Sensor

Abstract

The sensor comprises a chip, a connecting part and a middle part, the middle component is provided with a hole, the connecting component is partially located in the hole, the connecting component is fixedly connected with the hole wall corresponding to the hole, and the middle component and the connecting component are insulated. The chip is connected with the middle part, the middle part is provided with a groove, and at least part of the chip is located in the groove. At least part of the chip is arranged in the groove, and the groove can protect at least part of the chip from being interfered by external pressure, so that the stability of connection between the chip and the intermediate component is improved.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and more particularly to a sensor. Background Technology

[0002] In related technologies, sensors include chips, connecting components, and intermediate components. The connecting components are electrically connected to the chips, the chips are connected to the intermediate components, and the connecting components are connected to the intermediate components. When the pressure in the detection environment is high, the connection between the chips and the intermediate components may become unstable due to excessive pressure. Summary of the Invention

[0003] Therefore, this application provides a sensor, which includes a chip, a connecting component, and an intermediate component; the intermediate component has a hole, the connecting component is partially located in the hole, the connecting component is fixedly connected to the hole wall corresponding to the hole, and the intermediate component is insulated from the connecting component; the chip is connected to the intermediate component, the intermediate component has a groove, and the chip is at least partially located in the groove.

[0004] The chip is located at least partially in a recess, which protects at least part of the chip from external pressure interference and improves the stability of the connection between the chip and intermediate components. Attached Figure Description

[0005] Figure 1 A three-dimensional schematic diagram of a sensor is provided for one embodiment of this application;

[0006] Figure 2 An exploded view of a sensor is provided for one embodiment of this application;

[0007] Figure 3 for Figure 2 Provides another angle diagram of the explosion from the sensor;

[0008] Figure 4 A cross-sectional schematic diagram of a sensor is provided for one embodiment of this application. Detailed Implementation

[0009] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0010] It should be understood that the described embodiments are only some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0011] The relevant sensor includes a chip 1, a connecting component 2, and an intermediate component 3. The connecting component 2 is electrically connected to the chip 1. Specifically, the chip 1 is connected to the intermediate component 3, and the connecting component 2 is connected to the intermediate component 3. When the pressure in the detection environment is high, the connection between the chip 1 and the intermediate component 3 may become unstable due to excessive pressure. Therefore, the sensor in this application includes a chip 1, a connecting component 2, and an intermediate component 3. The intermediate component 3 has a groove 31, and the chip 1 is at least partially located in the groove 31. This arrangement, where the chip 1 is at least partially located in the groove 31, protects part of the chip from external pressure interference when the pressure increases, thus improving the connection stability between the chip 1 and the intermediate component 3. Figure 1 and Figure 4 As shown, there is a gap between chip 1 and connecting component 2; the gap can reduce mutual interference between chip 1 and connecting component 2, such as electromagnetic field interference. The intermediate component 3 has a hole 32 that penetrates the intermediate component 3. The connecting component 2 is partially located in the hole 32. The connecting component 2 is fixedly connected to the hole wall corresponding to the hole 32. Chip 1 is connected to the intermediate component 3. The intermediate component 3 is insulated from the connecting component 2. The number of holes 32 and the number of connecting components 2 can be multiple. The number of holes 32 corresponds one-to-one with the number of connecting components 2.

[0012] In one implementation, such as Figure 1 As shown, the intermediate component 3 is made of insulating material, including alumina ceramic. In related sensors, the intermediate component 3 is generally made of semiconductor material, such as silicon. The insulating material improves the insulation between the intermediate component 3 and the connecting component 2, reduces electrical interference between them, and thus improves the sensor's detection accuracy. Alumina ceramic has advantages such as high mechanical stress, high insulation, and corrosion resistance, making it suitable for use in sensors. The connecting component 2 is a metal pin; the chip 1 includes either a pressure-sensitive sensing chip or a temperature-sensitive sensing chip.

