Force sensitive layer and manufacturing method and device thereof

Abstract

The invention discloses a force sensitive layer and a manufacturing method and equipment thereof. The force sensitive layer can be applied to a base frame curved surface, the force sensitive layer comprises an insulating layer and a force sensitive array, the insulating layer covers the base frame curved surface, the force sensitive array comprises a plurality of force sensitive blocks and is arranged between the base frame curved surface and the insulating layer, the force sensitive blocks are arranged at intervals, a gap area is formed between every two adjacent force sensitive blocks, and the resistance value of each force sensitive block changes along with the change of stress. The force sensitive layer has the advantages of accurate, reliable and stable sensing signals and the like.

Description

Technical Field

[0001] This application relates to the field of sensing technology, and in particular to a force-sensitive layer and its manufacturing method and equipment. Background Technology

[0002] With the rapid development of embodied intelligence technology, dexterous hands, as a key technology for general-purpose robots, are able to adapt to various industrial and commercial scenarios and equipment currently designed for human operation because they mimic the shape of human hands. They have great potential for wide application and universal deployment.

[0003] In recent years, although dexterous hands have made significant progress in grasping strength and posture flexibility, in complex industrial and commercial operations, due to the complexity and dynamism of related scenarios and operational targets, the tactile perception ability of dexterous hands still has significant shortcomings in terms of sensitivity, accuracy and reliability. In particular, the various parts of dexterous hands often have characteristics such as limited size and space, complex structural form and complex signal-noise environment, which bring great difficulties to the hardware implementation of tactile perception. Summary of the Invention

[0004] This application discloses a force-sensitive layer and its manufacturing method and equipment, which have the advantages of sensitive and clear signal, accurate and reliable measurement, and compact and precise structure.

[0005] In a first aspect, this application provides a force-sensitive layer applied to a base frame having a curved surface, the force-sensitive layer comprising: Insulation layer, the insulation layer is applied to the curved surface of the base frame; Force-sensitive array, the force-sensitive array is connected to the insulating layer and is located between the curved surface of the base and the insulating layer; The force-sensitive array includes multiple force-sensitive blocks, which are arranged at intervals and gaps are formed between adjacent force-sensitive blocks. The electrical parameters of the force-sensitive blocks change with the force applied.

[0006] Secondly, this application provides an actuator, comprising: The base frame has curved surfaces, and the actuator performs operations through these curved surfaces. Circuit pattern layer, the circuit pattern layer is set on the curved surface; In one embodiment of this application, the force-sensitive layer is overlaid on the circuit pattern layer, thereby being attached to the curved surface through the circuit pattern layer.

[0007] Thirdly, this application provides a method for manufacturing a force-sensitive layer, the method comprising: A first slurry and a second slurry are provided. The first slurry is used to prepare the force-sensitive array in the force-sensitive layer, and the second slurry is used to prepare the insulating layer in the force-sensitive layer. The first slurry is molded into a force-sensitive array; The force-sensitive array and the second slurry are molded together and co-vulcanized to obtain an integrally formed force-sensitive array and insulating layer. The force-sensitive array includes multiple force-sensitive blocks, which are arranged at intervals and gaps are formed between adjacent force-sensitive blocks. The resistance value of the force-sensitive blocks changes with the force applied. The force-sensitive array and the insulating layer are demolded and vulcanized together to obtain the force-sensitive layer.

[0008] Fourthly, this application provides a pressure sensor that includes a force-sensitive layer as described in any embodiment of this application; or, the manufacturing process of the pressure sensor includes a method for manufacturing a force-sensitive layer as described in any embodiment of this application.

[0009] Fifthly, this application provides a dexterous hand, which includes a force-sensitive layer as described in any embodiment of this application; or, at least one phalanx of the dexterous hand includes an actuator as described in any embodiment of this application; or, the dexterous hand includes a pressure sensor as described in any embodiment of this application.

[0010] In a sixth aspect, this application provides a robot that includes a force-sensitive layer as described in any embodiment of this application; or, at least one phalanx of the robot includes an actuator as described in any embodiment of this application; or, the robot includes a pressure sensor as described in any embodiment of this application; or, the robot includes a dexterous hand as described in any embodiment of this application.

[0011] The aforementioned force-sensitive layer and its manufacturing method and equipment, by covering the force-sensitive array with an insulating layer and coordinating it with the gap area design inside the force-sensitive array, enable the complex forces on the operating surface to be transmitted to several force-sensitive blocks through the insulating layer. Furthermore, by utilizing the stable connection between the insulating layer and the force-sensitive array and the insulation design of the gap area, problems such as stress diffusion, interference deformation, and electrical signal crosstalk between force-sensitive blocks are prevented, thereby improving the tactile perception reliability, sensitivity, and accuracy of the force-sensitive layer and related equipment.

[0012] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of a force-sensitive layer provided in an embodiment of this application; Figure 2This is a schematic diagram of the structure of an actuator provided in one embodiment of this application; Figure 3 yes Figure 2 A schematic diagram of the exploded structure shown; Figure 4 It corresponds to Figure 2 A schematic diagram of the second circuit pattern at point A shown in the diagram; Figure 5 yes Figure 2 Along the structure at point A shown Figure 4 A schematic diagram of the cross-sectional structure shown in the BB direction; Figure 6 It corresponds to Figure 2 A schematic diagram of the insulating film at point A in the diagram is shown. Figure 7 It corresponds to Figure 2 A schematic diagram of the first circuit pattern at point A shown in the diagram; Figure 8 This is a schematic flowchart of a method for manufacturing a force-sensitive layer according to an embodiment of this application; Figure 9 This is a schematic flowchart of a method for manufacturing a force-sensitive layer according to an embodiment of this application; Figure 10 This is a schematic flowchart of a method for manufacturing a force-sensitive layer according to an embodiment of this application; Figure 11 This is a schematic diagram of the structure of a contour mold provided in one embodiment of this application; Figure 12 yes Figure 11 A schematic diagram of a partial structure at point C shown in the diagram; Figure 13 This is a schematic diagram of the structure of a first mold provided in an embodiment of this application; Figure 14 This is a schematic diagram of the structure of a second mold provided in one embodiment of this application; Figure 15 This is a schematic diagram of the structure of the first mold and the contouring mold combined according to an embodiment of this application; Figure 16 This is a schematic diagram of the structure of the second mold and the contouring mold combined according to an embodiment of this application; Figure 17 This is a schematic block diagram of the structure of a robot provided in one embodiment of this application; Figure 18 This is a schematic block diagram of the structure of a dexterous hand provided in one embodiment of this application.

