Three-dimensional vapor chamber combination structure
By using a tight fit between the flange and the recessed groove, and resistance welding to combine the heat pipe with the shell plate, the problem of solder loosening and entering the cavity was solved, achieving efficient heat conduction and dissipation, and reducing costs.
Patent Information
- Application Number
- CN202411135761.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2026-03-03
AI Technical Summary
The existing three-dimensional heat exchanger structure is prone to loosening during the welding process, and the solder can easily enter the cavity, affecting the transmission of working fluid and resulting in a decrease in heat conduction and heat dissipation efficiency.
The heat pipe is bonded to the shell by a tight fit of flange and recessed groove, and a fusion layer is formed by resistance welding. A sealing layer is added to the gap to prevent the solder from entering the cavity. Capillary structure and support columns are used during the bonding process to improve stability.
It achieves a high-strength and stable bonding structure, prevents solder from entering the cavity, improves thermal conductivity and heat dissipation efficiency, simplifies the manufacturing process and reduces costs.
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Figure CN121604326A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical field of heat dissipation, and more particularly to a three-dimensional heat dissipation plate combined structure. Background Technology
[0002] The existing three-dimensional vapor chamber structure mainly includes a vapor chamber and a plurality of heat pipes. Each heat pipe is spaced apart on the vapor chamber, and the cavity inside the vapor chamber is connected to the cavity of each heat pipe, so as to achieve rapid heat conduction and heat dissipation through the change of vapor and liquid phases.
[0003] However, while existing three-dimensional vapor chamber structures possess excellent heat conduction and dissipation performance, the following problems remain to be addressed in practical applications. Because the heat pipes and vapor chamber are joined using solder paste such as copper or solder paste, they are prone to loosening and other defects due to vibration during assembly or handling. Furthermore, during manufacturing, copper or solder paste can easily seep into the cavity, affecting or blocking the transport path of the internal working fluid, thereby reducing its heat conduction and dissipation efficiency. Summary of the Invention
[0004] One objective of this invention is to provide a three-dimensional heat exchanger structure that is not only firmly bonded and has high strength, but also prevents solder from entering the cavity and affecting the transmission of the working fluid.
[0005] To achieve the above objectives, the present invention provides a three-dimensional heat exchanger structure, comprising a shell, a plurality of heat pipes, a capillary structure, and a working fluid. The shell includes a first shell plate and a second shell plate tightly sealed to the first shell plate. A cavity is formed between the first shell plate and the second shell plate. The second shell plate has a plurality of through holes, and a recessed groove is provided around the outer periphery of each through hole. Each heat pipe passes through corresponding to each through hole, and each heat pipe has an open end with a flange at the open end. Each flange is respectively accommodated in each of the recessed grooves, wherein each heat pipe is bonded to the second shell plate through the flange and a fusion layer in the recessed groove. The capillary structure is disposed in the cavity and attached to the shell. The working fluid is disposed in the cavity.
[0006] In one embodiment, the weld layer is formed by resistance welding.
[0007] In one embodiment, the second shell plate includes a top plate, with a protrusion formed at each position corresponding to each recessed groove, which is higher than the outer surface of the top plate.
[0008] In one embodiment, the recess is an annular recess with an inner edge diameter, and the flange is an annular flange with an outer edge diameter, the outer edge diameter of the flange being greater than or equal to the inner edge diameter of the recess.
[0009] In one embodiment, the flange extends from the open end of the heat pipe in an enlarged manner, and the flange and the centerline of the heat pipe are arranged perpendicularly.
[0010] In one embodiment, a ring wall extends around the periphery of each of the through holes, and each heat pipe passes through the respective ring wall.
[0011] In one embodiment, a sealing layer is further provided between each heat pipe and each annular wall.
[0012] In one embodiment, the sealing layer is formed by a soft soldering method or a hard soldering method.
[0013] In one embodiment, a plurality of support columns are also included, each of which is spaced apart within the cavity and erected between the first shell plate and the second shell plate.
[0014] In one embodiment, a heat dissipation fin assembly is also included, which is sleeved on each of the heat pipes.
