Shockproof device

Abstract

The invention provides an anti-vibration device applied to a rotary semiconductor element storage structure, the rotary semiconductor element storage structure comprises a wafer storage tower, the wafer storage tower is composed of a cage body and a plurality of wafer storage basket groups vertically arranged around the cage body, and the plurality of wafer storage basket groups are provided with a plurality of horizontal storage positions. The anti-vibration device is provided with a tablet pressing module and an anti-vibration touch module capable of driving the tablet pressing module, the tablet pressing module is provided with a guide column between every two adjacent tablet storage basket sets in a sliding mode, and the guide columns are provided with a plurality of fins corresponding to the horizontal storage positions of the tablet storage basket sets on the two sides. And the plurality of fins can synchronously move between a limiting position and a releasing position relative to the upper surfaces of the plurality of semiconductor elements, so that the semiconductor elements on the wafer storage tower can be quickly limited and protected when the earthquake intensity is detected to exceed a set value, and the semiconductor elements are prevented from falling off due to vibration.

Description

Technical Field

[0001] This invention relates to a shockproof technology for storage devices, and more specifically to a shockproof device that can quickly restrict and protect semiconductor elements on a storage tower when an earthquake intensity exceeds a set value, so as to prevent the semiconductor elements from being dislodged by vibration, while increasing the storage capacity of the semiconductor elements. Background Technology

[0002] With the advancement and improvement of network and communication technologies, coupled with the development of smartphones, electric vehicles, IoT (Internet of Things), and AI technologies, people have gained a richer and more convenient life. These technological products are mainly made of semiconductor components manufactured through semiconductor processes. These semiconductor components include, but are not limited to, photomasks and wafers. According to current semiconductor component manufacturing technology, the circuit patterns of semiconductor components are transferred from the photomask to the surface of the wafer through a photolithography process. As the line diameter of the circuit patterns of the aforementioned semiconductor components has evolved from the early micrometer level to the nanometer level, in order to cope with the contamination of semiconductor components by particles in the environment and harmful gases released during the manufacturing process, contamination control measures during storage, transportation, and manufacturing have become more stringent.

[0003] In semiconductor manufacturing plants, maintaining cleanliness during the manufacturing process primarily relies on designing cleanrooms. However, due to the large size of cleanrooms and the mutual interference of airflow between different devices, the cleanliness of the environment can still be easily affected. Therefore, the storage and transportation of semiconductor components outside the manufacturing process require a separate container with an independent clean environment. Taking photomasks as an example, due to the aforementioned miniaturization of semiconductor components, contamination of the photomask can cause distortion or deformation of the circuit patterns on the wafer surface. To maintain the cleanliness of the photomask during storage or transportation outside the manufacturing process, it is typically housed in a SEMI standard photomask transport box (Reticle SMIF). Within the Pod (RSP), to reduce the adhesion of harmful contaminants such as particles, chemicals, or free gas molecules from the environment to the photomask surface, thus reducing defects, the multiple photomask transport boxes containing the photomasks are then stored in a large storage cabinet (Stocker). Currently, the storage cabinet's storage positions are arranged in a matrix on one side of the surface, and a linear robotic arm that can move left, right, up, and down is used to pick up and place photomask transport boxes in different storage positions. This increases the robotic arm's travel distance, thus increasing the time spent picking up and placing photomask transport boxes and reducing its operating efficiency. Furthermore... This approach also significantly increases the storage space of each photomask transport box. At the same time, the operating space and load-bearing capacity of the robotic arm used to transport the photomask transport boxes also need to be increased. In order to maintain the cleanliness of the internal environment of each photomask transport box, an inflation plate connected to an inflation system is usually designed on each storage position of the storage cabinet to fill the photomask transport box with clean gas. This inadvertently complicates the structure of the storage cabinet, increases its manufacturing and maintenance costs, and also increases the volume of the storage cabinet. With the same volume, a smaller volume will directly reduce the storage capacity of the semiconductor components in the storage cabinet.

[0004] Furthermore, as mentioned above, since the circuit pattern line diameter of semiconductor devices has developed to the nanometer level, the importance and value of related semiconductor devices are constantly increasing. Taking the aforementioned photomask as an example, the value of a single piece may be as high as millions, and when it is damaged, it may affect the efficiency of the manufacturing process. Therefore, the protection level for these multiple semiconductor devices is also constantly improving. In recent years, earthquakes have occurred frequently, so there is a need to provide good shockproof design for these multiple storage devices to protect the multiple semiconductor devices in the event of an earthquake. Therefore, how to solve the aforementioned problems is what this invention aims to explore and solve.

