Cooling module and electronic device

Abstract

Provided are a cooling module capable of maintaining cooling performance for a longer period of time and an electronic device provided with the cooling module. The cooling module is mounted on an electronic device, and is provided with: a fan having an air outlet; and a heat sink having a plurality of fins arranged with gaps therebetween, the heat sink being disposed facing the air outlet, the heat sink having a duct portion, the pitch of the fins of the duct portion being larger than that of the other portions. The duct portion is provided at a position in the vicinity of at least an end of the fan on the downstream side in the direction of air flow among both ends of the fin in the width direction along the width direction of the air outlet.

Description

Technical Field

[0001] This invention relates to a cooling module and an electronic device having the cooling module. Background Technology

[0002] Electronic devices such as laptop PCs are equipped with cooling modules for cooling heat-generating components such as CPUs (see, for example, Patent Document 1). Such cooling modules include a structure that includes: heat pipes for absorbing and transferring heat generated by the CPU, etc.; and heat sinks and fans for dissipating the heat transferred by the heat pipes to the outside of the casing.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-059833

[0004] There is a strong desire for miniaturization and thinning of electronic devices, as described above. Therefore, the heat sinks mounted on these devices also strive for miniaturization and thinning. Furthermore, considering heat exchange efficiency, the heat sinks aim to have minimal fin spacing. However, under prolonged use of electronic devices in harsh environments with high levels of dust and dirt, the heat sinks may gradually become clogged with dust, increasing ventilation resistance. This would reduce the heat exchange performance at the heat sink within the cooling module, potentially leading to a gradual decrease in cooling performance. Summary of the Invention

[0005] The present invention was made in view of the problems of the prior art described above, and its object is to provide a cooling module that can maintain cooling performance for a longer period of time and an electronic device having the cooling module.

[0006] The cooling module according to the first aspect of the present invention is a cooling module mounted on an electronic device, comprising: a fan having an air outlet; and a heat sink having a plurality of fins arranged with gaps between them and disposed facing the air outlet, the heat sink having: a duct portion in which the fin spacing of the fins is larger than that of other portions, the duct portion being disposed at a position near the downstream end of the heat sink at both ends in the width direction along the width direction of the air outlet, at least in the fan in the air flow direction.

[0007] The electronic device according to the second aspect of the present invention includes: a housing; a heating element disposed within the housing; and a cooling module disposed within the housing and cooling the heating element. The cooling module includes: a fan having an air outlet; and a heat sink having a plurality of fins arranged with gaps between them and disposed facing the air outlet. The heat sink has a duct portion, the fin spacing of which is larger than that of the other portions. The duct portion is disposed near the downstream end of the heat sink at least at one end in the airflow direction of the fan at the two ends along the width direction of the air outlet.

[0008] According to the above-described method of the present invention, cooling performance can be maintained for a longer period of time. Attached Figure Description

[0009] Figure 1 This is a schematic top view of an electronic device according to one embodiment, viewed from above.

[0010] Figure 2 It is a top view that schematically shows the internal structure of the shell.

[0011] Figure 3 It is a 3D view of the heatsink and fan.

[0012] Figure 4A It is a 3D view of the heat sink.

[0013] Figure 4B Observing from the opposite direction Figure 4A The image shows a 3D view of the heatsink.

[0014] Figure 5 This is a front view of the heat sink and its surrounding area.

[0015] Figure 6 It is along Figure 5 A schematic cross-sectional view of the VI-VI line.

[0016] Figure 7A It is a front view obtained by dissecting the heat sink's pipe section and its surrounding parts.

[0017] Figure 7B It means to Figure 7A The front view showing the fins joined together.

[0018] Figure 8 It is a front view of the heat sink and its surrounding parts of the pipe section involved in the first modified example.

[0019] Figure 9 This is a front view of the heat sink and its surrounding parts of the pipe section involved in the second variation.

