Grating microstructure adhesive residue removing equipment based on multi-frequency vibration field assistance

Abstract

The invention discloses equipment for removing residual glue of a grating microstructure based on multi-frequency vibration field assistance. The equipment comprises a sliding block A, a guide rail B, a sliding block B, a liquid outlet, a liquid outlet pipe, a substrate, a guide rail A, a control cabinet, a vibration unit, a vibration table, a vacuum system and a liquid source. According to the invention, the multi-frequency vibration field is introduced, so that the photoresist residues with different viscosities and surface tensions can be efficiently removed by selecting the proper vibration frequency. According to the invention, a multi-frequency vibration field is applied to the surface of the grating microstructure, and the residual photoresist is vibrated by using vibration waves with different frequencies, so that the movement and separation of liquid molecules are promoted. By accurately adjusting the frequency and the intensity of the vibration field, liquid molecules can obtain enough power, surface tension and adhesive force are overcome, and photoresist residues are helped to be rapidly removed on the surface of the microstructure. According to the invention, the removal efficiency is obviously improved, the pollution of the residual glue to the microstructure is reduced, and the integrity and precision of the microstructure are ensured.

Description

Technical Field

[0001] This invention belongs to the field of micro-nano fabrication technology, specifically relating to a device for removing residual adhesive from grating microstructures based on multi-frequency vibration field assistance. Background Technology

[0002] In the fabrication of grating microstructures, especially in the fabrication of microelectronic, optical, and MEMS (microelectromechanical systems) devices, residual photoresist often adversely affects subsequent processes such as etching and deposition. Traditional photoresist removal methods, such as solvent immersion and air blowing cleaning, suffer from problems such as incomplete removal of residual liquid, low removal efficiency, and damage to microstructures. These problems lead to unstable product quality and inconsistencies in subsequent processes, severely impacting the precision and yield of micro- and nanofabrication. Summary of the Invention

[0003] To address the aforementioned problems in existing technologies, this invention aims to design a multi-frequency vibration field-assisted residual photoresist removal device for grating microstructures that can efficiently and thoroughly remove residual photoresist liquid without damaging the microstructure, thereby improving the precision and product yield of micro-nano fabrication.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows: a grating microstructure residual adhesive removal device based on multi-frequency vibration field assistance, comprising slider A, guide rail B, slider B, liquid outlet, liquid outlet pipe, substrate, guide rail A, control cabinet, vibration unit, vibration table, vacuum system and liquid source; The vibration table is mounted on the workbench, the vibration unit is fixedly mounted in the mounting groove on the upper part of the vibration table, the base is mounted on the upper part of the vibration unit, and the grating microstructure is vacuum adsorbed onto the base; The control cabinet is installed on the vibration table and is connected to slider A, slider B, vacuum system and vibration unit respectively via control lines; The guide rail A is installed on the side of the control cabinet; the slider A is slidably connected to the guide rail A and slides along the guide rail A; the guide rail B is fixedly installed on the slider A, and the guide rail B and the guide rail A are perpendicular to each other on the horizontal plane; the slider B is slidably connected to the guide rail B and slides along the guide rail B; the liquid outlet is installed at the lower part of the slider B and is connected to the liquid source through the liquid outlet pipe. The vacuum system is connected to a vacuum adsorption device under the substrate via a connecting pipe, and uses negative pressure to remove photoresist residue.

[0005] Furthermore, the inner wall of the outlet pipe is smoothed to ensure that the cleaning fluid flows smoothly and is evenly distributed.

[0006] Furthermore, the vibration unit is equipped with a multi-frequency vibration generator to adjust the vibration frequency, amplitude, and waveform according to cleaning requirements.

[0007] Furthermore, the vacuum system is equipped with an adjustable negative pressure module to adjust the suction strength and ensure that the grating microstructure remains stable during the removal of photoresist residue.