[0005] In view of the above-mentioned shortcomings, the inventor of this case believed that it was necessary to make corrections. Therefore, based on his many years of experience in related technologies and product design and manufacturing, and adhering to the concept of good design, he studied and improved the above-mentioned defects. After continuous efforts in trial and error, he finally successfully developed a shockproof device to overcome the troubles and inconveniences caused by the poor shockproof design of existing storage cabinets. Summary of the Invention

[0006] Therefore, the main objective of this invention is to provide a shock-absorbing device that can provide opposing fins above semiconductor elements in each storage location, and can synchronously drive the plurality of fins to restrict the semiconductor elements in the opposing storage location when a set vibration intensity is detected, so as to prevent them from falling out due to vibration, thereby greatly improving the safety of semiconductor elements during storage.

[0007] Another object of the present invention is to provide a shock-absorbing device that can be easily installed and maintained by utilizing the modular design of the storage and shock-absorbing mechanism, thereby greatly improving its practicality.

[0008] Based on this, the present invention mainly achieves the aforementioned objectives and effects through the following technical means: The present invention provides a shockproof device for accommodating a plurality of semiconductor components, the shockproof device comprising at least:

[0009] A semiconductor storage tower consists of a cage and a plurality of semiconductor storage baskets. The plurality of semiconductor storage baskets are vertically locked around the cage and have a plurality of horizontally placed storage positions arranged vertically and at equal intervals, for selective horizontal placement of the plurality of semiconductor devices.

[0010] A shock-absorbing device is installed around the cage, and the shock-absorbing device includes at least:

[0011] A tablet compression module is provided with a guide post between adjacent tablet storage baskets around the cage. The multiple guide posts are slidably disposed between the top and bottom ends of the cage. Furthermore, the multiple guide posts are provided with multiple winglets corresponding to the flat storage positions of the tablet storage baskets on both sides, and one end of the multiple winglets can extend into the upper surface of the multiple semiconductor elements located on the relatively flat storage positions.

[0012] A shock-absorbing actuation module that can selectively drive the plurality of guide pillars of the pressing module, so that the plurality of blades can move synchronously between a restricted position and a released position relative to the upper surface of the plurality of semiconductor elements;

[0013] This allows the shock-absorbing module to drive the guide post of the pressing module to move the plurality of blades downward to restrict the plurality of semiconductor elements from being ejected from the flat storage position, and the shock-absorbing module to drive the guide post of the pressing module to move the plurality of blades upward to release the plurality of semiconductor elements from the flat storage position.

[0014] Furthermore, the present invention utilizes the following technical means to further achieve the aforementioned objectives and effects; such as:

[0015] Preferably, the cage has at least a bottom frame, a top frame, and a plurality of basket plates disposed between the outer contours of the bottom frame and the top frame, and the bottom and top frames have a plurality of guide seats at equal angles and distances, so that the plurality of guide pillars of the pressing module can slide together between the guide seats opposite to the bottom and top frames.

[0016] Preferably, the plurality of tablet storage baskets are composed of a plurality of tablet storage boxes arranged vertically and locked to the plurality of basket plates. The plurality of tablet storage boxes consists of a box back plate and two box side plates respectively disposed on both sides of the box back plate. The plurality of tablet storage boxes are provided with a plurality of equidistant tablet carrier plates in layers between the box back plate and the two side box plates to form a plurality of flat storage positions. The plurality of guide posts are provided with a plurality of wing groups corresponding to the tablet storage boxes of the two sides of the tablet storage baskets. The plurality of wing groups have a sleeve that can be locked to the guide post. The plurality of wing groups are formed on both sides of the periphery of the plurality of sleeves.

[0017] Preferably, the ends of the blades in the plurality of blade groups are provided with limiting bumps corresponding to the plurality of semiconductor elements to reduce the area in contact with the plurality of semiconductor elements.

[0018] Preferably, the plurality of limiting protrusions can be selected from materials such as PEEK or PEI.

[0019] Preferably, the cage of the storage tower is a cylindrical structure, and the storage tower can be rotated by a driving device.

