Temperature control device and electronic equipment

Abstract

The embodiment of the invention discloses a temperature control device and electronic equipment, and belongs to the technical field of temperature control. The temperature control device is used for controlling the temperature of electronic equipment with a first heat source area and a second heat source area. The temperature control device comprises a control module, a temperature detection module, a refrigeration sheet, a first micropump and a first flow channel, the first micropump is arranged on the first flow channel, the first flow channel extends to pass through the first heat source area and / or the second heat source area, and the first flow channel extends to pass through the refrigeration sheet; the temperature detection module is electrically connected with the control module and used for detecting the first temperature of the first heat source area and / or the second temperature of the second heat source area. The control module is electrically connected with the first micropump and the refrigeration sheet and used for controlling the working states of the first micropump and the refrigeration sheet according to at least one of the working mode of the equipment, the first temperature and the second temperature. According to the embodiment of the invention, the temperature control effect of the electronic equipment can be improved.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and in particular to a temperature control device and electronic equipment. Background Technology

[0002] Temperature control is a crucial issue that cannot be ignored in electronic devices. Current temperature control solutions in electronic devices mainly focus on heat dissipation, including fan cooling, VC cooling (Vapor Chamber cooling technology), micro-pump cooling, etc. However, these temperature control solutions are limited by factors such as stacking space and heat conduction medium, resulting in limited temperature control effects.

[0003] Therefore, in order to avoid the impact of poor temperature control on the performance of electronic devices, how to further improve the temperature control effect of electronic devices is a technical problem that urgently needs to be solved. Summary of the Invention

[0004] This application provides a temperature control device and an electronic device, which aims to at least improve the temperature control effect of the electronic device.

[0005] In a first aspect, embodiments of this application provide a temperature control device for controlling the temperature of an equipment having a first heat source region and a second heat source region. The temperature control device includes: a control module, a temperature detection module, a cooling chip, a first micropump, and a first flow channel. The first micropump is disposed on the first flow channel, which extends through the first heat source region and / or the second heat source region, and extends through the cooling chip. The temperature detection module is electrically connected to the control module and is used to detect a first temperature of the first heat source region and / or a second temperature of the second heat source region. The control module is electrically connected to the first micropump and the cooling chip respectively and is used to control the operating state of the first micropump and the cooling chip according to at least one of the operating mode of the equipment, the first temperature, and the second temperature.

[0006] Secondly, embodiments of this application provide an electronic device, which includes the temperature control device described above.

[0007] In this embodiment, a temperature detection module detects the first temperature of the first heat source region and / or the second temperature of the second heat source region. Based on the device's operating mode, the first temperature, and the second temperature, the operating state of the first micro-pump and the cooling chip is controlled so that the fluid medium in the first flow channel flows through the cooling chip and then flows to the first heat source region and / or the second heat source region, thereby achieving temperature control of the electronic device and improving the temperature control effect of the electronic device. Attached Figure Description

[0008] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0009] Figure 1 This is a schematic diagram of the structure of a temperature control device provided in an embodiment of this application;

[0010] Figure 2 This is a schematic diagram of another temperature control device provided in the embodiments of this application;

[0011] Figure 3 This is a cross-sectional view of an electronic device used in a temperature control device according to an embodiment of this application, perpendicular to the screen direction;

[0012] Figure 4 This is a schematic diagram of the circuit structure of a temperature control device provided in an embodiment of this application;

[0013] Figure 5 This is a schematic diagram of the circuit structure of another temperature control device provided in the embodiments of this application;

[0014] Figure 6 This is a schematic diagram of the circuit structure of another temperature control device provided in the embodiments of this application;

[0015] Figure 7 This is a schematic diagram of the circuit structure of another temperature control device provided in the embodiments of this application. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0017] It should be understood that in the description of the embodiments of this application, the use of terms such as "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated. "At least one" means one or more, and "more" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can indicate the existence of A alone, the simultaneous existence of A and B, or the existence of B alone. A and B can be singular or plural. The character " / " generally indicates that the related objects before and after are in an "or" relationship. "At least one of the following" and similar expressions refer to any group of these items, including any group of singular or plural items. For example, at least one of a, b, and c can mean: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple.

[0018] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0019] This application provides a temperature control device for controlling the temperature of an electronic device having a first heat source region 1 and a second heat source region 2. See [link to relevant documentation]. Figure 1 , Figure 4 The temperature control device includes: a control module 8, a temperature detection module 13, a cooling element 5, a first micropump 3, and a first flow channel 4; the first micropump 3 is disposed on the first flow channel 4, the first flow channel 4 extends through the first heat source region 1 and / or the second heat source region 2, and the first flow channel 4 extends through the cooling element 5; the temperature detection module 13 is electrically connected to the control module 8 and is used to detect the first temperature of the first heat source region 1 and / or the second temperature of the second heat source region 2; the control module 8 is electrically connected to the first micropump 3 and the cooling element 5 respectively, and is used to control the working state of the first micropump 3 and the cooling element 5 according to at least one of the device's working mode, the first temperature, and the second temperature.

[0020] A device's operating mode refers to its performance state under different usage scenarios. In some implementations, the device's operating modes may include normal mode, standard charging mode, performance mode, and fast charging mode. Performance mode refers to the mode in which the device operates when playing videos, playing games, or performing tasks requiring large amounts of data processing, running complex applications, or engaging in highly computationally intensive tasks. Fast charging mode refers to the mode in which the device charges rapidly based on specific charging protocols and technical standards. Normal mode, corresponding to performance mode, can be a mode in which the device performs basic operations and information exchange without requiring complex configuration or calculations. Standard charging mode, corresponding to fast charging mode, can be a basic, relatively slow charging method.

[0021] In some implementations, the operating states of the cooling element may include preheating mode, cooling mode, freezing mode, and no-start mode. The cooling and freezing modes of the cooling element 5 both serve to lower the temperature. In these modes, the cooling element absorbs heat to achieve a cooling effect. The freezing mode provides a better cooling effect than the cooling mode, but the power consumption required by the cooling element 5 in freezing mode is higher than that in cooling mode. The preheating mode of the cooling element is for heating. In this mode, the cooling element releases heat to heat the device.

[0022] In some implementations, the operating state of the first micropump can refer to whether it is started or not, specifically including whether the first micropump is started or not.

[0023] In some implementations, the temperature control device can exist as a standalone unit, or it can be integrated with other functions of the electronic device, or it can be miniaturized and integrated onto a circuit board to become part of the electronic device, achieving precise temperature monitoring and control. The electronic device can be a mobile phone, tablet computer, laptop computer, super mobile personal computer, e-book reader, netbook, personal digital assistant, vehicle terminal, etc. In some exemplary implementations, the electronic device described in this embodiment of the invention will be described in detail using a mobile phone as an example.