[0015] Figure label: X, first direction; Y, second direction; 100. Force-sensitive layer; 200. Actuator; 210. Base frame; 220. Curved surface; 300. Pressure sensor; 400. Dexterous hand; 500. Robot; 10. Insulation layer; 20. Force-sensitive array; 21. Force-sensitive block; 22. Gap region; 30. Circuit pattern layer; 31. First circuit pattern; 32. Second circuit pattern; 321. First circuit section; 3211. First electrode line; 322. Second circuit section; 3221. Second electrode line; 323. Joining angle; 33. Insulating film; 331. Via; 34. Circuit board; 41. First mold; 42. Second mold; 43. Copying mold.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0019] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0020] It should be understood that, in order to clearly describe the technical solutions of the embodiments of this application, the terms "first" and "third" are used in the embodiments of this application to distinguish the same or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "third" do not limit the quantity or execution order, and the terms "first" and "third" are not necessarily different.

[0021] With the rapid advancement and widespread application of artificial intelligence (AI) technology, embodied intelligent devices such as humanoid robots are considered by industry and academia as a necessary carrier and key link for the future expansion of AI from the digital world to the physical world, representing an important application direction for AI technology. For contemporary human society, the industrial and commercial scenarios and related physical tools that embodied intelligence may apply to are often the result of long-term evolution throughout human history, designed based on human physiological structures. For example, kitchen knives, computer mice and keyboards, mechanical pens, car cockpits, factory equipment buttons, product assembly and disassembly structures and related tools, door handles, etc., allow humans to operate these tools efficiently and save energy. If robots lack corresponding human-like hand shapes and fingers, they may not only be less efficient and harder to operate, but their flexibility and versatility in human society will be severely limited, creating a bottleneck for the continued penetration and application of AI technology. Therefore, the human hand is a unique and crucial part of daily life for humans, and a dexterous hand is one of the key electromechanical systems that future robots must possess in their design.

[0022] In their in-depth research on dexterous hand control systems, the inventors discovered that without a tactile sensing system, even simple human hand operations such as grasping, picking up, and pushing are difficult for a robotic dexterous hand to perform. For example, questions like "How much force should be used to pick up a cup?", "From which part of the hand can the grip be held securely to prevent it from falling?", and "How to adjust the force used to hold or push an object that appears large but is actually very light?"—these seemingly simple questions are actually extremely complex and sophisticated in terms of control system design, involving multiple modes and complex force scenarios. They represent a long-standing technical challenge for the research team.

[0023] The inventors had attempted to solve the above technical problems by incorporating pressure sensors and electronic skin into the dexterous hand, but found at least three issues: Firstly, traditional pressure sensors are often hard and bulky, making it difficult to fit them on irregular surfaces such as the fingertips and pads of a dexterous hand. Even if high costs are incurred to improve their fit to curved surfaces through customized design, the inherent design concept of the sensing system limits the range and direction of the sensor array, making it difficult to achieve the tactile sensitivity of human hands. Secondly, while flexible pressure sensors and electronic skin can fit well into irregular surfaces such as fingertips and pads, when subjected to local pressure, stress is transmitted through the material, causing crosstalk in the mechanical structure between sensing units. This results in varying degrees of deformation and changes in electrical parameters in multiple adjacent sensing units, leading to signal distortion and reduced reliability and accuracy. Thirdly, the target sensing area of ​​the dexterous hand is very small, scattered, and has a complex structure, which further exacerbates the problems of insufficient mechanical structure reliability of the wiring and electrical signal crosstalk, reducing the accuracy of tactile perception.

[0024] To address the aforementioned problems, this application proposes a force-sensitive layer. Please refer to [link / reference]. Figures 1 to 3 The force-sensitive layer 100 can be applied to a base frame 210, which has a curved surface 220. The force-sensitive layer 100 may include an insulating layer 10 and a force-sensitive array 20. Specifically, the insulating layer 10 may cover the curved surface 220 of the base frame 210, and the force-sensitive array 20 may be connected to the insulating layer 10 and located between the curved surface 220 of the base frame 210 and the insulating layer 10. The force-sensitive array 20 may include multiple force-sensitive blocks 21, which are arranged at intervals, with gaps 22 formed between adjacent force-sensitive blocks 21. The electrical parameters of the force-sensitive blocks 21 change with the applied force.

[0025] It should be understood that the electrical parameters may include resistance and capacitance values. The base 210 may be part of the pressure sensor 300, or part of the actuator 200 of an electromechanical device such as the fingertip of the dexterous hand 400, the gripper gripping part, or the massage head of a massager; no specific limitations are made here. The curved surface 220 can be used as the operating surface of the base 210, such as the gripping surface of the gripper, the curved surface 220 of the fingertip of the dexterous hand 400, the palm surface of the dexterous hand 400, and the curved surface 220 of the massage head of the massager. The force-sensitive block 21 is disposed between the insulating layer 10 and the curved surface 220 of the base 210. On the one hand, it facilitates electrical connection with subsequent circuit patterns to realize the technical function of the pressure sensor 300. On the other hand, the covering of the insulating layer 10 provides a dual function of protection and fixed positioning for the force-sensitive array 20.

[0026] Specifically, the side of the force-sensitive block 21 facing the curved surface 220 of the base frame 210 may include at least one of a square, a strip, a circle, a polygon, a triangle, and combinations thereof. It may also be a similar shape, such as a triangle with rounded corners, a square with chamfered corners, or a polygon with at least some of its sides curved.

[0027] In some embodiments, the Shore hardness of at least one force-sensitive block 21 may be greater than the Shore hardness of the insulating layer 10; or, the elasticity of at least one force-sensitive block 21 may be weaker than the elasticity of the insulating layer 10. It should be understood that if a conductive carbon black-doped silicone is used to make the force-sensitive block 21 conductive, the force-sensitive block 21 will be harder than the insulating silicone, or the insulating silicone will be more elastic than the force-sensitive block 21. With this design, since the insulating layer 10 is applied to the force-sensitive array 20 and then attached to the curved surface 220 via the force-sensitive array 20, due to the specific direction and transmission of force during operation, the relevant force will be difficult to be transmitted from one force-sensitive block 21 to another force-sensitive block 21 in the force-sensitive array 20 by first moving away from the curved surface 220, then through the insulating layer 10, and finally approaching the curved surface 220. This solves the problems of stress diffusion and deformation interference.

[0028] Specifically, the force-sensitive block 21 can be made of silicone with a Shore A hardness of 40° to 60° and conductive carbon black, which may include acetylene black or Ketjen black. The high-hardness substrate ensures that each force-sensitive block 21 deforms primarily under stress, effectively confining deformation and stress within the area of ​​a single force-sensitive block 21.

[0029] Specifically, the insulating layer 10 can be made of insulating silicone with lower hardness and better elasticity, for example, insulating silicone with a Shore hardness in the range of A10° to A25°. This design can not only more evenly transmit the local pressure applied by external objects to the curved surface 220 to the local force-sensitive blocks 21 in the inner layer, thereby avoiding excessive stress concentration and improving the accuracy and consistency of the measurement.

