Cooling fin feeding and assembling equipment

Abstract

The invention discloses cooling fin feeding and assembling equipment, which belongs to the technical field of automatic assembling equipment, and comprises a rack, and a multi-station cooling fin supply mechanism, a cooling fin feeding mechanism, a cooling fin adsorption visual detection mechanism, a substrate carrying mechanism and a substrate cooling fin attachment detection mechanism which are mounted on the rack, the cooling fin feeding mechanism comprises a second supporting frame, an ion wind bar, a first X-axis linear module, a second Z-axis linear module, a mounting frame, a cooling fin adsorbing and taking assembly and a cooling fin anti-adhesion edge pressing assembly. According to the continuous feeding device for the cooling fins, the two cooling fin adsorbing and placing assemblies alternately move, and the material supporting assemblies are matched to lift and support the cooling fin adsorbing and placing assemblies, so that continuous feeding of the cooling fins is achieved; and high-precision and high-efficiency assembly operation of the cooling fins and the substrate is realized through cooperation of an ion wind bar, a cooling fin adsorption material taking assembly, a second mounting frame, a cooling fin adsorption visual detection mechanism, a substrate carrying mechanism and a substrate cooling fin attachment detection mechanism.

Description

Technical Field

[0001] This invention relates to the field of automated assembly equipment technology, specifically to a heat sink feeding and assembly device. Background Technology

[0002] When a circuit board is in operation, its core area generates a lot of heat, so an additional heat dissipation structure needs to be installed in the core area.

[0003] As shown in the attached diagram of the instruction manual. Figure 5 As shown, the heat sink consists of a bottom carrier and heat sinks arranged in a matrix on the carrier. During assembly, heat sinks need to be picked up one by one from the carrier and then attached to the designated position on the substrate. This allows the heat generated in the core of the substrate to dissipate through the heat sinks, achieving a better heat dissipation effect.

[0004] Based on this, the present invention designs a heat sink feeding and assembly device to solve the above problems. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a heat sink feeding and assembly device.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A heat sink loading and assembly device, including a frame; The frame is equipped with a multi-station heat sink feeding mechanism, a heat sink loading mechanism, a heat sink adsorption visual inspection mechanism, a substrate handling mechanism, and a substrate heat sink attachment inspection mechanism. The substrate handling mechanism and the multi-station heat sink feeding mechanism are located on the left and right sides of the frame, respectively. The heat sink loading mechanism and the heat sink adsorption visual inspection mechanism are located between the substrate handling mechanism and the multi-station heat sink feeding mechanism. The substrate heat sink attachment inspection mechanism is located behind the substrate handling mechanism. The heat sink feeding mechanism includes a second support frame, an ion air bar, a first X-axis linear module, a fifth Z-axis linear module, a first mounting frame, a heat sink adsorption and picking component, and a heat sink anti-sticking edge pressing component. The second support frame is fixedly mounted on the machine frame. The first X-axis linear module is fixedly mounted on the second support frame. The fifth Z-axis linear module is fixedly mounted on the moving end of the first X-axis linear module. The first mounting frame is fixedly mounted on the moving end of the fifth Z-axis linear module. The heat sink adsorption and picking component and the heat sink anti-sticking edge pressing component are mounted on the first mounting frame. The heat sink anti-sticking edge pressing component is used to press down other heat sinks around the heat sink picked up by the heat sink adsorption and picking component. The second support frame is also fixedly mounted with an ion air bar, which is used to remove static electricity from the surface of the heat sink picked up by the heat sink adsorption and picking component.

[0007] Furthermore, the heat sink adsorption and material picking assembly includes a linear slide rail, a vertical moving plate, a first floating assembly, and a rotating adsorption assembly. The linear slide rail is fixedly connected to the first mounting frame, the vertical moving plate is slidably connected to the linear slide rail via a slider, and the first floating assembly is installed between the vertical moving plate and the first mounting frame. The first mounting frame is also equipped with a rotating adsorption assembly for picking up heat sinks.

[0008] Furthermore, the rotary adsorption assembly includes a motor, an air tube, and a microporous adsorption block. The motor is fixedly connected to the vertical moving plate, the upper end of the air tube is fixedly connected to the output end of the motor, the lower end of the air tube is fixedly connected to the microporous adsorption block, and the air tube is connected to a negative pressure generating device.

[0009] Furthermore, the heat sink anti-adhesion pressing assembly includes a pressing cylinder, a fixed frame, a positioning block, a second floating assembly, an L-shaped pressing plate, and an anti-adhesion pressing block. The pressing cylinder is fixedly connected to the vertical moving plate, and the output end of the pressing cylinder is fixedly connected to the fixed frame. The L-shaped pressing plate is located on the lower side of the fixed frame, and the second floating assembly is installed between the fixed frame and the L-shaped pressing plate. An anti-adhesion pressing block is fixedly installed at the lower end of the L-shaped pressing plate, and a positioning block is also fixedly installed on the side of the fixed frame. The positioning block is used to press on the heat sink to limit the vertical floating stroke of the L-shaped pressing plate and the anti-adhesion pressing block.

