Cantilever type T-shaped layout wafer scribing machine

Abstract

The invention discloses a cantilever type T-shaped layout wafer scribing machine, and particularly relates to the technical field of semiconductor product cutting, the cantilever type T-shaped layout wafer scribing machine comprises a square tube base, the square tube base is fixedly provided with a water path and gas path control box, the square tube base is fixedly provided with a working platform block, and the working platform block is of a T-shaped structure; an X-axis module and a Y-axis module are fixedly installed on the working platform block, a Z-axis module is fixedly installed at the output moving end of the Y-axis module, and a CCD visual assembly and a cutting assembly are arranged at the output moving end of the Z-axis module. The working platform block is arranged, a cantilever type Z-axis structure is adopted, the occupied space is small, the loss is low, the space utilization rate is high, the structure is light and handy, the cantilever type structural design has high rigidity and stability, and due to the fact that a scribing cutter at the tail end of a cantilever has the advantages of being stable in cutting force, small in cutter abrasion loss, high in rigidity and light in weight, the machining precision is higher.

Description

Technical Field

[0001] This invention relates to the field of semiconductor product dicing technology, and more specifically, to a cantilevered T-layout wafer dicing machine. Background Technology

[0002] Wafer dicing machines are core equipment in the back-end packaging of semiconductor manufacturing. Their core function is to divide a whole wafer (made of silicon / SiC / sapphire, etc.) with fabricated circuits into independent functional chips using high-precision dicing technology. It is a key link between wafer manufacturing and chip packaging. Its dicing accuracy directly determines core yield indicators such as chip size consistency and edge breakage rate. It is compatible with 4-12 inch wafers and 50-775μm thickness range, and is widely used in consumer electronics, automotive semiconductors, power devices, LEDs and other fields.

[0003] The existing semiconductor product dicing channels cannot guarantee micron-level precision, and certain phenomena such as chipping are inevitable at the dicing position. Therefore, they have poor stability and low efficiency. In addition, semiconductor wafer dicing machines often adopt a gantry structure. The gantry structure is often used in large-size precision dicing machines of 8 inches and above. It has high parts processing accuracy and high assembly accuracy, but it occupies a large area, has low space utilization, and is not conducive to the dicing of small-size wafers. Summary of the Invention

[0004] The present invention provides a cantilevered T-type layout wafer dicing machine, which aims to solve the technical problem that the gantry structure wafer dicing machine in the related technology has a large footprint and is not conducive to the cutting of small-sized wafers.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a cantilevered T-type layout wafer dicing machine, comprising a square tube base, a water and gas circuit control box fixedly installed on the square tube base, and a work platform block fixedly installed on the square tube base; The work platform block is designed with a T-shaped structure. An X-axis module and a Y-axis module are fixedly installed on the work platform block. A Z-axis module is fixedly installed on the output moving end of the Y-axis module. A CCD vision component and a cutting component are set on the output moving end of the Z-axis module. A vacuum adsorption rotary table is fixedly installed on the output moving end of the X-axis module. A waterproof cover and a protective cover are installed on the outside of the vacuum adsorption rotary table.

[0006] In a preferred embodiment, a waterproof groove is fixedly provided on the square tube base, and several waterproof grooves are provided.

[0007] In a preferred embodiment, a sliding door is installed on the waterproof cover, and the waterproof cover and the work platform block are fixedly connected.

[0008] In a preferred embodiment, an exhaust vent and a water tank are installed on the side of the waterproof cover away from the sliding door, and a water outlet is installed on the water tank.

[0009] In a preferred embodiment, the CCD vision component includes camera one and camera two, both of which are housed inside a waterproof cover. A connecting plate is fixedly installed on the moving end of the output end of the Z-axis module, and a light shield and a cover block are provided on the outer side of camera one and camera two.

[0010] In a preferred embodiment, the end of the connecting plate away from the Z-axis module is fixedly connected to camera one, the end of the connecting plate away from the Z-axis module is fixedly connected to camera two, and the cover block is fixedly connected to the connecting plate.