[0020] Figure 10 This is a front view of the heat sink and its surrounding parts of the pipe section involved in the third variation.

[0021] Figure 11 This is a front view of the heat sink and its surrounding parts of the pipe section involved in the fourth variation.

[0022] Figure 12 This is a front view of the heat sink and its surrounding parts of the pipe section involved in the fifth variation.

[0023] Explanation of reference numerals in the attached figures

[0024] 10...electronic device; 14...casing; 22...cooling module; 30...CPU; 31...GPU; 38...heat pipe; 40, 41...heat sink; 41a, 41b...end; 42, 43...fan; 43a...air outlet; 43g...air path; 46, 47, 54, 55...plate-like part; 48 (48A~48E)...fins; 50, 50A~50E...duct part; 52...opening. Detailed Implementation

[0025] Hereinafter, preferred embodiments of the cooling module and electronic device involved in the present invention will be described in detail with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic top view, taken from above, of the electronic device 10 according to one embodiment. (As shown) Figure 1 As shown, the electronic device 10 connects the display housing 12 and the housing 14 via a hinge 16 to form a clamshell-type laptop PC capable of relative rotation. The electronic device involved in this invention can be, in addition to a laptop PC, a desktop PC, a tablet PC, a smartphone, or a game console, etc.

[0027] The display housing 12 is a thin and flat box. A display 18 is mounted within the display housing 12. The display 18 is made of, for example, organic EL (OLED: Organic Light Emitting Diode) or liquid crystal.

[0028] The following describes the arrangement of housing 14 and the elements mounted thereon, such that housings 12 and 14 are positioned as follows: Figure 1 The open state shown is described with reference to the orientation of the visual display 18, with the near front side referred to as front, the far side as rear, the width direction as left and right, and the height direction (thickness direction of the housing 14) as up and down.

[0029] The housing 14 is a thin and flat box. The housing 14 is composed of a cover member 14A forming the upper surface and surrounding side surfaces, and a cover member 14B forming the lower surface. The upper cover member 14A has a roughly bathtub shape with an opening on the lower surface. The lower cover member 14B is a cover having a roughly flat shape and closing the opening on the lower surface of the cover member 14A. The cover members 14A and 14B are connected in a manner that overlaps in the thickness direction and is detachable from each other. A keyboard 20 and a touchpad 21 are provided on the upper surface of the housing 14. The rear end of the housing 14 is connected to the display housing 12 using a hinge 16.

[0030] Figure 2 It is a schematic top view showing the internal structure of the housing 14, and a schematic planar cross-sectional view obtained by cutting the housing 14 slightly below the keyboard 20.

[0031] like Figure 2 As shown, a cooling module 22, a motherboard 24, and a battery device 26 are disposed inside the housing 14. Various electronic components and mechanical components are also disposed inside the housing 14.

[0032] The motherboard 24 is the mainboard of the electronic device 10. The motherboard 24 is located near the rear of the housing 14 and extends in the left-right direction. The motherboard 24 is a printed circuit board on which various electronic components, including the CPU 30 and GPU 31, are mounted, such as power supply components, communication modules, memory, and connection terminals. The motherboard 24 is located below the keyboard 20 and is screwed to the back of the keyboard 20, on the inner surface of the cover member 14A. The upper surface of the motherboard 24 serves as a mounting surface for mounting to the cover member 14A, and the lower surface serves as a mounting surface for mounting the CPU 30 and other components.

[0033] The CPU 30 is positioned near the left side of the center of the mounting surface of the motherboard 24. The CPU 30 performs the main control and processing calculations related to the electronic device 10. The GPU 31 is positioned on the mounting surface of the motherboard 24 to the right of the CPU 30. The GPU 31 performs the calculations required for image rendering, such as 3D graphics.

[0034] The battery device 26 is a rechargeable battery that powers the electronic device 10. The battery device 26 is located at the front of the motherboard 24 and extends laterally along the front end of the housing 14.

