Package carrier, manufacturing method thereof and package structure

Abstract

The invention provides a packaging substrate, a manufacturing method thereof and a packaging structure. The manufacturing method of the package carrier comprises the following steps: preparing a sacrificial layer on one side of a base material; at least one opening penetrating through the sacrificial layer is formed, the base material is modified to obtain at least one modified area, and the orthographic projection of the opening on the base material at least partially covers the modified area; obtaining the position of an opening in the sacrificial layer, and identifying an omission area without an opening in the sacrificial layer; at least one opening penetrating through the sacrificial layer is additionally formed in the omission area, and the base material corresponding to the omission area is modified to obtain at least one modified area.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, specifically to packaging substrates, their fabrication methods, and packaging structures. Background Technology

[0002] With the booming development of emerging fields such as 5G, wearable devices, smartphones, automotive electronics, and AI, integrated circuit applications are diversifying, and advanced packaging technology is gradually becoming an important means to achieve miniaturization, lightweighting, and multifunctionality of electronic products. The role of an IC package substrate is to connect the chip (die) to the printed circuit board (PCB) and carry signals. The IC package substrate can provide electrical connections between the chip and the PCB; provide support, heat dissipation, and protection for the chip; and can also embed passive and active devices to achieve certain system functions. However, limited by related technologies, current IC package substrates still cannot meet the demands. Summary of the Invention

[0003] In view of this, embodiments of this application provide a packaging carrier board, a method for manufacturing the same, and a packaging structure.

[0004] The first aspect of this application provides a method for manufacturing a packaging carrier board, comprising: A sacrificial layer is prepared on one side of the substrate; At least one opening is made through the sacrificial layer, and the substrate is modified to obtain at least one modified region, wherein the orthographic projection of the opening on the substrate at least partially covers the modified region. Obtain the location of openings in the sacrificial layer and identify any missed areas in the sacrificial layer where no openings have been made; At least one opening penetrating the sacrificial layer is added to the missing area, and the substrate corresponding to the missing area is modified to obtain at least one modified area.

[0005] In one embodiment, the method of preparing the sacrificial layer on one side of the substrate includes at least one of slot coating, spin coating, inkjet printing, physical vapor deposition, atomic layer deposition, and electron beam evaporation.

[0006] In one embodiment, the method of creating at least one opening through the sacrificial layer includes laser ablation; Preferably, modifying the substrate to obtain at least one modified region includes: irradiating the substrate with a laser through an opening to obtain at least one modified region; Preferably, the process of creating at least one opening through the sacrificial layer and modifying the substrate to obtain at least one modified region is performed in the same step.

[0007] In one embodiment, the total number of openings is equal to the total number of modified regions; Preferably, the position of the opening corresponds one-to-one with the position of the modified region.

[0008] In one embodiment, the steps of obtaining the location of openings in the sacrificial layer and identifying missed areas in the sacrificial layer where no openings are made include: Find the location of at least one opening in the sacrificial layer; Compare the location of at least one opening with the location of a pre-defined modified area; If the positions of the preset modified areas and the openings completely coincide, there are no missing areas; if the positions of some preset modified areas do not coincide with the openings, the area of ​​the sacrificial layer corresponding to the position of the preset modified area that does not coincide with the opening is the missing area. Preferably, the step of obtaining the location of at least one opening in the sacrificial layer includes: A photograph of the sacrificial layer is taken on the side of the sacrificial layer facing away from the substrate; Identify the location of at least one opening in the photograph.

[0009] In one embodiment, after adding at least one opening through the sacrificial layer to the missed area and modifying the substrate corresponding to the missed area to obtain at least one modified region, the method further includes: Obtain the location of the opening in the sacrificial layer and identify whether there are any missing regions in the sacrificial layer; At least one opening penetrating the sacrificial layer is added to the missing area, and the substrate corresponding to the missing area is modified to obtain at least one modified area; Repeat the above steps until there are no missing areas in the sacrificial layer.

