Intelligent protection equipment for power electronic chip
The automated processing of intelligent protection equipment has solved the problem of power electronic chips malfunctioning due to micro-vibrations in outdoor environments, extending chip lifespan and reducing costs.
Patent Information
- Application Number
- CN202511777125.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-03-03
AI Technical Summary
Existing power electronic chips suffer from component failure due to micro-vibrations in outdoor environments, resulting in short lifespans and high costs.
An intelligent protection device was designed, which includes multiple devices such as feeding, transferring, film tearing, positioning, transportation and pressure holding to realize automated processing and enhance the protection capability of the chip.
This has improved the lifespan of power electronic chips, reduced production costs, and increased production efficiency.
Smart Images
Figure CN121604758A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of power electronic chip processing technology, and more particularly to an intelligent protection device for power electronic chips. Background Technology
[0002] An electronic chip is an electronic product that can transmit data. In electronics, it is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of a semiconductor wafer. Currently, electronic information equipment is used in all walks of life. Since its software requires hardware support, electronic equipment needs special protection measures, also known as safety protection. Many protection measures for power electronic chips are inadequate due to the instability of the outdoor environment, which leads to a short lifespan of internal components. Existing chips are prone to component failure due to micro-vibrations, resulting in high costs and unnecessary economic losses. Summary of the Invention
[0003] To address the problems existing in the prior art, the present invention provides an intelligent protection device for power electronic chips.
[0004] The present invention provides a technical description of an intelligent protection device for power electronic chips, comprising a frame, on which a feeding device, a transfer device, a film-tearing device, a positioning device, a transport device, and a pressure-holding device are respectively arranged. The film-tearing device is located in the middle of the frame, and the feeding device and the positioning device are respectively arranged on both sides of the film-tearing device. The transfer device is arranged above the film-tearing device, the transport device is arranged on one side of the positioning device, the pressure-holding device is arranged on one side of the transport device, and a waste collection box is arranged on one side of the film-tearing device.
[0005] Preferably, the feeding device includes a feeding frame, a feeding cylinder, a feeding turntable, multiple baffles, a lifting cylinder, a lifting frame, a lifting rod, and a lifting connecting shaft. The feeding frame is mounted on the machine frame. The fixed end of the feeding cylinder is located inside the feeding frame. The output end of the feeding cylinder passes through the machine frame and connects to the feeding turntable. Multiple baffles are arranged opposite each other on the feeding turntable. A lifting circular hole is provided in the center of the feeding turntable. The lifting frame is mounted inside the machine frame. The lifting cylinder is located on one side of the lifting frame. The output end of the lifting cylinder is connected to the lifting rod through the lifting connecting shaft. The other end of the lifting rod passes vertically upward and sequentially through the lifting frame, the machine frame, the feeding frame, and the lifting circular hole.
[0006] Preferably, the transfer device includes a transfer bracket, a traversing unit, a first suction assembly, and a second suction assembly. The transfer bracket is mounted on the frame, and the traversing unit is installed on the transfer bracket. The first suction assembly and the second suction assembly are arranged in parallel and are both located on the output end of the traversing unit. The first suction assembly includes a traversing slide, a suction cylinder, a suction slide rail, a suction slide, a suction slide rod, and multiple suction heads. The traversing slide is located on the output end of the traversing unit via a traversing slider. The suction cylinder is installed at the top of the traversing slide. The suction slide rail is installed on the front side of the traversing slide. One end of the suction slide is located within the suction slide rail via a suction slider. The output end of the suction cylinder is connected to one end of the suction slide rod. The other end of the suction slide rod passes through the suction slider. Multiple suction heads are installed at the lower end of the suction slide.
