NPU module plug-in frame heat dissipation system

Abstract

The invention discloses an NPU module plug-in frame cooling system, and belongs to the technical field of computer equipment.The NPU module plug-in frame cooling system comprises a server framework, first handles are arranged on the two sides of the server framework, and a first base is installed on the server framework; a first cavity is formed in the server frame, an NPU module, a cold liquid plate for heat dissipation, a heat exchanger and a first liquid pump are arranged in the first cavity, an inlet of the first liquid pump is connected to the heat exchanger through a first liquid inlet pipeline, and an outlet of the first liquid pump is connected to the cold liquid plate through a second liquid inlet pipeline; an outlet of the liquid cooling plate is connected with the heat exchanger through a first liquid return pipeline to form a liquid cooling circulation loop, an air cooling mechanism is further arranged in the first cavity, the liquid cooling loop directly conducts heat efficiently for the high-heat-density NPU chip, and the air cooling mechanism is responsible for rapidly dissipating heat collected by the liquid cooling loop into the environment. And the temperature of the key heat source is effectively controlled.

Description

Technical Field

[0001] This invention relates to the field of computer equipment technology, specifically to an NPU module slot heat dissipation system. Background Technology

[0002] With the rapid development of artificial intelligence, big data analytics, and cloud computing technologies, the NPU (Neural Processing Unit), as the core of their computing power, is evolving towards higher computing density and stronger parallel processing capabilities. Consequently, the power consumption and heat generation of NPU chips are surging, with their heat flux density far exceeding the limits of traditional air-cooling technologies. If the generated heat cannot be dissipated in a timely and efficient manner, the NPU core temperature will rise sharply, leading to chip frequency reduction, calculation errors, and even hardware damage, severely restricting the continuous output of computing power and hardware reliability.

[0003] For high-performance NPU modules with power consumption in the hundreds or even thousands of watts, simply increasing fan airflow and fin area is no longer sufficient. Forced air cooling not only generates significant noise, but its heat dissipation efficiency and energy efficiency are also unsatisfactory in high-density server racks. Although liquid cooling technology offers higher heat dissipation efficiency, its application in standard server racks faces significant challenges. The system needs to integrate multiple components such as liquid pumps, piping, cold plates, and heat exchangers. How to rationally arrange these components within a limited space while ensuring their sealing, reliability, and maintainability is a design challenge. When maintenance or replacement of NPU modules or heat dissipation components is required, traditional complex piping connections make operations extremely inconvenient and increase downtime. Furthermore, a single point of failure in the cooling system (such as the failure of a single liquid pump) can cause the entire computing node to crash, highlighting the need to improve system reliability. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide an NPU module insert frame heat dissipation system.

[0005] The objective of this invention is achieved through the following technical solution: An NPU module heat dissipation system includes a server frame, with first handles on both sides of the server frame and a first base installed on the server frame at the end away from the first handles. The server frame has a first cavity inside, and an NPU module, a coolant plate installed on the NPU module for heat dissipation, a heat exchanger, and a first liquid pump located between the heat exchanger and the coolant plate are disposed in the first cavity. The inlet of the first liquid pump is connected to the heat exchanger through a first liquid inlet pipe, and the outlet of the first liquid pump is connected to the cold liquid plate through a second liquid inlet pipe; The outlet of the cold liquid plate is connected to the heat exchanger through a first liquid return pipeline, forming a liquid cooling circulation loop. An air cooling mechanism for dissipating heat from the heat exchanger is also provided in the first cavity.

[0006] Preferably, the air cooling mechanism includes a pluggable fan module and a fan backplane installed between the heat exchanger and the fan module. A second cavity for accommodating the fan module is provided in the server frame. The heat exchanger is provided with a plurality of fins distributed at equal intervals. A junction box is also installed in the first cavity, and the junction box is connected to the NPU module through a cable.

[0007] Preferably, a first cover plate and a second cover plate are installed on the server frame. The two cover plates are respectively used to cover the first cavity and the second cavity, and the first cover plate and the second cover plate are respectively disposed on both sides of the fan backplane.