[0035] Next, the structure of the cooling module 22 will be described.

[0036] CPU 30 and GPU 31 are the electronic components with the highest heat generation levels among those housed within housing 14. Therefore, cooling module 22 absorbs and diffuses the heat generated by CPU 30 and GPU 31, further dissipating the heat to the outside of housing 14. Cooling module 22 is, for example, stacked in a manner that partially covers the mounting surface of motherboard 24.

[0037] like Figure 2 As shown, the cooling module 22 can include a heat spreader 36, a heat pipe 38, a pair of left and right heat sinks 40 and 41, a pair of left and right fans 42 and 43, and a heat conduction plate 44.

[0038] The vapor chamber 36 is a plate-type heat transfer device. The vapor chamber 36 is a structure in which a sealed space is formed between two thin metal plates, and a working fluid is sealed within this sealed space. The metal plates are made of a metal with high thermal conductivity, such as aluminum, copper, or stainless steel. The sealed space serves as a flow path for the sealed working fluid to flow while undergoing a phase change. Examples of working fluids include water, Freon substitutes, acetone, or butane. A core is provided within the sealed space to transport the condensed working fluid via capillary action. The core is formed of a porous body, such as a mesh obtained by weaving fine metal threads into a cotton-like structure, or micro-flow channels.

[0039] The vapor chamber 36 can absorb and diffuse the heat from the CPU 30 and GPU 31, and transfer the heat to the heat pipe 38 connected to the lower surface. Figure 2 In the accompanying drawings, reference numerals 30a and 31a refer to the heat-receiving plates sandwiched between the upper surface of the heat spreader 36 and the top surfaces of the CPU 30 and GPU 31, such as copper plates.

[0040] Heat pipe 38 is a tubular heat transfer device. Heat pipe 38 is a structure in which a metal tube is pressed and flattened to form an elliptical cross-section, and a working fluid is sealed in a closed space formed inside the metal tube. The materials and structures of the metal tube, closed space, working fluid, and core constituting heat pipe 38 can be the same as or similar to the materials and structures of the metal plate, closed space, working fluid, and core constituting the aforementioned heat spreader 36.

[0041] In this embodiment, the heat pipe 38 bends forward near its center, forming a roughly U-shape when viewed from above and extending in the left-right direction. The central portion 38a of the heat pipe 38 connects to the lower surface of the heat sink 36 at the point where it overlaps with the CPU 30 and GPU 31 in the vertical direction. One end 38b of the heat pipe 38 connects to the lower surface of the heat sink 40, and the other end 38b connects to the lower surface of the heat sink 41. Two or more heat pipes 38 can also be used side-by-side. In the cooling module 22, when only one set of heat sinks and a fan are provided, it is preferable that one end of the heat pipe 28 is connected to the CPU 30 and GPU 31, and the other end is connected to the heat sink.

[0042] The heat-conducting plate 44 is connected to the leading edge of the heat-spreading plate 36 and protrudes forward. The heat-conducting plate 44 is a thin plate made of metals such as aluminum and copper, or materials with high thermal conductivity such as graphite.

[0043] Next, the structure of heat sinks 40 and 41 and fans 42 and 43 will be explained.

[0044] like Figure 2 As shown, although the left and right heat sinks 40 and 41 differ slightly in size and heat exchange area, they can essentially be considered as a symmetrical structure. Similarly, the left and right fans 42 and 43 can also be considered as a symmetrical structure. Therefore, the following mainly describes the heat sink 41 and fan 43 on the right side, while the heat sink 40 and fan 42 on the left side are labeled with the same reference figures as on the right side, and detailed descriptions are omitted. Alternatively, it is also possible that the fans 42 and 43 and the heat sinks 40 and 41 are not a pair, but rather constituted by only one of them.