[0007] Preferably, the film-tearing device includes a film-tearing frame, a film-tearing side plate, a sliding cylinder, a film-tearing carrier plate, a film-tearing motor, a film-tearing shaft, a film-tearing mounting base, a film-tearing cylinder, and film-tearing grippers. The film-tearing frame is mounted on the machine frame. The film-tearing side plate is provided on one side of the film-tearing frame. The fixed end of the sliding cylinder is mounted on the film-tearing side plate. The film-tearing carrier plate is mounted on the output end of the sliding cylinder. The film-tearing motor is mounted on one side of the film-tearing carrier plate. The film-tearing mounting base is mounted on the other side of the film-tearing carrier plate. The output end of the film-tearing motor is connected to one end of the film-tearing shaft. The other end of the film-tearing shaft passes through the film-tearing carrier plate and the film-tearing mounting base in sequence and connects to the film-tearing clamping base. The fixed end of the film-tearing cylinder is mounted on the film-tearing clamping base. The film-tearing grippers are mounted on the output end of the film-tearing cylinder.
[0008] Preferably, the positioning device includes a positioning frame, a positioning panel, an L-shaped fixing plate, a first positioning cylinder, a second positioning cylinder, a first push plate, and a second push plate. The positioning frame is mounted on the machine frame, the positioning panel is mounted on the positioning frame, the L-shaped fixing plate is mounted on the positioning panel, the first positioning cylinder and the second positioning cylinder are both mounted on the positioning frame, the first positioning cylinder is located on the left side of the positioning panel, the second positioning cylinder is located on the front side of the positioning panel, and the first push plate and the second push plate are respectively mounted on the output ends of the first positioning cylinder and the second positioning cylinder.
[0009] Preferably, the transport device includes a transport base plate, a transport frame, a first transport track, a second transport track, a first carrier, and a second carrier. The transport base plate is disposed on the frame, the transport frame is mounted on the transport base plate, the first carrier and the second carrier are disposed opposite to each other inside the transport frame, and the first transport track and the second transport track are respectively disposed on the transport frame.
[0010] Preferably, the first carrier includes an adjustment frame, an adjustment motor, an adjustment cylinder, an adjustment top plate, and an adjustment baffle. The adjustment frame is mounted on the transport base plate. The fixed end of the adjustment motor is located on the upper end of the adjustment frame. The output end of the adjustment motor is facing upward and is mounted on the adjustment top plate. The adjustment cylinder is mounted on one side of the adjustment frame, and the adjustment baffle is mounted on the output end of the adjustment cylinder.
[0011] Preferably, the pressure holding device includes a pressure holding frame, a pressure holding side plate, a pressure holding motor, a pressure holding slide, a pressure holding rod, a pressure holding slide plate, a pressure holding cylinder, and a pressure holding head. The pressure holding frame is mounted on the machine frame, the pressure holding side plate is located on one side of the pressure holding frame, the fixed end of the pressure holding motor is installed at the upper end of the pressure holding side plate, a pressure holding slide rail is installed on the outer surface of the pressure holding side plate, the pressure holding slide plate is mounted on the pressure holding slide rail via a pressure holding slider, the output end of the pressure holding motor is connected to the pressure holding slider via the pressure holding rod, the pressure holding slide is installed on the outer surface of the pressure holding slide, the pressure holding cylinder is installed inside the pressure holding slide, and the pressure holding head is installed on the output end of the pressure holding cylinder.
[0012] Preferably, a protective cover is installed on the frame, and a heat sink is installed inside the protective cover.
[0013] Compared with the advantages of existing technologies, this invention is equipped with a feeding device, a transfer device, a film-tearing device, a positioning device, a transportation device, and a pressure-holding device, which can automatically perform feeding, transfer, film-tearing, installation, transportation, and pressure holding. The assembled power electronic chip has strong protection capabilities, long service life, low cost, and high productivity due to automatic processing, and has good market application value. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the feeding device of the present invention; Figure 3 This is a schematic diagram of the transfer device structure of the present invention; Figure 4 This is a schematic diagram of the film-tearing device of the present invention; Figure 5 This is a schematic diagram of the positioning device of the present invention; Figure 6 This is a schematic diagram of the transportation device structure of the present invention; Figure 7 This is a schematic diagram of the pressure-holding device of the present invention.
