Grinding device for jewelry processing
By using an atomization cooling and dust removal mechanism and adaptive adjustment technology, the problem of unstable positioning and uneven polishing of spherical gemstones caused by water flow impact in jewelry processing has been solved, achieving efficient and stable polishing results and surface protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-20
- Publication Date
- 2026-03-10
AI Technical Summary
In jewelry processing, the traditional water-spraying cooling method causes the spherical gemstones to shift slightly due to the impact of the water flow, which disrupts the coaxial positioning relationship and leads to problems such as uneven polishing thickness and surface scratches.
The system employs an atomization cooling and dust removal mechanism. Water mist is evenly sprayed onto the polishing area of the spherical gemstone through a ring-shaped distribution of atomizing nozzles. Combined with rotation speed detection and a moving resistance mechanism, the atomization pressure and atomization amount are adaptively adjusted to ensure stable positioning of the polishing head on the gemstone surface and uniform cooling and dust removal.
It achieves uniform cooling and dust removal across the entire surface of the spherical gemstone, avoiding thermal cracking, stress imbalance, and secondary scratches, improving polishing efficiency and quality stability, and protecting the optical texture of the gemstone surface.
Smart Images

Figure CN121624955A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of intelligent processing technology, and in particular relates to a polishing device for jewelry processing. Background Technology
[0002] In the jewelry manufacturing process, spherical gemstones, due to their unique curved shape and excellent optical properties, have become a commonly used core material in high-end jewelry design. The polishing of spherical gemstones is a key step in determining the quality of the finished product, such as the polishing device for jewelry manufacturing disclosed in announcement number CN222345005U.
[0003] Currently, the high-speed friction between the polishing head and the surface of the spherical gemstone during polishing generates a large amount of heat. If the heat cannot be dissipated in time, it can easily lead to damage such as thermal cracking and internal stress imbalance in the gemstone. To solve the problem of heat generation during polishing, water spraying is commonly used for cooling. Water is delivered to the polishing area to carry away the heat generated by friction and wash away polishing dust, preventing dust accumulation from causing secondary scratches on the surface of the spherical gemstone. However, traditional water spraying cooling methods mostly use direct water flow or ordinary spray structure. The water flow is in the form of columnar or large droplets, which will generate a significant impact force when it comes into contact with the surface of the spherical gemstone. Since the spherical gemstone has a curved structure and precise positioning is required during polishing to ensure uniform polishing of the spherical surface, the impact of the water flow can easily cause slight displacement of the gemstone, disrupting the coaxial positioning relationship between the center of the spherical gemstone and the polishing head, and thus causing problems such as uneven polishing thickness, surface scratches, or transitional defects.
[0004] Therefore, a polishing device for jewelry processing is proposed. Summary of the Invention
[0005] The purpose of this invention is to address the above-mentioned problems by providing a polishing apparatus for jewelry processing.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a polishing device for jewelry processing, comprising a base, a first support plate laterally movably mounted on one side of the top of the base, an annular moving assembly fixedly mounted on the side of the first support plate, an annular moving seat disposed inside the annular moving assembly, a first electric push rod fixedly mounted at the bottom of the annular moving seat, and a polishing mechanism fixedly mounted at the moving end of the first electric push rod, further comprising: Two second support plates are symmetrically fixed on the top of the base, and each of the two second support plates is provided with a clamping mechanism. The atomizing cooling and dust removal mechanism is fixedly installed on one side of the annular movable seat, and the annular output end of the atomizing cooling and dust removal mechanism extends to the outside of the grinding mechanism. A rotation speed detection mechanism is installed on the inner wall of the annular output end of the atomizing cooling and dust removal mechanism, and the rotation speed detection mechanism is used to detect the rotation speed of the grinding mechanism. The atomizing pressure and atomizing amount of the atomizing cooling and dust removal mechanism are adaptively adjusted according to the speed detected by the rotation speed detection mechanism. A movable resistance mechanism is provided on the bottom side of the first support plate, and the movable resistance mechanism can be linked with the first support plate. The atomizing cooling and dust removal mechanism adjusts the atomizing pressure according to the resistance change of the movable resistance mechanism. A PLC controller is fixedly mounted on the surface of one of the second support plates. A storage battery is fixedly mounted on the side wall of the annular moving base. The annular moving assembly, the first electric push rod, the grinding mechanism, the clamping mechanism, the atomizing cooling and dust removal mechanism, the speed detection mechanism, the moving resistance mechanism, and the storage battery are all electrically connected to the PLC controller.