[0015] This invention also offers the following advantages: Since resistance welding eliminates the need for solder, it saves costs. The tight fit between the flange and the recess effectively prevents solder paste or tin paste from entering the cavity, thereby improving overall heat conduction and dissipation efficiency. Its manufacturing process is quite simple and easy, and the resulting bond exhibits excellent strength and reliability. Attached Figure Description
[0016] Figure 1 This is an exploded view of the second shell plate, each heat pipe, and capillary structure of the present invention.
[0017] Figure 2 This is a cross-sectional view and a magnified view of a portion of the second shell plate and each heat pipe assembly of the present invention.
[0018] Figure 3 This is an exploded view of the three-dimensional temperature distribution plate combined structure of the present invention.
[0019] Figure 4 This is an external view of the three-dimensional temperature distribution plate combined structure of the present invention.
[0020] Figure 5 This is a cross-sectional view of the combined structure of the three-dimensional heat equalization plate of the present invention.
[0021] In the picture: 10: Shell; 11: First shell plate; 111: Bottom plate; 112: Enclosure plate; 113: Flanged flange; 12: Second shell plate; 121: Top plate; 122: Through hole; 123: Recessed groove; 124: Protrusion; 125: Circumferential wall; 20: Heat pipe; 21: Open end; 211: Flange; 22: Closed end; 30: Capillary structure; 31: Lower capillary structure; 32: Upper capillary structure; 321: Perforation; 40: Working fluid; 50: Support column; 60: Heat dissipation fin assembly; A: Cavity; D1: Inner diameter; D2: Outer diameter; S: Sealing layer; W: Welded layer. Detailed Implementation
[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.
[0023] Please see Figures 1 to 5 As shown, the present invention provides a three-dimensional heat exchanger combined structure, which mainly includes a shell 10, a plurality of heat pipes 20, a capillary structure 30 and a working fluid 40.
[0024] Please refer to the following first. Figure 3 and Figure 5 As shown, the shell 10 mainly includes a first shell plate 11 and a second shell plate 12. The first shell plate 11 and the second shell plate 12 are made of materials with good thermal conductivity, such as copper, aluminum, magnesium or their alloys. The first shell plate 11 mainly includes a bottom plate 111 and a surrounding plate 112 that bends upward from the periphery of the bottom plate 111. A flange 113 extends outward from the end of the surrounding plate 112 away from the bottom plate 111.
[0025] The second shell plate 12 mainly includes a top plate 121. The second shell plate 12 is closely connected and sealed to the flange 113 of the first shell plate 11 through its top plate 121, so as to form a cavity A between the first shell plate 11 and the second shell plate 12.
[0026] Please continue reading. Figure 1 and Figure 2 As shown, a plurality of through holes 122 are spaced apart on the inner side of the top plate 121 of the second shell plate 12. A recessed groove 123 is provided around the outer periphery of each through hole 122. A protrusion 124 higher than the outer surface of the top plate 121 is formed at the position corresponding to the recessed groove 123. In addition, a ring wall 125 extends upward from the periphery of each through hole 122. In this embodiment, the recessed groove 123 is an annular recessed groove with an inner edge diameter D1.
[0027] Each heat pipe 20 is inserted through each through hole 122. Each heat pipe 20 has an open end 21 and a closed end 22. A flange 211 is provided at the open end 21. Each flange 211 is respectively accommodated in a recessed groove 123, and the lower surface of the flange 211 is flush with or lower than the inner surface of the top plate 121 of the second shell plate 12. In this embodiment, the flange 211 is an annular flange with an outer edge diameter D2, wherein the outer edge diameter D2 of the flange 211 is greater than or equal to the inner edge diameter D1 of the recessed groove 123, so as to form an interference fit or a tight fit between the flange 211 and the recessed groove 123. The flange 211 extends from the open end 21 of the heat pipe 20 in an expanded manner, and the flange 211 is perpendicular to the centerline of the heat pipe 20.
[0028] During assembly, the closed end 22 of the heat pipe 20 passes through the through hole 122 and the annular wall 125 of the second shell plate 12, and the flange 211 is embedded in the recessed groove 123. Using a welding device and fixture (not shown), a weld layer W is formed within the flange 211 and the recessed groove 123, thereby uniting each heat pipe 20 with the second shell plate 12. In this embodiment, welding is performed using a spot welding machine. During operation, pressure is first applied to bring the flange 211 of the heat pipe 20 into close contact with the wall of the recessed groove 123 of the second shell plate 12. Then, current is applied, and under the action of resistance heat, the contact area melts, forming the weld layer W after cooling.
