Wafer detecting and sorting system

Abstract

The invention relates to the technical field of wafer detection, and discloses a wafer detection and sorting system which comprises a rack, a mounting rack, a carrying module, a detection module, a first clamping plug and a second clamping plug, the mounting rack, the carrying module and the detection module are all fixedly connected to the rack, and the carrying module is located in the middle of the rack; the mounting rack is provided with a hollow part through which the carrying module and the detection module penetrate, the mounting rack is provided with a plurality of mounting parts, the plurality of mounting parts are arranged around the carrying module, the plurality of mounting parts are provided with at least one first clamping plug and one second clamping plug, the first clamping plug is used for storing a wafer to be detected, and the second clamping plug is used for storing the detected wafer; the carrying module is used for carrying the to-be-detected wafer in the first clamping plug to the detection module and carrying the wafer on the detection module to the second clamping plug, the first clamping plug or the second clamping plug can be conveniently mounted and dismounted through the mounting part, the structure is compact, and the space utilization rate is improved.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, specifically a wafer inspection and sorting system. Background Technology

[0002] In the semiconductor wafer manufacturing process, wafers are manufactured through processes such as ingot cutting, grinding, and polishing. During these processes, it is necessary to monitor the shape, size, and condition of the wafer surface at all times, including warp, roughness, flatness, and even thickness. To better classify wafers, they are categorized and arranged according to different warp, roughness, flatness, or thickness ranges. This makes it easier to classify wafers of different shapes, sizes, and conditions and process them according to different categories. However, currently, due to the large number of categories, and because it is inconvenient to remove the wafers after inspection, the process is also complicated.

[0003] In the prior art, the applicant's earlier patent application (CN118053782A) discloses a detection device for wafer substrate inspection. The device stores wafers through a feeding module and transports wafers to a detection and output module for sorting and placement. The first wafer chuck of the feeding module and the second wafer chuck of the output module are driven to extend and retract by a first driving component and a second driving component, respectively, thereby completing the transfer of wafers from the first wafer chuck to the second wafer chuck. After the first wafer chuck has been transported and the second wafer chuck is full, the first wafer chuck and the second wafer chuck are retracted by the first driving component and the second driving component, respectively, to replenish or remove wafers. The first wafer chuck and the second wafer chuck are both mounted on a rack and require extension and retraction by a driving component, which occupies a large space and has low space utilization.

[0004] Therefore, the technical problem to be solved in this case is: how to improve space utilization.

[0005] Application content

[0006] To address the aforementioned technical problems, this application provides a wafer inspection and sorting system. Multiple mounting parts allow for easy installation and removal of a first or second chuck. A transport module picks up the wafer from the first chuck and places it in the inspection module for testing. After inspection, the transport module picks up the wafer from the inspection module and places it in the second chuck, thus achieving inspection and sorting based on different inspection results. For example, wafers with different thickness ranges are separated and placed in two second chucks, achieving the sorting purpose. Compared with existing technologies, this application has a more compact structure, improves space utilization, is more convenient to operate, and allows for more flexible installation of different numbers of first and second chucks.

[0007] The technical solution of this application is:

[0008] A wafer inspection and sorting system includes a rack, a mounting frame, a transport module, a detection module, a first chuck, and a second chuck. The mounting frame, transport module, and detection module are all fixedly connected to the rack. The transport module is located in the middle of the rack. The mounting frame has a cutout for the transport module and detection module to pass through. The mounting frame has multiple mounting parts arranged around the transport module. At least one first chuck and one second chuck are installed in each mounting part. The first chuck is used to store the wafer to be tested, and the second chuck is used to store the wafer after inspection. The transport module is used to transport the wafer to be tested in the first chuck to the detection module and to transport the wafer in the detection module to the second chuck.

[0009] Preferably, the mounting frame includes a mounting plate and vertically arranged support legs. One end of each support leg is fixedly connected to the bottom of the mounting plate, and the other end is fixedly connected to the frame. All mounting parts are located on the mounting plate. The mounting plate has a cutout portion. The transport module is provided with a clamping portion for clamping the wafer. The clamping portion is located above the mounting plate. The detection module is provided with a detection portion for detecting the wafer. The detection portion is located above the mounting plate.

[0010] Preferably, the top of the mounting plate is provided with multiple positioning slots arranged around the circumference of the transport module, and multiple mounting parts are connected to the multiple positioning slots one by one; the mounting part includes a positioning seat and a support block. The positioning seat is placed in the corresponding positioning slot and is limited to the inner wall of the positioning slot. The positioning seat is provided with a mounting hole, and the support block is provided with a mounting slot. The support block is fixed to the positioning seat by bolts passing through the mounting hole and the mounting slot. The positioning seat is used to install a first or second latch, and the support block is used to prevent the first or second latch on the corresponding positioning seat from tipping over. The support block can move closer to or away from the transport module.

