Filament guiding device
By employing a stacked assembly of retaining layer and spring layer in the filament guiding device, and utilizing cantilever beams and positioning parts to achieve detachable installation of the guiding part, the problems of independent replacement and misalignment when the guiding part is damaged are solved, thereby improving the stability and durability of the device.
Patent Information
- Application Number
- CN202411816674.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-22
- Filing Date
- 2024-12-11
- Publication Date
- 2026-03-03
AI Technical Summary
The guide section of the existing filament guiding device is difficult to replace independently when it is damaged by vibration or contact, resulting in the replacement of the entire device, and it is prone to misalignment and damage.
The guide is fixed by a stacked assembly consisting of a retaining layer and a spring layer, and is secured by a cantilever beam and a positioning part. This allows for independent replacement and suppresses misalignment. The elastic force of the cantilever beam enables the detachable installation of the guide.
It enables independent replacement of the guide section and suppression of misalignment, reducing the maintenance cost and damage risk of the device, and improving the stability and durability of the device.
Smart Images

Figure CN121593210A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a filament guiding device. Background Technology
[0002] In the production of filament yarns or twisted yarns, filament guiding devices are particularly needed to guide the filaments or filament bundles in order to properly process the filaments. Filament guiding devices can be installed upstream or downstream of various filament processing devices. Examples of filament processing devices include interlacing nozzles that provide an interlacing section in the filament bundle and migration nozzles that disperse oil adhering to the filaments throughout the filament bundle. Furthermore, examples of filament processing devices that are not filament processing nozzles include filament splitting devices that separate smaller filament bundles or single filaments from the filament bundle.
[0003] Regarding filament guiding devices like those described above, prior art, such as that described in Patent Document 1, is known. In this prior art, multiple carbon fiber bundles are divided into individual carbon fibers or individual carbon fiber bundles by a filament-splitting unit of a filament-splitting device, and each divided carbon fiber or individual carbon fiber bundle passes through a filament-splitting guide (equivalent to the "filament guiding device" of this disclosure), thereby allowing them to be pulled out continuously in a predetermined direction. The filament-splitting guide used in the embodiment of Patent Document 1 has a structure in which ceramic guiding parts for guiding carbon fibers or carbon fiber bundles (filaments or filament bundles) are installed one by one in each opening of a plate-shaped base element arranged in a row.
[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2002-255448 Summary of the Invention The problem the invention aims to solve In the aforementioned prior art, the guiding parts of each filament guiding device (filament guide) need to be fixed in a way that prevents misalignment. When fixing the guiding parts, methods such as using adhesives to bond them to the base element are often employed. However, filament guiding devices can also be placed in areas with high vibration, and damage such as missing or damaged guiding parts due to contact with other objects is common. Moreover, if the guiding parts are missing or damaged, the filament guiding device cannot properly guide the filaments and filament bundles.
[0005] If the guide portion of the filament guiding device is missing or damaged, and if the guide portion is bonded to the base element, it is difficult to remove the bond and separate the guide portion. Therefore, in the above-mentioned prior art, if the guide portion of the filament guiding device is missing or damaged, it may be necessary to replace the entire filament guiding device, including the base element to which the guide portion is bonded.
[0006] Therefore, this disclosure aims to solve the above-mentioned problems, and its purpose is to enable the guide part of the filament guide device to be replaced independently.
[0007] means for solving problems According to one aspect of this disclosure, a filament guiding device for guiding filaments or filament bundles is provided. The filament guiding device includes: a plate-shaped base element; a stamping section formed by stamping a portion of the base element in the thickness direction; and a guiding section that guides filaments or filament bundles when mounted on the stamping section. The base element is a laminated assembly consisting of multiple layers including a rigid retaining layer and a spring layer, the retaining layer holding the guiding section in the mounted state, and the spring layer being made of a spring material. The stamping section has a structure in which an insertion space for the guiding section is inserted is provided between two opposing edges. The spring layer has a cantilever beam formed in the portion constituting one edge of the spring layer. The retaining layer has a first positioning portion that positions the guiding section when it abuts against the portion constituting the other edge of the retaining layer from the edge side. The cantilever beam applies force to the guiding section inserted into the insertion space towards the other edge side, causing the guiding section to abut against the first positioning portion.
[0008] According to the above aspects, the guide portion of the filament guiding device abuts against the first positioning portion of the retaining layer by the force of the cantilever beam, and is held in an installed state by the retaining layer. Therefore, by applying an external force that overcomes the force of the cantilever beam, the guide portion can be separated from the stamping portion of the base element. Therefore, according to the above aspects, in the filament guiding device, only the guide portion that guides the filament or the filament bundle can be replaced independently.
[0009] Furthermore, according to the above aspects, the guide portion in the installed state can abut against the first positioning portion of the retaining layer by the force of the cantilever beam and be positioned by the first positioning portion. Therefore, the guide portion is not affected by its dimensional deviation and is positioned with the first positioning portion of the retaining layer as a reference. Therefore, according to the above aspects, misalignment of the guide portion in the filament guiding device can be suppressed.
[0010] According to other aspects, the cantilever beam has: an extension extending along one edge; and an abutment portion configured to extend beyond the extension to the other edge side and abut against the guide portion from the edge side. The extension is bent towards the edge side by the action of the guide portion, which is inserted into the insertion space, pushing the abutment portion towards the edge side.
