Wafer transfer apparatus and vertical furnace system

Abstract

The application discloses a wafer conveying device and a vertical furnace system. The wafer conveying device comprises: a taking and placing cavity which is formed by surrounding a taking and placing cavity body, and a preset position of the taking and placing cavity body is provided with a taking and placing opening which is communicated with the taking and placing cavity; a conveying cavity which is formed by surrounding a conveying cavity body, one side of the conveying cavity body is provided with a conveying opening which is communicated with the conveying cavity, the conveying cavity body is located below the taking and placing cavity body, and a connecting position of the conveying cavity body and the taking and placing cavity body is provided with a communication opening which is communicated with the taking and placing cavity and the conveying cavity; and a conveying mechanism which is installed on the conveying cavity body and can move up and down and left and right in the conveying cavity, so as to transfer a wafer in the taking and placing cavity body to a process equipment which is adjacent to the wafer conveying device, and transfer a wafer which is processed to the process equipment to the taking and placing cavity body. The interval of the clamping structure of the conveying mechanism for clamping a wafer box is adjustable, different sizes of wafer boxes can be clamped, and the equipment cost can be reduced and the production efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more particularly to a wafer transport device and a vertical furnace system. Background Technology

[0002] In recent years, with the continuous advancement of science and technology, semiconductor technology has developed rapidly, and electronic devices manufactured based on semiconductor technology are widely used in fields such as communication and computing, consumer electronics, automotive industry, industrial automation, and medical technology.

[0003] Semiconductor chip manufacturing is a highly precise process. Any particulate contamination during the production process can lead to a decrease in chip performance or even failure. Therefore, strict particulate control must be carried out during chip production.

[0004] Currently, SMIF (Standard Mechanical Interface) equipment is commonly used to transport wafers. The main process is as follows: the wafer cassette is removed from the housing through the SMIF equipment's transport structure. Then, the wafer in the wafer cassette is placed on the process equipment for processing. After processing is completed, the wafer is put back into the wafer cassette, and the wafer cassette is retrieved and placed back into the housing to reduce the risk of the wafer in the wafer cassette being contaminated by external particles.

[0005] In existing SMIF equipment, at the connection between the wafer cassette and the SMIF equipment, as the wafer cassette leaves the cassette and enters the SMIF equipment, external particles may enter the wafer cassette and contaminate the wafer.

[0006] It should also be noted that the current SMIF equipment and wafer cassette sizes are usually compatible with each other. Transferring wafer cassettes of different sizes requires the use of SMIF equipment of different specifications, which will greatly increase equipment costs. Summary of the Invention

[0007] To address the aforementioned technical problems, the present invention aims to provide a wafer transfer device and a vertical furnace system, wherein the spacing of the clamping structure of the transfer mechanism for holding wafer cassettes is adjustable, enabling it to hold wafer cassettes of different sizes, thereby reducing equipment costs and improving production efficiency.

[0008] In the wafer transport device provided in this application, when the wafer holding device is placed in the pick-and-place cavity, the edge of the box opening is covered outside the connecting port, the wafer carrier mechanism corresponds to the connecting port, and the transport mechanism is adapted to carry the wafer carrier mechanism out of the box and into the transport cavity, which can reduce the risk of contact with external particles during the wafer carrier mechanism placement process.

[0009] To achieve the above objectives, the present invention aims to provide a wafer transmission device, comprising:

[0010] The pick-and-place cavity is formed by surrounding the pick-and-place chamber, and a pick-and-place opening communicating with the pick-and-place chamber is provided at a preset position of the pick-and-place cavity. The pick-and-place opening is used for picking up and placing wafers between the wafer transfer device and external devices.

[0011] A transmission cavity is formed by surrounding the transmission cavity. One side of the transmission cavity has a transmission opening that communicates with the transmission cavity. The transmission cavity is located below the pick-and-place cavity. The connection between the transmission cavity and the pick-and-place cavity has a communication port that communicates with the pick-and-place cavity and the transmission cavity.

[0012] A transfer mechanism is installed in the transfer cavity. The transfer mechanism can move up, down, left, and right within the transfer cavity to transfer wafers in the pick-and-place cavity to a process device adjacent to the wafer transfer device, and to transfer wafers that have completed process processing from the process device to the pick-and-place cavity. The transfer mechanism has a clamping structure for holding wafer cassettes, and the spacing of the clamping structure is adjustable to hold wafer cassettes of different sizes.

[0013] In some embodiments, the bottom surface connecting the pick-and-place cavity and the transfer cavity is provided with a plurality of positions for placing the wafer holding device. The wafer holding device is adapted to be placed into the pick-and-place cavity through the pick-and-place opening. The wafer holding device includes a housing and a wafer carrying mechanism, and the housing is disposed on the outside of the wafer carrying mechanism.

[0014] When the wafer holding device is placed in the pick-and-place cavity, the edge of the opening of the housing covers the outside of the connecting port, the wafer carrying mechanism corresponds to the connecting port, and the transfer mechanism is adapted to carry the wafer carrying mechanism away from the housing and into the transfer cavity.

[0015] In some embodiments, the transfer mechanism includes two clamping arms, each adapted to clamp on one side of the wafer carrier mechanism to carry the wafer carrier mechanism away from the housing and into the transfer cavity, and the distance between the two clamping arms can be adjusted according to the width of the wafer carrier mechanism.