[0015] Labels: 1. Frame; 2. Feeding device; 3. Transfer device; 4. Film tearing device; 5. Positioning device; 6. Transport device; 7. Pressure holding device; 8. Waste collection box; 21. Feeding rack; 22. Feeding cylinder; 23. Feeding turntable; 24. Multiple baffles; 25. Lifting cylinder; 26. Lifting frame; 27. Lifting rod; 28. Lifting coupling; 31. Transfer bracket; 32. Lateral transfer unit; 33. Second suction assembly; 34. Lateral transfer slide; 35. Suction cylinder; 36. Suction slide rail; 37. Multiple suction heads; 38. Film tearing frame; 41. Film tearing side plate; 42. Sliding cylinder; 43. Film tearing carrier. 44. Film-tearing motor 45. Film-tearing shaft 46. Film-tearing mounting base 47. Film-tearing cylinder 48. Film-tearing gripper 49. Positioning frame 51. Positioning panel 52. L-shaped fixing plate 53. First positioning cylinder 54. Second positioning cylinder 55. First push plate 56. Second push plate 57. Transport base plate 61. Transport frame 62. First transport track 63. Second transport track 64. First carrier 65. Second carrier 66. Pressure holding frame 71. Pressure holding side plate 72. Pressure holding motor 73. Pressure holding slide 74. Pressure holding slide rod 75. Pressure holding cylinder 76. Pressure holding head 77. Detailed Implementation
[0016] It should be noted that the above-mentioned technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this invention specification; and, for those skilled in the art, improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
[0017] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.
[0018] It should be noted that when a component is described as being "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is described as being "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.
[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention.
[0020] The present invention will now be described in detail with reference to the accompanying drawings.
[0021] like Figures 1-7 One embodiment shown: A smart protection device for power electronic chips includes a frame 1. A feeding device 2, a transfer device 3, a film-tearing device 4, a positioning device 5, a transport device 6, and a pressure-holding device 7 are respectively arranged on the frame 1. The film-tearing device 4 is located in the middle of the frame 1. The feeding device 2 and the positioning device 5 are respectively arranged on both sides of the film-tearing device 4. The transfer device 3 is arranged above the film-tearing device 4. The transport device 6 is arranged on one side of the positioning device 5. The pressure-holding device 7 is arranged on one side of the transport device 6. A waste collection box 8 is arranged on one side of the film-tearing device 4.
[0022] It should be noted that, firstly, the lifting component in the feeding device 2 lifts the product on the feeding device 2. After being lifted, the product is picked up or clamped by the transfer device 3 and transferred to the top of the film-tearing device 4. The film-tearing device 4 tears the film, and the waste material after film tearing is thrown into the waste collection box 8. After the film tearing is completed, the transfer device 3 places the product into the positioning device 5, and then waits for the feeding robot to feed the protective layer. After the positioning and feeding are completed, the transfer device 3 clamps or picks it up and transfers it to the transport device 6 on one side. The transport device 6 transports it to the processing position of the pressure holding device 7. The pressure holding device 7 presses the protective layer onto the electronic chip to ensure the durability of the power electronic chip.
[0023] like Figure 2 One embodiment shown: The feeding device 2 includes a feeding frame 21, a feeding cylinder 22, a feeding turntable 23, multiple baffles 24, a lifting cylinder 25, a lifting frame 26, a lifting rod 27, and a lifting connecting shaft 28. The feeding frame 21 is mounted on the machine frame 1. The fixed end of the feeding cylinder 22 is located inside the feeding frame 21. The output end of the feeding cylinder 22 passes through the machine frame 1 and connects to the feeding turntable 23. The multiple baffles 25... 4 is disposed opposite to the feeding turntable 23. The feeding turntable 23 has a lifting circular hole in the middle. The lifting frame 26 is disposed inside the frame 1. The lifting cylinder 25 is disposed on one side of the lifting frame 26. The output end of the lifting cylinder 25 is connected to the lifting rod 27 through the lifting coupling 28. The other end of the lifting rod 27 is vertically upward and passes through the lifting frame 26, the frame 1, the feeding frame 21 and the lifting circular hole in sequence.