[0008] Preferably, a second liquid pump is provided in the first cavity. The second liquid pump is located between the heat exchanger and the cold liquid plate, and the second liquid pump is connected in series with the first liquid pump.

[0009] Preferably, the main body of the cold liquid plate is a "mouth" - shaped outer frame structure. An NPU chip cold plate is separately provided inside the cold liquid plate at a position corresponding to the NPU chip. Both sides of the NPU chip cold plate are connected to the outer frame structure through pipelines.

[0010] Preferably, a second base is fixedly connected to the bottom of the second cavity. A limiting column is installed on the second base. A limiting groove cooperating with the limiting column is provided on the side of the fan module. Second handles are symmetrically arranged on the top of the fan module.

[0011] Preferably, first bottom plates are symmetrically fixed to the top of the second base, and first top plates are symmetrically fixed to the bottom of the fan module. When the limiting columns are inserted into the corresponding limiting grooves, the two first top plates just descend and respectively abut against the opposite side surfaces of the two first bottom plates, forming a lateral restraint.

[0012] Preferably, limiting components are symmetrically distributed at the bottom of the fan module. The limiting components are used to drive the first top plate to abut against the first bottom plate. The limiting components include: An L - shaped bracket fixedly connected to the bottom of the fan module, and a first through - hole is provided on the L - shaped bracket; A first screw rod, with a first hinge seat installed at one end of the first screw rod. The first hinge seat is connected to the side surface of the first top plate, and the other end of the first screw rod passes through the first through - hole; A first nut sleeved on the first screw rod. The first nut is in threaded cooperation with the first screw rod, and the side surface of the first nut abuts against the side surface of the L - shaped bracket.

[0013] Preferably, a first spring and a second nut are sleeved on the first screw, the second nut is threadedly engaged with the first screw, and the first spring is located between the second nut and the first top plate.

[0014] Preferably, the first top plate has a second through groove on its side, and the corresponding first bottom plate has a first through groove. The second base has a guide groove. An I-shaped slider is horizontally slidable within the guide groove, and a first insert is mounted on the top of the I-shaped slider. An electric telescopic rod is installed inside the second base and connected to the I-shaped slider via a push rod to drive its sliding. A guide optical shaft and a slide block are also provided. The guide optical shaft is located inside the second base, with both ends mounted via fixed seats. The slide block slidably engages with the guide optical shaft and is fixedly connected to the side of the I-shaped slider.

[0015] The beneficial effects of this invention are: I. In this invention, by innovatively combining liquid cooling and air cooling, the liquid cooling circuit (cold liquid plate, liquid pump, heat exchanger) directly and efficiently conducts heat to the high heat density NPU chip, while the air cooling mechanism (fan module, finned heat exchanger) is responsible for rapidly dissipating the heat collected by the liquid cooling circuit into the environment, forming a well-defined and highly efficient tiered heat dissipation system; the cold liquid plate adopts a design that combines a "U"-shaped outer frame with an independent NPU chip cold plate, achieving precise and centralized cooling of the heat-generating core and ensuring effective control of the temperature of key heat sources.