[0024] In this embodiment, the temperature detection module 13 detects the first temperature of the first heat source region 1 and / or the second temperature of the second heat source region 2, and controls the working state of the first micro pump 3 and the cooling chip 5 according to the device's working mode, the first temperature, and the second temperature, so that the fluid medium in the first flow channel 4 flows through the cooling chip 5 and then flows to the first heat source region 1 and / or the second heat source region 2, thereby achieving temperature control of the electronic device and improving the temperature control effect of the electronic device.

[0025] In some implementations, the first heat source can be a battery, and the first heat source region 1 can be the location of the battery and the surrounding area.

[0026] In some implementations, the second heat source can be the motherboard, and the second heat source region 2 can be the location of the motherboard and the surrounding area.

[0027] Specifically, in some embodiments, the first micropump 3 is disposed on the first flow channel 4, which extends through the first heat source region 1 and the cooling chip 5; the temperature detection module 13 is electrically connected to the control module 8 and is used to detect the first temperature of the first heat source region 1; the control module 8 is electrically connected to both the first micropump 3 and the cooling chip 5 and is used to control the operating state of the first micropump 3 and the cooling chip 5 according to the first temperature, or, according to the first temperature and the operating state of the device. This embodiment can achieve fine control of the temperature of the first heat source region 1, effectively improving the temperature control effect of the device.

[0028] In some embodiments, the first micropump 3 is disposed on the first flow channel 4, which extends through the second heat source region 2 and the cooling chip 5. The temperature detection module 13 is electrically connected to the control module 8 and is used to detect the second temperature of the second heat source region 2. The control module 8 is electrically connected to both the first micropump 3 and the cooling chip 5 and is used to control the operating state of the first micropump 3 and the cooling chip 5 according to the second temperature. Alternatively, the control module 8 can control the operating state of the first micropump 3 and the cooling chip 5 according to the second temperature and the operating state of the device. This embodiment can achieve fine control of the temperature of the first heat source region 2, effectively improving the temperature control effect of the device.

[0029] In some implementations, see Figure 1 A first micropump 3 is disposed on a first flow channel 4, which extends through a first heat source region 1 and a second heat source region 2, and also extends through a cooling element 5. A temperature detection module 13 is electrically connected to a control module 8 and is used to detect a first temperature in the first heat source region 1 and a second temperature in the second heat source region 2. The control module 8 is electrically connected to both the first micropump 3 and the cooling element 5. The control module 8 is used to control the operating state of the first micropump 3 and the cooling element 5 according to the device's operating mode, or, according to the first and second temperatures, or, according to the device's operating mode, the first temperature, and the second temperature. This embodiment can achieve fine-grained control of the temperature of the first heat source region 1 and the second heat source region 2, effectively improving the temperature control effect of the device.

[0030] In some embodiments, the temperature control device further includes a second micropump 6 and a second flow channel 7; the second micropump 6 is disposed on the second flow channel 7, which extends through the first heat source region 1 and / or the second heat source region 2; the control module 8 is also electrically connected to the second micropump 6 and is used to control the operating state of the second micropump 6 according to at least one of the device's operating mode, a first temperature, and a second temperature. By adding the second micropump 6 and the second flow channel 7, more precise temperature control and faster temperature transfer can be achieved in the electronic device, further improving the temperature control effect.

[0031] In some embodiments, the first flow channel 4 and the second flow channel 7 extend through the first heat source region 1 and the second heat source region 2, respectively, thereby enabling independent temperature control for specific heat source regions and improving the accuracy of temperature control; in some embodiments, see Figure 1 , Figure 2 The first flow channel 4 and the second flow channel 7 can extend through the first heat source region 1 and the second heat source region 2 simultaneously, thereby enabling joint temperature control of multiple heat source regions of electronic equipment and improving the utilization rate of the cooling chip 5.

[0032] Specifically, in some embodiments, the second micropump 6 is disposed on the second flow channel 7, which extends through the first heat source region 1. The control module 8 is also electrically connected to the second micropump 6 and is used to control the operating state of the second micropump 6 according to the operating mode of the device, or, the control module 8 is used to control the operating state of the second micropump 6 according to a first temperature, or, the control module 8 is used to control the operating state of the second micropump 6 according to the first temperature and the operating mode of the device. This embodiment, by adding the second micropump 6 and the second flow channel 7, can further improve the temperature control effect of the first heat source region 1.

[0033] In some embodiments, the second micropump 6 is disposed on the second flow channel 7, which extends through the second heat source region 2. The control module 8 is also electrically connected to the second micropump 6 and is used to control the operating state of the second micropump 6 according to the operating mode of the device; or, the control module 8 is used to control the operating state of the second micropump 6 according to a second temperature; or, the control module 8 is used to control the operating state of the second micropump 6 according to both the second temperature and the operating mode of the device. This embodiment, by adding the second micropump 6 and the second flow channel 7, can further improve the temperature control effect of the second heat source region 2.

[0034] In some implementations, see Figure 2A second micropump 6 is disposed on a second flow channel 7, which extends through the first heat source region 1 and the second heat source region 2. A control module 8 is also electrically connected to the second micropump 6. The control module 8 is used to control the operating state of the second micropump 6 according to the device's operating mode, or according to a first temperature and a second temperature, or according to the first temperature, the second temperature, and the device's operating mode. This embodiment, by adding a second micropump 6 and a second flow channel 7, can further improve the temperature control effect of the first heat source region 1 and the second heat source region 2.

[0035] In some implementations, the number of micropumps can be increased as needed to achieve better flow rate and temperature control.

[0036] In some embodiments, the cooling chip 5 can be disposed in a region other than the first heat source region 1 and the second heat source region 2, and the temperature of the cooling chip 5 can be transferred to the first heat source region 1 and / or the second heat source region 2 through the first flow channel 4 and / or the second flow channel 7, avoiding encroachment on the space of the first heat source region 1 and the second heat source region 2 and optimizing the internal spatial layout of the electronic device. In some embodiments, see [link to relevant documentation]. Figure 1 , Figure 2 At least a portion of the cooling element 5 can be located in the first heat source region 1 and / or the second heat source region 2, so that the temperature of the cooling element 5 can be directly transferred to the first heat source region 1 and / or the second heat source region 2 without passing through the flow channel, thereby improving the working efficiency of the cooling element 5.

[0037] In some embodiments, the control module 8 includes a preset mapping table, which represents the mapping relationship between preset device operating modes and / or preset temperature ranges and preset micropump operating modes and preset cooling chip 5 operating states. Based on the detected device operating mode, first temperature, and second temperature, the preset temperature range corresponding to the first temperature and second temperature, as well as the preset device operating mode corresponding to the device operating mode, are searched in the preset mapping table. This allows the operating states of the micropump and cooling chip 5 to be determined based on the current device temperature, operating mode, and preset mapping table, thereby accurately controlling the temperature of the electronic device.