[0013] To further improve the connection stability between chip 1 and intermediate component 3, in one embodiment, such as Figure 2As shown, the sensor includes an adhesive 4 located in the groove 31. The outer surface of the chip 1 is at least partially covered with the adhesive 4, which firmly bonds the intermediate component 3 to the chip 1. Further, the adhesive 4 inside the groove 31 is subjected to high-temperature curing treatment. In one embodiment, UV lamp curing can be selected to improve the curing efficiency of the adhesive 4. In another embodiment, the adhesive 4 is epoxy resin. Epoxy resin has high strength and toughness, making it suitable for use in sensors to improve the reliability of components in the sensor. At the same time, epoxy resin is also an insulating material, which improves the insulation and passivation effect between the chip 1 and the intermediate component 3, and can also improve the service life of the sensor. When the sensor works in different environments, the connection between the chip 1 and the intermediate component 3 will not be damaged due to the influence of the external environment, further improving the detection accuracy of the sensor.

[0014] Furthermore, in one embodiment, such as Figure 2 As shown, the intermediate component 3 includes a groove bottom 311, which is part of the wall of the groove 31. The adhesive 4 is spread all over the groove bottom 311. The adhesive 4 serves to prevent the intermediate component 3 from contacting the outside air and thus oxidizing, passivating and protecting the intermediate component 3, and improving the service life of the intermediate component 3.

[0015] The amount of adhesive 4 used is also crucial. In one embodiment, such as... Figure 2 As shown, the intermediate component 3 includes a top surface 33. Along the sensor height direction H, a groove 31 is formed by recessing along the top surface 33 towards the connecting component 2, and the adhesive 4 fills the groove 31.

[0016] To avoid affecting the sensor's detection accuracy, in one embodiment, the depth of the groove 31 along the sensor's height direction H is less than the height of the chip 1. For example, the depth of the groove 31 is 0.7–0.8 mm, and the height of the chip 1 is 0.85–0.95 mm.

[0017] In one implementation, such as Figure 4 As shown, the sensor includes a conductive part 8, which is electrically connected to the chip 1. Part of the conductive part 8 is located within the intermediate component 3, and it is electrically connected to the connecting component 2. In one embodiment, the conductive part 8 is a wire.

[0018] Specifically, in one implementation, such as Figure 3 As shown, the sensor includes pads 5, chip 1, and intermediate component 3, all of which are physically connected to pads 5. Chip 1 is electrically connected to pads 5, and pads 5 are electrically connected to conductive portion 8. In other words, conductive portion 8 is electrically connected to chip 1 via pads 5. To further improve the reliability of the electrical connection between conductive portion 8 and chip 1, in one embodiment, the surface of pads 5 at least partially includes a gold plating layer.

[0019] The specific steps for connecting chip 1 and intermediate component 3 are as follows: The sensor provides a first pad 51, which is connected to the intermediate component 3. A second pad 52 is provided, which is connected to the chip 1 electrically. The first pad 51 and the second pad 52 are connected by soldering.

[0020] Specifically, the first pad 51 is integrally formed with the intermediate component 3, and the first pad 51 is electrically connected to the chip 1. The adhesive 4 is located around the first pad 51. The sensor defines the plane perpendicular to the sensor height direction H as the projection plane. The orthographic projection of the first pad 51 onto the projection plane at least partially coincides with the orthographic projection of the second pad 52 onto the projection plane, and the second pad 52 is electrically connected to the first pad 51. For example... Figure 2 and Figure 3 As shown, the orthographic projection of the first pad 51 on the projection plane completely coincides with the orthographic projection of the second pad 52 on the projection plane. Specifically, there are four first pads 51 and four second pads 52, and the four first pads 51 and four second pads 52 are electrically connected in a one-to-one correspondence. The four first pads 51 are spaced more than 200 micrometers apart, and the four second pads 52 are spaced more than 200 micrometers apart.

[0021] Furthermore, in one embodiment, the surface of the first pad 51 is at least partially covered with a gold plating layer, and the surface of the second pad 52 is at least partially covered with a gold plating layer. The gold plating layer can improve the welding strength, improve the connection stability between the chip 1 and the intermediate component 3, and thus improve the reliability and detection accuracy of the sensor.

