Magnetic control device for functional composite powder and multi-layer coating method

Abstract

The invention discloses a functional composite powder magnetic control device and a multi-layer coating method, the functional composite powder magnetic control device comprises a plurality of vacuum magnetic control coating chambers and a cathode unit, and further comprises a powder dispersion chamber, a buffer vortex chamber and a powder collection chamber, the plurality of vacuum magnetic control coating chambers are arranged in a vertical state to form a multi-stage magnetron sputtering chamber, every two adjacent vacuum magnetic control coating chambers are communicated through the buffer vortex chamber, the powder dispersing chamber is arranged at the top of each vacuum magnetic control coating chamber, and the powder collecting chamber is arranged at the bottom of each vacuum magnetic control coating chamber; a discharging hole is formed in the bottom face of the powder dispersing chamber, and an air outlet hole is formed in the bottom of the powder collecting chamber. By the adoption of the magnetic control device and the multi-layer coating method, continuous processing can be achieved, the coating requirements of different materials and powder particle sizes can be met, the thickness distribution of a coated film layer can be more uniform, and therefore the application field of products can be expanded, and the use requirements of functional composite powder products can be met.

Description

Technical Field

[0001] This invention relates to the field of functional metal powder materials technology, specifically to a magnetron sputtering device and a multilayer coating method for functional composite powders. Background Technology

[0002] Functional powder materials are powder materials with special physical, chemical, or biological activities. Through the synergistic effect of nano- or micron-sized particles, they achieve a variety of functional properties and are widely used in electronics, communications, battery materials, energy, industrial manufacturing, and environmental protection materials, thereby meeting the needs of different fields. With the advancement of technology and the development of the materials industry, powder surface coating modification technology has been gradually applied to all aspects of the industry. The principle of powder coating modification is to uniformly introduce one or more other components onto the surface of powder particles, forming a deposition layer of a certain thickness through chemical reactions or physical adsorption, thereby changing the surface properties of the powder or endowing the powder with new properties.

[0003] In existing technologies, powder coating modification techniques mainly fall into two categories: liquid phase methods and gas phase methods. The former includes methods such as mechanochemical methods, liquid phase precipitation methods, sol-gel methods, and chemical plating, while the latter mainly refers to physical vapor deposition and chemical vapor deposition methods.

[0004] Magnetron sputtering is a highly advantageous physical vapor deposition technique, widely used in microelectronics, optical thin films, and material surface treatment. Magnetron sputtering equipment is commonly used for thin film deposition. Magnetron sputtering technology utilizes high-energy particles to bombard a target material, sputtering target atoms onto the substrate surface to form a thin film. The working principle of magnetron sputtering is that electrons, under the influence of an electric field E, collide with argon atoms as they fly towards the substrate, ionizing them to produce Ar ions and new electrons. The new electrons fly towards the substrate, while the Ar ions, under the influence of the electric field, accelerate towards the cathode target and bombard the target surface with high energy, sputtering target atoms or molecules. The sputtered atoms or molecules then fly onto the substrate surface and accumulate there, forming a thin film, thus obtaining a coated powder material.

[0005] For coating methods of functional powder materials, existing magnetron sputtering technology suffers from drawbacks. Traditional vacuum coating equipment typically has a linear structure, with the substrate fed into multiple vacuum chambers from one end and exiting from the other. This results in a long production line. Furthermore, because multiple electrodes within the vacuum coating equipment use the same target material, only one type of material can be coated. When different powder materials need to be coated, continuous processing cannot be achieved, leading to increased production cycles, low production efficiency, and difficulty in controlling production costs. Additionally, the inability to achieve continuous processing with existing coating methods can easily cause segregation of the coated powder, thus affecting its application scenarios.

[0006] To achieve continuous processing, meet the multi-layer coating requirements of different materials and powder particle sizes, effectively improve powder coating efficiency, reduce processing costs, and make the film thickness distribution more uniform, avoiding segregation caused by uneven distribution, it is necessary to improve existing vacuum coating equipment and provide a magnetic control device and multi-layer coating method for functional composite powders to expand the application range of functional composite powders. Summary of the Invention