[0016] In some embodiments, the transmission mechanism includes a first transmission mechanism and a second transmission mechanism, and the wafer carrier mechanism includes a base and a wafer cassette located on the base; the first transmission mechanism is located below the communication port and is used to support the base to adjust the height of the wafer carrier mechanism;

[0017] The second transfer mechanism includes two clamping arms. After the first transfer mechanism supports the base so that the wafer cassette enters the transfer cavity, the two clamping arms are adapted to clamp the wafer cassette to transfer the wafer cassette from the transfer cavity to the transfer opening.

[0018] In some embodiments, the second transmission mechanism includes a base slidably mounted within the transmission cavity, and a clamping arm slidably mounted on the base. Sliding the clamping arm relative to the base can change the distance between the two clamping arms.

[0019] In some embodiments, the second transmission mechanism further includes a telescopic component and a guide rail, the guide rail being mounted on the base, the bottom of the clamping arm being slidably mounted on the guide rail, the telescopic component being mounted on the base and disposed on one side of the guide rail, and the telescopic component being connected to the clamping arm, the telescopic component being able to drive the clamping arm to slide along the guide rail when it extends or retracts.

[0020] In some embodiments, the second transmission mechanism further includes a first link and a second link, wherein there are two second links, the middle position of the first link is rotatably connected to the base, both ends of the first link are rotatably connected to the two second links respectively, and the ends of the two second links away from the first link are rotatably connected to the two clamping arms respectively; the rotatable connection between the first link and the second link is rotatably connected to one end of the telescopic assembly.

[0021] In some embodiments, the transmission mechanism further includes a clamping block disposed at a preset position of the clamping arm, the clamping block extending a preset length from the clamping arm toward another clamping arm;

[0022] The wafer cassette has clamping grooves on both sides corresponding to the clamping arm. When the clamping arm clamps the wafer cassette, the clamping block is adapted to enter the clamping groove.

[0023] In some embodiments, the transmission mechanism further includes an orientation adjustment component mounted on the clamping arm, and the clamping block mounted on the orientation adjustment component. The orientation adjustment component can drive the clamping block to move relative to the clamping arm to adjust the orientation of the clamping block relative to the clamping arm.

[0024] In some embodiments, the orientation adjustment assembly includes a mounting plate and a drive unit, the drive unit including a servo motor, the mounting plate being mounted on the clamping arm, the drive unit being mounted on the mounting plate, and the output shaft of the drive unit being connected to the clamping block, the drive unit being capable of moving the clamping block.

[0025] According to another aspect of this application, a vertical furnace system is further provided, comprising:

[0026] The wafer transfer device described in any of the above claims;

[0027] A vertical furnace device is installed on one side of the wafer transfer device, and the wafer temporary storage stack of the vertical furnace device is correspondingly arranged with the transfer opening of the transfer cavity. The transfer mechanism is adapted to transfer the wafer cassette loaded with wafers to the wafer temporary storage stack. Attached Figure Description

[0028] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of the present invention.

[0029] Figure 1 This is a three-dimensional structural schematic diagram of a wafer transmission device according to a preferred embodiment of the present invention.

[0030] Figure 2 This is a three-dimensional structural schematic diagram of a wafer transmission device according to a preferred embodiment of the present invention from another perspective;

[0031] Figure 3 This is a schematic diagram of the installation structure of the wafer holding device of the wafer transport device according to a preferred embodiment of the present invention;

[0032] Figure 4 This is an exploded structural diagram of the wafer holding device of a preferred embodiment of the wafer transport apparatus of the present invention.

[0033] Figure 5 This is an exploded structural diagram of the wafer holding device of the wafer transport apparatus according to a preferred embodiment of the present invention.

[0034] Figure 6 This is a three-dimensional structural diagram of the wafer holding device of the wafer transport device according to a preferred embodiment of the present invention;

[0035] Figure 7 This is a three-dimensional structural diagram of the base of the wafer holding device of the wafer transport equipment according to a preferred embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of the first support plate of the wafer transfer device according to a preferred embodiment of the present invention;

[0037] Figure 9 This is a three-dimensional structural diagram of the transmission mechanism of a wafer transmission device according to a preferred embodiment of the present invention;

[0038] Figure 10This is a three-dimensional structural diagram of a preferred embodiment of the wafer transport device of the present invention, showing the wafer carrier mechanism mounted on the first transport mechanism from one perspective.

[0039] Figure 11 This is a three-dimensional structural diagram of a preferred embodiment of the wafer transport device of the present invention, showing the wafer carrier mechanism installed on the first transport mechanism from another perspective.

[0040] Figure 12 This is a three-dimensional structural schematic diagram of the first transmission mechanism of the wafer transmission device according to a preferred embodiment of the present invention.

[0041] Figure 13 This is a three-dimensional structural schematic diagram of the first transmission mechanism of the wafer transmission device according to a preferred embodiment of the present invention from another perspective.

[0042] Figure 14 This is a three-dimensional structural schematic diagram of the second transmission mechanism of the wafer transmission device according to a preferred embodiment of the present invention.

[0043] Figure 15 This is a three-dimensional structural schematic diagram of the second transmission mechanism of the wafer transmission device according to a preferred embodiment of the present invention;

[0044] Figure 16 This is a schematic diagram of a portion of the structure of the second transmission mechanism of a wafer transmission device according to a preferred embodiment of the present invention;

[0045] Figure 17 This is a schematic diagram of the orientation adjustment component of the wafer transmission device of the present invention installed on the clamping arm according to a preferred embodiment of the present invention;

[0046] Figure 18 This is a schematic diagram of the orientation adjustment component of a wafer transmission device according to a preferred embodiment of the present invention.