[0029] Next, solder is applied to the heat pipe 20 and the annular wall 127 using either soft soldering or hard soldering. Heating is then used to fill the gap between the heat pipe 20 and the annular wall 125, thus forming a sealing layer S. Soft soldering uses paste-like zinc, tin, and lead as solder; hard soldering uses paste-like copper, aluminum, and magnesium as solder.
[0030] Please continue reading. Figures 3 to 5 As shown, the capillary structure 30 is disposed within the aforementioned cavity A, and it can be made of materials with good capillary adsorption, such as metal woven mesh, porous sintered powder, or fiber bundles. Its shape is roughly similar to that of the aforementioned shell 10. In this embodiment, the capillary structure 30 mainly includes a lower capillary structure 31 and an upper capillary structure 32. The lower capillary structure 31 is attached to the first shell plate 11 and is fixed to the inner surface of the first shell plate 11 by a heat diffusion welding process. The upper capillary structure 32 is attached to the second shell plate 12 and is fixed to the inner surface of the second shell plate 12 by a heat diffusion welding process. Furthermore, a plurality of perforations 321 are provided in the upper capillary structure 32, and the perforations 321 of the upper capillary structure 32 are roughly corresponding to the configuration of the heat pipe 20, and the upper capillary structure 32 is in contact with the capillary structure of the heat pipe 20.
[0031] The working fluid 40 can be pure water, which is injected into the aforementioned cavity A and subjected to a degassing and sealing process, thereby forming a vacuum chamber in cavity A.
[0032] In one embodiment, the three-dimensional temperature distribution plate combined structure of the present invention further includes a plurality of support columns 50, each support column 50 being spaced apart in the cavity A and erected between the first shell plate 11 and the second shell plate 12.
[0033] In one embodiment, the three-dimensional heat exchanger structure of the present invention further includes a heat dissipation fin assembly 60, which is sleeved on each heat pipe 20. The heat dissipation fin assembly 60 includes a plurality of heat dissipation fins stacked on top of each other.
[0034] The above-described embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the claims.
Claims
1. A three-dimensional temperature distribution plate combined structure, characterized in that, include: A housing includes a first shell plate and a second shell plate that is tightly sealed to the first shell plate. A cavity is formed between the first shell plate and the second shell plate. The second shell plate is provided with a plurality of through holes and a recessed groove is provided around the outer periphery of each through hole. A plurality of heat pipes are respectively inserted through each of the through holes. Each heat pipe has an open end and a flange is provided at the open end. Each flange is respectively housed in each of the recessed grooves. Each heat pipe is joined to the second shell plate through the flange and a fusion layer in the recessed groove. A capillary structure is disposed within the cavity and attached to the housing; and A working fluid is contained within this cavity.
2. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, The weld layer is formed by resistance welding.
3. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, The second shell plate includes a top plate, and a bulge higher than the outer surface of the top plate is formed at the position corresponding to each of the recessed grooves.
4. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, The recessed groove is an annular recessed groove with an inner edge diameter, and the flange is an annular flange with an outer edge diameter. The outer edge diameter of the flange is greater than or equal to the inner edge diameter of the recessed groove.
5. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, The flange extends from the open end of the heat pipe in an enlarged manner, and the flange and the centerline of the heat pipe are arranged perpendicularly.
6. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, A ring wall extends around each of the through holes, and each heat pipe passes through the respective ring wall.
7. The three-dimensional heat equalizer plate combined structure as described in claim 6, characterized in that, A sealing layer is also provided between each heat pipe and each ring wall.
8. The three-dimensional heat equalizer plate combined structure as described in claim 7, characterized in that, The sealing layer is formed by either a soft soldering method or a hard soldering method.
9. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, It also includes a plurality of support columns, each of which is spaced apart within the cavity and erected between the first shell plate and the second shell plate.
10. The three-dimensional heat equalizer plate combined structure as described in claim 1, characterized in that, It also includes a heat dissipation fin assembly, which is fitted onto each of the heat pipes.