[0011] Based on the above aspects, the cantilever beam formed by the spring layer made of spring material functions as a cantilever spring, thereby enabling the cantilever beam to exert a force on the guide portion.
[0012] According to other aspects, the stamping part is formed by a slot of a size sized for inserting a guide portion, which is engraved on the side of the base element. The guide portion has: a first engaging portion extending along one edge and engaging with one edge; a second engaging portion extending along another edge and engaging with another edge; and a connecting portion connecting the first engaging portion and the second engaging portion by a root portion serving as the bottom side of the slot. A second positioning portion is provided in the slot, abutting against the connecting portion from the bottom side of the slot to position the guide portion. The abutting portion abuts against the first engaging portion at an intermediate position between the front end portion and the root portion. The extension portion applies a reaction force from the aforementioned action of the guide portion to the guide portion via the abutting portion, thereby pushing the second engaging portion of the guide portion against the first positioning portion and positioning the guide portion.
[0013] According to the above aspects, the second positioning part of the slot can position the guide portion in a direction different from the force exerted by the extension portion that pushes the second engaging portion of the guide portion against the first positioning part of the stamping part. Furthermore, since the force of the extension portion is applied to the midpoint between the abutting portion and the first engaging portion of the guide portion, compared to the case where the abutting portion abuts against the front or root portion of the first engaging portion, tilting of the guide portion relative to the slot can be suppressed. Therefore, according to the above aspects, misalignment of the guide portion in the filament guiding device can be further suppressed.
[0014] Depending on other aspects, multiple slots are arranged along the side of the base element. A guide is installed in each of the multiple slots. A cantilever beam is formed corresponding to each of the multiple slots, applying force to the guide installed in the corresponding slot.
[0015] Based on the above aspects, multiple guide portions, each installed in multiple slots, are independently stressed by separate cantilever beams. Therefore, when an external force is applied to a guide portion to separate it from the slot of the base element, this external force acts on the cantilever beams that apply force to guide portions other than the one being separated, reducing the likelihood that the force applied by the cantilever beams to the guide portions will become less forceful.
[0016] According to other aspects, the guide portion has: a first engaging portion extending along one edge and engaging with that edge; and a second engaging portion extending along the other edge and engaging with that edge. The first engaging portion has first clamping grooves that clamp the retaining layer and spring layer constituting one edge from both sides in the thickness direction. The second engaging portion has second clamping grooves that clamp the retaining layer and spring layer constituting the other edge from both sides in the thickness direction. The cantilever beam applies force to the guide portion towards the other edge while at least a portion is engaged in the first clamping groove.
[0017] According to the above aspects, the guide portion clamps the retaining layer and the spring layer through its first and second clamping grooves, suppressing misalignment observed in the thickness direction of the base element. Furthermore, the cantilever beam applies force to the guide portion with at least a portion inserted into the first clamping groove, thus limiting the deflection of the base element in the thickness direction by the first clamping groove. Therefore, according to the above aspects, the possibility that the force of the cantilever beam deviates in the thickness direction of the base element and cannot be properly applied to the other edge of the guide portion can be reduced.
[0018] Invention Effects According to this disclosure, in the filament guiding device, only the guiding part for guiding the filament or filament bundle can be replaced independently. Attached Figure Description
[0019] Figure 1 This is a top view showing an interracer to which the filament guiding device of the first embodiment is applicable.
[0020] Figure 2 It is shown Figure 1 Right view of a cross-weaving machine.
[0021] Figure 3 yes Figure 2 Sectional view with arrows along line III-III.
[0022] Figure 4 It is shown in individual units Figure 3 The rear view of the retaining layer.
[0023] Figure 5 It is shown in individual units Figure 3 Rear view of the spring layer.
[0024] Figure 6 yes Figure 3 Enlarged view of section VI.
[0025] Figure 7 This is a cross-sectional view showing the main part of the filament guiding device according to the second embodiment.
[0026] Figure 8 It is shown in individual units Figure 7 Rear view of the spring layer.
[0027] Figure 9 yes Figure 7 Enlarged view of section IX.
[0028] Figure 10 This is a front view showing the filament guiding device according to the third embodiment.
[0029] Figure 11 It is shown in individual units Figure 10 Maintain the main view of the layer.
[0030] Figure 12 It is shown in individual units Figure 10 The front view of the spring layer.
[0031] Figure 13 It is shown Figure 10 Right view of the filament guiding device.
[0032] Explanation of reference numerals in the attached figures 10 Filament Guiding Device 10A filament guiding device 11 Base components (layered assemblies) 11A Fasteners 12 spring layers 12A cantilever beam, 12B extension 12C contact section 13 Retention Layer 13A First Positioning Section 14. Stamping section (groove) 14A One edge part, 14B The other edge, 14C Second Positioning Section 14D insertion space, 20 Guiding Department 20A connection part, 20B clamping groove 20C slit 21 First card combination part, 21A front-end section, 21B root portion, 21C First Grip, 22 Second card combination part, 22A front-end section, 22B root portion, 22C Second Grip, 30 filament guiding device 31 Base element (layered assembly) 32 spring layers 32A cantilever beam, 32B extension 32C contact section 32D guidance unit 34. Stamping process (groove) 34A One edge part, 34B on the other side of the edge, 34C Second Positioning Section 34D insertion space, 40 filament guiding device 41 base components, 41A Fasteners 42 spring layers 42A cantilever beam, 42B extension 42C contact section 43 Retention Layer 43A First Positioning Section 44 Stamping Processing Department 44A Marginal Section (One Marginal Section, the Other Marginal Section) 44D insertion space, 50 Guiding Department 50C through hole, 51 cylindrical body 51C flange, 90 interlaced spinning machine 90A main body, 90B interleaved guide 91 long filament bundles. Detailed Implementation
[0033] Hereinafter, embodiments of the present invention will be described using the accompanying drawings. In the following description, the directions “front,” “rear,” “left,” and “right” are defined as the front side (downstream side) of the filament or filament bundle being guided by the filament guiding device.