[0011] Preferably, the first plug has side plates extending outward from both sides along its length direction, and the second plug has the same structure as the first plug;

[0012] The positioning seat is provided with a limiting groove and a receiving groove that are interconnected. The receiving groove is used to receive the first or second plug, and the limiting groove is used to receive the side plate. The inner wall of the limiting groove is in a limiting fit with the side plate.

[0013] Preferably, the mounting plate is equipped with an infrared sensor, and the positioning slot is provided with a strip groove. The infrared sensor is placed in the strip groove and is used to identify whether a positioning seat is placed on the corresponding positioning slot.

[0014] Preferably, the first chuck has an opening facing the transport module, and the opening is used to allow the clamping part of the transport module to enter the first chuck.

[0015] Preferably, the conveying module includes a fixed base, a lifting drive unit, a rotating drive unit, and a telescopic unit. The fixed base is fixedly connected to the frame. The lifting drive unit is connected to the top of the fixed base. The output end of the lifting drive unit is connected to the rotating drive unit and is used to drive the rotating drive unit to move up and down along the height direction of the frame. The output end of the rotating drive unit is connected to the telescopic unit and is used to drive the telescopic unit to rotate on the horizontal plane. The output end of the telescopic unit is connected to the clamping part. Multiple mounting parts are arranged around the circumference of the fixed base.

[0016] Preferably, the detection module includes a support base, an upper probe mechanism, and a lower probe mechanism. The support base is fixedly connected to the frame, and a U-shaped seat is provided on the support base. The closed end of the U-shaped seat is fixedly connected to one side of the support base. The upper probe mechanism and the lower probe mechanism are both located inside the U-shaped seat and are arranged vertically in correspondence. The upper probe mechanism and the lower probe mechanism form a detection section.

[0017] Preferably, the upper probe mechanism includes an upper detection head and an upper fixing block. A fixing groove is provided on the U-shaped seat. The upper fixing block is fixedly connected to the inner side of the U-shaped seat and located in the fixing groove. A fixing hole is provided on the upper fixing block for the upper detection head to pass through. A horizontal adjusting bolt is connected to the outer peripheral wall of the upper fixing block. A pad is provided inside the upper fixing block. The pad is located in the fixing hole and is fitted onto the outer peripheral wall of the upper detection head. A spring is provided between the outer peripheral wall of the pad and the inner wall of the fixing hole. The horizontal adjusting bolt passes through the upper fixing block and abuts against the outer peripheral wall of the pad. The spring and the horizontal adjusting bolt are arranged opposite to each other. The horizontal adjusting bolt can be rotated to horizontally adjust the position of the upper detection head.

[0018] Preferably, the lower probe mechanism includes a lower probe and a lower fixing block. The lower fixing block is fixedly connected to the inner side of the U-shaped seat. An adjusting plate is provided on the lower fixing block, and a groove is provided on the lower fixing block. The adjusting plate is placed in the groove, and a horizontally arranged adjusting hole is provided on the adjusting plate. A locking bolt is provided in the adjusting hole. The adjusting plate is connected to the lower fixing block by the locking bolt. Clamping blocks are fixedly provided on the top of the lower fixing block and the top of the adjusting plate. A clamping part for clamping the lower probe is formed between the two clamping blocks.

[0019] One of the above-mentioned technical solutions in this application has at least one of the following advantages or beneficial effects:

[0020] This application allows for convenient installation and removal of the first or second cassette using multiple mounting parts. A transport module picks up the wafer from the first cassette and places it in the detection module for testing. After testing, the transport module picks up the wafer from the detection module and places it in the second cassette, thus enabling testing and sorting of wafers based on different test results. For example, wafers with different thickness ranges are separated and placed in two second cassettes, achieving the sorting purpose. Compared with existing technologies, this application has a more compact structure, improves space utilization, is more convenient to operate, and allows for more flexible installation of different numbers of first and second cassettes. Attached Figure Description

[0021] Figure 1 This is a perspective view of Embodiment 1 of this application;

[0022] Figure 2 This is a schematic diagram of the structure of this application;

[0023] Figure 3 for Figure 2 The front view;

[0024] Figure 4 for Figure 2 Side view;

[0025] Figure 5 for Figure 2 Top view;

