Cleaning device and processing equipment

Abstract

The invention discloses a cleaning device and processing equipment, and relates to the technical field of PCB manufacturing, the cleaning device is used for cleaning a PCB, the cleaning device comprises a base station, a carrier and a dust removal structure, the carrier is movably arranged on the base station, the carrier is used for bearing the PCB, the carrier is provided with an air hole, the dust removal structure comprises a dust removal main body and a first air nozzle, the dust removal main body is arranged on the base station, and the first air nozzle is arranged on the base station. The first air nozzle is arranged on the dedusting main body; the dust removal structure is provided with a dust removal cavity, the carrier is arranged in the dust removal cavity so that the first air nozzle can be limited in the air hole, and the first air nozzle is arranged to blow air to the PCB through the air hole. According to the cleaning device, on the basis that the position of the PCB is kept fixed, accurate dust removal is conducted on the PCB, and the dust removal efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and in particular to a cleaning device and processing equipment. Background Technology

[0002] Currently, in the PCB milling and separation process, although the separation machine has a built-in dust removal function, some dust still remains on the edges of the PCB and inside the components. This can lead to an increase in test defects in the subsequent testing process. Therefore, it is necessary to perform a secondary cleaning of the PCB after separation.

[0003] Traditional secondary cleaning of PCB boards uses structures such as flexible hoses. The hoses are used to clean the area of ​​the PCB board by suction or blowing dust, followed by a unified dust extraction. However, these hoses are not fixed in position and are easily affected by external interference, resulting in an unstable position relative to the PCB board. Consequently, they cannot accurately and continuously clean the PCB board, leading to low overall dust removal efficiency. Summary of the Invention

[0004] The main objective of this invention is to provide a cleaning device and processing equipment, which aims to improve dust removal efficiency by accurately removing dust from PCB boards while keeping their positions fixed.

[0005] To achieve the above objectives, the present invention provides a cleaning device for cleaning PCB boards, the cleaning device comprising:

[0006] abutment;

[0007] A carrier, movably mounted on the base, is used to support a PCB board and is provided with vents; and

[0008] A dust removal structure, comprising a dust removal body and a first air nozzle, wherein the dust removal body is disposed on the base and the first air nozzle is disposed on the dust removal body;

[0009] The dust removal body is provided with a dust removal chamber, and the carrier is disposed in the dust removal chamber so that the first air nozzle is limited to the air hole, and the first air nozzle is configured to blow air onto the PCB board through the air hole.

[0010] In one embodiment, the dust removal body includes a first dust removal component and a second dust removal component, the first dust removal component and the second dust removal component enclosing to form the dust removal chamber;

[0011] The first air nozzle is disposed on the first dust removal component or the second dust removal component.

[0012] In one embodiment, the dust removal structure further includes a second air nozzle, wherein the first air nozzle is disposed in one of the first dust removal component and the second dust removal component, and the second air nozzle is disposed in the other of the first dust removal component and the second dust removal component;

[0013] The second air nozzle is configured to blow air onto the PCB board.

[0014] In one embodiment, the dust removal chamber is provided with an upper mounting surface and a lower mounting surface that are parallel to each other. The lower mounting surface is provided on the first dust removal assembly, and the upper mounting surface is provided on the second dust removal assembly.

[0015] The first air nozzle is located on the lower mounting surface, the second air nozzle is located on the upper mounting surface, and the carrier is located between the first air nozzle and the second air nozzle.

[0016] In one embodiment, the carrier is provided with a bearing plane for supporting a PCB board;

[0017] The dust removal structure also includes a positioning element, which is disposed on the dust removal body and faces the bearing plane. The positioning element and the first air nozzle are located on opposite sides of the bearing plane.

[0018] In one embodiment, the bearing plane has interconnected clearance holes and flow guide holes, the clearance holes and / or the flow guide holes are connected to the air holes, and the clearance holes are used to limit the components on the PCB board;

[0019] And / or, the positioning element includes a base column and a buffer element, the base column is disposed on the dust removal body and extends toward the bearing plane, and the buffer element is disposed on the side of the base column facing the bearing plane.

[0020] In one embodiment, the first dust removal component includes a base plate and a sealing frame. The base plate is slidably connected to the base platform, and the sealing frame is disposed on the periphery of the base plate. The sealing frame and the base plate enclose a first cleaning chamber, and the air hole communicates with the first cleaning chamber.

[0021] The first air nozzle is located in the first cleaning chamber.

[0022] In one embodiment, the cleaning device further includes a mounting frame slidably disposed on the base, and the carrier disposed on the mounting frame;

[0023] The mounting bracket has a sealing edge that abuts against the sealing frame. The carrier covers the opening of the first cleaning chamber and makes the air hole communicate with the first cleaning chamber.

[0024] In one embodiment, the second dust removal assembly includes a top plate and a dust cover. The top plate is slidably connected to the base, and the dust cover is disposed at the periphery of the top plate. The dust cover and the top plate enclose a second cleaning chamber, and the air vent communicates with the second cleaning chamber.