[0038] Specifically, as shown in the examples in Tables 1 and 2, the preset mapping table contains the mapping relationship between the preset device working mode and the preset micro pump working mode and the preset cooling chip 5 working state. By detecting the current working mode of the device, the corresponding preset device working mode is found in the preset mapping table, and the working mode of the micro pump and the working state of the cooling chip 5 are controlled based on the preset micro pump working mode and the preset cooling chip 5 working state corresponding to the preset device working mode.

[0039] Preset device working mode Cooler working status First micropump operating status Normal mode / Standard charging mode Do not start start up Performance Mode Cooling mode start up Fast charging mode Frozen Mode start up

[0040] Table 1: Preset mapping representation of temperature control device including first micropump Example 1

[0041] Preset device working mode Cooler operating status First micropump operating status Second micropump operating status Normal mode / Standard charging mode Do not start start up start up Performance Mode Cooling mode start up Do not start Fast charging mode Frozen Mode start up Do not start

[0042] Table 2: Example 2: Preset mapping representation of temperature control device including first micropump and second micropump

[0043] Referring to the examples in Tables 3 and 4, the preset mapping table contains the mapping relationship between preset temperature ranges and preset micropump working modes and preset cooling chip 5 working states. By detecting the current first temperature or second temperature of the device, the preset temperature range in which the current first temperature or second temperature is located is found in the preset mapping table, and the working mode of the micropump and the working state of the cooling chip 5 are controlled based on the preset temperature range corresponding to the preset micropump working mode and preset cooling chip 5 working state.

[0044] Preset temperature range Cooler operating status First micropump operating status Below 0℃ Preheating mode Do not start 0℃ (inclusive) - 20℃ (exclusive) Do not start start up 20℃ (inclusive) - 40℃ (exclusive) Cooling mode start up 40℃ and above Frozen Mode start up

[0045] Table 3: Example 3: Preset mapping representation of temperature control device including first micropump

[0046] Preset temperature range Cooler operating status First micropump operating status Second micropump operating status Below 0℃ Preheating mode Do not start Do not start 0℃ (inclusive) - 20℃ (exclusive) Do not start start up Do not start 20℃ (inclusive) - 40℃ (exclusive) Cooling mode start up Do not start 40℃ and above Frozen Mode start up Do not start

[0047] Table 4: Example 4: Preset mapping representation of temperature control device including first micropump and second micropump

[0048] Referring to the example in Table 5, the preset mapping table contains the mapping relationship between preset temperature ranges and preset micropump working modes and preset cooling chip 5 working states. By detecting the current first temperature and second temperature of the device, the preset temperature range in which the current first temperature and second temperature are located is found in the preset mapping table, and the working mode of the micropump and the working state of the cooling chip 5 are controlled based on the preset temperature range corresponding to the preset micropump working mode and preset cooling chip 5 working state.

[0049]

[0050] Table 5: Example 5: Preset mapping representation of temperature control device including first micropump and second micropump

[0051] Referring to the example in Table 6, the preset mapping table contains the mapping relationship between preset device operating modes, preset temperature ranges, preset micropump operating modes, and preset cooling chip 5 operating states. By detecting the current first or second temperature of the device, the preset temperature range in which the current first or second temperature is located is found in the preset mapping table. Also, by detecting the current operating mode of the device, the corresponding preset device operating mode is found in the preset mapping table. Based on the preset temperature range, the preset micropump operating mode corresponding to the preset device operating mode, and the preset cooling chip 5 operating state, the operating mode of the micropump and the operating state of the cooling chip 5 are controlled.

[0052]

[0053] Table 6: Preset mapping representation of the temperature control device including the first micropump and the second micropump (Example 6)

[0054] In some implementations, see Figure 2 , Figure 3 The cooling element 5 includes a first surface and a second surface disposed opposite to each other. The first surface faces the first heat source region 1 and / or the second heat source region 2, and the second surface faces the rear housing 14 of the electronic device. A portion or all of the first flow channel 4 and / or the second flow channel 7 is located between the first heat source region 1 and / or the second heat source region 2 and the first surface. By distributing the first flow channel 4 and / or the second flow channel 7 between the cooling element 5 and the first heat source region 1 and / or the second heat source region 2, the temperature of the cooling element 5 is transferred to the first heat source region 1 and / or the second heat source region 2 using the flow channels, thereby accelerating the temperature transfer speed and range, and improving the efficiency of temperature control. In some embodiments, a portion or all of the first flow channel 4 is located between the first heat source region 1 and the first surface, and a portion or all of the second flow channel 7 is located between the second surface and the rear housing 14 of the device. By setting the first flow channel 4 and the second flow channel 7 on both sides of the cooling chip 5, and taking advantage of the characteristic that the cooling chip 5 has a cold side and a hot side when it is working, when the first surface of the cooling chip 5 is the hot side (such as when the cooling chip 5 is in preheating mode), the second surface of the cooling chip 5 is the cold side. The temperature of the cold side of the cooling chip 5 can be transferred to the second heat source area 2 through the second flow channel 7, thereby achieving heat dissipation of the second heat source area 2 and further improving the utilization rate of the cooling chip 5.

[0055] In some implementations, the device operates in two modes: a performance mode and a fast-charging mode. The cooling element 5 has a cooling mode and an ice-sealing mode. See [link to relevant documentation]. Figure 1When the temperature control device includes a first micropump 3 and a cooling chip 5 but excludes a second micropump 6, in performance mode or fast charging mode, the control module 8 controls the first micropump 3 and the cooling chip 5 to start, and the cooling chip 5 is in either cooling mode or freezing mode. Performance mode can be the mode in which the device is playing videos, playing games, or performing tasks requiring large amounts of data processing, running complex applications, or performing highly computationally intensive tasks. Fast charging mode can be the mode in which the device charges quickly based on a specific charging protocol and technical standard. Both cooling mode and freezing mode of the cooling chip 5 serve to lower the temperature, but freezing mode has a better cooling effect than cooling mode, although the power consumption required by the cooling chip 5 in freezing mode is higher than that in cooling mode. When the device is in performance mode or fast charging mode, the temperature of the first heat source area 1 and / or the second heat source area 2 is usually very high. By simultaneously activating the cooling chip 5 and the micropump for heat dissipation, the high heat dissipation requirements of the device can be met. Furthermore, by detecting the device's operating mode to determine the temperature control scheme, the use of a temperature sensor can be avoided, thereby saving hardware costs and internal space.

[0056] Furthermore, when the device is in performance mode, the control module 8 controls the first micro-pump 3 and the cooling chip 5 to start, and the cooling chip 5 is in cooling mode. When the device is in fast charging mode, the control module 8 controls the first micro-pump 3 and the cooling chip 5 to start, and the cooling chip 5 is in ice-freezing mode. Considering the device's power consumption, controlling the cooling chip 5 to be in cooling mode when the device is in performance mode can effectively balance heat dissipation requirements and device power consumption. When the device is in fast charging mode, since the device is being powered, there is no need to worry about power consumption, so the cooling chip 5 can be controlled to be in ice-freezing mode to further improve the heat dissipation effect.

