Semiconductor package and method of manufacturing the same

Abstract

The invention provides a semiconductor package and a method of manufacturing the semiconductor package. In a WLCSP, optical characteristics are improved while the height is reduced. The semiconductor package includes a microlens layer, a color filter layer, a semiconductor substrate, a sealing resin, and a glass substrate. In the semiconductor package, a plurality of refractive index films having different refractive indexes are laminated on a microlens layer. A microlens layer and a color filter layer are laminated on a semiconductor substrate. The sealing resin seals the microlens layer and the semiconductor substrate. The glass substrate is bonded to the sealing resin.

Description

Technical Field

[0001] This technology relates to a semiconductor package. More specifically, it relates to a semiconductor package with wafer-level sealing and other similar methods of manufacturing the same. Background Technology

[0002] Conventionally, wafer-level chip-size packages (WLCSPs) have been used in solid-state imaging devices and the like, where the wafer is sealed at the chip level. For example, a WLCSP in which a single-layer microlens is formed on a substrate and covered by a waterproof protective film has been proposed (see, for example, Patent Document 1). Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent Publication No. 2014-60203

[0004] In the aforementioned prior art, a waterproof protective film prevents moisture from penetrating into the semiconductor package. However, in this semiconductor package, if various lens groups are added within the module including the semiconductor package to improve optical properties, the size (in other words, the height) of the module in the optical axis direction increases. Therefore, it is difficult to simultaneously achieve both a low module height and improved optical properties. Summary of the Invention

[0005] This technology was developed in view of the situation and aims to improve optical properties in WLCSP while reducing height.

[0006] This technology was developed to solve the aforementioned problems. Its first aspect is a semiconductor package comprising: a microlens layer having multiple refractive index films of different refractive indices stacked thereon; a color filter layer; a semiconductor substrate having the microlens layer and the color filter layer stacked on the semiconductor substrate; a sealing resin sealing the microlens layer and the semiconductor substrate; and a glass substrate bonded to the sealing resin. This results in improved optical properties at a lower profile.

[0007] Furthermore, in this first aspect, a cover film may also be included, which comprises a predetermined material having waterproof and gas-blocking properties. When viewed from a direction perpendicular to the surface of the semiconductor substrate, the cover film covers the electrode pad area and the scribing area. Any one of the plurality of refractive index films comprises a hygroscopic material, and an opening is formed in the electrode pad area, the opening penetrating the microlens layer and reaching the electrode pad within the semiconductor substrate. This results in the suppression of venting and bubbling.

[0008] Furthermore, in this first aspect, the cover film may also cover areas other than the electrode pad area and the scribed area. This eliminates the need for a mask.

[0009] Furthermore, in this first aspect, the predetermined material may be any one of silicon nitride, silicon carbide nitride, silicon oxynitride, and silicon oxide. This results in the suppression of exhaust gas and foaming.

[0010] Furthermore, a second aspect of this technology is a method for manufacturing a semiconductor package, comprising: a sealing step of sealing a semiconductor substrate and a microlens layer with a sealing resin, wherein the microlens layer and a color filter layer are stacked on the semiconductor substrate, and the microlens layer has a plurality of refractive index films with different refractive indices stacked thereon; and a bonding step of bonding a glass substrate to the sealing resin. This results in improved optical properties at a lower height.

[0011] Furthermore, in this second aspect, it may also include: an opening step, forming an opening that penetrates the microlens layer and reaches the electrode pads within the semiconductor substrate; and a covering step, between the opening step and the sealing step, covering the electrode pad area and the scribing area where the opening is formed when viewed from a direction perpendicular to the surface of the semiconductor substrate, using a covering film comprising a material having waterproof and gas-blocking properties, wherein any one of the plurality of refractive index films comprises a hygroscopic material. This results in the suppression of venting and bubbling.

[0012] Furthermore, in this second aspect, in the aforementioned covering step, the covering film can be used to further cover the area outside the electrode pad area and the scribed area. This eliminates the need for a mask.

[0013] Furthermore, in this second aspect, the predetermined material may be any one of silicon nitride, silicon carbide nitride, silicon oxynitride, and silicon oxide. This results in the suppression of exhaust gas and foaming.

[0014] Furthermore, this second aspect may also include: a testing step, after the opening step, bringing the probe into contact with the electrode pads; a coating step, after the testing step, coating a water-soluble protective film on the surface of the microlens layer and the opening; a processing step, after the coating step, forming a scribing groove in the scribing area; a water rinsing step, performing water rinsing after the processing step; and a dehydration and baking step, performing dehydration and baking after the water rinsing step, with the covering step performed between the dehydration and baking step and the sealing step. This results in suppressing venting and bubbling without affecting probe testing.

[0015] Furthermore, this second aspect may also include: an annealing step, performed after the bonding step; and a dicing step, performed after the annealing step, cutting the wafer including the semiconductor substrate along the scribed area. This results in the formation of multiple semiconductor packages. Attached Figure Description

[0016] Figure 1 This is a block diagram illustrating a construction example of a camera module in a first embodiment of the present technology. Figure 2 This is a block diagram illustrating a construction example of a solid-state imaging element within a semiconductor package in a first embodiment of the present technology. Figure 3 This is an example of a top view of a semiconductor package in the first embodiment of this technology. Figure 4 This is a cross-sectional view illustrating a construction example of a semiconductor package in a first embodiment of the present technology. Figure 5 This is an example of a cross-sectional view of the peripheral area of ​​a pixel region in the first embodiment of this technology. Figure 6 This is an example of a top view of a wafer in the first embodiment of this technology. Figure 7 This is an example of a cross-sectional view of a pixel region on the surface of a wafer in the first embodiment of this technology. Figure 8 This is an example of a cross-sectional view of the pad area and scribing area on the surface of a wafer in the first embodiment of this technology. Figure 9 This is a diagram illustrating the manufacturing process up to the coating of a water-soluble protective film in the first embodiment of this technology. Figure 10 This is a diagram illustrating the manufacturing process up to dehydration and baking in the first embodiment of this technology. Figure 11 This is a diagram illustrating the manufacturing process up to the annealing treatment in the first embodiment of this technology. Figure 12 This is a flowchart illustrating an example of a semiconductor packaging manufacturing method in the first embodiment of the present technology. Figure 13 This is an example of a cross-sectional view showing the formation of bubbles and venting in the first embodiment of this technology. Figure 14 This is an example of a cross-sectional view of the peripheral region of a pixel region in the second embodiment of this technology. Figure 15 This is a diagram illustrating the manufacturing process in the second embodiment of this technology. Figure 16 This is a flowchart illustrating an example of a semiconductor packaging manufacturing method in the second embodiment of the present technology. Figure 17 This is an example of a cross-sectional view of a pixel region in the third embodiment of this technology. Figure 18 This is an example of a cross-sectional view of the peripheral region of a pixel region in the third embodiment of this technology. Figure 19 This is a diagram illustrating an example of the schematic structure of an endoscopic surgical system. Figure 20 This is a block diagram illustrating an example of the functional structure of a camera and a CCU. Figure 21 This is a block diagram illustrating a schematic example of the construction of a vehicle control system. Figure 22 This is an explanatory diagram showing an example of the location of the camera unit. Detailed Implementation