[0026] Figure 6 This is a perspective view of the mounting bracket according to Embodiment 1 of this application;

[0027] Figure 7 for Figure 6 The front view;

[0028] Figure 8 for Figure 6 Top view;

[0029] Figure 9 for Figure 8 A magnified view of a portion of the image;

[0030] Figure 10 This is a schematic diagram of the transport module of this application;

[0031] Figure 11 This is a top view of the transport module of this application;

[0032] Figure 12 This is a schematic diagram of the detection module in this application;

[0033] Figure 13 This is a schematic diagram of the upper probe mechanism and the lower probe mechanism of this application;

[0034] Figure 14 This is a cross-sectional view of the upper probe mechanism.

[0035] The reference numerals for each of the attached figures are as follows:

[0036] 1. Rack;

[0037] 2. Mounting bracket; 21. Cutout section; 22. Mounting section; 221. Positioning seat; 2211. Mounting hole; 2212. Limiting groove; 2213. Receiving groove; 222. Support block; 2221. Mounting groove; 23. Mounting plate; 231. Square hole; 232. Through hole; 233. Positioning groove; 234. Strip groove; 24. Support foot;

[0038] 3. Handling module; 31. Fixed base; 32. Lifting drive unit; 33. Rotation drive unit; 34. Telescopic unit; 35. Clamping unit;

[0039] 4. Detection module; 41. Detection section; 42. Support base; 421. U-shaped base; 4211. Fixing groove; 43. Upper probe mechanism; 431. Upper detection head; 432. Upper fixing block; 4321. Fixing hole; 4322. Horizontal adjustment bolt; 4323. Spring; 4324. Pad; 44. Lower probe mechanism; 441. Lower detection head; 442. Lower fixing block; 4421. Adjusting plate; 4422. Locking bolt; 443. Clamping block; 444. Clamping section;

[0040] 5. First stopper; 51. Side plate; 52. Opening;

[0041] 6. Second Caesar;

[0042] a. Wafer. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] Example 1

[0045] Please see Figures 1-14A wafer inspection and sorting system includes a rack 1, a mounting frame 2, a transport module 3, an inspection module 4, a first chuck 5, and a second chuck 6. The mounting frame 2, the transport module 3, and the inspection module 4 are all fixedly connected to the rack 1. The transport module 3 is located in the middle of the rack 1. The mounting frame 2 has a cutout 21 for the transport module 3 and the inspection module 4 to pass through. The mounting frame 2 has multiple mounting parts 22 arranged around the transport module 3. At least one first chuck 5 and one second chuck 6 are installed in each mounting part 22. The first chuck 5 is used to store the wafer to be inspected (a), and the second chuck 6 is used to store the inspected wafer (a). The transport module 3 is used to transport the wafer to be inspected (a) in the first chuck 5 to the inspection module 4 and to transport the wafer (a) on the inspection module 4 to the second chuck 6.

[0046] In practical applications, the operator installs the first cassette 5 and the second cassette 6 onto the mounting section 22. The number of cassettes installed is variable; for example, one first cassette 5 and two second cassettes 6 can be installed, or three first cassettes 5 and two second cassettes 6 can be installed. The specific installation selection can be adjusted by the operator according to the actual situation, thus allowing the operator more flexibility in choosing the combination of the number of first cassettes 5 and second cassettes 6. The transport module 3 and the detection module 4 pass through the cutout section 21 so that the transport module 3 can pick up the wafer a to be tested from the first cassette 5 located on the mounting section 22 of the mounting frame 2, or pick up the wafer a from the detection module 4 after testing. Furthermore, the operator can classify and store the wafer a according to the test results, which can be stored in different second cassettes 6, thereby realizing the sorting function, such as wafers a with different thickness ranges, flat wafers a, etc. Wafers of different thicknesses (e.g., 'a') can be used as classification criteria. Based on different test results, they are stored in the corresponding second cassettes (6) to facilitate the classification and storage of wafers of different thicknesses or flatnesses by the staff. It should be noted that this application uses a control system to adjust the position of the corresponding first cassettes (5) and second cassettes (6) on each mounting part (22). Therefore, the staff can operate the control system so that the transport module (3) can be placed in the corresponding second cassette (6) on the mounting part (22) according to the test results, thereby realizing the sorting function. The human-machine interface of the control system can be referred to in Chinese patent document CN118053782A, which will not be described in detail here. Compared with the prior application, this application has a more compact structure, higher space utilization, and can more flexibly select the number of first cassettes (5) and second cassettes (6) for combination.