[0034] <First Implementation> First, use Figures 1 to 6 The structure of the filament guiding device 10 and the filament guiding device 10A of the first embodiment will be explained. Figure 1 as well as Figure 2 As shown, the filament guiding device 10 and the filament guiding device 10A are respectively installed on the cross-weaving machine 90.
[0035] The interlacing spinning machine 90 is a device that simultaneously arranges interlaced portions (not shown) of filaments side by side on each of multiple bundles (32 bundles in this embodiment) of filament bundles 91. The interlacing spinning machine 90 has a main body 90A in a generally rectangular shape and multiple (16 in this embodiment) interlacing guides 90B located on the upper surface of the main body 90A and arranged in the left-right direction.
[0036] In each of the interlacing guides 90B, two filament bundles 91 pass through each other without interfering with each other's travel paths. The main body 90A sprays air onto the filament bundles 91 passing through each interlacing guide 90B through built-in interlacing processing nozzles (not shown), creating interlacing portions (not shown) on these filament bundles 91. This processing is carried out as each filament bundle 91 travels from rear to front.
[0037] The filament guide device 10 is fixed to the front surface of the main body 90A with screws, and the filament guide device 10A is fixed to the rear surface of the main body 90A with screws. The number of guide parts 20, which is the same as the number of filament bundles 91 processed simultaneously by the interlaced spinning machine 90 (32 in this embodiment), are respectively installed on the filament guide device 10 and the filament guide device 10A in an installation state arranged in a row in one direction (left-right direction).
[0038] Each guide portion 20 installed in the filament guiding device 10A passes through a bundle of filaments 91, thereby guiding the filament bundle 91 toward the interlacing guide 90B. Each guide portion 20 installed in the filament guiding device 10 guides each bundle of filaments 91, which has an interlacing portion (not shown), through the interlacing guide 90B one bundle at a time, thereby guiding the filament bundle 91 toward a spinning device (not shown). In other words, the filament guiding device 10 and the filament guiding device 10A guide each bundle of multiple filament bundles 91 through the installed guide portions 20.
[0039] The filament guide device 10 and the filament guide device 10A are identical in structure, except that they are installed with their orientations rotated 180° to correspond to the fact that the filament guide device 10 is used in the front and the filament guide device 10A is used in the rear. Therefore, in the following description, the filament guide device 10 used in the front and the filament guide device 10A used in the rear will be described in detail only by referring to the description of the filament guide device 10 used in the front. Moreover, the detailed description of the filament guide device 10A used in the rear will be omitted.
[0040] like Figure 3 As shown, the filament guiding device 10 has: a base element 11 in the shape of a generally rectangular plate; a stamping part 14 formed by stamping a portion of the base element 11 in the plate thickness direction (front and back direction); and a guiding part 20 mounted on the stamping part 14.
[0041] like Figure 2 As shown, the base element 11 is secured to the rigid retaining layer 13 (see reference 11A) by fasteners 11A. Figure 4 ) and spring layer 12 made of spring material (see reference) Figure 5A stacked assembly formed by fastening and layering. The retaining layer 13 is made of sheet metal of stainless steel with a specified thickness, for example, and is disposed on the opposite side of the main body 90A of the interlacing weaving machine 90 in the base element 11. The spring layer 12 is made of sheet metal of stainless steel for springs, for example, thinner than the retaining layer 13, and is disposed on the side of the main body 90A of the interlacing weaving machine 90.
[0042] like Figure 3 As shown, the stamping part 14 is formed by a U-shaped slot carved into the upper side of the base element 11. In this embodiment, the stamping part 14 is formed by performing appropriately selected stamping processes (e.g., punching or piercing) on the retaining layer 13 and the spring layer 12 of the base element 11. Furthermore, the slots of the stamping parts 14, the same number as the number of guide parts 20 installed on the filament guide device 10 (32 in this embodiment), are arranged in a left-right direction along the upper side of the base element 11. Each of these stamping parts 14 is equipped with one guide part 20.
[0043] like Figure 6 As shown, in the U-groove (groove opening) of each stamping section 14, the right (one side) and left (the other side) groove walls extending upwards serve as one edge 14A and the other edge 14B facing each other, respectively. The interval between one edge 14A and the other edge 14B is set such that a guide 20 can be inserted in a detachable manner (see reference). Figure 3 The size of the stamping part 14 is such that a guide part 20 can be inserted into a slot, and the insertion space 14D for inserting the guide part 20 is provided between one edge 14A and the other edge 14B.
