts and ventilation holes on both sides of the support base. The cooling air source is switchable, and high-purity nitrogen or compressed air can be selectively introduced into the cooling ducts. This avoids the need to configure two independent cooling systems for different gases. A single infrastructure can meet multiple operating conditions, greatly reducing equipment investment and operating costs. In addition, by rationally arranging the ventilation holes, uniform convection cooling of the boat body can be achieved, which can significantly shorten the process cycle and increase production capacity compared to natural cooling. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of this application.

[0033] Figure 2 This is a schematic diagram of the cooperative structure of the second transport mechanism and the boat grabbing mechanism in this application.

[0034] Figure 3 This is a schematic diagram of the cooperative structure of the second transport mechanism and the boat grabbing mechanism from another perspective of this application.

[0035] Figure 4 for Figure 3 Enlarged schematic diagram of part A in the diagram.

[0036] Figure 5 This is a schematic diagram of the guide component in the boat-grabbing mechanism of this application.

[0037] Figure 6 for Figure 5 Enlarged schematic diagram of part B in the diagram.

[0038] Figure 7 This is a schematic diagram of the clamping component in the boat-grabbing mechanism of this application.

[0039] Figure 8 for Figure 7 A schematic diagram of the clamping assembly after the top cover is removed.

[0040] Figure 9 This is a schematic diagram of the cooling position in this application.

[0041] Figure 10 for Figure 9 Enlarged schematic diagram of part C in the diagram.

[0042] Wherein: 100, First conveying mechanism; 200, Second conveying mechanism; 300, Boat grabbing mechanism; 400, Silicon wafer carrier boat; 500, Cooling position; 600, Working position;

[0043] 110. First synchronous motor; 120. Connector; 130. First synchronous belt; 140. First slider;

[0044] 210. First connecting plate; 220. First support frame; 230. Second synchronous motor; 240. Second synchronous belt;

[0045] 310. Second slider; 320. Second support frame; 330. First guide block; 340. First guide rail; 350. Linear module; 360. Third slider; 370. Second connecting plate; 380. Clamping assembly; 390. Second guide rail; 3100. Second guide block;

[0046] 381. Third connecting plate; 382. Assembly plate; 383. First clamping cylinder; 384. Gripper; 385. Clamping plate unit;

[0047] 3851, Second clamping cylinder; 3852, Connecting block; 3853, Drive plate; 3854, Trapezoidal clamping plate; 3855, Third guide rail; 3856, Third guide block;

[0048] 510. Support base; 520. Cooling air duct; 530. Ventilation hole. Detailed Implementation

[0049] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0050] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0051] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0054] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0055] See Figures 1 to 10 The diagram shows a schematic of the loading and unloading device for depositing atomic layer films on the surface of silicon wafers according to an embodiment of this application.

[0056] This application provides a loading and unloading device for deposition of atomic layer film on the surface of silicon wafers, including a first transport mechanism 100, a second transport mechanism 200, a boat grabbing mechanism 300, a cooling position 500, and a working position 600. The device transports the silicon wafer carrier boat 400 to any cooling position 500 or working position 600 within an xy plane defined by the length direction x and the width direction y, thereby improving the production efficiency and flexibility of photovoltaic cell manufacturing.

[0057] In some embodiments, the first conveying mechanism 100 is configured along the length direction x and is used to drive the second conveying mechanism 200 to move along the length direction x.

[0058] like Figure 1 As shown, the first conveying mechanism 100 includes a first synchronous motor 110, a connector 120, a first synchronous belt 130, and a first slider 140;

[0059] Furthermore, the output end of the first synchronous motor 110 is connected to the first synchronous belt 130 via a connector 120. The first synchronous belt 130 is arranged along the length direction x and drives the first slider 140 to move along the length direction x. The first synchronous motor 110 drives the first synchronous belt 130 to rotate, thereby realizing the linear movement of the second conveying mechanism 200 in the length direction x through the first slider 140. This synchronous belt drive mechanism is particularly suitable for long-stroke applications, effectively solving the problem of excessively long conveying strokes, while maintaining high movement speed and stability.

[0060] In some embodiments, the second transport mechanism 200 is configured along the width direction y and is connected to the first transport mechanism 100 to drive the boat grabbing mechanism 300 to move along the width direction y.