[0010] Furthermore, the multi-station heat sink feeding mechanism includes a heat sink adsorption and placement component, a material support component, and a first support frame. The first support frame is fixedly installed on the machine frame. Heat sink adsorption and placement components are symmetrically installed on the left and right sides of the first support frame. A material support component is installed between the first support frames. The material support component is used to support the heat sink adsorption and placement component at the upper and lower ends of the heat sink.

[0011] Furthermore, the heat sink adsorption and placement assembly includes a first Y-axis linear module, a first Z-axis linear module, a loading platform, a microporous vacuum chuck, and positioning strips. The first Y-axis linear module is fixedly connected to the first support frame. The first Z-axis linear module is fixedly installed at the moving end of the first Y-axis linear module, and the loading platform is fixedly installed at the moving end of the first Z-axis linear module. A microporous vacuum chuck for adsorbing heat sinks is fixedly installed on the loading platform, and multiple positioning strips for positioning heat sinks are also fixedly installed on the loading platform.

[0012] Furthermore, the heat sink adsorption visual inspection mechanism includes a first visual module, a visual shield, a ceramic inspection block, and an overload inspection column. The first visual module and the visual shield are fixedly installed on the frame, with the visual shield located on the upper side of the first visual module. A ceramic inspection block is fixedly installed on the side of the vertical moving plate, and an overload inspection column is fixedly installed on the side of the visual shield.

[0013] Furthermore, the substrate handling mechanism includes a second Y-axis linear module, a carrier plate, a positioning pusher, a contour jig, a pressure block, and an ejector assembly. The second Y-axis linear module is fixedly mounted on the frame, and the carrier plate is fixedly mounted on the moving end of the second Y-axis linear module. Several positioning pushers are fixedly mounted on the frame and distributed along the moving direction of the second Y-axis linear module. The lower end of the carrier plate has a slot for positioning in conjunction with the output end of the positioning pusher. A contour jig for loading the substrate is fixedly mounted on the upper end of the carrier plate. A pressure block is also fixedly mounted on the carrier plate, and the pressure block is located below the position on the substrate where the heat sink is to be attached.

[0014] Furthermore, the substrate heat sink attachment detection mechanism includes a second mounting frame, a second vision module, a positioning and light-shielding component, and a light-shielding inspection component. The second mounting frame is fixedly connected to the frame, the second vision module is fixedly mounted on the upper end of the second mounting frame, and a positioning and light-shielding component is also mounted on the second mounting frame below the second vision module; the light-shielding inspection component is also mounted on the frame.

[0015] Furthermore, the positioning and light-shielding component includes a fourth Z-axis linear module and a positioning frame. The fourth Z-axis linear module is fixedly connected to the second mounting bracket, and the positioning frame is fixedly installed at the output end of the fourth Z-axis linear module. The light-shielding inspection assembly includes a second X-axis linear module, a third Z-axis linear module, and an inspection light-shielding plate. The second X-axis linear module is fixedly mounted on the frame. The third Z-axis linear module is fixedly mounted on the moving end of the second X-axis linear module. The inspection light-shielding plate is fixedly mounted on the moving end of the third Z-axis linear module. The inspection light-shielding plate has openings that align with the heat sinks on the substrate.

[0016] Compared with the prior art, the advantages of this invention are as follows: In this invention, the heat sink adsorption and placement components move alternately and the material support component supports and lifts the heat sink adsorption and placement components, thereby realizing continuous material supply for the heat sink. Furthermore, the heat sink adsorption and material handling components, the second mounting frame, the heat sink adsorption visual inspection mechanism, the substrate handling mechanism, and the substrate heat sink attachment and inspection mechanism work together to achieve high-precision and high-efficiency assembly of the heat sink and the substrate, thus meeting the requirements for continuous heat sink assembly of batch substrates. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0018] Figure 1This invention provides a three-dimensional heat sink feeding and assembly device. Figure 1 ; Figure 2 This is a front view of a heat sink loading and assembly device according to the present invention; Figure 3 This invention provides a three-dimensional heat sink feeding and assembly device. Figure 2 ; Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 This is a perspective view of the multi-station heat sink feeding mechanism of the present invention; Figure 6 The three-dimensional heat sink feeding mechanism of the present invention Figure 1 ; Figure 7 The three-dimensional heat sink feeding mechanism of the present invention Figure 2 ; Figure 8 The three-dimensional heat sink feeding mechanism of the present invention Figure 3 ; Figure 9 The three-dimensional representation of the substrate handling mechanism of the present invention Figure 1 ; Figure 10 The three-dimensional representation of the substrate handling mechanism of the present invention Figure 2 ; Figure 11 This is a perspective view of the substrate heat sink attachment detection mechanism of the present invention.