[0024] It should be noted that when the baffles are arranged opposite each other to form a frame, which is used to prevent the power electronic products to be processed, the feeding cylinder 22 drives the feeding turntable 23 to rotate 360°. When the product in the left baffle frame is lifted by the lifting cylinder 25 driving the lifting rod 27 through the lifting hole, the transfer device 3 transfers the product away. Then the lifting rod 27 falls back from the lifting hole, the feeding cylinder 22 drives the feeding turntable 23 to rotate, and the lifting rod 27 lifts the product on the other side of the feeding turntable. The lifting, clamping and transferring are carried out in a cycle.
[0025] like Figure 3 One embodiment shown: The transfer device 3 includes a transfer bracket 31, a transverse unit 32, a first suction assembly, and a second suction assembly 33. The transfer bracket 31 is mounted on the frame 1, and the transverse unit 32 is mounted on the transfer bracket 31. The first suction assembly and the second suction assembly 33 are arranged in parallel and are both located on the output end of the transverse unit 32. The first suction assembly includes a transverse slide 34, a suction cylinder 35, a suction rail 36, a suction slide 37, a suction rod, and multiple suction heads 38. The transverse slide 34 is mounted on the output end of the transverse unit 32 via a transverse slider. The suction cylinder 35 is mounted on the top of the transverse slide 34. The suction rail 36 is mounted on the front side of the transverse slide 34. One end of the suction slide 37 is located within the suction rail 36 via a suction slider. The output end of the suction cylinder 35 is connected to one end of the suction rod. The other end of the suction rod passes through the suction slider. Multiple suction heads 38 are mounted on the lower end of the suction slide 37.
[0026] It should be noted that the transverse unit 32 drives the first suction component and the second suction component 33 to slide horizontally left and right respectively. When the suction components slide, the suction cylinder 35 drives the suction slider to slide up and down on the suction slide rail 36 through the suction slide rod. The sliding of the suction slider drives the suction slide frame 37 to slide up and down. The sliding of the suction slide frame 37 drives multiple suction heads 38 to suction and transfer the products to be processed below to different work stations. The second suction component 33 has the same structure as the first suction component, except that the output end of the second suction component 33 is a suction plate.
[0027] like Figure 4One embodiment shown: The film-tearing device 4 includes a film-tearing frame 41, a film-tearing side plate 42, a sliding cylinder 43, a film-tearing carrier plate 44, a film-tearing motor 45, a film-tearing shaft 46, a film-tearing mounting base 47, a film-tearing cylinder 48, and a film-tearing gripper 49. The film-tearing frame 41 is mounted on the frame 1. The film-tearing side plate 42 is provided on one side of the film-tearing frame 41. The fixed end of the sliding cylinder 43 is mounted on the film-tearing side plate 42, and the film-tearing device is mounted on the output end of the sliding cylinder 43. A film-tearing motor 45 is mounted on one side of a film-tearing carrier plate 44, and a film-tearing mounting base 47 is mounted on the other side of the film-tearing carrier plate 44. The output end of the film-tearing motor 45 is connected to one end of a film-tearing shaft 46. The other end of the film-tearing shaft 46 passes through the film-tearing carrier plate 44 and the film-tearing mounting base 47 in sequence and is connected to a film-tearing clamping base. The fixed end of the film-tearing cylinder 48 is mounted on the film-tearing clamping base, and the film-tearing claw 49 is mounted on the output end of the film-tearing cylinder 48.