[0061] Furthermore, combined Figure 2 , Figure 3 and Figure 4 As shown, the second conveying mechanism 200 includes a first connecting plate 210, a first support frame 220, a second synchronous motor 230, and a second synchronous belt 240. The first connecting plate 210 is connected to the first slider 140 of the first conveying mechanism 100, and the other side of the first connecting plate 210 is fixedly connected to the first support frame 220. The second synchronous motor 230 is mounted on the first support frame 220, and its output end cooperates with the second synchronous belt 240. The second synchronous belt 240 is arranged along the width direction y and drives the second slider 310 to move along the width direction y.

[0062] Furthermore, the first support frame 220 has two opposite sides in the length direction x, and each side is provided with a first guide rail 340 in the width direction y. A first guide block 330 is provided on the first guide rail 340. The first guide block 330 is connected to the second support frame 320 of the boat grabbing mechanism 300 to achieve symmetrical guidance on both sides. The above-mentioned double guide rail mechanism enhances the torsional stiffness and overall stability of the second transport mechanism 200 when it moves in the width direction y, effectively preventing the overturning moment generated by the boat grabbing mechanism 300 and the load, and ensuring the positioning accuracy and smooth operation during the transport process.

[0063] In some embodiments, the gripping boat mechanism 300 is configured along the height direction z and is connected in cooperation with the second conveying mechanism 200 for clamping and lifting the silicon wafer carrier boat 400.

[0064] Combination Figures 2 to 8 The boat-grabbing mechanism 300 includes a second slider 310, a second support frame 320, a linear module 350, a third slider 360, a second connecting plate 370, and a clamping assembly 380.

[0065] Furthermore, the second slider 310 is connected to the second synchronous belt 240 of the second conveying mechanism 200, and a second support frame 320 is provided on the other side of the second slider 310;

[0066] The linear module 350 drives the third slider 360 to move along the height direction z through a rack and pinion gear structure. The linear module 350 is inverted and installed at the bottom of the second support frame 320. This inverted design saves space, reduces the overall height, and makes the structure more compact.

[0067] The third slider 360 engages with the linear module 350 and is connected to the clamping assembly 380 via the second connecting plate 370.

[0068] It is understandable that, in order to ensure the stable movement of the boat grabbing mechanism 300 in the height direction z, a second guide rail 390 is fixed on the second support frame 320 along the height direction z, and a second guide block 3100 is provided on the second guide rail 390.

[0069] The second guide block 3100 is connected to the second connecting plate 370. Through the cooperation of the second guide rail 390 and the second guide block 3100, the clamping assembly 380 driven by the third slider 360 and the second connecting plate 370 slides linearly in the height direction z, avoiding deflection.

[0070] Furthermore, the clamping assembly 380 is used to clamp the silicon wafer carrier boat 400, and its structure includes a third connecting plate 381, an assembly plate 382, ​​a first clamping cylinder 383, a gripper 384, and a clamping plate unit 385.

[0071] The third connecting plate 381 is connected to the second connecting plate 370 in the height direction z, and the end face of the third connecting plate 381 away from the second connecting plate 370 is fixedly connected to the assembly plate 382.

[0072] The top surface of the assembly plate 382 is equipped with multiple grippers 384, which cooperate with the output end of the first clamping cylinder 383 to extend and retract in the width direction y, thereby clamping the upper part of the silicon wafer support boat 400. The bottom surface of the assembly plate 382 is provided with symmetrical clamping plate units 385, which include trapezoidal clamping plates 3854 symmetrical in the width direction y.

[0073] The top of the trapezoidal clamping plate 3854 is connected to the drive plate 3853, and the drive plate 3853 is connected to the output end of the second clamping cylinder 3851 via the connecting block 3852 on the side away from the trapezoidal clamping plate 3854.

[0074] The drive plate 3853 is also provided with third guide blocks 3856 on both sides, and the third guide blocks 3856 cooperate with the third guide rail 3855 provided along the width direction y.