[0019] The labels in the diagram represent: 1. Frame; 2. Multi-station heat sink feeding mechanism; 21. Heat sink adsorption and placement assembly; 211. First Y-axis linear module; 212. First Z-axis linear module; 213. Carrying platform; 214. Micro-hole vacuum suction cup; 215. Positioning strip; 22. Material support assembly; 221. Second Z-axis linear module; 222. Movable bracket; 223. First roller; 224. Fixed bracket; 225. Second roller; 23. First support Frame; 3. Heat sink feeding mechanism; 31. Second support frame; 32. Ionizing air bar; 33. First X-axis linear module; 34. Fifth Z-axis linear module; 35. First mounting frame; 36. Heat sink adsorption and picking assembly; 361. Linear slide rail; 362. Vertical moving plate; 363. Stroke limit block; 364. First guide rod; 365. First spring; 366. Fixed block; 367. Movable block; 368. Motor; 369. Air pipe 3610. Microporous adsorption block; 37. Heat sink anti-adhesion edge pressing assembly; 371. Edge pressing cylinder; 372. Fixing frame; 373. Positioning pressure block; 374. Second guide rod; 375. Second spring; 376. L-shaped pressure plate; 377. Anti-adhesion pressure block; 4. Heat sink adsorption visual inspection mechanism; 41. First vision module; 42. Vision cover; 43. Ceramic inspection block; 44. Overload inspection column; 5. Substrate handling mechanism; 51. Second Y-axis linear module; 52. Carrier plate; 53. Positioning push cylinder; 54. Contouring fixture; 55. Ejector push cylinder; 56. Ejector frame; 57. Ejector rod; 58. Pressure block; 6. Substrate heat sink attachment and inspection mechanism; 61. Second X-axis linear module; 62. Third Z-axis linear module; 63. Inspection light shield; 64. Fourth Z-axis linear module; 65. Positioning frame; 66. Second vision module; 67. Second mounting bracket. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0021] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view.

[0022] In some embodiments, please refer to the accompanying drawings. Figures 1-11 A heat sink loading and assembly device, comprising a frame 1; The frame 1 is equipped with a multi-station heat sink feeding mechanism 2, a heat sink loading mechanism 3, a heat sink adsorption visual inspection mechanism 4, a substrate handling mechanism 5, and a substrate heat sink attachment inspection mechanism 6. The substrate handling mechanism 5 and the multi-station heat sink feeding mechanism 2 are located on the left and right sides of the frame 1, respectively. The heat sink loading mechanism 3 and the heat sink adsorption visual inspection mechanism 4 are located between the substrate handling mechanism 5 and the multi-station heat sink feeding mechanism 2. The substrate heat sink attachment inspection mechanism 6 is located on the rear side of the substrate handling mechanism 5. The heat sink feeding mechanism 3 includes a second support frame 31, an ion air bar 32, a first X-axis linear module 33, a fifth Z-axis linear module 34, a first mounting frame 35, a heat sink adsorption and feeding assembly 36, and a heat sink anti-sticking edge pressing assembly 37. The second support frame 31 is fixedly mounted on the frame 1. The first X-axis linear module 33 is fixedly mounted on the second support frame 31. The fifth Z-axis linear module 34 is fixedly mounted on the moving end of the first X-axis linear module 33. The first mounting frame 35 is fixedly mounted on the moving end of the fifth Z-axis linear module 34. The heat sink adsorption and feeding assembly 36 and the heat sink anti-sticking edge pressing assembly 37 are mounted on the first mounting frame 35. The heat sink anti-sticking edge pressing assembly 37 is used to press down other heat sinks around the heat sink picked up by the heat sink adsorption and feeding assembly 36. The second support frame 31 is also fixedly mounted with an ion air bar 32, which is used to remove static electricity from the surface of the heat sink picked up by the heat sink adsorption and feeding assembly 36. The multi-station heat sink feeding mechanism 2 includes a heat sink adsorption and placement component 21, a material support component 22, and a first support frame 23. The first support frame 23 is fixedly installed on the frame 1. The heat sink adsorption and placement components 21 are symmetrically installed on the left and right sides of the first support frame 23. The material support component 22 is installed between the first support frames 23. The material support component 22 is used to support the heat sink adsorption and placement component 21 at the upper and lower ends of the heat sink.

