High-toughness heat-insulating epoxy resin, composite material and preparation method thereof

Abstract

The invention provides high-toughness heat-insulating epoxy resin, a composite material and a preparation method thereof, and the high-toughness heat-insulating epoxy resin is prepared from the following raw materials: a component A and a component B, the mass ratio of the component A to the component B is (95-150): (80-120); the component A comprises 62-150 parts of epoxy resin and 8-15 parts of a toughening agent; the component B comprises the following components in parts by weight: 25-45 parts of a curing agent, 0.3-0.8 part of an antioxidant, 12-28 parts of an auxiliary agent and 32-50 parts of light filler; the auxiliary agent is at least one of nano titanium dioxide and silicon-titanium stacked composite microspheres. According to the epoxy resin and the composite material, the auxiliaries are added, the auxiliaries can be superposed with the low-heat-conductivity effect of the light filler, efficient heat insulation is achieved, energy is absorbed through interlayer slippage, interface bonding is strengthened through hydrogen-bond interaction with the epoxy resin matrix and the glass beads, and the mechanical property of the material is improved; the flexibilizer and the antioxidant are also added, so that the mechanical property and the anti-aging property of the composite material are improved.

Description

Technical Field

[0001] This invention belongs to the field of epoxy resin material technology, specifically relating to a high-toughness heat-insulating epoxy resin, composite material and its preparation method. Background Technology

[0002] With the increasing demands for material performance in aerospace, shipbuilding, and construction industries, high-insulation resins and prepregs, as composite materials with excellent thermal insulation and mechanical properties, are receiving widespread attention and research. These materials not only effectively block heat transfer but also maintain structural stability in extreme environments, providing crucial material support for various high-end applications.

[0003] To improve the thermal insulation performance of resin materials, lightweight fillers such as hollow glass microspheres have been introduced into epoxy resin systems in recent years to form a special crystal structure and enhance thermal insulation performance. For example, Chinese patent document CN115109551A discloses a thermally insulating epoxy resin material with adhesive and sealing properties and its preparation method, comprising component A and component B. Component A includes: 10-50 parts epoxy resin; 0-10 parts diluent; 5-50 parts thermal insulation premix; and 5-20 parts glass fiber. Component B includes: 10-50 parts amine curing agent; 5-50 parts thermal insulation premix; and 5-20 parts glass fiber. The thermal insulation premix includes hollow glass microspheres and aerogel powder. This thermally insulating epoxy resin material exhibits ultra-low thermal conductivity, excellent sealing performance, excellent adhesive performance, good high and low temperature resistance, and anti-aging properties. However, the introduction of lightweight fillers such as hollow glass microspheres can lead to varying degrees of decline in the mechanical properties of epoxy resin due to problems such as microsphere agglomeration, poor interfacial adhesion, and the introduction of air bubbles, thus limiting the use of resin materials. Summary of the Invention

[0004] The technical problem solved by this invention is to provide a high-toughness thermal insulation epoxy resin, a composite material, and a method for preparing the same. Nano-titanium dioxide and silicon-titanium stacked composite microspheres are added as additives, which, combined with the low thermal conductivity of lightweight fillers, achieve highly efficient thermal insulation. Energy is absorbed through interlayer slip, and the interfacial bonding is strengthened through hydrogen bonding with the epoxy resin matrix and glass microspheres, thus improving the mechanical properties of the material. Toughening agents and antioxidants are also added to further improve the mechanical properties and anti-aging properties of the composite material.

[0005] To address the above problems, a first aspect of the present invention provides a high-toughness heat-insulating epoxy resin, the raw materials for which are prepared include: Component A and Component B; the mass ratio of Component A to Component B is 95~150: 80~120; Component A comprises the following components in parts by weight: 62-150 parts epoxy resin and 8-15 parts toughening agent; Component B comprises the following components in parts by weight: 25-45 parts curing agent, 0.3-0.8 parts antioxidant, 12-28 parts additives, and 32-50 parts lightweight filler; the additives are one or a combination of two of nano-titanium dioxide and silicon-titanium stacked composite microspheres.