[0007] Preferably, the grinding mechanism includes a fixed base fixedly mounted on the moving end of the first electric push rod, a grinding motor fixedly mounted at the bottom of the fixed base, a rotating shaft fixedly mounted at the output end of the grinding motor, and a grinding head fixedly mounted at the lower end of the rotating shaft.
[0008] Preferably, an electric slide rail is fixedly mounted horizontally on one side of the top of the base, and an electric slider is slidably mounted horizontally inside the electric slide rail. The bottom of the first support plate is fixedly connected to the top of the electric slider.
[0009] Preferably, the clamping mechanism includes a second electric push rod fixedly disposed on the side of the second support plate, a pressure sensor fixedly disposed on the moving end of the second electric push rod, and a clamping seat fixedly disposed on the detection end of the pressure sensor.
[0010] Preferably, the atomizing cooling and dust removal mechanism includes a first fixed plate fixedly mounted on the side wall of the annular movable seat. A water storage tank is fixedly mounted on the lower surface of the first fixed plate. A high-pressure water supply pump is fixedly mounted inside the water storage tank. A flexible water supply pipe extending to the outside of the water storage tank is fixedly mounted at the output end of the high-pressure water supply pump. An L-shaped water pipe is fixedly mounted at the end of the flexible water supply pipe away from the high-pressure water supply pump. An annular water pipe is fixedly mounted at the end of the L-shaped water pipe away from the flexible water supply pipe. The annular water pipe is located around the rotating shaft. L-shaped fixing rods are fixedly mounted between the top two sides of the annular water pipe and the two sides of the fixed seat. Multiple first atomizing nozzles and multiple second atomizing nozzles are fixedly mounted on both sides of the pipe wall of the annular water pipe. Flow regulating valves are fixedly mounted on the pipe walls of the multiple first atomizing nozzles and the multiple second atomizing nozzles. A pressure regulating valve is fixedly mounted on the pipe wall of the L-shaped water pipe.
[0011] Preferably, the rotational speed detection mechanism includes a housing fixedly disposed on the inner wall of the annular water pipe, an encoder fixedly disposed inside the housing, a first bevel gear fixedly disposed on the shaft wall of the rotating shaft, a transmission shaft rotatably disposed on the side wall of the housing, one end of the transmission shaft being fixedly connected to the rotating end of the encoder, and a second bevel gear fixedly disposed on the other end of the transmission shaft, the first bevel gear and the second bevel gear being meshed.
[0012] Preferably, the movable resistance mechanism includes a strip-shaped compartment that is horizontally fixedly disposed on the top of the electric slide rail. A resistance rod is fixedly disposed inside the strip-shaped compartment. A conductive block is slidably disposed on the wall of the resistance rod. A connecting rod is fixedly disposed on the side wall of the conductive block. The side wall of the connecting rod away from the conductive block is fixedly connected to the side of the first support plate.
[0013] Preferably, a water receiving box is fixedly provided on the top of the base and below the annular moving assembly.
[0014] Compared with existing technologies, the advantages of this invention are as follows: Through the atomizing cooling and dust removal mechanism, the ring-shaped atomizing nozzles can evenly spray water mist onto the polishing area of the spherical gemstone. This can quickly remove the heat generated during polishing, preventing the gemstone from cracking or becoming unbalanced due to overheating. It can also encapsulate and settle polishing dust, preventing it from causing secondary scratches on the gemstone surface. At the same time, the flexible lubricating film formed by the water mist can reduce the frictional resistance between the polishing head and the gemstone surface, improving polishing efficiency while protecting the optical texture of the gemstone surface and preventing polishing marks or excessive imperfections.