[0045] Figure 3 This is a 3D view of heat sink 41 and fan 43. Figure 4A This is a 3D view of heat sink 41. Figure 4B Observing from the opposite direction Figure 4A The three-dimensional view of the heat sink 41 shown. Figure 5 This is a front view of the heat sink 41 and its surrounding area. Figure 6 It is along Figure 5 A schematic cross-sectional view of the VI-VI line.

[0046] like Figure 2 , Figure 3 and Figure 6As shown, the fan 43 has a fan housing 43b with an air outlet 43a formed on one side surface. The fan 43 is positioned in front of the heat sink 41, with the rearward-opening air outlet 43a facing the front surface of the heat sink 41. The fan 43 is a centrifugal fan that uses a motor to rotate an impeller 43c housed inside the fan housing 43b. The fan housing 43b can be constructed, for example, by a cover plate 43d forming an upper surface and a side surface, and a cover plate 43e forming a lower surface. An intake port 43f is provided on each of the cover plates 43d and 43e. The intake port 43f may also be provided only on one of the cover plates 43d and 43e.

[0047] An air path 43g is formed inside the fan housing 43b. The air path 43g is the airflow path from the intake port 43f, through the periphery of the impeller 43c, to the outlet 43a. Figure 3 The single-dotted arrow shown schematically illustrates the flow of air. Figure 6 The same applies to the middle.

[0048] Figure 3 The air A in the diagram represents the airflow pattern where air is introduced from the intake 43f and flows along the air path 43g formed around the impeller 43c, gradually compressed, and thus its velocity increases as it reaches the outlet 43a. The outlet 43a is wider than the air path 43g. Therefore, the air A exiting the outlet 43a has a gradually decreasing velocity in the width direction (left-right direction) from the upstream wall 43b1 towards the downstream wall 43b2. Figure 3 As schematically shown, for the air exiting from the outlet 43a, the upstream air velocity A1 is the highest, followed by air velocities A2 and A3, while the downstream air velocity A4 is the lowest. However, the actual air velocity exiting from the outlet 43a of the fan 43 is not numerically differentiated like A1 to A4, but rather varies analogously. Therefore, within a small area, it is possible for the upstream and downstream air velocities to reverse. Based on this, in this embodiment, the air velocity exiting from the outlet 43a is illustrated using four levels: A1 to A4.

[0049] like Figures 2-6 As shown, the heat sink 41 (40) has: plate-shaped portions 46, 47, a plurality of fins 48 standing vertically and arranged horizontally between the plate-shaped portions 46, 47, and a pipe portion 50. The plate-shaped portions 46, 47 and the fins 48 can be formed of a metal with high thermal conductivity, such as copper, aluminum or stainless steel.

[0050] Plate-shaped portions 46 and 47 form the upper and lower surfaces of the heat sink 41, and are parallel to each other, spaced apart by the same distance as the height of the fins 48. Plate-shaped portions 46 and 47 are arranged parallel to the upper and lower surfaces of the fan housing 43b, respectively. The upper plate-shaped portion (first plate-shaped portion) 46 is configured to be substantially flush with the upper surface of the fan housing 43b, and closes the upper surface openings of the gaps G between the fins 48. The lower plate-shaped portion (second plate-shaped portion) 47 is configured to be substantially flush with the lower surface of the fan housing 43b, and closes the lower surface openings of the gaps G between the fins 48. The end 38b of the heat pipe 38 is joined to the outer surface (lower surface) of the plate-shaped portion 47 by welding or the like.

[0051] Although details will be described below, as Figure 7A and Figure 7B As shown, in this embodiment, the heat sink 41 arranges the plates 48a and 48b of each fin 48 in the left-right direction to form plate-shaped portions 46 and 47. Alternatively, the plate-shaped portions 46 and 47 may each be formed from a single metal plate.