[0008] Furthermore, the control system installed in the control cabinet includes a real-time monitoring and feedback mechanism, which adjusts the operating parameters through feedback data to maintain the stability of equipment operation.

[0009] Furthermore, the vibration unit not only provides multi-frequency vibration, but also has a high-precision control function, which adjusts the frequency, amplitude and waveform of the vibration according to the properties of different types of photoresists, thereby achieving efficient removal of different photoresists.

[0010] Furthermore, the vacuum system uses an adjustable negative pressure module to precisely control the suction strength, ensuring that the grating microstructure remains stable on the substrate surface while avoiding excessive suction from negatively impacting the surface of the grating microstructure.

[0011] Furthermore, the control cabinet is equipped with a real-time monitoring and feedback mechanism, which adjusts the equipment operating parameters based on real-time data during the adhesive removal process to ensure the continuity and stability of the entire adhesive removal process and avoid the adhesive removal effect being affected by environmental changes.

[0012] The working principle of this invention is as follows: Slider A and slider B are used to adjust the relative position between the liquid outlet and the grating microstructure; the liquid outlet is used to precisely adjust the cleaning fluid flow rate and cooperate with the vibration field to assist in removing photoresist residue; the grating microstructure removes excess photoresist residue from the substrate surface through vibration; the substrate is used to support the grating microstructure, the photoresist residue is located on the substrate surface, and the vibration unit is located below the substrate, generating vibration on the surface of the grating microstructure through a multi-frequency vibration field to help remove the photoresist residue; the control cabinet is used to adjust the vibration frequency in real time to ensure the photoresist removal effect; the vacuum system is used to hold the grating microstructure, ensuring the stability of the grating microstructure during the photoresist removal process, preventing it from shifting due to vibration, and improving the removal efficiency.

[0013] The slider A is supported by the guide rail B and can slide along the guide rail B to adjust the relative position between the liquid outlet and the grating microstructure, ensuring that the liquid can be accurately sprayed onto the grating microstructure and that the entire cleaning process can be carried out stably and accurately.

[0014] The guide rail B is used to support the slider A and provide a sliding track, so that the slider A can be accurately positioned and move smoothly within the equipment, ensuring no offset or vibration during the adjustment process, thereby guaranteeing the stability and high precision of the operation.

[0015] The slider B is connected to the slider A. The movement of the slider B adjusts the precise relative position between the liquid outlet and the grating, ensuring that the effects of liquid and vibration are evenly distributed, optimizing the removal of photoresist residue, and ensuring the integrity and precision of the grating microstructure during the photoresist removal process.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention introduces a multi-frequency vibration field, enabling efficient removal of photoresist residues with varying viscosities and surface tensions by selecting appropriate vibration frequencies. Different frequencies of vibration waves generate different waveforms and energy distributions, enhancing the separation and flowability of liquid molecules and overcoming the limitations of traditional methods that rely on a single frequency.

[0017] 2. Compared with traditional removal methods, the present invention can remove residual liquid on the surface of grating microstructure in a short time, which greatly improves the removal efficiency and avoids damage to the microstructure caused by excessive cleaning.

[0018] 3. The frequency and intensity of the vibration source can be adjusted according to the needs of different types of photoresists and microstructures to achieve a customized cleaning process, avoiding damage to the microstructure caused by excessive vibration or strong liquid impact during the cleaning process.

[0019] 4. In summary, this invention applies a multi-frequency vibration field to the surface of the grating microstructure, utilizing vibration waves of different frequencies to vibrate the photoresist residue, thereby promoting the movement and separation of liquid molecules. By precisely adjusting the frequency and intensity of the vibration field, the liquid molecules gain sufficient momentum to overcome surface tension and adhesion forces, facilitating the rapid removal of photoresist residue from the microstructure surface. This invention significantly improves removal efficiency, reduces residue contamination of the microstructure, and ensures the integrity and precision of the microstructure. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is an exploded view of the overall structure of the present invention; Figure 3 This is a schematic diagram of the grating microstructure. Figure 4 This is a schematic diagram of the base structure; Figure 5 This is a schematic diagram showing the fixed position of guide rail A; Figure 6 This is a schematic diagram (exploded view) of the cleaning fluid source.