[0028] It should be noted that the sliding cylinder 43 drives the film-tearing carrier plate 44 to slide back and forth. The sliding of the film-tearing carrier plate 44 simultaneously drives the film-tearing motor 45 and the film-tearing mounting base 47 to slide. The film-tearing motor 45 drives the film-tearing cylinder 48 on the film-tearing clamping base to rotate 360° through the film-tearing rotating shaft 46. The rotation of the film-tearing cylinder 48 simultaneously drives the film-tearing gripper 49 to tear the product picked up by the upper transfer device 3. The waste material after film tearing is thrown into the waste collection box 8.
[0029] like Figure 5 One embodiment shown: The positioning device 5 includes a positioning frame 51, a positioning panel 52, an L-shaped fixing plate 53, a first positioning cylinder 54, a second positioning cylinder 55, a first push plate 56, and a second push plate 57. The positioning frame 51 is mounted on the frame 1, the positioning panel 52 is mounted on the positioning frame 51, the L-shaped fixing plate 53 is mounted on the positioning panel 52, the first positioning cylinder 54 and the second positioning cylinder 55 are both mounted on the positioning frame 51, the first positioning cylinder 54 is located on the left side of the positioning panel 52, and the second positioning cylinder 55 is located on the front side of the positioning panel 52. The first push plate 56 and the second push plate 57 are respectively mounted on the output ends of the first positioning cylinder 54 and the second positioning cylinder 55.
[0030] It should be noted that when the product after the film is removed is placed into the positioning panel 52, the first positioning cylinder 54 and the second positioning cylinder 55 respectively drive the first push plate 56 and the second push plate 57 to push the product to abut against the L-shaped fixing plate 53 for positioning. Then the loading robot performs loading and layering. After loading is completed, the first positioning cylinder 54 and the second positioning cylinder 55 retract to release the product and wait for the second suction component 33 to pick it up and place it on the transport device 6.
[0031] like Figure 6 One embodiment shown: The transport device 6 includes a transport base plate 61, a transport frame 62, a first transport track 63, a second transport track 64, a first carrier 65, and a second carrier 66. The transport base plate 61 is disposed on the frame 1, and the transport frame 62 is mounted on the transport base plate 61. The first carrier 65 and the second carrier 66 are arranged opposite to each other inside the transport frame 62, and the first transport track 63 and the second transport track 64 are respectively disposed on the transport frame 62.
[0032] It should be noted that the transport track is used to transport products for unloading, while the first carrier 65 and the second carrier 66 are used to lift the products. The first carrier 65 is used to lift the products on the transport track to achieve transport intervals, while the second carrier 66 is used to lift the products on the transport track and cooperate with the pressure holding device 7 to perform pressing processing.
[0033] like Figure 6 One embodiment shown: The first carrier 65 includes an adjustment frame, an adjustment motor, an adjustment cylinder, an adjustment top plate, and an adjustment baffle. The adjustment frame is mounted on the transport base plate 61. The fixed end of the adjustment motor is located at the upper end of the adjustment frame. The output end of the adjustment motor is facing upward and is mounted on the adjustment top plate. The adjustment cylinder is mounted on one side of the adjustment frame, and the adjustment baffle is mounted on the output end of the adjustment cylinder.
[0034] It should be noted that the adjusting motor drives the adjusting top plate to lift, and the pressure holding device 7 presses the protective layer of the product on the adjusting top plate together. The adjusting cylinder drives the adjusting baffle to block the product transported on the transport track. When the product on the adjusting top plate is pressed and falls to the transport track, the adjusting baffle falls, and the next product to be pressure held enters the upper part of the adjusting top plate. The process of blocking and processing is repeated in this cycle.