[0016] II. The fan module's fixing mechanism integrates lateral constraint (top / bottom plate fit), threaded clamping (screw / nut), and mechanical interlocking (insert block / through slot) for triple protection. This design effectively resists vibration during long-term operation, prevents loosening of the connection, ensures stable fan operation and good contact with the backplate interface, thereby guaranteeing continuous and stable air cooling performance. The hinged design (first hinge seat) in the limiting component allows for adaptive adjustment of the clamping force, avoiding stress concentration caused by machining or assembly tolerances and protecting component lifespan. The addition of springs and double nuts provides continuous anti-vibration preload, further enhancing the long-term stability of the connection. Driven by an electric telescopic rod, combined with a precision guide mechanism (guide shaft / slide), the locking and unlocking of the fan module is automated. This not only improves operational efficiency but also reduces human error. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the server framework of the present invention; Figure 3 This is a schematic diagram of the two cover plate structures on the server frame of the present invention; Figure 4 This is a schematic diagram of the NPU module and coolant plate distribution structure of the present invention; Figure 5 This is a top view of the overall connection structure of the fan module of the present invention; Figure 6 This is a bottom view of the overall connection structure of the fan module of the present invention; Figure 7 This is a schematic plan view of the overall connection structure of the fan module of the present invention; In the diagram, 1. Server frame; 2. NPU module; 3. First liquid pump; 4. Second liquid pump; 5. Coolant plate; 6. First return pipe; 7. First inlet pipe; 8. Second inlet pipe; 9. Heat exchanger; 10. Fan backplate; 11. Fan module; 12. First cover plate; 13. Second cover plate; 14. Junction box; 15. Cable; 16. First base; 17. First handle; 18. Limiting post; 19. Limiting groove; 20. Second handle; 22. First top plate; 23. First bottom plate; 24. First through slot; 25. Second through slot; 26. First screw; 27. First hinge seat; 28. First nut; 29. ​​L-shaped bracket; 30. Second nut; 31. First spring; 32. First insert block; 33. I-shaped slider; 34. Push rod; 35. Electric telescopic rod; 36. Guide shaft; 37. Slide seat; 38. Second base; 39. Guide slot. Detailed Implementation

[0018] Example 1 like Figures 1-4As shown, an NPU module frame cooling system is provided, including a server frame 1. First handles 17 are provided on both sides of the server frame 1 for easy handling and installation. A first base 16 is installed on the server frame 1 at the end away from the first handles 17 to enhance structural stability. A first cavity is formed inside the server frame 1, which integrates an NPU module 2, a coolant plate 5, a heat exchanger 9, and a first liquid pump 3. The first cavity contains the NPU module 2, the coolant plate 5 mounted on the NPU module 2 for heat dissipation, the heat exchanger 9, and the first liquid pump 3 located between the heat exchanger 9 and the coolant plate 5. The inlet of the first liquid pump 3 is connected to the heat exchanger 9 through a first inlet pipe 7, and the outlet of the first liquid pump 3 is connected to the coolant plate 5 through a second inlet pipe 8. The outlet of the coolant plate 5 is connected to the heat exchanger 9 through a first return pipe 6, forming a liquid cooling circulation loop. An air-cooling mechanism for dissipating heat from the heat exchanger 9 is also provided in the first cavity. Specifically, the inlet of the first liquid pump 3 is connected to the heat exchanger 9 through the first liquid inlet pipe 7, and the outlet is connected to the cold liquid plate 5 through the second liquid inlet pipe 8; the outlet of the cold liquid plate 5 is connected back to the heat exchanger 9 through the first liquid return pipe 6, forming a closed coolant flow path; driven by the first liquid pump 3, the coolant flows out of the heat exchanger 9, absorbs heat through the cold liquid plate 5, and then returns to the heat exchanger 9 for heat dissipation, thus achieving efficient thermal management.

[0019] To enhance heat dissipation, a cooling mechanism is also installed in the first cavity. This mechanism includes a pluggable fan module 11 and a fan backplate 10 installed between the heat exchanger 9 and the fan module 11. The server frame 1 has a second cavity for accommodating the fan module 11. The heat exchanger 9 has multiple evenly spaced fins to increase the heat dissipation area. When the fan module 11 is working, airflow carries away heat through the fins, improving overall heat dissipation efficiency. A junction box 14 is also installed in the first cavity. The junction box 14 is connected to the NPU module 2 via a cable 15 to ensure power supply and data transmission. In this transmission process, the fan backplate 10 typically integrates a control chip that receives commands from the system management unit (such as the BMC). Based on the NPU's temperature or system load, it precisely adjusts the speed of each fan, ensuring effective heat dissipation while achieving energy saving and noise reduction. It also monitors fan speed, operating status, and fault detection in real time, reporting this information to the system management unit. Upon detecting a fan fault, it immediately issues an alarm. The fan backplate 10 is securely mounted on the server frame 1, providing a rigid and precise mounting reference surface for the pluggable fan modules 11. This ensures that the fan modules 11 are always inserted in the correct position, and the relative position between the fan backplate 10 and the heat exchanger 9 is fixed. This design helps to create a closed, efficient airflow path. When the fans are operating, airflow is forced through the fins of the heat exchanger 9 instead of dissipating outwards, maximizing heat dissipation efficiency. It acts as an "air guide," ensuring that all airflow is used to dissipate heat from the heat exchanger 9.