[0015] The rotational speed detection mechanism can capture the rotational speed of the grinding head in real time and feed it back to the PLC controller, enabling the atomization cooling and dust removal mechanism to adaptively adjust the atomization pressure and atomization amount. When the rotational speed increases, the atomization pressure increases synchronously to resist the interference of the rotating airflow, and the atomization amount increases accordingly to enhance the heat dissipation and dust removal effect. When the rotational speed decreases, the atomization pressure and atomization amount decrease appropriately to avoid high-pressure water mist impacting the gemstone or excessive water causing waste, ensuring that a stable cooling and dust removal effect can be maintained under different grinding conditions.
[0016] Through the set movable resistance mechanism, the grinding head moves laterally, causing the conductive block to slide on the resistance rod, which changes the resistance value of the movable resistance mechanism. The PLC controller accurately determines the relative position of the grinding head and the spherical gemstone based on the resistance change. When the distance between the atomizing nozzle and the curved surface of the gemstone increases, the PLC controller increases the atomizing pressure of the atomizing nozzle accordingly to compensate for the insufficient cooling and dust removal caused by the distance difference, completely eliminate the coverage blind spot during curved surface grinding, ensure uniform cooling and dust removal on the entire surface of the spherical gemstone, and further improve the stability of grinding quality. Attached Figure Description
[0017] Figure 1 This is a first-view perspective perspective view of a polishing device for jewelry processing provided by the present invention; Figure 2 This is a second-view perspective perspective view of a polishing device for jewelry processing provided by the present invention; Figure 3 This is a perspective top view of the structure on both sides and bottom of the annular moving seat in a polishing device for jewelry processing provided by the present invention. Figure 4 This is a perspective view of the clamping mechanism in a polishing device for jewelry processing provided by the present invention; Figure 5 This is a perspective view of the annular moving sides and bottom structure of a polishing device for jewelry processing provided by the present invention. Figure 6 This is a perspective view of the atomizing cooling and dust removal mechanism in a polishing device for jewelry processing provided by the present invention; Figure 7 This is a perspective view of the rotation speed detection mechanism in a polishing device for jewelry processing provided by the present invention; Figure 8 This is a perspective view of the moving resistance mechanism in a polishing device for jewelry processing provided by the present invention; Figure 9 This is a perspective view of the polishing structure, atomizing cooling and dust removal mechanism, and spherical gemstone in a polishing device for jewelry processing provided by the present invention.
[0018] In the diagram: 1. Base; 2. First support plate; 3. Circular moving assembly; 4. Circular moving seat; 5. First electric push rod; 6. Grinding mechanism; 61. Fixed seat; 62. Grinding motor; 63. Rotating shaft; 64. Grinding head; 7. Second support plate; 8. Clamping mechanism; 81. Second electric push rod; 82. Pressure sensor; 83. Clamping seat; 9. Atomizing cooling and dust removal mechanism; 91. First fixed plate; 92. Water tank; 93. High-pressure water pump; 94. Flexible water supply pipe; 95. L-shaped water pipe; 96. Circular water pipe; 97. L 98. Fixed rod, 99. First atomizing nozzle, 910. Second atomizing nozzle, 911. Flow regulating valve, 912. Pressure regulating valve, 10. Speed detection mechanism, 101. Housing, 102. Encoder, 103. First bevel gear, 104. Drive shaft, 105. Second bevel gear, 11. Moving resistance mechanism, 111. Strip chamber, 112. Resistance rod, 113. Conductive block, 114. Connecting rod, 12. PLC controller, 13. Battery, 14. Electric slide rail, 15. Electric slider, 16. Water receiving box. Detailed Implementation