[0052] The fins 48 are formed from a thin plate that stands upright in the vertical direction and extends in the front-back direction between the plate-shaped portions 46 and 47. Each fin 48 is arranged with a gap G between it and the other fins 41 in the width direction (left-right direction) of the heat sink 41 along the width direction of the air outlet 43a. Thus, the gap G between adjacent fins 48 in the heat sink 41 becomes an airflow path for air from the air outlet 43a to pass through. The fin spacing (width of the gap G) of each fin 48 can be set, for example, to 1 mm. Figure 4A , Figure 4B and Figure 6 As shown, each fin 48 may also have an inclined shape portion 48c provided on the portion extending from the edge 46a and opening 52 of the plate-shaped portion 46 toward the air outlet 43a. The inclined shape portion 48c gradually slopes downward from the outlet side (rear side) of the heat sink 41 toward the air outlet 43a side (front side) and is inserted into the fan housing 43b. Alternatively, each fin 48 may not have such an inclined shape portion 48c, but may be formed in a rectangular shape when viewed from the side.

[0053] The duct section 50 is a path for discharging dust D, which is drawn in along with air by the fan 43 and discharged from the outlet 43a towards the heat sink 41. Examples of dust D include dirt, dust particles, fibers, and hair. The duct section 50 is an airflow path formed in a pipe shape, with the fin spacing of the fins 48 being larger than other parts. The duct section 50 has a width larger than the gap G. Figure 5As shown, the dimension of the heat sink 41 in the width direction is referred to as the width W, and the dimension of the pipe section 50 in the width direction is referred to as the width W1. Thus, the width W1 can be set to approximately 10% to 20% of the width W. When the fin spacing is, for example, 1 mm as described above, the width W1 of the pipe section 50 can be set to approximately 5 mm to 15 mm.

[0054] The duct section 50 is disposed near the downstream side (the side near the wall portion 43b2) of one of the two ends 41a and 41b of the heat sink 41 in the width direction, at least within the fan housing 43b in the airflow direction. The duct section 50 is formed, for example, between the right end of the fin 48 at the forming end 41b and an adjacent fin 48 facing that fin 48 across a width W1. The upper and lower openings between the fins 48, 48 of the duct section 50 arranged at a spacing of width W1 are closed by plate-shaped portions 46 and 47. Thus, the duct section 50 is formed as a rectangular cylindrical airflow path extending in the front-rear direction.

[0055] The duct portion 50 can also be provided at one of the two ends 41a and 41b of the heat sink 41 in the width direction, near the end 41a on the upstream side (wall portion 43b1 side) in the airflow direction within the fan housing 43b. However, in this embodiment, the heat sink 41 does not have the duct portion 50 provided near the end 41a on the upstream side.

[0056] The heat sink 41 may have an opening 52 on the plate-shaped portion 46 forming the upper surface. The opening 52 may be formed as a concave opening, which is formed by forming a notch in a portion of the edge 46a of the plate-shaped portion 46 facing the air outlet 43a in a direction away from the air outlet 43a. The opening 52 may be formed in a region including the center in the width direction of the heat sink 41. The opening 52 forms a bypass path that allows a portion of the air exiting from the air outlet 43a to bypass and be discharged near the front. The opening 52 may be provided at a central position that avoids a predetermined range from the upstream end 41a and a predetermined range from the downstream end 41b. In other words, in this embodiment, the opening 52 is not provided on the two ends 41a, 41b of the heat sink 41. Therefore, the opening 52 is not provided on the duct portion 50.

[0057] like Figure 4A and Figure 4B As shown, each fin 48 (hereinafter, sometimes referred to as "fin 48A") located near the upstream end 41a without an opening 52 is longer in the airflow direction (front-back direction) than the fins 48 of other parts.

[0058] As described above, the cooling module 22 of this embodiment includes a heat sink 41 having a plurality of fins 48 arranged with gaps between them and positioned facing the air outlet 43a of the fan 43. The heat sink 41 has a duct portion 50 with a larger fin spacing than other portions. The duct portion 50 is located near the downstream end 41b at one of the two ends 41a, 41b along the width direction of the air outlet 43a in the width direction of the heat sink 41.