[0020] like Figure 2 and Figure 3 As shown, a first cover plate 12 and a second cover plate 13 are installed on the server frame 1. The two covers are used to cover the first cavity and the second cavity respectively. The two covers are placed on both sides of the fan back plate 10 to facilitate maintenance and access to internal components. The first cover plate 12 and the second cover plate 13 are placed on both sides of the fan back plate 10. In the first cavity, a second liquid pump 4 is also provided, located between the heat exchanger 9 and the coolant plate 5. The second liquid pump 4 is connected in series with the first liquid pump 3 to form a redundant pumping system, which improves the reliability and flow stability of the cooling circuit. In addition, when one of the liquid pumps fails, the other liquid pump can still play a role in heat dissipation.

[0021] like Figure 2 and Figure 4 As shown, the main body of the coolant plate 5 is a "U"-shaped outer frame structure. Inside the coolant plate 5, an NPU chip cold plate is separately set at the position corresponding to the NPU chip. The two sides of the NPU chip cold plate are connected to the outer frame structure through pipes to achieve targeted local cooling. The low-temperature coolant from the heat exchanger 9, driven by the first liquid pump 3, enters the "U"-shaped outer frame of the coolant plate 5 through the second liquid inlet pipe 8. The coolant is distributed and flows into the microchannel inside the independent cold plate corresponding to the NPU chip. When the coolant flows through the microchannel, it undergoes intense heat exchange with the high-speed NPU chip, absorbing a large amount of heat and raising its own temperature. The high-temperature coolant that has absorbed heat flows out from the chip cold plate and returns to the "U"-shaped outer frame. Finally, it is pumped to the heat exchanger 9 for cooling through the first liquid return pipe 6. At the heat exchanger 9, the heat is carried away by the airflow generated by the fan module 11. After the coolant cools down, the next cycle begins.

[0022] Example 2 like Figures 5-7As shown, the stable installation of the fan module 11 is crucial to the overall heat dissipation effect. If the fan is loose, the air cooling efficiency will decrease, which may lead to NPU overheating. Therefore, these structures not only affect mechanical fixation but also directly relate to heat dissipation performance. The pluggable design of the fan module 11 improves the installation method to reduce downtime, while mechanical constraints replacing screws speed up maintenance. The bottom of the second cavity is fixedly connected to the second base 38, and the second base 38 is equipped with a limiting post 18. The side of the fan module 11 has a limiting groove 19 for positioning with the limiting post 18. In the initial stage of inserting the fan module 11, the cooperation between the limiting post 18 and the limiting groove 19 acts as a "guide rail," guiding the fan module 11 into the second cavity in the correct direction and angle, preventing insertion failure or component damage due to misalignment. This is the key first step in achieving "blind insertion" (insertion without directly seeing the mating point) or quick alignment. The top of the fan module 11 is symmetrically equipped with second... The symmetrically designed handle 20 provides operators with a clear point of leverage, allowing for easy removal or insertion of the fan module 11 in dense server racks without the need for special tools. This greatly simplifies maintenance and replacement processes and meets the needs of rapid operation and maintenance in data centers. The top of the second base 38 is symmetrically fixed with the first base plate 23, and the bottom of the fan module 11 is symmetrically fixed with the first top plate 22. When the limiting post 18 is inserted into the corresponding limiting slot 19, the two first top plates 22 descend and abut against the opposing sides of the two first base plates 23, forming a lateral constraint. When the fan is working, it will generate multi-dimensional vibrations. This lateral constraint can effectively prevent the fan module 11 from shaking in the horizontal plane (front and back, left and right). The vibration force is transmitted through the first base plate 23 to the second base 38 and the entire server frame 1, avoiding connector loosening or structural fatigue caused by long-term vibration. It ensures that the electrical interface between the fan module 11 and the fan backplate 10 can be precisely aligned and in close contact.