[0025] And / or, the dust removal body forms a dust removal chamber, and the cleaning device further includes a dust extraction assembly, which includes a fan and a suction pipe connected to each other, one end of the suction pipe being connected to the fan, and the other end of the suction pipe extending into the dust removal chamber.

[0026] The present invention also proposes a processing device, which includes the cleaning device described above.

[0027] The cleaning device of this invention is used to clean PCB boards. The cleaning device includes a base, a carrier, and a dust removal structure. The base is used to support and install the carrier and the dust removal structure. The carrier is movably mounted on the base and is used to support and place the PCB board. The carrier is provided with air holes. The dust removal structure includes a dust removal body and a first air nozzle. The first air nozzle is located on the dust removal body, which is located on the base. The dust removal body is provided with a dust removal chamber, and the carrier is located in the dust removal chamber, so that the first air nozzle can be confined in the air hole. The first air nozzle can blow air onto the PCB board through the air hole. This application uses the carrier to confine the PCB board and confines the first air nozzle used to blow air onto the PCB board for dust removal in the air hole to ensure the fixed position of the first air nozzle relative to the PCB board. This makes the first air nozzle less susceptible to changes in position due to external interference, thereby enabling precise and continuous cleaning and dust removal of the PCB board, thus improving the overall dust removal efficiency. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the cleaning device in one embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the cleaning device in another embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the structure of the first dust removal component in one embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of the structure of the second dust removal component in one embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of the mounting frame and carrier in one embodiment of the present invention.

[0034] Explanation of icon numbers:

[0035] 100. Cleaning device; 1. Base; 11. Column; 2. Carrier; 21. Air vent; 22. Bearing plane; 23. Clearance hole; 24. Guide hole; 3. Dust removal structure; 31. Dust removal body; 311. First dust removal component; 3111. Base plate; 3112. Sealing frame; 3113. First cleaning chamber; 3114. Lower mounting surface; 312. Second dust removal component; 3121. Top plate; 3122. Dust cover; 3123. Second cleaning chamber; 3124. Upper mounting surface; 313. Dust removal chamber; 32. First air nozzle; 33. Second air nozzle; 34. Positioning component; 341. Base column; 342. Buffer component; 4. Mounting frame; 41. Sealing edge; 5. Suction pipe.

[0036] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0038] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0039] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0040] This invention proposes a cleaning device 100, please refer to... Figure 1 and Figure 2 As shown, a cleaning device 100 for cleaning PCB boards includes a base 1, a carrier 2, and a dust removal structure 3. The carrier 2 is movably mounted on the base 1 and is used to support the PCB board. The carrier 2 is provided with an air hole 21. The dust removal structure 3 includes a dust removal body 31 and a first air nozzle 32. The dust removal body 31 is mounted on the base 1, and the first air nozzle 32 is mounted on the dust removal body 31. The dust removal body 31 is provided with a dust removal chamber 313, and the carrier 2 is mounted on the dust removal chamber 313 so that the first air nozzle 32 is limited to the air hole 21. The first air nozzle 32 is configured to blow air onto the PCB board through the air hole 21.

[0041] In this embodiment, the cleaning device 100 is used to clean PCB boards. After the PCB board is cut and separated, a lot of dust remains on the surface of the PCB board. The cleaning device 100 proposed in this application removes the dust on the surface of the PCB board by suction or blowing, thereby cleaning the PCB board. The cleaning device 100 includes a base 1, a carrier 2, and a dust removal structure 3. The base 1 is the main support structure of the cleaning device 100. The base 1 is used to support and install the carrier 2 and the dust removal structure 3. The base 1 can be a frame structure such as a rack or mounting frame 4, or it can be a mounting table. The platform structure, such as the placement table, is not limited here. The carrier 2 is movably mounted on the base 1, such as by means of a synchronous belt, chain, guide rail, etc. The carrier 2 is used to support the PCB board. The carrier 2 can be a carrier plate, a platform, or a tray structure. The carrier 2 forms a bearing plane 22 for supporting and placing the PCB board. At the same time, the carrier 2 is also provided with a slot or limiting slot structure to limit the PCB board, thereby ensuring that the position of the PCB board relative to the carrier 2 can remain fixed when blowing or vacuuming the PCB board, effectively improving the cleaning degree and cleaning effect of dust removal on the PCB board surface.

[0042] In this embodiment, the cleaning device 100 also includes a dust removal structure 3, which is a structure for removing dust from the surface of the PCB board. The dust removal structure 3 can blow high-speed airflow into the PCB board to blow up the dust on the surface of the PCB board and collect the dust in a unified manner, or directly aim the dust extraction port at the PCB board to remove the dust on the surface of the PCB board by suction. The dust removal structure 3 generally includes a main structure installed on the base 1 and an airflow generating device for suction and blowing dust, such as a fan or air pump, etc., which are not limited here.