[0022] In one implementation, such as Figure 4 As shown, the sensor includes a metal ring 6, which is at least partially located within a hole 32. The metal ring 6 is connected to the wall of the hole 32, the connecting member 2 is electrically connected to the metal ring 6, and the metal ring 6 is electrically connected to the conductive part 8. The metal ring 6 improves the conductivity of the connecting member 2.

[0023] Furthermore, in one embodiment, such as Figure 2 As shown, the sensor includes a solder ball 7, which is at least partially located inside a metal ring 6. Both the connecting component 2 and the metal ring 6 are electrically connected to the solder ball 7. In order to passivate and protect the solder ball 7 without affecting its conductivity, in one embodiment, the adhesive 4 is partially connected to the solder ball 7.

[0024] In one embodiment, there is a gap between the solder ball 7 and the chip 1 in the vertical sensor height direction H to reduce the risk of electromagnetic interference.

[0025] In one embodiment, the sensor includes a circuit board, and the connecting component 2 is electrically connected to the circuit board so that the sensor can be used normally.

[0026] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A sensor, characterized in that, The sensor includes a chip (1), a connecting component (2), and an intermediate component (3); The intermediate component (3) has a hole (32), the connecting component (2) is partially located in the hole (32), the connecting component (2) is fixedly connected to the hole wall corresponding to the hole (32), and the intermediate component (3) and the connecting component (2) are insulated from each other; The chip (1) is connected to the intermediate component (3), the intermediate component (3) having a groove (31), and the chip (1) is at least partially located in the groove (31).

2. The sensor according to claim 1, characterized in that, The sensor includes an adhesive (4) located in the groove (31), and the outer surface of the chip (1) is at least partially covered with the adhesive (4), which is epoxy resin.

3. The sensor according to claim 2, characterized in that, The intermediate component (3) includes a groove bottom (311), which is part of the wall of the groove (31), and the adhesive (4) covers the groove bottom (311); Along the height direction of the sensor, the depth of the groove (31) is less than the height of the chip (1).

4. The sensor according to claim 2, characterized in that, The intermediate component (3) includes a top surface (33). Along the sensor height direction, the groove (31) is recessed along the top surface (33) towards the connecting component (2), and the adhesive (4) fills the groove (31).

5. The sensor according to claim 1, characterized in that, The intermediate component (3) is an insulating material, including alumina ceramic; the connecting component (2) is a metal pin; the chip (1) includes either a pressure-sensitive sensing chip or a temperature-sensitive sensing chip.

6. The sensor according to claim 1, characterized in that, The sensor includes a conductive part (8) which is electrically connected to the chip (1). The conductive part (8) is partially located inside the intermediate component (3) and is electrically connected to the connecting component (2).

7. The sensor according to claim 6, characterized in that, The sensor includes a pad (5). Along the height direction of the sensor, the pad (5) is located between the chip (1) and the intermediate component (3). The chip (1) and the intermediate component (3) are both physically connected to the pad (5). The chip (1) is electrically connected to the pad (5). The pad (5) is electrically connected to the conductive part (8).

8. The sensor according to claim 6, characterized in that, The sensor includes a metal ring (6), which is at least partially located inside the hole (32). The metal ring (6) is connected to the wall of the hole (32). The connecting member (2) is partially located inside the metal ring (6). The connecting member (2) is electrically connected to the metal ring (6). The metal ring (6) is electrically connected to the conductive part (8).

9. The sensor according to claim 8, characterized in that, The sensor includes solder balls (7), which are at least partially located within the metal ring (6). The connecting component (2) and the metal ring (6) are both electrically connected to the solder balls (7). The adhesive (4) is partially connected to the solder ball (7).

10. The sensor according to any one of claims 1-9, characterized in that, The sensor includes a circuit board, and the connecting component (2) is electrically connected to the circuit board.

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