[0023] like Figures 5-7As shown, symmetrically distributed limit components are located at the bottom of the fan module 11. These limit components actively and forcibly drive the first top plate 22 to press tightly against the first bottom plate 23, thereby transforming the previously mentioned "lateral constraint" concept into a robust, reliable, and operable mechanical connection. The components include: an L-shaped bracket 29, fixedly connected to the bottom of the fan module 11, with a first through hole on the L-shaped bracket 29; and a first screw 26, with a first hinge 27 mounted at one end of the first screw 26. A hinge 27 is connected to the side of the first top plate 22, and the other end of the first screw 26 passes through the first through hole; a first nut 28 is sleeved on the first screw 26, and the first nut 28 is threadedly engaged with the first screw 26. The side of the first nut 28 abuts against the side of the L-shaped bracket 29. By rotating the first nut 28, it is screwed into the first screw 26; because the side of the first nut 28 abuts against the L-shaped bracket 29, it cannot move forward, but instead pulls the first screw 26 backward. The first screw 26 is driven by the first hinge... The seat 27 drives the first top plate 22 to move towards the L-shaped bracket 29 (i.e., towards the first bottom plate 23), thereby generating a huge, controllable clamping force between the two plates. The applied force is precisely provided by the mechanical advantages of the thread, ensuring the firmness of the connection. The threaded fit itself has a self-locking characteristic. Once the first nut 28 is tightened, it will not loosen on its own under normal vibration, which makes the fixing method very reliable. It can maintain a strong preload for a long time without the need for additional pins or snap rings, effectively resisting the vibration generated by the continuous operation of the fan and preventing the fan module 11 from loosening. The first hinge seat 27 is a hinged connection, which allows a small degree of angular freedom between the first screw 26 and the first top plate 22. During installation, if the contact surfaces of the first top plate 22 and the first bottom plate 23 are not parallel, the rigid connection will generate huge installation stress, causing component deformation or wear. The hinged design allows the system to self-adjust, ensuring that the clamping force is evenly distributed across the entire contact surface, avoiding stress concentration, and improving the stability and life of the structure.

[0024] like Figure 6As shown, a first spring 31 and a second nut 30 are fitted onto the first screw 26. The second nut 30 is threaded into the first screw 26. The first spring 31 is located between the second nut 30 and the first top plate 22. When the second nut 30 is tightened, it compresses the first spring 31 located between it and the first top plate 22. The compressed spring generates a continuous thrust pointing towards the first top plate 22. This thrust is ultimately applied to the contact surface between the top plate and the bottom plate through the first hinge 27, maintaining a compressed state. Under the long-term vibration environment generated by the fan operation, ordinary threaded connections (such as those with only one first nut 28) may gradually loosen due to small reciprocating movements (this phenomenon is called "vibration loosening"). However, the first spring 31 here always maintains an expanding trend, which can compensate for the vibration in real time and dynamically. The tiny gap; even if the second nut 30 has an extremely slight tendency to loosen, the elastic force of the first spring 31 will immediately follow, ensuring that the preload does not disappear, thereby achieving the anti-loosening effect. The second nut 30 is usually used as a locking nut here. In use, first tighten the first nut 28 to generate the main locking force, and then tighten the second nut 30 to compress the spring and finally press against the side of the first nut 28 or the L-shaped bracket 29. In this way, a strong frictional force is formed between the threads of the two nuts and the screw, locking them together and greatly reducing the possibility of either one rotating and loosening on its own. The spring is an elastic element, while the previous structure (screw, nut, top plate, bottom plate) is almost rigid. The addition of the elastic element gives the whole system a buffer that can deform slightly to absorb energy when subjected to impact or thermal expansion and contraction.