[0035] like Figure 7 One embodiment shown: The pressure holding device 7 includes a pressure holding frame 71, a pressure holding side plate 72, a pressure holding motor 73, a pressure holding slide 74, a pressure holding slide rod 75, a pressure holding slide plate, a pressure holding cylinder 76, and a pressure holding head 77. The pressure holding frame 71 is mounted on the frame 1. The pressure holding side plate 72 is located on one side of the pressure holding frame 71. The fixed end of the pressure holding motor 73 is installed on the upper end of the pressure holding side plate 72. A pressure holding slide rail is installed on the outer surface of the pressure holding side plate 72. The pressure holding slide plate is mounted on the pressure holding slide rail via a pressure holding slider. The output end of the pressure holding motor 73 is connected to the pressure holding slider via the pressure holding slide rod 75. The pressure holding slide 74 is installed on the outer surface of the pressure holding slide plate. The pressure holding cylinder 76 is installed inside the pressure holding slide 74. The pressure holding head 77 is installed on the output end of the pressure holding cylinder 76.
[0036] It should be noted that the output end of the pressure holding motor 73 drives the pressure holding slider to slide on the pressure holding slide rail through the pressure holding slide rod 75. When the pressure holding slider slides, it drives the pressure holding slide plate to slide. The pressure holding slide plate drives the pressure holding slide frame 74 to slide up and down. When the slide frame slides, it drives the pressure holding cylinder 76 to slide. The pressure holding cylinder 76 drives the pressure holding head 77 to press the delivered electronic chip product with the protective layer for protective processing.
[0037] like Figure 1 One embodiment shown: A protective cover is installed on the frame 1, and a heat sink is installed inside the protective cover.
[0038] It should be noted that the above-mentioned technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this invention specification; and, for those skilled in the art, improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A smart protection device for power electronic chips, characterized in that, The device includes a frame, on which a feeding device, a transfer device, a film-tearing device, a positioning device, a transport device, and a pressure-holding device are respectively installed. The film-tearing device is located in the middle of the frame, and the feeding device and the positioning device are respectively installed on both sides of the film-tearing device. The transfer device is installed above the film-tearing device, the transport device is installed on one side of the positioning device, the pressure-holding device is installed on one side of the transport device, and a waste collection box is installed on one side of the film-tearing device.
2. The intelligent protection device for power electronic chips according to claim 1, characterized in that, The feeding device includes a feeding frame, a feeding cylinder, a feeding turntable, multiple baffles, a lifting cylinder, a lifting frame, a lifting rod, and a lifting connecting shaft. The feeding frame is mounted on the machine frame. The fixed end of the feeding cylinder is located inside the feeding frame. The output end of the feeding cylinder passes through the machine frame and connects to the feeding turntable. Multiple baffles are arranged opposite each other on the feeding turntable. A lifting circular hole is provided in the center of the feeding turntable. The lifting frame is mounted inside the machine frame. The lifting cylinder is located on one side of the lifting frame. The output end of the lifting cylinder is connected to the lifting rod through the lifting connecting shaft. The other end of the lifting rod passes vertically upward and sequentially through the lifting frame, the machine frame, the feeding frame, and the lifting circular hole.
3. The intelligent protection device for power electronic chips according to claim 1, characterized in that, The transfer device includes a transfer bracket, a traversing unit, a first suction assembly, and a second suction assembly. The transfer bracket is mounted on the frame, and the traversing unit is installed on the transfer bracket. The first and second suction assemblies are arranged in parallel and are both located on the output end of the traversing unit. The first suction assembly includes a traversing slide, a suction cylinder, a suction rail, a suction slide, a suction rod, and multiple suction heads. The traversing slide is located on the output end of the traversing unit via a traversing slider. The suction cylinder is installed at the top of the traversing slide, and the suction rail is installed on the front side of the traversing slide. One end of the suction slide is located within the suction rail via a suction slider. The output end of the suction cylinder is connected to one end of the suction rod, and the other end of the suction rod passes through the suction slider. Multiple suction heads are installed at the lower end of the suction slide.