[0023] In this invention, two heat sink adsorption and placement components 21 move alternately to achieve continuous feeding of heat sinks. At the loading and unloading ends of the heat sink adsorption and placement components 21, a support component 22 provides support and lift, ensuring stable and precise movement of the heat sink adsorption and placement components 21 and improving the accuracy of the heat sink adsorption and retrieval component 36. After the heat sink adsorption and placement components 21 are loaded with heat sinks, the first X-axis linear module 33 and the fifth Z-axis linear module 34 cooperate to control the movement of the first mounting bracket 35. When retrieving a heat sink, the heat sink anti-adhesion pressing component 37 first presses down other heat sinks around the heat sink to be retrieved on the heat sink adsorption and placement components 21, and then the heat sink is removed by the heat sink... The heat sink adsorption and picking component 36 picks up the required heat sink and then transfers it to the substrate transport mechanism 5. During the transport of the heat sink, the static electricity on the surface of the heat sink is removed by the ion air bar 32 to prevent the heat sink from sticking to the heat sink adsorption and picking component 36. The heat sink picked up by the heat sink adsorption and picking component 36 is visually inspected by the substrate transport mechanism 5 to determine whether the position of the heat sink meets the set value and whether the heat sink is picked up empty. Finally, the heat sink adsorption and picking component 36 aligns and attaches the qualified heat sink to the substrate on the substrate transport mechanism 5. The substrate transport mechanism 5 transports the substrate with the heat sink assembly backward. During the transport, the substrate heat sink attachment detection mechanism 6 detects whether the heat sink is correctly attached to the substrate. In this invention, two heat sink adsorption and placement components 21 move alternately and a support component 22 supports and lifts the heat sink adsorption and placement components 21, thereby achieving continuous feeding of heat sinks. The heat sink adsorption and placement components 21 are supported by an ion air bar 32, a heat sink adsorption and picking component 36, a second mounting bracket 67, a heat sink adsorption visual inspection mechanism 4, a substrate transport mechanism 5, and a substrate heat sink attachment and inspection mechanism 6, thereby achieving high-precision and high-efficiency assembly of heat sinks and substrates, and meeting the requirements for continuous heat sink assembly of batch substrates.

[0024] Please see Figure 6 , Figure 7 and Figure 8 The heat sink adsorption and picking assembly 36 includes a linear slide rail 361, a vertical moving plate 362, a first floating assembly, and a rotary adsorption assembly. The linear slide rail 361 is fixedly connected to the first mounting frame 35. The vertical moving plate 362 is slidably connected to the linear slide rail 361 via a slider. The first floating assembly is installed between the vertical moving plate 362 and the first mounting frame 35. A rotary adsorption assembly for picking up heat sinks is also installed on the first mounting frame 35. The first floating component includes a travel limit block 363, a first guide rod 364, a first spring 365, a fixed block 366, and a movable block 367. Two travel limit blocks 363 are fixedly connected to the linear slide rail 361 and distributed on both sides of the vertical moving plate 362. Two fixed blocks 366 are fixedly installed on the first mounting bracket 35, and the first guide rod 364 is fixedly installed between the two fixed blocks 366. The movable block 367 is fixedly connected to the vertical moving plate 362, and the movable block 367 is slidably connected to the first guide rod 364. Two first springs 365 are sleeved on the outside of the first guide rod 364 and distributed on both sides of the movable block 367. The two ends of the first springs 365 abut against the fixed block 366 and the movable block 367, respectively. The rotary adsorption assembly includes a motor 368, an air tube 369, and a microporous adsorption block 3610. The motor 368 is fixedly connected to the vertical moving plate 362. The upper end of the air tube 369 is fixedly connected to the output end of the motor 368, and the lower end of the air tube 369 is fixedly connected to the microporous adsorption block 3610. The air tube 369 is connected to a negative pressure generating device (not shown in the figure). The heat sink anti-adhesion pressing assembly 37 includes a pressing cylinder 371, a fixing frame 372, a positioning pressing block 373, a second floating assembly, an L-shaped pressing plate 376, and an anti-adhesion pressing block 377. The pressing cylinder 371 is fixedly connected to the vertical moving plate 362, and the output end of the pressing cylinder 371 is fixedly connected to the fixing frame 372. The L-shaped pressing plate 376 is located on the lower side of the fixing frame 372, and a second floating assembly is installed between the fixing frame 372 and the L-shaped pressing plate 376. The lower end of the L-shaped pressing plate 376 is fixedly installed with the anti-adhesion pressing block 377, and the side of the fixing frame 372 is also fixedly installed with the positioning pressing block 373. The positioning pressing block 373 is used to press on the heat sink to limit the vertical floating stroke of the L-shaped pressing plate 376 and the anti-adhesion pressing block 377. In this embodiment, the anti-adhesion pressure block 377 is provided with multiple grooves. The grooves are used to prevent the anti-adhesion pressure block 377 and the heat sink from sticking together due to negative pressure caused by squeezing.