[0030] In some embodiments, the gap region 22 may be provided with insulating silicone, or the gap region 22 may form an air gap. By fabricating the force-sensitive array 20 into multiple physically isolated strip-shaped or block-shaped units, and separating the units with non-conductive silicone material or air gaps, it is possible to mechanically ensure that the stress and deformation generated by a unit under pressure are difficult to be transmitted to adjacent units, while simultaneously solving the problem of electrical signal crosstalk.

[0031] It should be understood that by covering the force-sensitive array 20 with the insulating layer 10 and cooperating with the gap region 22 inside the force-sensitive array 20, the complex forces on the operating surface can be transmitted to several force-sensitive blocks 21 through the insulating layer 10. By utilizing the stable connection between the insulating layer 10 and the force-sensitive array 20 and the insulation design of the gap region 22, problems such as stress diffusion, interference deformation and electrical signal crosstalk between the force-sensitive blocks 21 are prevented, thereby improving the tactile sensing reliability, sensitivity and accuracy of the force-sensitive layer 100 and related equipment.

[0032] In some embodiments, at least one force-sensitive block 21 includes silicone and conductive carbon black, with the conductive carbon black doped into the silicone. The mass ratio of silicone to conductive carbon black ranges from 95:5 to 85:15. The ratio and silicone hardness can be adjusted according to different applications. When a large pressure range is required, a formulation with a lower carbon black content and a silicone with higher hardness is used. When applied to high-sensitivity and high-precision applications, a formulation with a higher carbon black content and a silicone with lower hardness is used.

[0033] In some embodiments, the conductive carbon black may include at least one of acetylene black and Ketjen black, or it may be a blend of the two conductive carbon blacks. This design utilizes the high conductivity and structural stability of acetylene black, as well as the high specific surface area of ​​Ketjen black, to form a more stable and efficient three-dimensional conductive network within the silicone matrix. This reduces the background noise caused by uneven distribution of conductive fillers or network instability, indirectly improving the signal-to-noise ratio, enhancing the ability to resist electrical interference, and improving the signal stability of each force-sensitive block 21.

[0034] In some embodiments, the insulating layer 10 may include insulating silicone, and the force-sensitive array 20 and the insulating layer 10 are integrally formed by a co-curing process. This design enables the insulating layer 10 and the force-sensitive array 20 to undergo covalent cross-linking at the interface, forming a strong chemical bond, avoiding the risk of delamination, and ensuring reliable, stable, and sensitive pressure transmission.

[0035] This application also proposes an actuator 200, which may include a gripper, a dexterous hand 400, a massager, etc. The base 210 may include the gripping part of the gripper, the fingertips of the dexterous hand 400, the massage head of the massager, etc., and may also include objects with curved surfaces 220 such as a steering wheel, a mannequin, or a joystick, through which the user can operate. The curved surface 220 can be the operating surface of the actuator 200 when performing operations through the base 210, or it can be the surface being operated on.

[0036] Specifically, the actuator 200 may include a base frame 210, a circuit pattern layer 30, and a force-sensitive layer 100. Since the circuit pattern layer 30 can be formed on at least one material selected from LDS ink layer, PC / ABS alloy, PBT, and liquid crystal polymer using a laser direct forming process, the base frame 210 can also be detachably connected to the main body of the actuator 200, such as the dexterous hand 400 or gripper. Therefore, the base frame 210 can be made of at least one of PC / ABS alloy, PBT, and liquid crystal polymer, and an LDS ink layer can be formed on the base frame 210; this LDS ink layer can also be an insulating film 33. In some contexts, the force-sensitive layer 100, the circuit pattern layer 30, and the base frame 210 can be understood as forming part of a pressure sensor 300, which can be disposed on the actuator 200. In some contexts, the force-sensitive layer 100 and the circuit layer can be understood as forming part of the pressure sensor 300, while the base frame 210 is part of the actuator 200, or the base frame 210 is detachably mounted on the actuator 200. The two differ only slightly in semantics and both fall within the scope of this application.

[0037] In some embodiments, the circuit pattern layer 30 may include a first circuit pattern 31, a second circuit pattern 32, and an insulating film 33. The first circuit pattern 31 is formed on the curved surface 220 by a laser direct forming process. The insulating film 33 may be deposited on the first circuit pattern 31 and form a via 331. The second circuit pattern 32 may be formed on the insulating film 33 by a laser direct forming process. The second circuit pattern 32 may be electrically connected to the force-sensitive layer 100. At least a portion of the second circuit pattern 32 may be electrically connected to the first circuit pattern 31 through the via 331.

[0038] Through laser direct forming (LDF) technology, the first circuit pattern 31 and the second circuit pattern 32 can be stably and reliably attached to the curved surface 220, avoiding the use of a separate fabric substrate and making the overall structure more streamlined, compact, stable, and reliable. It should be understood that the insulating film 33 may include an insulating film 33 formed by coating and curing or semi-curing LDS ink onto the first circuit pattern 31. Specifically, the LDS ink may include at least one of epoxy resin, acrylic resin, and polyurethane. It should be understood that, for purposes such as mimicking human fingers or improving grip strength, the base frame 210 itself forms a curved surface 220. The insulating film 33 covers and protects the first circuit pattern 31, preventing it from being subjected to external friction, pressure, or moisture erosion, thus improving the structural stability and electrical reliability of the overall structure.

[0039] Furthermore, this design, utilizing LDS ink and its curing process, allows the ink's leveling properties to adapt to the curved surface 220, achieving a good fit and firm bond between the insulating film 33 and the first circuit pattern 31, the second circuit pattern 32, and the curved surface 220 of the base frame 210. This reduces the use of adhesives and ensures process consistency and overall structural strength, avoiding the risk of interlayer peeling caused by traditional multi-layer independent bonding. Moreover, the insulating film 33 formed using LDS ink can create reliable electrical insulation between a portion of the first circuit pattern 31 and the second circuit pattern 32, providing independent wiring space for the two circuit layers, supporting high-density, three-dimensional wiring design, and allowing for flexible planning of wiring paths according to the fine layout requirements of small areas such as the fingertips of the dexterous hand 400, avoiding wiring interference. This improves the flexibility and reliability of wiring within the narrow curved surface 220, further adapting to the multi-point signal transmission requirements of the force-sensitive array 20, and synergizing with the stress isolation design of the aforementioned force-sensitive layer 100 to ensure the accuracy and stability of tactile sensing.

[0040] In some embodiments, the second circuit pattern 32 may include a first circuit portion 321 and a second circuit portion 322, which are spaced apart and electrically connected via a force-sensitive block 21. For example, the first circuit portion 321 and the second circuit portion 322 may have corresponding connection areas, which may be provided corresponding to the force-sensitive block 21 and electrically connected to it.