[0020] Preferably, the shock-absorbing trigger module of the shock-absorbing device has a plurality of equiangular driving elements around the storage tower. The plurality of driving elements are fixed on a fixed base, and the plurality of driving elements have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the plurality of driving elements are arranged together to form a pressure ring around the periphery of the cage. Furthermore, the shock-absorbing trigger module has a connecting plate spanning the bottom ends of at least two adjacent guide columns. The outer edge of the connecting plate is formed with at least one convex pressure plate that overlaps with the pressure ring. When the actuating rods of the plurality of driving elements drive the plurality of pressure rings, the plurality of pressure rings can drive the connecting plate through the plurality of elastic pressure members, so that the connecting plate can synchronously drive the relative displacement of the guide columns.

[0021] Preferably, the shockproof trigger module has 6 sets of driving elements and a plurality of linkage plates of equal length. Each linkage plate can be locked with three guide posts at equal angles to drive the plurality of guide posts respectively, thereby reducing the occurrence of jamming.

[0022] Preferably, an elastic pressure member is provided between the convex pressure plate of the linkage plate and the pressure ring at the opposite position, so that the pressure ring can press the linkage plate through the plurality of elastic pressure members.

[0023] Preferably, the linkage plate is provided with an upper buffer and a lower buffer on the guide post respectively above and below, so as to reduce the impact force of the blades of the plurality of blade groups on the plurality of semiconductor elements.

[0024] Therefore, through the aforementioned technical means, the anti-vibration device of the present invention can utilize the anti-vibration device installed on the storage tower. When the earthquake intensity exceeds the set value, the anti-vibration trigger module can synchronously drive the relative guide column to move downward, so that the multiple blades can relatively restrict the multiple semiconductor elements, thereby preventing the multiple semiconductor elements from falling out of the storage tower during an earthquake. This effectively improves the safety of the multiple semiconductor elements during storage, and is easy to install and maintain, greatly enhancing its practicality and increasing its added value and economic benefits.

[0025] To enable a further understanding of the structure, features, and other objectives of the present invention, preferred embodiments are listed below and described in detail with reference to the accompanying drawings, so that those skilled in the art can implement the invention. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the shockproof device of the present invention applied to a storage compartment.

[0027] Figure 2 This is a three-dimensional appearance diagram of the shockproof device of the present invention, used to illustrate its appearance and relative relationships.

[0028] Figure 3 This is a schematic diagram of most of the shockproof device of the present invention.

[0029] Figure 4 This is a partial external view of the storage basket assembly and the pressing module in the shockproof device of the present invention.

[0030] Figure 5 This is a partially exploded view of the storage basket assembly and the pressing module assembly in the shockproof device of the present invention.

[0031] Figure 6 This is a side cross-sectional view of the storage basket assembly in the shockproof device of the present invention.

[0032] Figure 7 This is a schematic end view cross-sectional view of the storage basket assembly in the shockproof device of the present invention.

[0033] Figure 8 This is a schematic diagram of the appearance of the shock-absorbing trigger module in the shock-absorbing device of the present invention.

[0034] Figure 9 This is a partial external schematic diagram of the shockproof device in the rotating semiconductor element storage structure of the present invention.

[0035] Figure 10This is a partially enlarged schematic diagram of the shock-absorbing device in the shock-absorbing device of the present invention.

[0036] Figure 11 This is a schematic diagram of the shock-absorbing device before its operation, illustrating the pre-operation state of its shock-absorbing trigger module and their relative relationships.

[0037] Figure 12 This is a schematic diagram of the shock-absorbing device after its operation, used to illustrate the state of the tablet pressing module after its operation and their relative relationships.