[0017] The following describes the methods for implementing this technology (hereinafter referred to as implementation methods). The descriptions will be presented in the following order. 1. First embodiment (example of multiple refractive index films stacked) 2. Second implementation (example of multiple refractive index films stacked, covering pad area and scribing area) 3. Third embodiment (example of multiple refractive index films stacked to cover the entire surface) 4. Examples of applications of endoscopic surgical systems 5. Examples of applications for moving bodies

[0018] <1. First Implementation> [Example of camera module construction] Figure 1 This is a block diagram illustrating a construction example of a camera module 100 in the first embodiment of the present technology. The camera module 100 captures image data and includes a lens group 110, a semiconductor package 200, an image control unit 120, and a DSP (Digital Signal Processor) circuit 130. The dimension of the camera module 100 in the optical axis direction is defined as the "height" of the module. When the camera module 100 is installed in an electronic device such as a smartphone or digital camera, from the viewpoint of miniaturization and thinning, it is preferable to minimize the height of the camera module 100 (in other words, reduce its height).

[0019] Lens group 110 focuses the incident light and guides it to semiconductor package 200. Semiconductor package 200 is a WLCSP that houses solid-state imaging elements such as CIS (CMOS Image Sensor). The solid-state imaging elements in semiconductor package 200 capture image data and supply it to DSP circuit 130 via signal line 209.

[0020] The camera control unit 120 sends control signals to the semiconductor package 200 via signal line 208 and controls its operation.

[0021] The DSP circuit 130 performs various image processing operations on image data from the solid-state imaging element.

[0022] In addition, the camera module 100 may also be configured with a memory for storing image data, an interface for sending and receiving data with the outside world, etc.

[0023] [Example of semiconductor package construction] Figure 2 This is a block diagram illustrating a construction example of a solid-state imaging element 210 within a semiconductor package 200 in the first embodiment of the present technology. The solid-state imaging element 210 includes a vertical drive unit 211, a system control unit 212, a pixel region 213, a column processing unit 215, a horizontal drive unit 216, a data storage unit 217, and a signal processing unit 218.

[0024] In pixel region 213, multiple pixels 214 are arranged in a two-dimensional grid pattern. Pixels 214 generate pixel signals through photoelectric conversion and supply them to column processing unit 215.

[0025] The vertical drive unit 211 sequentially selects and drives rows within the pixel region 213 and outputs pixel signals.

[0026] The system control unit 212 controls the operating timing of the vertical drive unit 211, the column processing unit 215, and the horizontal drive unit 216.

[0027] The column processing unit 215 performs AD (Analog to Digital) conversion and CDS (Correlated Double Sampling) processing on the pixel signals for each column of the pixel region 213. Under the control of the horizontal drive unit 216, the column processing unit 215 supplies the processed pixel signals to the signal processing unit 218.

[0028] The horizontal drive unit 216 selects columns in sequence and outputs the pixel signal of that column to the signal processing unit 218.

[0029] The signal processing unit 218 performs various signal processing on the pixel signals. Image data containing the processed pixel signals is supplied to the DSP circuit 130. Furthermore, the DSP circuit 130 can also perform all or part of the processing performed by the signal processing unit 218.

[0030] The data storage unit 217 temporarily holds the data necessary for processing by the signal processing unit 218.

[0031] Figure 3 This is an example of a top view of the semiconductor package 200 in the first embodiment of this technology. When viewed from the optical axis, the semiconductor package 200 is rectangular.

[0032] Hereinafter, the axis parallel to the row or column of pixel region 213 is set as the "X-axis", and the optical axis is set as the "Z-axis". The axis perpendicular to the X-axis and Z-axis is set as the "Y-axis".

[0033] Viewed from the Z-axis, a pixel region 213 and a predetermined number of electrode pads 220 are configured within the semiconductor package 200. The electrode pads 220 are arranged around the pixel region 213. For example, the X coordinates of the left and right ends of the semiconductor package 200 are set to X1 and X4, and the X coordinates of the left and right ends of the pixel region 213 are set to X2 and X3. In this case, electrode pads 220 are arranged along the Y-axis in the regions of coordinates X1 to X2 and coordinates X3 to X4. These electrode pads 220 are used for probe testing performed in wafer-level processes.

[0034] Figure 4 This is a cross-sectional view illustrating a construction example of a semiconductor package 200 according to a first embodiment of the present technology. The figure shows a cross-sectional view along... Figure 3 A cross-sectional view of pixel region 213 when the semiconductor package 200 is cut off by a dotted line and viewed from the Y-axis direction.

[0035] like Figure 4 As illustrated, the semiconductor package 200 includes a glass substrate 310, a sealing resin 320, a pixel protection film 330, a microlens layer 340, a color filter layer 350, a planarization film 360, and a laminated substrate 370. In the following text, the direction from the laminated substrate 370 toward the glass substrate 310 will be referred to as the "upper" direction. Furthermore, the upper surface of the substrate or layer will be referred to as the "surface," and the lower surface will be referred to as the "back surface."

[0036] The stacked substrate 370 includes a protective film 371, a silicon substrate 373, a wiring layer 374, and a support substrate 375. A wiring layer 374, such as silicon dioxide (SiO2), is formed on the upper surface (i.e., the surface) of the support substrate 375, and the silicon substrate 373 is formed on the surface of the wiring layer 374. A photodiode 372 is formed within the silicon substrate 373 for each pixel. A protective film 371, such as silicon dioxide (SiO2), is formed on the surface of the silicon substrate 373. Furthermore, the stacked substrate 370 is an example of a semiconductor substrate as described in the claims.

[0037] A planarization film 360 is formed on the surface of the laminated substrate 370 to planarize the areas where color filters are formed. Within this planarization film 360, light-shielding films 361 are disposed at various positions between pixels to prevent light leakage to adjacent pixels. A color filter layer 350 is formed on the surface of the planarization film 360. Color filters that transmit visible light, such as R (Red), G (Green), and B (Blue), are disposed for each pixel in the color filter layer 350. These color filters are arranged, for example, in a Bayer array when viewed from the Z-axis direction.

[0038] A microlens layer 340 is formed on the surface of the color filter layer 350. The microlens layer 340 includes a low refractive index film 341, a microlens protective film 342, a high refractive index film 343, and a medium refractive index film 344.

[0039] A medium refractive index film 344 is formed on the surface of the color filter layer 350. The material of the medium refractive index film 344 is, for example, a single layer of thermosetting styrene resin (STSR), with a refractive index of, for example, 1.57.

[0040] A high refractive index film 343 is formed on the surface of the intermediate refractive index film 344. The material of the high refractive index film 343 is, for example, silicon nitride (SiN), and its refractive index is, for example, 1.88.

