Processing device and manufacturing method of high-thermal-conductivity C-grade electrical molded product

Abstract

The invention provides a machining device for a high-heat-conductivity C-grade electrical molded product, and relates to the technical field of mold pressing machining.The machining device comprises an upper mold and a lower mold, and the upper mold is provided with an auxiliary pressurization assembly used for applying independent local secondary pressurization to a microstructure area after mold closing; the lower die is provided with an exhaust assembly, and the exhaust assembly can exhaust gas in the microstructure area and assist in filling of the die pressing material; and a heat conduction channel system which is independently controlled in a regional mode is arranged in the lower die and used for preferentially heating a microstructure region and achieving preliminary filling of a die pressing material. By integrating the auxiliary pressurization assembly, the heat conduction channel system and the exhaust assembly, preferential heating and preliminary filling of a microstructure area of a molded product, negative pressure auxiliary exhaust and flowing in the main mold pressing process and local secondary pressurization in the final stage of mold pressing are achieved; and the compactness, the dimensional precision, the electrical insulation strength and the mechanical property of the product are obviously improved.

Description

Technical Field

[0001] This invention relates to the field of molding technology, and in particular to a processing apparatus and manufacturing method for high thermal conductivity Class C electrical molded products. Background Technology

[0002] High thermal conductivity Class C electrical molded products (such as high-voltage insulation components and electrical switch housings) are typically manufactured using thermosetting composite materials such as BMC (bulk molding compound) or SMC (sheet molding compound). These materials require cross-linking and curing under high temperature and pressure to form products with excellent electrical insulation properties, mechanical strength, and heat resistance (Class C heat resistance refers to a temperature index >180℃). The trend towards high power density and miniaturization in electronic and electrical equipment places higher demands on the microstructural precision, thermal conductivity, and thermal stability of insulating components.

[0003] Currently, traditional molding technology faces three major bottlenecks in the production of such products. First, the addition of a large amount of filler (such as ceramic particles and boron nitride) to high thermal conductivity materials reduces fluidity. By the time pressure is transmitted to the ends of microstructures such as deep grooves and ribs, it has already been severely attenuated, easily causing incomplete filling or loose defects. Second, microstructure areas are often places where air tends to stagnate. If venting is not smooth, residual gas will be compressed and dissolved in the resin under high pressure, or form pores and bubbles inside the product, seriously reducing the electrical insulation strength and mechanical properties of the product. In addition, traditional molding processes use overall heating and single pressure control, which is difficult to adapt to the differentiated needs of structures with uneven thickness. Thick-walled areas require low-temperature slow curing to prevent shrinkage marks, while microstructure areas require high temperature to promote flow. However, existing technologies cannot independently control these conditions, resulting in asynchronous curing and causing warping or cracking.

[0004] While existing technologies have attempted to improve filling by optimizing mold structure or adjusting overall process parameters, they often fail to fundamentally address key issues such as localized pressure attenuation in microstructure regions, dead zones in venting, and thermal balance control. For example, some solutions increase overall molding pressure or extend holding time, but this not only increases energy consumption and equipment load but may also damage the mold or lead to increased flash on the finished product, with limited effectiveness in improving microstructure filling. Furthermore, they have not overcome the technical bottlenecks of lacking coordinated localized pressure compensation, directional venting, and precise temperature control.

[0005] Given the aforementioned challenges, the core challenge in overcoming the manufacturing barriers of high-end electrical insulation products lies in how to achieve high-quality molding of microstructure regions through multi-field coupling control of heat, force, and gas, and how to ensure the molding quality and reliability of high thermal conductivity Class C electrical molded products, especially those with complex microstructures, through a processing device and method that can precisely control the microstructure regions locally.