[0075] The second clamping cylinder 3851 drives the trapezoidal clamping plate 3854 to extend and tighten in the width direction y to clamp the side of the silicon wafer carrier boat 400. This dual clamping mechanism, with both upper and side clamping, forms a three-dimensional enclosure of the silicon wafer carrier boat 400, resulting in a uniform distribution of clamping force. This greatly improves the stability and reliability of clamping and avoids the risk of shaking or falling off during high-speed handling.

[0076] In some embodiments, the cooling position 500 is used to cool the silicon wafer carrier boat 400, such as... Figure 9 and Figure 10 As shown, the cooling position 500 includes a support base 510 and a cooling air duct 520;

[0077] Furthermore, the support base 510 supports the silicon wafer carrier boat 400, and cooling ducts 520 are arranged on both sides of the support base 510. Multiple ventilation holes 530 are formed on the cooling ducts 520 facing the area above the support base 510. The gas medium (such as nitrogen or compressed air) introduced into the cooling ducts 520 is blown onto the silicon wafer carrier boat 400 through the ventilation holes 530, achieving forced cooling. This design supports flexible switching of the gas medium; customers can choose to use nitrogen (for an oxygen-free environment) or compressed air (for conventional cooling) according to process requirements, meeting multiple operating conditions with a single infrastructure, reducing equipment investment and operating costs. At the same time, the rational arrangement of the ventilation holes 530 ensures uniform and efficient cooling, shortening the process cycle.

[0078] In other embodiments, this application also provides a method for operating a loading and unloading device for depositing atomic layer films on the surface of silicon wafers, wherein the silicon wafer carrier boat 400 is clamped by the clamping component 380 of the gripping boat mechanism 300, including the following process:

[0079] The first clamping cylinder 383 drives the gripper 384 to clamp the upper part of the silicon wafer carrier boat 400, while the second clamping cylinder 3851 drives the trapezoidal clamping plate 3854 of the clamping plate unit 385 to clamp the side of the silicon wafer carrier boat 400.

[0080] Subsequently, the first transport mechanism 100 moves along the length direction x, the second transport mechanism 200 moves along the width direction y, and the linear module 350 of the grabbing mechanism 300 moves along the height direction z to transport the silicon wafer carrier boat 400 to the cooling position 500 or the working position 600.

[0081] In the cooling unit 500, cooling ducts 520 cool the silicon wafer carrier boat 400 through ventilation holes 530. The entire device achieves precise positioning and efficient movement of the silicon wafer carrier boat 400 in space through three-axis collaborative transport, improving the automation level and production efficiency of the production line.

[0082] In summary, the structure of this application is reasonable. Through the coordinated work of the first conveying mechanism along the length direction x, the second conveying mechanism along the width direction y, and the boat-grabbing mechanism along the height direction z, a three-dimensional conveying system is formed, which enables the silicon wafer carrier boat 400 to move flexibly and efficiently between any cooling position 500 or working position 600 in the entire working area, greatly improving the overall layout flexibility and production efficiency of the production line.

[0083] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A loading and unloading device for depositing atomic layer films on the surface of silicon wafers, characterized in that, include: The first conveying mechanism (100) is configured along the length direction x and is used to drive the second conveying mechanism (200) to move along the length direction x; The second transport mechanism (200) is configured along the width direction y and is connected to the first transport mechanism (100) to drive the boat grabbing mechanism (300) to move along the width direction y; A boat-grabbing mechanism (300) is configured along the height direction z and is connected to the second conveying mechanism (200). The boat-grabbing mechanism (300) includes a clamping assembly (380). The clamping assembly (380) has multiple jaws (384) for clamping the upper part of the silicon wafer carrier boat (400) and symmetrically arranged clamping plate units (385) for clamping the side of the silicon wafer carrier boat (400). The jaws (384) are driven to extend or retract in the width direction y by a first clamping cylinder (383), and the clamping plate units (385) are driven to extend or retract in the width direction y by a second clamping cylinder (3851). The boat-grabbing mechanism (300) also includes a linear module (350), which drives the third slider (360) to move along the height direction z through a rack and pinion gear structure, so as to drive the clamping assembly (380) to rise and fall; The first transport mechanism (100), the second transport mechanism (200), and the boat grabbing mechanism (300) cooperate to transport the silicon wafer carrier boat (400) to a cooling position (500) or a working position (600) in the xy plane defined by the length direction x and the width direction y. The cooling position (500) includes a support base (510) and a cooling duct (520). The cooling duct (520) is provided with ventilation holes (530). The gas medium introduced into the cooling duct (520) cools the silicon wafer carrier boat (400) placed on the support base (510) through the ventilation holes (530).