[0025] Example 3 like Figures 5-7As shown, a second through groove 25 is provided on the side of the first top plate 22, and a first through groove 24 is provided on the corresponding first bottom plate 23. A guide groove 39 is provided on the second base 38. An I-shaped slider 33 is horizontally slidable in the guide groove 39, and a first insert block 32 is installed on the top of the I-shaped slider 33. An electric telescopic rod 35 is installed inside the second base 38 and is connected to the I-shaped slider 33 through a push rod 34 to drive its sliding. A guide optical shaft 36 and a slide block 37 are provided. The guide optical shaft 36 is located inside the second base 38, and both ends of the guide optical shaft 36 are installed through fixed seats. The slide block 37 is slidably engaged with the guide optical shaft 36. 7 is fixedly connected to the side of the I-shaped slider 33. The through slots on the first top plate 22 and the first bottom plate 23 are aligned. The I-shaped slider 33, with the first insert 32, can slide horizontally through these two slots, locking the upper and lower plates together like a pin. This is equivalent to adding a mechanical interlock on the basis of the previous screw and nut clamping force, providing double insurance. This makes the fixing of the fan module 11 no longer dependent on manual screw tightening, but mechanical locking / unlocking, which is particularly suitable for data center environments that require frequent maintenance. The addition of the guide optical axis 36 and the slide block 37 ensures smooth and precise sliding and avoids jamming. The sliding pin mechanism driven by the electric telescopic rod 35 replaces the traditional manual screw or buckle operation. The system mechanically interlocks the first top plate 22 and the first bottom plate 23 vertically, forming an extremely stable connection. Driven by the electric telescopic rod 35, the entire locking process (pushing out the push rod 34, then sliding the I-shaped slider 33, and then inserting the first insert block 32 into the through slot) can be completed instantly without any manual intervention. In large data centers, maintenance personnel can remotely or on-site fix or release the fan module 11 with a single click, greatly shortening maintenance time. Combined with the manual limit component, it prevents the fan module 11 from jumping upwards due to vibration or accidental collision, achieving complete constraint in all directions. The strength of the mechanical interlock is far higher than that relying solely on friction (such as screw pressure). The tight fixing method can withstand greater impact and vibration. The guide optical shaft 36 and the slide 37 ensure that the first insert 32 can be accurately inserted into the narrow through slot, avoiding jamming or damage caused by misalignment. The guide optical shaft 36 can effectively withstand the lateral force generated during insertion and removal, protect the push rod 34 of the electric telescopic rod 35 from bending moment, and extend its service life. Through the composite constraint of "lateral constraint (top plate / bottom plate) plus vertical interlock (insert block / through slot)," the fan module 11 is integrated with the server frame 1, achieving optimal vibration resistance and realizing the automation of the fixing process. This is a key step towards intelligent data center operation and maintenance, and significantly reduces the cost and time of manual operation.

Claims

1. A heat dissipation system for an NPU module mounting frame, characterized in that, It includes a server frame (1), with first handles (17) provided on both sides of the server frame (1), and a first base (16) installed at one end of the server frame (1) away from the first handles (17). A first cavity is formed inside the server frame (1). Inside the first cavity, there are an NPU module (2), a cold liquid plate (5) installed on the NPU module (2) for heat dissipation, a heat exchanger (9), and a first liquid pump (3) located between the heat exchanger (9) and the cold liquid plate (5). The inlet of the first liquid pump (3) is connected to the heat exchanger (9) through a first liquid inlet pipe (7), and the outlet of the first liquid pump (3) is connected to the cold liquid plate (5) through a second liquid inlet pipe (8). The outlet of the cold liquid plate (5) is connected to the heat exchanger (9) through a first liquid return pipe (6), forming a liquid cooling circulation loop. An air cooling mechanism for dissipating heat from the heat exchanger (9) is also provided inside the first cavity.