[0041] In some embodiments, the first circuit portion 321 is electrically connected to the first circuit pattern 31 via a via 331, and the second circuit portion 322 extends to the periphery of the force-sensitive array 20 and is electrically connected to the circuit board 34. It should be understood that after the second circuit portion 322 extends to the periphery of the force-sensitive array 20, it can be electrically connected to a portion of the first circuit pattern 31 or the circuit board 34. It should be understood that by electrically connecting the periphery to the circuit board 34, it is possible to avoid opening holes or slots in the middle of the curved surface 220 of the base 210, thereby avoiding damage to the flatness of the curved surface 220 and ensuring the consistency and stability of the force-sensitive layer 100's feedback to the pressure signal.

[0042] In some embodiments, the first circuit section 321 includes a plurality of first electrode lines 3211 extending along a first direction, which are arranged at intervals. The second circuit section 322 includes a plurality of second electrode lines 3221 extending along a second direction, which are arranged at intervals. The first direction and the second direction are arranged at an angle. Specifically, the absolute value of the angle between the first direction and the second direction can be set to any angle value between 60° and 90°. Typically, but not limitingly, the absolute value of the angle between the first direction and the second direction can be 60°, 65°, 70°, 75°, 80°, 85°, 90°, or any range of two values. Maintaining an angle of 60° to 90° between the first direction and the second direction facilitates process routing, reduces signal interference and routing interference between circuit sections, and ensures the stable and reliable function of the force-sensitive layer 100 and the actuator 200.

[0043] In some embodiments, the shortest distance between the first line portion 321 and the second line portion 322 can be set to any value between 1mm and 5mm. Typically, but not limitingly, the shortest distance between the first line portion 321 and the second line portion 322 can be 1mm, 2mm, 3mm, 4mm, 5mm, or a range of any two values.

[0044] Furthermore, the first circuit pattern may also include multiple first electrode lines 3211, a portion of which is electrically connected to the first electrode line 3211 of the first circuit section 321 through a via 331, and another portion extends to the periphery of the area of ​​the surface 220 to be tested on the base frame 210 and is electrically connected to the circuit board 34.

[0045] It should be understood that the resistance value of the force-sensitive block 21 changes when the force-sensitive array 20 is compressed. Since the multiple first electrode lines 3211 and the multiple second electrode lines 3221 arranged at intervals can form an angle, they can combine with the corresponding force-sensitive blocks 21 in the force-sensitive array 20 to form a matrix-like intersection layout. In use, the circuit board 34 can detect the current value of each electrode line to determine the first electrode line 3211 and the second electrode line 3221 corresponding to the force-sensitive block 21 that is being compressed, and determine the location, range, and pressure magnitude of the compression based on preset parameters.

[0046] By combining the electrode line matrix layout of the second circuit pattern 32 with the isolation design between the force-sensitive blocks 21, multi-point tactile sensing is achieved. Furthermore, the electrical connection between the first circuit section 321 and the second circuit section 322 based on the force-sensitive blocks 21 reduces signal distortion and interference during transmission, ensuring the authenticity and reliability of the detection data.

[0047] It should be further understood that, since the first electrode line 3211 and the second electrode line 3221 are both disposed on the second circuit pattern 32, and multiple spaced first electrode lines 3211 and multiple spaced second electrode lines 3221 extend in different directions, geometrically, it is difficult for the multiple first electrode lines 3211 corresponding to the middle of the force-sensitive array 20 to bypass the other first electrode lines 3211 and second electrode lines 3221 and extend to the periphery of the force-sensitive array 20, thus making it difficult to electrically connect with the circuit board 34. Therefore, through the via 331 design, multiple first electrode lines 3211 can be electrically connected to first electrode lines 3211 on different layers through the via 331, thereby avoiding geometric interference and electronic circuit interference of the second electrode lines 3221, and stably and reliably transmitting electrical signals to the circuit board 34.

[0048] In some embodiments, in a first direction, the width of at least a portion of the part of the first electrode line 3211 directly connected to the force-sensitive block 21 is greater than the width of at least a portion of the part of the first electrode line 3211 not in contact with the force-sensitive block 21; or, in a second direction, the width of at least a portion of the part of the second electrode line 3221 directly connected to the force-sensitive block 21 is greater than the width of at least a portion of the part of the second electrode line 3221 not in contact with the force-sensitive block 21. By increasing the width of the part in contact with the force-sensitive block 21, it is helpful to increase the contact area between the first circuit portion 321 or the second circuit portion 322 and the force-sensitive block 21. This not only improves the stability and reliability of the electrical connection, but also appropriately expands the installable area of ​​the force-sensitive block 21, reduces the alignment difficulty in the production and assembly process, increases the accuracy redundancy of the manufacturing and alignment process of the force-sensitive layer 100, and prevents problems such as failure of the force-sensitive sensing function due to poor contact.

[0049] In some embodiments, at least a portion of the edge of the first wiring section 321 that directly contacts the force-sensitive block 21 is flush with at least a portion of the edge of the second wiring section 322 that directly contacts the force-sensitive block 21. This design allows the portions of the first wiring section 321 and the second wiring section 322 that directly contact the force-sensitive block 21 to correspond and fit together without direct electrical connection, creating a mosaic-like effect. This makes fuller use of the limited wiring layout space and increases the area of ​​the portions of the first wiring section 321 and the second wiring section 322 that directly contact the force-sensitive block 21.

[0050] For example, the portion of the first circuit section 321 directly connected to the force-sensitive block 21 can form a joining angle 323, or the portion of the second circuit section 322 directly connected to the force-sensitive block 21 can form a joining angle 323. Alternatively, the portion of the first circuit section 321 directly connected to the force-sensitive block 21 can form a triangle, a rhombus, or a combination thereof, or the portion of the second circuit section 322 directly connected to the force-sensitive block 21 can form a triangle, a rhombus, or a combination thereof. This design allows the portions of the first circuit section 321 that directly contact the force-sensitive block 21 to correspond and cooperate with the portions of the second circuit section 322 and other portions of the first circuit section 321 that directly contact the force-sensitive block 21. This allows for more efficient use of the wiring space within the electrical connection area corresponding to the force-sensitive block 21, maximizing the area of ​​the portions of the first circuit section 321 and the second circuit section 322 that directly contact the force-sensitive block 21, given the limited size of the force-sensitive block 21, thereby improving the stability and reliability of the electrical connection.