[0007] To address the aforementioned problems, the present invention aims to achieve continuous processing and meet the multi-layer coating requirements of different materials and powder particle sizes. This provides a magnetron sputtering device for functional composite powders. By improving vacuum coating equipment, the deposition rate of the film can be increased, and the film thickness distribution can be made more uniform, avoiding segregation caused by uneven distribution. This expands the application areas of the product to meet the usage requirements of functional composite powder products. Specifically, it provides a magnetron sputtering device and a multi-layer coating method for functional composite powders.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: a magnetic control device for functional composite powders, comprising a vacuum magnetic control coating chamber and cathode units, wherein the vacuum magnetic control coating chamber is equipped with a pumping system and a filling system, and the vacuum magnetic control coating chamber is provided with multiple coating cavities, and multiple cathode units are provided, the multiple cathode units being arranged in a ring within the coating cavities to form a ring magnetic control region, and further comprising a powder dispersion chamber, a buffer eddy current chamber, and a powder collection chamber, wherein the vacuum magnetic control coating chamber is provided with multiple units, and the multiple vacuum magnetic control coating units are arranged in a ring within the coating cavities to form a ring magnetic control region, and further comprising a powder dispersion chamber, a buffer eddy current chamber, and a powder collection chamber. The coating chambers are arranged vertically to form a multi-stage magnetron sputtering chamber. Adjacent vacuum magnetron coating chambers are connected by a buffer eddy current chamber. The powder dispersion chamber is located at the top of the vacuum magnetron coating chamber above the multi-stage magnetron sputtering chamber, while the powder collection chamber is located at the bottom of the vacuum magnetron coating chamber below the multi-stage magnetron sputtering chamber. The bottom surface of the powder dispersion chamber has a feeding hole corresponding to the annular magnetron area, and the top of the powder dispersion chamber has a conveying pipe connection hole for connecting with the medium gas. The bottom of the powder collection chamber has a gas outlet.

[0009] Furthermore, in the magnetic control device for functional composite powder described in this invention, an ultrasonic vibrator is provided on the outer side of the powder dispersion chamber, and multiple feeding holes are provided. The multiple feeding holes are arranged in a ring on the bottom surface of the powder dispersion chamber and correspond to the annular magnetic control area of ​​the vacuum magnetic control coating chamber.

[0010] Furthermore, in the magnetic control device for functional composite powder described in this invention, the buffer vortex chamber is a cylindrical structure with openings at both ends, and a stirring device is provided inside the buffer vortex chamber.

[0011] Furthermore, in the magnetic control device for functional composite powder described in this invention, the powder collection chamber is a conical structure with openings at both ends, an air outlet pipe communicating with an external air extraction unit is provided at the air outlet, and a detachable filter screen is also provided at the air outlet.

[0012] Furthermore, in the magnetic control device for functional composite powder described in this invention, at least two vacuum magnetic control coating chambers are provided, and the two vacuum magnetic control coating chambers are connected by a buffer eddy current chamber. The cathode unit includes a target cylinder and a target body, both of which are hollow cylindrical structures, and the target body is sleeved on the target cylinder.

[0013] Furthermore, in the magnetic control device for functional composite powder described in this invention, the target body is made of any one of metal target material, alloy target material or non-metal target material to form a cylindrical structure, and the target bodies in two adjacent vacuum magnetic control coating chambers are made of the same material or different materials.

[0014] The present invention also provides a method for multilayer coating of functional composite powders using the above-mentioned magnetron sputtering device, the multilayer coating method comprising the following steps: S1. Place the raw powder to be coated in the powder dispersion chamber in advance, and use the feeding hole at the bottom of the powder dispersion chamber to allow the raw powder to enter the vacuum magnetic coating chamber; S2. Before the raw powder enters the vacuum magnetron coating chamber, the pumping and filling systems configured in the vacuum magnetron coating chamber are activated in advance to make the vacuum magnetron coating chamber a vacuum environment; then the power supply configured in the cathode unit is activated to sputter the atoms or molecules in the target body to achieve one magnetron sputtering. After sputtering deposition, one coated powder is obtained. S3. The primary coated powder obtained by sputtering deposition enters the buffer vortex chamber, and then enters the vacuum magnetron coating chamber. At the same time, the power supply configured in the cathode unit is turned on to sputter atoms or molecules in the target material, realizing secondary magnetron sputtering. After sputtering deposition, secondary coated powder is obtained. Before the primary coated powder enters the vacuum magnetron coating chamber, the pumping and filling systems configured in the vacuum magnetron coating chamber are turned on in advance to make the vacuum magnetron coating chamber a vacuum environment. After sputtering deposition from top to bottom until the coating layer meets the specified particle size, it finally enters the powder collection chamber. S4. Activate the external gas extraction unit connected to the powder collection chamber, so that the coated powder entering the powder collection chamber settles and the functional composite powder product is obtained.