[0006] Preferably, the mass ratio of component A to component B is 102~141: 84~116; Component A comprises the following components in parts by weight: 110-140 parts epoxy resin and 10-13 parts toughening agent; Component B comprises the following components in parts by weight: 30-42 parts curing agent, 0.5-0.7 parts antioxidant, 15-25 parts additives, and 35-45 parts lightweight filler.

[0007] Preferably, the curing agent is one or a combination of several of the following: bisphenol A type epoxy resin modified 2-methylimidazole, bisphenol A type epoxy resin modified 2-ethyl-4-methylimidazole, m-phenylenediamine, and diaminodiphenylmethane; The toughening agent is one or a combination of several of carboxylated nitrile rubber, polyethersulfone, polyetherimide, and polysulfone; The antioxidant is one or a combination of antioxidant V85-P and antioxidant 1010; The lightweight filler is hollow glass microspheres.

[0008] Preferably, the hollow glass microspheres have a particle size of 30~110μm, D50≤65μm, and compressive strength of 1.72~2.10MPa.

[0009] Preferably, the epoxy resin is one or a combination of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0010] A second aspect of the present invention provides a method for preparing the above-mentioned high-toughness heat-insulating epoxy resin, comprising the following steps: S1. Mix high-toughness heat-insulating epoxy resin with toughening agent to obtain component A; S2. Mix the curing agent, antioxidant, additives, and lightweight filler to obtain component B; S3. Mix component A and component B according to the mass ratio to obtain the high-toughness heat-insulating epoxy resin.

[0011] Preferably, step S1 specifically includes the following steps: placing epoxy resin into a high-speed disperser, heating it to 130~140℃, adding toughening agent and stirring for 120~240min, with the high-speed disperser speed being 600~800r / min, to obtain component A; Step S2 specifically includes the following steps: mixing the curing agent, antioxidant, additives, and lightweight filler, and processing them in a three-roll mill for 15-30 minutes at a speed of 150-300 r / min to obtain component B; Step S3 specifically includes the following steps: mixing component A and component B in a certain proportion, mixing with a high-speed disperser for 10-15 minutes, the speed of the high-speed disperser being 600-800 r / min, to obtain the high-toughness heat-insulating epoxy resin.

[0012] A third aspect of the present invention provides a high-toughness thermal insulation epoxy resin-based composite material, comprising: The above-mentioned high-toughness heat-insulating epoxy resin and reinforcing fiber; wherein the volume content of the reinforcing fiber in the composite material is 42%~60%.

[0013] A fourth aspect of the present invention provides a method for preparing the above-mentioned high-toughness heat-insulating epoxy resin-based composite material, comprising the following steps: A1. Prepare epoxy resin into a resin film; A2. Prepreg is prepared by hot-pressing resin film and reinforcing fiber together; A3. The prepreg is molded to obtain a high-toughness heat-insulating epoxy resin-based composite material.

[0014] Preferably, in step A3, the molding temperature is 120~140℃, the time is 120~180min, and the pressure is 0.6~1.2MPa.

[0015] Compared with the prior art, the present invention has the following advantages: The high-toughness thermal insulation epoxy resin of this invention, with the addition of lightweight fillers, can reduce the thermal conductivity of the epoxy resin material and improve its thermal insulation performance. The addition of nano-titanium dioxide or silicon-titanium stacked composite microspheres as additives can reduce the surface temperature of the material by reflecting infrared radiation. This effect, combined with the low thermal conductivity of the lightweight fillers, achieves highly efficient thermal insulation. More importantly, the silicon-titanium stacked composite microspheres have a layered structure, which can disperse stress. Under stress, they can absorb energy through interlayer slip, improving the mechanical properties of the material. Simultaneously, the active groups on their surface (such as -OH, -Ti-O-Si-) can form hydrogen bonds or chemical bonds with the epoxy resin matrix and lightweight fillers such as glass microspheres, further strengthening the interfacial bonding and improving the material's mechanical properties. This invention also further incorporates toughening agents to reinforce and toughen the epoxy resin material, improving its mechanical properties. The addition of antioxidants can prevent oxidative degradation of the epoxy resin during high temperatures or long-term use, thereby maintaining the material's mechanical properties and stability. Detailed Implementation