[0051] In some embodiments, the insulating layer 10 can be sealed to the curved surface 220 of the base frame 210. For example, an engaging portion can be formed on one of the peripheral portion of the insulating layer 10 and the curved surface 220 of the base frame 210, and an engaging groove can be formed on the other, so that a sealed connection is achieved by the engagement of the engaging portion and the engaging groove. Specifically, a groove surrounding the entire curved surface 220 region can be formed on the peripheral portion of the region to be measured of the base frame 210, or multiple grooves can be formed at designated positions on the outer sidewall of the peripheral portion of the region to be measured of the curved surface 220 of the base frame 210, at least two of the multiple grooves being symmetrically arranged about the region to be measured of the curved surface 220 region, such as axially symmetrical, rotationally symmetrical, or centrally symmetrical, so that the force-sensitive layer 100 is sealed and locked to the base frame 210 by the grooves.

[0052] It should be understood that the working environment of the actuators 200 of robots 500, such as the dexterous hand 400 and gripper 500, is often complex and variable. The force-sensitive layer 100 and its surrounding electronic circuit structure may be exposed to contaminants such as dust, oil, water stains, and fine particulate matter. Through the sealed connection design between the insulating layer 10 and the curved surface 220 of the base frame 210, a seal is formed at the periphery of the area to be tested on the curved surface 220, effectively preventing external contaminants from entering the gap between the insulating layer 10 and the base frame 210. This avoids problems such as short circuits and signal distortion in the circuit pattern layer 30 and the force-sensitive array 20 due to contamination. Simultaneously, the sealed connection further strengthens the bonding strength between the insulating layer 10 and the base frame 210, preventing the insulating layer 10 from shifting or falling off under repeated stress and changing posture conditions of the actuator 200, and ensuring a stable electrical connection between the force-sensitive block 21 and the circuit pattern.

[0053] In some embodiments, engaging slots on the base frame 210 can be matched with engaging portions such as straight-arm snaps, L-shaped snaps, and circumferential snaps on the periphery of the insulating layer 10. Alternatively, a separate sealing element can be provided, with one part matching the engaging slot and another part matching the engaging portion on the insulating layer 10, or fixedly connected to or integrally formed with the insulating layer 10, thereby achieving a sealed fit between the force-sensitive layer 100 and the base frame 210. Specifically, the sealing element may include a clamping sheet, a screw, etc. When the sealing element is a screw, corresponding screw holes can be provided on the base frame 210 and the force-sensitive layer 100 to achieve a threaded fixed connection. It should be understood that multiple methods can be used simultaneously to achieve sealing and fixing without conflict.

[0054] This application also provides a method for manufacturing a force-sensitive layer 100, which can be used to manufacture the force-sensitive layer 100 in any embodiment of this application. Please refer to [link to relevant documentation]. Figure 8 , Figure 8 This is a schematic flowchart of a method for manufacturing a force-sensitive layer according to an embodiment of this application. The method for manufacturing the force-sensitive layer 100 may include steps S101 to S104.

[0055] S101, Provide the first slurry and the second slurry.

[0056] The first slurry can be used to prepare the force-sensitive array 20 in the force-sensitive layer 100, and the second slurry can be used to prepare the insulating layer 10 in the force-sensitive layer 100.

[0057] In some embodiments, providing the first slurry may specifically include providing liquid silica gel and conductive carbon black, mixed at a mass ratio of liquid silica gel to conductive carbon black ranging from 95:5 to 85:15 to obtain the first slurry. It should be understood that this mass ratio range can be flexibly adjusted according to actual sensing requirements. In high-range scenarios, a formulation with a lower carbon black content and higher hardness can be selected to ensure structural stability; in high-sensitivity, high-precision detection scenarios, a formulation with a higher carbon black content and lower hardness can be selected to improve response sensitivity.

[0058] The liquid silica gel can be AB type liquid silica gel with a viscosity range of 1 Pa·s to 100 Pa·s. It should be understood that by selecting AB type liquid silica gel with a viscosity range of 1 Pa·s to 100 Pa·s, which is easier to mix evenly with carbon black, the conductive carbon black is quickly dispersed in the silica gel matrix due to its low viscosity, avoiding agglomeration and ensuring uniform composition of the first slurry. Furthermore, the AB type two-component system design allows for the adjustment of curing parameters such as temperature and time to adapt to subsequent molding and co-curing processes, balancing molding efficiency and material bonding strength, thereby greatly simplifying the preparation process.

[0059] The conductive carbon black is obtained by compounding Ketjen black and acetylene black. It should be understood that, firstly, the compounded system optimizes the dispersion of conductive carbon black in the silicone matrix, avoiding performance fluctuations caused by agglomeration and accumulation that may occur with single carbon black components, ensuring consistency between different force-sensitive blocks 21, and improving the accuracy of subsequent matrix-type tactile detection; secondly, acetylene black has high conductivity and structural stability, while Ketjen black has a high specific surface area. The compounding of these two components can form a more stable and efficient three-dimensional conductive network in the silicone matrix, thereby reducing background noise caused by uneven distribution of conductive fillers or instability of the conductive network, indirectly improving the signal-to-noise ratio, enhancing the anti-interference capability of the force-sensitive layer 100, and improving the signal stability of each force-sensitive block 21.

[0060] S102. The first slurry is molded to obtain the force-sensitive array 20.

[0061] It should be understood that the force-sensitive array 20, obtained by molding the first slurry, can form a force-sensitive block 21 with good functionality and stable electrical characteristics. Specifically, the cavity structure of the mold can be preset in the molding process, thereby defining the shape of multiple spaced force-sensitive blocks 21, while ensuring the dimensional consistency of the gap area 22 between adjacent force-sensitive blocks 21. This avoids problems such as adhesion or uneven gaps between force-sensitive blocks 21 during subsequent processing, and achieves electrical insulation and prevents mechanical interference in the structure. In addition, the pressure applied during the molding process can promote the first slurry to fully fill the cavity, expel internal air bubbles, ensure the internal structure of the force-sensitive block 21 is dense, reduce the breakage of the conductive network or the hysteresis of the sensing response caused by pores, and ensure the consistency and stability of the resistance-pressure response performance of each force-sensitive block 21.

[0062] In some embodiments, the force-sensitive array 20 may include force-sensitive blocks 21 and insulating portions, the insulating portions being disposed in the gap regions between the force-sensitive blocks 21. Specifically, insulating silicone can be disposed in the gap regions 22 to further improve the insulation of the gap regions 22. For example, insulating silicone slurry can be pre-filled into the gap regions of the mold cavity before the first slurry is molded, thereby being molded synchronously with the first slurry, so that the insulating portions are formed synchronously with the force-sensitive blocks 21, blocking the electrical conduction path between adjacent force-sensitive blocks 21. Alternatively, after the force-sensitive array 20 is obtained by molding the first slurry, insulating silicone can be injected or filled into the gap regions 22, and the insulating portions in the force-sensitive array 20 can be formed after curing. Furthermore, in the cavity structure of the mold, a portion can be filled with a second slurry and a portion with a first slurry, thereby forming a mosaic-like force-sensitive array 20.