[0025] The second floating component includes a second guide rod 374 and a second spring 375. Multiple second guide rods 374 are provided. The upper end of the second guide rod 374 is slidably connected to the fixed frame 372, and the lower end of the second guide rod 374 is fixedly connected to the L-shaped pressure plate 376. The second spring 375 is sleeved on the outside of the second guide rod 374, and the two ends of the second spring 375 abut against the fixed frame 372 and the L-shaped pressure plate 376 respectively. When removing the heat sink, the fifth Z-axis linear module 34 controls the first mounting bracket 35 to move vertically downwards. The anti-adhesion pressure block 377 first presses down on the heat sink around the heat sink to be removed, and the microporous adsorption block 3610 then presses down on the heat sink to be removed, while the first mounting bracket 35 continues to move downwards. This causes the vertical sliding plate 362 to slide upwards under the limiting action of the linear slide rail 361, and the L-shaped pressure plate 376 to slide upwards under the limiting action of the second guide rod 374, until the positioning pressure block 373 presses down on the heat sink and the first mounting bracket 35 stops moving. At this time, the first spring... Both spring 365 and the second spring 375 are under force. Then, the microporous adsorption block 3610 adsorbs and grabs the heat sink to be taken. The first mounting bracket 35 moves up and resets. Under the reset action of the first spring 365 and the second spring 375, the microporous adsorption block 3610 first drives the heat sink to be taken away from the heat sink adsorption and placement assembly 21, and then causes the anti-adhesion pressure block 377 to leave the heat sink adsorption and placement assembly 21. The static electricity on the heat sink is removed by the ion wind bar 32 to prevent the heat sink from sticking to the microporous adsorption block 3610.

[0026] Please see Figure 5 The heat sink adsorption and placement assembly 21 includes a first Y-axis linear module 211, a first Z-axis linear module 212, a loading platform 213, a microporous vacuum suction cup 214, and positioning strips 215. The first Y-axis linear module 211 is fixedly connected to the first support frame 23. The first Z-axis linear module 212 is fixedly installed at the moving end of the first Y-axis linear module 211, and the loading platform 213 is fixedly installed at the moving end of the first Z-axis linear module 212. A microporous vacuum suction cup 214 for adsorbing heat sinks is fixedly installed on the loading platform 213, and a plurality of positioning strips 215 for positioning heat sinks are also fixedly installed on the loading platform 213. The material support assembly 22 includes a second Z-axis linear module 221, a movable bracket 222, first rollers 223, a fixed bracket 224, and second rollers 225. The second Z-axis linear module 221 is fixedly installed at the front end of the first support frame 23. The movable bracket 222 is fixedly installed at the moving end of the second Z-axis linear module 221. Multiple first rollers 223 are rotatably installed on the movable bracket 222 at equal intervals along the length direction of the first support frame 23. The fixed bracket 224 is fixedly installed at the rear end of the first support frame 23. The second rollers 225 are rotatably installed on the upper end of the fixed bracket 224. In this invention, the first Y-axis linear module 211 can drive the loading platform 213 to move along the length of the first support frame 23, so that the loading platform 213 can load heat sinks at the rear end of the first support frame 23 and unload heat sinks at the front end of the first support frame 23. When loading heat sinks, the heat sinks are positioned by positioning strips 215, and the heat sinks are fixed by microporous vacuum suction cups 214 to ensure the accuracy of the heat sink position. The loading platforms 213 of the two heat sink adsorption and placement components 21 move back and forth alternately, and when they meet, they are controlled by the first Z-axis linear module 212. The material carrier 213 is raised to avoid obstacles, so as to achieve uninterrupted material supply for the heat sink. The material carrier 213 is supported at the rear end of the first support frame 23 by the second roller 225, while at the front end of the first support frame 23 by the first roller 223. When a row of heat sinks on the material carrier 213 is removed, the first Y-axis linear module 211 drives the material carrier 213 to move synchronously by a set distance so that the next row of heat sinks is aligned with the microporous adsorption block 3610. The first roller 223 can always maintain the supporting effect on the material carrier 213.

[0027] Please see Figure 4 The heat sink adsorption visual inspection mechanism 4 includes a first visual module 41, a visual cover 42, a ceramic inspection block 43, and an overload inspection column 44. The first visual module 41 and the visual cover 42 are fixedly installed on the frame 1, with the visual cover 42 located on the upper side of the first visual module 41. The ceramic inspection block 43 is fixedly installed on the side of the vertical moving plate 362, and the overload inspection column 44 is fixedly installed on the side of the visual cover 42. When the equipment is powered on, the ceramic inspection block 43 is used to test whether the position of the first visual module 41 is offset and whether the camera correction value is correct. Then, the overload inspection column 44 is used to determine whether the overload function of the heat sink loading mechanism is in effect.