[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0020] like Figures 1-9 As shown, a polishing device for jewelry processing includes a base 1. A first support plate 2 is laterally movable on one side of the top of the base 1. An electric slide rail 14 is laterally fixed on one side of the top of the base 1. An electric slider 15 is laterally slidable inside the electric slide rail 14. The bottom of the first support plate 2 is fixedly connected to the top of the electric slider 15. An annular moving assembly 3 is fixedly mounted on the side of the first support plate 2. An annular moving seat 4 is disposed inside the annular moving assembly 3. The annular moving assembly 3 adopts a gear ring, a spur gear, and an annular moving motor (this assembly structure is prior art and is not shown in the figure). A first electric push rod 5 is fixedly mounted on the bottom of the movable base 4. A grinding mechanism 6 is fixedly mounted on the moving end of the first electric push rod 5. The grinding mechanism 6 includes a fixed base 61 fixedly mounted on the moving end of the first electric push rod 5. A grinding motor 62 is fixedly mounted on the bottom of the fixed base 61. A rotating shaft 63 is fixedly mounted on the output end of the grinding motor 62. A grinding head 64 is fixedly mounted on the lower end of the rotating shaft 63. The grinding surface of the grinding head 64 is hemispherical to improve the contact effect between the grinding head 64 and the curved surface of the spherical gemstone. A water receiving box 16 is fixedly mounted on the top of the base 1 and below the annular moving component 3. It also includes: Two second support plates 7 are symmetrically fixed on the top of the base 1. Each of the two second support plates 7 is provided with a clamping mechanism 8. The clamping mechanism 8 includes a second electric push rod 81 fixedly mounted on the side of the second support plate 7. A pressure sensor 82 is fixedly mounted on the moving end of the second electric push rod 81. A clamping seat 83 is fixedly mounted on the detection end of the pressure sensor 82. The side wall of the clamping seat 83 is a concave arc surface, and the concave arc surface matches the surface of the spherical gemstone. Displacement sensors are installed on the moving ends of the two second electric push rods 81 to collect their respective extension and retraction displacement data in real time. The displacement deviation of the two second electric push rods 81 is compared, and the output signal is dynamically adjusted to ensure that the extension and retraction of the two are synchronized.
[0021] Atomizing cooling and dust removal mechanism 9 is fixedly installed on one side of the annular movable seat 4, and the annular output end of the atomizing cooling and dust removal mechanism 9 extends to the outside of the grinding mechanism 6. The atomizing cooling and dust removal mechanism 9 includes a first fixed plate 91 fixedly installed on the side wall of the annular movable seat 4. A water storage tank 92 is fixedly installed on the lower surface of the first fixed plate 91. A water supply pipe is provided on the side wall of the water storage tank 92 for replenishing water to the inside of the water storage tank 92. A high-pressure water supply pump 93 is fixedly installed inside the water storage tank 92. A soft water supply pipe 94 extending to the outside of the water storage tank 92 is fixedly installed at the output end of the high-pressure water supply pump 93. An L-shaped water pipe 95 is fixedly installed at the end of the soft water supply pipe 94 away from the high-pressure water supply pump 93. An annular water pipe 96 is fixedly installed at the end of the L-shaped water pipe 95 away from the soft water supply pipe 94. Pipe 96 is located around the rotating shaft 63. L-shaped fixing rods 97 are fixed between the top two sides of the annular water pipe 96 and the two sides of the fixing seat 61. Multiple first atomizing nozzles 98 and multiple second atomizing nozzles 99 are fixed on both sides of the pipe wall of the annular water pipe 96. Flow regulating valves 910 are fixed on the pipe walls of the multiple first atomizing nozzles 98 and the multiple second atomizing nozzles 99. Pressure regulating valves 911 are fixed on the pipe wall of the L-shaped water pipe 95. Both the flow regulating valve 910 and the pressure regulating valve 911 are electrically controlled. The high-pressure water pump 93 delivers water from the water storage tank 92 to the soft water supply pipe 94, the L-shaped water pipe 95 and the annular water pipe 96. After the water flows through the pipeline, it is evenly sprayed out as water mist through the multiple first atomizing nozzles 98 and multiple second atomizing nozzles 99 distributed in an annular pattern.