[0041] A microlens protective film 342 for preventing the intrusion of water or impurities is formed on the surface of the high refractive index film 343. The material of the microlens protective film 342 is, for example, silicon oxynitride (SiON), and its refractive index is, for example, 1.65.

[0042] A low-refractive-index film 341 is formed on the surface of the microlens protective film 342. The refractive index of the low-refractive-index film 341 is, for example, 1.41. As the material of the low-refractive-index film 341, a hygroscopic coating material based on polysiloxane is used, for example.

[0043] A pixel protection film 330 is formed on the surface of the low refractive index film 341. As this pixel protection film 330, for example, a low temperature oxide film (LTO) with a refractive index of 1.47 is used.

[0044] A sealing resin 320 for sealing the pixel protective film 330, the microlens layer 340, etc., is formed on the surface of the pixel protective film 330. The refractive index of the sealing resin 320 is, for example, 1.51. A glass substrate 310 is bonded to the surface of the sealing resin 320.

[0045] Figure 5 This is an example of a cross-sectional view of the peripheral region of a pixel region in the first embodiment of this technology. The figure shows a cross-sectional view of the peripheral region of the pixel region when viewed from the Y-axis direction. Pad areas and scribing areas are provided around the pixel region.

[0046] An opening is formed in the pad area, which penetrates the pixel protective film 330, the microlens layer 340, and the laminated substrate 370, and reaches the electrode pad 220 within the wiring layer 374. In this figure, the X coordinates of the left and right ends of the pad area are X31 and X34. Furthermore, within the pad area, the X coordinates of the left and right ends of the opening are X32 and X33.

[0047] Furthermore, the scribing region is the area used for cutting semiconductor package 200 from the wafer. In the wafer-level process, scribing grooves are formed in the scribing region before cutting. After cutting along the scribing grooves, as illustrated in the figure, a portion of the left side of the scribing groove remains. The X coordinates of the left and right ends of the cut scribing region are X34 and X4, and the X coordinates of the left and right ends of the remaining scribing grooves are X35 and X4.

[0048] In addition, the openings and scribe grooves in the pad area and scribe area are sealed with sealing resin 320.

[0049] Furthermore, in cutting, for example, a wafer is cut along a scribing groove in one process using a cutting blade, and the shape of the cut surface is straight when viewed from the Y-axis direction, as illustrated in the figure.

[0050] Alternatively, cutting can be performed in multiple steps instead of a single process. For example, as shown in Figure 32 of Japanese Patent Publication No. 2019-213151, cutting can be performed in two steps. In the first step, a cutting blade is used, and in the second step, dry etching, laser cutting, or a cutting blade is used. Or, as shown in Figures 33 and 34 of Japanese Patent Publication No. 2019-213151, cutting can be performed in three steps.

[0051] In addition, such as Japanese Patent Publication No. 2020-27837 Figures 7 to 9 As illustrated, laser cutting and wet etching can also be used. Additionally, plasma etching and other methods can also be employed.

[0052] like Figure 4 and Figure 5 As illustrated, multiple refractive index films (low refractive index film 341, high refractive index film 343) with different refractive indices are stacked on the microlens layer 340. The microlens layer 340 and the color filter layer 350 are stacked on the laminated substrate 370. Furthermore, the microlens layer 340 and the color filter layer 350 are sealed with a sealing resin 320, on which a glass substrate 310 is bonded.

[0053] Here, as a comparative example, a structure is envisioned where the microlens layer 340 is formed from a single layer of thermosetting styrene resin (STSR). In this comparative example, to improve optical properties such as resolution, a lens needs to be added to the lens group 110 above the microlens layer 340. In this case, the dimension (height) in the optical axis direction of the camera module 100 becomes larger. Therefore, it is difficult to simultaneously improve optical properties and reduce the height of the module.

[0054] In contrast, such as Figure 4 and Figure 5 As illustrated, by forming a microlens layer 340 with multiple refractive index films of different refractive indices stacked on top of each other, optical properties can be improved without adding lenses (in other words, while reducing height).

[0055] Semiconductor packaging manufacturing methods Next, refer to Figures 6 to 12 The manufacturing method of semiconductor package 200 is described.

[0056] Figure 6 This is an example of a top view of the wafer 300 in the first embodiment of this technology. The figure shows a top view viewed from the Z-axis direction. Within the circular wafer 300, each of the plurality of rectangular regions surrounded by dashed lines represents an area of ​​the semiconductor package 200 cut to chip size by dicing.

[0057] Figure 7 This is an example of a cross-sectional view of a pixel region on the surface of a wafer 300 in a first embodiment of this technology. The figure shows a cut along the dashed line. Figure 6 A cross-sectional view of the wafer 300 viewed from the Y-axis direction.

[0058] like Figure 7As illustrated, in the wafer-level process prior to dicing, a planarization film 360, a color filter layer 350, and a microlens layer 340 are stacked on a laminated substrate 370, and a pixel protection film 330 is coated thereon.

[0059] Figure 8 This is an example of a cross-sectional view of the pad area and scribing area on the surface of the wafer 300 in the first embodiment of this technology. The figure shows a cross-sectional view viewed from the Y-axis direction.

[0060] The X coordinates of the left and right ends of a certain pixel region are set to X2 and X3, respectively. The X coordinate of the left end of the pixel region to the right of this pixel region is set to X6. The X coordinate between X3 and X6 is set to X5. In this case, a line area is configured within a predetermined range centered on X5, and pad areas are configured on both sides of it.

[0061] In the pad area and scribing area, a pixel protection film 330 and a microlens layer 340 are stacked on the upper surface of the laminated substrate 370. The opening and scribing groove are formed in a process described later.

[0062] Next, focusing on the pad area and the scribing area, refer to... Figures 9 to 11 right Figure 8 The subsequent processes will be explained.

[0063] Figure 9 This is a diagram illustrating the manufacturing process up to the coating of the water-soluble protective film 402 in the first embodiment of this technology.

[0064] As illustrated in figure a, an opening 401 is formed by dry etching or the like, which penetrates the microlens layer 340 and reaches the electrode pad 220 within the laminated substrate 370.

[0065] Then, as illustrated in b of the figure, a probe test is performed to bring the probe into contact with the surface of the exposed electrode pad 220. After this step, the electrode pad 220 is no longer needed, so it can be covered with the cover film described later, or embedded with the sealing resin 320.

[0066] Next, as illustrated in c of the figure, a water-soluble protective film 402 is applied to the entire surface to prevent dust from adhering to the laser processing described later. For example, the HogoMax series of water-soluble protective films from DISCO (registered trademark) can be used as this water-soluble protective film 402.

[0067] Figure 10 This is a diagram illustrating the manufacturing process up to dehydration and baking in the first embodiment of this technology.

[0068] After the water-soluble protective film 402 is applied, as illustrated in a of the figure, scribe lines 403 extending to the wiring layer 374 are formed by laser processing. Laser processing is also known as laser cutting or LA (Laser Ablation).