[0044] The guide portion 20 is a ceramic component referred to as a "slit guide". In this embodiment, the guide portion 20 is a structure in which the root portions 21B and 22B of a first engaging portion 21 and a second engaging portion 22 extending in parallel across a straight slit 20C are connected by a connecting portion 20A. The front portions 21A and 22A of the first engaging portion 21 and the second engaging portion 22 can be separated from each other, allowing the filament bundle 91 ( Figure 6 (Illustration omitted) It passes through the gap between its front end portions 21A and 22A and enters the slit 20C. In the guide portion 20 of this embodiment, the first engaging portion 21 and the second engaging portion 22 are straight and look like the English letter "U", so they are also called "U-shaped guide".
[0045] The guide portion 20 is inserted into the stamping part 14 with the front ends 21A and 22A of the first engaging portion 21 and the second engaging portion 22 facing upwards and the connecting portion 20A facing downwards (towards the bottom of the slot of the stamping part 14). At this time, the first engaging portion 21 engages with one edge 14A in a manner that extends along one edge 14A. The second engaging portion 22 engages with the other edge 14B in a manner that extends along the other edge 14B. Furthermore, the gap between the front ends 21A and 22A passing through the slit 20C opens upwards, thus maintaining a state where the filament bundle 91 can pass through this gap into the slit 20C (figure omitted).
[0046] Additionally, the connecting portion 20A is engaged with the groove wall near the bottom of the stamping section 14, where the groove width narrows due to the U-shaped groove. This structure is equivalent to the "second positioning portion" in this disclosure, and therefore, it is also referred to as the "second positioning portion 14C" below. The second positioning portion 14C abuts against the connecting portion 20A from the bottom side (lower side) of the groove opening of the stamping section 14, positioning the guide portion 20 in the vertical direction.
[0047] like Figure 1 as well as Figure 6 As shown, the first engaging portion 21 has two sides extending from the thickness direction of the base element 11 (see reference). Figure 1 The first clamping groove 21C clamps the retaining layer 13 and the spring layer 12 forming one edge portion 14A. Additionally, the second engaging portion 22 has a second clamping groove 22C that clamps the retaining layer 13 and the spring layer 12 forming the other edge portion 14B from both sides in the thickness direction of the base element 11. Furthermore, as... Figure 6 As shown, the connecting portion 20A has a clamping groove 20B, which clamps the retaining layer 13 and the spring layer 12, which are formed in the U-groove of the stamping part 14 from the bottom of the groove to the second positioning part 14C, from both sides of the thickness direction of the base element 11. These clamping grooves suppress the misalignment of the guide portion 20 as seen in the thickness direction of the base element 11. In the guide portion 20 of this embodiment, the first clamping groove 21C, the clamping groove 20B, and the second clamping groove 22C are connected in this order as a single unit.
[0048] In the retaining layer 13, the portion of the retaining layer 13 that constitutes the other edge 14B engages with the second engaging portion 22 of the guide portion 20 positioned by the second positioning portion 14C, and serves as a linear first positioning portion 13A. When the second engaging portion 22 of the guide portion 20 abuts from the side of the edge 14A (right side), the first positioning portion 13A positions the guide portion 20 in the left-right direction.
[0049] The spring layer 12 has a cantilever beam 12A formed by a portion constituting a side edge 14A within the spring layer 12. With at least a portion of the cantilever beam 12A inserted into the first clamping groove 21C, it applies force to the guide portion 20 inserted into the insertion space 14D towards the other side edge 14B (left side), causing the guide portion 20 to abut against the first positioning portion 13A. Conversely, the first positioning portion 13A positions the guide portion 20 in the left-right direction.
[0050] In this embodiment, the cantilever beam 12A is arranged in the left-right direction along the upper side of the base element 11 (see reference). Figure 3 Each of these cantilever beams 12A forms one for each of the multiple stamping sections 14 (grooves). These cantilever beams 12A apply force to the guide section 20 installed in the corresponding stamping section 14 (groove).
[0051] In the structure of cantilever beam 12A, the main reference is on one side. Figure 6 To be further explained in more detail. The cantilever beam 12A has an extension 12B extending upward from the bottom side of the U-groove of the stamping section 14 along one edge 14A, and an abutment portion 12C provided at the front end of the extension 12B. When viewed from a rear view, the abutment portion 12C has an arc shape extending in a clockwise direction and extends towards the other edge 14B (left side) than the extension 12B. In this embodiment, the various structures of the cantilever beam 12A are integrally formed by stamping (e.g., punching or piercing) applied to the spring layer 12.
[0052] Under the natural state where no external force is applied to the cantilever beam 12A (refer to...) Figure 6 Under the imaginary line, the abutment portion 12C extends to the other edge portion 14B (left side) to the extent that the insertion space 14D, in which the guide portion 20 is inserted, becomes locally narrower. Therefore, the guide portion 20, inserted into the insertion space 14D, pushes the abutment portion 12C towards the edge portion 14A (right side) through its first engaging portion 21. The force (external force) of the guide portion 20 pushing the abutment portion 12C is transmitted to the extension portion 12B, bending the extension portion 12B towards the edge portion 14A (right side).
[0053] The extension 12B is a cantilever beam structure made of spring material, thus functioning as a cantilever spring that provides spring elasticity to move the abutment 12C toward the other side 14B (left side). Through the spring elasticity of this cantilever spring, the abutment 12C abuts against the first engaging portion 21 of the guide portion 20 (more specifically, the bottom of the first clamping groove 21C) from the side of one side 14A (right side).