[0011] In a preferred embodiment, the cutting assembly includes a spindle drive, with a blade fixedly mounted on the output end of the spindle drive. The blade is disposed inside a waterproof cover, and a water spray frame is mounted on the outer side of the spindle drive end near the blade. A water spray pipe is fixedly mounted on the water spray frame.

[0012] In a preferred embodiment, a cleaning assembly is fixedly installed on the outer side of the connecting plate. The cleaning assembly includes an air pump, which is fixedly connected to the outer side of the connecting plate. Hollow slot blocks and rubber flexible plates are fixedly installed on the lens ends of camera one and camera two. An air pipe is fixedly arranged between the output end of the air pump and the hollow slot block. A hollow block is arranged inside the hollow slot block. A rotating rod is rotatably connected between the hollow block and the hollow slot block. A spring block is fixedly connected between the hollow block and the hollow slot block. The end of the air pipe away from the air pump is fixedly connected to the hollow block. A jet nozzle is opened on the side of the hollow block near the rubber flexible plate. Several jet nozzles are provided.

[0013] The beneficial effects of this invention are as follows: This invention utilizes a cantilevered Z-axis structure in the work platform block design, resulting in a small footprint, low wear, high space utilization, and a lightweight structure suitable for small dicing machines with low load-bearing capacity. The cantilever structure design provides high rigidity and stability, while the T-shaped marble structure design and Z-axis drive module effectively reduce vibration and deformation, ensuring consistent and reliable dicing quality. In particular, it effectively maintains the cutting quality of wafer materials on the Z-axis. Because the dicing tool has stable cutting force at the cantilever end, tool wear is reduced. The high rigidity and lightweight characteristics result in higher processing accuracy. The cutting worktable requires a minimal waterproof cover area, reducing the possibility of water seepage and preventing rust on ultra-high precision roller guides and ultra-high precision ball screws, as well as moisture damage to electronic components, which could affect the overall machine lifespan. Furthermore, the waterproof cover is positioned at the front of the T-shaped worktable for easy tool replacement by the operator. In contrast, gantry-type dicing machines require front and rear doors for the waterproof cover, and the addition of a rear door for maintenance increases the possibility of water seepage.

[0014] This invention addresses the issue of water droplets or mist generated during wafer cutting when the blade rapidly impacts the cooling liquid. Excessive water droplets can adhere to the lens, potentially obstructing the wafer and hindering dicing. This necessitates manual cleaning, requiring machine shutdown and reducing dicing efficiency. The invention utilizes a hollow slot with air vents in the cleaning component to create a wave-shaped gas barrier on the lens's exterior. This barrier blocks external debris and moisture, keeping the lens clean and eliminating manual cleaning. The air vents, aligned with the cutting blade, blow away debris generated during dicing. Combined with an external air extraction device, this process accelerates debris removal. Furthermore, the wave-shaped gas barrier, compared to a straight barrier, expands the protective coverage, eliminates airflow blind spots on the lens surface, enhances airflow resistance, stabilizes external impurities, reduces airflow loss, conserves energy, minimizes airflow impact on the lens, prevents turbulent scratches on the lens surface, and adapts to different lens layouts, increasing installation flexibility. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0016] Figure 2 This is a structural schematic diagram of a portion of the present invention.

[0017] Figure 3 This is a schematic diagram of the structure of a portion of the CCD vision component of this invention.

[0018] Figure 4 This is a schematic diagram of the cutting component of the present invention.

[0019] Figure 5 This is a structural schematic diagram of the square tube base and working platform block of the present invention.

[0020] Figure 6 This is a schematic diagram of the structure of the X-axis module and Y-axis module of the present invention.

[0021] Figure 7 This is a schematic diagram of the structure of the Y-axis module and Z-axis module of the present invention.

[0022] Figure 8 This is a schematic diagram of the structure of the vacuum adsorption rotary table and protective cover of the present invention.

[0023] Figure 9 This is a schematic diagram of the structure of the covering block and part of the cleaning components of the present invention.

[0024] Figure 10 This is a schematic diagram of the structure of another part of the cleaning component of the present invention.