[0069] Then, as illustrated in b of the diagram, a water rinse is performed.

[0070] Next, as illustrated in c of the figure, perform a dehydration baking at 200°C for 10 minutes, for example.

[0071] Figure 11 This is a diagram illustrating the manufacturing process up to the annealing treatment in the first embodiment of this technology.

[0072] After dehydration and baking, as illustrated in figure a, a sealing resin 320 is applied to seal the pixel protective film 330, the microlens layer 340, and the laminated substrate 370.

[0073] Then, as illustrated in b of the figure, the glass substrate 310 is bonded to the surface of the sealing resin 320.

[0074] Next, as illustrated in c of the figure, an annealing process is performed, for example, at 200°C for 4 hours.

[0075] Furthermore, in the subsequent process, the wafer 300, including the laminated substrate 370, is cut along the marked area, and the wafer 300 is monolithically divided into multiple semiconductor packages 200.

[0076] Figure 12 This is a flowchart illustrating an example of a method for manufacturing a semiconductor package 200 in the first embodiment of the present technology.

[0077] First, in the wafer 300, a planarization film 360, a color filter layer 350, and a microlens layer 340 are formed on the laminated substrate 370 (step S901). Then, the electrode pads 220 are exposed through openings (step S902).

[0078] Then, a probe test is performed to form a water-soluble protective film 402 (step S903). Next, a scribing groove is formed by laser processing, followed by water cleaning (step S904).

[0079] Then, dehydration and baking are performed (step S905), and the microlens layer 340 and the laminated substrate 370 are sealed by applying sealing resin 320 (step S906). Then, the glass substrate 310 is bonded to the sealing resin 320 (step S907), and annealing is performed (step S908).

[0080] Next, the area is cut along the marked line (step S909), and various processes are performed as needed, thus completing the manufacturing process of the semiconductor package 200.

[0081] Thus, according to the first embodiment of this technology, a microlens layer 340 with multiple refractive index films of different refractive indices is formed, thereby improving optical characteristics while reducing the height of the camera module 100.

[0082] <2. Second Implementation> In the first embodiment described above, the microlens layer 340 is a laminated structure. However, as mentioned above, the low-refractive-index film 341 within the microlens layer 340 contains a hygroscopic material. Therefore, during the annealing process after glass substrate bonding, venting occurs from the low-refractive-index film 341, sometimes causing appearance abnormalities at the ends of openings, etc. The semiconductor package 200 in this second embodiment differs from the first embodiment in that it suppresses venting by using a cover film containing a waterproof and gas-blocking material.

[0083] Figure 13 This is an example of a cross-sectional view showing the formation of bubbles and venting in the first embodiment of this technology.

[0084] As illustrated in figure a, when applying sealant 320, air sometimes gets mixed into the pad area and scribe line area, and bubbles 404 are generated in the opening 401 and scribe line groove 403. This phenomenon is called "bubbling".

[0085] Furthermore, during water rinsing after the formation of the scribing groove 403, the low-refractive-index film 341, which contains hygroscopic material, sometimes absorbs moisture, leaving residual moisture after dehydration and baking. Moreover, after bonding the glass substrate 310 in Figure b, during annealing as illustrated in Figure c, venting 405 sometimes occurs due to moisture remaining in the low-refractive-index film 341. This venting 405 can sometimes cause appearance abnormalities at the ends of the opening 401, etc.

[0086] Furthermore, due to venting 405 and bubbling, the electrical characteristics of the devices within the semiconductor package 200 may deteriorate.

[0087] Figure 14 This is an example of a cross-sectional view of the peripheral region of the pixel region in the second embodiment of this technology. The semiconductor package 200 in this second embodiment differs from that in the first embodiment in that it also includes a cover film 380. Furthermore, the cross-sectional view of the pixel region in the second embodiment is the same as that in the first embodiment.

[0088] Viewed from the Z-axis, the cover film 380 is applied to the pad and scribe areas on the surface of the semiconductor package 200. This cover film 380 contains a material with water and gas barrier properties. Silicon nitride (SiN), silicon carbide nitride (SiCN), silicon carbide oxide (SiCO), and silicon oxide (SiO) are used as this material. This structure can be referred to as a CPAS (Coated Pads and Scribes) structure.

[0089] Figure 15 This is a diagram illustrating the manufacturing process in the second embodiment of the present technology. In order to suppress the generation of the above-mentioned venting and bubbling, in the second embodiment, step b in the diagram is added between the dehydration and baking step a in the diagram and the coating step of the sealing resin 320 in the diagram c.

[0090] In Figure b, a cover film 380 is applied to the pad area and the scribing area to obtain the CPAS structure.

[0091] By covering the pad area and scribing area with a waterproof and gas-blocking cover film 380, the generation of venting from the low-refractive-index film 341 can be suppressed. This suppresses any appearance abnormalities caused by venting.

[0092] Furthermore, by covering the sealant 320 with a cover film 380 before applying the sealant 320, the embedding properties of the sealant 320 can be improved, and bubbling generated during the application of the sealant 320 can be suppressed.

[0093] Furthermore, titanium dioxide (TiO2) has become the mainstream material for water-soluble protective films used during laser processing to suppress initial debris and flyaways. However, this material can potentially act as a catalyst that induces resin degradation. Therefore, if the sealing resin 320 is applied with the electrode pads 220 and scribe lines exposed, as in the first embodiment, the quality of the resin may be reduced. In contrast, in the second embodiment, since the pad area and scribe area are covered before applying the sealing resin 320, the degradation of resin quality can also be suppressed.

[0094] Furthermore, by covering the scribe area with a waterproof and gas-blocking covering film 380, it is possible to suppress the absorption of moisture by the microlens material (such as the low-refractive-index film 341) during the formation of the scribe groove. By suppressing this moisture absorption, the deterioration of the film properties of the refractive-index film within the microlens can be suppressed.

[0095] In summary, by adding step b in the diagram, the following effects are achieved. (1) Suppress the generation of exhaust gas from the low refractive index film 341. This exhaust gas is used to prevent abnormal appearance. (2) Improve the embedding properties of the sealant 320 in the marked areas, etc. Improve the embedding properties to suppress the formation of bubbles. (3) Suppress the degradation of the resin quality of sealing resin 320. (4) Suppress moisture absorption of the microlens material during groove formation. Suppress this moisture absorption to prevent film property degradation.

[0096] In addition, in Patent Document 1 Figure 4 In the described structure, the sidewalls of the electrode pads 220 and the scribe lines lack a waterproof and gas-blocking covering film 380, thus failing to suppress blistering and abnormal appearance. Furthermore, in Patent Document 1… Figure 4 In the process, there may be problems such as insufficient film formation, resulting in thinning of the protective film on the sidewalls, or the protective film disappearing when forming openings by dry etching or when laser processing of scribe lines.