[0010] In one embodiment, if the sacrificial layer does not have any missing areas, the manufacturing method further includes: removing the sacrificial layer; Preferably, the material of the sacrificial layer includes at least one of organic materials, inorganic materials, and metallic materials; Preferably, the organic material includes at least one of epoxy resin, polymethyl methacrylate, polyimide and modified polyester; and / or, the inorganic material includes alumina; and / or, the metallic material includes at least one of copper and aluminum. Preferably, the sacrificial layer is made of organic materials; the method for removing the sacrificial layer includes solvent immersion, and the solvent used for solvent immersion includes organic solvents; Preferably, the organic solvent includes at least one of propylene glycol diacrylate, diethylene glycol hexyl ether, acetone, and ethyl acetate; Preferably, the material of the sacrificial layer includes at least one of inorganic materials and metallic materials; the method of removing the sacrificial layer includes pickling, and the solvent used for pickling includes an acid solution; Preferably, the acid solution includes at least one of hydrochloric acid and sulfuric acid.

[0011] In one embodiment, after removing the sacrificial layer, the fabrication method further includes: The modified regions in the substrate are removed to obtain multiple through holes; Preferably, a wet etching process is used to remove the modified areas in the substrate; Preferably, the substrate material includes glass.

[0012] The second aspect of this application provides a packaging carrier board, which is manufactured using the aforementioned manufacturing method.

[0013] A third aspect of this application provides a packaging structure, including the aforementioned packaging carrier board, or including a packaging carrier board manufactured by the aforementioned manufacturing method.

[0014] According to the method for manufacturing a packaging substrate provided in the embodiments of this application, a sacrificial layer is first fabricated on one side of the substrate. After openings are made in the sacrificial layer, the substrate is modified at the positions corresponding to the openings. The modified areas correspond one-to-one with the openings. The positions of the modified areas can be obtained by detecting the positions of the openings. When no opening is made in the missing area of ​​the sacrificial layer, no modified areas are set in the area of ​​the substrate corresponding to the missing area. This makes it easier to identify the areas in the substrate that have not been modified, and thus supplement the modification of the substrate until the positions of the modified areas in the substrate meet the expectations and satisfy the modification requirements of the substrate. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the manufacturing process of the packaging carrier board in one embodiment of this application.

[0016] Figure 2 This is a schematic cross-sectional view of a sacrificial layer formed on the surface of a substrate in one embodiment of this application.

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure after M openings are made in the sacrificial layer in one embodiment of this application.

[0018] Figure 4 This is a schematic cross-sectional view of the M modified regions obtained by modifying the substrate in one embodiment of this application.

[0019] Figure 5 This is a schematic diagram of a process in one embodiment of the present application to modify the substrate by opening M openings in the sacrificial layer to obtain M modified regions.

[0020] Figure 6 This is a schematic diagram of a process in another embodiment of the present application, in which M openings are made in the sacrificial layer to modify the substrate and obtain M modified regions.

[0021] Figure 7 This is a top view of the predetermined location of the modified region in one embodiment of this application.

[0022] Figure 8 This is a top view of the actual location of the modified region in one embodiment of this application.

[0023] Figure 9 This is a schematic diagram of the process for determining whether there is a missing region in the sacrificial layer in one embodiment of this application.

[0024] Figure 10 This is a schematic diagram of the process of preparing N openings and N modified regions in a missing region in one embodiment of this application.

[0025] Figure 11 This is a schematic diagram of the manufacturing process of the encapsulation carrier board in another embodiment of this application.

[0026] Figure 12 This is a schematic diagram of the cross-sectional structure of the encapsulation carrier board.

[0027] Reference numerals: 100, substrate; 110, modified area; 120, through hole; 200, sacrificial layer; 210, opening; Q, laser; S1, first position; S2, second position; Y, preset position; A, actual position; L, missing modified area; L', omitted area. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0031] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0032] The inventors of this application have discovered through research that using a packaging substrate as a glass substrate is a development trend in chip packaging substrates. Glass substrates have attracted widespread attention in the semiconductor industry because they can perfectly cooperate with large chips, providing better signal performance and denser wiring than current organic substrates. When glass substrates are used in large chip packaging, a large number of vias (TGVs) are set in the glass packaging substrate due to the high interconnect density requirements. Generally, the larger the size of the glass substrate, the more TGVs there are, which leads to a lower yield of large-size glass substrates. TGV via formation generally uses laser induction to locally modify the glass, and then wet etching is used to form glass vias. The inventors found that, based on a TGV aperture diameter of 50μm and a center-to-center distance of 100μm, the number of pre-designed modified areas for vias on a 100mm×100mm glass packaging substrate is approximately 1 million; when the ratio of the actual number of TGV openings to the number of pre-designed modified areas is 99.9999%, the yield of a 100mm×100mm substrate is close to 0. The low aperture ratio of TGV (Thin-Glass Vase) mainly stems from several factors. During the TGV via fabrication process, after laser-induced modification of the glass packaging substrate, some areas may be missed and not adequately modified. These missed areas may be due to equipment limitations or airborne particles obstructing the laser beam. After modification of the glass packaging substrate, these missed areas are difficult to detect. Furthermore, once wet etching removes the modified area and forms TGV within the packaging substrate, areas where TGV holes were not formed are difficult to repair and re-form. If a second laser-induced wet etching method is used to re-create holes at these missed locations, the etching solution will damage the already formed TGV, reducing product yield.