[0063] In some embodiments, please refer to Figure 9 , Figure 9This is a schematic flowchart of a method for manufacturing a force-sensitive layer according to an embodiment of this application. Specifically, it may include steps S102a to S102c. This method can be used to mold a first slurry.

[0064] S102a, Provide a contouring mold 43 and a first mold 41.

[0065] Please refer to Figure 11 , Figure 12 , Figure 13 and Figure 15 At least a portion of the contouring mold 43 conforms to the curved surface 220 of the base frame 210, and the contouring mold 43 is adapted to the first mold 41. Specifically, for example, one of the contouring mold 43 and the first mold 41 may be provided with a locating pin, and the other may be provided with a locating hole, the locating pin and the locating hole being adapted to each other. Alternatively, the cavity structure of the contouring mold 43 may be adapted to the cavity structure of the first mold 41.

[0066] It should be understood that in scenarios where space is limited, shapes are complex, and fine operations such as grasping and pressing are required at high frequencies, such as the fingertips of a dexterous hand 400, the adaptability of the curved surface 220 directly determines the tightness of the fit between the force-sensitive layer 100 and the base frame 210. If there are gaps at the fit, external pressure will be difficult to transmit accurately to the force-sensitive block 21, resulting in lag or distortion of the sensing signal, affecting the control and judgment of grasping force and force application position. If there are deviations in the dimensions of each force-sensitive block 21 and the gap area 22, it will not only cause difficulties in the alignment and poor contact between the first circuit section 321 and the second circuit section 322 and the force-sensitive array 20, but also cause differences in the resistance-pressure response performance of different force-sensitive blocks 21, making it impossible to achieve accurate positioning and quantification of pressure distribution.

[0067] This design serves two purposes. First, by adapting the contour of the curved surface 220 of the contouring mold 43 to the curved surface 220 of the force-sensitive layer 100 to be installed on the base frame 210, the adaptability and fit of the subsequently formed force-sensitive array 20 to the curved surface 220 of the base frame 210 can be improved, avoiding problems such as pressure transmission distortion or structural loosening caused by fitting gaps. Second, through the adaptation and cooperation between the contouring mold 43 and the first mold 41, as well as the design of positioning pins and positioning holes, the sealing and dimensional accuracy of the cavity can be ensured when the mold is closed, preventing the first slurry from overflowing or the cavity from deforming, and ensuring the consistency of the shape of the force-sensitive block 21.

[0068] S102b, Introduce the first slurry into the first mold 41 and combine the first mold 41 with the contour mold 43.

[0069] The slurry introduction process can be controlled by adjusting the slurry flow rate, filling pressure, and venting path, thereby improving the slurry filling rate of the cavity and reducing air bubble residue. Furthermore, a locating pin can be provided in one of the first mold 41 and the contour mold 43, while a locating hole can be provided in the other. The insertion design of the locating pin and the locating hole enables rapid mold alignment, ensuring a perfect match between the cavity contours.

[0070] S102c, The first slurry is molded into shape by combining the contour mold 43 and the first mold 41.

[0071] It should be understood that the sealing of the mold fit can be enhanced by applying a preset pressure to prevent the first slurry from overflowing from the cavity gaps. Specifically, the first slurry can be molded by combining the contour mold 43 and the first mold 41 at a temperature of 60 to 90 degrees Celsius for 5 to 15 minutes.

[0072] Typically, but not limitingly, molding can be performed using the combined molding die 43 and the first die 41 at a temperature of 60°C, 65°C, 70°C, 75°C, 80°C, 85°C, 90°C, or any combination of two values. Within the temperature range of 60°C to 90°C, the molding time can typically, but not limitingly, be 5 minutes, 6 minutes, 7 minutes, 8 minutes, 9 minutes, 10 minutes, 11 minutes, 12 minutes, 13 minutes, 14 minutes, 15 minutes, or any combination of two values.

[0073] In some embodiments, after mold closing, a pre-curing treatment can be performed according to the material properties such as the curing temperature of the first slurry to initially fix the shape of the force-sensitive array 20 so that insulating silicone can be set in the gap area 22 in the future, avoiding structural displacement and other problems when the insulating part formed by the insulating silicone is set.

[0074] S103. The force-sensitive array 20 and the second slurry are molded together and co-vulcanized to obtain an integrally formed force-sensitive array 20 and insulating layer 10.

[0075] The force-sensitive array 20 includes multiple force-sensitive blocks 21, which are arranged at intervals. A gap region 22 is formed between adjacent force-sensitive blocks 21. The resistance value of the force-sensitive block 21 changes with the applied force. It should be understood that the molding and co-vulcanization processes can be performed simultaneously or sequentially.

[0076] Through compression molding and co-vulcanization processes, a covalent cross-linking reaction can occur between the force-sensitive array 20 and the insulating layer 10, forming a strong chemical bond and achieving integral molding of the two. On the one hand, this avoids the risk of interlayer delamination caused by traditional bonding processes; on the other hand, the insulating layer 10 provides a protective and fixed constraint for the force-sensitive array 20, preventing the force-sensitive block 21 from loosening or shifting due to force during subsequent assembly or use. Furthermore, since the insulating layer 10 is larger than the force-sensitive array 20, during the assembly of the actuator 200 such as the fingertip of the dexterous hand 400, the grooves and protrusions on the insulating layer 10 can be used for positioning. The integral molding structure between the insulating layer 10 and the force-sensitive array 20 ensures that the position of the force-sensitive array 20 matches the sensing point array formed by the first circuit section 321 and the second circuit section 322. The co-cured insulation layer 10 can also maintain good flexibility and elasticity, which can not only adapt to the curved surface 220 shape of the base frame 210, but also transmit the external pressure evenly and stably to the stress-sensitive block 21 when under stress, ensuring the accuracy of the sensing response. It works in synergy with the gap area design between the stress-sensitive block 21 to further improve the overall performance of the stress-sensitive layer 100.

[0077] In some embodiments, after step S102c of molding the first slurry, the first mold 41 can be individually removed while the force-sensitive array 20 is held in the conforming mold 43. It should be understood that since the force-sensitive array 20 contains a large number of force-sensitive blocks 21, picking and placing them one by one will not only affect the production cycle but also reduce the process accuracy, resulting in insufficient consistency of the force-sensitive layer 100 and poor accuracy of the subsequent actuator 200 alignment and assembly process. This will affect the accuracy and reliability of the electrical connection between the circuit pattern layer 30 and the force-sensitive layer 100, and affect the stability of the force-sensitive sensing function.

[0078] For further details, please refer to Figure 10 , Figure 10 This is a schematic flowchart of a method for manufacturing a force-sensitive layer according to an embodiment of this application. The method can be used to mold and co-vulcanize the force-sensitive array 20 and the second slurry together. Specifically, it can include steps S103a to S103c.