[0054] Furthermore, in this embodiment, the extension 12B is formed to be approximately half the length of the first engaging portion 21. Therefore, the abutment portion 12C, located at the front end of the extension 12B, is positioned in the slot of the stamping portion 14 as if being pulled towards the bottom (lower side) from its opening. Additionally, the abutment portion 12C abuts against the middle position between the front end portion 21A and the root portion 21B of the first engaging portion 21.
[0055] Furthermore, the extension 12B, via the abutment portion 12C, applies a reaction force (external force) to the guide portion 20, which is pushed against the abutment portion 12C. This force pushes the second engaging portion 22 of the guide portion 20 against the first positioning portion 13A of the retaining layer 13. The first positioning portion 13A of the retaining layer 13 positions the guide portion 20 in the left-right direction and maintains it in the mounting state where the guide portion 20 is installed in the stamping part 14.
[0056] According to the filament guiding device 10 described above, the guiding part 20 can abut against the first positioning part 13A of the retaining layer 13 by the force of the cantilever beam 12A, and is held in the installed state by the retaining layer 13. Therefore, by applying an external force that overcomes the force of the cantilever beam 12A, the guiding part 20 can be separated from the stamping part 14 of the base element 11. Therefore, according to the filament guiding device 10, only the guiding part 20 that guides the filament bundle 91 can be replaced independently.
[0057] Furthermore, according to the filament guiding device 10, the guide portion 20 in the installed state can abut against the first positioning portion 13A of the retaining layer 13 by the force of the cantilever beam 12A, and be positioned by the first positioning portion 13A. Therefore, the guide portion 20 is not affected by its dimensional deviation, and is positioned with the first positioning portion 13A of the retaining layer 13 as a reference. Therefore, according to the filament guiding device 10, misalignment of the guide portion 20 in the filament guiding device 10 can be suppressed.
[0058] Furthermore, according to the filament guiding device 10, the cantilever beam 12A formed on the spring layer 12 made of spring material functions as a cantilever spring, thereby enabling the cantilever beam 12A to exert a force on the guiding part 20.
[0059] Furthermore, according to the filament guiding device 10, the second positioning portion 14C of the slot in the stamping section 14 can position the guide portion 20 in a vertical direction different from the force exerted by the extension portion 12B (the force in the left-right direction that pushes the second engaging portion 22 of the guide portion 20 against the first positioning portion 13A of the stamping section 14). Additionally, the force of the extension portion 12B is applied to the middle position of the abutting portion 12C of the guide portion 20 against the first engaging portion 21. Therefore, compared to the case where the abutting portion 12C abuts against the front end portion 21A or the root portion 21B of the first engaging portion 21, the tilting of the guide portion 20 relative to the slot in the stamping section 14 is suppressed. Therefore, according to the filament guiding device 10, misalignment of the guide portion 20 in the filament guiding device can be further suppressed.
[0060] Furthermore, according to the filament guiding device 10, each of the multiple guide portions 20 installed in the stamping section 14 (groove) is independently stressed by a separate cantilever beam 12A. Therefore, when an external force is applied to the guide portion 20 to separate it from the stamping section 14 (groove) of the base element 11, this external force acts on the cantilever beam 12A, which applies force to guide portions 20 other than the separated guide portion 20, reducing the possibility that the force applied by the cantilever beam 12A to the guide portion 20 may become less forceful.
[0061] Furthermore, according to the filament guiding device 10, the guiding portion 20 clamps the retaining layer 13 and the spring layer 12 through its first clamping groove 21C and second clamping groove 22C, suppressing the misalignment observed in the thickness direction of the base element 11. Additionally, the cantilever beam 12A applies force to the guiding portion 20 with at least a portion inserted into the first clamping groove 21C, thus limiting the deflection of the base element 11 in the thickness direction by the first clamping groove 21C. Therefore, according to the filament guiding device 10, the possibility that the force of the cantilever beam 12A deviates in the thickness direction of the base element 11, making it impossible to properly apply force to the guiding portion 20 towards the other edge 14B side (left side), can be reduced.
[0062] Furthermore, according to the filament guiding device 10, the guiding part 20, in its installed state with the stamping part 14 mounted on the base element 11, pushes against the first positioning part 13A of the retaining layer 13. Therefore, according to the filament guiding device 10, misalignment movement of the guiding part 20 relative to the base element 11 caused by vibration or the like (so-called "fretting wear") can be suppressed. Moreover, damage (specifically wear, fatigue, corrosion, etc.) suffered by the base element 11 or the guiding part 20 due to this misalignment movement can be suppressed.
[0063] <Second Implementation> Next, use Figures 7 to 9The structure of the filament guiding device 30 according to the second embodiment will be described. The filament guiding device 30 of the second embodiment is an embodiment that modifies some components of the filament guiding device 10 of the first embodiment. Therefore, for components or structures that are common to the structure described above as appearing in the description of the filament guiding device 10, reference numerals that are the same as those used for these components or components will be used. In addition, for common structures related to components that are modified in the filament guiding device 30 of the second embodiment, reference numerals that are larger than the reference numerals used for the structures described in the description of the filament guiding device 10 will be used. Moreover, detailed descriptions of these components or structures will be omitted.