[0028] During the handling of the heat sink, the first mounting bracket 35 moves vertically downward so that the ceramic inspection block 43 presses on the overload inspection column 44 to determine that the heat sink is located on the upper side of the vision shield 42, and the first vision module 41 detects whether the heat sink is qualified.

[0029] Please see Figure 9 and Figure 10The substrate handling mechanism 5 includes a second Y-axis linear module 51, a carrier plate 52, a positioning push cylinder 53, a contour jig 54, a pressure block 58, and a top-loading assembly. The second Y-axis linear module 51 is fixedly mounted on the frame 1. The carrier plate 52 is fixedly mounted on the moving end of the second Y-axis linear module 51. Several positioning push cylinders 53 are fixedly mounted on the frame 1 and distributed along the moving direction of the second Y-axis linear module 51. The lower end of the carrier plate 52 has a slot for positioning in conjunction with the output end of the positioning push cylinder 53. The upper end of the carrier plate 52 is fixedly mounted with a contour jig 54 for loading the substrate. A pressure block 58 is also fixedly mounted on the carrier plate 52. The pressure block 58 is located below the position where the heat sink is to be attached to the substrate.

[0030] The top material assembly includes a contour jig 54, a top material pusher cylinder 55, and a top material frame 56. The top material pusher cylinder 55 is fixedly connected to the carrier plate 52. The top material frame 56 is fixedly installed at the output end of the top material pusher cylinder 55. Multiple top material rods 57 adapted to the substrate are fixedly installed on the top material frame 56.

[0031] In this embodiment, four positioning cylinders 53 are provided, which are used to position the carrier plate 52 during substrate feeding, substrate and heat sink attachment, substrate and heat sink assembly and subsequent detection by substrate and heat sink attachment detection mechanism 6, and substrate finished product discharge. In this invention, the second Y-axis linear module 51 can drive the carrier plate 52 to flow from front to back. The positioning push cylinder 53 and the pressure block 58 work together to provide positioning support for the substrate. When the microporous adsorption block 3610 moves down to press and attach the heat sink to the substrate, the pressure block 58 supports the substrate from the bottom side, so that the pressure block 58 and the microporous adsorption block 3610 work together to complete the assembly of the substrate and the heat sink. When the substrate and the heat sink are assembled and unloaded, the top push cylinder 55 drives the top rod 57 to move vertically upward through the top frame 56 to push the substrate out of the conformal jig 54, which facilitates the unloading of the substrate.

[0032] Please see Figure 11 The substrate heat sink attachment detection mechanism 6 includes a second mounting frame 67, a second vision module 66, a positioning and light-shielding component, and a light-shielding inspection component. The second mounting frame 67 is fixedly connected to the frame 1. The second vision module 66 is fixedly mounted on the upper end of the second mounting frame 67. A positioning and light-shielding component is also mounted on the second mounting frame 67 below the second vision module 66. A light-shielding inspection component is also mounted on the frame 1. The positioning and light-shielding assembly includes a fourth Z-axis linear module 64 and a positioning frame 65. The fourth Z-axis linear module 64 is fixedly connected to the second mounting bracket 67, and the positioning frame 65 is fixedly installed at the output end of the fourth Z-axis linear module 64.

[0033] The light-shielding inspection assembly includes a second X-axis linear module 61, a third Z-axis linear module 62, and an inspection light-shielding plate 63. The second X-axis linear module 61 is fixedly mounted on the frame 1. The third Z-axis linear module 62 is fixedly mounted on the moving end of the second X-axis linear module 61. The inspection light-shielding plate 63 is fixedly mounted on the moving end of the third Z-axis linear module 62. The inspection light-shielding plate 63 has openings that align with the heat sinks on the substrate.

[0034] In this invention, when the device is powered on, the second X-axis linear module 61 and the third Z-axis linear module 62 drive the inspection light shield 63 to move to the lower side of the second vision module 66, and test whether the position of the second vision module 66 is offset and whether the camera correction value is correct through the inspection light shield 63. Once the carrier plate 52 is in place with the assembled substrate and heat sink, the fourth Z-axis linear module 64 drives the positioning frame 65 to press down on the carrier plate 52, and the second vision module 66 detects whether the heat sink assembled on the substrate is qualified.