[0043] Specifically, the dust removal structure 3 includes a dust removal body 31 and a first air nozzle 32 connected to the dust removal body 31. The dust removal body 31 is the main support structure of the dust removal structure 3. On one hand, it is used to connect to the base 1, which can be a fixed connection or a movable connection. On the other hand, it is used to connect to the first air nozzle 32 for mounting the first air nozzle 32. The first air nozzle 32 is used to generate high-speed airflow and to blow airflow into the air hole 21. The first air nozzle 32 includes, but is not limited to, an air tank for storing airflow or an air pump for generating airflow, a nozzle for blowing air into the air hole 21, and valves, controllers and pipelines for connecting the air tank and the nozzle.

[0044] Based on the specific configuration of the dust removal structure 3, the dust removal body 31 forms a dust removal chamber 313, which is a sealed chamber structure. The carrier 2 and the PCB board located on the carrier 2 are both located in the dust removal chamber 313. At the same time, the first air nozzle 32 is also located in the dust removal chamber 313, so that during the dust removal process, the dust that detaches from the surface of the PCB board only stays inside the dust removal chamber 313. Furthermore, the dust floating inside the dust removal chamber 313 can be extracted by the dust extraction device, thereby ensuring that the dust will not disperse into the external environment, so as to ensure the cleanliness of the external environment for PCB board processing.

[0045] In this embodiment, as Figure 5 As shown, the carrier 2 is provided with an air hole 21, and the air hole 21 is located on the other side surface of the carrier 2 where the PCB board is placed. The carrier 2 is located in the dust removal chamber 313. The first air nozzle 32 located in the dust removal chamber 313 can also be limited in the air hole 21, so that the position of the first air nozzle 32 relative to the carrier 2 is fixed, and the position of the first air nozzle 32 relative to the PCB board is also fixed.

[0046] It is understandable that by limiting the position of the first air nozzle 32 located in the dust removal chamber 313 to the air hole 21 of the carrier 2 also located in the dust removal chamber 313, the position of the first air nozzle 32 can be limited, keeping the position of the first air nozzle 32 relative to the air hole 21 and relative to the carrier 2 fixed. This allows the high-speed airflow blown out by the first air nozzle 32 to enter through the air hole 21 and be blown directionally toward the PCB board surface. Thus, with the first air nozzle 32 fixed relative to the PCB board, the first air nozzle 32 can blow air to the fixed area of ​​the PCB board in a fixed direction to remove dust. Furthermore, during use, the placement position, air outlet angle, air outlet speed, and area blown toward the PCB board of the first air nozzle 32 are not affected by external factors. It can not only accurately and directionally blow air to remove dust from all or part of the PCB board, but also maintain the continuity and stability of the dust removal process, effectively improving the overall dust removal efficiency and cleanliness.

[0047] Of course, in this application, the carrier 2 is provided with an air hole 21 on the side facing the first air nozzle 32. The air hole 21 can penetrate the carrier 2 and is connected to the PCB board at the end away from the first air nozzle 32, so as to ensure that the airflow blown by the first air nozzle 32 toward the air hole 21 can be blown toward the PCB board. At the same time, a guide hole 24 is provided on the carrier 2. The guide hole 24 is connected to the air hole 21 so that the airflow blown by the first air nozzle 32 can be blown toward the PCB board through the air hole 21 and the guide hole 24, and the airflow with dust can be blown into other collection space or other dust extraction device through the guide hole 24.

[0048] Furthermore, the number of air holes 21 and the number of first air nozzles 32 can both be set to multiple. The position of the air holes 21 can be specifically set according to the specific cleaning area of ​​the PCB board or the arrangement position of the components. The position of the first air nozzles 32 is set corresponding to the air holes 21. Multiple air holes 21 and multiple first air nozzles 32 can cover the surface of the PCB board to be cleaned, so as to perform comprehensive air blowing dust removal on the PCB board.

[0049] The cleaning device 100 of this invention is used to clean PCB boards. The cleaning device 100 includes a base 1, a carrier 2, and a dust removal structure 3. The base 1 is used to support and install the carrier 2 and the dust removal structure 3. The carrier 2 is movably mounted on the base 1 and is used to support and place the PCB board. The carrier 2 is provided with air holes 21. The dust removal structure 3 includes a dust removal body 31 and a first air nozzle 32. The first air nozzle 32 is located on the dust removal body 31, which is mounted on the base 1 and has a dust removal chamber 313. The carrier... The first air nozzle 32 is located in the dust removal chamber 313, which allows the first air nozzle 32 to be confined in the air hole 21. The first air nozzle 32 can blow air onto the PCB board through the air hole 21. This application uses the carrier 2 to limit the PCB board and confines the first air nozzle 32, which is used to blow air onto the PCB board for dust removal, in the air hole 21 to ensure that the position of the first air nozzle 32 relative to the PCB board is fixed, so that the position of the first air nozzle 32 is not easily affected by external interference, thereby enabling precise and continuous cleaning and dust removal of the PCB board, thereby improving the overall dust removal efficiency.

[0050] In one embodiment of the present invention, such as Figures 1 to 4 As shown, the dust removal body 31 includes a first dust removal component 311 and a second dust removal component 312, which together form a dust removal chamber 313; a first air nozzle 32 is disposed on the first dust removal component 311 or the second dust removal component 312.