[0021] In the figure: 1-Slider A; 2-Guide rail B; 3-Slider B; 4-Liquid outlet; 5-Liquid outlet pipe; 6-Grate microstructure; 7-Substrate; 8-Guide rail A; 9-Control cabinet; 10-Vibration unit; 11-Vibration table; 12-Residual adhesive; 13-Vacuum system; 14-Liquid source. Detailed Implementation

[0022] The present invention will now be further described with reference to the accompanying drawings.

[0023] like Figure 1-6 As shown, a device for removing residual adhesive 12 based on a multi-frequency vibration field-assisted grating microstructure 6 includes a device structure composed of components such as slider A1, guide rail B2, slider B3, liquid outlet 4, liquid outlet 5, grating microstructure 6, substrate 7, guide rail A8, control cabinet 9, vibration unit 10, vibration table 11, vacuum system 13, and liquid source 14.

[0024] The slider A1 supports and guides the smooth movement of slider B3, ensuring accurate relative positioning between the base 7 and the vibration unit 10, and guaranteeing precision and stability during the adhesive removal process. Slider A1 slides along a stable trajectory via guide rail B2, avoiding deviations caused by external vibrations or other factors. Figure 1-2 As shown; The guide rail B2 provides support for the slider A1, allowing it to slide freely within the device and ensuring the stability and accuracy of its movement. The guide rail B2 is the main structure supporting the slider A1, guaranteeing stability throughout the entire adhesive removal process. Figure 1-2 As shown; The slider B3, connected to slider A1, adjusts the relative position between the substrate 7 and the vibration unit 10. The movement of slider B3 directly affects the effectiveness of the photoresist removal process and the integrity of the microstructure. This component, in conjunction with the adjustment of the control cabinet 9 during the photoresist removal process, achieves precise positioning of the substrate 7, such as... Figure 1-2 As shown; The outlet 4 is used to adjust the direction and intensity of the cleaning solution, ensuring that the liquid can evenly cover the surface of the substrate 7, thus aiding in the removal of photoresist. The outlet 4, in conjunction with the outlet 5, ensures that the cleaning solution does not create dead zones, effectively removing residual photoresist 12. Figure 1-2 As shown; The outlet 5 is connected to the outlet 4, and uniformly transfers the cleaning solution to the surface of the grating microstructure 6 to help remove residual photoresist. The rational design of the outlet 5 ensures the stability and strength of the cleaning solution, further improving the photoresist removal efficiency. Figure 1-2 As shown; The grating microstructure 6 is located above the substrate and serves to hold the photoresist residue removed during the cleaning process. During cleaning, the photoresist residue is removed from the grating microstructure 6 by means of vibration and the cleaning solution, such as... Figure 1-3 As shown; The guide rail A8 is fixed to the side of the control cabinet 9, supporting the slider B3 and ensuring its stable movement during the adhesive removal process, thus avoiding errors caused by external interference. The guide rail A8 provides a precise motion trajectory, ensuring the substrate 7 remains in a stable position during adhesive removal. Figure 1 , 2 As shown in Figure 5; The control cabinet 9 is used to adjust the vibration frequency and airflow intensity in real time to precisely control the photoresist removal process. The control cabinet 9 can automatically adjust the vibration and airflow parameters according to different substrate types 7 and the amount of photoresist residue, ensuring the efficiency and stability of the photoresist removal process. Figure 1-2 As shown; The vibration unit 10 assists in removing photoresist residue 12 by generating a multi-frequency vibration field. The vibration unit 10 can adjust the vibration frequency according to the removal requirements, ensuring efficient photoresist removal and avoiding impact on the microstructure, such as... Figure 1-2 As shown; The vibration table 11 provides external protection to prevent interference from the external environment on the internal components of the equipment. The vibration table 11 is designed with the long-term stable operation requirements of the equipment in mind, while effectively isolating the equipment from the effects of external vibrations and impurities. Figure 1-2 As shown; The residual adhesive 12 refers to the photoresist residue that needs to be removed during the adhesive removal process. The equipment uses a combination of cleaning fluid and vibration to ensure that the residual adhesive 12 is completely removed, thus guaranteeing the stability of subsequent processes. Figure 3 As shown; The vacuum system 13 generates negative pressure to hold the grating microstructure 6 in place, ensuring the grating maintains a stable position during the adhesive removal process and preventing displacement due to vibration. Figure 4 As shown; The liquid source 14 is responsible for supplying the cleaning solution and conveying it to the outlet 4 through the outlet 5. The liquid source 14 ensures a stable flow rate and pressure of the cleaning solution throughout the photoresist removal process through a stable liquid supply, providing sufficient cleaning solution support for removing photoresist residue 12. Figure 6 As shown.