[0035] The specific working steps of this invention are as follows: Step 1: The substrate is transported to the conformal fixture 54, and the basic information of the substrate is obtained by a scanning device such as a barcode scanner. The second Y-axis linear module 51 drives the carrier plate 52 containing the substrate to the next station. Step 2: The fifth Z-axis linear module 34 controls the first mounting bracket 35 to move vertically downward. The anti-adhesion pressure block 377 first presses down on the heat sink around the heat sink to be removed, and then the microporous adsorption block 3610 presses down on the heat sink to be removed. After the microporous adsorption block 3610 adsorbs and grabs the heat sink to be removed, the first mounting bracket 35 moves upward and resets. The microporous adsorption block 3610 first drives the heat sink to be removed away from the heat sink adsorption and placement component 21, and then causes the anti-adhesion pressure block 377 to leave the heat sink adsorption and placement component 21; and the static electricity on the removed heat sink is removed by the ion air bar 32. Step 3: The microporous adsorption block 3610 conveys the heat sink towards the substrate. During the conveying process, the static electricity on the heat sink is removed by the ion air bar 32, and then the first vision module 41 detects whether the required heat sink is qualified. Step 4: When the microporous adsorption block 3610 presses and attaches the heat sink to the substrate, the pressure block 58 supports the substrate from the bottom side. The pressure block 58 and the microporous adsorption block 3610 work together to complete the assembly of the substrate and the heat sink. Step 5: The second Y-axis linear module 51 moves the substrate with assembled heat sinks to the underside of the substrate heat sink attachment detection mechanism 6 via the carrier plate 52. Step 6: The fourth Z-axis linear module 64 drives the positioning frame 65 to press down on the carrier plate 52, and the second vision module 66 detects whether the heat sink assembled on the substrate is qualified. Step 7: The second Y-axis linear module 51 moves the assembled and inspected substrate to the unloading station via the carrier plate 52. The top pusher cylinder 55 moves the top rod 57 vertically upward via the top frame 56 to push the substrate out of the conforming fixture 54, in order to cooperate with the subsequent substrate unloading work.

[0036] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fin feeding and assembling device, comprising a rack (1), characterized in that: a multi-station fin feeding mechanism (2), a fin feeding mechanism (3), a fin adsorption visual detection mechanism (4), a substrate carrying mechanism (5) and a substrate fin attaching detection mechanism (6) are installed on the rack (1); the substrate carrying mechanism (5) and the multi-station fin feeding mechanism (2) are respectively located on the left side and the right side of the rack (1); the fin feeding mechanism (3) and the fin adsorption visual detection mechanism (4) are located between the substrate carrying mechanism (5) and the multi-station fin feeding mechanism (2); and the substrate fin attaching detection mechanism (6) is located on the rear side of the substrate carrying mechanism (5). The fin feeding mechanism (3) comprises a second support frame (31), an ion wind rod (32), a first X-axis linear module (33), a fifth Z-axis linear module (34), a first mounting frame (35), a fin adsorption material taking assembly (36) and a fin anti-blocking edge pressing assembly (37); the second support frame (31) is fixedly installed on the rack (1); the first X-axis linear module (33) is fixedly installed on the second support frame (31); the moving end of the first X-axis linear module (33) is fixedly installed with the fifth Z-axis linear module (34); the moving end of the fifth Z-axis linear module (34) is fixedly installed with the first mounting frame (35); the fin adsorption material taking assembly (36) and the fin anti-blocking edge pressing assembly (37) are installed on the first mounting frame (35); the fin anti-blocking edge pressing assembly (37) is used for pressing other fins around the fin taken by the fin adsorption material taking assembly (36); the ion wind rod (32) is also fixedly installed on the second support frame (31); and the ion wind rod (32) is used for removing static electricity on the surface of the fin taken by the fin adsorption material taking assembly (36). The fin adsorption material taking assembly (36) comprises a linear slide rail (361), a vertical moving plate (362), a first floating assembly and a rotating adsorption assembly; the linear slide rail (361) is fixedly connected with the first mounting frame (35); the vertical moving plate (362) is limitingly and slidably connected with the linear slide rail (361) through a sliding block; and the first floating assembly is installed between the vertical moving plate (362) and the first mounting frame (35).

2. The fin feeding and assembling apparatus according to claim 1, wherein The rotating adsorption assembly comprises a motor (368), an air pipe (369) and a microporous adsorption block (3610); the motor (368) is fixedly connected with the vertical moving plate (362); the upper end of the air pipe (369) is fixedly connected with the output end of the motor (368); the lower end of the air pipe (369) is fixedly connected with the microporous adsorption block (3610); and the air pipe (369) is connected with a negative pressure generating device.