[0051] In this embodiment, the first dust removal component 311 and the second dust removal component 312 are disposed on the base 1 at a distance from each other. The first dust removal component 311 and the second dust removal component 312 are two parts of the dust removal body 31. The first dust removal component 311 and the second dust removal component 312 together enclose a dust removal chamber 313, and the carrier 2 is disposed in the dust removal chamber 313, such as the carrier 2 being disposed between the first dust removal component 311 and the second dust removal component 312.

[0052] The first dust removal component 311 and the second dust removal component 312 have roughly the same structure. They can be plate-shaped structures with grooves, shell structures or box structures with one-way openings, such as dust removal shells or dust removal boxes. Of course, they can also be bag structures made of soft materials such as polymers. There is no limitation here. The first dust removal component 311 and the second dust removal component 312 form a semi-cavity space with one-way openings through the shell structure, box structure or plate structure. When the first dust removal component 311 and the second dust removal component 312 are connected or abutted to each other, their one-way openings are interconnected, so that their respective semi-cavity spaces are combined to form a dust removal chamber 313, which is used to place the first air nozzle 32 and the carrier 2, as well as the PCB board placed on the carrier 2. The dust removal chamber 313 formed is a closed space to ensure the cleanliness of the dust removal environment.

[0053] Meanwhile, the relative position between the first dust removal component 311 and the second dust removal component 312 can be fixed or relatively movable, such as sliding relative to each other or towards each other along a straight line in the vertical or horizontal direction, so that the dust removal chamber 313 formed between the first dust removal component 311 and the second dust removal component 312 can be opened or closed, or remain normally closed. At the same time, the carrier 2 carrying the PCB board can also enter the dust removal chamber 313 when the dust removal chamber 313 is opened, so that the carrier 2 and the PCB board located on the carrier 2 are between the first dust removal component 311 and the second dust removal component 312. At the same time, the first air nozzle 32 is confined in the air hole 21 to realize air blowing dust removal on the PCB board. When the first air nozzle 32 blows air dust removal on the PCB board through the air hole 21, the dust removal chamber 313 remains in a sealed state.

[0054] It is understood that the first air nozzle 32 in this embodiment can be located on the first dust removal component 311 or on the second dust removal component 312. No limitation is made here. Depending on the location of the first air nozzle 32, the location of the PCB board mounted on the carrier 2 is also different. The PCB board is always located on the side of the carrier 2 facing away from the first air nozzle 32, so that the first air nozzle 32 can blow air to the PCB board to remove dust through the air hole 21. In this embodiment, by setting the first dust removal component 311 and the second dust removal component 312, a dust removal chamber 313 that can be opened or closed is formed. This makes it convenient for the carrier 2 and the PCB board to enter the dust removal chamber 313 through automated means, such as a sliding rail or a sliding conveyor module, to correspond with the first air nozzle 32 and to perform precise and continuous dust removal on the PCB board, effectively improving the overall dust removal efficiency.

[0055] In one embodiment of the present invention, such as Figure 2 and Figure 4 As shown, the dust removal structure 3 also includes a second air nozzle 33. The first air nozzle 32 is disposed in one of the first dust removal assembly 311 and the second dust removal assembly 312, and the second air nozzle 33 is disposed in the other of the first dust removal assembly 311 and the second dust removal assembly 312. The second air nozzle 33 is configured to blow air onto the PCB board.

[0056] In this embodiment, the dust removal structure 3 is further provided with a second air nozzle 33. The first air nozzle 32 and the second air nozzle 33 are respectively located at different positions on the dust removal body 31. The first air nozzle 32 may be located in one of the first dust removal component 311 or the second dust removal component 312 and is provided corresponding to the air hole 21 of the carrier 2. The second air nozzle 33 is located in the other of the first dust removal component 311 and the second dust removal component 312 and is provided corresponding to the PCB board of the carrier 2. The structure of the second air nozzle 33 is the same as that of the first air nozzle 32, including but not limited to an air tank for storing airflow or an air pump for generating airflow, a nozzle for blowing air into the air hole 21, and valves, controllers and pipelines for connecting the air tank and the nozzle. The first air nozzle 32 and the second air nozzle 33 may share the same air tank or air pump to reduce equipment parts and simplify the structure and volume of the cleaning device 100. The dust removal structure 3 includes multiple first air nozzles 32 and multiple second air nozzles 33.

[0057] It is understandable that the first air nozzle 32 and the second air nozzle 33 have different functions, and their dust removal methods and areas on the PCB board are also different. Specifically, the first air nozzle 32 is used to precisely remove dust from the side of the PCB board where components are inserted or mounted through the air hole 21, while the second air nozzle 33 is used to remove dust over a large area of ​​the PCB board. The side of the PCB board with components has a complex structure, and dust easily accumulates in the gaps between components and between components and the PCB board body, as well as on the pins and adsorbable surfaces of components. Moreover, the dust retained therein is difficult to clean. By directionally connecting the area of ​​the PCB board with components through the air hole 21 and blowing air through the air hole 21 with the first air nozzle 32, the dust on the area of ​​the PCB board with components can be precisely removed by blowing air, which not only improves the cleanliness of the dust removal, but also continuously removes dust from the side of the PCB board with components, effectively improving the dust removal efficiency.