[0057] In some implementations, the device's operating modes include a normal mode and a standard charging mode, see [link / reference]. Figure 1 When the temperature control device includes the first micropump 3 and the cooling chip 5 but excludes the second micropump 6, in normal mode or standard charging mode, the control module 8 controls the first micropump 3 to start while the cooling chip 5 remains off. Normal mode corresponds to performance mode and can be a mode where the device performs basic operations and information exchange without requiring complex configuration or calculations. Standard charging mode corresponds to fast charging mode and can be a basic, relatively slow charging method. Considering that the first heat source area 1 and / or the second heat source area 2 are usually not very hot in normal mode or standard charging mode, only the first micropump 3 is controlled to start while the cooling chip 5 remains off, thus reducing device power consumption while meeting heat dissipation requirements.

[0058] In some implementations, the device's operating modes include a normal mode and a standard charging mode, see [link / reference]. Figure 2When the temperature control device includes a first micropump 3, a second micropump 6, and a cooling element 5, in normal mode or normal charging mode, the control module 8 controls at least one of the first micropump 3 and the second micropump 6 to start, and the control module 8 controls the cooling element 5 to not start. By setting two micropumps, more precise temperature control can be achieved.

[0059] In some embodiments, the cooling element 5 has a preheating mode, see [link to documentation]. Figure 1 When the temperature control device includes a first micropump 3 and a cooling element 5 but not a second micropump 6, if the first or second temperature is within a preset first temperature range, the control module 8 controls the cooling element 5 to start and enter preheating mode, while the first micropump 3 does not start. The preheating mode of the cooling element is for heating; in preheating mode, the cooling element releases heat to achieve the effect of heating the equipment. In some embodiments, the cooling element 5 has a cooling mode, see [link to relevant documentation]. Figure 1 When the temperature control device includes a first micropump 3 and a cooling element 5 but not a second micropump 6, and the first or second temperature is within a preset third temperature range, the control module 8 controls the first micropump 3 and the cooling element 5 to start, and the cooling element 5 is in cooling mode; in some embodiments, the cooling element 5 has an ice-sealing mode, see [link to relevant documentation]. Figure 1 When the temperature control device includes the first micro pump 3 and the cooling chip 5 but not the second micro pump 6, and the first temperature or the second temperature is within the preset fourth temperature range, the control module 8 controls the first micro pump 3 and the cooling chip 5 to start, and the cooling chip 5 is in the ice-sealing mode.

[0060] In some implementations, the cooling element has a preheating mode, a cooling mode, and an ice-sealing mode, see [link to relevant documentation]. Figure 1When the temperature control device includes a first micropump 3 and a cooling element 5 but not a second micropump 6, if the first or second temperature is within a preset first temperature range, the control module 8 controls the cooling element 5 to start and be in preheating mode, while the first micropump 3 does not start; if the first or second temperature is within a preset second temperature range, the control module 8 controls the first micropump 3 to start, while the cooling element 5 does not start; if the first or second temperature is within a preset third temperature range, the control module 8 controls both the first micropump 3 and the cooling element 5 to start, and the cooling element 5 is in cooling mode; if the first or second temperature is within a preset fourth temperature range, the control module 8 controls both the first micropump 3 and the cooling element 5 to start, and the cooling element 5 is in freezing mode. In some embodiments, the preset first temperature range, preset second temperature range, preset third temperature range, and preset fourth temperature range are consecutive temperature ranges ordered from low to high. Specific temperature thresholds can be set based on experimental test data. For example, taking a mobile phone as an example, the preset first temperature range can be below 0℃, the preset second temperature range can be 0℃ (inclusive) - 20℃ (exclusive), the preset third temperature range can be 20℃ (inclusive) - 40℃ (exclusive), and the preset fourth temperature range can be 40℃ and above. By detecting the first temperature of the first heat source area 1 and / or the second temperature of the second heat source area 2, the working status of the cooling chip 5 and the first micro-pump 3 can be determined. This allows for accurate acquisition of the terminal's heat dissipation requirements, enabling the matching of corresponding temperature control schemes, achieving a balance between temperature control requirements and device power consumption, and further improving the temperature control effect.

[0061] In some implementations, the device operates in two modes: a performance mode and a fast-charging mode, and the cooling chip 5 has a cooling mode and an ice-sealing mode; see also Figure 2 When the temperature control device includes a first micropump 3, a second micropump 6, and a cooling chip 5, in performance mode or fast charging mode, the control module 8 controls at least two of the first micropump 3, the second micropump 6, and the cooling chip 5 to start. When the cooling chip 5 is started, the control module 8 controls the cooling chip 5 to be in cooling mode or freezing mode. By setting two micropumps, when the temperature of the first heat source area 1 and / or the second heat source area 2 is high due to the device being in performance mode or fast charging mode, in addition to using a single micropump and the cooling chip 5 simultaneously for heat dissipation, two micropumps can also work together for heat dissipation, thereby achieving more precise temperature control. Alternatively, two micropumps can work together with the cooling chip 5 to further improve the heat dissipation effect.

[0062] In some implementations, see Figure 2 , Figure 3The cooling chip 5 includes a first surface and a second surface arranged opposite to each other. The first surface is arranged facing the first heat source region 1, and the second surface is arranged facing the rear shell 14 of the device. Part or all of the first flow channel 4 is located between the first heat source region 1 and the first surface, and part or all of the second flow channel 7 is located between the second surface and the rear shell 14 of the device. When the device is in performance mode or fast charging mode, and the first temperature is within the preset second temperature range, the control module 8 controls the first micro pump 3 and the second micro pump 6 to start, and the cooling chip 5 does not start.

[0063] In some embodiments, when the device is in performance mode or fast charging mode, and the first temperature is within a preset third temperature range, the control module 8 controls the first micropump 3 to start, the second micropump 6 to stop, and the cooling chip 5 to be in cooling mode. In some embodiments, when the device is in fast charging mode and the first temperature is within a preset fourth temperature range, the control module 8 controls the first micropump 3 to start, the second micropump 6 to stop, and the cooling chip 5 to be in freezing mode. The preset second temperature range, the preset third temperature range, and the preset fourth temperature range are consecutive temperature ranges ordered from low to high.