[0047] Icon labels:

[0048] 100. Wafer transfer device; 10. Device body; 11. Pick-and-place cavity; 110. Pick-and-place cavity; 111. Pick-and-place opening; 12. Transfer cavity; 120. Transfer cavity; 121. Transfer opening; 13. Connecting port; 14. Limiting frame; 20. Transfer mechanism; 21. Clamping arm; 211. Clamping block; 2111. Base block; 2112. Buffer pad; 22. First transfer mechanism; 221. First support plate; 2211. Locking protrusion; 2212. Limiting protrusion; 2213. First connecting block; 222. Locking drive component; 223. Driving block; 224. First drive assembly; 2241. First drive component; 2242. First driving wheel; 2243. First driven wheel; 2244. First transmission belt; 225. First screw; 226. First slider; 227. First sliding... 23. Rail; 23. Second transmission mechanism; 231. Base; 2311. Second connecting block; 2312. Second slide rail; 2313. Second slider; 232. Second drive assembly; 2321. Second drive component; 2322. Second driving wheel; 2323. Second driven wheel; 2324. Second transmission belt; 233. Second screw; 234. Telescopic assembly; 2341. Telescopic cylinder; 2342. Telescopic rod; 235. Guide rail; 236. First connecting rod; 237. Second connecting rod; 238. Cable chain; 24. Orientation adjustment assembly; 241. Mounting plate; 242. Drive component; 200. Wafer holding device; 201. Box cover; 202. Wafer carrying mechanism; 2021. Base; 2020. Locking slot; 2024. Limiting slot; 2022. Wafer box; 2023. Clamping slot. Detailed Implementation

[0049] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0050] To keep the drawings concise, each figure only schematically shows the parts relevant to the invention, and these do not represent the actual structure of the product. Furthermore, to facilitate understanding, in some figures, only one of components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0051] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0052] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0053] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0054] refer to Figures 1 to 18 This application provides a wafer transfer device 100, which includes a device body 10. The device body 10 includes a pick-and-place cavity 11 and a transfer cavity 12. The pick-and-place cavity 11 forms a pick-and-place chamber 110. A preset position of the pick-and-place cavity 11 has a pick-and-place opening 111 communicating with the pick-and-place chamber 110. The pick-and-place opening 111 is used for picking and placing wafers between the wafer transfer device 100 and external devices, and more specifically, for picking and placing wafer cassettes 2022 containing wafers. Preferably, the pick-and-place cavity 11 and the transfer cavity 12 are two spaces separated by an upper and lower space within the same metal housing. The bottom surface where the pick-and-place cavity 11 and the transfer cavity 12 connect is provided with a plurality of positions for placing wafer holding devices, such as one or two. The wafer placement device 200 is adapted to be placed into the pick-and-place cavity 110 through the pick-and-place opening 111, and to be removed from the wafer transport device 100 through the pick-and-place opening 111. The wafer placement device 200 includes a housing 201 and a wafer carrier mechanism 202, the housing 201 covering the outside of the wafer carrier mechanism 202.

[0055] In other words, the wafer holding device 200 in the external device can be placed into the picking cavity 110 through the picking opening 111, or the wafer holding device 200 can be taken out from the picking cavity 110 to the external device, and the wafer holding device 200 is used to carry the wafer.

[0056] Preferably, the pick-and-place opening 111 is located at the top of the pick-and-place cavity 11, and the external device is, for example but not limited to, an OHT system. The pick-and-place opening 111 located at the top can interface with the OHT system (Overhead Hoist Transport, often referred to as a crane transport system) to receive wafers transferred from the OHT system and to reconnect wafers that have undergone processing to the OHT system. In some modified embodiments, the pick-and-place opening 111 can also be located on one side of the pick-and-place cavity 11. As long as the wafer placement device 200 can be used for picking and placing, the location of the pick-and-place opening 111 within the pick-and-place cavity 11 should not constitute a limitation of this application.

[0057] The transfer cavity 12 surrounds and forms a transfer cavity 120. One side of the transfer cavity 12 has a transfer opening 121 that communicates with the transfer cavity 120. The transfer cavity 12 is located below the pick-and-place cavity 11. The connection between the transfer cavity 12 and the pick-and-place cavity 11 has a communication port 13 that communicates the pick-and-place cavity 110 and the transfer cavity 120. The communication port 13 is opened on the aforementioned bottom surface (that is, the bottom of the pick-and-place cavity 11) and corresponds one-to-one with the position where the wafer holding device 200 is placed.

[0058] refer to Figure 3 , Figure 4 , Figure 5 as well as Figure 6 The cover 201 is disposed on the outside of the wafer carrier 202, which is used to place wafers, and the cover 201 can provide airtight protection on the outside of the wafer carrier 202.

[0059] Specifically, the wafer carrier mechanism 202 includes a base 2021 and a wafer cassette 2022. The wafer cassette 2022 is placed on the base 2021. When the cover 201 is placed over the wafer carrier mechanism 202, the wafer cassette 2022 is located inside the cover 201. The base 2021 is located at the opening of the cover 201. The base 2021 can seal the opening of the cover 201, so that the wafer cassette 2022 is located in a relatively enclosed space.

[0060] When the wafer holding device 200 is placed in the pick-and-place cavity 110, the edge of the opening of the housing 201 covers the outside of the connecting port 13, and the wafer carrying mechanism 202 corresponds to the connecting port 13. After the housing 201 is separated from the base 2021, the base 2021 is adapted to carry the wafer cassette 2022 away from the housing 201 and descend through the connecting port 13 into the transfer cavity 120. A limiting frame 14 is provided around the outer periphery of the connecting port 13 facing the pick-and-place opening 111 at a predetermined position. The limiting frame 14 surrounds the outside of the housing 201, which facilitates the alignment of the wafer carrying mechanism 202 with the connecting port 13.