[0058] Meanwhile, the second air nozzle 33 is arranged opposite to the first air nozzle 32, and multiple second air nozzles 33 are arranged facing the other side of the PCB board (that is, the side without components). They can also be arranged in a ring around the perimeter of the PCB board. The second air nozzles 33 are used to remove dust over a wide area of ​​the PCB board surface and edges where there are no components. The surface of this area is relatively flat, and the dust on it is easy to be blown or sucked away. Therefore, the second air nozzles 33 can be used to blow or suck air directly to remove dust from the PCB board surface.

[0059] It is understandable that by setting the first air nozzle 32 and the second air nozzle 33, dust can be removed from different areas of the PCB board. The first air nozzle 32 faces one side of the PCB board, and some of the multiple second air nozzles 33 face the other side of the PCB board. At the same time, another part of the multiple second air nozzles 33 is also set towards the periphery of the PCB board to completely surround the PCB board, thereby reducing cleaning dead corners and improving cleanliness. Furthermore, according to the different structural characteristics of different areas of the PCB board, the first air nozzle 32 is also adapted to have air holes 21, thereby improving the cleaning effect and cleaning efficiency on the complex surface of the PCB board.

[0060] In one embodiment of the present invention, such as Figures 2 to 4 As shown, the dust removal chamber 313 is provided with an upper mounting surface 3124 and a lower mounting surface 3114 that are parallel to each other. The lower mounting surface 3114 is provided on the first dust removal assembly 311, and the upper mounting surface 3124 is provided on the second dust removal assembly. The first air nozzle 32 is provided on the lower mounting surface 3114, the second air nozzle 33 is provided on the upper mounting surface 3124, and the carrier 2 is located between the first air nozzle 32 and the second air nozzle 33.

[0061] In this embodiment, the first dust removal component 311 and the second dust removal component 312 are vertically spaced on the base 1, and the carrier 2 is located between the first dust removal component 311 and the second dust removal component 312. That is, the second dust removal component 312 is located above the first dust removal component 311 and the carrier 2 in the vertical direction, and the first dust removal component 311 is located below the second dust removal component 312 and the carrier 2 in the vertical direction. The bottom wall of the semi-cavity space formed by the first dust removal component 311 is provided with a lower mounting surface 3114, and the bottom wall of the semi-cavity space formed by the second dust removal component 312 is provided with an upper mounting surface 3124. The upper mounting surface 3124 and the lower mounting surface 3114 are arranged parallel to each other so that the two bottom surfaces of the dust removal cavity 313 are parallel to each other in the vertical direction and are both parallel to the plane of the PCB board on the carrier 2.

[0062] Furthermore, the first air nozzle 32 is disposed on the lower mounting surface 3114, and the second air nozzle 33 is disposed on the upper mounting surface 3124, so that the first air nozzle 32 and the second air nozzle 33 are arranged opposite to each other, and the carrier 2 is positioned between the first air nozzle 32 and the second air nozzle 33. At the same time, the second air nozzle 33 disposed on the upper mounting surface 3124 is parallel to one side plane of the PCB board, and the first air nozzle 32 disposed on the lower mounting surface 3114 is parallel to the other side plane of the PCB board, so as to blow air to remove dust from both sides of the PCB board through the first air nozzle 32 and the second air nozzle 33.

[0063] It is understandable that by setting the upper mounting surface 3124 and the lower mounting surface 3114 to be parallel to each other, and setting the upper mounting surface 3124 and the lower mounting surface 3114 to be parallel to the plane where the PCB board is located, the air outlets of the first air nozzle 32 and the second air nozzle 33 can be kept parallel to the surface of the PCB board. This not only ensures that both sides of the PCB board can be effectively cleaned by blowing air, but also ensures that the effect of cleaning air on all parts of the PCB board is consistent, thereby improving the cleaning effect and cleaning efficiency.

[0064] In one embodiment of the present invention, such as Figure 2 and Figure 4 As shown, the carrier 2 is provided with a bearing plane 22, which is used to support the PCB board; the dust removal structure 3 also includes a positioning member 34, which is located on the dust removal body 31 and faces the bearing plane 22. The positioning member 34 and the first air nozzle 32 are located on both sides of the bearing plane 22.

[0065] In this embodiment, the carrier 2 is provided with a bearing plane 22 for bearing the PCB board. The bearing plane 22 is arranged parallel to the upper mounting surface 3124 and the lower mounting surface 3114, and the bearing plane 22 is arranged opposite to the upper mounting surface 3124. The dust removal structure 3 also includes a positioning member 34. The positioning member 34 is located on the second dust removal component 312 of the dust removal body 31 and on the upper mounting surface 3124. That is, the positioning member 34 and the second air nozzle 33 are both located on the upper mounting surface 3124, so that the positioning member 34 and the first air nozzle 32 are located on both sides of the bearing plane 22. Furthermore, there can be multiple positioning members 34. The positioning members 34 and the second air nozzle 33 can be distributed at intervals and staggered on the upper mounting surface 3124.