[0006] Therefore, it is necessary to invent a processing device and manufacturing method for high thermal conductivity Class C electrical molded products to solve the above problems. Summary of the Invention

[0007] The purpose of this invention is to provide a processing apparatus and manufacturing method for high thermal conductivity Class C electrical molded products, aiming to solve the problem of incomplete filling in the fine structures (such as thin walls, deep cavities, and narrow gaps) of molded products.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: a processing apparatus and manufacturing method for high thermal conductivity Class C electrical molded products, comprising an upper mold and a lower mold, wherein the upper mold is provided with an independently controllable auxiliary pressurizing component at a position corresponding to the microstructure region of the molded product, for applying independent local secondary pressurization to the microstructure region after mold closing; The lower mold is provided with an exhaust component that communicates with the microstructure area at the corresponding position of the microstructure area. The exhaust component can discharge the gas in the microstructure area and assist the filling of the molding material. The lower mold is equipped with a heat conduction channel system with independent temperature control in different areas, which is used to preferentially heat the microstructure area and achieve the initial filling of the molding material.

[0009] Preferably, when the upper mold moves to the lower mold, the heat conduction channel system heats the microstructure area to a preset temperature, the exhaust component is activated and forms a negative pressure in the microstructure area; after the pressure applied by the upper mold stabilizes, the auxiliary pressurization component applies local pressure to the microstructure area.

[0010] Preferably, the auxiliary pressurization component includes a telescopic component and a control system; the telescopic component is embedded in the microstructure region corresponding to the upper mold, and the control system includes a regulating valve for controlling the pressure output of the telescopic component.

[0011] Preferably, the top of the upper mold is provided with a main hydraulic system that drives its movement, and the control system is communicatively connected to the main hydraulic system; after the pressure of the main mold reaches a threshold and remains stable, the control system controls the telescopic component to output local pressure.

[0012] Preferably, the venting assembly includes a micro venting groove, a vacuum channel, and a vacuum pump; the micro venting groove is formed on the lower mold forming surface and surrounds or is adjacent to the microstructure area, and the micro venting groove is connected to the vacuum pump through the vacuum channel.

[0013] Preferably, the heat conduction channel system includes partitioned independent heat flow pipes and a temperature control unit; the partitioned independent heat flow pipes are embedded in the upper and lower molds, and the temperature control unit can control the heating of the microstructure area to take priority over the heating of the other areas.

[0014] Preferably, the temperature control unit includes multiple temperature sensors that are configured with different partitions corresponding to the molded product, particularly partitions corresponding to microstructure regions, and a heat source controller connected to the independent heat flow pipes of each partition. The temperature control unit independently adjusts the heat output power of the independent heat flow pipes of each partition according to the feedback signals of the temperature sensors, so as to achieve priority heating and precise temperature control of the microstructure region.

[0015] Preferably, it also includes a coordination system, which includes a pressure sensor for monitoring the molding pressure distribution, an ultrasonic sensor for monitoring the flow state of the molding material and the filling of the microstructure region, and a controller; the controller receives signals from the pressure sensor, ultrasonic sensor, temperature control unit and control system, and coordinates and controls the heating sequence and temperature of the heat conduction channel system, the start and stop and negative pressure intensity of the exhaust component, and the pressurization timing and pressure of the auxiliary pressurization component based on preset logic.

[0016] A method for manufacturing a high thermal conductivity Class C electrical molded article, the method being used to manufacture the high thermal conductivity Class C electrical molded article using the processing apparatus, comprising the following steps: Step S1: Place the high thermal conductivity C-grade electrical molding material into the cavity of the lower mold; Step S2: Drive the upper mold to move to the lower mold, start the heat conduction channel system, and control the temperature control unit to preferentially heat the molding material near the tiny details of the molded product, so that the temperature of the molding material near this area increases and the fluidity is enhanced, and the initial filling of the microstructure area is completed before or in the early stage of mold closing. Step S3: Drive the upper mold and lower mold to close, apply the main molding pressure, so that the molding material flows and compacts in the main cavity area, and form a negative pressure in the microstructure area through the venting component to help vent the gas in the area and promote the flow and filling of the molding material into the area; Step S4: At the end of the main molding process in step S3, after the main molding pressure reaches a preset threshold and stabilizes, the auxiliary pressurization component is activated to apply independent local secondary pressure to the microstructure area of ​​the molded product, ensuring that the material in this area is completely filled and densified. Step S5: Maintain the molding pressure until the molded product is fully cured and shaped. Then, release the local pressure of the auxiliary pressure component and the overall pressure of the main molding in sequence, drive the upper mold upward, and complete the demolding.