[0047] It should be noted that this wafer inspection and sorting system is controlled by a control system, which is a MES system well known to those skilled in the art. The MES system can control the handling module 3 and the inspection module 4, which will not be described in detail here.

[0048] Preferably, the mounting frame 2 includes a mounting plate 23 and vertically arranged support legs 24. One end of the support legs 24 is fixedly connected to the bottom of the mounting plate 23, and the other end is fixedly connected to the frame 1. All mounting parts 22 are located on the mounting plate 23. The mounting plate 23 has a hollowed-out part 21. The transport module 3 is provided with a clamping part 444 for clamping the wafer a. The clamping part 444 is located above the mounting plate 23. The detection module 4 is provided with a detection part 41 for detecting the wafer a. The detection part 41 is located above the mounting plate 23.

[0049] Through the above design, the mounting plate 23 can be supported by the support foot 24, so that the mounting plate 23 is at a certain height, and the height position of the middle part of the first latch 5 or the middle part of the second latch 6 on the mounting part 22 corresponds to the position of the clamping part 444 of the transport module 3, thereby making it easier for the transport module 3 to pick up the target wafer a. The target wafer a here includes the wafer a to be tested or the wafer a that has been tested. The cutout part 21 is divided into a square hole 231 and a through hole 232. The square hole 231 and the through hole 232 are connected. The square hole 231 is for the detection module 4 to pass through, and the through hole 232 is for the transport module 3 to pass through, so that the detection module 4 and the transport module 3 are at similar height positions. Therefore, after the transport module 3 picks up the wafer a, it can place the wafer a to be tested in the detection part 41 for testing with a shorter path. By shortening the travel path of the transport module 3, the efficiency of testing is improved.

[0050] Preferably, the top of the mounting plate 23 is provided with a plurality of positioning grooves 233 arranged around the circumference of the transport module 3, and a plurality of mounting parts 22 are connected to the plurality of positioning grooves 233 one by one; the mounting part 22 includes a positioning seat 221 and a support block 222. The positioning seat 221 is placed in the corresponding positioning groove 233 and is limited to cooperate with the inner wall of the positioning groove 233. The positioning seat 221 is provided with a mounting hole 2211, and the support block 222 is provided with a mounting groove 2221. The support block 222 is fixed to the positioning seat 221 by bolts passing through the mounting hole 2211 and the mounting groove 2221. The positioning seat 221 is used to install the first plug 5 or the second plug 6. The support block 222 is used to prevent the first plug 5 or the second plug 6 on the corresponding positioning seat 221 from tipping over. The support block 222 can move closer to or away from the transport module 3.

[0051] In the above design, the positioning seat 221 can be placed in the positioning groove 233. Specifically, each positioning seat 221 is placed in a different positioning groove 233, and the positioning groove 233 provides a limiting function to prevent the positioning seat 221 from falling out of the positioning groove 233, further stabilizing the positioning seat 221. The support seat 42 can be locked onto the positioning seat 221 by bolts. Specifically, since the support block 222 can move closer to or further away from the positioning seat 221 in the direction of the transport module 3, that is, the support block 222 can move on the positioning seat 221. When the mounting hole 2211 and the mounting groove 2221 are connected, it is only necessary to pass the bolt through the mounting groove 2221 and the mounting hole 2211 in sequence and lock it to lock the support block 222 onto the positioning seat 221. Furthermore, the support block 222 can be moved to adjust the position of the support block 222 to be aligned with the corresponding positioning seat 221. The first latch 5 or the second latch 6 on 1 serves as a limit. It should be noted that the size of the mounting groove 2221 is larger than the size of the mounting hole 2211. The mounting groove 2221 is composed of two semi-circular ends and a straight groove. The operator can move the position of the support block 222 to adjust the relative position between the support block 222 and the positioning seat 221. Since the first latch 5 and the second latch 6 are relatively high, they may tip over if placed directly on the positioning seat 221. Therefore, the support block 222 can prevent the first latch 5 or the second latch 6 from tipping over on the positioning seat 221. The operator can adjust the position of the support block 222 so that the outer wall of the support block 222 can abut against the outer wall of the first latch 5 or the outer wall of the second latch 6, thereby preventing the first latch 5 or the second latch 6 from tipping over and further improving the stability of the first latch 5 and the second latch 6 placed on the positioning seat 221.

[0052] Preferably, the first plug 5 has side plates 51 extending outward from both sides along its length direction, and the second plug 6 has the same structure as the first plug 5; the positioning seat 221 has a limiting groove 2212 and a receiving groove 2213 that are interconnected, the receiving groove 2213 is used to receive the first plug 5 or the second plug 6, the limiting groove 2212 is used to receive the side plates 51, and the inner wall of the limiting groove 2212 is in a limiting fit with the side plates 51.