[0064] like Figure 7 As shown, the filament guiding device 30 has a base element 31 composed of a stacked assembly of a retaining layer 13 and a spring layer 32, instead of the base element 11 composed of a stacked assembly of a retaining layer 13 and a spring layer 12 (see reference). Figure 3 ).like Figure 8 As shown, the spring layer 32 has a cantilever beam 32A with an abutment portion 32C disposed in the middle portion, instead of a cantilever beam 12A formed with the abutment portion 12C in the spring layer 12 as the front end (see reference). Figure 3 ).
[0065] like Figure 9 As shown, the cantilever beam 32A has a straight guide portion 32D extending upward from the abutment portion 32C located at the upper end of the extension 32B along a side edge 34A. The structure of the extension 32B and the abutment portion 32C is similar to that of the extension 12B and the abutment portion 12C in the spring layer 12 of the first embodiment (see reference). Figure 6 Since they are the same, a detailed description is omitted.
[0066] In its natural state without any external force applied to the cantilever beam 32A (refer to...) Figure 9 Below the imaginary line, the guide portion 32D extends in a state inclined towards the other edge portion 34B (left side). Therefore, in the natural state described above, the upper part of the insertion space 34D into which the guide portion 20 in the stamping part 34 is inserted narrows. Therefore, the guide portion 20, which is inserted into the insertion space 34D, pushes the guide portion 32D towards the edge portion 14A (right side) through its first engaging portion 21. The force (external force) of the guide portion 20 pushing the guide portion 32D is transmitted to the extension portion 32B, bending the extension portion 32B towards the edge portion 34A (right side). As a result, the abutment portion 32C provided at the upper end of the extension portion 32B is slightly pulled towards the edge portion 14A (right side) (illustration omitted).
[0067] Subsequently, if the guide portion 20 is inserted further, the first engaging portion 21 pushes the abutting portion 32C toward one edge portion 14A (right side), thereby further bending the extension portion 32B. At this time, the guide portion 32D is pulled toward one edge portion 14A (right side), so the force of the extension portion 12B is only applied to the guide portion 20 via the abutting portion 32C.
[0068] The guide unit 20 is positioned vertically by the second positioning unit 34C (see reference). Figure 9 In the solid line (hereinafter also referred to as the "upper and lower positioning state"), the guide part 32D separates from the bottom of the first clamping groove 21C, but does not completely disengage from the first clamping groove 21C. That is, in the upper and lower positioning state, the cantilever beam 32A at least partially blocks the first clamping groove 21C of the guide part 20 through the guide part 32D. This cantilever beam 32A is not the right end of the cantilever beam 32A in a left-right arrangement (refer to...). Figure 7 In the case of cantilever beam 32A, guide portion 32D enters the second clamping groove 22C of guide portion 20 installed at the adjacent stamping section 34 on the right (see reference). Figure 9 That is, in the vertical positioning state, the cantilever beam 32A blocks at least partially the second clamping groove 22C of the guide part 20 through the guide part 32D.
[0069] also, Figure 9 In the diagram, the upper end of the guide portion 32D of the cantilever beam 32A is depicted in a vertically positioned state, pulled in slightly below the front ends 21A and 22A of the first engaging portion 21 and the second engaging portion 22. However, the guide portion 32D of the cantilever beam 32A can be pulled in further below the position shown in the diagram, or its vertical position can be the same as the front ends 21A and 22A, or it can protrude further upward than the front ends 21A and 22A.
[0070] When the filament bundle 91 passes through the gap between the front end portions 21A and 22A and enters the slit 20C (not shown) of the guide portions 20 arranged in the left-right direction, the filament bundle 91 may mistakenly enter between the left and right guide portions 20. To address this, according to the filament guiding device 30 described above, the space between the first clamping groove 21C of the left guide portion 20 and the second clamping groove 22C of the right guide portion 20 between adjacent left and right guide portions 20 is at least partially blocked by the guide portion 32D. Therefore, according to the filament guiding device 30, the possibility of the filament bundle 91 mistakenly entering between the left and right guide portions 20 can be reduced.
[0071] Furthermore, in the structure where the abutment portion 32C, which partially narrows the insertion space 34D into which the guide portion 20 is inserted, is located at a position where it is pulled towards the bottom (lower side) from the opening of the slot in the stamping portion 34 (see reference). Figure 9In this process, the guide portion 20 may be stuck by the abutment portion 32C during insertion. In response, according to the filament guiding device 30 described above, by pushing the guide portion 32D with the guide portion 20, the abutment portion 32C is pulled towards the edge portion 14A (right side), thereby reducing the possibility that the guide portion 20 may be stuck by the abutment portion 32C.
[0072] Moreover, according to the filament guiding device 30, the same effects as those described above can be enjoyed as those of the filament guiding device 10 of the first embodiment.
[0073] <Third Implementation> Next, use Figures 10 to 13 The structure of the filament guiding device 40 in the third embodiment will be explained. The filament guiding device 40 can be installed on a cross-weaving machine (figure omitted) where the filaments of a bundle of filaments are interlaced.
[0074] like Figure 10 as well as Figure 13 As shown, the filament guiding device 40 has a generally rectangular plate-shaped base element 41, a stamping part 44 formed by stamping a portion of the base element 41 in the thickness direction, and a guiding part 50 mounted on the stamping part 44.