[0064] Even when the device is in performance mode or fast charging mode, the temperature of the first heat source area 1 will still differ. For example, although both gaming and video playback scenarios are in performance mode, the temperature of the first heat source area 1 will still differ. Furthermore, when fast charging mode is combined with gaming, the temperature of the first heat source area 1 will be higher compared to either fast charging or performance mode alone. This embodiment further detects the first temperature of the first heat source area 1 in performance mode or fast charging mode, and further determines the temperature control scheme based on the first temperature to achieve more refined and precise temperature control and improve the temperature control effect. Simultaneously, since the cooling element 5 has both heating and cooling functions, when the cooling element 5 is in preheating mode, the first surface of the cooling element 5 is the hot surface, and the second surface is the cold surface. To fully utilize the cold surface of the cooling element 5 for heat dissipation during preheating mode, the first flow channel 4 and the second flow channel 7 are respectively set on both sides of the cooling element 5 to improve the utilization rate of the cooling element 5. Meanwhile, when the cooling chip 5 is in cooling mode or freezing mode, the first surface of the cooling chip 5 is the cold surface and the second surface of the cooling chip 5 is the hot surface. Therefore, when it is determined that the cooling chip 5 will not start based on the first temperature, the two micro pumps can start simultaneously to enhance the heat dissipation effect. However, when it is determined that the cooling chip 5 is in cooling mode or freezing mode based on the first temperature, the second micro pump 6 corresponding to the second flow channel 7 on the hot surface of the cooling chip 5 cannot start, thereby avoiding the transfer of the hot surface temperature to the second heat source area 2.

[0065] In some implementations, see Figure 2 , Figure 3The cooling chip 5 includes a first surface and a second surface arranged opposite to each other. The first surface is arranged facing the first heat source region 1, and the second surface is arranged facing the rear shell 14 of the device. Part or all of the first flow channel 4 is located between the first heat source region 1 and the first surface, and part or all of the second flow channel 7 is located between the second surface and the rear shell 14 of the device. The device has a normal mode and a normal charging mode. The cooling chip 5 has a preheating mode. When the device is in the normal mode or normal charging mode and the first temperature is less than the preset first temperature threshold, the control module 8 controls the cooling chip 5 to start and be in the preheating mode, and the first micro pump 3 and the second micro pump 6 do not start.

[0066] In some implementations, the device operates in a performance mode and a fast charging mode. The cooling chip 5 has a preheating mode. When the device is in performance mode or fast charging mode and the first temperature is less than a preset first temperature threshold, the control module 8 controls the second micro pump 6 and the cooling chip 5 to start. The cooling chip 5 is in preheating mode, and the second micro pump 6 does not start.

[0067] The temperatures of the first heat source area 1 and the second heat source area 2 within the device are related not only to the device's operating mode but also to the ambient temperature. By comprehensively considering both the heat source area temperatures and the device's operating mode, more precise temperature control can be achieved. Specifically, the device's battery may experience low utilization or fail to power the device in very low ambient temperatures. This embodiment utilizes a cooling element 5, which has both heating and cooling functions. By placing the cooling element 5 in the first heat source area 1 and simultaneously detecting the device's operating mode, the temperature of both the first and second heat source areas is determined, allowing for a comprehensive temperature control scheme and achieving more precise temperature control, thus improving the temperature control effect. Meanwhile, by setting the first flow channel 4 and the second flow channel 7 on both sides of the cooling chip 5, when the cooling chip 5 is in preheating mode, the first surface of the cooling chip 5 is the hot surface and the second surface of the cooling chip 5 is the cold surface. When the device is in performance mode or fast charging mode, and the temperature of the first heat source area 1 is lower than the preset first temperature threshold but the temperature of the second heat source area 2 is relatively high, the second flow channel 7 can transfer the temperature of the cold surface of the cooling chip 5 to the second heat source area 2, thereby achieving heat dissipation of the second heat source area 2 and further improving the utilization rate of the cooling chip 5.

[0068] In some embodiments, the cooling element 5 has a preheating mode, see [link to documentation]. Figure 2 When the temperature control device includes a first micropump 3, a second micropump 6, and a cooling element 5, if the first temperature or the second temperature is within a preset first temperature range, the control module 8 controls the cooling element 5 to start and enter a preheating mode, while the first micropump 3 and the second micropump 6 do not start; in some embodiments, the cooling element 5 has a cooling mode, see [link to relevant documentation]. Figure 2When the temperature control device includes a first micropump 3, a second micropump 6, and a cooling element 5, if the first or second temperature is within a preset third temperature range, the control module 8 controls at least two of the first micropump 3, the second micropump 6, and the cooling element 5 to start. Furthermore, when the cooling element 5 is started, the control module 8 controls the cooling element 5 to be in cooling mode. In some embodiments, the cooling element has an ice-sealing mode, see [link to documentation]. Figure 2 When the temperature control device includes a first micropump 3, a second micropump 6, and a cooling chip 5, if the first temperature or the second temperature is within a preset fourth temperature range, the control module 8 controls at least two of the first micropump 3, the second micropump 6, and the cooling chip 5 to start, and if the cooling chip 5 is started, the control module 8 controls the cooling chip 5 to be in an ice-sealing mode.

[0069] In some implementations, the cooling element has a preheating mode, a cooling mode, and an ice-sealing mode, see [link to relevant documentation]. Figure 2 When the temperature control device includes a first micropump 3, a second micropump 6, and a cooling element 5, if the first temperature or the second temperature is within a preset first temperature range, the control module 8 controls the cooling element 5 to start and be in preheating mode, while the first micropump 3 and the second micropump 6 do not start; if the first temperature or the second temperature is within a preset second temperature range, the control module 8 controls at least one of the first micropump 3 and the second micropump 6 to start, while the control module 8 controls the cooling element 5 to not start; if the first temperature or the second temperature is within a preset third temperature range, the control module 8 controls at least two of the first micropump 3, the second micropump 6, and the cooling element 5 to start, and if the cooling element 5 is started, the control module 8 controls the cooling element 5 to be in cooling mode; if the first temperature or the second temperature is within a preset fourth temperature range, the control module 8 controls at least two of the first micropump 3, the second micropump 6, and the cooling element 5 to start, and if the cooling element 5 is started, the control module 8 controls the cooling element 5 to be in freezing mode.

[0070] In some implementations, the preset first temperature range, preset second temperature range, preset third temperature range, and preset fourth temperature range are consecutive temperature ranges ordered from low to high. Specific temperature thresholds can be set based on experimental test data. For example, taking a mobile phone as an example, the preset first temperature range can be below 0℃, the preset second temperature range can be 0℃-20℃, the preset third temperature range can be 20℃-40℃, and the preset fourth temperature range can be 40℃ and above (rounded down from the previous range). By detecting the first temperature of the first heat source region 1 and / or the second temperature of the second heat source region 2, the operating status of the cooling chip 5, the first micro-pump 3, and the second micro-pump 6 can be determined. This allows for precise acquisition of the terminal's heat dissipation requirements, enabling the matching of corresponding temperature control schemes, achieving a balance between temperature control requirements and device power consumption, and further improving the temperature control effect.