[0053] In this embodiment, when the worker places the first plug 5 or the second plug 6 on the positioning seat 221, the side plate 51 and the limiting groove 2212 will engage in a limiting fit, thus providing a reminder that the first plug 5 or the second plug 6 is in place when the worker installs it. The first plug 5 or the second plug 6 will be placed in the receiving groove 2213, and the limiting fit between the limiting groove 2212 and the side plate 51 can prevent the first plug 5 or the second plug 6 from continuing to move into the receiving groove 2213. When the outer wall of the first plug 5 or the second plug 6 abuts against the end wall of the receiving groove 2213, the first plug 5 and the second plug 6 are more likely to tip over. Therefore, through the support block 222 and the limiting groove 2212 and the side plate 51, the two can work together to further enhance the stability of the first plug 5 and the second plug 6 placed on the positioning seat 221.

[0054] Preferably, the mounting plate 23 is provided with an infrared sensor, the positioning groove 233 is provided with a strip groove 234, the infrared sensor is placed in the strip groove 234, and the infrared sensor is used to identify whether the corresponding positioning groove 233 is provided with a positioning seat 221.

[0055] In this embodiment, the infrared sensor can be placed in the strip groove 234, and the two ends of the strip groove 234 can facilitate the routing of the infrared sensor wires. When the positioning seat 221 is placed on the positioning groove 233, interference between the positioning seat 221 and the infrared sensor can be avoided. The infrared sensor can also identify whether there is a positioning seat 221 on the positioning groove 233, thereby helping the transport module 3 to identify which position has the positioning seat 221. It should be noted that the positioning seat 221 and the first latch 5 or the second latch 6 are prepared in pairs. If there is a positioning seat 221, the first latch 5 or the second latch 6 is installed on the positioning seat 221. On the other hand, in order to better fix the infrared sensor, the infrared sensor can be fixed in the strip groove 234 by means of glue, screws, etc., or the inner wall of the strip groove 234 and the infrared sensor can be used for limiting cooperation to further improve the stability of the infrared sensor.

[0056] Preferably, the first chuck 5 is provided with an opening 52, which is arranged facing the transport module 3, and the opening 52 is used to allow the clamping part 444 of the transport module 3 to enter the first chuck 5.

[0057] With the above design, the transport module 3 can enter the interior of the first cassette 5 or the second cassette 6 through the opening 52, thereby grabbing the wafer a to be tested in the first cassette 5 or placing the tested wafer a inside the second cassette 6. When the first cassette 5 or the second cassette 6 is placed on the positioning seat 221, the opening 52 faces the transport module 3, which makes it convenient for the position of the transport module 3 and the opening 52 to correspond, thereby making it convenient for the transport module 3 to grab or place the wafer a.

[0058] Preferably, the conveying module 3 includes a fixed base 31, a lifting drive unit 32, a rotating drive unit 33, and a telescopic unit 34. The fixed base 31 is fixedly connected to the frame 1. The lifting drive unit 32 is connected to the top of the fixed base 31. The output end of the lifting drive unit 32 is connected to the rotating drive unit 33 and is used to drive the rotating drive unit 33 to move up and down along the height direction of the frame 1. The output end of the rotating drive unit 33 is connected to the telescopic unit 34 and is used to drive the telescopic unit 34 to rotate on the horizontal plane. The output end of the telescopic unit 34 is connected to the clamping part 444. Multiple mounting parts 22 are arranged around the circumference of the fixed base 31.

[0059] In this embodiment, the fixed base 31 can improve the stability of the entire gripping process, and the lifting drive unit 32 can drive the rotation drive unit 33 to move up or down along the height direction of the frame 1. The rotation drive unit 33 can drive the telescopic unit 34 to rotate on the horizontal plane, so as to correspond to the different positions of the mounting part 22. The telescopic unit 34 can pass through the opening 52 of the first latch 5 or the second latch 6 and extend into the interior of the first latch 5 or the second latch 6 to grip or place the target wafer a. The clamping unit 35 can clamp the wafer a. For details, please refer to the applicant's earlier Chinese patent document CN118053782A, which will not be repeated here.