[0061] refer to Figure 9 The wafer transfer device 100 further includes a transfer mechanism 20, which is installed within the transfer cavity 120 of the transfer chamber 12. The transfer mechanism 20 is capable of moving up, down, left, and right within the transfer cavity 120. In this invention, the transfer mechanism 20 has a lifting component and a translation component, thus allowing it to move in the up, down, left, and right directions to transfer wafers from the pick-and-place cavity 11 to a process device adjacent to the wafer transfer device 100, and to transfer wafers that have completed processing from the process device to the pick-and-place cavity 11. Simultaneously, the transfer mechanism 20 has a clamping structure for holding the wafer cassette 2022, and the spacing of the clamping structure is adjustable to hold wafer cassettes 2022 of different sizes. This allows the wafer transfer device 100 provided by this invention to be adapted to devices of various sizes, helping to reduce equipment costs for customers.

[0062] In some examples, the clamping mechanism of the transmission mechanism 20 includes two clamping arms 21, which are respectively adapted to clamp on both sides of the wafer cassette 2022 to carry the wafer carrier mechanism 202 away from the cassette cover 201 and into the transmission cavity 120, and the distance between the two clamping arms 21 can be adjusted according to the width of the wafer cassette.

[0063] Further, the transmission mechanism 20 includes a first transmission mechanism 22 and a second transmission mechanism 23. The first transmission mechanism 22 is located below the communication port 13 and is used to support the base 2021 to adjust the height of the wafer carrier 202, so that the wafer carrier 202 can enter the transmission cavity 120 from the housing 201 or from the transmission cavity 120 into the housing 201. The second transmission mechanism 23 includes two clamping arms 21. After the first transmission mechanism 22 supports the base 2021 so that the wafer housing 2022 enters the transmission cavity 120, the two clamping arms 21 are adapted to clamp the wafer housing 2022 to transfer the wafer housing 2022 from the transmission cavity 120 to the transmission opening 121. In other words, the first transmission mechanism 22 is used to adjust the height of the wafer carrier mechanism 202 in the vertical direction, and the second transmission mechanism 23 is used to adjust the distance between the wafer box 2022 and the transmission opening 121 in the horizontal direction. The cooperation between the two can achieve more precise position adjustment.

[0064] refer to Figure 10 , Figure 11 , Figure 12 as well as Figure 13 The first transmission mechanism 22 includes a first support plate 221, which is vertically and flexibly installed within the transmission cavity 120. The position of the first support plate 221 corresponds to the position of the connecting port 13, and the size of the first support plate 221 is larger than the size of the connecting port 13. The first support plate 221 is adapted to support the wafer carrier mechanism 202, so as to drive the wafer carrier mechanism 202 from the housing 201 into the transmission cavity 120 or from the transmission cavity 120 into the housing 201. Before the wafer placement device 200 is placed in the pick-and-place cavity 110, the first support plate 221 is adapted to rise to the connection between the pick-and-place cavity 110 and the transmission cavity 120, and block the connecting port 13 to separate the pick-and-place cavity 110 from the transmission cavity 120. When the wafer placement device 200 is positioned within the pick-and-place cavity 110 corresponding to the communication port 13, the housing 201 is adapted to block the communication port 13 on one side of the pick-and-place cavity 110. As the height of the first support plate 221 decreases, causing the wafer carrier mechanism 202 to leave the housing 201 and enter the transfer cavity 120, the housing 201 blocks the communication port 13 on one side of the pick-and-place cavity 110. The pick-and-place cavity 110 and the transfer cavity 120 are always separated from each other, reducing the risk of contamination of the wafer cassette 2022 by contact with external particles.

[0065] Furthermore, the base 2021 and the cover 201 are detachably connected by a snap-fit ​​mechanism. For example, in some examples, a snap-fit ​​plate (not shown in the figure) is movably installed inside the base 2021. The snap-fit ​​plate moves within the base 2021 so that its end extends from one side of the base 2021 into a snap-fit ​​groove on the side wall of the cover 201, thus snapping the base 2021 and the cover 201 together. When the snap-fit ​​plate moves within the base 2021 so that its end retracts into the base 2021, the end of the snap-fit ​​plate leaves the snap-fit ​​groove on the side wall of the cover 201, and the base 2021 and the cover 201 can be separated.

[0066] The base 2021 has a locking groove 2020 on the side away from the wafer box 2022. A rotating block (not shown in the figure) is installed in the locking groove 2020, and the rotating block is connected to the snap-fit ​​plate. When the rotating block rotates in the locking groove 2020, it can drive the snap-fit ​​plate to move in the base 2021. This allows for easy control of the end of the snap-fit ​​plate extending or retracting from one side of the base 2021.

[0067] The first support plate 221 has a locking protrusion 2211 on one side supporting the wafer carrier mechanism 202. When the first support plate 221 supports the wafer carrier mechanism 202, the locking protrusion 2211 is adapted to be inserted into the locking groove 2020 and can drive the rotating block to rotate, so as to control the end of the snap-fit ​​plate to extend or retract from one side of the base 2021.

[0068] refer to Figure 8 The first transmission mechanism 22 further includes a locking drive component 222 and a driving block 223. The driving block 223 is rotatably mounted within the first support plate 221. One end of the locking protrusion 2211 is connected to the driving block 223, and the driving block 223 is mounted on the output shaft of the locking drive component 222. The locking drive component 222 can drive the driving block 223 to rotate within the first support plate 221. The locking drive component 222 can be either a rotary cylinder or a motor.