[0025] Furthermore, the control cabinet 9 employs a modular design, with its various components, such as sensors, actuators, and control panels, connected via standardized interfaces to ensure flexible system adjustments under different process requirements. The sensors utilize high-precision temperature and humidity monitoring and photoresist removal level sensors, enabling real-time acquisition of the substrate 7's surface status information and feedback to the control cabinet 9. The circuit board of the control cabinet 9 is made of high-temperature resistant materials to ensure stability and reliability under prolonged high-load operation.

[0026] Furthermore, the vibration device of the vibration unit 10 adopts a design combining composite materials and metal, ensuring high strength and low friction. The motor of the vibration unit 10 is a low-noise, high-stability DC motor, connected to the machine body through a spring damping device to reduce excessive vibration caused by equipment operation. The frequency adjustment of the vibration unit 10 is achieved mechanically, featuring high-precision adjustment capabilities and providing vibration output in multiple frequency bands to adapt to different photoresist removal requirements.

[0027] Furthermore, the connection between the liquid outlet 4 and the liquid outlet 5 adopts a quick-release connector design, which facilitates maintenance and cleaning. The internal design of the air outlet adopts a gradient streamlined structure, which reduces the turbulence effect when the cleaning fluid passes through, thereby ensuring that the liquid is more evenly distributed on the surface of the substrate 7. The air outlet pipe is made of high-temperature resistant silicone material to ensure that it will not deform or age in high-temperature environments, guaranteeing long-term stability.

[0028] Furthermore, the adsorption device of the vacuum system 13 adopts a multi-stage pump design, with each stage pump using corrosion-resistant materials to ensure efficient removal of photoresist residue during the photoresist removal process. The vacuum pipeline is made of a high-compressive-strength composite material, and the connections use high-sealing quick-connect fittings to reduce the possibility of system leakage.

[0029] The operating mode of this invention is as follows: First, prepare the grating microstructure 6 substrate to be cleaned, ensuring its surface is smooth and the photoresist layer has been exposed and developed.

[0030] Secondly, the vibration generation unit is activated, and a suitable vibration frequency and intensity are selected according to the type of photoresist and the properties of the residual photoresist 12. By adjusting the operating frequency of the vibration source (e.g., low-frequency vibration is used to disrupt large-scale liquid flow, and high-frequency vibration is used to resolve small-scale droplet adhesion), it is ensured that the vibration wave can effectively act on the surface of the grating microstructure 6 and stimulate the flow and separation of the residual liquid.

[0031] Then, the liquid delivery and spraying system is activated. By spraying an appropriate cleaning solution or solvent, and in conjunction with the vibration field, the cleaning solution interacts with the photoresist residue 12, promoting the separation and removal of the liquid. The synergistic effect of the cleaning solution spraying and the vibration field ensures the complete removal of residual photoresist liquid in a short time.