4. The intelligent protection device for power electronic chips according to claim 1, characterized in that, The film-tearing device includes a film-tearing frame, a film-tearing side plate, a sliding cylinder, a film-tearing carrier plate, a film-tearing motor, a film-tearing shaft, a film-tearing mounting base, a film-tearing cylinder, and film-tearing grippers. The film-tearing frame is mounted on the machine frame. The film-tearing side plate is provided on one side of the film-tearing frame. The fixed end of the sliding cylinder is mounted on the film-tearing side plate. The film-tearing carrier plate is mounted on the output end of the sliding cylinder. The film-tearing motor is mounted on one side of the film-tearing carrier plate. The film-tearing mounting base is mounted on the other side of the film-tearing carrier plate. The output end of the film-tearing motor is connected to one end of the film-tearing shaft. The other end of the film-tearing shaft passes through the film-tearing carrier plate and the film-tearing mounting base in sequence and connects to the film-tearing gripper. The fixed end of the film-tearing cylinder is mounted on the film-tearing gripper. The film-tearing grippers are mounted on the output end of the film-tearing cylinder.
5. The intelligent protection device for power electronic chips according to claim 1, characterized in that, The positioning device includes a positioning frame, a positioning panel, an L-shaped fixing plate, a first positioning cylinder, a second positioning cylinder, a first push plate, and a second push plate. The positioning frame is mounted on the machine frame, the positioning panel is mounted on the positioning frame, the L-shaped fixing plate is mounted on the positioning panel, the first positioning cylinder and the second positioning cylinder are both mounted on the positioning frame, the first positioning cylinder is located on the left side of the positioning panel, the second positioning cylinder is located on the front side of the positioning panel, and the first push plate and the second push plate are respectively mounted on the output ends of the first positioning cylinder and the second positioning cylinder.
6. The intelligent protection device for power electronic chips according to claim 1, characterized in that, The transport device includes a transport base plate, a transport frame, a first transport track, a second transport track, a first carrier, and a second carrier. The transport base plate is disposed on the frame, and the transport frame is mounted on the transport base plate. The first carrier and the second carrier are arranged opposite to each other inside the transport frame, and the first transport track and the second transport track are respectively disposed on the transport frame.
7. The intelligent protection device for power electronic chips according to claim 6, characterized in that, The first carrier includes an adjustment frame, an adjustment motor, an adjustment cylinder, an adjustment top plate, and an adjustment baffle. The adjustment frame is mounted on the transport base plate. The fixed end of the adjustment motor is located on the upper end of the adjustment frame. The output end of the adjustment motor is facing upward and is mounted on the adjustment top plate. The adjustment cylinder is mounted on one side of the adjustment frame, and the adjustment baffle is mounted on the output end of the adjustment cylinder.
8. The intelligent protection device for power electronic chips according to claim 1, characterized in that, The pressure holding device includes a pressure holding frame, a pressure holding side plate, a pressure holding motor, a pressure holding slide, a pressure holding slide rod, a pressure holding slide plate, a pressure holding cylinder, and a pressure holding head. The pressure holding frame is mounted on the machine frame, and the pressure holding side plate is located on one side of the pressure holding frame. The fixed end of the pressure holding motor is installed at the upper end of the pressure holding side plate. A pressure holding slide rail is installed on the outer surface of the pressure holding side plate. The pressure holding slide plate is mounted on the pressure holding slide rail via a pressure holding slider. The output end of the pressure holding motor is connected to the pressure holding slider via the pressure holding slide rod. The pressure holding slide is installed on the outer surface of the pressure holding slide plate. The pressure holding cylinder is installed inside the pressure holding slide. The pressure holding head is installed on the output end of the pressure holding cylinder.
9. The intelligent protection device for power electronic chips according to claim 1, characterized in that, A protective cover is installed on the frame, and a heat sink is installed inside the protective cover.