[0069] When it is necessary to transfer the wafer carrier mechanism 202 from the housing 201 to the transmission cavity 120, the first support plate 221 is raised to the communication port 13, and the locking protrusion 2211 is inserted into the locking groove 2020 accordingly; the locking drive 222 is controlled to drive the locking protrusion 2211 to rotate along a preset direction, so that the rotating block in the base 2021 retracts, so that the wafer carrier mechanism 202 is separated from the housing 201, and the height of the first support plate 221 is lowered, so that the wafer carrier mechanism 202 moves from the housing 201 into the transmission cavity 120. Accordingly, when it is necessary to transfer the wafer carrier mechanism 202 from the transfer cavity 120 back to the housing 201, the first support plate 221 is controlled to support the wafer carrier mechanism 202 and raise it to the communication port 13. The locking drive 222 is controlled to work and drive the locking protrusion 2211 to rotate in the opposite direction, so that the rotating block in the base 2021 extends to the snap-fit ​​groove on the housing 201, and the wafer carrier mechanism 202 and the housing 201 snap into each other.

[0070] refer to Figure 8 Furthermore, a limiting protrusion 2212 is provided at a predetermined position on one side of the first support plate 221 where the locking protrusion 2211 is located, and a limiting groove 2024 is provided on the base 2021 corresponding to the position of the limiting protrusion 2212. When the first support plate 221 supports the base 2021, the limiting protrusion 2212 is adapted to be inserted into the limiting groove 2024, so that the position of the first support plate 221 and the position of the base 2021 are aligned with each other.

[0071] refer to Figures 10 to 13 The first transmission mechanism 22 further includes a first drive assembly 224 and a first screw 225. The first screw 225 is disposed within the transmission cavity 120, and the length extension direction of the first screw 225 is the same as the height direction of the transmission cavity 120. A first connecting block 2213 is provided on one side of the first support plate 221. The first connecting block 2213 is sleeved on the first screw 225 and threadedly engaged with it. When the first screw 225 rotates, it can drive the first connecting block 2213 to slide along the length extension direction of the first screw 225, thereby changing the height of the first support plate 221.

[0072] The first drive assembly 224 is connected to the first screw 225 and is used to drive the first screw 225 to rotate. Specifically, the first drive assembly 224 includes a first drive member 2241, a first driving wheel 2242, a first driven wheel 2243, and a first transmission belt 2244. The first driving wheel 2242 is mounted on the output shaft of the first drive member 2241, the first driven wheel 2243 is mounted on the first screw 225, one end of the first transmission belt 2244 is sleeved on the first driving wheel 2242, and the other end is sleeved on the first driven wheel 2243. When the first drive member 2241 is working, it can drive the first screw 225 to rotate. Preferably, the first drive member 2241 is a motor.

[0073] refer to Figure 10 and Figure 12 The first transmission mechanism 22 further includes a first slider 226 and a first slide rail 227. The first slide rail 227 is disposed on the inner wall of the transmission cavity 120, and the length extension direction of the first slide rail 227 is the same as the length extension direction of the first screw 225. One end of the first slider 226 is connected to the first connecting block 2213, and the other end is slidably mounted on the first slide rail 227. When the first driving member 2241 drives the first screw 225 to rotate, the first screw 225 rotates relative to the first connecting block 2213 while driving the first connecting block 2213 to move up and down. The first connecting block 2213 drives the first slider 226 to slide up and down along the length extension direction of the first slide rail 227. Through the cooperation of the first slider 226 and the first slide rail 227, the stability of the first support plate 221 when it moves up and down along the first screw 225 can be improved.

[0074] refer to Figure 14 and Figure 15The second transfer mechanism 23 includes a base 231, and the clamping arms 21 are slidably mounted on the base 231. Sliding the clamping arms 21 relative to the base 231 changes the distance between the two clamping arms 21, allowing them to clamp wafer carrier mechanisms 202 of different sizes. The base 231 is slidably mounted within the transfer cavity 120. When the base 231 slides relative to the transfer cavity 120, it changes its position relative to the transfer opening 121 to facilitate subsequent processing of the wafers carried by the wafer cassette 2022. When adjusting the width of the two clamping arms 21 to accommodate wafer cassettes 2022 of different sizes, the two clamping arms 21 slide relative to the base 231. When clamping wafer cassettes 2022 of different sizes, the contact area between the clamping arms 21 and the wafer cassette 2022 remains essentially unchanged, which helps to control the force exerted by the clamping arms 21 on the wafer cassette 2022 and avoids excessive or insufficient clamping force.

[0075] Specifically, the second transmission mechanism 23 further includes a second drive assembly 232 and a second screw 233. The second screw 233 is disposed within the transmission cavity 120, with one end of the second screw 233 near the transmission opening 121 and the other end near the first transmission mechanism 22. The base 231 is slidably mounted on the second screw 233. A second connecting block 2311 is provided at a predetermined position on the base 231. The second connecting block 2311 is sleeved on the second screw 233, and the second connecting block 2311 has a thread that mates with the second screw 233. When the second screw 233 rotates, it can drive the second connecting block 2311 to slide along the length extension direction of the second screw 233.

[0076] The second drive assembly 232 is connected to the second screw 233 and is used to drive the second screw 233 to rotate. Specifically, the second drive assembly 232 includes a second drive member 2321, a second drive wheel 2322, a second driven wheel 2323, and a second transmission belt 2324. The second drive wheel 2322 is mounted on the power output shaft of the second drive member 2321, the second driven wheel 2323 is mounted on the second screw 233, one end of the second transmission belt 2324 is sleeved on the second drive wheel 2322, and the other end is sleeved on the second driven wheel 2323. When the second drive member 2321 is working, it can drive the second screw 233 to rotate, and the rotating second screw 233 can drive the base 231 to move. Preferably, the second drive member 2321 is a motor.