[0071] In some implementations, see Figure 2 , Figure 3The cooling element 5 includes a first surface and a second surface disposed opposite to each other. The first surface faces the first heat source region 1, and the second surface faces the rear shell 14 of the device. Part or all of the first flow channel 4 is located between the first heat source region 1 and the first surface, and part or all of the second flow channel 7 is located between the second surface and the rear shell 14 of the device. When the first temperature is within a preset second temperature range and the second temperature is within a preset third temperature range or a preset fourth temperature range, the control module 8 controls the first micropump 3 and the second micropump 6 to start, and the cooling element 5 does not start; or, when the first temperature is within the preset third temperature range, the control module 8 controls the first micropump 3 to start, and the second micropump 6 does not start, and the cooling element 5 is in cooling mode. Or, when the first temperature is within the preset fourth temperature range, the control module 8 controls the first micropump 3 to start, and the second micropump 6 does not start, and the cooling element 5 is in freezing mode. In this embodiment, since the cooling chip 5 has both heating and cooling functions, when the cooling chip 5 is in preheating mode, the first surface of the cooling chip 5 is the hot surface and the second surface of the cooling chip 5 is the cold surface. In order to make full use of the cold surface of the cooling chip 5 for heat dissipation in preheating mode, the first flow channel 4 and the second flow channel 7 are respectively set on both sides of the cooling chip 5 to improve the utilization rate of the cooling chip 5. At the same time, when the cooling chip 5 is in cooling mode or freezing mode, the first surface of the cooling chip 5 is the cold surface and the second surface of the cooling chip 5 is the hot surface. Therefore, by detecting the first temperature of the first heat source region 1 and the second temperature of the second heat source region 2, when the first temperature is in a preset second temperature range (e.g., 0℃-20℃) and the second temperature is in a preset third temperature range (e.g., 20℃-40℃) or in a preset fourth temperature range (e.g., 40℃ and above), two micro pumps are controlled to start simultaneously to dissipate heat, thereby achieving rapid heat dissipation of the second heat source region 2. When the first temperature is within a preset third temperature range (e.g., 20℃-40℃), the cooling element 5 is controlled to be in cooling mode, and the first micro-pump 3 is simultaneously activated to achieve rapid heat dissipation from the first heat source region 1 and the second heat source region 2. At this time, since the second surface of the cooling element 5 is the hot surface, the second micro-pump 6 cannot be activated to prevent the hot surface temperature from being transferred to the second heat source region 2. When the first temperature is within a preset fourth temperature range (e.g., 40℃ and above), the cooling element 5 is controlled to be in freezing mode, and the first micro-pump 3 is simultaneously activated to achieve rapid heat dissipation from the first heat source region 1 and the second heat source region 2. At this time, since the second surface of the cooling element 5 is the hot surface, the second micro-pump 6 cannot be activated to prevent the hot surface temperature from being transferred to the second heat source region 2. Through the temperature control scheme design of this embodiment, the cooling element 5 can be fully utilized, and the corresponding temperature control scheme can be determined based on the temperatures of the first heat source region 1 and the second heat source region 2 of the equipment, achieving refined temperature control of the equipment, meeting the temperature control requirements of the equipment, and improving the temperature control effect.

[0072] In some implementations, see Figure 4 , Figure 6 The temperature control device also includes a micropump drive module 11. The cooling chip drive module 9 drives the cooling chip 5, and the micropump drive module 11 drives the micropump. Specifically, the power supply VCC of the micropump drive module 11 is connected to the power supply system of the electronic device. The micropump drive module 11 receives control commands from the electronic device control module 8 through IIC1 and outputs micropump drive voltage VOUT_P1 / VOUT_N1 to drive the micropump.

[0073] In some implementations, see Figure 5 In the case where the temperature control device includes a first micropump 3 and a second micropump 6, the temperature control device also includes a micropump co-processing module 12. This module controls the switching and control output of the micropump drive voltage signals VOUT_P1A / VOUT_N1A and VOUT_P2A / Vout_N2B according to the control commands EN1A / EN1B of the control module 8. When EN1B is high, the input voltage signals VOUT_P1 / VOUT_N1 and the output signals VOUT_P1B / VOUT_N1B of the micropump co-processing module 12 are connected, and the first micropump 3 starts working; when EN2B is high, the input voltage signals VOUT_P1 / VOUT_N1 and the output signals VOUT_P2B / VOUT_N2B of the micropump co-processing module 12 are connected, and the first micropump 3 starts working. When EN1B / EN2B are both high, the input voltage signal VOUT_P1 / VOUT_N1 of the micropump co-processing module 12 is connected with the output signals VOUT_P1B / VOUT_N1B and VOUT_P2B / VOUT_N2B, and the first micropump 3 and the second micropump 6 start working simultaneously.

[0074] In some implementations, see Figure 6The temperature control device also includes a cooling chip drive module 9 and a cooling chip management module 10. The power supply VCC of the cooling chip drive module 9 is connected to the power supply system of the electronic device. The cooling chip drive module 9 is connected to the PWM_V signal of the control module 8 of the electronic device via the FB signal. The control module 8 sets the required cooling chip 5 drive voltage VOUT_P3 via the PWM_V signal. The cooling chip management module 10 controls the connection mode of the output cooling chip 5 drive voltage VOUT_P3A / VOUT_N3A and VOUT_P3 / VOUT_N3 according to the control command SW3 sent by the control module 8. When SW3 is low, the output signal VOUT_P3A is connected to the input signal VOUT_P3 and the output signal VOUT_N3A is connected to GND. At the same time, the PWM_V signal adjusts the output cooling chip 5 drive voltage VOUT_P3 by controlling the conduction time of the cooling chip 5 drive voltage VOUT_P3A / VOUT_N3A and adjusting the PWM_V frequency or duty cycle, thereby controlling whether the cooling chip 5 is in cooling mode or freezing mode. In the freezing mode, the PWM_V frequency or duty cycle is higher than that in the cooling mode. When SW3 is high, the cooling chip management module 10 controls the cooling chip 5 to be in preheating mode, that is, the output signal VOUT_P3A is connected to GND and the output signal VOUT_N3A is connected to the input signal VOUT_P3.

[0075] The embodiments of this application will be described below with reference to a specific scenario.

[0076] See Figure 2 , Figure 3 and Figure 7 The temperature control device of the first embodiment of this application includes a control module 8, a temperature detection module 13, a cooling chip drive module 9, a cooling chip management module 10, a micro-pump drive module 11, a micro-pump co-processing module 12, a cooling chip 5, a first micro-pump 3, a first flow channel 4, a second micro-pump 6, and a second flow channel 7. The temperature detection module 13 is connected to the control module 8 and is used to detect the first temperature of the battery area and the second temperature of the motherboard area. The control module 8 is electrically connected to the cooling chip drive module 9, the cooling chip management module 10, the micro-pump drive module 11, and the micro-pump co-processing module 12 to control the working state of the first micro-pump 3, the second micro-pump 6, and the cooling chip 5. The first micro-pump 3 is disposed on the first flow channel 4, which extends through the battery area and the motherboard area, and also extends through the cooling chip 5, which is disposed in the battery area. The second micro-pump 6 is disposed on the second flow channel 7, which extends through the battery area and the motherboard area. The cooling chip 5 includes a first surface and a second surface disposed opposite to each other. The first surface is disposed facing the battery area, and the second surface is disposed facing the rear shell 14 of the device. A portion of the first flow channel 4 is located between the battery area and the first surface; a portion of the second flow channel 7 is located between the rear shell 14 of the device and the second surface.