[0016] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0017] A first aspect of this invention provides a high-toughness heat-insulating epoxy resin, the raw materials for which are prepared include: Component A and Component B; the mass ratio of Component A to Component B is 95~150: 80~120; Component A comprises the following components in parts by weight: 62-150 parts epoxy resin and 8-15 parts toughening agent; Component B comprises the following components in parts by weight: 25-45 parts curing agent, 0.3-0.8 parts antioxidant, 12-28 parts additives, and 32-50 parts lightweight filler; the additives are one or a combination of two of nano-titanium dioxide and silicon-titanium stacked composite microspheres.

[0018] Preferably, the mass ratio of component A to component B is 102~141: 84~116; Component A comprises the following components in parts by weight: 110-140 parts epoxy resin and 10-13 parts toughening agent; Component B comprises the following components in parts by weight: 30-42 parts curing agent, 0.5-0.7 parts antioxidant, 15-25 parts additives, and 35-45 parts lightweight filler.

[0019] Within the above-mentioned range of mass fractions and mass ratios, the overall performance of the obtained epoxy resin material can be improved.

[0020] Preferably, the curing agent is one or a combination of several of the following: bisphenol A type epoxy resin modified 2-methylimidazole, bisphenol A type epoxy resin modified 2-ethyl-4-methylimidazole, m-phenylenediamine, and diaminodiphenylmethane. By adjusting the substituents of the imidazole ring, the curing reaction rate can be controlled. A slower curing rate allows sufficient time for fillers and toughening agents to migrate and align, forming a uniform microstructure and reducing defects. Amine curing agents react with epoxy resin to form a three-dimensional network structure; the crosslinking density can be controlled by adjusting the dosage, ensuring mechanical properties while avoiding excessive embrittlement. More preferably, the curing agent is bisphenol A type epoxy resin modified 2-methylimidazole or bisphenol A type epoxy resin modified 2-ethyl-4-methylimidazole. Epoxy resin modification can regulate the reactivity of the resin and the curing agent, while simultaneously improving the compatibility between the curing agent and the resin.

[0021] The preparation method of bisphenol A type epoxy resin modified 2-methylimidazole is as follows: bisphenol A type epoxy resin and 2-methylimidazole are mixed, heated to 50℃~80℃, reacted for 60~120 min, and stirred at a speed of 60~200 rpm. The mass ratio of bisphenol A type epoxy resin to 2-methylimidazole is 100:24~32.

[0022] The preparation method of bisphenol A type epoxy resin modified 2-ethyl-4-methylimidazole is as follows: bisphenol A type epoxy resin and 2-ethyl-4-methylimidazole are mixed, heated to 50℃~80℃, reacted for 60~120 min, and stirred at a speed of 60~200 rpm. The mass ratio of bisphenol A type epoxy resin to 2-ethyl-4-methylimidazole is 100:12~28.

[0023] Preferably, the toughening agent is one or a combination of several of carboxylated nitrile rubber, polyethersulfone, and polyetherimide. The carboxyl groups in the carboxylated nitrile rubber can undergo a ring-opening reaction with the epoxy groups of the epoxy resin to form flexible segments. Under stress, these segments absorb energy through crazing and shear yielding, increasing the impact strength by 2-3 times while maintaining the matrix stiffness. Polyethersulfone and polyetherimide have poor compatibility with epoxy resin, forming an island structure after curing. When cracks propagate to the phase interface, they consume energy through interfacial debonding and cavitation, inhibiting crack tip propagation and achieving toughening without significantly reducing the modulus.

[0024] Preferably, the antioxidant is one or a combination of antioxidant V85-P and antioxidant 1010.