[0097] In contrast, in the second embodiment where the cover film 380 is formed before the sealing resin 320 is applied, there is no subsequent processing step to thin the cover film 380. Therefore, the cover film 380 does not disappear, maintaining its coverage performance (in other words, the covered area). Thus, the aforementioned effects can be utilized to the maximum extent. Furthermore, since the cover film 380 is formed after probe testing, no problems arise during probe testing prior to this coverage, even if the electrode pads 220 are covered.

[0098] Figure 16 This is a flowchart illustrating an example of a method for manufacturing a semiconductor package 200 according to a second embodiment of the present technology. The difference between the manufacturing method in this second embodiment and the first embodiment is that step S910 is also performed.

[0099] After dehydration and baking (step S905), a cover film 380 is applied to the pad area and the scribing area (step S910). Then, the microlens layer 340 and the laminated substrate 370 are sealed by applying sealing resin 320 (step S906), and the steps after step S907 are performed.

[0100] Thus, according to the second embodiment of this technology, the pad area and the scribing area are covered by a cover film 380 that has waterproof and gas-blocking properties, thereby suppressing venting and bubbling.

[0101] <3. Third Implementation> In the second embodiment described above, the cover film 380 only covers the pad area and the scribing area, but it can also further cover areas other than those. The semiconductor package 200 in this third embodiment differs from the second embodiment in that the cover film 380 covers the entire surface.

[0102] Figure 17 This is an example of a cross-sectional view of a pixel region in the third embodiment of this technology.

[0103] Figure 18 This is an example of a cross-sectional view of the peripheral region of a pixel region in the third embodiment of this technology.

[0104] like Figure 17 and Figure 18 As illustrated, in the third embodiment, the entire surface of the semiconductor package 200, including areas other than the pad area and the scribing area (pixel area, etc.), is covered by a cover film 381 that has waterproof and gas-blocking properties. This cover film 381 is a film with the same refractive index as the LTO film and the low-refractive-index film 341.

[0105] Similar to the second embodiment, the step of forming the covering film 381 is added between the dehydration and baking step and the step of coating the sealing resin 320.

[0106] In the CPAS structure, a mask is required to prevent the cover film 380 from being applied to the pixel area. However, in the third embodiment, since the cover film 381 is applied to the entire surface, a mask is not required.

[0107] Thus, according to the third embodiment of the present technology, the entire surface of the semiconductor package 200 is covered by a cover film 381 that has waterproof and gas-blocking properties, so there is no need to mask the pixel area.

[0108] <4. Examples of the application of endoscopic surgical systems> The technology involved in this invention (the technology itself) can be applied to various products. For example, the technology involved in this invention can also be applied to endoscopic surgical systems.

[0109] Figure 19 This is a diagram illustrating an example of the schematic construction of an endoscopic surgical system to which the technology (the present invention) can be applied.

[0110] exist Figure 19 The illustration shows a surgeon (doctor) 11131 using an endoscopic surgical system 11000 to perform surgery on a patient 11132 on a bed 11133. As shown, the endoscopic surgical system 11000 consists of an endoscope 11100, an insufflation tube 11111, an energy delivery device 11112, and other surgical instruments 11110, a support arm device 11120 supporting the endoscope 11100, and a trolley 11200 equipped with various devices for endoscopic surgery.

[0111] Endoscope 11100 comprises an endoscope tube 11101 inserted into the body cavity of patient 11132 with a predetermined length from its tip, and a camera 11102 connected to the base of the endoscope tube 11101. In the illustrated example, an endoscope 11100 configured as a so-called rigid endoscope with a rigid endoscope tube 11101 is shown, but endoscope 11100 may also be configured as a so-called flexible endoscope with a flexible endoscope tube.

[0112] An opening for embedding an objective lens is provided at the front end of the endoscope 11101. A light source device 11203 is connected to the endoscope 11100. The light generated by the light source device 11203 is guided to the front end of the endoscope 11101 through a light guide extending inside the endoscope 11101, and then illuminates the object to be observed inside the body cavity of the patient 11132 via the objective lens. In addition, the endoscope 11100 can be a direct viewing endoscope, an oblique viewing endoscope, or a side viewing endoscope.

[0113] An optical system and an image sensor are installed inside the camera 11102. Reflected light from the object being observed (observation light) is focused onto the image sensor by the optical system. The image sensor performs photoelectric conversion on the observation light to generate an electrical signal corresponding to the observation light, i.e., an image signal corresponding to the observed image. This image signal is sent as RAW data to the camera control unit (CCU) 11201.

[0114] The CCU11201, composed of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit), comprehensively controls the operation of the endoscope 11100 and the display device 11202. Furthermore, the CCU11201 receives image signals from the camera 11102 and performs various image processing operations on the image signals, such as developing (de-mosaicing), for displaying images based on those signals.

[0115] The display device 11202 displays an image based on an image signal that has undergone image processing by the CCU 11201, under control from the CCU 11201.

[0116] The light source device 11203 is composed of a light source such as an LED (light emitting diode) and supplies illumination light to the endoscope 11100 when photographing the surgical site.

[0117] Input device 11204 is an input interface for endoscopic surgical system 11000. Users can input various information and commands into endoscopic surgical system 11000 via input device 11204. For example, users can input commands to change the imaging conditions of endoscope 11100 (type of illumination light, magnification, focal length, etc.).

[0118] The treatment device control unit 11205 controls the actuation of the energy treatment device 11112 used for tissue cauterization, incision, or vascular sealing. The pneumoperitoneum device 11206 delivers gas into the body cavity of the patient 11132 via the pneumoperitoneum tube 11111 to inflate the cavity, thereby ensuring the field of vision of the endoscope 11100 and ensuring the surgeon's working space. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device capable of printing various information related to the surgery in various forms such as text, images, or charts.

[0119] Furthermore, the light source device 11203 that supplies illumination light to the endoscope 11100 for photographing the surgical site can be composed of a white light source, such as an LED, a laser light source, or a combination thereof. When the white light source is composed of a combination of RGB laser light sources, the output intensity and timing of each color (wavelength) can be controlled with high precision, thus allowing adjustment of the white balance of the photographed image within the light source device 11203. Moreover, in this case, the lasers from each of the RGB laser light sources are time-division multiplexed onto the object of observation, and the driving of the camera element of the camera 11102 is controlled synchronously with this illumination timing, thereby enabling the time-division multiplexing of images corresponding to each RGB element. According to this method, color images can be obtained even without a color filter in the camera element.

[0120] Furthermore, the light source device 11203 can also be controlled to change the intensity of the output light at predetermined time intervals. By controlling the driving of the imaging element of the camera 11102 in sync with the timing of the light intensity changes, images are acquired and synthesized in a time-division manner, thereby generating high dynamic range images without underexposed shadows or overexposed highlights.