[0038] Explanation of reference numerals in the attached drawings: 100-Storage tower; 10-Cage body; 11-Bottom frame; 110-Mounting part; 12-Top frame; 120-Mounting part; 121-Support rib; 122-Shaft seat; 123-Step shaft hole; 15-Basket plate; 16-Middle section ring frame; 161-Locking part; 162-Locking part; 163-Middle guide seat; 18-First airflow hole slot; 20-Passive assembly; 22-Gear sleeve; 30-Storage basket assembly; 31-Storage box; 32-Box back plate; 320-Second airflow hole slot; 33-Box side plate; 330-Through hole; 35-Storage carrier plate; 351-Back carrier plate; 352-Side carrier plate; 353-Bridge section; 36-Limiting component; 361-Supporting protrusion; 362- Side baffle; 363-Guide slope; 365-Stop block; 366-Guide slope; 50-Anti-vibration device; 51-Pressure plate module; 52-Guide seat; 53-Guide seat; 54-Guide post; 55-Wing assembly; 56-Sleeve; 57-Wing; 58-Restriction protrusion; 60-Anti-vibration trigger module; 61-Drive element; 62-Actuating rod; 63-Fixed seat; 64-Pressure ring; 65-Connecting plate; 650-Protruding pressure plate; 66-Elastic pressure component; 671-Upper buffer component; 672-Lower buffer component; 500-Drive device; 510-Motor component; 800-Storage compartment; 801-Storage space; 802-Upper mounting base; 803-Lower mounting base; 900-Semiconductor component. Detailed Implementation

[0039] This invention provides a shock-absorbing device. In the accompanying drawings illustrating specific embodiments and components of the shock-absorbing device, all references to front and back, left and right, top and bottom, upper and lower parts, and horizontal and vertical are for descriptive convenience only and are not intended to limit the scope of the invention, nor to restrict the components to any position or spatial orientation. The dimensions specified in the drawings and specification should be varied according to the design and requirements of specific embodiments of the invention without departing from the scope of the claims, and are therefore not limited to this structure for patent purposes.

[0040] Please refer to Figure 1 , Figure 2As shown, the present invention provides a shockproof device, which is composed of a chip storage tower 100 and can be applied to a storage chamber 800 for storing a plurality of semiconductor components 900, wherein the semiconductor components 900 can be photomask dies. The storage chamber 800 has a storage space 801 inside, and the top and bottom of the storage space 801 are respectively provided with an upper mounting seat 802 and a lower mounting seat 803. The chip storage tower 100 is located between the upper mounting seat 802 and the lower mounting seat 803, so that the chip storage tower 100 can be rotated by a driving device 500. The chip storage tower 100 is composed of a cage 10, a plurality of longitudinally arranged chip storage baskets 30, and a shockproof device 50.

[0041] like Figure 2 , Figure 3 As shown, the cage 10 is composed of at least a bottom frame 11, a top frame 12, and a plurality of basket plates 15 disposed between the outer contours of the bottom frame 11 and the top frame 12. The bottom frame 11 is pivotally mounted on the lower mounting base 803, and the bottom frame 11 has a plurality of equidistant mounting portions 110 (e.g., ...). Figure 3 As shown, the top frame 12 is for mounting the aforementioned basket plate 15. The top frame 12 has a bearing seat 122 supported by a plurality of radial ribs 121, and the bearing seat 122 forms a stepped shaft hole 123 for pivoting the upper mounting seat 802. The top frame 12 also has a plurality of mounting portions 120 corresponding to the mounting portions 110 of the bottom frame 11, for the plurality of basket plates 15 to be longitudinally locked between the corresponding mounting portions 110 and 120 of the bottom and top frames 11 and 12. Furthermore, according to certain embodiments, the plurality of basket plates 15 can be a segmented structure, wherein the cage body 10 is provided with at least one middle section ring frame 16 between the bottom frame 11 and the top frame 12, and the upper and lower edges of the plurality of middle section ring frames 16 are respectively provided with a plurality of locking portions 161 and 162 corresponding to the mounting portions 110 and 120 of the bottom and top frames 11 and 12, so that the aforementioned segmented basket plates 15 can be respectively locked between the mounting portion 110 of the bottom frame 11 and the lower locking portion 161 of the middle section ring frame 16 and the upper locking portion 162 of the middle section ring frame 16 and the mounting portion 120 of the top frame 12, thereby improving the structural strength of the cage body 10 and the plurality of basket plates 15, and the plurality of basket plates 15 are provided with a plurality of first airflow slots 18. Furthermore, the outer surfaces of the plurality of basket plates 15 can be respectively locked with the aforementioned storage basket group 30, and the bottom frame 11 is pivotally mounted on the lower mounting base 803. A gear sleeve 22 is locked around the bottom frame 11 of the cage body 10, so that when the aforementioned drive device 500 engages and drives the gear sleeve 22 of the bottom frame 11 of the cage body 10, it can synchronously drive the cage body 10 to rotate in place relative to the upper and lower mounting bases 802 and 803 of the storage compartment 800.