[0059] The cooling module 22 allows dust D, drawn in by the fan 43 and discharged along with air from the outlet 43a toward the heat sink 41, to be smoothly discharged out of the housing 12 through the duct section 50. That is, the heat sink 41 only has the duct section 50, which is formed by widening the fin spacing, in a localized area. Therefore, the heat sink 41 can sufficiently ensure the heat exchange area with the air from the outlet 43a through each fin 48 except for the duct section 50. On the other hand, the fin spacing on the fins 48 other than the duct section 50 is, for example, as small as about 1 mm, and may be blocked by dust D, for example, several millimeters in size. If the heat sink 41 is blocked by dust D, the airflow will decrease, and the heat exchange performance will likely decrease. In this respect, the heat sink 41 can smoothly discharge dust D through the duct section 50 with widened fin spacing.

[0060] In particular, the duct section 50 is located near the downstream end 41b, at least in the width direction of the heat sink 41. In other words, the duct section 50 is positioned in the width direction of the heat sink 41 to allow airflow of minimum velocity A4. Therefore, although the surface area of ​​the fins 48 of the heat sink 41 is reduced due to the duct section 50, the impact on the overall heat exchange performance is minimized. Moreover, the dust D discharged to the rear surface of the heat sink 41 is pressed against the rear end face of each fin 48, and some of the dust D gradually moves from the upstream side to the downstream side. As a result, the dust D is guided towards the duct section 50 located downstream of the heat sink 41, and discharged to the outside more efficiently.

[0061] Therefore, even when the electronic device 10 is used for many years in harsh environments with a lot of dust and dirt, the cooling module 22 can prevent dust D from clogging the heat sink 41. As a result, the cooling module 22 can maintain the heat exchange performance of the heat sink 41 for a longer period of time and can maintain the cooling performance for a longer period of time.

[0062] As described above, the duct portion 50 can also be located near the upstream end 41a in the width direction of the heat sink 41. However, it is preferable that the duct portion 50 is not located on the end 41a side. That is, if only the dust D discharge efficiency is considered, it is preferable that the duct portion 50 is also located on the end 41a side. However, the gap G between the fins 48A on the end 41a side allows high-velocity air A1 to pass through. Therefore, if the duct portion 50 is also located on the end 41a side, the overall heat exchange performance of the heat sink 41 may be significantly reduced. Therefore, the heat sink 41 of this embodiment balances heat exchange performance and dust D discharge efficiency, and therefore, the duct portion 50 is only located on the downstream end 41b side.

[0063] Therefore, it is preferable that fin 48A is longer in the airflow direction than other parts of the fin 48. In this way, the heat sink 41 can ensure a larger heat exchange area between the high-velocity air A1 from the air outlet 43a and the fin 48A, thereby improving heat exchange efficiency.

[0064] The heat sink 41 is a structure in which multiple fins 48 are arranged and erected between plate-shaped portions 46 and 47 extending along its width direction. The plate-shaped portion 46 may have an opening 52 formed by partially creating a notch in the edge 46a facing the air outlet 43a. The opening 52 allows a portion of the air exiting the air outlet 43a to bypass and be discharged. Thus, the heat sink 41 allows a portion of the air to pass through the opening 52 (see reference). Figure 6 The air in the opening 52 (A5) reduces ventilation resistance and improves heat exchange performance. Furthermore, the opening 52 also allows a portion of the dust D from the outlet 43a to be discharged (see reference). Figure 6 ).

[0065] The opening 52 is not located at either end 41a or 41b of the heat sink 41. This prevents air A5 passing through the opening 52 from being discharged laterally from either end 41a or 41b along the width of the heat sink 41. As a result, the opening 52 prevents excessive reduction in the amount of air flowing through the gaps G between the fins 48, thus avoiding a decrease in heat exchange performance.