[0121] Furthermore, the light source device 11203 can also be configured to supply light of a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissues, a narrow band of light is irradiated compared to the illumination light used in normal observation (i.e., white light), thereby performing so-called narrow band imaging (Narrow Band Imaging) of predetermined tissues such as blood vessels on the mucosal surface with high contrast. Alternatively, in special light observation, fluorescence observation can also be performed, which uses fluorescence generated by irradiating excitation light to obtain an image. In fluorescence observation, it is possible to irradiate body tissue with excitation light to observe fluorescence from that body tissue (autofluorescence observation), or to locally inject a reagent such as indocyanine green (ICG) into body tissue and irradiate the body tissue with excitation light corresponding to the fluorescence wavelength of the reagent to obtain a fluorescence image. The light source device 11203 can be configured to supply narrow band light and / or excitation light corresponding to such special light observation.

[0122] Figure 20 It means Figure 19 The block diagram shows an example of the functional configuration of the camera 11102 and CCU11201.

[0123] Camera 11102 includes a lens unit 11401, an image capture unit 11402, a drive unit 11403, a communication unit 11404, and a camera control unit 11405. CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. Camera 11102 and CCU 11201 are communicatively connected to each other via a transmission cable 11400.

[0124] Lens unit 11401 is an optical system disposed at the connection portion with lens barrel 11101. Observation light taken in from the front end of lens barrel 11101 is guided to camera 11102 and incident on lens unit 11401. Lens unit 11401 is constructed by combining multiple lenses, including zoom lens and focusing lens.

[0125] The imaging element constituting the imaging unit 11402 can be a single (so-called single-plate type) or multiple (so-called multi-plate type). When the imaging unit 11402 is configured as a multi-plate type, for example, image signals corresponding to RGB values ​​can be generated by each imaging element and then synthesized to obtain a color image. Alternatively, the imaging unit 11402 can be configured with a pair of imaging elements, one for the right eye and one for the left eye, respectively, for acquiring image signals corresponding to 3D (dimensional) display. By performing 3D display, the surgeon 11131 can more reliably determine the depth of biological tissue in the surgical site. Furthermore, when the imaging unit 11402 is configured as a multi-plate type, multiple lens units 11401 can be provided corresponding to each imaging element.

[0126] Furthermore, the camera unit 11402 does not necessarily have to be located in the camera 11102. For example, the camera unit 11402 may also be located inside the lens barrel 11101, directly behind the objective lens.

[0127] The drive unit 11403 is composed of an actuator, and according to the control from the camera control unit 11405, moves the zoom lens and focusing lens of the lens unit 11401 a predetermined distance along the optical axis. As a result, the magnification and focus of the image captured by the imaging unit 11402 can be appropriately adjusted.

[0128] The communication unit 11404 is composed of a communication device for transmitting and receiving various information with the CCU 11201. The communication unit 11404 transmits the image signal obtained from the camera unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

[0129] Furthermore, the communication unit 11404 receives control signals from the CCU 11201 for controlling the camera 11102 and supplies them to the camera control unit 11405. These control signals include, for example, information related to shooting conditions such as information for specifying the frame rate of the captured image, information for specifying the exposure value during shooting, and / or information for specifying the magnification and focus of the captured image.

[0130] Furthermore, the aforementioned camera conditions, such as frame rate, exposure value, magnification, and focus, can be appropriately specified by the user, or automatically set by the control unit 11413 of the CCU11201 based on the acquired image signal. In the latter case, the endoscope 11100 is equipped with so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function.

[0131] The camera control unit 11405 controls the driving of the camera 11102 based on the control signal received from the CCU 11201 via the communication unit 11404.

[0132] The communication unit 11411 is composed of a communication device for transmitting and receiving various information between itself and the camera 11102. The communication unit 11411 receives image signals transmitted from the camera 11102 via the transmission cable 11400.

[0133] In addition, the communication unit 11411 sends control signals to the camera 11102 to control the driving of the camera 11102. The image signal and control signal can be transmitted via electrical communication or optical communication, etc.

[0134] The image processing unit 11412 performs various image processing operations on the RAW data, i.e., the image signal, sent from the camera 11102.

[0135] The control unit 11413 performs various controls related to the imaging of the surgical site by the endoscope 11100 and the display of the image obtained by imaging the surgical site. For example, the control unit 11413 generates control signals for controlling the drive of the camera 11102.

[0136] Furthermore, the control unit 11413, based on the image signal processed by the image processing unit 11412, causes the display device 11202 to display a camera image showing the surgical site, etc. At this time, the control unit 11413 can also use various image recognition technologies to identify various objects within the camera image. For example, the control unit 11413 can identify surgical instruments such as forceps, specific living tissue sites, bleeding, and fog when using the energy treatment device 11112 by detecting the shape or color of the edges of objects contained in the camera image. The control unit 11413 can also use its recognition results to overlay various surgical assistance information onto the image of the surgical site when displaying the camera image on the display device 11202. By overlaying surgical assistance information and providing prompts to the surgeon 11131, the burden on the surgeon 11131 can be reduced, and the surgeon 11131 can perform the surgery reliably.

[0137] The transmission cable 11400 connecting the camera 11102 and the CCU11201 is an electrical signal cable for communication with electrical signals, an optical fiber for communication with optical signals, or a composite cable thereof.

[0138] In the illustrated example, communication is conducted via a wired connection using transmission cable 11400, but communication between camera 11102 and CCU 11201 can also be conducted wirelessly.

[0139] The above describes an example of an endoscopic surgical system in which the technology of the present invention can be applied. The technology of the present invention can be applied to, for example, the camera 11102 in the structure described above. Specifically, Figure 1 The camera module 100 can be applied to the camera 11102. By applying the technology involved in this invention to the camera 11102, optical characteristics can be improved while reducing height, and clearer images of the surgical site can be obtained, so that the surgeon can reliably identify the surgical site.

[0140] In addition, an endoscopic surgical system has been described here as an example, but the technology involved in this invention can also be applied to microscopic surgical systems, etc.

[0141] <4. Examples of applications for moving bodies> The technology involved in this invention (the technology) can be applied to various products. For example, the technology involved in this invention can also be implemented as a device mounted on any type of mobile body such as automobiles, electric vehicles, hybrid vehicles, motorcycles, bicycles, personal mobile devices, airplanes, drones, ships, and robots.

[0142] Figure 21 This is a block diagram illustrating a schematic construction example of a vehicle control system, which is an example of a mobile body control system capable of applying the technology involved in this invention.

[0143] The vehicle control system 12000 has multiple electronic control units connected via a communication network 12001. Figure 21 In the example shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and a comprehensive control unit 12050. Furthermore, the comprehensive control unit 12050 is functionally configured with a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (interface) 12053.

[0144] The drive system control unit 12010 controls the operation of devices associated with the vehicle's drive system according to various programs. For example, the drive system control unit 12010 functions as a control device for generating drive force for the vehicle, such as an internal combustion engine or a drive motor; a drive force transmission mechanism for transmitting drive force to the wheels; a steering mechanism for adjusting the vehicle's steering angle; and a braking device for generating braking force for the vehicle.