[0042] For example Figure 2As shown, the plurality of tablet storage baskets 30 are disposed on the basket plate 15 of the cage body 10, and the plurality of tablet storage baskets 30 have a plurality of horizontally placed storage positions arranged at equal intervals above and below. Each tablet storage basket 30 is composed of a plurality of tablet storage boxes 31 arranged above and below and locked to the opposite basket plate 15, as shown. Figure 4 and Figure 5 As shown, the plurality of tablet storage boxes 31 consists of a box back plate 32 and two box side plates 33 respectively disposed on both sides of the box back plate 32. The plurality of box back plates 32 have a plurality of second airflow slots 320. Furthermore, the box side plates 33 on both sides are respectively formed with a plurality of through holes 330, which allow the aforementioned shock-absorbing device 50 to extend into the interior from the outside of the plurality of tablet storage boxes 31. The plurality of tablet storage boxes 31 are layered and fixed between the box back plate 32 and the two box side plates 33, with a plurality of vertically arranged and equidistant tablet carrier plates 35 forming a plurality of flat storage positions. The plurality of tablet carrier plates 35 have a back carrier plate 351. Each of the two sides has a side carrier plate 352, wherein the middle section of the plurality of side carrier plates 352 is bent into a bridge section 353 to improve the strength of both sides of the chip carrier plate 35. Each of the side carrier plates 352 on both sides of the chip carrier plate 35 has a limiting member 36 at both ends of the bridge section 353. The plurality of limiting members 36 have at least one support protrusion 361 that can support the bottom surface of the aforementioned semiconductor element 900. The outer edge of the plurality of limiting members 36 has at least one side baffle 362 for the side edge of the aforementioned semiconductor element 900 to abut, thereby limiting the left and right position of the plurality of semiconductor elements 900 (e.g., ...). Figure 7 [As disclosed], each of the plurality of limiting members 36 has a stop 365 at its end for the front and rear end edges of the aforementioned semiconductor element 900 to abut, thereby limiting the front and rear positions of the plurality of semiconductor elements 900 (e.g., Figure 6 [As disclosed], and the inner surfaces of the plurality of side baffles 362 and the plurality of baffles 365 respectively form a guiding inclined surface 363, 366 [e.g.] Figure 4 , Figure 5 [Disclosed], the plurality of semiconductor elements 900 can generate a guiding effect when placed, so that the plurality of semiconductor elements 900 can be supported by the support protrusions 361 of the plurality of limiting members 36, so that the plurality of semiconductor elements 900 can be stably placed on any of the chip carrier plates 35 of the plurality of chip cassettes 31, wherein the limiting member 36 can be selected from materials such as PEEK or PEI to reduce wear and have a conductive effect;

[0043] Furthermore, such as Figure 3 , Figure 8 and Figure 9As shown, the shock-absorbing device 50 is located between the lower mounting base 803 of the cabin 800 and the cage 10. The shock-absorbing device 50 includes a pressing module 51 that can selectively restrict the semiconductor element 900 on the chip storage basket group 30 and a shock-absorbing trigger module 60 that can drive the pressing module 51. The pressing module 51 has a corresponding guide seat 52 and 53 between adjacent mounting portions 110 and 120 of the bottom and top frames 11 and 12 of the cage 10. The bottom and top frames 11 and 12 are each slidably provided with a guide post 54 between the corresponding guide seats 52 and 53, so that the aforementioned shock-absorbing trigger module 60 can drive the multiple guide posts 54 to move up and down partially. Furthermore, according to certain embodiments, when the cage 10 has a middle ring frame 16, the middle ring frame 16 is provided with a plurality of middle guide seats 163 corresponding to the plurality of guide seats 52, 53 (e.g., Figure 3 [As disclosed], the plurality of guide posts 54 are slidable through them. Furthermore, each of the plurality of guide posts 54 is provided with at least one wing assembly 55 corresponding to the two side storage tray assemblies 30, such as... Figure 4 , Figure 5 As shown, the present invention takes as its main embodiment a plurality of wing-plate groups 55 corresponding to the chip storage bins 31 on both sides of the chip storage bins 30. Each plurality of wing-plate groups 55 has a sleeve 56 lockable to the guide post 54. Furthermore, each of the sleeves 56 has a plurality of wing-plates 57 extending into the chip storage bin 31 on both sides of its periphery. The ends of the wing-plates 57 are positioned above the edges of the semiconductor elements 900 on the plurality of chip storage carriers 35 (e.g., ...). Figure 7 [As disclosed], furthermore, each of the blades 57 has a corresponding limiting bump 58 at its end corresponding to the plurality of semiconductor elements 900, such that when the plurality of blade groups 55 are driven by the guide post 54, the blades 57 of the plurality of blade groups 55 can be in a release position relative to the upper surface of the semiconductor element 900 (e.g., Figure 11 As shown] and movement between a restricted position (such as Figure 12 As shown in the figure, the limiting position can prevent the semiconductor element 900 from being removed from the wafer carrier 35, while the releasing position can allow the semiconductor element 900 to be removed from the wafer carrier 35. The wing group 55 or the limiting bump 58 can be selected from materials such as PEEK or PEI.