[0033] In view of this, the first aspect of this application provides a method for manufacturing a packaging carrier board, referring to... Figure 1 The diagram shows a process flow chart for fabricating a packaging substrate. The fabrication process for the packaging substrate includes the following steps.

[0034] S100: A sacrificial layer is prepared on one side of the substrate.

[0035] Reference Figure 2 The substrate 100 is made of glass, and the sacrificial layer 200 is made of at least one of organic materials, inorganic materials, and metallic materials.

[0036] Optionally, the organic material includes at least one selected from epoxy resin, polymethyl methacrylate, polyimide, and modified polyester. Optionally, the inorganic material includes alumina. Optionally, the metallic material includes at least one selected from copper and aluminum.

[0037] In one embodiment, the method of preparing the sacrificial layer on one side of the substrate includes at least one of slot coating, spin coating, inkjet printing, physical vapor deposition, atomic layer deposition, and electron beam evaporation.

[0038] In a preferred embodiment, the sacrificial layer 200 is made of organic materials. When removing the sacrificial layer 200, it can be removed by soaking it in an organic solvent, which is convenient to operate and has a better effect on removing the sacrificial layer 200, and it is not easy to leave residues.

[0039] In another preferred embodiment, the sacrificial layer 200 is made of a metallic material. When removing the sacrificial layer 200, it can be removed by soaking it in an acid solution, which is convenient to operate and has a better effect on removing the sacrificial layer 200, and it is not easy to leave residue.

[0040] S200: At least one opening is made through the sacrificial layer, and the substrate is modified to obtain at least one modified region.

[0041] For example, the orthographic projection of the opening onto the substrate at least partially covers the modified area.

[0042] Optionally, the total number of openings is equal to the total number of modified regions; alternatively, the positions of the openings correspond one-to-one with the positions of the modified regions.

[0043] It is understandable that the modified areas obtained by modifying the substrate are not easily located directly. However, by mapping the locations of openings to the locations of modified areas, the location of the modified areas can be obtained by detecting the locations of the openings in the sacrificial layer. The locations of the openings in the sacrificial layer can be obtained through optical detection, which offers high accuracy and is simple and easy to perform.

[0044] In one embodiment, a structural schematic diagram showing the structure after forming at least one opening 210 through the sacrificial layer 200 is shown below. Figure 3 The method of creating at least one opening 210 in the sacrificial layer 200 includes laser ablation.

[0045] Optionally, a structural schematic diagram of at least one modified region 110 obtained by modifying the substrate 100 is shown below. Figure 4 Modifying the substrate 100 to obtain at least one modified region 110 includes: irradiating the substrate 100 with a laser through the opening 210 to obtain at least one modified region 110.

[0046] For example, at least one opening 210 penetrating the sacrificial layer 200 and a corresponding modified region 110 obtained by modifying the substrate 100 are prepared in the same process. For example, at least one opening 210 penetrating the sacrificial layer 200 is opened by laser direct writing, and at least one modified region 110 is obtained by modifying the substrate 100.

[0047] In one embodiment, refer to Figure 5The process of opening at least one opening 210 through the sacrificial layer 200 and modifying the substrate 100 to obtain at least one modified region 110 includes: on the side of the sacrificial layer 200 away from the substrate 100, at a first position S1, irradiating the sacrificial layer 200 with laser Q and opening an opening 210 through the sacrificial layer 200 on the surface of the sacrificial layer 200 away from the substrate 100; the laser Q irradiates the substrate 100 through the opening 210 to obtain a modified region 110.