[0022] A speed detection mechanism 10 is installed on the inner wall of the annular output end of the atomizing cooling and dust removal mechanism 9. The speed detection mechanism 10 is used to detect the speed of the grinding mechanism 6. The atomizing pressure and atomizing amount of the atomizing cooling and dust removal mechanism 9 are adaptively adjusted according to the speed detected by the speed detection mechanism 10. The speed detection mechanism 10 includes a housing 101 fixedly installed on the inner wall of the annular water pipe 96. An encoder 102 is fixedly installed inside the housing 101. A first bevel gear 103 is fixedly installed on the shaft wall of the rotating shaft 63. A transmission is rotatably installed on the side wall of the housing 101. Shaft 104, one end of which is fixedly connected to the rotating end of encoder 102, and the other end of which is fixedly provided with a second bevel gear 105. The first bevel gear 103 and the second bevel gear 105 are meshed together. When the rotating shaft 63 rotates, it will synchronously drive the first bevel gear 103. The first bevel gear 103 and the second bevel gear 105 mesh and drive the transmission shaft 104 to rotate synchronously. The end of the transmission shaft 104 is linked with the rotating shaft 63 of encoder 102, so that encoder 102 can detect the rotation speed of rotating shaft 63 in real time.
[0023] The movable resistance mechanism 11 is located at the bottom side of the first support plate 2 and can be linked with the first support plate 2. The atomizing cooling and dust removal mechanism 9 adjusts the atomizing pressure according to the resistance change of the movable resistance mechanism 11. The movable resistance mechanism 11 includes a strip-shaped compartment 111 that is horizontally fixed on the top of the electric slide rail 14. A resistance rod 112 is fixedly installed inside the strip-shaped compartment 111. A conductive block 113 is slidably installed on the wall of the resistance rod 112. A connecting rod 114 is fixedly installed on the side wall of the conductive block 113. The side wall of the connecting rod 114 away from the conductive block 113 is fixedly connected to the side of the first support plate 2. Both the strip-shaped compartment 111 and the connecting rod 114 are made of insulating material. When the first support plate 2 moves, it will drive the connecting rod 114 to move in tandem. The connecting rod 114 drives the conductive block 113 to slide smoothly on the surface of the resistance rod 112, thereby changing the resistance value of the resistance rod 112 connected to the measurement circuit.
[0024] The PLC controller 12 is fixedly mounted on the surface of one of the second support plates 7. The side wall of the annular moving seat 4 is fixedly equipped with a storage battery 13. The annular moving assembly 3, the first electric push rod 5, the grinding mechanism 6, the clamping mechanism 8, the atomizing cooling and dust removal mechanism 9, the speed detection mechanism 10, the moving resistance mechanism 11, and the storage battery 13 are all electrically connected to the PLC controller 12.
[0025] The operating principle of this invention is described as follows: The operator first operates the PLC controller 12 to start the second electric push rods 81 on both sides, and then quickly places the spherical gemstone to be processed between the two clamping seats 83. As the two second electric push rods 81 extend synchronously, they drive the corresponding clamping seats 83 to move towards each other until the two clamping seats 83 contact the two sides of the spherical gemstone and complete the clamping. During the clamping process, the spherical gemstone will exert a reverse force on the clamping seats 83. This force is transmitted to the pressure sensor 82. The pressure sensor 82 captures the magnitude of the squeezing force of the clamping seats 83 on the spherical gemstone in real time and feeds back the detected pressure signal to the PLC controller 12 in real time. The PLC controller 12 dynamically adjusts the extension and retraction stroke of the first electric push rod 5, thereby avoiding excessive clamping force that may cause the spherical gemstone to be squeezed and broken, or surface scratches, and ensuring the safety and stability of the gemstone clamping process. After the clamping action is completed, the staff simultaneously starts the annular moving component 3, the first electric push rod 5, the grinding motor 62 and the high-pressure water pump 93 through the PLC controller 12. The first electric push rod 5 extends downward, driving the fixed base 61 and the grinding motor 62, the rotating shaft 63 and the grinding head 64 at the bottom to move down synchronously until the grinding head 64 makes stable contact with the top of the spherical gemstone. After the grinding motor 62 starts, it drives the grinding head 64 to rotate at high speed through the rotating shaft 63. At the same time, the annular moving component 3 drives the annular moving base 4 to move smoothly along the preset trajectory, thereby driving the high-speed rotating grinding head 64 to perform all-round annular grinding on the spherical surface of the gemstone, ensuring that the spherical surface is ground evenly without dead corners. During the polishing process, the high-pressure water pump 93 delivers water from the water