[0075] Regarding the base element 41, it is positioned so that its plate surface faces the front-to-back direction and its short rectangular side faces the top-to-bottom direction. The base element 41 is secured to the rigid retaining layer 43 (see reference 41A) by fasteners 41A. Figure 11 ) and spring layer 42 made of spring material (see reference) Figure 12 A stacked assembly formed by fastening and layering. The retaining layer 43 is made of sheet metal of stainless steel with a specified thickness, for example, and is disposed at the rear side of the base element 41. The spring layer 42 is made of sheet metal of stainless steel for springs, for example, thinner than the retaining layer 43, and is disposed at the front side of the base element 41.
[0076] The stamping section 44 is formed by a circular through hole opened by performing a suitably selected stamping process (e.g., punching or piercing) on the upper part of the plate surface of the base element 41. The edge 44A of the stamping section 44 is a structure in which any part of the edge 44A faces each other. Therefore, the edge 44A corresponds to both "one edge" and "the other edge" in this disclosure. The opening provided between the facing edges 44A in the stamping section 44 serves as an insertion space 44D of a size that allows a guide 50 to be inserted in a removable manner.
[0077] The guide portion 50 is a component made of ceramic and is referred to as an "eyelet guide". In this embodiment, the guide portion 50 is structured such that a flange 51C extending radially outward from one end of a cylindrical body 51 through which a through hole 50C through which a long filament bundle (not shown) passes is provided.
[0078] The guide portion 50 is inserted into the insertion space 44D of the stamping part 44 from the rear side (the side of the retaining layer 43) with its through hole 50C facing the front-rear direction and its flange 51C facing the rear. At this time, the outer peripheral surface of the cylindrical body 51 engages with the edge 44A of the stamping part 44. In addition, the flange 51C hooks from the rear side onto the portion of the retaining layer 43 that forms the edge 44A of the stamping part 44, positioning the guide portion 50 in the front-rear direction. Thus, in the installed state where it is mounted on the stamping part 44 and held by the retaining layer 43, the guide portion 50 guides the long filament bundle (not shown) passing through the through hole 50C in the front-rear direction.
[0079] In the retaining layer 43, a plurality of first positioning portions 43A are provided along the edge 44A of the stamping part 44. When the first positioning portion 43A abuts against the cylindrical body 51 of the guide portion 50 from the edge 44A side (one edge side) facing the first positioning portion 43A, the guide portion 50 is positioned in the abutment direction. In this embodiment, as... Figure 11 As shown, in the portion of the retaining layer 43 that forms the edge portion 44A of the stamping part 44, one first positioning portion 43A is provided on the upper side, lower side, left side and right side.
[0080] like Figure 10 As shown, the spring layer 42 has a cantilever beam 42A, which is formed in the portion of the spring layer 42 that forms the edge portion 44A and faces each of the first positioning portions 43A (equivalent to the "part forming one edge portion" in this disclosure). In this embodiment, one cantilever beam 42A is provided in each of the lower, upper, right, and left portions of the edge portion 44A of the stamping part 44 that faces each of the first positioning portions 43A.
[0081] The cantilever beam 42A has an edge 44A along the stamping section 44, on one side of the circumferential direction of the edge 44A. Figure 10 The extension portion 42B extends in a clockwise direction and the abutment portion 42C is provided at the front end of the extension portion 42B.
[0082] The abutment portion 42C, viewed from the main viewing angle, has an arc shape extending clockwise, protruding from the extension portion 42B toward the central side of the insertion space 44D (the side of the opposing first positioning portion 43A, and the other edge side). The extent of this protrusion is such that, in its natural state without external force applied to the cantilever beam 42A (refer to...). Figure 10 The guide portion 50 is inserted into the insertion space 44D to a degree that narrows locally under the imaginary line. Therefore, the guide portion 50, inserted into the insertion space 44D, pushes the abutment portion 42C towards the outer periphery of the insertion space 44D (the side extending from the cantilever beam 42A, the edge side) through its cylindrical body 51. The force (external force) of the guide portion 50 pushing the abutment portion 42C is transmitted to the extension portion 42B, bending the extension portion 42B towards the outer periphery of the insertion space 44D.
[0083] The extension 42B is a cantilever beam structure made of spring material, thus functioning as a cantilever spring that moves the abutment 42C toward the center side (the side of the opposing first positioning part 43A, and the other edge side) of the insertion space 44D. Through the elasticity of this cantilever spring, the abutment 42C abuts against the cylindrical body 51 of the guide part 50 from the outer periphery (one edge side) of the insertion space 44D extending from the cantilever beam 42A.
[0084] Furthermore, the extension 42B, via the abutment portion 42C, applies a reaction force (external force) to the guide portion 50, which acts as a pusher on the abutment portion 42C. This force pushes the cylindrical body 51 of the guide portion 50 against the first positioning portion 43A on the opposite side. In other words, the extension 42B of the cantilever beam 42A applies force to the cylindrical body 51 of the guide portion 50, which is inserted into the insertion space 44D, against the first positioning portion 43A (the other edge side), causing the cylindrical body 51 of the guide portion 50 to abut against the first positioning portion 43A.
[0085] In response, the first positioning part 43A of the retaining layer 43 positions the guide part 50 in the abutment direction where the cylindrical body 51 is pushed (in this embodiment, the up-down direction or the left-right direction), and maintains the guide part 50 in the installation state of the stamping part 44.