[0077] The working modes of the cooling element 5 include preheating mode, cooling mode and freezing mode, and the control module includes the preset mapping table shown in Table 7 below.

[0078]

[0079] Table 7

[0080] When the temperature detection module 13 detects a first temperature of 36°C in the battery area, it checks a preset mapping table to confirm that the first temperature of the battery area is within a preset temperature range of 20°C (inclusive) to 40°C (exclusive). Therefore, it determines that the working state of the cooling chip 5 is cooling mode, the first micropump 3 is in the "start" state, and the second micropump 6 is in the "not started" state. The control module 8 controls the micropump drive module 11 to output control voltage Vout_P1 / Vout_N1 via IIC1, and the control module 8 controls EN1 B to be high. The micropump co-processing module 12 connects the input voltage signal VOUT_P1 / VOUT_N1 with the output signal VOUT_P1 B / VOUT_N1 B, and the first micropump 3 starts working. Meanwhile, the control module 8 sets the driving voltage VOUT_P3 of the cooler 5 by outputting the PWM_V frequency or duty cycle corresponding to the cooling mode of the cooler 5, and the control module 8 controls SW3 to be low level. The output signal VOUT_P3A of the cooler management module 10 is connected to the input signal VOUT_P3 and the output signal VOUT_N3A is connected to GND, so the cooler 5 is in cooling mode.

[0081] When the temperature detection module 13 detects that the first temperature of the battery area is 15℃ and the second temperature of the motherboard area is 36℃, it confirms by looking up the preset mapping table that the first temperature of the battery area is within the preset temperature range of 0℃ (inclusive) to 20℃ (exclusive), and the second temperature of the motherboard area is within the preset temperature range of 20℃ and above. Thus, it is determined that the working state of the cooling chip 5 is not started, the working state of the first micropump 3 is started, and the working state of the second micropump 6 is started. The control module 8 controls the micropump drive module 11 to output the control voltage Vout_P1 / Vout_N1 through IIC1, and the control module 8 controls EN1 B / EN2B to be at a high level. The input voltage signal VOUT_P1 / VOUT_N1 of the micropump co-processing module 12 is connected to the output signals VOUT_P1 B / VOUT_N1 B and VOUT_P2B / VOUT_N2B. The first micropump 3 and the second micropump 6 start working simultaneously.

[0082] This application embodiment detects the temperature of the motherboard area and the battery area to determine the temperature control scheme and achieve accurate temperature control of the device.

[0083] The temperature control device in the second embodiment of this application is the same as that in the first embodiment, except that the device has a working mode including a performance mode, a fast charging mode, a normal mode and a standard charging mode, and the control module includes a preset mapping table as shown in Table 8 below.

[0084]

[0085] Table 8

[0086] When the device is in performance mode and the temperature detection module 13 detects a first temperature of 18°C ​​in the battery area, it checks the preset mapping table to confirm that the first temperature of the battery area is within the preset temperature range of 0°C (inclusive) to 20°C (exclusive), and the device's working mode corresponds to the preset performance mode. Thus, it is determined that the working state of the cooling chip 5 is not started, the working state of the first micropump 3 is started, and the working state of the second micropump 6 is started. The control module 8 controls the micropump drive module 11 to output the control voltage Vout_P1 / Vout_N1 through IIC1, and the control module 8 controls EN1B / EN2B to be at a high level. The micropump co-processing module 12 connects the input voltage signal VOUT_P1 / VOUT_N1 with the output signals VOUT_P1B / VOUT_N1B and VOUT_P2B / VOUT_N2B, and the first micropump 3 and the second micropump 6 start working simultaneously.

[0087] When the device is in fast charging mode and the temperature detection module 13 detects a first temperature of 36°C in the battery area, it confirms by looking up the preset mapping table that the first temperature of the battery area is within the preset temperature range of 20°C (inclusive) to 40°C (exclusive), and the device's working mode corresponds to the preset fast charging mode. Thus, it is determined that the working state of the cooling chip 5 is cooling mode, the working state of the first micropump 3 is started, and the working state of the second micropump 6 is not started. The control module 8 controls the micropump drive module 11 to output the control voltage Vout_P1 / Vout_N1 through IIC1, and the control module 8 controls EN1 B to be high level. The micropump co-processing module 12 connects the input voltage signal VOUT_P1 / VOUT_N1 with the output signal VOUT_P1 B / VOUT_N1 B, and the first micropump 3 starts working. Meanwhile, the control module 8 sets the driving voltage VOUT_P3 of the cooler 5 by outputting the PWM_V frequency or duty cycle corresponding to the cooling mode of the cooler 5, and the control module 8 controls SW3 to be low level. The output signal VOUT_P3A of the cooler management module 10 is connected to the input signal VOUT_P3 and the output signal VOUT_N3A is connected to GND, so the cooler 5 is in cooling mode.

[0088] In this embodiment, the operating status of the device and the temperature of the motherboard and battery area are considered to determine the activation of the corresponding temperature control scheme, thereby further improving the accuracy and effectiveness of temperature control.

[0089] This application also provides an electronic device, including a temperature control device as described in any of the above embodiments.

[0090] The system architecture and application scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. Those skilled in the art will know that as the system architecture evolves and new application scenarios emerge, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0091] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0092] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0093] The above description, with reference to the accompanying drawings, illustrates some embodiments of this application, but does not limit the scope of the invention. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and spirit of this invention should be considered within the scope of this application.

Claims

1. A temperature control device for controlling the temperature of an electronic device having a first heat source region and a second heat source region, characterized in that, The temperature control device includes: a control module, a temperature detection module, a cooling chip, a first micropump, and a first flow channel; The first micropump is disposed on the first flow channel, the first flow channel extends through the first heat source region and / or the second heat source region, and the first flow channel extends through the cooling chip; The temperature detection module is electrically connected to the control module and is used to detect the first temperature of the first heat source area and / or the second temperature of the second heat source area. The control module is electrically connected to the first micropump and the cooling chip respectively, and is used to control the working state of the first micropump and the cooling chip according to at least one of the device's working mode, the first temperature, and the second temperature.

2. The temperature control device as described in claim 1, characterized in that, Also includes: Second micropump and second flow channel; The second micropump is disposed on the second flow channel, which extends through the first heat source region and / or the second heat source region. The control module is also electrically connected to the second micropump and is used to control the working state of the second micropump according to at least one of the device's working mode, the first temperature, and the second temperature.

3. The temperature control device as described in claim 1 or 2, characterized in that, At least a portion of the cooling element is disposed in the first heat source region 1 and / or the second heat source region 2.