3. The fin feeding and assembling apparatus according to claim 2, wherein ​ 4. The fin feeding and assembling apparatus according to claim 3, wherein The fin anti-adhesion edge pressing assembly (37) comprises an edge pressing push cylinder (371), a fixing frame (372), a positioning pressing block (373), a second floating assembly, an L-shaped pressing plate (376) and an anti-adhesion pressing block (377), the edge pressing push cylinder (371) is fixedly connected with the vertical moving plate (362), and the output end of the edge pressing push cylinder (371) is fixedly connected with the fixing frame (372); the L-shaped pressing plate (376) is located on the lower side of the fixing frame (372), and the second floating assembly is installed between the fixing frame (372) and the L-shaped pressing plate (376); the lower end of the L-shaped pressing plate (376) is fixedly installed with the anti-adhesion pressing block (377), and the side surface of the fixing frame (372) is further fixedly installed with the positioning pressing block (373), and the positioning pressing block (373) is used for pressing on the fin to limit the vertical floating stroke of the L-shaped pressing plate (376) and the anti-adhesion pressing block (377).

5. The fin feeding and assembling apparatus according to claim 1, wherein The multi-station fin feeding mechanism (2) comprises fin suction material placing assemblies (21), material supporting assemblies (22) and first support frames (23), the first support frames (23) are fixedly installed on the rack (1), the left and right sides of the first support frames (23) are symmetrically installed with the fin suction material placing assemblies (21), and the material supporting assemblies (22) are installed between the first support frames (23), and the material supporting assemblies (22) are used for supporting and elevating the fin suction material placing assemblies (21) at the feeding end and the discharging end of the fin.

6. The fin feeding and assembling apparatus according to claim 5, wherein The fin suction material placing assembly (21) comprises a first Y-axis linear module (211), a first Z-axis linear module (212), a material loading table (213), a microporous vacuum chuck (214) and a positioning strip (215), the first Y-axis linear module (211) is fixedly connected with the first support frame (23), the moving end of the first Y-axis linear module (211) is fixedly installed with the first Z-axis linear module (212), and the moving end of the first Z-axis linear module (212) is fixedly installed with the material loading table (213); the microporous vacuum chuck (214) for suction of the fin is fixedly installed on the material loading table (213), and a plurality of positioning strips (215) for positioning of the fin are further fixedly installed on the material loading table (213).

7. The fin feeding and assembling apparatus according to claim 4, wherein The fin suction visual detection mechanism (4) comprises a first visual module (41), a visual shield (42), a ceramic point detection block (43) and an overload point detection column (44), the first visual module (41) and the visual shield (42) are fixedly installed on the rack (1), and the visual shield (42) is located on the upper side of the first visual module (41); the side surface of the vertical moving plate (362) is fixedly installed with the ceramic point detection block (43), and the side surface of the visual shield (42) is fixedly installed with the overload point detection column (44).

8. The fin feeding and assembling apparatus according to claim 1, wherein The substrate carrying mechanism (5) comprises a second Y-axis linear module (51), a carrier plate (52), positioning push cylinders (53), a profiling jig (54), a pressure block (58) and a material lifting assembly, the second Y-axis linear module (51) is fixedly installed on the rack (1), the moving end of the second Y-axis linear module (51) is fixedly installed with the carrier plate (52), the positioning push cylinders (53) are fixedly installed on the rack (1) and are distributed along the moving direction of the second Y-axis linear module (51), the lower end of the carrier plate (52) is provided with a slot for positioning the output end of the positioning push cylinder (53), and the upper end of the carrier plate (52) is fixedly installed with the profiling jig (54) for loading the substrate; the carrier plate (52) is further fixedly installed with the pressure block (58), and the pressure block (58) is located below the position of the substrate to be attached with the heat dissipation fin.

9. The fin feeding and assembling apparatus of claim 1, wherein The substrate heat dissipation fin attaching detection mechanism (6) comprises a second mounting rack (67), a second visual module (66), a positioning light shielding assembly and a light shielding point detection assembly, the second mounting rack (67) is fixedly connected with the rack (1), the second visual module (66) is fixedly installed at the upper end of the second mounting rack (67), and the positioning light shielding assembly is further installed on the lower side of the second visual module (66) on the second mounting rack (67); the light shielding point detection assembly is further installed on the rack (1).

10. The fin feeding and assembling apparatus according to claim 9, wherein The positioning light shielding assembly comprises a fourth Z-axis linear module (64) and a positioning frame (65), the fourth Z-axis linear module (64) is fixedly connected with the second mounting rack (67), and the output end of the fourth Z-axis linear module (64) is fixedly installed with the positioning frame (65); The light shielding point detection assembly comprises a second X-axis linear module (61), a third Z-axis linear module (62) and a point detection light shielding plate (63), the second X-axis linear module (61) is fixedly installed on the rack (1), the moving end of the second X-axis linear module (61) is fixedly installed with the third Z-axis linear module (62), the moving end of the third Z-axis linear module (62) is fixedly installed with the point detection light shielding plate (63), and the point detection light shielding plate (63) is provided with an opening hole for aligning with the heat dissipation fin on the substrate.

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