[0044] The shock-absorbing actuation module 60 can synchronously drive the plurality of guide posts 54 of the tablet pressing module 51 to drive the vane groups 55 of the tablet pressing module 51 on each guide post 54 to move downward, so that the plurality of vane groups 55 can restrict the semiconductor elements 900 in the relative tablet storage cassette 31 of the plurality of tablet storage basket groups 30, and so that the vanes 57 of the plurality of vane groups 55 can restrict the semiconductor elements 900 on the relative tablet storage carrier plate 35. According to some embodiments, such as... Figure 9 , Figure 10 and Figure 11As shown, the shock-absorbing trigger module 60 has a plurality of equiangular driving elements 61 on the bottom surface of the cabin 800 or the lower mounting base 803 relative to the periphery of the cage 10. The present invention uses six sets of driving elements 61 as the main embodiment. The plurality of driving elements 61 are fixed on a fixed base 63, and each plurality of driving elements 61 has an actuating rod 62 that can extend and retract relative to the fixed base 63. Furthermore, the actuating rods 62 of the plurality of driving elements 61 together form a pressure ring 64 surrounding the periphery of the cage 10. The shock-absorbing trigger module 60 has a connecting plate 65 spanning the bottom ends of at least two adjacent guide posts 54. The present invention uses a connecting plate 65 locked between every three guide posts 54 as the main embodiment, resulting in six sets of connecting plates 65 to respectively drive... The plurality of guide posts 54 are moved to reduce jamming. At least one convex pressure plate 650 is formed on the outer edge of the connecting plate 65, overlapping with the pressure ring 64. An elastic clamping member 66 is provided between the plurality of convex pressure plates 650 and the pressure ring 64 at their relative positions. When the actuating rod 62 of the plurality of driving elements 61 retracts, driving the plurality of pressure rings 64, the plurality of pressure rings 64 can press the connecting plate 65 downwards through the plurality of elastic clamping members 66. Simultaneously, the connecting plate 65 can drive the corresponding guide posts 54 to move downwards. This, in turn, drives the blade assembly 55 of the aforementioned pressure plate module 51 to move downwards through the moving guide posts 54. This allows the blades 57 of the plurality of blade assemblies 55 to restrict the corresponding semiconductor elements 900 (e.g., Figure 12 As shown in the figure, the linkage plate 65 is provided with an upper buffer 671 and a lower buffer 672 respectively between each of the guide posts 54 and the upper bottom frame 11 guide seat 52 and the lower gear sleeve 22. Figure 11 , Figure 12 As shown, this is to reduce the impact force of the blades 57 of the plurality of blade groups 55 on the plurality of semiconductor elements 900;

[0045] This allows for the creation of a shock-absorbing device that increases storage capacity and provides shock protection.

[0046] Through the aforementioned structural design, such as Figure 1 , Figure 2As shown, in operation, when a robotic arm (not shown) is needed to place or pick up a semiconductor element 900 on the chip storage tower 100, the motor element 510 of the drive device 500 is activated to engage with the gear sleeve 22 at the bottom of the cage 10 of the chip storage tower 100, so that the cage 10 of the chip storage tower 100 can be driven by the motor element 510 of the drive device 500, thereby allowing the cage 10 of the chip storage tower 100 to rotate coaxially between the upper and lower mounting seats 802 and 803 of the compartment 800, so that the designated chip storage basket group 30 on the cage 10 in which the aforementioned semiconductor element 900 is placed can rotate to the position corresponding to the robotic arm, so that the robotic arm can move up and down to the height corresponding to the chip storage carrier plate 35 of the chip storage box 31 in the chip storage basket group 30 containing the aforementioned semiconductor element 900, so that the robotic arm can place or pick up the semiconductor element 900 relative to the chip storage carrier plate 35.