[0025] Preferably, the lightweight filler is hollow glass microspheres. More preferably, the hollow glass microspheres have a particle size of 30~110μm, D50≤65μm, and a compressive strength of 1.72~2.10 MPa. Smaller particle size and uniform distribution help reduce stress concentration, while higher compressive strength ensures that the microspheres are not easily broken under stress, thereby maintaining the overall mechanical properties of the composite material.

[0026] Preferably, the epoxy resin is one or a combination of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0027] A second aspect of this invention provides a method for preparing the above-mentioned high-toughness heat-insulating epoxy resin, comprising the following steps: S1. Mix high-toughness heat-insulating epoxy resin with toughening agent to obtain component A; S2. Mix the curing agent, antioxidant, additives, and lightweight filler to obtain component B; S3. Mix component A and component B according to the mass ratio to obtain the high-toughness heat-insulating epoxy resin.

[0028] Preferably, step S1 specifically includes the following steps: placing epoxy resin into a high-speed disperser, heating it to 130~140℃, adding toughening agent and stirring for 120~240min, with the high-speed disperser speed being 600~800r / min, to obtain component A.

[0029] Preferably, step S2 specifically includes the following steps: mixing the curing agent, antioxidant, additives, and lightweight filler, and processing them in a three-roll mill for 15-30 minutes, with the three-roll mill speed being 150-300 r / min, to obtain component B.

[0030] Preferably, step S3 specifically includes the following steps: mixing component A and component B in a certain proportion, mixing with a high-speed disperser for 10-15 minutes, the speed of the high-speed disperser being 600-800 r / min, to obtain the high-toughness heat-insulating epoxy resin.

[0031] A third aspect of the present invention provides a high-toughness, heat-insulating epoxy resin-based composite material, comprising: The above-mentioned high-toughness heat-insulating epoxy resin and reinforcing fiber; wherein the volume content of the reinforcing fiber in the composite material is 42%~60%.

[0032] Preferably, the reinforcing fiber is glass fiber.

[0033] A fourth aspect of this invention provides a method for preparing the above-mentioned high-toughness heat-insulating epoxy resin-based composite material, comprising the following steps: A1. Prepare epoxy resin into a resin film; A2. Prepreg is prepared by hot-pressing resin film and reinforcing fiber together; A3. The prepreg is molded to obtain a high-toughness heat-insulating epoxy resin-based composite material.

[0034] Preferably, in step A3, the molding temperature is 120~140℃, the time is 120~180min, and the pressure is 0.6~1.2MPa.

[0035] In the following embodiments, the silicon-titanium stacked composite microspheres were purchased from Shanghai Huzheng Nanotechnology Co., Ltd., model RFS-P100. The hollow glass microspheres had a particle size of 50~80μm, D50≤65μm, and a compressive strength of 1.8~2 MPa. Epoxy resin 830 was purchased from Nantong Xingchen Synthetic Materials Co., Ltd. Epoxy resin E-51 was purchased from Jiangsu Sanmu Group. Antioxidant V85-P was purchased from Guangzhou Zhiyi Chemical Co., Ltd.

[0036] In the following embodiments, the preparation method of bisphenol A epoxy resin modified 2-methylimidazole is as follows: bisphenol A epoxy resin and 2-methylimidazole are added to a glass reactor and heated to 80°C. The reaction time is 60 min, and the stirring speed is 200 rpm. The mass ratio of bisphenol A epoxy resin to 2-methylimidazole is 100:30. The preparation method of bisphenol A epoxy resin modified 2-ethyl-4-methylimidazole is as follows: bisphenol A epoxy resin and 2-ethyl-4-methylimidazole are added to a glass reactor and heated to 80°C. The reaction time is 60 min, and the stirring speed is 200 rpm. The mass ratio of bisphenol A epoxy resin to 2-ethyl-4-methylimidazole is 100:20.

[0037] Example 1 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment includes: high-toughness heat-insulating epoxy resin and glass fiber; wherein the glass fiber has a volume content of 43.8% in the composite material.