[0025] The attached diagram is labeled as follows: 1. Square tube base; 11. Water and air circuit control box; 12. Waterproof groove; 2. Working platform block; 21. X-axis module; 22. Y-axis module; 23. Z-axis module; 24. Waterproof cover; 25. Sliding door; 26. Exhaust pipe; 27. Water storage tank; 28. Water outlet; 3. Vacuum adsorption rotary table; 4. CCD vision component; 41. Camera 1; 42. Camera 2; 43. Light shield; 44. Connecting plate; 45. Covering block; 46. Cleaning component; 461. Air pump; 462. Hollow groove block; 463. Air pipe; 464. Rubber flexible plate; 465. Hollow block; 466. Rotating rod; 467. Spring block; 468. Air jet nozzle; 5. Cutting component; 51. Spindle drive component; 52. Blade; 53. Water spray frame; 54. Water spray pipe; 6. Protective cover. Detailed Implementation

[0026] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0027] like Figures 1-10 As shown, a cantilevered T-type layout wafer dicing machine includes a square tube base 1, a water and air control box 11 fixedly installed on the square tube base 1, and a work platform block 2 fixedly installed on the square tube base 1. The work platform block 2 is configured as a T-shaped structure. An X-axis module 21 and a Y-axis module 22 are fixedly installed on the work platform block 2. A Z-axis module 23 is fixedly installed on the output moving end of the Y-axis module 22. A CCD vision component 4 and a cutting component 5 are provided on the output moving end of the Z-axis module 23. A vacuum adsorption rotary table 3 is fixedly installed on the output moving end of the X-axis module 21. A waterproof cover 24 and a protective cover 6 are installed on the outside of the vacuum adsorption rotary table 3.

[0028] It should be noted that the T-shaped structure of the work platform, together with the CCD vision component 4 and the cutting component 5 set on the outside of the Z-axis module 23, forms a cantilevered T-shaped layout wafer dicing machine. Its overall footprint is small, which is convenient for dicing small wafers with a size of less than 8 inches. A grating ruler and a bar level are set near the X-axis module 21. Several grinding plates are installed on the vacuum adsorption rotary table 3. When used with a non-contact height measuring device, the cutting height is detected, while avoiding tool wear or chipping, extending tool life and improving yield. The protective cover 6 is also set inside the waterproof cover 24, and the protective cover 6 is also for waterproofing.

[0029] In this embodiment, the specific implementation scenario is as follows: when the staff is dicing small-sized wafers, the wafer is first placed on the vacuum adsorption rotary table 3 for fixation. Then, through the combination of the X-axis module 21, Y-axis module 22, and Z-axis module 23 (hereinafter referred to as the three-axis module), the cutting component 5 and the CCD vision component 4 are used together to divide the small gear wafer.

[0030] A waterproof groove 12 is fixedly installed on the square tube base 1, and there are several waterproof grooves 12.

[0031] It should be noted that there are two waterproof channels 12, located on both sides of the work platform block 2. Their main function is to prevent coolant from flowing onto the workshop floor, thus avoiding slipping by operators, and to isolate wastewater containing debris, thereby reducing the risk of contact.

[0032] A sliding door 25 is installed on the waterproof cover 24, and the waterproof cover 24 and the work platform block 2 are fixedly connected.

[0033] It should be noted that the waterproof cover 24 surrounds the vacuum adsorption rotary table 3. The waterproof cover 24 is set on the upper side of the X-axis module 21 and is connected to the working platform by several connecting blocks.

[0034] The waterproof cover 24 is equipped with an exhaust pipe 26 and a water storage tank 27 on the side away from the sliding door 25, and a water outlet 28 is installed on the water storage tank 27.

[0035] It should be noted that the water storage tank 27 and the waterproof cover 24 are interconnected. The exhaust port 26 is used to extract the debris generated by the slicing blade, and the water storage tank 27 and the water outlet 28 are used to drain the water accumulated inside the waterproof cover 24.

[0036] The CCD vision component 4 includes a first camera 41 and a second camera 42. Both the first camera 41 and the second camera 42 are located inside the waterproof cover 24. A connecting plate 44 is fixedly installed on the moving end of the output end of the Z-axis module 23. A light shield 43 and a cover block 45 are provided on the outer side of the first camera 41 and the outer side of the second camera 42.