[0066] It is understandable that the positioning component 34 is used to position or limit the PCB board. The positioning component 34 can be a positioning post, positioning block, or positioning protrusion, etc. The main structure of the positioning component 34 extends from the upper mounting surface 3124 toward the PCB board on the bearing plane 22. When the first air nozzle 32 blows air to remove dust from the surface of the PCB board, the positioning component 34 can abut against the PCB board. The positioning component 34 and the bearing plane 22 together limit the PCB board to keep the position of the PCB board fixed during dust removal. It can also ensure the stability of the first air nozzle 32 when blowing air onto the PCB board through the air hole 21, and prevent the PCB board from shifting due to the strong airflow ejected by the first air nozzle 32, thereby improving the cleaning effect and cleaning efficiency.

[0067] In one embodiment of the present invention, such as Figure 1 and Figure 2As shown, the bearing plane 22 has interconnected clearance holes 23 and guide holes 24. The clearance holes 23 and / or guide holes 24 are connected to the air vent 21. The clearance holes 23 are used to limit the components on the PCB board. It can be understood that the bearing plane 22 of the carrier 2 has clearance holes 23 and guide holes 24. Components are inserted or mounted on one side of the PCB board. When the PCB board is placed on the bearing plane 22 of the carrier 2, the components on the PCB board can be limited in the clearance holes 23, so that the PCB board is limited on the carrier 2 and its position is fixed. Simultaneously, the clearance holes 23 and guide holes 24 are interconnected, and at least one of the clearance holes 23 and guide holes 24 is directly connected to the air vent 21, so that the air vent 21, clearance holes 23, and guide holes 24 are connected. When the air nozzle 32 blows air into the air hole 21, the airflow passes through the air hole 21 and blows towards the clearance hole 23 and / or guide hole 24 connected to it. This ensures that when blowing dust off the PCB board surface, the airflow can also flow from the guide hole 24 to the outer dust removal chamber 313, and further collect or absorb the dust-laden airflow. The bearing plane 22 can be provided with multiple guide holes 24, and at least one guide hole 24 can be connected to a clearance hole 23 to increase the flow area after the airflow flows out of the air hole 21, so as to avoid dust redeposition during the airflow process and ensure the effect of blowing dust removal.

[0068] Optionally, the positioning member 34 includes a base column 341 and a buffer member 342. The base column 341 is located on the dust removal body 31 and extends toward the bearing plane 22. The buffer member 342 is located on the side of the base column 341 facing the bearing plane 22. It is understood that the base column 341 of the positioning component 34 is located on the dust removal body 31, such as on the upper mounting surface 3124 of the second dust removal component 312. The main structure of the base column 341 extends from the upper mounting surface 3124 toward the bearing plane 22 of the carrier 2. A buffer 342 is provided at one end of the column of the base column 341 near the bearing plane 22. The buffer 342 can be made of soft rubber or silicone. When the positioning component 34 abuts against the PCB board surface, the buffer 342 can reduce the hard contact between the base column 341 and the PCB board, avoid damage to the surface of the PCB board, and improve the positioning and fixing effect of the positioning component 34 on the PCB board, thereby improving the blowing dust removal effect of the first air nozzle 32 and the second air nozzle 33 on the PCB board.

[0069] In one embodiment of the present invention, such as Figures 1 to 3 As shown, the first dust removal assembly 311 includes a base plate 3111 and a sealing frame 3112. The base plate 3111 is slidably connected to the base 1, and the sealing frame 3112 is disposed on the periphery of the base plate 3111. The sealing frame 3112 and the base plate 3111 enclose a first cleaning chamber 3113, and the air hole 21 communicates with the first cleaning chamber 3113. The first air nozzle 32 is disposed in the first cleaning chamber 3113.

[0070] In this embodiment, the base plate 3111 is a structural support component of the first dust removal assembly 311. The base plate 3111 has a plate-like structure, and the plane on which the plate surface of the base plate 3111 is located is parallel to the bearing plane 22 of the carrier 2. A lower mounting surface 3114 is formed on the side of the base plate 3111 facing the carrier 2. A sealing frame 3112 is provided at the periphery of the base plate 3111. The sealing frame 3112 has a central through structure. When the main structure of the sealing frame 3112 is located at the periphery of the base plate 3111, the side wall of the sealing frame 3112 and the lower mounting surface 3114 formed by the base plate 3111 enclose a first cleaning cavity 3113. The first cleaning cavity 3113 is the aforementioned semi-cavity space. The first air nozzle 32 is located in the first cleaning cavity 3113 and is located on the lower mounting surface 3114.