[0086] According to the filament guiding device 40 described above, the same effects as those of the filament guiding device 10 in the first embodiment can be enjoyed.
[0087] Furthermore, according to the filament guiding device 40, by providing a plurality of first positioning portions 43A and a cantilever beam 42A along the edge portion 44A of the stamping processing portion 44, the guiding portion 50 can be positioned in a two-dimensional direction that expands the plate surface of the base element 41.
[0088] The embodiments of this disclosure have been described above through the first to third embodiments. However, it will be apparent to those skilled in the art that various substitutions, modifications, and variations can be made without departing from the purpose of this disclosure. That is, the embodiments of this disclosure include all substitutions, modifications, and variations that do not depart from the spirit and purpose of the appended claims. For example, as embodiments of this disclosure, it can be implemented in various ways as follows.
[0089] (1) The application of this disclosure is not limited to filament guiding devices used in interlacing spinning machines that provide the interlacing portion of filament bundles, but can be various processing devices that perform arbitrary processing on filaments. Examples of processing devices include migration processing nozzles that disperse oil adhering to the filaments to the entire filament, and filament separating devices that separate a small number of filament bundles or a single filament from the filament bundle. In cases where the processing device is used to process only a single filament, the filament guiding device can also be a device that guides only a single filament.
[0090] (2) In this disclosure, the laminated assembly of the base element is not limited to a two-layer structure consisting of a retaining layer and a spring layer, but can also be a multi-layer structure consisting of three or more layers. Examples of such structures include, for instance, the retaining layer or the spring layer itself may comprise a structure consisting of multiple laminated assemblies. Furthermore, the above examples include a laminated assembly in which the retaining layer and the spring layer are bonded together by an adhesive layer (specifically, for example, double-sided tape or adhesive) and the adhesive layer is added to the base element. Additionally, the above examples include a laminated assembly in which each component laminated to the base element or the base element itself is coated, and the coating layer is added to the base element.
[0091] (3) In the first or second embodiment described above, the second positioning part that positions the guide part in the vertical direction is not limited to the part where the groove width of the stamping part narrows, but may be the bottom of the groove.
[0092] (4) In the first or second embodiment described above, the first clamping groove and the second clamping groove that clamp one edge and the other edge from both sides in the thickness direction of the base element are not limited to a structure connected as one piece, but can also be a structure with slits at appropriately set positions. When the first clamping groove has slits, a part of the cantilever beam can be exposed at the slit portion.
Claims
1. A filament guiding device for guiding filaments or filament bundles, wherein, have: Plate-shaped base element, The stamping part is obtained by stamping a portion of the base element in the thickness direction. The guide portion, in the installed state where it is mounted on the stamping part, guides the filament or the filament bundle; The base element is a laminated assembly consisting of multiple layers, including a rigid retaining layer and a spring layer. The retaining layer holds the guide portion in the installed state, and the spring layer is made of a spring material. The stamping part has a structure in which an insertion space is provided between two opposing edges for the guide part to be inserted. The spring layer has a cantilever beam formed in the portion constituting the one edge portion of the spring layer. The retaining layer has a first positioning portion that positions the guide portion when it abuts against a portion of the retaining layer forming the other edge from one edge side. The cantilever beam applies force to the guide portion inserted into the insertion space on the other side edge, causing the guide portion to abut against the first positioning portion.
2. The filament guiding device according to claim 1, wherein, The cantilever beam has: The extension extends along one of the edges, and The abutting portion is configured to extend beyond the other edge of the extension portion and abut against the guide portion from the one edge side; By pushing the abutting portion toward the edge side through the guide portion inserted into the insertion space, the extension portion is bent toward the edge side.
3. The filament guiding device according to claim 2, wherein, The stamping part is formed by a slot of a size that can be inserted into the guide part, which is carved into the side of the base element. The guide portion has: The first engaging portion extends along one of the edges and engages with the edge. The second engaging portion extends along the other edge and engages with the other edge. The connecting portion is formed by the root portion, which serves as the bottom side of the slot, connecting the first engaging portion and the second engaging portion. A second positioning part is provided in the slot, which abuts against the connecting part from the bottom side of the slot to position the guide part. The abutting part abuts against the first engaging part at the midpoint between the front end and the root part. The extension applies a reaction force to the guide via the abutment portion as a response to the action from the guide portion, thereby pushing the second engaging portion of the guide portion against the first positioning portion and positioning the guide portion.
4. The filament guiding device according to claim 3, wherein, The plurality of slots are arranged along the side of the base element. Each of the plurality of slots is equipped with a guide portion. The cantilever beam forms one slot for each of the multiple slots, and applies force to the guide portion installed in the corresponding slot.
5. The filament guiding device according to any one of claims 1 to 4, wherein, The guide portion has: The first engaging portion extends along one of the edges and engages with the edge. The second engaging portion extends along the other edge and engages with the other edge; The first engaging portion has first clamping grooves that clamp the retaining layer and the spring layer constituting the one edge portion from both sides in the plate thickness direction. The second engaging portion has second clamping grooves that clamp the retaining layer and the spring layer constituting the other edge portion from both sides in the plate thickness direction. With at least a portion of the cantilever beam inserted into the first clamping groove, it applies force to the guide portion on the other edge side.
Citation Information
Patent Citations
Winding of carbon fiber bundles, method and device for separating bundles from winding
JP2002255448A