[0047] Taking the placement of the plurality of semiconductor elements 900 on the storage positions of the plurality of chip carriers 35 in the plurality of chip cassettes 31 as an example, Figure 4 , Figure 6 and Figure 7 As shown, when the plurality of semiconductor elements 900 are placed from top to bottom on the wafer carrier 35 of the opposite wafer cassette 31, the side baffles 362 of the upper limit member 36 of the plurality of wafer carrier 35 and the guiding slopes 363 and 366 of the stop block 365 can be used to effectively guide the placement position of the plurality of semiconductor elements 900, and allow the lower surface of the plurality of semiconductor elements 900 to be supported by the support protrusions 361 of the plurality of limit members 36, so that the plurality of semiconductor elements 900 can be stably placed in the opposite wafer carrier 35;

[0048] Furthermore, during the storage of the plurality of semiconductor devices 900 in the storage tower 100, if the intensity of an earthquake exceeds a set value, such as Figure 2 , Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, the shockproof device 50 can activate the driving element 61 of the tablet pressing module 51 to drive the pressure ring 64 downward through the plurality of actuating rods 62, so that the pressure ring 64 can simultaneously press against the elastic clamping member 66 on the convex pressure plate 650 of the connecting plate 65, so that the connecting plate 65 can simultaneously drive the opposing plurality of guide posts 54 to slide downward. When the plurality of guide posts 54 move downward, the plurality of guide posts 54 can simultaneously drive the plurality of winglet groups 55 locked on them to move downward. Since the plurality of winglet groups 55 have a plurality of equidistant winglets 57 on both sides, and the plurality of winglets 57 can be positioned above the semiconductor elements 900 of the opposing tablet carrier plates 35 of the plurality of tablet cartridges 31, the winglets 57 of the plurality of winglet groups 55 can restrict the opposing semiconductor elements 900 (e.g., Figure 12As shown], furthermore, since the upper buffer 671 and the lower buffer 672 are respectively provided above and below the linkage plate 65 [as shown], Figure 11 , Figure 12 As shown, the impact force of the blades 57 of the plurality of blade groups 55 on the plurality of semiconductor elements 900 can be reduced, so that when the seismic intensity exceeds the set value, the anti-vibration device 50 can activate the pressing module 51 to drive the anti-vibration trigger module 60 to restrict the plurality of semiconductor elements 900, so as to prevent the plurality of semiconductor elements 900 from falling out of the storage tower 100.

[0049] As described above, the shockproof device of the present invention utilizes the storage tower 100, which can be driven to rotate in place by the drive device 500, so that the storage basket group 30 on the cage 10 of the storage tower 100 can correspond to the robotic arm, allowing the robotic arm to move up and down to grab the semiconductor element 900 on the storage box 31 of the storage basket group 30 relative to the storage carrier plate 35. This not only simplifies the structure but also facilitates the placement and grabbing of the semiconductor element 900, and further significantly increases the storage capacity of the storage tower 100.

[0050] Furthermore, since the storage tower 100 of the present invention is equipped with an anti-vibration device 50, when the earthquake intensity exceeds the set value, the anti-vibration trigger module 60 can synchronously drive the relative guide column 54 to move downward, so that the vanes 57 of the vane group 55 on the plurality of guide columns 54 can relatively restrict the semiconductor elements 900 on the plurality of storage carrier plates 35, so as to prevent the plurality of semiconductor elements 900 from falling out of the storage tower 100 when an earthquake occurs, effectively improving the safety of the plurality of semiconductor elements 900 during the storage process.

[0051] Furthermore, the tablet storage box 31 of the tablet storage basket assembly 30 and the wing assembly 55 of the tablet pressing module 51 of the shockproof device 50 are modularly designed, making them easy to install and maintain, and greatly improving their practicality.

[0052] The above embodiments are merely preferred embodiments of the present invention and should not be used to limit the scope of protection of the present invention. Any modifications or refinements made to the main design concept and spirit of the present invention that are not of substantial significance, but solve the same technical problem as the present invention, should be included within the scope of protection of the present invention.