[0037] The end of the connecting plate 44 away from the Z-axis module 23 is fixedly connected to camera 1 41, the end of the connecting plate 44 away from the Z-axis module 23 is fixedly connected to camera 2 42, and the cover block 45 is fixedly connected to the connecting plate 44.

[0038] It should be noted that the connecting plate 44 is located at the CCD vision perforation position of the waterproof cover 24. Camera 1 41 is a high-magnification lens camera, and Camera 2 42 is a low-magnification lens camera. Its light shield 43 is to prevent stray light from interfering with the operation of the camera, and the cover block 45 is to protect the camera from water corrosion and damage.

[0039] The cutting assembly 5 includes a spindle drive 51, a blade 52 is fixedly mounted on the output end of the spindle drive 51, the blade 52 is located inside the waterproof cover 24, a water spray frame 53 is mounted on the outer side of the spindle drive end near the blade 52, and a water spray pipe 54 is fixedly mounted on the water spray frame 53.

[0040] It should be noted that the spindle drive component 51 is located at the spindle through hole of the waterproof cover 24, and the blade 52 is an ultra-thin diamond blade 52. Its water spray pipes 54 are distributed on the left and right sides of the blade 52. Figure 4 To present a positive perspective.

[0041] In this embodiment, the specific implementation scenario is as follows: when the wafer is mounted on the vacuum adsorption rotary table 3, the three-axis module is started to cut the wafer with the cutting component 5 and the CCD vision component 4. The cutting position is first positioned by the cooperation of camera 1 41 and camera 2 42. Then, the spindle drive 51 is started to cut the wafer with the blade 52. The water spray frame 53 is connected to an external water pump housing to draw coolant, so that the blade 52 can avoid the splashing of debris during cutting as much as possible, and at the same time reduce the cutting temperature of the blade 52 and the wafer. During this process, the sliding door 25 is closed. The exhaust pipe 26 is connected to an external exhaust device to draw out the splashing debris generated inside. The used coolant enters the water storage tank 27 and is discharged through the water outlet 28. The coolant that flows out can be reused after filtration.

[0042] When the cutting component 5 works with the CCD vision component 4 to cut the wafer, the moisture will be sprayed into water mist by the high speed of the blade 52 and splash onto the lens. When the moisture accumulates to a certain level, it will block the lens, requiring the staff to stop the cutting work and open the sliding door 25 to clean the lens, which is time-consuming, laborious and reduces the efficiency of wafer cutting.

[0043] A cleaning assembly 46 is fixedly installed on the outer side of the connecting plate 44. The cleaning assembly 46 includes an air pump 461, which is fixedly connected to the outer side of the connecting plate 44. A hollow slot block 462 and a rubber flexible plate 464 are fixedly installed on the lens ends of camera one 41 and camera two 42. An air pipe 463 is fixedly arranged between the output end of the air pump 461 and the hollow slot block 462. A hollow block 465 is arranged inside the hollow slot block 462. A rotating rod 466 is rotatably connected between the hollow block 465 and the hollow slot block 462. A spring block 467 is fixedly connected between the hollow block 465 and the hollow slot block 462. The end of the air pipe 463 away from the air pump 461 is fixedly connected to the hollow block 465. An air jet 468 is opened on the side of the hollow block 465 near the rubber flexible plate 464. The air jet 468 is provided with several... It should be noted that a wave-shaped airflow barrier is formed on the side of the lens to protect it from water mist. When the gas blows over the rubber flexible plate 464, if the rubber flexible plate 464 is bent, it indicates that the gas intensity is high. This can form a wave-shaped gas barrier and also blow away impurities. If the rubber flexible plate 464 is not bent, it indicates that the gas intensity is low and needs to be strengthened. This is to form a reliable gas barrier.