tank 92 to the soft water supply pipe 94, the L-shaped water pipe 95, and the annular water pipe 96. After the water flows through the pipes, it is evenly sprayed out as water mist through multiple first atomizing nozzles 98 and multiple second atomizing nozzles 99 distributed in an annular pattern. The fine water mist covers the polishing area of the spherical gemstone, which can not only quickly remove the large amount of heat generated by the friction between the polishing head 64 and the gemstone, thus preventing the gemstone from cracking, internal stress imbalance, or material deterioration due to local overheating, but also promptly wrap and settle the dust generated during polishing, preventing dust from accumulating on the spherical surface and causing secondary scratches. At the same time, the flexible lubricating film formed by the water mist can reduce the frictional resistance between the polishing head 64 and the surface of the gemstone, thereby improving polishing efficiency and protecting the optical texture of the gemstone surface, avoiding polishing marks or over-processing defects. When the grinding motor 62 is running, the rotating shaft 63 synchronously drives the first bevel gear 103 to rotate. The first bevel gear 103 meshes with the second bevel gear 105, driving the transmission shaft 104 to rotate synchronously. The end of the transmission shaft 104 is linked with the rotating shaft 63 of the encoder 102, enabling the encoder 102 to detect the rotation speed of the rotating shaft 63 in real time and accurately feed the speed signal back to the PLC controller 12. The PLC controller 12 adjusts the opening of the flow regulating valve 910 in real time according to the speed, realizing dynamic matching between the atomized water volume and the operating power of the grinding motor 62. The higher the rotation speed, the more heat and dust are generated during polishing, and the water supply increases accordingly to ensure timely heat dissipation and sufficient dust settling, maintaining a clean and safe polishing environment. During low-speed fine polishing, the water supply is reduced to prevent excessive water mist buildup from affecting the polishing field of vision or causing gemstone displacement. Furthermore, the high-speed rotation of the polishing head 64 generates strong airflow, which can easily disturb the water mist pattern, causing it to disperse and cover unevenly. To address this, the PLC controller 12 synchronously adjusts the opening of the pressure regulating valves 911 on the first atomizing nozzle 98 and the second atomizing nozzle 99 according to the rotation speed of the polishing head 64, dynamically matching the water mist pressure. The force and rotational speed of the polishing head 64 are controlled. When the rotational speed increases, the water mist pressure increases accordingly, giving the water mist stronger directional penetration and resistance to airflow interference. This ensures that the water mist always tightly covers the polishing contact point and will not be blown away by the airflow. When the rotational speed decreases, the water mist pressure decreases appropriately to avoid unnecessary impact of high-pressure water mist on the surface of the gemstone. This precise linkage between pressure and rotational speed not only ensures the stability of the cooling and dust removal effect, but also keeps the water mist fine and uniform, further reducing the impact on the spherical gemstone. Combined with the ring-shaped nozzle design, it achieves uniform cooling and dust removal on the entire surface, providing a strong guarantee for high-quality polishing. After the surface of the spherical gemstone has been polished in a ring, the PLC controller 12 immediately activates the electric slider 15 inside the electric slide rail 14. The electric slider 15 drives the first support plate 2 to move smoothly, which in turn drives the first electric push rod 5, the polishing motor 62, and the polishing head 64 to move laterally in sync. The initial position of the electric slider 15 is set in the middle of the electric slide rail 14 to ensure that the polishing head 64 is precisely in contact with the top of the spherical gemstone in the initial state. During the lateral movement, the PLC controller 12 continuously outputs signals to control the first electric push rod 5 to extend, thereby compensating for the curvature difference of the spherical gemstone and ensuring that the polishing head 64 is always in close contact with the spherical surface of the gemstone, so as to continuously perform the rotational polishing operation and avoid the problem of polishing blind spots or over-polishing due to the undulation of the curved surface. As the first support plate 2 moves, it simultaneously drives the connecting rod 114. The connecting rod 114 causes the conductive block 113 to slide smoothly on the surface of the resistor rod 112, thereby changing the resistance value of the resistor rod 112 connected to the measurement circuit. A detection circuit is connected between the resistor rod 112 and the conductive block 113. The detection circuit will generate corresponding electrical signal fluctuations as the resistance value changes. This electrical signal is collected in real time and fed back to the PLC controller 12 to accurately determine the real-time position of the grinding head 64 