[0017] Preferably, in steps S2 and S3, the collaborative system monitors the mold cavity pressure distribution, the flow state of the molding material, and the filling signal of the microstructure region in real time; and dynamically adjusts the zone temperature setting of the heat conduction channel system, the vacuum degree of the exhaust component, and the pressurization timing and pressure value of the auxiliary pressurization component based on the monitoring results.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention achieves precise localized pressurization of the microstructure areas of molded products through the independently controllable auxiliary pressurization component. A regionally independently temperature-controlled heat conduction channel system preferentially heats the microstructure areas of the molded product before the auxiliary pressurization component applies localized pressurization, increasing the fluidity of the molding material and creating conditions for initial filling. Simultaneously, the venting component actively creates negative pressure in the microstructure areas. This negative pressure efficiently expels gas to eliminate porosity and generates traction force to assist the molding material in flowing into deep cavities and narrow slits in the microstructure areas, eliminating looseness and porosity caused by poor material fluidity and inadequate venting during precise localized pressurization by the auxiliary pressurization component. Through the synergistic effect of the thermal, mechanical, and gas systems, the invention significantly improves the density, dimensional accuracy, electrical insulation strength, and mechanical properties of the product, while also enhancing production efficiency and product quality consistency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the processing device of the present invention.

[0020] Figure 2 This is a cross-sectional view of the upper and lower molds after they are joined together in this invention.

[0021] Figure 3 This is the present invention. Figure 2 Enlarged view of a portion of point A in the middle.

[0022] Figure 4 This is a schematic diagram of the partitioning of the heat conduction channel system in this invention.

[0023] Figure 5 This is a flowchart of the manufacturing method of the present invention.

[0024] Figure label: 1. Upper mold; 2. Lower mold; 3. Auxiliary pressurization component; 31. Telescopic component; 32. Pressure head; 4. Exhaust component; 41. Miniature exhaust channel; 42. Vacuum channel; 5. Heat conduction channel system; 51. Independent heat flow pipes in different zones; 6. Main hydraulic system; 10. Thick-walled area; 20. Thin-walled area; 30. Microstructure area. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example 1

[0026] To improve the filling integrity of the microstructure region 30 in the molded product and to solve the problem of porosity defects in the microstructure region 30, such as Figures 1 to 4 As shown, the present invention proposes a processing device for high thermal conductivity Class C electrical molded products, including an upper mold 1 and a lower mold 2. The upper mold 1 is provided with an independently controllable auxiliary pressurizing component 3 corresponding to the position of the microstructure region 30 of the molded product, which is used to apply independent local secondary pressurization to the microstructure region 30 after mold closing. The lower mold 2 is provided with a heat conduction channel system 5 with independent temperature control in different regions, which is used to preferentially heat the microstructure region 30 and realize the initial filling of the molding material.

[0027] The upper mold 1 is equipped with a main hydraulic system 6 at the top to drive its movement. The main hydraulic system 6 drives the upper mold 1 to realize the opening and closing action. The upper mold 1 and the lower mold 2 together form the cavity of the product. The upper mold 1 and the lower mold 2 are made of H13 hot work die steel. The cavity corresponds to the main outline of the molded product. The cavity contains a microstructure area 30 to be formed. The microstructure area 30 includes fine heat dissipation teeth or insulating grooves.

[0028] When the upper mold 1 moves to the lower mold 2, the heat conduction channel system 5 heats the microstructure region 30 to the preset temperature, the exhaust component 4 is activated and forms a negative pressure in the microstructure region 30; after the pressure applied by the upper mold 1 stabilizes, the auxiliary pressurization component 3 applies local pressure to the microstructure region 30.

[0029] The auxiliary pressurization component 3 includes a telescopic component 31 and a control system; the telescopic component 31 is embedded in the upper mold 1 at the position corresponding to the microstructure region 30, and the control system includes a regulating valve that controls the pressure output of the telescopic component 31; the upper mold 1 is provided with a mounting hole, and the telescopic component 31 is located in the mounting hole; the lower mold 2 also integrates an ejection mechanism for demolding the product after molding.