[0071] It is understandable that the first cleaning chamber 3113 is formed by the base plate 3111 and the sealing frame 3112, which can limit the placement of the first air nozzle 32. At the same time, when the first dust removal assembly 311 is connected to or abuts against the carrier 2, the sealing frame 3112 is sealed to the periphery of the carrier 2, thereby ensuring the sealing of the first cleaning chamber 3113. The air hole 21 provided in the carrier 2 is connected to the first cleaning chamber 3113. The first air nozzle 32 is limited and set in the air hole 21. Thus, when the first air nozzle 32 blows air to the PCB board to remove dust through the air hole 21, due to the sealing of the first cleaning chamber 3113, it can not only ensure that the airflow does not flow back into the first cleaning chamber 3113, but also ensure that it can be blown to the surface of the PCB board from the air hole 21. At the same time, it can also prevent the airflow carrying dust from flowing into the external environment, ensuring the cleanliness of dust removal and improving the dust removal effect.

[0072] Meanwhile, the base plate 3111 is slidably connected to the base platform 1. For example, a column 11 is provided on the base platform 1 in the vertical direction. The column 11 is provided with a slide rail. The base plate 3111 is provided with a driving component and a slider. The slider is slidably connected to the slide rail. The driving component drives the slider to slide relative to the slide rail so as to realize the movement of the base plate 3111 and the first dust removal component 311 relative to the base platform 1.

[0073] In one embodiment of the present invention, such as Figure 1 , Figure 2 as well as Figure 5 As shown, the cleaning device 100 also includes a mounting frame 4, which is slidably mounted on the base 1, and the carrier 2 is mounted on the mounting frame 4. The mounting frame 4 is provided with a sealing edge 41, which abuts against the sealing frame 3112. The carrier 2 covers the opening of the first cleaning chamber 3113 and makes the air hole 21 communicate with the first cleaning chamber 3113.

[0074] In this embodiment, the mounting frame 4 is slidably mounted on the base 1 along a plane parallel to the bearing plane 22. For example, a linear guide rail, synchronous belt, or double-speed chain structure can be provided on the base 1 to enable the sliding of the mounting frame 4. Simultaneously, the carrier 2 is mounted on the mounting frame 4, allowing the mounting frame 4 to drive the carrier 2 to slide relative to the base 1 and enter or exit the dust removal chamber 313. A sealing edge 41 is provided on the side of the mounting frame 4 facing the bottom plate 3111 of the first dust removal assembly 311. When the sealing edge 41 abuts against the sealing frame 3112, the carrier 2 covers the first cleaning chamber 311. The opening of the first cleaning chamber 3113 is sealed by the sealing edge 41 and the sealing frame 3112, and by the carrier 2 covering the opening of the first cleaning chamber 3113. This ensures that the airflow from the first air nozzle 32 in the first cleaning chamber 3113 blown towards the air hole 21 flows only through the air hole 21 to the PCB board surface, and effectively prevents the airflow with dust from flowing back into the first cleaning chamber 3113. This facilitates the collection and absorption of the airflow with dust, thereby improving the overall cleaning effect and efficiency of the air blowing dust removal.

[0075] In one embodiment of the present invention, such as Figure 1 , Figure 2 as well as Figure 4 As shown, the second dust removal assembly 312 includes a top plate 3121 and a dust cover 3122. The top plate 3121 is slidably connected to the base 1, and the dust cover 3122 is disposed on the periphery of the top plate 3121. The dust cover 3122 and the top plate 3121 enclose each other to form a second cleaning chamber 3123, and the air hole 21 communicates with the second cleaning chamber 3123.

[0076] In this embodiment, the top plate 3121 is a structural support component of the second dust removal assembly 312. The top plate 3121 has a plate-like structure, and the plane on which the plate surface of the top plate 3121 is located is parallel to the bearing plane 22 of the carrier 2. An upper mounting surface 3124 is formed on the side of the top plate 3121 facing the carrier 2. A dust cover 3122 is provided at the periphery of the top plate 3121. The dust cover 3122 has a central through structure. When the main structure of the dust cover 3122 is located at the periphery of the top plate 3121, the side wall of the dust cover 3122 and the upper mounting surface 3124 formed by the top plate 3121 enclose a second cleaning cavity 3123. The second cleaning cavity 3123 is the aforementioned semi-cavity space. The second air nozzle 33 is located in the second cleaning cavity 3123 and is located on the upper mounting surface 3124.

[0077] It is understandable that the top plate 3121 and the dust cover 3122 enclose and form the second cleaning chamber 3123, which can limit the setting of the second air nozzle 33 and the positioning component 34. At the same time, the top plate 3121 is slidably connected to the base 1. For example, a column 11 is set on the base 1 in the vertical direction. The column 11 is equipped with a slide rail. The top plate 3121 is equipped with a driving component and a slider. The slider is slidably connected to the slide rail. The driving component drives the slider to slide relative to the slide rail so that the top plate 3121 and the second dust removal component 312 are relative to the base 1. When the top plate 3121 moves and the second dust removal component 312 slides relative to the base 1, the dust removal cover abuts against the sealing frame 3112 of the first dust removal component 311, so that the bottom plate 3111, the sealing frame 3112, the dust cover 3122 and the top plate 3121 together enclose the dust removal chamber 313. Thus, when the second air nozzle 33 blows air to the PCB board to remove dust, the dust only exists in the dust removal chamber 313, preventing the airflow with dust from flowing to the external environment, ensuring the cleanliness of dust removal and improving the dust removal effect.