and the atomizing nozzle relative to the spherical gemstone. As the grinding head 64 moves to the left, the annular water pipe 96 moves to the left synchronously. As the distance between the multiple first atomizing nozzles 98 and the curved surface of the spherical gemstone gradually increases, if the original atomization parameters are maintained, the water mist coverage will decrease due to the increased distance, and it will not be able to fully reach the grinding contact point. In response to this situation, the PLC controller 12 automatically increases the opening of the pressure regulating valve 911 on the multiple first atomizing nozzles 98 according to the increasing trend of the feedback electrical signal, thereby increasing the water mist pressure of the first atomizing nozzles 98, enhancing the directional penetration and coverage of the water mist, thereby compensating for the defects of insufficient cooling and dust removal caused by excessive spacing, and ensuring that the grinding area is always in a stable cooling and dust removal state. like Figure 9 As shown, when the grinding head 64 continues to move to the left, the distance between the multiple second atomizing nozzles 99 and the curved surface of the spherical gemstone also increases. The PLC controller 12 also increases the opening of the pressure regulating valve 911 on the second atomizing nozzle 99 according to the trend of the change of the electrical signal, and simultaneously strengthens the water mist pressure of the second atomizing nozzle 99 to achieve dynamic compensation of the atomization effect and completely eliminate the problem of uneven cooling caused by the difference in distance between the first atomizing nozzle 98 and the second atomizing nozzle 99 and the spherical surface. After the left side of the spherical gemstone is polished, the PLC controller 12 controls the electric slider 15 to reset and simultaneously drives the first electric push rod 5 to retract, causing the polishing head 64 to return to the initial position in the middle of the electric slide rail 14. Then the controller controls the electric slider 15 to move to the right along the electric slide rail 14, and completes the polishing operation of the right side of the spherical gemstone with symmetrical control logic, ultimately achieving all-round uniform polishing of the gemstone surface. During the polishing process, the wastewater carrying polishing dust will flow naturally down the surface of the gemstone and the ring moving component 3 (the bottom of the ring moving component 3 is equipped with a drain hole). Under the action of gravity, it will collect in the water collection box 16, which can effectively prevent the dust-containing wastewater from splashing and seeping everywhere, and prevent the processing table from being stained and dusty. This not only keeps the equipment operation area clean and tidy, but also reduces the workload of subsequent table cleaning.
[0026] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A polishing device for jewelry processing, comprising a base (1), wherein a first support plate (2) is laterally movably disposed on one side of the top of the base (1), an annular moving assembly (3) is fixedly disposed on the side of the first support plate (2), an annular moving seat (4) is disposed inside the annular moving assembly (3), a first electric push rod (5) is fixedly disposed at the bottom of the annular moving seat (4), and a polishing mechanism (6) is fixedly disposed at the moving end of the first electric push rod (5), characterized in that, Also includes: Two second branch plate (7), symmetrically fixed on the top of the base (1), the surface of the two second branch plate (7) is provided with clamping mechanism (8); Atomization cooling dust removal mechanism (9) is fixedly arranged on one side of the annular moving seat (4), and the annular output end of the atomization cooling dust removal mechanism (9) extends to the outside of the polishing mechanism (6); The rotating speed detection mechanism (10) is arranged on the inner wall of the annular output end of the atomization cooling dust removal mechanism (9), and the rotating speed detection mechanism (10) is used for detecting the rotating speed of the polishing mechanism (6), the atomization pressure and the atomization amount of the atomization cooling dust removal mechanism (9) are adaptively adjusted according to the speed detected by the rotating speed detection mechanism (10); The moving resistance changing mechanism (11) is arranged on the side surface of the first branch plate (2), and the moving resistance changing mechanism (11) can be linked with the first branch plate (2), the atomization cooling dust removal mechanism (9) adjusts the atomization pressure according to the resistance change of the moving resistance changing mechanism (11); The PLC controller (12) is fixedly arranged on the surface of one of the second branch plates (7), the side wall of the annular moving seat (4) is fixedly provided with a battery (13), the annular moving assembly (3), the first electric push rod (5), the polishing mechanism (6), the clamping mechanism (8), the atomization cooling dust removal mechanism (9), the rotating speed detection mechanism (10), the moving resistance changing mechanism (11) and the battery (13) are electrically connected with the PLC controller (12).