[0030] The telescopic component 31 can be a miniature hydraulic cylinder, and the regulating valve can be an electromagnetic directional valve. The regulating valve is connected to the main hydraulic station and the telescopic component 31 through a high-temperature resistant high-pressure hose, and the oil circuit is controlled by the electromagnetic directional valve. The telescopic component 31 is embedded inside the upper mold 1, and the piston rod of the telescopic component 31 is connected to the pressure head 32 at the end near the lower mold 2. The pressure head 32 corresponds to the microstructure area 30 of the cavity of the molded product.

[0031] The telescopic component 31 is embedded inside the upper mold 1, and the pressure head 32 at its end faces the microstructure area 30. The control system is connected to the main hydraulic system 6. After the pressure of the main hydraulic system 6 reaches the threshold and remains stable, the control system controls the telescopic component 31 to move. It provides precise local pressure compensation to directly address the problem of pressure attenuation when transmitted to the end of the microstructure.

[0032] The heat conduction channel system 5 includes a partitioned independent heat flow pipe 51 and a temperature control unit; the partitioned independent heat flow pipe 51 is embedded in the upper mold 1 and the lower mold 2, and the temperature control unit can control the heating of the microstructure region 30 to take priority over the other regions.

[0033] The temperature control unit includes multiple temperature sensors that are configured with different partitions for the molded product, especially for the partitions corresponding to the microstructure region 30, and a heat source controller connected to the partition's independent heat flow pipe 51. The temperature control unit independently adjusts the heat output power of each partition's independent heat flow pipe 51 based on the feedback signal from the temperature sensors, so as to achieve priority heating and precise temperature control of the microstructure region 30.

[0034] The heat conduction channel system 5 is partitioned according to the shape design of the molded product, ensuring that the mold is divided into multiple independently temperature-controlled areas, such as thick-walled area 10, thin-walled area 20, and microstructure area 30. Plastic is a poor conductor of heat, and the internal temperature of thick-walled parts rises slowly. If the external temperature is too high, it will solidify first to form a hard shell, resulting in incomplete internal solidification or internal stress. Therefore, thick-walled area 10 requires a lower temperature and a longer time. Thin-walled area 20 requires the material to maintain fluidity until it fills the end, so thin-walled area 20 requires a higher temperature. The material in microstructure area 30 needs to overcome the huge resistance of material flow in narrow or long channels to ensure complete filling and avoid material shortage. Therefore, microstructure area 30 needs to ensure fluidity and higher pressure.

[0035] Preliminary filling is achieved by preferentially heating the tiny detail areas through the partitioned independent heat flow pipes 51, and then the pressure section is used to finally compact the preliminarily filled tiny details.

[0036] The timing, pressure, and duration of pressurization of the auxiliary pressurization component 3 can be independently set and adjusted through the control system, enabling the production process to better adapt to the characteristics of products with different structures or different batches of materials, optimize the molding cycle, and help improve overall production efficiency and product consistency.

[0037] The heat conduction channel system 5 is equipped with different independent heat flow pipes 51 for different areas, and the temperature control unit implements personalized temperature control for each area. For example, at the beginning of the process, the temperature of the microstructure area 30 can be instructed to be slightly higher than that of other areas or preheated, so that the molding material in that area softens first and the viscosity is reduced, so as to achieve initial flow and filling, laying a good foundation for subsequent main molding.

[0038] In this embodiment, the auxiliary pressurizing component 3 precisely controls the local pressure, and performs secondary pressurization on areas with complex structures, large depths, or fine details in the mold cavity. This effectively compensates for the attenuation of the main pressure when it is transmitted to these areas, ensuring that the molding material can completely fill every corner, significantly reducing the risk of material shortage, and greatly improving the integrity and reliability of the product structure. Through zoned temperature control, selective and rapid heating of the microstructure area 30 can be achieved, shortening the overall preheating and curing time. Local pressurization reduces the dependence on excessively high main pressure and shortens the holding time. Through the coordinated optimization and control of pressure and temperature, the density, dimensional accuracy, performance consistency, and production yield of the product are significantly improved. Example 2

[0039] In actual use, when the processing device of the above embodiment 1 is subjected to heating and pressurization, the residual gas in the microstructure region 30 is compressed and dissolved in the molding material under the action of high temperature and high pressure, or forms pores and bubbles inside the molded product, which seriously reduces the electrical insulation strength and mechanical properties of the product.