[0038] The raw materials for preparing high-toughness heat-insulating epoxy resin include: Component A and Component B; the mass ratio of Component A to Component B is 141:98; Component A includes 90g of epoxy resin 830 (bisphenol F type epoxy resin), 38.57g of epoxy resin E-51 (bisphenol A type epoxy resin), and 12.86g of toughening agent polysulfone; Component B includes 41g of curing agent bisphenol A type epoxy resin modified 2-methylimidazole, 0.68g of antioxidant V85-P, 18g of additive silicon-titanium stacked composite microspheres, and 39g of lightweight filler hollow glass microspheres.

[0039] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment includes the following steps: 1. Place the epoxy resin in a high-speed disperser, heat it to 140°C, add the toughening agent and stir continuously for 240 minutes to mix thoroughly. The speed of the high-speed disperser is 600 r / min to obtain component A.

[0040] 2. Weigh the curing agent, add antioxidant, additives and light filler to the curing agent, and process it in a three-roll mill for 30 minutes. The speed of the three-roll mill is 150 r / min to obtain component B.

[0041] 3. Mix components A and B at a mass ratio of 141:98 and mix for 15 minutes using a high-speed disperser at a speed of 800 r / min to obtain a high-toughness heat-insulating epoxy resin.

[0042] 4. On a coating equipment, epoxy resin is prepared into a resin film according to the process parameters of coating temperature 55℃, speed 6m / min, and gap 0.02mm; 5. Place the resin film and reinforcing fiber in the designated position on the impregnation equipment, and prepare the prepreg by hot pressing the resin film and reinforcing fiber together according to the process parameters of impregnation temperature 45℃, pressure 0.4MPa, and speed 3m / min; 6. Place the prepreg on a press for molding. The molding temperature is 130℃, the time is 150min, and the pressure is 1MPa to obtain a high-toughness heat-insulating epoxy resin-based composite material.

[0043] Example 2 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment includes: high-toughness heat-insulating epoxy resin and glass fiber; wherein the glass fiber has a volume content of 45.2% in the composite material.

[0044] The raw materials for preparing high-toughness heat-insulating epoxy resin include: Component A and Component B; the mass ratio of Component A to Component B is 102:116; Component A includes 100g of epoxy resin 830 (bisphenol F type epoxy resin), 40g of epoxy resin E-51 (bisphenol A type epoxy resin), and 13g of toughening agent polysulfone; Component B includes 30g of curing agent bisphenol A type epoxy resin modified 2-methylimidazole, 0.7g of antioxidant V85-P, 15g of additive silicon-titanium stacked composite microspheres, and 35g of lightweight filler hollow glass microspheres.

[0045] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0046] Example 3 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment includes: high-toughness heat-insulating epoxy resin and glass fiber; wherein, the volume content of glass fiber in the composite material is 45.8%.

[0047] The raw materials for preparing high-toughness heat-insulating epoxy resin include: Component A and Component B; the mass ratio of Component A to Component B is 120:84; Component A includes 80g of epoxy resin 830 (bisphenol F type epoxy resin), 30g of epoxy resin E-51 (bisphenol A type epoxy resin), and 10g of toughening agent polysulfone; Component B includes 42g of curing agent bisphenol A type epoxy resin modified 2-methylimidazole, 0.5g of antioxidant V85-P, 25g of additive silicon-titanium stacked composite microspheres, and 45g of lightweight filler hollow glass microspheres.

[0048] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0049] Example 4 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment includes: high-toughness heat-insulating epoxy resin and glass fiber; wherein the glass fiber has a volume content of 43.2% in the composite material.

[0050] The raw materials for preparing high-toughness heat-insulating epoxy resin include: Component A and Component B; the mass ratio of Component A to Component B is 95:120; Component A includes 100g of epoxy resin 830 (bisphenol F type epoxy resin), 50g of epoxy resin E-51 (bisphenol A type epoxy resin), and 8g of toughening agent polysulfone; Component B includes 45g of curing agent bisphenol A type epoxy resin modified 2-methylimidazole, 0.8g of antioxidant V85-P, 12g of additive silicon-titanium stacked composite microspheres, and 32g of lightweight filler hollow glass microspheres.