[0078] Optionally, such as Figure 4 As shown, the dust removal body 31 forms a dust removal chamber 313. The cleaning device 100 also includes a dust extraction component, which includes a fan and a dust extraction pipe 5 connected to each other. One end of the dust extraction pipe 5 is connected to the fan, and the other end of the dust extraction pipe 5 extends into the dust removal chamber 313. It can be understood that by setting the fan and the dust extraction pipe 5 connected to the fan, after the first air nozzle 32 and the second air nozzle 33 blow air onto the PCB board to remove dust, the fan can generate a high-speed airflow and extract the airflow containing dust in the dust removal chamber 313 through the dust extraction pipe 5, thereby achieving further collection and extraction of dust, ensuring the cleanliness of the first dust removal component 311 and the second dust removal component 312, as well as the carrier 2 and the PCB board in the dust removal chamber 313.

[0079] The present invention also proposes a processing device, which is the cleaning device 100 described above. The specific structure of the cleaning device 100 is as described in the foregoing embodiments. Since this processing device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, which will not be described in detail here.

[0080] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A cleaning device for cleaning a PCB board, characterized in that, The cleaning device comprises: a base; a carrier movably arranged on the base, the carrier being configured to carry a PCB board, the carrier being provided with an air hole; and a dust removal structure comprising a dust removal main body and a first air nozzle, the dust removal main body being arranged on the base, and the first air nozzle being arranged on the dust removal main body. The dust removal main body is provided with a dust removal cavity, and the carrier is arranged in the dust removal cavity, so that the first air nozzle is limited in the air hole, and the first air nozzle is configured to blow air to the PCB board through the air hole.

2. The cleaning device of claim 1, wherein, The dust removal main body comprises a first dust removal assembly and a second dust removal assembly, and the first dust removal assembly and the second dust removal assembly enclose the dust removal cavity. The first air nozzle is arranged on the first dust removal assembly or the second dust removal assembly.

3. The cleaning device of claim 2, wherein, The dust removal structure further comprises a second air nozzle, the first air nozzle is arranged on one of the first dust removal assembly and the second dust removal assembly, and the second air nozzle is arranged on the other one of the first dust removal assembly and the second dust removal assembly. The second air nozzle is configured to blow air to the PCB board.

4. The cleaning device of claim 3, wherein, The dust removal cavity is provided with upper and lower installation surfaces which are parallel to each other, the lower installation surface is arranged on the first dust removal assembly, and the upper installation surface is arranged on the second dust removal assembly. The first air nozzle is arranged on the lower installation surface, the second air nozzle is arranged on the upper installation surface, and the carrier is located between the first air nozzle and the second air nozzle.

5. The cleaning device of claim 1, wherein, The carrier is provided with a carrying plane configured to carry a PCB board. The dust removal structure further comprises a positioning member arranged on the dust removal main body and facing the carrying plane, and the positioning member and the first air nozzle are located on both sides of the carrying plane.

6. The cleaning device of claim 5, wherein, The carrying plane is provided with a clearance hole and a flow guide hole which are in communication with each other, the clearance hole and / or the flow guide hole are in communication with the air hole, and the clearance hole is configured to limit components on the PCB board. Furthermore, the positioning member comprises a base column arranged on the dust removal main body and extending towards the carrying plane, and a buffer arranged on one side of the base column facing the carrying plane.

7. The cleaning device of any one of claims 2 to 6, wherein, The first dust removal assembly comprises a bottom plate and a sealing frame, the bottom plate is slidably connected to the base, the sealing frame is arranged on the periphery of the bottom plate, the sealing frame and the bottom plate enclose a first cleaning cavity, and the air hole is in communication with the first cleaning cavity. The first air nozzle is arranged in the first cleaning cavity.

8. The cleaning device of claim 7, wherein, The cleaning device further comprises a mounting rack slidably arranged on the base, and the carrier is arranged on the mounting rack. The mounting rack is provided with a sealing edge abutting against the sealing frame, the carrier covers the cavity opening of the first cleaning cavity, and the air hole is in communication with the first cleaning cavity.

9. The cleaning device of any one of claims 2 to 6, wherein, The second dust removal assembly comprises a top plate and a dustproof cover, the top plate is slidably connected to the base, the dustproof cover is arranged on the periphery of the top plate, the dustproof cover and the top plate enclose a second cleaning cavity, and the air hole is in communication with the second cleaning cavity. And / or, the dust removal main body forms a dust removal cavity, and the cleaning device further comprises a dust suction assembly, the dust suction assembly comprising a fan and a dust suction pipe connected with each other, one end of the dust suction pipe being communicated with the fan, and the other end of the dust suction pipe extending into the dust removal cavity.

10. A processing apparatus characterized by comprising: The processing equipment comprises the cleaning device according to any one of claims 1 to 9.

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