[0040] To solve the above-mentioned technical problems, in another embodiment of the present invention, the lower mold 2 is provided with an exhaust component 4 corresponding to the microstructure region 30 and communicating with the microstructure region 30. The exhaust component 4 can exhaust the gas in the microstructure region 30 and assist in filling the molding material.

[0041] The exhaust assembly 4 includes a micro exhaust channel 41, a vacuum channel 42 and a vacuum pump; the micro exhaust channel 41 is formed on the molding surface of the lower mold 2 and surrounds or is adjacent to the microstructure region 30, and the micro exhaust channel 41 is connected to the vacuum pump through the vacuum channel 42.

[0042] The micro exhaust channel 41 can be set as a trapezoid with a wide inlet and a narrow outlet. The inner wall of the micro exhaust channel 41 is electropolished to reduce the adhesion of materials. At the same time, a filter is installed in the vacuum channel 42 to prevent material powder from entering the vacuum pump. The micro exhaust channel 41 combined with vacuum assistance solves the problem of "poor exhaust in small parts" of solid molding materials and improves exhaust efficiency.

[0043] In the initial stage of mold closing or material filling, starting the vacuum pump can create a negative pressure in the microstructure area 30. This negative pressure can actively and efficiently extract the gas in the cavity, greatly reducing the risk of porosity. On the other hand, the pressure difference generated is like a "traction force", which helps to pull the viscous molding material to flow into the depth of the fine cavity, thereby assisting filling. Compared with the traditional method of relying on the parting surface for natural venting, this directional active venting is more efficient and reliable, and is especially suitable for molds with complex structures and long venting paths.

[0044] The aforementioned auxiliary pressurization component 3, exhaust component 4, heat conduction channel system 5, and main hydraulic system 6 can all be centrally controlled and time-coordinated by a collaborative system (not shown separately in the figure, but can be integrated into the control system or a higher-level PLC). This collaborative system can ensure that each component operates with optimal parameters at the correct time based on preset programs or real-time sensor feedback, thereby achieving intelligent and optimized operation of the entire molding process.

[0045] The processing device also includes a coordination system, which includes a pressure sensor for monitoring the distribution of molding pressure, an ultrasonic sensor for monitoring the flow state of the molding material and the filling status of the microstructure region 30, and a controller. The pressure sensor is located inside the mold cavity or on the mold, the ultrasonic sensor is located around the mold, and the controller receives signals from the pressure sensor, the ultrasonic sensor, the temperature control unit, and the control system. Based on preset logic, the controller coordinates and controls the heating sequence and temperature of the heat conduction channel system 5, the start and stop of the exhaust component 4 and the negative pressure intensity, and the pressurization timing and pressure of the auxiliary pressurization component 3. If the ultrasonic sensor detects insufficient filling rate, the controller automatically extends the negative pressure exhaust time and increases the local secondary pressurization pressure.

[0046] By setting the venting component 4, a negative pressure is actively generated in the microstructure area 30, forming a strong suction force to promptly expel the air and volatiles trapped in the mold cavity. This fundamentally solves the problem of air holes and bubbles forming inside the product due to poor venting, which is especially crucial for electrical molded products with extremely high requirements for surface quality and high insulation performance. Furthermore, the generated negative pressure difference has a certain traction effect on the molding material, which can help the material flow more smoothly into and fill the difficult-to-fill microstructure areas 30 such as deep cavities and narrow gaps, further ensuring the integrity of the filling.

[0047] In this embodiment, a precise closed-loop process for molding the microstructure region 30 is constructed through the coordinated operation of the exhaust component 4, the heat conduction channel system 5, and the auxiliary pressurization component 3. The heat conduction channel system 5 first preferentially heats the microstructure region 30 to increase material fluidity and create conditions for its initial filling. At the same time, the exhaust component 4 actively forms a negative pressure in the microstructure region 30. This negative pressure efficiently discharges gas to eliminate porosity and generates traction force to assist the material in flowing into the deep cavity and narrow slit of the microstructure region 30. Furthermore, the auxiliary pressurization component 3 applies precise local secondary pressure to the microstructure region 30 that has been initially filled and fully vented, effectively compensating for pressure attenuation and achieving final compaction. This solves problems such as incomplete filling, porosity, and looseness, resulting in significant improvements in the product's density, dimensional accuracy, electrical insulation performance, and batch consistency. Example 3