[0048] Optionally, refer to Figure 6 The process of creating at least one opening 210 through the sacrificial layer 200 and modifying the substrate 100 to obtain at least one modified region 110 further includes: moving the laser Q to a second position S2, irradiating the sacrificial layer 200 with the laser Q, and creating an opening 210 through the sacrificial layer 200 on the surface of the sacrificial layer 200 facing away from the substrate 100; the laser Q irradiates the substrate 100 through the opening 210 to obtain a modified region 110. In other words, the opening 210 can be created by laser direct writing, and the modified region 110 can be obtained by modifying the substrate 100 at the position corresponding to the opening 210.

[0049] For example, when opening the opening 210 by laser direct writing and modifying the substrate 100 at the position corresponding to the opening 210 to obtain the modified region 110, the position coordinates of multiple openings 210 are first set in the preset program (the preset position coordinates of the openings 210 are set in correspondence with the preset modified regions). The laser moves sequentially at the position coordinates of the multiple openings 210 according to the preset program and emits laser at each position coordinate. After emitting laser at each position coordinate, the laser sequentially opens an opening 210 through the sacrificial layer 200 on the surface of the sacrificial layer 200 away from the substrate 100. The laser passes through the opening 210 to irradiate the substrate 100 to obtain a modified region 110.

[0050] For example, the number of openings 210 can be 1 million, 2 million, 3 million, 4 million, or 5 million, etc. For instance, the laser needs to move 1 million positions to obtain 1 million openings 210 and corresponding 1 million modified regions 110. For example, at the first position, the laser emitted by the laser irradiates the sacrificial layer 200 and opens an opening 210 through the sacrificial layer 200 on the surface of the sacrificial layer 200 away from the substrate 100; at the same time, the laser passes through the opening 210 to irradiate the substrate 100 to obtain a modified region 110; the laser moves to the second position according to a preset program, the laser emitted by the laser irradiates the sacrificial layer 200 and opens an opening 210 through the sacrificial layer 200 on the surface of the sacrificial layer 200 away from the substrate 100; at the same time, the laser passes through the opening 210 to irradiate the substrate 100 to obtain a modified region 110. Similarly, the laser needs to be moved 1 million times to obtain 1 million openings 210 and corresponding 1 million modified regions 110. However, dust may be present in some locations, resulting in the number of openings 210 and modified regions 110 being less than 1 million. Therefore, it is necessary to add preset modified regions 110 in the substrate 100 to bring the number of preset modified regions 110 to 1 million.

[0051] S300: Obtain the location of openings in the sacrificial layer and identify any missing areas in the sacrificial layer where no openings have been created.

[0052] It's understandable that no openings were made in the missed area.

[0053] It is understandable that laser Q can sequentially fabricate multiple openings 210 and multiple modified regions 110 according to a predetermined route or procedure. For example, when it is necessary to obtain 1 million modified regions 110 in a substrate 100, the predetermined positions Y of the 1 million modified regions 110 (refer to...) Figure 7The schematic diagram of the preset position structure of the modified region 110 is shown. The laser is programmed to create the opening 210 and the modified region 110 along a predetermined path. For example, at the first position corresponding to the first modified region, laser Q is used to irradiate the sacrificial layer 200 to obtain an opening 210; laser Q passes through the opening 210 to irradiate the substrate 100, obtaining a modified region 110, thus obtaining the first modified region; at the second position corresponding to the second modified region, laser Q is used to irradiate the sacrificial layer 200 to obtain an opening 210; laser Q passes through the opening 210 to irradiate the substrate 100, obtaining a second modified region; and so on, until 1 million openings 210 and modified regions 110 are obtained. During the preparation process, dust and other particles may exist in the environment, which can block the laser, causing some of the modified regions 110 to be obstructed. The laser cannot reach the surface of the sacrificial layer 200, thus preventing modification of the substrate 100. Therefore, some areas of the substrate 100 may remain unmodified by the laser; these areas can be referred to as the unmodified area L (refer to...). Figure 8 (Structural schematic diagram of the actual location A of the modified region 110 shown). In view of this, the inventors of this application discovered that when a sacrificial layer 200 is provided on the surface of the substrate 100, the sacrificial layer 200 will be ablated to create an opening 210 under the action of a laser. After modifying the substrate 100 according to a predetermined procedure, theoretically, the position of the opening 210 corresponds one-to-one with the position of the preset modified region. However, since the unmodified region L is not modified, there is no corresponding modified region 110 in the unmodified region L, and there is no opening 210 in the sacrificial layer 200 corresponding to the unmodified region L. By using an automatic optical detection method to detect the position of the opening 210 in the sacrificial layer 200, it is easy to detect the region in the sacrificial layer 200 where the opening 210 is not opened. This position can be marked as the unmodified region L'. The sacrificial layer 200 and the substrate 100 are then irradiated with a laser at the corresponding position of the unmodified region L to increase the preparation accuracy of the modified region 110, thereby improving the preparation accuracy of the through holes in the substrate 100.