[0079] S103a. A second mold 42 is provided, which is adapted to the contour mold 43.

[0080] Please refer to Figure 11 , Figure 14 and Figure 16The cavity structure of the second mold 42 can be matched with the preset shape of the insulating layer 10. It should be understood that by transferring the force-sensitive array 20 through the contour mold 43, the force-sensitive array 20 can be directly and accurately aligned with the corresponding cavity structure of the insulating layer 10 in the second mold 42, reducing complex positioning and loading / unloading processes and ensuring the relative positional accuracy between the force-sensitive array 20 and the insulating layer 10. The adaptive design of the second mold 42 and the contour mold 43 facilitates the direct transfer of the force-sensitive array 20 using the contour mold 43, achieving continuous processing from molding of the force-sensitive array 20 to its integral molding with the insulating layer 10. This reduces the impact of intermediate transfer steps on the relative positional accuracy between the force-sensitive array 20 and the insulating layer 10, improving production efficiency and product consistency.

[0081] S103b, Introduce the second slurry into the second mold 42, and combine the contour mold 43 with the second mold 42.

[0082] It should be understood that the second slurry can be introduced into the second mold 42 before the contour mold 43 is attached to the second mold 42, or it can be introduced into the second mold 42 or the contour mold 43 after the contour mold 43 is attached to the second mold 42. The specific method can be adjusted according to the mold structure design. For example, when introducing the second slurry before mold closing, the amount of slurry introduced can be controlled by metering or spraying processes to ensure that the slurry can fill the gap between the cavity of the second mold 42 and the force-sensitive array 20, avoiding excessive use leading to overflow or insufficient use causing uneven thickness of the insulation layer 10. If the slurry is introduced after mold closing, injection channels and venting holes can be pre-set on the second mold 42 or the contour mold 43. Pressure injection allows the second slurry to flow evenly in the sealed cavity, fully filling the cavity area corresponding to the insulation layer 10. Furthermore, after attaching the contour mold 43 to the second mold 42, a pre-tightening force can be applied to ensure cavity sealing.

[0083] S103c, The force-sensitive array 20 and the second slurry are molded and co-vulcanized together by combining the contour mold 43 and the second mold 42.

[0084] It should be understood that since the compression molding process itself also requires heating and pressurization, it can promote a certain degree of co-curing reaction between the force-sensitive layer 100 and the second slurry (insulating layer 10). After compression molding, a double-layer pressure-sensitive material with stable chemical bonds formed through curing can be directly obtained. The compression molding pressure applied during the compression molding process helps to eliminate air bubbles and gaps between the force-sensitive layer 100 and the force-sensitive array 20, reduce the contact gap between the two, and further enhance the fit and sealing of the contour mold 43 and the second mold 42, avoiding slurry overflow caused by thermal expansion of the material during co-curing, and ensuring the molding accuracy of the product.

[0085] S104. Demold and vulcanize the force-sensitive array 20 and the insulating layer 10 together to obtain the force-sensitive layer 100.

[0086] It should be understood that in steps S102c and S103a, the force-sensitive array 20 can remain on the molding die 43 without complete demolding. Complete demolding will then occur when the force-sensitive array 20 and the insulating layer 10 are completely demolded together to obtain the demolded product. After complete demolding, there is no need to operate the related molds. The demolded product is essentially identical in shape to the force-sensitive layer 100 and possesses a certain degree of structural stability. In terms of process, the demolded product, serving as the prototype of the force-sensitive layer 100, can undergo separate loading, unloading, and co-vulcanization operations to ultimately obtain the force-sensitive layer 100.

[0087] In some embodiments, the first slurry is molded by combining the contour mold 43 and the second mold 42. Specifically, this may include demolding the force-sensitive array 20 and the insulating layer 10 together to obtain a demolded product; and then vulcanizing the demolded product at 150 degrees Celsius to 200 degrees Celsius for 2 to 4 hours to obtain the force-sensitive layer 100.

[0088] In some embodiments, the mold release material can be vulcanized for 2 to 4 hours at a temperature ranging from 150°C to 200°C using a combined mold 43 and a second mold 42 to obtain the force-sensitive layer 100. Typically, but not limitingly, the mold release material can be vulcanized at a temperature of 150°C, 160°C, 170°C, 180°C, 190°C, 200°C, or any combination of two values ​​using a combined mold 43 and a second mold 42. Further, within the temperature range of 150°C to 200°C, the vulcanization time can typically, but not limitingly, be 2 hours, 2.5 hours, 3 hours, 3.5 hours, 4 hours, or any combination of two values.

[0089] It should be understood that after compression molding, further co-vulcanization not only forms a strong chemical bond through covalent cross-linking, achieving integral molding of the two components, but also stabilizes the material properties of the force-sensitive array 20 and the insulating layer 10. This ensures that the insulating layer 10 maintains the flexibility and elasticity of the curved surface 220 of the base frame 210, guaranteeing smooth pressure transmission, while also providing long-term reliable protection and fixed positioning for the force-sensitive array 20, preventing displacement of the force-sensitive block 21 during subsequent assembly or use. Furthermore, the bonding strength, hardness, and other mechanical structural properties of the materials can be adjusted by controlling the vulcanization temperature and time.

[0090] Please see Figure 3 , Figure 17 and Figure 18It should be understood that, due to the application of laser direct forming technology, the circuit pattern layer 30 is directly fixedly mounted on the base 210. Therefore, the base 210 can be considered as part of the pressure sensor 300, or as part of the actuator 200 such as the fingers or massage head of the dexterous hand 400. It should be further understood that the pressure sensor 300 can be integrally formed with the base 210 and detachably mounted on the actuator 200. Therefore, the pressure sensor 300 can be considered as part of the actuator 200, or as something different from the actuator 200 but belonging to the dexterous hand 400. Furthermore, the force-sensitive layer 100 on the pressure sensor 300 can be considered as part of the actuator 200, or as something different from the actuator 200 but belonging to the dexterous hand 400.

[0091] This application also provides a pressure sensor 300, which includes a force-sensitive layer 100 as described in any embodiment of this application; or, the manufacturing process of the pressure sensor 300 includes a manufacturing method for the force-sensitive layer 100 as described in any embodiment of this application.

[0092] This application also provides a dexterous hand 400, which includes a force-sensitive layer 100 as described in any embodiment of this application; or, at least one phalanx of the dexterous hand 400 includes an actuator 200 as described in any embodiment of this application; or, the dexterous hand 400 includes a pressure sensor 300 as described in any embodiment of this application.

[0093] This application also provides a robot 500, which includes a force-sensitive layer 100 as described in any embodiment of this application; or, at least one phalanx of the robot 500 includes an actuator 200 as described in any embodiment of this application; or, the robot 500 includes a pressure sensor 300 as described in any embodiment of this application; or, the robot 500 includes a dexterous hand 400 as described in any embodiment of this application.