4. The temperature control device as described in claim 1 or 2, characterized in that, The control module includes a preset mapping table, which is used to characterize the mapping relationship between preset device working modes and / or preset temperature ranges and preset micro-pump working modes and preset cooling chip 5 working states.

5. The temperature control device as described in claim 1 or 2, characterized in that, The cooling chip includes a first surface and a second surface disposed opposite to each other, the first surface being disposed toward the first heat source region and / or the second heat source region, the second surface being disposed toward the rear shell of the device, and a portion or all of the first flow channel and / or the second flow channel being located between the first heat source region and / or the second heat source region and the first surface. Alternatively, part or all of the first flow channel may be located between the first heat source region and the first surface, and part or all of the second flow channel may be located between the second surface and the rear housing of the device.

6. The temperature control device as described in claim 1, characterized in that, The device has a performance mode and a fast charging mode, and the cooling chip has a cooling mode and an ice-sealing mode. When the device is in performance mode or fast charging mode, the control module controls the first micro pump and the cooling chip to start, and the cooling chip is in cooling mode or ice-sealing mode.

7. The temperature control device as described in claim 6, characterized in that, When the device is in performance mode, the control module controls the first micropump and the cooling chip to start, and the cooling chip is in cooling mode. When the device is in fast charging mode, the control module controls the first micro pump and the cooling chip to start, and the cooling chip is in ice-freezing mode.

8. The temperature control device as described in claim 1, characterized in that, The device has two operating modes: normal mode and standard charging mode. When the device is in normal mode or standard charging mode, the control module controls the first micro pump to start, and the cooling chip does not start.

9. The temperature control device as described in claim 1, characterized in that, The cooling chip has a preheating mode, a cooling mode, and / or an ice-sealing mode. When the first temperature or the second temperature is within a preset first temperature range, the control module controls the cooling chip to start and be in the preheating mode, and the first micro pump does not start. And / or, When the first temperature or the second temperature is within a preset second temperature range, the control module controls the first micro-pump to start, and the cooling chip does not start; And / or, When the first temperature or the second temperature is within a preset third temperature range, the control module controls the first micro-pump and the cooling chip to start, and the cooling chip is in cooling mode. And / or, When the first temperature or the second temperature is within a preset fourth temperature range, the control module controls the first micro-pump and the cooling chip to start, and the cooling chip is in an ice-sealing mode.

10. The temperature control device as described in claim 2, characterized in that, The device has a performance mode and a fast charging mode, and the cooling chip has a cooling mode and an ice-sealing mode. When the device is in performance mode or fast charging mode, the control module controls at least two of the first micropump, the second micropump, and the cooling chip to start, and when the cooling chip is started, the control module controls the cooling chip to be in cooling mode or ice-sealing mode.

11. The temperature control device as described in claim 10, characterized in that, The cooling chip includes a first surface and a second surface disposed opposite to each other. The first surface is disposed toward the first heat source region, and the second surface is disposed toward the rear shell of the device. Part or all of the first flow channel is located between the first heat source region and the first surface, and part or all of the second flow channel is located between the second surface and the rear shell of the device. When the device is in performance mode or fast charging mode, and the first temperature is within a preset second temperature range, the control module controls the first micro pump and the second micro pump to start, while the cooling chip does not start. And / or, When the device is in performance mode or fast charging mode, and the first temperature is within a preset third temperature range, the control module controls the first micro pump to start, the second micro pump to not start, and the cooling chip to be in cooling mode. And / or, When the device is in fast charging mode and the first temperature is within the preset fourth temperature range, the control module controls the first micro pump to start, the second micro pump to not start, and the cooling chip to be in ice-freezing mode.

12. The temperature control device as described in claim 2, characterized in that, The device has two operating modes: normal mode and normal charging mode. When the device is in normal mode or normal charging mode, the control module controls at least one of the first micro pump and the second micro pump to start, and the control module controls the cooling chip to not start.

13. The temperature control device as described in claim 2, characterized in that, The cooling chip includes a first surface and a second surface disposed opposite to each other. The first surface is disposed toward the first heat source region, and the second surface is disposed toward the rear shell of the device. Part or all of the first flow channel is located between the first heat source region and the first surface, and part or all of the second flow channel is located between the second surface and the rear shell of the device. The device has two operating modes: normal mode and normal charging mode. The cooling chip has a preheating mode. When the device is in normal mode or normal charging mode and the first temperature is less than a preset first temperature threshold, the control module controls the cooling chip to start and enter the preheating mode, and the first micro pump and the second micro pump do not start. or, The device has two operating modes: a performance mode and a fast charging mode. The cooling chip has a preheating mode. When the device is in performance mode or fast charging mode and the first temperature is less than a preset first temperature threshold, the control module controls the second micro pump and the cooling chip to start. The cooling chip is in preheating mode, and the first micro pump does not start.

14. The temperature control device as described in claim 2, characterized in that, The cooling element has a preheating mode, a cooling mode, and / or an ice-sealing mode; When the first temperature or the second temperature is within a preset first temperature range, the control module controls the cooling chip to start and be in preheating mode, and the first micro pump and the second micro pump do not start. And / or, When the first temperature or the second temperature is within a preset second temperature range, the control module controls at least one of the first micropump and the second micropump to start, and the control module controls the cooling chip not to start. And / or, When the first temperature or the second temperature is within a preset third temperature range, the control module controls at least two of the first micropump, the second micropump, and the cooling chip to start, and when the cooling chip is started, the control module controls the cooling chip to be in cooling mode. And / or, When the first temperature or the second temperature is within a preset fourth temperature range, the control module controls at least two of the first micropump, the second micropump, and the cooling chip to start, and when the cooling chip is started, the control module controls the cooling chip to be in an ice-sealing mode.

15. The temperature control device as described in claim 14, characterized in that, The cooling chip includes a first surface and a second surface disposed opposite to each other. The first surface is disposed toward the first heat source region, and the second surface is disposed toward the rear shell of the device. Part or all of the first flow channel is located between the first heat source region and the first surface, and part or all of the second flow channel is located between the second surface and the rear shell of the device. When the first temperature is within the preset second temperature range and the second temperature is within the preset third temperature range or the preset fourth temperature range, the control module controls the first micropump and the second micropump to start, and the cooling chip does not start; or, when the first temperature is within the preset third temperature range, the control module controls the first micropump to start, the second micropump to not start, and the cooling chip is in cooling mode. or, When the first temperature is within the preset fourth temperature range, the control module controls the first micropump to start, the second micropump to not start, and the cooling chip to be in ice-freezing mode.

16. The temperature control device as described in claim 9, 11, or 14, characterized in that, The preset first temperature range, the preset second temperature range, the preset third temperature range, and the preset fourth temperature range are consecutive temperature ranges ordered from low to high.

17. An electronic device, characterized in that, Includes the temperature control device as described in any one of claims 1-16.

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