[0051] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0052] Example 5 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment includes: high-toughness heat-insulating epoxy resin and glass fiber; wherein the glass fiber has a volume content of 43.6% in the composite material.

[0053] The raw materials for preparing high-toughness heat-insulating epoxy resin include: Component A and Component B; the mass ratio of Component A to Component B is 150:80; Component A includes 42g of epoxy resin 830 (bisphenol F type epoxy resin), 20g of epoxy resin E-51 (bisphenol A type epoxy resin), and 15g of toughening agent polysulfone; Component B includes 25g of curing agent bisphenol A type epoxy resin modified 2-methylimidazole, 0.3g of antioxidant V85-P, 28g of additive silicon-titanium stacked composite microspheres, and 50g of lightweight filler hollow glass microspheres.

[0054] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0055] Example 6 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment has the same components and mass fractions as in Example 1, except that the additives are replaced with nano-titanium dioxide.

[0056] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0057] Example 7 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment has the same components and mass fractions as in Example 1, except that the curing agent is replaced with 2-ethyl-4-methylimidazole modified with bisphenol A type epoxy resin.

[0058] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0059] Example 8 The high-toughness heat-insulating epoxy resin-based composite material described in this embodiment has the same components and mass fractions as in Example 1, except that the curing agent is replaced with m-phenylenediamine.

[0060] The preparation method of the high-toughness heat-insulating epoxy resin-based composite material in this embodiment is the same as that in Example 1.

[0061] Comparative Example 1 The epoxy resin-based composite material in this comparative example has the same components and mass fractions as in Example 1, except that no additives are added.

[0062] The preparation method of the epoxy resin-based composite material in this comparative example is the same as that in Example 1.

[0063] Comparative Example 2 The epoxy resin-based composite material in this comparative example has the same components and mass fractions as in Example 1, except that no toughening agent is added.

[0064] The preparation method of the epoxy resin-based composite material in this comparative example is the same as that in Example 1.

[0065] Comparative Example 3 The epoxy resin-based composite material in this comparative example has the same components and mass fractions as in Example 1, except that no antioxidant is added.

[0066] The preparation method of the epoxy resin-based composite material in this comparative example is the same as that in Example 1.

[0067] The thermal conductivity, mechanical properties, and aging resistance of the epoxy resin-based composite materials of the above embodiments and comparative examples were measured, and the test results are shown in Table 1 below.

[0068] Table 1

[0069] As shown in Table 1, the epoxy resin-based composite material of Comparative Example 1, without the addition of additives, has a high thermal conductivity and poor mechanical properties. The epoxy resin-based composite material of Comparative Example 2, without the addition of toughening agents, also has poor mechanical properties. The epoxy resin-based composite material of Comparative Example 3, without the addition of antioxidants, has poor aging resistance.

[0070] In comparison, the high-toughness thermal insulation epoxy resin-based composite materials of the various embodiments of the present invention exhibit higher toughness, lower thermal conductivity, and better aging resistance. In Example 6, the additive was replaced with nano-titanium dioxide. Compared to Example 1, the nano-titanium dioxide in Example 6 can also be combined with the low thermal conductivity of the lightweight filler to achieve efficient thermal insulation; however, its effect on improving the mechanical properties of the composite material is not as good as that of the silicon-titanium stacked composite microspheres. Example 7 used another bisphenol A type epoxy resin modified imidazole-based curing agent, and its overall performance was close to that of Example 1. Example 8 used m-phenylenediamine curing agent, but its overall performance was not as good as that of Example 1. Therefore, using a bisphenol A type epoxy resin modified imidazole-based curing agent results in better performance.

[0071] Compared with Examples 1-5, the difference lies in the different mass fractions of each component. Examples 1-3 are preferred embodiments, and their overall performance is better than that of Examples 4 and 5.