[0032] Next, the cleaning effect is monitored in real time, and the vibration intensity and frequency are adjusted using a feedback control unit to ensure that the removal effect reaches the expected level and does not damage the microstructure.

[0033] Finally, after removing the residual photoresist 12, drying and curing are carried out to ensure that the photoresist on the surface of the microstructure is completely removed and the microstructure remains intact.

[0034] As described above, those skilled in the art can make various other corresponding changes and modifications based on the technical solutions and concepts of this invention, and all such changes and modifications should fall within the protection scope of the claims of this invention.

Claims

1. A device for removing residual adhesive using a grating microstructure assisted by a multi-frequency vibration field, characterized in that: It includes slider A (1), guide rail B (2), slider B (3), liquid outlet (4), liquid outlet (5), base (7), guide rail A (8), control cabinet (9), vibration unit (10), vibration table (11) and vacuum system (13) and liquid source (14); The vibration table (11) is installed on the workbench, the vibration unit (10) is fixedly installed in the mounting groove on the upper part of the vibration table (11), the base (7) is installed on the upper part of the vibration unit (10), and the grating microstructure (6) is vacuum adsorbed on the base (7); The control cabinet (9) is installed on the vibration table (11) and connected with the slider A (1), the slider B (3), the vacuum system (13) and the vibration unit (10) through control lines respectively; The guide rail A (8) is installed on the side of the control cabinet (9); the slider A (1) is in sliding connection with the guide rail A (8) and slides along the guide rail A (8); the guide rail B (2) is fixedly installed on the slider A (1), and the guide rail B (2) is perpendicular to the guide rail A (8) in the horizontal plane; the slider B (3) is in sliding connection with the guide rail B (2) and slides along the guide rail B (2); the liquid outlet (4) is installed on the lower part of the slider B (3) and connected with the liquid source (14) through the liquid outlet (5); The vacuum system (13) is connected with the vacuum adsorption device below the base (7) through a connecting pipeline, and the photoresist residue (12) is removed by using negative pressure.

2. The apparatus for removing residue based on multi-frequency vibration field assistance according to claim 1, wherein: The inner wall of the liquid outlet (5) is smoothly treated to ensure smooth flow of the cleaning liquid and uniform distribution.

3. The apparatus according to claim 1, wherein the apparatus is characterized by: The vibration unit (10) is provided with a multi-frequency vibration generating device, and the vibration frequency, amplitude and waveform are adjusted according to the cleaning requirement.

4. The apparatus for removing residue based on multi-frequency vibration field assistance according to claim 1, wherein: The vacuum system (13) is provided with an adjustable negative pressure module to adjust the suction strength, so that the grating microstructure (6) remains stable during removal of the photoresist residue (12).

5. The apparatus for removing residue based on multi-frequency vibration field assistance according to claim 1, wherein: The control system installed in the control cabinet (9) includes a real-time monitoring and feedback mechanism, which adjusts the working parameters through feedback data to maintain the stability of the equipment operation.

6. The apparatus for removing residue based on multi-frequency vibration field assistance according to claim 1, wherein: The vibration unit (10) not only provides multi-frequency vibration, but also has high-precision control function, and adjusts the frequency, amplitude and waveform of vibration according to the properties of different types of photoresist, so as to realize efficient removal of different photoresists.

7. The apparatus for removing residue based on multi-frequency vibration field assistance according to claim 1, wherein: The vacuum system (13) uses an adjustable negative pressure module to accurately control the strength of the suction force, so as to ensure that the grating microstructure (6) is stable on the surface of the base (7), and avoid negative effects of the overstrong suction force on the surface of the grating microstructure (6).

8. The apparatus for removing residue based on multi-frequency vibration field assistance according to claim 1, wherein: The control cabinet (9) is provided with a real-time monitoring and feedback mechanism, which adjusts the equipment working parameters according to the real-time data in the photoresist removal process, ensures the continuity and stability of the whole photoresist removal process, and avoids the influence of environmental changes on the photoresist removal effect.

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