[0077] The second transmission mechanism 23 further includes a second slide rail 2312 installed within the transmission cavity 120. The second slide rail 2312 is disposed on one side of the second screw 233, and the length extension direction of the second slide rail 2312 is the same as the length extension direction of the second screw 233. The second transmission mechanism 23 further includes a second slider 2313 installed at the bottom of the base 231. The second slider 2313 is adapted to the second slide rail 2312 and is slidably mounted on the second slide rail 2312. When the second connecting block 2311 slides along the second screw 233, the cooperation between the second slider 2313 and the second slide rail 2312 improves the stability of the base 231 during movement.

[0078] refer to Figure 16 The distance between the two clamping arms 21 can be changed by controlling the sliding of the clamping arm 21 relative to the base 231. In some modified embodiments, the distance between the ends of the two clamping arms 21 can be changed by controlling the rotation of the clamping arm 21 relative to the base 231, so as to achieve the purpose of clamping the second transmission mechanism 23 of different sizes.

[0079] refer to Figure 16 Specifically, the second transmission mechanism 23 further includes a telescopic component 234 and a guide rail 235. The guide rail 235 is mounted on the base 231, and the bottom of the clamping arm 21 is slidably mounted on the guide rail 235. The telescopic component 234 is mounted on the base 231 and disposed on one side of the guide rail 235. The telescopic component 234 is connected to the clamping arm 21, and when the telescopic component 234 extends or retracts, it can drive the clamping arm 21 to slide along the guide rail 235.

[0080] Specifically, the telescopic assembly 234 includes a telescopic cylinder 2341 and a telescopic rod 2342. The telescopic cylinder 2341 is disposed on one side of the guide rail 235. One end of the telescopic rod 2342 is connected to the clamping arm 21, and the other end is connected to the telescopic cylinder 2341. When the telescopic rod 2342 extends or retracts relative to the telescopic cylinder 2341, it can drive the clamping arm 21 to slide relative to the base 231. The second transmission mechanism 23 also includes a cable chain 238. One end of the cable chain 238 is connected to the telescopic cylinder 2341, and the other end is connected to a preset part of the transmission cavity 12. The pipeline and / or circuit controlling the operation of the telescopic cylinder 2341 is disposed in the cable chain 238. The cable chain 238 can deform accordingly with the reciprocating motion of the base 231, providing traction and protection for the corresponding pipeline and / or circuit.

[0081] Furthermore, the second transmission mechanism 23 also includes a first connecting rod 236 and a second connecting rod 237, wherein there are two second connecting rods 237. The middle position of the first connecting rod 236 is rotatably connected to the base 231, and both ends of the first connecting rod 236 are rotatably connected to the two second connecting rods 237 respectively. The ends of the two second connecting rods 237 away from the first connecting rod 236 are rotatably connected to the two clamping arms 21 respectively. The rotatable connection between the first connecting rod 236 and the second connecting rod 237 is rotatably connected to one end of the telescopic rod 2342. When the telescopic rod 2342 extends or retracts relative to the telescopic cylinder 2341, the first connecting rod 236 rotates relative to the base 231, and the two ends of the first connecting rod 236 drive the two second connecting rods 237 to pull the two clamping arms 21 closer to each other or push the two clamping arms 21 away from each other. Through the cooperation between the first link 236, the second link 237 and the telescopic assembly 234, when one telescopic cylinder 2341 is activated, it can simultaneously drive two clamping arms 21 to slide relative to the base 231. On the one hand, this can reduce the number of telescopic cylinders 2341 and reduce costs. On the other hand, the two clamping arms 21 move synchronously, and the stroke difference between the two clamping arms 21 is small, which helps to improve the stability when clamping the wafer cassette 2022.

[0082] refer to Figure 16 The transmission mechanism 20 further includes a clamping block 211 disposed at a preset position on the clamping arm 21, the clamping block 211 extending a preset length from the clamping arm 21 toward another clamping arm 21. (Reference) Figure 10 The wafer carrier mechanism 202 has a clamping groove 2023 corresponding to the position of the clamping arm 21. When the clamping arm 21 clamps the wafer carrier mechanism 202, the clamping block 211 is adapted to enter the clamping groove 2023. The cooperation between the clamping block 211 and the clamping groove 2023 improves the stability of the clamping arm 21 when clamping the wafer carrier mechanism 202. Preferably, the clamping groove 2023 is formed at the bottom of the wafer cassette 2022.

[0083] refer to Figure 17 and Figure 18 The transmission mechanism 20 further includes an orientation adjustment component 24, which is mounted on the clamping arm 21. The clamping block 211 is mounted on the orientation adjustment component 24. The orientation adjustment component 24 can drive the clamping block 211 to move relative to the clamping arm 21 to adjust the orientation of the clamping block 211 relative to the clamping arm 21 and improve the stability of the clamping block 211 when it contacts the wafer carrier mechanism 202.

[0084] In some examples, the orientation adjustment component 24 is implemented as an angle adjustment component for adjusting the angle of the clamping block 211 relative to the clamping arm 21. Specifically, the orientation adjustment component 24 includes a mounting plate 241 and a drive member 242. The mounting plate 241 is mounted on the clamping arm 21, and the drive member 242 is mounted on the mounting plate 241. The output shaft of the drive member 242 is connected to the clamping block 211, and the drive member 242 can drive the clamping block 211 to rotate, thereby adjusting the angle of the clamping block 211 relative to the clamping arm 21. Preferably, the drive member 242 includes a servo motor, which can flexibly and precisely adjust the clamping angle of the clamping block 211 as needed, for example, according to the external conditions of the wafer cassette 2022, providing more stable clamping of the wafer cassette 2022 and avoiding damage to the external structure of the wafer cassette. The number of drive members 242 matches the number of clamping blocks. For example, there are two driving members 242 on one side, and there are also two clamping blocks 211. The two clamping blocks 211 are installed on the output shafts of the two driving members 242 respectively. When the driving member 242 drives the clamping block 211 to rotate, the angle between the two clamping blocks 211 will also change.