[0145] The body system control unit 12020 controls the operation of various devices equipped on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for keyless entry systems, smart key systems, power windows, or various lights such as headlights, reversing lights, brake lights, turn signals, or fog lights. In this case, radio waves or signals from various switches sent from a portable device that replaces the key can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signal inputs and controls the vehicle's door locks, power windows, lights, etc.

[0146] The exterior information detection unit 12030 detects external information of the vehicle equipped with the vehicle control system 12000. For example, the exterior information detection unit 12030 is connected to a camera unit 12031. The exterior information detection unit 12030 causes the camera unit 12031 to capture images of the exterior of the vehicle and receives the captured images. The exterior information detection unit 12030 can also perform object detection processing or distance detection processing based on the received images, such as people, vehicles, obstacles, signs, or text on the road surface.

[0147] The camera unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The camera unit 12031 can output the electrical signal as an image or as distance measurement information. Furthermore, the light received by the camera unit 12031 can be visible light or non-visible light such as infrared light.

[0148] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected, for example, to a driver state detection unit 12041 that detects the driver's state. The driver state detection unit 12041 includes, for example, a camera that captures images of the driver. The in-vehicle information detection unit 12040 can calculate the driver's fatigue level or concentration level based on the detection information input from the driver state detection unit 12041, or it can determine whether the driver is dozing off.

[0149] The microcomputer 12051 can calculate the control target values ​​for the drive force generating device, steering mechanism, or braking device based on information acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control for implementing ADAS (Advanced Driver Assistance System) functions, including: vehicle collision avoidance or impact mitigation, distance-based following, speed maintenance, collision warning, or lane departure warning.

[0150] Furthermore, the microcomputer 12051 controls the drive force generating device, steering mechanism, or braking device based on information about the vehicle's surroundings obtained by the external information detection unit 12030 or the internal information detection unit 12040, thereby enabling coordinated control for purposes such as autonomous driving that does not depend on the driver's operation.

[0151] Furthermore, the microcomputer 12051 can output control commands to the vehicle system control unit 12020 based on the external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of the vehicle in front or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control for the purpose of anti-glare, such as switching from high beam to low beam.

[0152] The audio-visual output unit 12052 sends an output signal of at least one of audio and visual information to an output device capable of visually or audibly notifying the vehicle occupants or an external device. Figure 21 In the example, an audio speaker 12061, a display unit 12062, and a dashboard 12063 are shown as output devices. The display unit 12062 may also include at least one of an in-vehicle display and a head-up display, for example.

[0153] Figure 22 This is a diagram showing an example of the installation position of the camera unit 12031.

[0154] exist Figure 22 In the middle, as the camera unit 12031, there are camera units 12101, 12102, 12103, 12104, and 12105.

[0155] Cameras 12101, 12102, 12103, 12104, and 12105 are installed, for example, at locations such as the front nose, rearview mirrors, rear bumper, rear door, and the upper part of the windshield inside the vehicle 12100. The camera 12101 at the front nose and the camera 12105 at the upper part of the windshield inside the vehicle primarily acquire images of the front of the vehicle 12100. The cameras 12102 and 12103 at the rearview mirrors primarily acquire images of the sides of the vehicle 12100. The camera 12104 at the rear bumper or rear door primarily acquires images of the rear of the vehicle 12100. The camera 12105 at the upper part of the windshield inside the vehicle is mainly used for detecting vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes ahead.

[0156] In addition, Figure 22The diagram illustrates an example of the imaging range of camera units 12101 to 12104. Imaging range 12111 represents the imaging range of camera unit 12101 located at the front nose; imaging ranges 12112 and 12113 represent the imaging ranges of camera units 12102 and 12103 located at the rearview mirrors, respectively; and imaging range 12114 represents the imaging range of camera unit 12104 located at the rear bumper or rear door. For example, by overlaying the image data captured by camera units 12101 to 12104, a top-down view of the vehicle 12100 is obtained.

[0157] At least one of the camera units 12101 to 12104 may also have the function of acquiring distance information. For example, at least one of the camera units 12101 to 12104 may be a stereo camera composed of multiple camera elements, or a camera element having pixels for phase difference detection.

[0158] For example, based on distance information obtained from cameras 12101 to 12104, microcomputer 12051 calculates the distance to each three-dimensional object within the camera range 12111 to 12114 and the time change of that distance (relative speed to vehicle 12100). Thus, in particular, the nearest three-dimensional object located on the path of vehicle 12100, i.e., the one traveling in approximately the same direction as vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher), can be identified as the vehicle ahead. Furthermore, microcomputer 12051 can set a predetermined safe distance from the vehicle ahead and perform automatic braking control (including follow-stop control), automatic acceleration control (including follow-start control), etc. In this way, cooperative control can be performed for purposes such as autonomous driving that does not rely on driver operation.

[0159] For example, the microcomputer 12051 can classify three-dimensional object data related to three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from cameras 12101 to 12104, and use the extracted three-dimensional object data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that the driver of the vehicle 12100 can visually recognize and obstacles that are difficult to visually recognize. Then, the microcomputer 12051 determines the collision risk, which indicates the degree of danger of collision with each obstacle. When the collision risk is above a set value and there is a possibility of collision, it outputs an alarm to the driver via the audio speaker 12061 or the display unit 12062, or performs forced deceleration or evasive steering via the drive system control unit 12010, thereby enabling driving assistance for collision avoidance.

[0160] At least one of the camera units 12101 to 12104 can also be an infrared camera that detects infrared light. For example, the microcomputer 12051 can identify a pedestrian by determining whether a pedestrian exists in the captured images of the camera units 12101 to 12104. The pedestrian identification is performed, for example, by the following steps: extracting feature points from the captured images of the camera units 12101 to 12104, which are infrared cameras; and performing pattern matching processing on a series of feature points representing the outline of an object to determine whether it is a pedestrian. If the microcomputer 12051 determines that a pedestrian exists in the captured images of the camera units 12101 to 12104 and identifies the pedestrian, the sound image output unit 12052 controls the display unit 12062 to overlay a square outline for emphasis onto the identified pedestrian. In addition, the sound image output unit 12052 can also control the display unit 12062 to display an icon or the like representing a pedestrian at a desired position.

[0161] The above describes an example of a vehicle control system to which the technology of the present invention can be applied. The technology of the present invention can be applied to, for example, the camera unit 12031 in the structure described above. Specifically, Figure 1 The camera module 100 can be applied to the imaging unit 12031. By applying the technology involved in this invention to the imaging unit 12031, optical characteristics can be improved while reducing height, and photographic images that are easier to view can be obtained, thereby reducing driver fatigue.

[0162] Furthermore, the above embodiments illustrate one example of implementing this technology, and the matters in the embodiments correspond to the specific inventive matters in the claims. Similarly, the specific inventive matters in the claims correspond to the matters in the embodiments of this technology that bear the same names. However, this technology is not limited to the embodiments and can be implemented through various modifications without departing from its spirit.

[0163] Furthermore, the effects described in this manual are merely illustrative and not limiting; other effects may also be provided.