[0066] However, on the one hand, the heat sink 41 has such an opening 52 located in the central part of its width. On the other hand, there is a problem that dust D cannot easily pass through at the two ends 41a, 41b where the opening 52 is not provided. Furthermore, the two ends 41a, 41b are located along the wall portions 43b1, 43b2 of the fan housing 43b, so dust D is more likely to accumulate. In this regard, the heat sink 41 is provided with a duct portion 50 at least at the end 41b. Therefore, the heat sink 41 also achieves a better dust D discharge effect on the side of the opening 52.

[0067] Here, an example of a method for manufacturing the heat sink 41 (40) of this embodiment will be described. Figure 7A This is a front view showing the disassembled pipe section 50 and its surrounding parts of the heat sink 41. Figure 7B It means to Figure 7A The front view showing the fins 48 in the state of being joined together.

[0068] like Figure 4A , Figure 4B , Figure 7A and Figure 7B As shown, the heat sink 41 (40) can be constructed by stacking multiple fins 48 with plates 48a and 48b bent at their upper and lower ends in the vertical direction, respectively, and interlocking them with each other. Plate 48a is a fin-like portion formed by bending one end (upper end) of the fin 48 in the vertical direction. Plate 48b is a fin-like portion formed by bending the other end (lower end) of the fin 48 in the vertical direction. Each plate 48a and 48b protrudes toward the adjacent fin 48. Each plate 48a and 48b protrudes in the same direction.

[0069] In this embodiment, each fin 48 is formed into a plate shape by arranging each plate 48a continuously with each other, thereby constituting a plate-shaped portion 46. Each fin 48 is formed into a plate shape by arranging each plate 48b continuously with each other, thereby constituting a plate-shaped portion 47.

[0070] The fins 48 (hereinafter sometimes referred to as "fins 48B") constituting the pipe section 50 are configured such that the protruding lengths of the plates 48a and 48b are larger than those of the other fins 48. Therefore, the heat sink 41 can easily form the pipe section 50 simply by arranging and joining the fins 48 and fins 48B. Furthermore, the fin 48A is configured such that its length in the front-to-back direction is longer than that of the other fins 48.

[0071] The structure of the piping section is not limited to the above. Figure 8 This is a front view of the heat sink 41 and its surrounding portion of the pipe section 50A involved in the first modified example.

[0072] The aforementioned pipe section 50 is formed between two fins 48, 48. In contrast, Figure 8 The heat sink 41 (40) shown arranges two or more fins 48 (hereinafter, sometimes referred to as "fins 48C") with an enlarged fin spacing compared to other portions, and the gaps between the fins 48C are respectively configured as conduits 50A. The fin spacing of the fins 48C is, for example, more than twice the fin spacing of the other fins 48. As a result, the conduits 50A can facilitate the discharge of dust D of a certain size and increase the heat exchange area compared to the conduits 50.

[0073] Figure 9 This is a front view of the heat sink 41 and its surrounding portion of the pipe section 50B involved in the second variation.

[0074] The aforementioned pipe section 50 spans the entire height of fins 48 in the vertical direction. In comparison, Figure 9 The channel portion 50B of the heat sink 41 (40) shown is formed approximately halfway down the entire height of the fins 48 in the vertical direction. Therefore, above the channel portion 50B, the fins 48 (hereinafter sometimes referred to as "fins 48D"), which are configured to be lower than the other portions, are arranged side-by-side with the other portions. The lower surface openings of the gaps G between each fin 48D are closed by plate-shaped portions 54 that have a height difference with the plate-shaped portions 47 of the other portions. Thus, the channel portion 50B also allows for the discharge of a larger amount of dust D in the width direction, increasing the heat exchange area compared to the channel portion 50.