[0054] For example, the preset position Y can be the position coordinates of a predetermined number of preset modified regions set in the preset program. The laser sequentially opens at least one opening through the sacrificial layer on the surface of the sacrificial layer away from the substrate at the preset position coordinates according to a predetermined route, and modifies the substrate to obtain at least one modified region.

[0055] For example, the total number of openings 210 is equal to the total number of modified regions 110, and the positions of the openings 210 and the modified regions 110 are in a one-to-one correspondence. The position of the modified regions 110 can be obtained by detecting the position of the openings 210. Thus, before wet etching the substrate 100 to open the vias, the total number of modified regions 110 or the positional accuracy can be increased, which is beneficial to improving the manufacturing accuracy of the packaging substrate and almost eliminates the risk of secondary etching of the vias.

[0056] It is understandable that the unmodified area L and the unmodified area L' are set accordingly, or in other words, the orthographic projection of the unmodified area L on the plane of the substrate coincides with the orthographic projection of the unmodified area L' on the plane of the substrate. Since the laser first irradiates the sacrificial layer 200 to form an opening 210, and then irradiates the substrate 100 through the opening 210 to modify the substrate 100, no modified area is set in the substrate of the unmodified area L, and no opening 210 is opened in the sacrificial layer 200 of the unmodified area L'.

[0057] In one embodiment, refer to Figure 9 The steps for obtaining the location of openings in the sacrificial layer and identifying omission areas in the sacrificial layer where no openings are made include the following steps.

[0058] S310: Obtain the location of at least one opening in the sacrificial layer.

[0059] S320: Compare the position of at least one opening with the position of a preset modified region.

[0060] For example, when comparing the position of at least one opening with the position of a preset modified area, it is necessary to identify the position of the opening that coincides with the position of the preset modified area.

[0061] S331: If the position of the preset modified area coincides with the position of the opening, then there is no missing area.

[0062] S332: If the position of a portion of the preset modified area does not coincide with the position of the opening, the area of ​​the sacrificial layer corresponding to the position of the preset modified area that does not coincide with the opening is the omission area.

[0063] Optionally, the step of obtaining the location of at least one opening in the sacrificial layer includes: taking a photograph of the sacrificial layer on the side of the sacrificial layer facing away from the substrate; and identifying the location of at least one opening in the photograph. It is understood that an automated optical inspection device can be used to take a photograph of the sacrificial layer on the side facing away from the substrate and identify the location of at least one opening in the photograph.

[0064] It is understandable that the coordinates of the preset modified areas can be predetermined. Based on these predetermined positions, an opening is created on the surface of the sacrificial layer facing away from the substrate using laser direct writing. The substrate at the corresponding opening position is then modified to obtain the modified area. In a dust-free environment, the positions of the preset modified areas perfectly coincide with the actual modified areas. However, when the environment contains dust, the number of actual modified areas may be less than the number of preset modified areas, causing some preset modified areas to not coincide with the actual modified areas. In this case, the regions of the sacrificial layer that do not coincide with the preset modified areas can be identified by detecting the positions of the openings in the sacrificial layer. These are considered missed areas, and laser processing can be continued in these missed areas to add more modified areas.

[0065] For example, an automated optical inspection device typically refers to an Optical Vector Analyzer (OVA). Its working principle is as follows: the OVA directly measures the optical linear transfer function, i.e., the Jones matrix, using interferometry. By measuring and analyzing the Jones matrix, the optical parameters of at least one opening in the sacrificial layer can be obtained. For instance, by analyzing the elements of the Jones matrix, parameters such as insertion loss (IL), return loss (RL), polarization dependent loss (PDL), polarization mode dispersion (PMD), and group delay (GD) can be obtained. Combining these parameters, the location of at least one opening in the sacrificial layer can be determined.