2. The NPU module socket heat dissipation system according to claim 1, characterized in that, The air cooling mechanism includes a pluggable fan module (11) and a fan backplate (10) installed between the heat exchanger (9) and the fan module (11). A second cavity for accommodating the fan module (11) is provided inside the server frame (1). The heat exchanger (9) has a plurality of equally spaced fins. A junction box (14) is also installed inside the first cavity, and the junction box (14) is connected to the NPU module (2) through a cable.

3. The NPU module insertion frame heat dissipation system according to claim 2, characterized in that, A first cover plate (12) and a second cover plate (13) are installed on the server frame (1). The two cover plates are respectively used to cover the first cavity and the second cavity, and the first cover plate (12) and the second cover plate (13) are respectively placed on both sides of the fan backplate (10).

4. The NPU module socket heat dissipation system according to claim 1, characterized in that, A second liquid pump (4) is provided inside the first cavity. The second liquid pump (4) is located between the heat exchanger (9) and the cold liquid plate (5), and the second liquid pump (4) is connected in series with the first liquid pump (3).

5. The NPU module socket heat dissipation system according to claim 1, characterized in that, The main body of the cold liquid plate (5) is a "mouth" - shaped outer frame structure. An NPU chip cold plate is separately provided inside the cold liquid plate (5) at the position corresponding to the NPU chip. Both sides of the NPU chip cold plate are connected to the outer frame structure through pipes.

6. The NPU module insertion frame heat dissipation system according to claim 3, characterized in that, A second base (38) is fixedly connected to the bottom of the second cavity. A limit post (18) is installed on the second base (38). A limit groove (19) cooperating with the limit post (18) is provided on the side of the fan module (11). Second handles (20) are symmetrically arranged on the top of the fan module (11).

7. The NPU module socket heat dissipation system according to claim 6, characterized in that, First bottom plates (23) are symmetrically fixed to the top of the second base (38), and first top plates (22) are symmetrically fixed to the bottom of the fan module (11). When the limit post (18) is inserted into the corresponding limit groove (19), the two first top plates (22) exactly descend and respectively closely abut against the opposite side faces of the two first bottom plates (23), forming a lateral constraint.

8. The NPU module socket heat dissipation system according to claim 7, characterized in that, Limit components are symmetrically distributed at the bottom of the fan module (11). The limit components are used to drive the first top plate (22) to abut against the first bottom plate (23). The limit components include: L-shaped bracket (29), the L-shaped bracket (29) is fixedly connected to the bottom of the fan module (11), and the L-shaped bracket (29) has a first through hole; A first screw (26) is provided with a first hinge (27) at one end, which is connected to the side of the first top plate (22). The other end of the first screw (26) passes through a first through hole. The first nut (28) is sleeved on the first screw (26). The first nut (28) is threadedly engaged with the first screw (26). The side of the first nut (28) abuts against the side of the L-shaped bracket (29).

9. The NPU module insertion frame heat dissipation system according to claim 8, characterized in that, A first spring (31) and a second nut (30) are fitted on the first screw (26). The second nut (30) is threadedly engaged with the first screw (26). The first spring (31) is located between the second nut (30) and the first top plate (22).

10. The NPU module socket heat dissipation system according to claim 9, characterized in that, The first top plate (22) has a second through groove (25) on its side, the corresponding first bottom plate (23) has a first through groove (24), and the second base (38) has a guide groove (39). I-shaped slider (33), which is horizontally slidably disposed in guide groove (39), and a first insert (32) is installed on the top of I-shaped slider (33). An electric telescopic rod (35) is installed inside the second base (38). The electric telescopic rod (35) is connected to the I-shaped slider (33) through a push rod (34) for driving its sliding. The guide optical axis (36) and the slide (37) are provided. The guide optical axis (36) is located inside the second base (38). Both ends of the guide optical axis (36) are installed by fixed seats. The slide (37) is slidably engaged with the guide optical axis (36). The slide (37) is fixedly connected to the side of the I-shaped slider (33).

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