[0075] like Figure 10 As shown in the pipe section 50C of the third variation, the pipe section 50B can also adopt a structure in which the plate-like section 54 forming its upper surface is omitted. For Figure 10 In the case of the duct section 50C shown, the lower surface of the gap G between the fins 48D is open. As a result, the dust discharge efficiency of the duct section 50C is improved compared to that of the duct section 50B.

[0076] Figure 11 This is a front view of the heat sink 41 and its surrounding portion of the pipe section 50D involved in the fourth variation.

[0077] Figure 11 The pipe section 50D shown is with Figure 9 The pipe section 50B shown has a structure that flips up and down. That is, Figure 11The channel portion 50D of the heat sink 41 (40) shown is formed approximately halfway down the entire height of the fins 48 in the vertical direction. Therefore, above the channel portion 50D, the fins 48 (hereinafter sometimes referred to as "fins 48E"), which are configured to be lower than the other portions, are arranged side by side with the other portions. The upper surface openings of the gaps G between each fin 48E are closed by plate-shaped portions 55 that have a height difference with the plate-shaped portions 46 of the other portions. As a result, the channel portion 50D also allows for the discharge of a larger amount of dust D in the width direction, and can increase the heat exchange area compared to the channel portion 50.

[0078] like Figure 12 As shown in the fifth modified example, the pipe section 50E, the pipe section 50D can also adopt a structure in which the plate-like section 55 forming its lower surface is omitted. For Figure 12 In the case of the duct section 50E shown, the upper surface of the gap G between the fins 48E is open. As a result, the dust discharge efficiency of the duct section 50E is higher than that of the duct section 50D.

[0079] Furthermore, the present invention is not limited to the above-described embodiments, and it is self-evident that it can be freely modified within the scope of the spirit of the present invention.

Claims

1. A cooling module, which is mounted on an electronic device, characterized in that, have: A fan, which has an air outlet; and The heat sink has multiple fins arranged with gaps between them and is positioned facing the air outlet. The heat sink has a channel section where the fin spacing of the fins is larger than in other sections. The duct is located at least near the downstream end of the fan in the airflow direction at both ends of the heat sink along the width direction of the air outlet.

2. The cooling module according to claim 1, characterized in that, The heat sink has a structure in which the plurality of fins are arranged and erected between a first plate-shaped portion and a second plate-shaped portion extending along the width direction of the heat sink. The first plate-shaped portion has an opening that allows a portion of the air exiting the air outlet to be discharged. The opening is not located at either end of the heat sink.

3. The cooling module according to claim 1 or 2, characterized in that, The pipe section is not located at either end of the heat sink, but at the upstream end of the fan in the direction of airflow.

4. The cooling module according to claim 3, characterized in that, For multiple fins located near the upstream end where the duct section is not provided, their length in the airflow direction is longer than that of the fins in other parts.

5. The cooling module according to claim 1, characterized in that, The duct section is located near one end or the other end of the fin in the upright direction.

6. An electronic device, characterized in that, have: case; A heating element, disposed within the housing; and A cooling module, disposed within the housing, cools the heating element. The cooling module includes: A fan, which has an air outlet; and The heat sink has multiple fins arranged with gaps between them and is positioned facing the air outlet. The heat sink has a channel section where the fin spacing of the fins is larger than in other sections. The duct is located at least near the downstream end of the fan in the airflow direction at both ends of the heat sink along the width direction of the air outlet.

7. The electronic device according to claim 6, characterized in that, The heat sink has a structure in which the plurality of fins are arranged and erected between a first plate-shaped portion and a second plate-shaped portion extending along the width direction of the heat sink. The first plate-shaped portion has an opening that allows a portion of the air exiting the air outlet to be discharged through an opening formed in such a way that a notch is partially formed on the edge facing the air outlet. The opening is not located at either end of the heat sink.

8. The electronic device according to claim 6 or 7, characterized in that, The pipe section is not located at either end of the heat sink, but at the upstream end in the airflow direction of the fan.

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