Claims

1. A shockproof device for a rotating semiconductor element storage structure, characterized in that: This rotary semiconductor device storage structure is used to store a plurality of exposed semiconductor devices. The structure includes a storage tower with a cage and a plurality of storage baskets. The storage baskets are vertically locked around the cage, and each basket has a plurality of horizontally positioned storage spaces arranged vertically and equidistantly for selective horizontal placement of the semiconductor devices. A shock-absorbing device is located around the cage and includes: A tablet compression module has a plurality of guide posts disposed on at least one side of each of the tablet storage basket groups. The plurality of guide posts are slidably disposed between the top and bottom ends of the cage body. Each guide post has a plurality of flaps corresponding to the horizontal storage positions of the tablet storage basket groups on both sides, and one end of each flap can extend into the upper surface of a plurality of semiconductor devices located on the relatively horizontal storage positions. A shock-absorbing actuation module selectively drives the plurality of guide pillars, enabling the plurality of vanes to move synchronously between a restricted position and a released position relative to the upper surface of the plurality of semiconductor elements. The shock-absorbing module can drive the plurality of guide posts to move the plurality of blades downward to restrict the plurality of semiconductor elements from being ejected from the flat storage position, and the shock-absorbing module can also drive the plurality of guide posts to move the plurality of blades upward to release the plurality of semiconductor elements from being removed from the flat storage position.

2. The shock-absorbing device as described in claim 1, characterized in that: The cage has at least a bottom frame, a top frame, and a plurality of basket plates disposed between the outer contours of the bottom frame and the top frame. The bottom frame and the top frame have a plurality of guide seats at equal angles and distances, so that the plurality of guide pillars of the pressing module can slide together between the guide seats opposite to the bottom frame and the top frame.

3. The shock-absorbing device as described in claim 2, characterized in that: The multiple tablet storage baskets are composed of multiple tablet storage boxes arranged vertically and locked to the multiple storage basket plates. Each multiple tablet storage box includes a box back plate and two box side plates respectively disposed on both sides of the box back plate. The multiple tablet storage boxes are fixed with multiple tablet storage carrier plates at equal intervals between the box back plate and the two side box plates to form multiple flat storage positions. The multiple guide posts are provided with multiple wing groups corresponding to the tablet storage boxes of the two side tablet storage baskets, and the multiple wing groups have a sleeve that can be locked to the guide post. The multiple wing groups are formed on both sides of the periphery of the multiple sleeves.

4. The shock-absorbing device as described in claim 3, characterized in that: The blades of the complex blade assembly have limiting bumps at their ends to reduce the area of ​​contact with the complex semiconductor elements.

5. The shock-absorbing device as described in claim 4, characterized in that: The complex number of limiting bumps is selected from PEEK or PEI materials.

6. The shock-absorbing device as described in any one of claims 1 to 5, characterized in that: The storage tower has a cylindrical cage structure and can be rotated by a drive device.

7. The shock-absorbing device as described in claim 6, characterized in that: The shock-absorbing module has a plurality of equiangular driving elements around the storage tower. The plurality of driving elements are fixed on a fixed base and have actuating rods that can extend and retract relative to the fixed base. The actuating rods of the plurality of driving elements are arranged together to form a pressure ring around the periphery of the cage. The shock-absorbing module has a connecting plate spanning the bottom ends of at least two adjacent guide columns. The outer edge of the connecting plate is formed with at least one convex pressure plate that overlaps with the pressure ring. When the actuating rods of the plurality of driving elements drive the plurality of pressure rings, the plurality of pressure rings can drive the connecting plate, so that the connecting plate can synchronously drive the relative displacement of the guide columns.

8. The shock-absorbing device as described in claim 7, characterized in that: The shockproof trigger module has 6 sets of driving elements and multiple linkage plates of equal length. The multiple linkage plates can lock three of the multiple guide posts at equal angles to drive the multiple guide posts respectively, so as to reduce the occurrence of jamming.

9. The shock-absorbing device as described in claim 8, characterized in that: An elastic pressure element is provided between the convex pressure plate of the multiple linkage plate and the pressure ring at the opposite position, so that the pressure ring can press the multiple linkage plates through the multiple elastic pressure elements.

10. The shock-absorbing device as described in claim 8, characterized in that: The multiple linkage plate is provided with an upper buffer and a lower buffer above and below the guide post, respectively, to reduce the impact force.

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