[0164] In addition, this technology can also adopt the following structure. (1) A semiconductor package, comprising: The microlens layer consists of multiple refractive index films with different refractive indices stacked on top of each other. Color filter layer; A semiconductor substrate, wherein the microlens layer and the color filter layer are stacked on the semiconductor substrate; Sealing resin, sealing the microlens layer and the semiconductor substrate; and A glass substrate is bonded to the sealing resin. (2) The semiconductor package according to (1), wherein, The semiconductor package further includes a cover film comprising a predetermined material having waterproof and gas-blocking properties, and when viewed from a direction perpendicular to the surface of the semiconductor substrate, the cover film covers the electrode pad area and the scribing area. Any one of the plurality of refractive index films contains a hygroscopic material. An opening is formed in the electrode pad region, the opening penetrating the microlens layer and reaching the electrode pad within the semiconductor substrate. (3) The semiconductor package according to (2), wherein, The cover film also covers the area outside the electrode pad area and the scribing area. (4) The semiconductor package according to (2) or (3), wherein, The predetermined material is any one of silicon nitride, silicon carbide nitride, silicon oxynitride, and silicon oxide. (5) A method for manufacturing a semiconductor package, comprising: In the sealing step, a sealing resin is used to seal a semiconductor substrate and a microlens layer, wherein the microlens layer and a color filter layer are stacked on the semiconductor substrate, and the microlens layer has multiple refractive index films with different refractive indices stacked on it; and The bonding step involves bonding the glass substrate to the sealing resin. (6) The method for manufacturing a semiconductor package according to (5) further includes: An opening step is performed to form an opening that penetrates the microlens layer and reaches the electrode pads within the semiconductor substrate; and In the covering step, between the opening step and the sealing step, a covering film comprising a material having waterproof and gas-blocking properties is used to cover the electrode pad area and the scribing area where the opening is formed when viewed from a direction perpendicular to the surface of the semiconductor substrate. Any one of the plurality of refractive index films contains a hygroscopic material. (7) The method for manufacturing a semiconductor package according to (6), wherein, In the covering step, the covering film is used to further cover the area outside the electrode pad area and the scribing area. (8) The method for manufacturing a semiconductor package according to (6) or (7), wherein, The predetermined material is any one of silicon nitride, silicon carbide nitride, silicon oxynitride, and silicon oxide. (9) The method for manufacturing a semiconductor package according to any one of (6) to (8) further comprises: The testing step involves, after the opening step, bringing the probe into contact with the electrode pad; In the coating step, after the testing step, a water-soluble protective film is coated on the surface of the microlens layer and the opening. The processing step involves forming a scribing groove in the scribing area after the coating step. A water rinsing step is performed after the processing step; and The dehydration and baking step is performed after the water washing step. The covering step is performed between the dehydration and baking step and the sealing step. (10) The method for manufacturing a semiconductor package according to any one of (6) to (9) further comprises: An annealing step, performed after the joining step; and The dicing step involves cutting the wafer, including the semiconductor substrate, along the scribing area after the annealing step. Explanation of reference numerals in the attached figures

[0165] 100 camera modules 110 lens group 120 Camera Control Department 130 DSP circuit 200 Semiconductor Packaging 210 Solid-state imaging element 211 Vertical Drive Unit 212 System Control Department 213 pixel area 214 pixels 215th Column Processing Department 216 Horizontal Drive Unit 217 Data Storage Department 218 Signal Processing Department 220 electrode pads 300 chips 310 glass substrate 320 sealing resin 330 pixel protective film 340 microlens layers 341 Low Refractive Index Film 342 Microlens Protective Film 343 High Refractive Index Film 344 medium refractive index film 350 color filter layers 360° planarization film 361 shading film 370-layer substrate 371 Protective Film 372 photodiode 373 Silicon substrate 374 Wiring Layer 375 Support base plate 380 and 381 covering films 401 Opening 402 Water-soluble Protective Film 403 Marking Groove 404 bubbles 405 exhaust 11102 Camera 12031 Camera Department

Claims

1. A semiconductor package comprising: a microlens layer in which a plurality of refractive index films having different refractive indexes are laminated; a color filter layer; a semiconductor substrate, the microlens layer and the color filter layer being laminated to the semiconductor substrate; a sealing resin sealing the microlens layer and the semiconductor substrate; and a glass substrate bonded to the sealing resin.

2. The semiconductor package according to claim 1, wherein: the semiconductor package further comprises a cover film containing a predetermined material having water repellency and gas barrier properties, and the cover film covers an electrode pad area and a scribe line area when viewed from a direction perpendicular to a surface of the semiconductor substrate, any one of the plurality of refractive index films contains a hygroscopic material, an opening portion is formed in the electrode pad area, the opening portion penetrating the microlens layer and reaching an electrode pad within the semiconductor substrate.

3. The semiconductor package according to claim 2, wherein: the cover film further covers an area other than the electrode pad area and the scribe line area.

4. The semiconductor package according to claim 2, wherein: the predetermined material is any one of silicon nitride, silicon carbon nitride, silicon oxynitride, and silicon oxide.

5. A method of manufacturing a semiconductor package, comprising: a sealing step of sealing a semiconductor substrate and a microlens layer with a sealing resin, the microlens layer and a color filter layer being laminated to the semiconductor substrate, the microlens layer in which a plurality of refractive index films having different refractive indexes are laminated; a bonding step of bonding a glass substrate to the sealing resin.

6. The method of manufacturing a semiconductor package according to claim 5, further comprising: an opening step of forming an opening portion, the opening portion penetrating the microlens layer and reaching an electrode pad within the semiconductor substrate; a cover step of covering, between the opening step and the sealing step, an electrode pad area and a scribe line area in which the opening portion is formed when viewed from a direction perpendicular to a surface of the semiconductor substrate, with a cover film containing a material having water repellency and gas barrier properties, any one of the plurality of refractive index films containing a hygroscopic material.

7. The method of manufacturing a semiconductor package according to claim 6, wherein: in the cover step, an area other than the electrode pad area and the scribe line area is further covered with the cover film.

8. The method of manufacturing a semiconductor package according to claim 6, wherein: the predetermined material is any one of silicon nitride, silicon carbon nitride, silicon oxynitride, and silicon oxide.

9. The method of manufacturing a semiconductor package according to claim 6, further comprising: a test step of bringing a probe into contact with the electrode pad after the opening step; a coating step of coating a water-soluble protective film on a surface of the microlens layer and the opening portion after the test step; a processing step of forming a scribe groove in the scribe line area after the coating step; a water cleaning step of performing water cleaning after the processing step; and a dehydration baking step of performing dehydration baking after the water cleaning step, the cover step being performed between the dehydration baking step and the sealing step. ​ ​ ​ ​ 10. The method of manufacturing a semiconductor package according to claim 6, further comprising: an annealing step of performing annealing processing after the bonding step; and a dicing step of cutting a wafer including the semiconductor substrate along the scribe line region after the annealing step.

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