Claims

1. A force sensitive layer, characterized in that, The application is applied to a base frame which is formed with a curved surface, comprising: an insulating layer which is arranged on the curved surface of the base frame; a force sensing array which is connected to the insulating layer and is located between the curved surface of the base frame and the insulating layer; wherein the force sensing array comprises a plurality of force sensing blocks which are arranged at intervals, and gaps are formed between adjacent force sensing blocks, and the electrical parameters of the force sensing blocks change with the force.

2. The force sensitive layer of claim 1, wherein, The Shore hardness of at least one of the force sensing blocks is greater than the Shore hardness of the insulating layer. Alternatively, The elasticity of at least one of the force sensing blocks is weaker than the elasticity of the insulating layer.

3. The force sensitive layer of claim 2, wherein, At least one of the force sensing blocks comprises silica gel and conductive carbon black, the conductive carbon black is doped in the silica gel, and the mass ratio of the silica gel to the conductive carbon black ranges from 95:5 to 85:

15.

4. The force sensitive layer of claim 3, wherein, The conductive carbon black comprises acetylene carbon black and ketjen black.

5. The force sensitive layer of claim 3, wherein, The insulating layer comprises insulating silica gel, and the force sensing array and the insulating layer are integrally formed through a co-sulfurization process.

6. Force sensing layer according to any of claims 1-5, characterized in that The gaps are provided with insulating silica gel, or the gaps form air gaps.

7. An actuator, characterized by comprising: a base frame which is formed with a curved surface, and an actuator which performs an operation through the curved surface; a circuit pattern layer which is arranged on the curved surface; wherein the force sensing layer as claimed in any one of claims 1-6 is arranged on the circuit pattern layer, so as to be attached to the curved surface through the circuit pattern layer.

8. The actuator of claim 7, wherein, The circuit pattern layer comprises: a first circuit pattern which is formed on the curved surface through a laser direct forming process; an insulating film which is arranged on the first circuit pattern and is formed with a via hole; a second circuit pattern which is formed on the insulating film through a laser direct forming process, and is electrically connected to the force sensing layer, and at least a part of the second circuit pattern is electrically connected to the first circuit pattern through the via hole.

9. The actuator of claim 8, wherein, The base frame comprises PC / ABS alloy, PBT or liquid crystal polymer.

10. The effector of claim 8, wherein The insulating layer is sealingly connected to the curved surface of the base frame.

11. The effector of claim 8, wherein The actuator further comprises a circuit board which is electrically connected to the first circuit pattern and the second circuit pattern, respectively.

12. The effector of claim 11, wherein, The second circuit pattern comprises a first circuit part and a second circuit part which are arranged at intervals and are electrically connected through the force sensing blocks; The first circuit part is electrically connected to the first circuit pattern through the via hole, and the second circuit part extends to the peripheral part of the force sensing array and is electrically connected to the circuit board.

13. A method for manufacturing a force sensitive layer, characterized by, The manufacturing method of the force sensing layer comprises: providing a first slurry and a second slurry, the first slurry is used to prepare a force sensing array in the force sensing layer, and the second slurry is used to prepare an insulating layer in the force sensing layer; molding the first slurry to obtain the force sensing array; molding and co-vulcanizing the force-sensitive array and the second paste to obtain the force-sensitive array and the insulating layer in one piece, wherein the force-sensitive array comprises a plurality of force-sensitive blocks, the plurality of force-sensitive blocks are arranged at intervals, and gaps are formed between adjacent force-sensitive blocks, and the resistance of the force-sensitive blocks changes with force; molding and co-vulcanizing the force-sensitive array and the second paste to obtain the force-sensitive array and the insulating layer in one piece, wherein the force-sensitive array comprises a plurality of force-sensitive blocks, the plurality of force-sensitive blocks are arranged at intervals, and gaps are formed between adjacent force-sensitive blocks, and the resistance of the force-sensitive blocks changes with force; 14. The method for manufacturing a force sensing layer according to claim 13, wherein The molding of the first paste comprises: providing a profiled mold and a first mold, at least a part of the profiled mold is profiled according to a curved surface, and the profiled mold is adapted to the first mold; introducing the first paste into the first mold, and combining the first mold with the profiled mold; molding the first paste through the combined profiled mold and first mold.

15. The method for manufacturing a force sensing layer according to claim 14, wherein After the molding of the first paste to obtain the force-sensitive array, the method further comprises: removing the first mold while the profiled mold retains the force-sensitive array; The molding and co-vulcanizing of the force-sensitive array and the second paste comprises: providing a second mold, the second mold is adapted to the profiled mold; introducing the second paste into the second mold, and combining the profiled mold with the second mold; molding and co-vulcanizing the force-sensitive array and the second paste through the combined profiled mold and second mold.

16. The method for manufacturing a force sensing layer according to claim 14, wherein The molding of the first paste through the combined profiled mold and first mold comprises: The molding of the first paste through the combined profiled mold and first mold is performed at a temperature in the range of 60-90 degrees Celsius for 5-15 minutes.

17. The method of manufacturing a force sensing layer according to claim 13, wherein The molding and co-vulcanizing of the force-sensitive array and the second paste comprises: removing the first mold while the profiled mold retains the force-sensitive array; vulcanizing the removed material at a temperature in the range of 150-200 degrees Celsius for 2-4 hours to obtain the force-sensitive layer.

18. The method of manufacturing a force sensing layer according to claim 13, wherein The providing of the first paste and the second paste comprises: providing liquid silicone and conductive carbon black, mixing the liquid silicone and conductive carbon black at a mass ratio in the range of 95:5-85:15 to obtain the first paste.

19. The method for manufacturing a force sensing layer according to claim 18, wherein The liquid silicone is AB type liquid silicone with a viscosity in the range of 1-100 Pa·s; or The conductive carbon black is obtained by compounding ketjen black and acetylene black.

20. A pressure sensor, comprising: The pressure sensor comprises the force-sensitive layer according to any one of claims 1-6; or The manufacturing process of the pressure sensor comprises the manufacturing method of the force-sensitive layer according to any one of claims 13-18.

21. A dexterous hand characterized by, The dexterous hand comprises the force-sensitive layer according to any one of claims 1-6; or At least one finger joint of the dexterous hand comprises the actuator according to any one of claims 7-12; or The dexterous hand comprises the pressure sensor according to claim 20.

22. A robot, characterized in that The robot comprises the force-sensitive layer according to any one of claims 1-6; or At least one finger joint of the robot comprises the actuator according to any one of claims 7-12; or The robot includes the pressure sensor as claimed in claim 20; or The robot includes the dexterous hand as claimed in claim 21.

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