[0072] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A high toughness, thermally insulating epoxy resin, characterized in that, Preparation raw materials thereof include: A component and B component; the mass ratio of A component to B component is 95-150: 80-120; A component includes the following components in mass fraction: epoxy resin 62-150 parts, toughening agent 8-15 parts; B component includes the following components in mass fraction: curing agent 25-45 parts, antioxidant 0.3-0.8 parts, auxiliary agent 12-28 parts, light filler 32-50 parts; the auxiliary agent is one or a combination of both of nano titanium dioxide and silicon-titanium stacked composite microspheres.

2. The high-toughness thermal insulation epoxy resin according to claim 1, characterized in that: the mass ratio of A component to B component is 102-141: 84-116; A component includes the following components in mass fraction: epoxy resin 110-140 parts, toughening agent 10-13 parts; B component includes the following components in mass fraction: curing agent 30-42 parts, antioxidant 0.5-0.7 parts, auxiliary agent 15-25 parts, light filler 35-45 parts.

3. The high-toughness thermal insulation epoxy resin according to claim 1, characterized in that: the curing agent is one or a combination of several of 2-methylimidazole modified by bisphenol A type epoxy resin, 2-ethyl-4-methylimidazole modified by bisphenol A type epoxy resin, m-phenylenediamine, and diamino diphenyl methane; the toughening agent is one or a combination of several of carboxyl nitrile rubber, polyether sulfone, polyether imide, and polysulfone; the antioxidant is one or a combination of several of antioxidant V85-P and antioxidant 1010; the light filler is hollow glass microbeads.

4. The high-toughness thermal insulation epoxy resin according to claim 3, characterized in that: the particle size of the hollow glass microbeads is 30-110 μm, D50≤65 μm, and the compressive strength is 1.72-2.10 MPa.

5. The high-toughness thermal insulation epoxy resin according to claim 3, characterized in that: the epoxy resin is one or a combination of several of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

6. A process for the preparation of a high toughness, thermally insulated epoxy resin as claimed in any one of claims 1 to 5, characterized in that, including the following steps: S1. Mixing epoxy resin and toughening agent to obtain A component; S2. Mixing curing agent, antioxidant, auxiliary agent, and light filler to obtain B component; S3. Mixing A component and B component according to mass ratio to obtain the high-toughness thermal insulation epoxy resin.

7. The preparation method according to claim 6, characterized in that: step S1 specifically includes the following steps: placing epoxy resin into a high-speed disperser, heating to 130-140℃, adding toughening agent and stirring for 120-240 min, the rotation speed of the high-speed disperser being 600-800 r / min, to obtain A component; step S2 specifically includes the following steps: mixing curing agent, antioxidant, auxiliary agent, and light filler, and processing in a three-roll grinding device for 15-30 min, the rotation speed of the three-roll grinding being 150-300 r / min, to obtain B component; step S3 specifically includes the following steps: mixing A component and B component according to proportion, and mixing in a high-speed disperser for 10-15 min, the rotation speed of the high-speed disperser being 600-800 r / min, to obtain the high-toughness thermal insulation epoxy resin.

8. A high toughness thermally insulated epoxy resin based composite material, characterized in that, The application relates to a high-toughness thermal-insulation epoxy resin and reinforcing fibers, and a preparation method thereof. The application relates to a high-toughness thermal-insulation epoxy resin and reinforcing fibers, and a preparation method thereof.

9. A process for the preparation of high toughness thermally insulated epoxy resin based composites as claimed in claim 8, characterized in that, A1. Preparing a high-toughness thermal-insulation epoxy resin into a resin adhesive film; A2. Preparing the resin adhesive film and the reinforcing fibers into a prepreg through hot pressing; A3. Molding the prepreg to obtain a high-toughness thermal-insulation epoxy resin-based composite material.

10. The preparation method according to claim 9, wherein: In step A3, the temperature of the molding is 120-140 DEG C, the time is 120-180 min, and the pressure is 0.6-1.2 MPa. ​

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