[0048] A method for manufacturing high thermal conductivity Class C electrical molded products, applied to the apparatus in Example 2, addresses the problem of insufficient filling rate in the minute detail areas of the molded product during molding. Through the cooperation of the auxiliary pressurization component 3, the venting component 4, and the heat conduction channel system 5, the minute detail areas are preferentially heated, negative pressure assisted flow is formed, and secondary pressurization is applied, thus solving the above problem and manufacturing high thermal conductivity Class C electrical molded products with excellent performance. Specifically, as shown... Figure 5 As shown, it includes the following steps: Step S1: Place the high thermal conductivity C-grade electrical molding material into the cavity of the lower mold 2.

[0049] Step S2: Drive the upper mold 1 to move to the lower mold 2, start the heat conduction channel system 5, and control the temperature control unit to preferentially heat the molding material near the tiny details of the molded product or make the temperature of this area higher than other areas, so that the temperature of the molding material near this area increases and the fluidity is enhanced, and the initial filling of the microstructure area 30 is completed before or in the early stage of mold closing.

[0050] Step S3: Drive the upper mold 1 and lower mold 2 to close, apply the main molding pressure, so that the molding material flows and compacts in the main cavity area, and form a negative pressure in the microstructure area 30 through the venting component 4 to help vent the gas in the area and promote the flow and filling of the molding material into the area.

[0051] Step S4: At the end of the main molding process in step S3, after the main molding pressure reaches the preset threshold and stabilizes, the auxiliary pressurization component 3 is activated to apply independent local secondary pressure to the microstructure area 30 of the molded product, ensuring that the material in this area is completely filled and densified.

[0052] Step S5: Maintain the molding pressure until the molded product is fully cured and shaped. Sequentially release the local pressure of the auxiliary pressure component 3 and the overall pressure of the main molding, and drive the upper mold 1 upward to complete the demolding.

[0053] The process of the venting component 4 forming negative pressure in the microstructure region 30 in step S3 can be brought forward to step S2. That is, the venting component 4 can start the venting function when the heat conduction channel system 5 heats the molding material near the tiny details of the molded product, thus assisting the flow of the molding material.

[0054] In steps S2 and S3, the pressure distribution in the mold cavity, the flow state of the molding material, and the filling signal of the microstructure region 30 are monitored in real time by the collaborative system. Based on the monitoring results, the zone temperature setting of the heat conduction channel system 5, the vacuum degree of the exhaust component 4, and the pressurization timing and pressure value of the auxiliary pressurization component 3 are dynamically adjusted.

[0055] In this embodiment, by implementing a sequential control process of "priority heating for initial filling → main molding and negative pressure venting → local secondary pressurization and compaction," and in collaboration with a dedicated processing device, the core challenge of molding high thermal conductivity materials in the microstructure region 30 is systematically solved. This significantly improves the integrity and density of the microstructure filling, essentially eliminates internal defects such as pores and shrinkage cavities, shortens the production cycle, reduces energy consumption, and greatly improves the product qualification rate. It also achieves precise closed-loop control and adaptive optimization of key process parameters, making the production process more intelligent and stable. Through the synergistic effect of the heat conduction channel system 5, the auxiliary pressurization component 3, and the venting component 4, the density, dimensional accuracy, electrical insulation strength, and mechanical properties of the product are significantly improved, while production efficiency and product quality consistency are also enhanced.