[0060] Preferably, the detection module 4 includes a support base 42, an upper probe mechanism 43, and a lower probe mechanism 44. The support base 42 is fixedly connected to the frame 1. A U-shaped seat 421 is provided on the support base 42. The closed end of the U-shaped seat 421 is fixedly connected to one side of the support base 42. The upper probe mechanism 43 and the lower probe mechanism 44 are both located inside the U-shaped seat 421 and are arranged vertically in correspondence. A detection section 41 is formed between the upper probe mechanism 43 and the lower probe mechanism 44.

[0061] Through the above design, the U-shaped seat 421 includes a vertically arranged connecting rod, a first rod and a second rod arranged parallel to each other at intervals, and the first rod and the second rod are connected together by the connecting rod to form a U-shaped structure U-shaped seat 421. The connecting rod is the closed end of the U-shaped seat 421. The upper probe mechanism 43 is connected to the opposite side of the first rod and the second rod, and the lower probe mechanism 44 is connected to the opposite side of the second rod and the first rod. This allows the upper probe mechanism 43 and the lower probe mechanism 44 to be arranged vertically and correspondingly with the stroke detection section 41. The U-shaped seat 421 can be fixed to the frame 1 by the support base 42, thus allowing the upper probe mechanism 43 and the lower probe mechanism 44 to be fixed. On the rack 1, the stability of the upper probe mechanism 43 and the lower probe mechanism 44 is improved. The upper probe mechanism 43 and the lower probe mechanism 44 are respectively arranged inside the U-shaped base 421. The upper probe mechanism 43 and the lower probe mechanism 44 form a detection unit 41 through their corresponding positions to detect the wafer a. The upper probe mechanism 43 and the lower probe mechanism 44 can work together to detect data information such as roughness, warpage, thickness, and roundness of the wafer a. The support base 42 can improve the stability of the upper probe mechanism 43 and the lower probe mechanism 44. The U-shaped base 421 can ensure that the upper probe mechanism 43 and the lower probe mechanism 44 are arranged in a corresponding position, so that both the upper and lower surfaces of the wafer a can be detected.

[0062] Preferably, the upper probe mechanism 43 includes an upper probe 431 and an upper fixing block 432. A fixing groove 4211 is provided on the U-shaped base 421. The upper fixing block 432 is fixedly connected to the inner side of the U-shaped base 421 and located within the fixing groove 4211. A fixing hole 4321 is provided on the upper fixing block 432 for the upper probe 431 to pass through. A horizontal adjusting bolt 4322 is connected to the outer peripheral wall of the upper fixing block 432. A pad 4324 is provided inside the upper fixing block 432. The pad 4324 is located inside the fixing hole 4321 and is fitted onto the outer peripheral wall of the upper detection head 431. A spring 4323 is provided between the outer peripheral wall of the pad 4324 and the inner wall of the fixing hole 4321. The horizontal adjusting bolt 4322 passes through the upper fixing block 432 and abuts against the outer peripheral wall of the pad 4324. The spring 4323 and the horizontal adjusting bolt 4322 are arranged opposite to each other. The horizontal adjusting bolt 4322 can be rotated to horizontally adjust the position of the upper detection head 431.

[0063] In this embodiment, the fixing groove 4211 is located on the first rod body. The fixing groove 4211 is a through design, so that the upper detection head 431 can pass through the fixing hole 4321 and the fixing groove 4211, thereby correspondingly arranging with the lower detection head mechanism 44 to detect the upper surface of the wafer a. It is fixed to the U-shaped seat 421 by the upper fixing block 432, and the horizontal position of the upper detection head 431 can be adjusted by the horizontal adjusting bolt 4322. For example, rotating the horizontal adjusting bolt 4322 clockwise can push the upper fixing block 4321. 32 moves in the feed direction of the horizontal adjusting bolt 4322 and compresses the spring 4323; when the horizontal adjusting bolt 4322 is rotated counterclockwise, it can be disengaged, releasing the spring 4323. The upper detection head 431 moves in the direction of disengagement of the horizontal adjusting bolt 4322, thereby adjusting the horizontal position of the upper detection head 431. This facilitates the operator in adjusting the position of the upper detection head 431 to correspond vertically with the lower detection head mechanism 44. During the rotation of the horizontal adjusting bolt 4322, the pad 4324 can... To protect the upper detection head 431 from damage by the horizontal adjusting bolts 4322, the pad 4324 in this embodiment is a hollow cylindrical structure made of elastic material, which can be fitted onto the outer peripheral wall of the upper detection head 431, providing cushioning protection. It should be noted that there are two horizontal adjusting bolts 4322 in this embodiment, arranged at an angle of 45 degrees to the length direction of the U-shaped seat 421. The horizontal cross-section of the upper fixing block 432 is polygonal. In the middle, the horizontal cross section of the upper fixing block 432 is octagonal, and the outer angle of the octagonal upper fixing block 432 is 45 degrees. Therefore, the included angle between the two horizontal adjusting bolts 4322 is 90 degrees. Thus, when one horizontal adjusting bolt 4322 is rotated, the moving direction of the upper fixing block 432 is consistent with the tangential direction of the contact surface between the other horizontal adjusting bolt 4322 and the upper fixing block 432. Therefore, when one horizontal adjusting bolt 4322 is rotated, it will not be affected by the other horizontal adjusting bolt 4322.