[0066] S410: At least one opening penetrating the sacrificial layer is added to the missing area, and the substrate corresponding to the missing area is modified to obtain at least one modified area.

[0067] It is understandable that the total number of openings is less than or equal to the number of preset modified areas.

[0068] In one embodiment, after adding at least one opening through the sacrificial layer in the missing area and modifying the substrate corresponding to the missing area to obtain at least one modified area, the method further includes: obtaining the position of the opening in the sacrificial layer and determining whether there is a missing area in the sacrificial layer; if there is a missing area, adding at least one opening through the sacrificial layer on the surface of the sacrificial layer on the side away from the substrate located in the missing area, and modifying the substrate corresponding to the missing area to obtain at least one modified area; repeating the above steps until there is no missing area in the sacrificial layer.

[0069] It is understandable that by repeatedly checking for any missing areas in the sacrifice, the position of the modified area can be made to completely coincide with the position of the preset modified area, which is beneficial to improving the yield of the packaging substrate.

[0070] For example, refer to Figure 10On the side of the sacrificial layer 200 away from the substrate 100, the missed area L' is irradiated with a laser, and at least one opening penetrating the sacrificial layer is added; the laser passes through the opening 210 to irradiate the substrate 100 corresponding to the missed area L', and at least one modified area 110 is obtained.

[0071] S420: If there are no missing regions in the sacrificial layer, remove the sacrificial layer.

[0072] In one embodiment, the sacrificial layer is made of an organic material; the method of removing the sacrificial layer includes solvent immersion, wherein the solvent used for solvent immersion includes an organic solvent.

[0073] Optionally, the organic solvent includes at least one of propylene glycol diacrylate, diethylene glycol hexyl ether, acetone, and ethyl acetate.

[0074] Optionally, the sacrificial layer may be made of at least one of inorganic and metallic materials; the method of removing the sacrificial layer may include pickling, and the solvent used for pickling may include an acid solution.

[0075] Optionally, the acid solution includes at least one of hydrochloric acid and sulfuric acid; Optionally, the modified region penetrates the substrate in a direction perpendicular to the plane of the substrate, as shown in the figure. Figure 11 After removing the sacrificial layer, the manufacturing method also includes...

[0076] S500: Remove the modified region from the substrate to obtain multiple through holes.

[0077] Optionally, a wet etching process is used to remove the modified region 110 in the substrate 100 to obtain multiple through holes 120 (refer to...). Figure 12 (See the schematic diagram of the packaging carrier shown) to obtain the packaging carrier 10. For example, the modified regions 110 are easily etched using hydrofluoric acid or the like to obtain vias 120. Exemplarily, the number of vias 120 is equal to the number of modified regions 110.

[0078] According to the packaging substrate manufacturing method provided in the embodiments of this application, a sacrificial layer is first fabricated on one side of the substrate. An opening is made through the sacrificial layer, and then the substrate is modified at the position corresponding to the opening. The modified area corresponds one-to-one with the opening. The position of the modified area can be obtained by detecting the position of the opening. When the missing area of ​​the sacrificial layer does not have an opening, the area of ​​the substrate corresponding to the missing area does not have a modified area. This makes it easier to identify the area of ​​the substrate that has not been modified, and thus supplement the modification of the substrate until the position of the modified area in the substrate meets the expectation and satisfies the modification requirements of the substrate.

[0079] The second aspect of this application provides a packaging carrier board, which is manufactured using the aforementioned manufacturing method.

[0080] A third aspect of this application provides a packaging structure, which includes the aforementioned packaging substrate, or a packaging substrate manufactured by the aforementioned manufacturing method.

[0081] It is understood that the packaging structure includes, in addition to the aforementioned packaging substrate, connectors located in through holes and wiring layers located on opposite sides of the packaging substrate, the wiring layers being electrically connected to the connectors, and the packaging structure also includes a chip, the chip being electrically connected to the wiring layers.

[0082] Chip packaging structure is the "bridge" connecting chip (die) and external circuits. Its core functions are mechanical protection, electrical interconnection, heat dissipation, and environmental isolation (moisture / corrosion protection). The specific structure of chip packaging structure needs to be adapted to chip type (logic chip, power chip, etc.), application scenario (consumer electronics, automotive, aerospace) and packaging process.