[0056] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A processing device for high-thermal-conductivity C-class electrical molded products, comprising an upper mold and a lower mold, characterized in that: the upper mold is provided with an independently controllable auxiliary pressure assembly corresponding to the position of the microstructure region of the molded product, for applying independent local secondary pressure to the microstructure region after the mold is closed; the lower mold is provided with an exhaust assembly corresponding to the position of the microstructure region and communicating with the microstructure region, which can exhaust the gas in the microstructure region and assist the filling of the molded material; the lower mold is provided with a regionally independently temperature-controlled thermal conduction channel system for preferentially heating the microstructure region and achieving preliminary filling of the molded material. When the upper mold moves towards the lower mold, the thermal conduction channel system heats the microstructure region to a preset temperature, and the exhaust assembly is started and forms a negative pressure in the microstructure region; after the pressure applied by the upper mold stabilizes, the auxiliary pressure assembly applies local pressure to the microstructure region. The auxiliary pressure assembly comprises a telescopic member and a control system; the telescopic member is embedded in the upper mold corresponding to the position of the microstructure region, and the control system comprises an adjusting valve for controlling the pressure output of the telescopic member. The top of the upper mold is provided with a main hydraulic system for driving its movement, and the control system is in communication connection with the main hydraulic system; after the pressure of the main mold reaches a threshold value and remains stable, the control system controls the telescopic member to output local pressure.

2. The processing apparatus of claim 1, wherein: The exhaust assembly comprises a micro-exhaust groove, a vacuum channel and a vacuum pump; the micro-exhaust groove is opened on the forming surface of the lower mold and surrounds or is adjacent to the microstructure region, and the micro-exhaust groove communicates with the vacuum pump through the vacuum channel.

3. The apparatus of claim 1, wherein: The thermal conduction channel system comprises a regionally independently heat flow pipe and a temperature control unit; the regionally independently heat flow pipe is embedded in the upper mold and the lower mold, and the temperature control unit can control the heating of the microstructure region to be preferential to other regions.

4. The apparatus of claim 3, wherein: The temperature control unit comprises a plurality of temperature sensors corresponding to different regions of the molded product, especially the region corresponding to the microstructure region, and a heat source controller connected with the regionally independently heat flow pipe; the temperature control unit independently adjusts the heat output power of each regionally independently heat flow pipe according to the feedback signal of the temperature sensor, so as to realize the preferential heating and accurate temperature control of the microstructure region.

5. The apparatus of claim 1 wherein: It also comprises a coordination system, which comprises a pressure sensor for monitoring the pressure distribution of the mold, an ultrasonic sensor for monitoring the flow state of the molded material and the filling condition of the microstructure region, and a controller; the controller receives signals from the pressure sensor, the ultrasonic sensor, the temperature control unit and the control system, and coordinates the heating timing and temperature of the thermal conduction channel system, the start-stop and negative pressure intensity of the exhaust assembly, and the pressurizing time and pressure of the auxiliary pressure assembly based on a preset logic.

6. The apparatus of claim 1 wherein: The steps include:

7. The apparatus of claim 6, wherein: Step S1, placing high-thermal-conductivity C-class electrical molded material into the cavity of the lower mold; 8. The apparatus of claim 1 wherein: Step S2, driving the upper mold to move towards the lower mold, starting the thermal conduction channel system, and controlling the preferential heating of the molded material near the microstructure region by the temperature control unit, so as to increase the temperature and flowability of the molded material near the region, and complete the preliminary filling of the microstructure region before or at the early stage of the mold closing.

9. A manufacturing method of a high heat conductive class C electrical molded article, the manufacturing method for manufacturing a high heat conductive class C electrical molded article using the processing apparatus according to claim 8, characterized by: ​ ​ ​ Step S3, drive the upper die and the lower die to close, apply the main molding pressure to make the molding material flow and compact in the main body area of the cavity, and form negative pressure in the microstructure area through the exhaust assembly to assist in discharging the gas in the area and promote the flow of the molding material to the area; Step S4, at the end of the main molding process in step S3, after the main molding pressure reaches the preset threshold value and stabilizes, start the auxiliary pressure assembly to apply independent local secondary pressure to the microstructure area of the molded product, to ensure that the material in the area is completely filled and densified; Step S5, keep the molding pressure until the molded product is sufficiently solidified and shaped, sequentially remove the local pressure of the auxiliary pressure assembly and the overall pressure of the main molding, drive the upper die to go up, and complete the demolding.

10. The manufacturing method according to claim 9, characterized in that: In steps S2 and S3, the pressure distribution in the cavity, the flow state of the molding material, and the filling signal of the microstructure area are monitored in real time through the cooperative system; the partition temperature setting of the heat conduction channel system, the vacuum degree of the exhaust assembly, and the pressurization timing and pressure value of the auxiliary pressure assembly are dynamically adjusted according to the monitoring results.

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