[0064] Preferably, the lower probe mechanism 44 includes a lower probe 441 and a lower fixing block 442. The lower fixing block 442 is fixedly connected to the inner side of the U-shaped seat 421. An adjusting plate 4421 is provided on the lower fixing block 442. The lower fixing block 442 has a groove, and the adjusting plate 4421 is placed in the groove. The adjusting plate 4421 has a horizontally arranged adjusting hole, and a locking bolt 4422 is provided in the adjusting hole. The adjusting plate 4421 is connected to the lower fixing block 442 by the locking bolt 4422. A clamping block 443 is fixedly provided on the top of the lower fixing block 442 and the top of the adjusting plate 4421. A clamping part 444 for clamping the lower probe 441 is formed between the two clamping blocks 443.

[0065] In this embodiment, the adjusting plate 4421 is placed in the groove of the lower fixing block 442 and connected to the lower fixing block 442 by the locking bolt 4422. The locking bolt 4422 is used to tighten the plate. At this time, a clamping part 444 is formed between the clamping block 443 on the adjusting plate 4421 and the clamping block 443 on the lower fixing block 442, which can clamp and fix the lower detection head 441. In this embodiment, the lower detection head 441 has a circumferential structure, and the clamping block 443 has a semi-circular ring structure. The structure consists of two clamping blocks 443 that form a horizontally circular clamping part 444, which can clamp the lower detection head 441. The structure of the clamping blocks 443 can also be replaced with a V-shaped structure, which can also clamp the lower detection head 441. The height of the lower detection head 441 can be adjusted by adjusting the plate 4421 and locking bolt 4422. Specifically, the adjustment method is as follows: loosen the locking bolt 4422, so that the adjusting plate 4421 and the lower fixing block 442 are loosened, and the adjusting plate 442... 1. The clamping block 443 on the adjusting plate 4421 can be moved away from the lower fixed block 442, that is, the clamping block 443 on the adjusting plate 4421 can be moved away from the clamping block 443 on the lower fixed block 442, until the clamping force on the lower detection head 441 gradually decreases or even disappears. In order to prevent the lower detection head 441 from falling and being damaged, the staff needs to hold the lower detection head 441 before adjustment. When the clamping force on the lower detection head 441 disappears, the staff can manually adjust the height of the lower detection head 441, and then lock the adjusting plate 4421 on the lower fixed block 442 again through the locking bolt 4422, thereby realizing the height position adjustment of the lower detection head 441. Adjusting the height of the lower detection head 441 is mainly to cooperate with the upper detection head 431 to detect the wafer a. Non-contact detection can be achieved through the upper detection head 431 and the lower detection head 441, and the surface contour state (roughness, warp, thickness, roundness, etc.) of the wafer a can be detected through the optical offset principle.

[0066] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer inspection and sorting system, comprising: The utility model provides a wafer detection device, including frame, mounting frame, carrying module, detection module, first jam, second jam, mounting frame, carrying module and detection module all are fixedly connected on frame, carrying module is located in the middle part of frame, be equipped with the hollow part that is used for carrying module and detection module to wear out on mounting frame, be equipped with a plurality of mounting portions on mounting frame, a plurality of mounting portions surround carrying module arrangement, a plurality of mounting portions install at least one first jam and one second jam, first jam is used to store the wafer to be measured, second jam is used to store the wafer after detection, carrying module is used to carry the wafer to be measured in first jam to detection module and is used to carry the wafer on detection module to second jam.

2. The wafer inspection and sorting system of claim 1, wherein, The mounting frame includes a mounting plate and vertically arranged support legs, one end of the support legs is fixedly connected to the bottom of the mounting plate, the other end is fixedly connected with the frame, all the mounting portions are located on the mounting plate, the mounting plate has the hollow part, the carrying module is provided with a clamping portion, the clamping portion is used for clamping the wafer, the clamping portion is located above the mounting plate, the detection module is provided with a detection portion, the detection portion is used for detecting the wafer, and the detection portion is located above the mounting plate.