2. The polishing device for processing jewelry according to claim 1, characterized in that, The polishing mechanism (6) comprises a fixed seat (61) fixedly arranged on the moving end of the first electric push rod (5), the bottom of the fixed seat (61) is fixedly provided with a polishing motor (62), the output end of the polishing motor (62) is fixedly provided with a rotating shaft (63), and the lower end of the rotating shaft (63) is fixedly provided with a polishing head (64).
3. The polishing device for processing jewelry according to claim 1, characterized in that, The top side of the base (1) is fixedly provided with an electric sliding rail (14), the inside of the electric sliding rail (14) is slidably provided with an electric sliding block (15), and the bottom of the first branch plate (2) is fixedly connected with the top of the electric sliding block (15).
4. The polishing device for processing jewelry according to claim 1, characterized in that, The clamping mechanism (8) comprises a second electric push rod (81) fixedly arranged on the side surface of the second branch plate (7), the moving end of the second electric push rod (81) is fixedly provided with a pressure sensor (82), and the detection end of the pressure sensor (82) is fixedly provided with a clamping seat (83).
5. The polishing device for processing jewelry according to claim 2, wherein The atomization cooling and dust removal mechanism (9) comprises a first fixed plate (91) fixedly arranged on the side wall of the annular moving seat (4), a water storage tank (92) fixedly arranged on the lower surface of the first fixed plate (91), a high-pressure water supply pump (93) fixedly arranged in the water storage tank (92), a soft water supply pipe (94) fixedly arranged on the output end of the high-pressure water supply pump (93) and extending to the outside of the water storage tank (92), an L-shaped water pipe (95) fixedly arranged on the end of the soft water supply pipe (94) away from the high-pressure water supply pump (93), an annular water pipe (96) fixedly arranged on the end of the L-shaped water pipe (95) away from the soft water supply pipe (94), the annular water pipe (96) being located on the periphery of the rotating shaft (63), L-shaped fixed rods (97) fixedly arranged between the top sides of the annular water pipe (96) and the two sides of the fixed seat (61), a plurality of first atomizing nozzles (98) and a plurality of second atomizing nozzles (99) fixedly arranged on the two sides of the pipe wall of the annular water pipe (96), flow regulating valves (910) fixedly arranged on the pipe walls of the plurality of first atomizing nozzles (98) and the plurality of second atomizing nozzles (99), and a pressure regulating valve (911) fixedly arranged on the pipe wall of the L-shaped water pipe (95).
6. The polishing device for processing jewelry according to claim 5, wherein The rotating speed detection mechanism (10) comprises a shell (101) fixedly arranged on the inner wall of the annular water pipe (96), an encoder (102) fixedly arranged in the shell (101), a first bevel gear (103) fixedly arranged on the shaft wall of the rotating shaft (63), a transmission shaft (104) rotatably arranged on the side wall of the shell (101), one end of the transmission shaft (104) being fixedly connected with the rotating end of the encoder (102), the other end of the transmission shaft (104) being fixedly provided with a second bevel gear (105), and the first bevel gear (103) and the second bevel gear (105) being meshingly arranged.
7. The polishing device for processing jewelry according to claim 3, wherein The moving resistance changing mechanism (11) comprises a strip-shaped bin (111) fixedly arranged horizontally on the top of the electric sliding rail (14), an electric resistance rod (112) fixedly arranged in the strip-shaped bin (111), an electrically-conductive block (113) slidably arranged on the rod wall of the electric resistance rod (112), a connecting rod (114) fixedly arranged on the side wall of the electrically-conductive block (113), and the side wall of the connecting rod (114) away from the electrically-conductive block (113) being fixedly connected with the side surface of the first supporting plate (2).
8. The polishing device for processing jewelry according to claim 1, wherein A water receiving box (16) is fixedly arranged on the top of the base (1) and below the annular moving assembly (3).
Citation Information
Patent Citations
Grinding device for jewelry processing
CN222345005U