[0085] In some modified embodiments, the orientation adjustment component 24 is implemented as a distance adjustment component for adjusting the position of the clamping block 211 relative to the clamping arm 21. For example, the orientation adjustment component 24 includes a drive member, a threaded rod, and a screw block. The output shaft of the drive member is connected to the threaded rod, the screw block is slidably mounted on the threaded rod, and the clamping block 211 is mounted on the screw block. When the drive member drives the threaded rod to rotate, the threaded rod can drive the screw block and the clamping block 211 to slide along the length extension direction of the threaded rod. Preferably, there are two orientation adjustment components 24 and two clamping blocks 211 on each side. The distance between the two clamping blocks 211 is adjusted based on the size of the wafer carrier mechanism 202, so that the transmission mechanism 20 can better support the wafer carrier mechanism 202.

[0086] It should be noted that a tag marking the wafer information inside the wafer cassette 2022 is usually provided at a preset position on the outside of the wafer cassette 2022, such as, but not limited to, RFID tags for marking wafer batch information. By adjusting the orientation of the clamping block 211 relative to the clamping arm 21 through the orientation adjustment component 24, especially through the aforementioned angle condition component including the servo motor, the contact position between the clamping block 211 and the wafer cassette 2022 can be changed, avoiding contact with the tag or reducing the contact area with the tag, thereby reducing the risk of damage to the tag. Controlling the drive component 242 can also adjust the rotation or movement speed of the clamping block 211, which can increase the stability when connected to the wafer cassette 2022.

[0087] Furthermore, in the preferred example of this application, the base 2021 used for different specifications of POD boxes (6-inch / 8-inch / 12-inch), i.e., box covers, has the same size, or the size of the base is fixed. For example, the base size is adapted to a 12-inch box cover, while the size of the box cover and the wafer cell 2022 inside is adjusted according to usage requirements, provided that the wafer cell size is not larger than the box cover size. With a fixed clamping space, the orientation adjustment component 24 is used to drive the clamping block 211 to increase or decrease the clamping stroke. Through this configuration and coordination, the equipment is compatible with different specifications of POD boxes and / or wafer cells, helping to reduce customer equipment costs.

[0088] refer to Figure 18 The clamping block 211 further includes a base block 2111 and a buffer pad 2112. The buffer pad 2112 is disposed at the end of the base block 2111 away from the mounting plate 241, and can provide cushioning between the base block 2111 and the wafer cassette 2022 when the clamping block 211 clamps the wafer cassette 2022, reducing the risk of damage to the wafer cassette 2022. Specifically, the end of the base block 2111 away from the mounting plate 241 is a stepped surface, and the buffer pad 2112 is installed on the stepped surface and has a matching stepped surface. The clamping block 211 is preferably a hard metal block such as stainless steel, and the buffer pad is, for example, a wear-resistant rubber material such as PEEK, to provide stable support for the wafer cassette 2022 and prevent damage to the wafer cassette (the material is generally a plastic material such as PTFE or PEEK). In addition, it can also avoid direct contact between metal materials, which can cause metal particle precipitation and contamination, reduce the transfer of static electricity, and further improve the safety and cleanliness of the wafer transport process.

[0089] In some modified embodiments, the transfer mechanism 20 includes a robotic arm, which adjusts the height of the wafer carrier 202 in the vertical direction and the distance of the wafer carrier 202 relative to the transfer opening 121 in the horizontal direction. For example, but not limited to, the robotic arm is a two-axis robotic arm or a three-axis or higher robotic arm. When the robotic arm is a two-axis robotic arm, it includes a robotic arm, a rotating component, and a lifting component. The robotic arm is mounted on the rotating component, which can drive the robotic arm to rotate to adjust its angle. The rotating component is mounted on the lifting component, which can adjust the angle between the rotating component and the robotic arm. Preferably, the base 231 is disposed at the end of the robotic arm, and the two gripping arms 21 are slidably mounted on the base 231, so that the end of the robotic arm carries the wafer carrier 202 in a gripping manner. Optionally, the end of the robotic arm is provided with a support plate, which is similar to the first support plate, so that the end of the robotic arm supports the wafer carrier mechanism 202 in a supporting manner.

[0090] According to another aspect of this application, a vertical furnace system is further provided, comprising: the wafer transfer device 100 and the vertical furnace device described above, wherein the vertical furnace device is installed on one side of the wafer transfer device 100, and the wafer temporary storage stack of the vertical furnace device is disposed adjacent to the transfer opening 121 of the transfer cavity 12, and the transfer mechanism 20 is adapted to transfer a wafer cassette loaded with wafers to the wafer temporary storage stack. For example, in a specific application, an OHT system (Overhead Hoist Transport) is used to place the housing 201, which carries the wafer carrier 202, from the pick-and-place opening 111 into the pick-and-place cavity 110 of the pick-and-place chamber 11. The wafer cassette 2022 of the wafer carrier 202 contains wafers. The locking drive 222 is activated to separate the wafer carrier 202 from the housing 201. The height of the wafer carrier 202 is lowered by the first transfer mechanism 22, and the wafer carrier 202 is transferred to the transfer opening 121 by the second transfer mechanism 23. After that, the wafer cassette 2022 containing the wafers is transferred to the wafer temporary storage stack of the vertical furnace equipment, where the wafers await entry into the vertical reactor for processing. The wafers that have completed the process in the vertical furnace are loaded into wafer cassettes in the loading and unloading area of ​​the vertical furnace. Then, the wafer cassettes carrying the processed wafers are transported back to the base by the second transfer mechanism 23 and the first transfer mechanism 22 of the wafer transfer equipment and raised to be covered by the cassette cover 201. They are then transferred to the next process stage for processing via the OHT system.