3. The wafer inspection and sorting system of claim 2, wherein, The top of the mounting plate is provided with a plurality of positioning grooves arranged around the circumference of the carrying module, and a plurality of the mounting portions are connected one by one with a plurality of the positioning grooves; the mounting portion includes a positioning seat and a supporting block, the positioning seat is placed in the corresponding positioning groove and limitedly matched with the inner wall of the positioning groove, the positioning seat is provided with a mounting hole, the supporting block is provided with a mounting slot, and the supporting block is fixed on the positioning seat by bolts penetrating through the mounting hole and the mounting slot; the positioning seat is used for installing the first cassette or the second cassette, and the supporting block is used for preventing the first cassette or the second cassette on the corresponding positioning seat from toppling over; and the supporting block can move closer to or away from the carrying module.

4. The wafer inspection and sorting system of claim 3, wherein, The first cassette is provided with side plates extending outward from both sides along the length direction of the first cassette, and the second cassette has the same structure as the first cassette; The positioning seat is provided with a limiting groove and a containing groove in communication with each other, the containing groove is used for containing the first cassette or the second cassette, and the limiting groove is used for containing the side plate, and the inner wall of the limiting groove is limitedly matched with the side plate.

5. The wafer inspection and sorting system of claim 3, wherein, The mounting plate is provided with an infrared sensor, the positioning groove is provided with a strip-shaped groove, the infrared sensor is placed in the strip-shaped groove, and the infrared sensor is used for identifying whether the positioning seat is placed on the corresponding positioning groove.

6. The wafer inspection and sorting system of claim 4, wherein, The first cassette is provided with an opening, the opening is arranged towards the carrying module, and the opening is used for allowing the clamping portion of the carrying module to enter the first cassette.

7. The wafer inspection and sorting system of claim 1, wherein, The carrying module comprises a fixed seat, a lifting driving unit, a rotating driving unit and an extension unit, the fixed seat is fixedly connected to the rack, the lifting driving unit is connected to the top of the fixed seat, the output end of the lifting driving unit is connected with the rotating driving unit and is used for driving the rotating driving unit to lift along the height direction of the rack, the output end of the rotating driving unit is connected with the extension unit and is used for driving the extension unit to rotate in the horizontal plane, the output end of the extension unit is connected with the clamping part, and a plurality of the mounting parts are arranged around the circumference of the fixed seat.

8. The wafer inspection and sorting system of claim 2, wherein, The detection module comprises a support seat, an upper measuring head mechanism and a lower measuring head mechanism, the support seat is fixedly connected to the rack, a U-shaped seat is arranged on the support seat, the closed end of the U-shaped seat is fixedly connected to one side of the support seat, the upper measuring head mechanism and the lower measuring head mechanism are arranged on the inner side of the U-shaped seat and correspond to each other in up-down direction, and the detection part is formed between the upper measuring head mechanism and the lower measuring head mechanism.

9. The wafer inspection and sorting system of claim 8, wherein, The upper measuring head mechanism comprises an upper detection head and an upper fixed block, a fixed groove is arranged on the U-shaped seat, the upper fixed block is fixedly connected to the inner side of the U-shaped seat and is located in the fixed groove, a fixed hole through which the upper detection head passes is arranged on the upper fixed block, a horizontal adjusting bolt is connected to the outer peripheral wall of the upper fixed block, a pad block is arranged in the upper fixed block, the pad block is located in the fixed hole and is sleeved on the outer peripheral wall of the upper detection head, a spring is arranged between the outer peripheral wall of the pad block and the inner wall of the fixed hole, the horizontal adjusting bolt abuts against the outer peripheral wall of the pad block through the upper fixed block, the spring and the horizontal adjusting bolt are arranged oppositely, and the horizontal adjusting bolt is rotatable to horizontally adjust the position of the upper detection head.

10. The wafer inspection and sorting system of claim 9, wherein, The lower measuring head mechanism comprises a lower detection head and a lower fixed block, the lower fixed block is fixedly connected to the inner side of the U-shaped seat, an adjusting plate is arranged on the lower fixed block, a recess is arranged on the lower fixed block, the adjusting plate is arranged in the recess, an adjusting hole horizontally arranged on the adjusting plate, a locking bolt is arranged in the adjusting hole, the adjusting plate is connected to the lower fixed block through the locking bolt, clamping blocks are arranged on the top of the lower fixed block and the top of the adjusting plate, and a clamping part for clamping the lower detection head is formed between the two clamping blocks.

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