[0044] In this embodiment, the specific implementation scenario is as follows: When the cutting component 5 works in conjunction with the CCD vision component 4 to cut wafers, its air pump 461 can draw in clean external gas using an external pure air tank. The gas is then delivered through the air pipe 463 to the hollow block 465 and exits through the jet nozzle 468, forming a gas barrier at the lens of the CCD vision component 4. Simultaneously, the gas in the air pipe 463 is sprayed onto the hollow block 465 to compress the spring, causing the hollow block 465 to rotate around the rotating rod 466 to adjust the spray angle of the jet nozzle 468. At the same time, the air pump 461 periodically adjusts the gas flow rate. For example, when the gas is sprayed out from the jet nozzle 468, the gas barrier forms a wave-shaped barrier, preventing water mist from splashing onto the lens and avoiding obstruction of the lens, thus eliminating the need for manual cleaning of water mist.

[0045] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A cantilevered T-shaped layout wafer dicing machine comprising a square tube base (1), characterized in that, The waterway gasway control box (11) is fixedly installed on the square base (1), and the working platform block (2) is fixedly installed on the square base (1); The working platform block (2) is provided as a T-shaped structure, the X-axis module (21) and the Y-axis module (22) are fixedly installed on the working platform block (2), the output moving end of the Y-axis module (22) is fixedly installed with the Z-axis module (23), the output moving end of the Z-axis module (23) is provided with the CCD visual assembly (4) and the cutting assembly (5), the output moving end of the X-axis module (21) is fixedly installed with the vacuum adsorption rotary table (3), and the outer side of the vacuum adsorption rotary table (3) is installed with the waterproof cover (24) and the protective cover (6).

2. The cantilevered T-shaped layout wafer sawing machine according to claim 1, wherein, The waterproof groove (12) is fixedly arranged on the square base (1), and a plurality of waterproof grooves (12) are arranged.

3. The cantilevered T-shaped layout wafer sawing machine according to claim 2, wherein, The waterproof cover (24) is installed with the sliding door (25), and the waterproof cover (24) and the working platform block (2) are fixedly connected.

4. The cantilevered T-shaped layout wafer sawing machine according to claim 3, wherein, The waterproof cover (24) is installed with the air exhaust pipe (26) and the water storage tank (27) away from the sliding door (25), and the water storage tank (27) is installed with the water outlet (28).

5. The cantilevered T-shaped layout wafer sawing machine according to claim 4, wherein, The CCD visual assembly (4) comprises a camera one (41) and a camera two (42), the camera one (41) and the camera two (42) are arranged inside the waterproof cover (24), the output moving end of the Z-axis module (23) is fixedly installed with the connecting plate block (44), the outer side of the camera one (41) and the outer side of the camera two (42) are provided with the light shield (43) and the covering block (45).

6. The cantilevered T-shaped layout wafer sawing machine according to claim 5, wherein, The connecting plate block (44) is fixedly connected with the camera one (41) and the camera two (42) away from the Z-axis module (23), and the covering block (45) is fixedly connected with the connecting plate block (44).

7. The cantilevered T-shaped layout wafer sawing machine according to claim 6, wherein, The cutting assembly (5) comprises a main shaft driving part (51), the output end of the main shaft driving part (51) is fixedly installed with the blade (52), the blade (52) is arranged inside the waterproof cover (24), the outer side of the main shaft driving end close to one end of the blade (52) is installed with the water spraying frame (53), and the water spraying frame (53) is fixedly installed with the water spraying pipe (54).

8. The cantilevered T-shaped layout wafer sawing machine according to claim 7, wherein, The outer side of the connecting plate block (44) is fixedly installed with a cleaning assembly (46), the cleaning assembly (46) comprises an air pump (461), the air pump (461) is fixedly connected to the outer side of the connecting plate block (44), the lens end of the camera one (41) and the lens end of the camera two (42) are fixedly installed with a hollow groove block (462) and a rubber soft plate (464), an air pipe (463) is fixedly arranged between the output end of the air pump (461) and the hollow groove block (462), a hollow block (465) is arranged in the hollow groove block (462), a rotating rod (466) is rotatably connected between the hollow block (465) and the hollow groove block (462), a spring block (467) is fixedly connected between the hollow block (465) and the hollow groove block (462), one end of the air pipe (463) away from the air pump (461) is fixedly connected with the hollow block (465), a gas injection port (468) is formed in the side of the hollow block (465) close to the rubber soft plate (464), and a plurality of gas injection ports (468) are arranged.

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