[0083] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0084] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A method for manufacturing a packaging carrier board, characterized in that, include: A sacrificial layer is prepared on one side of the substrate; At least one opening is made through the sacrificial layer, and the substrate is modified to obtain at least one modified region, wherein the orthographic projection of the opening on the substrate at least partially covers the modified region; Obtain the position of the opening in the sacrificial layer and identify the missing areas in the sacrificial layer where the opening is not opened; At least one opening penetrating the sacrificial layer is added to the omission area, and the substrate corresponding to the omission area is modified to obtain at least one modified area.

2. The manufacturing method according to claim 1, characterized in that, The method of preparing the sacrificial layer on one side of the substrate includes at least one of slot coating, spin coating, inkjet printing, physical vapor deposition, atomic layer deposition, and electron beam evaporation.

3. The manufacturing method according to claim 1, characterized in that, The method of creating at least one opening through the sacrificial layer includes laser ablation; Preferably, the modification of the substrate to obtain at least one modified region includes: irradiating the substrate with a laser through the opening to obtain at least one modified region; Preferably, the process of creating at least one opening through the sacrificial layer and the process of modifying the substrate to obtain at least one modified region are performed in the same step.

4. The manufacturing method according to claim 1, characterized in that, The total number of openings is equal to the total number of modified regions; Preferably, the position of the opening corresponds one-to-one with the position of the modified region.

5. The manufacturing method according to claim 1, characterized in that, The steps of obtaining the location of the opening in the sacrificial layer and identifying the missing areas in the sacrificial layer where the opening is not located include: Obtain the location of at least one of the openings in the sacrificial layer; The position of at least one of the openings is compared with the position of the preset modified region; If the positions of the preset modified regions completely coincide with the positions of the openings, then there is no missing region; if the positions of some of the preset modified regions do not coincide with the positions of the openings, then the area of ​​the sacrificial layer corresponding to the positions of the preset modified regions that do not coincide with the openings is the missing region. Preferably, the step of obtaining the location of at least one of the openings in the sacrificial layer includes: A photograph of the sacrificial layer is taken on the side of the sacrificial layer facing away from the substrate; Identify the location of at least one of the openings in the photograph.

6. The manufacturing method according to claim 1, characterized in that, After adding at least one opening through the sacrificial layer to the missed area and modifying the substrate corresponding to the missed area to obtain at least one modified area, the method further includes: Obtain the position of the opening in the sacrificial layer and identify whether there is a missed area in the sacrificial layer; At least one opening penetrating the sacrificial layer is added to the omission area, and the substrate corresponding to the omission area is modified to obtain at least one modified area; Repeat the above steps until there are no missing regions in the sacrificial layer.

7. The manufacturing method according to any one of claims 1 to 6, characterized in that, If the sacrificial layer has no missing areas, the manufacturing method further includes: removing the sacrificial layer; Preferably, the material of the sacrificial layer includes at least one of organic materials, inorganic materials, and metallic materials; Preferably, the organic material includes at least one of epoxy resin, polymethyl methacrylate, polyimide, and modified polyester; and / or, the inorganic material includes alumina; and / or, the metallic material includes at least one of copper and aluminum. Preferably, the sacrificial layer is made of an organic material; the method for removing the sacrificial layer includes solvent immersion, wherein the solvent used for solvent immersion includes an organic solvent; Preferably, the organic solvent includes at least one selected from propylene glycol diacrylate, diethylene glycol hexyl ether, acetone, and ethyl acetate; Preferably, the material of the sacrificial layer includes at least one of inorganic materials and metallic materials; the method of removing the sacrificial layer includes pickling, and the solvent used for pickling includes an acid solution; Preferably, the acid solution includes at least one of hydrochloric acid and sulfuric acid.

8. The manufacturing method according to claim 7, characterized in that, After removing the sacrificial layer, the manufacturing method further includes: The modified region in the substrate is removed to obtain multiple through holes; Preferably, the modified region in the substrate is removed using a wet etching process; Preferably, the substrate is made of glass.

9. A packaging carrier board, characterized in that, The encapsulation carrier is manufactured using the manufacturing method described in any one of claims 1 to 8.

10. A packaging structure, characterized in that, It includes the packaging substrate produced by the manufacturing method according to any one of claims 1 to 8, or the packaging substrate according to claim 9.

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