2. The loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 1, characterized in that, The first conveying mechanism (100) includes a first synchronous motor (110), a connector (120), a first synchronous belt (130), and a first slider (140); The output end of the first synchronous motor (110) is connected to the first synchronous belt (130) through the connector (120). The first synchronous belt (130) is arranged along the length direction x and drives the first slider (140) to move along the length direction x.

3. The loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 1, characterized in that, The second conveying mechanism (200) includes a first connecting plate (210), a first support frame (220), a second synchronous motor (230), and a second synchronous belt (240); The first connecting plate (210) is connected to the first slider (140) of the first conveying mechanism (100), the first connecting plate (210) is connected to the first support frame (220), the second synchronous motor (230) is disposed on the first support frame (220), and drives the second slider (310) to move along the width direction y through the second synchronous belt (240).

4. The loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 3, characterized in that, The boat-grabbing mechanism (300) further includes a second support frame (320), which is connected to the second slider (310) of the second transport mechanism (200). The linear module (350) is inverted and disposed at the bottom of the second support frame (320). The third slider (360) cooperates with the linear module (350) and is connected to the clamping assembly (380) through the second connecting plate (370).

5. The loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 4, characterized in that, The first support frame (220) has two opposite sides in the length direction x, and a first guide rail (340) in the width direction y is provided on both sides. A first guide block (330) is provided on the first guide rail (340). The first guide block (330) is connected to the second support frame (320) to achieve symmetrical guidance on both sides. A second guide rail (390) is fixed on the end face of the second support frame (320) away from the linear module (350) and is arranged along the height direction z. A second guide block (3100) is provided on the second guide rail (390). The clamping assembly (380) driven by the third slider (360) and the second connecting plate (370) slides linearly in the height direction z through the second guide rail (390) and the second guide block (3100).

6. The loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 1, characterized in that, The clamping unit (385) includes a trapezoidal clamping plate (3854), a drive plate (3853), a connecting block (3852), and a second clamping cylinder (3851); The second clamping cylinder (3851) drives the trapezoidal clamping plate (3854) to move in the width direction y through the connecting block (3852) and the drive plate (3853); The drive plate (3853) is provided with a third guide block (3856), which cooperates with a third guide rail (3855) arranged along the width direction y.

7. The loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 1, characterized in that, The cooling air ducts (520) of the cooling position (500) are arranged on both sides of the support base (510), and the ventilation holes (530) face the area above the support base (510) for blowing cooling air.

8. A method for operating a loading and unloading device for depositing atomic layers on the surface of silicon wafers, characterized in that, Includes the following steps: The silicon wafer carrier boat (400) is clamped by the clamping assembly (380) of the gripping mechanism (300), wherein the first clamping cylinder (383) drives the gripper (384) to clamp the upper part of the silicon wafer carrier boat (400), and the second clamping cylinder (3851) drives the clamping plate unit (385) to clamp the lower part of the silicon wafer carrier boat (400); The silicon wafer carrier boat (400) is transported to the cooling position (500) or the working position (600) by the first conveying mechanism (100) moving along the length direction x, the second conveying mechanism (200) moving along the width direction y, and the linear module (350) of the boat grabbing mechanism (300) moving along the height direction z. At the cooling position (500), the silicon wafer carrier boat (400) is cooled through the ventilation holes (530) of the cooling air duct (520).

9. The operating method of the loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 8, characterized in that, The linear module (350) drives the third slider (360) to move through a rack and pinion structure to achieve precise positioning of the clamping assembly (380) in the height direction z.

10. The operating method of the loading and unloading device for silicon wafer atomic layer surface deposition as described in claim 8, characterized in that, In the step of clamping the silicon wafer carrier boat (400), the grippers (384) and the clamping plate unit (385) are configured to operate synchronously to stably clamp the silicon wafer carrier boat (400) from both the top and the side.

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