[0091] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the invention. The advantages of the present invention have been fully and effectively realized. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments; any variations or modifications can be made to the implementation of the present invention without departing from these principles.

Claims

1. A wafer transmission device, characterized in that, include: The pick-and-place cavity is formed by surrounding the pick-and-place chamber. The pick-and-place cavity has a pick-and-place opening at a preset position that communicates with the pick-and-place chamber. The pick-and-place opening is used for picking up and placing wafers between the wafer transfer device and external devices. A transmission cavity is formed by surrounding the transmission cavity. One side of the transmission cavity has a transmission opening that communicates with the transmission cavity. The transmission cavity is located below the pick-and-place cavity. The connection between the transmission cavity and the pick-and-place cavity has a communication port that communicates with the pick-and-place cavity and the transmission cavity. A transfer mechanism is installed in the transfer cavity. The transfer mechanism can move up, down, left, and right within the transfer cavity to transfer wafers in the pick-and-place cavity to a process device adjacent to the wafer transfer device, and to transfer wafers that have completed process processing from the process device to the pick-and-place cavity. The transfer mechanism has a clamping structure for clamping wafer cassettes, and the spacing of the clamping structure is adjustable to clamp wafer cassettes of different sizes. The transmission mechanism includes a second transmission mechanism, which includes two clamping arms, and the distance between the two clamping arms can be adjusted according to the width of the wafer cassette. The second transmission mechanism includes a base, which is slidably mounted in the transmission cavity, and a clamping arm is slidably mounted on the base. Sliding the clamping arm relative to the base can change the distance between the two clamping arms. The second transmission mechanism further includes a telescopic component and a guide rail. The guide rail is mounted on the base, and the bottom of the clamping arm is slidably mounted on the guide rail. The telescopic component is mounted on the base and disposed on one side of the guide rail. The telescopic component is connected to the clamping arm. When the telescopic component extends or retracts, it can drive the clamping arm to slide along the guide rail. The second transmission mechanism further includes a first link and a second link, wherein there are two second links, the middle position of the first link is rotatably connected to the base, both ends of the first link are rotatably connected to the two second links respectively, and the ends of the two second links away from the first link are rotatably connected to the two clamping arms respectively; the rotatable connection between the first link and the second link is rotatably connected to one end of the telescopic assembly.

2. The wafer transfer device according to claim 1, characterized in that, The bottom surface connecting the pick-and-place cavity and the transfer cavity is provided with several positions for placing the wafer holding device. The wafer holding device is adapted to be placed into the pick-and-place cavity through the pick-and-place opening. The wafer holding device includes a cover and a wafer carrying mechanism. The cover is disposed on the outside of the wafer carrying mechanism. When the wafer holding device is placed in the pick-and-place cavity, the edge of the opening of the housing covers the outside of the connecting port, the wafer carrying mechanism corresponds to the connecting port, and the transfer mechanism is adapted to carry the wafer carrying mechanism away from the housing and into the transfer cavity; the two clamping arms are respectively adapted to clamp the two sides of the wafer carrying mechanism to carry the wafer carrying mechanism away from the housing and into the transfer cavity.

3. The wafer transfer device according to claim 2, characterized in that, The transmission mechanism further includes a first transmission mechanism, and the wafer carrier mechanism includes a base and a wafer cassette located on the base; the first transmission mechanism is located below the communication port and is used to support the base to adjust the height of the wafer carrier mechanism; After the first transfer mechanism supports the base so that the wafer cassette enters the transfer cavity, the two clamping arms are adapted to clamp the wafer cassette to transfer the wafer cassette from the transfer cavity to the transfer opening.

4. The wafer transfer device according to any one of claims 1 to 3, characterized in that, The transmission mechanism further includes a clamping block disposed at a preset position of the clamping arm, the clamping block extending a preset length from the clamping arm toward the other clamping arm; The wafer cassette has clamping grooves on both sides corresponding to the clamping arm. When the clamping arm clamps the wafer cassette, the clamping block is adapted to enter the clamping groove.

5. The wafer transfer device according to claim 4, characterized in that, The transmission mechanism further includes an orientation adjustment component, which is mounted on the clamping arm. The clamping block is mounted on the orientation adjustment component. The orientation adjustment component can drive the clamping block to move relative to the clamping arm to adjust the orientation of the clamping block relative to the clamping arm.

6. The wafer transfer device according to claim 5, characterized in that, The orientation adjustment assembly includes a mounting plate and a drive component. The drive component includes a servo motor. The mounting plate is mounted on the clamping arm, and the drive component is mounted on the mounting plate. The output shaft of the drive component is connected to the clamping block, and the drive component can drive the clamping block to move.

7. A vertical furnace system, characterized in that, include: The wafer transfer device according to any one of claims 1 to 6; A vertical furnace device is installed on one side of the wafer transfer device, and the wafer temporary storage stack of the vertical furnace device is correspondingly arranged with the transfer opening of the transfer cavity. The transfer mechanism is adapted to transfer the wafer cassette loaded with wafers to the wafer temporary storage stack.

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