[0015] Furthermore, in the multi-layer coating method described in this invention, during the process of conveying the original powder into the vacuum magnetic control coating chamber in step S1, it is necessary to start the ultrasonic vibrator located on the outer side of the powder dispersion chamber so that the original powder in the powder dispersion chamber enters the vacuum magnetic control coating chamber evenly through the feeding hole; at the same time, during the feeding process, a medium gas is connected to the outside through the conveying pipe connection hole located at the top of the powder dispersion chamber, and the medium gas is conveyed into the powder dispersion chamber through the conveying pipe connection hole. The medium gas is an inert gas.

[0016] Furthermore, in the multi-layer coating method described in this invention, the inert gas is any one of nitrogen, argon, and helium, the pressure of the inert gas is 0.3 to 1.5 MPa, and the flow rate of the inert gas is 0.3 to 0.8 L / min.

[0017] Furthermore, in the multilayer coating method described in this invention, the vacuum environment in steps S2 and S3 is achieved by controlling the pumping and filling systems to maintain a vacuum level of 0.3–1 Pa in the vacuum magnetron sputtering chamber; and the magnetron sputtering is achieved by controlling the current of the cathode unit to 5–15 A, causing atoms or molecules in the target material to be sputtered out. The sputtered atoms or molecules fly to the powder surface and accumulate there, thereby achieving sputtering deposition and forming a coating layer.

[0018] The magnetic control device and multi-layer coating method for functional composite powders described in this invention have the following advantages compared to existing technologies: Multiple coating cavities are provided within the vacuum magnetic control coating chamber, and cathode units are configured within these cavities. These cathode units form an annular magnetic control region, enabling magnetic sputtering using multiple coating cavities. Simultaneously, through the configured powder dispersion chamber, buffer eddy current chamber, and powder collection chamber, the original powder in the dispersion chamber enters the vacuum magnetic control coating chamber through the feeding hole. The cathode units within the vacuum magnetic control coating chamber then perform a single magnetic sputtering operation. A thin film is coated onto the surface of the original powder, which then re-enters the vacuum magnetron sputtering chamber through a buffer eddy current chamber for secondary magnetron sputtering. By connecting multiple magnetron sputtering processes, the coating speed and uniformity can be greatly improved, thereby achieving multi-layer coating and meeting the preparation requirements of functional composite powders. The multi-layer coated product enters the powder collection chamber to obtain the functional composite powder product. Since the entire preparation process is carried out in a sealed environment, without introducing impurities and harmful substances, it can effectively improve the coating rate and deposition uniformity of the functional composite powder.

[0019] Therefore, it can be seen that by using the magnetron sputtering device and multi-layer coating method described in this invention, magnetron sputtering can be achieved in a vacuum environment using multiple coating cavities. This not only enables continuous processing and meets the multi-layer coating requirements of different materials and powder particle sizes, but also makes the coating film thickness distribution more uniform, avoiding segregation problems caused by uneven distribution. This expands the application field of the product to meet the usage requirements of functional composite powder products. Its overall structural design is reasonable, convenient to operate and control, and suitable for widespread application. Attached Figure Description

[0020] The present invention will now be described in further detail with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the magnetic control device described in Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the planar structure of the vacuum magnetron encapsulation chamber described in the invention; Figure 3 This is an enlarged schematic diagram of the planar structure of the encapsulated cavity described in the invention; Figure 4 This is a schematic diagram of the planar structure of the powder dispersion chamber described in the invention; Figure 5 This is a schematic diagram of the planar structure of the buffer vortex chamber described in the invention; Figure 6 This is a schematic diagram of the planar structure of the powder collection chamber described in the invention; Figure 7 This is a schematic diagram of the magnetic control device described in Embodiment 2 of the present invention; Figure 8 This is a schematic diagram of the magnetic control device described in Embodiment 3 of the present invention; Figure 9 These are before and after images of the product obtained by the coating method described in Embodiment 5 of the present invention.

[0022] The diagram shows: 1-vacuum magnetron coating chamber, 11-coating cavity, 2-cathode unit, 21-target cylinder, 22-target body, 3-powder dispersion chamber, 31-feeding hole, 32-conveying pipe, 4-buffered vortex chamber, 41-stirring device, 5-powder collection chamber, 51-air outlet, 52-air outlet pipe, 53-filter screen, 6-ultrasonic vibrator. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0024] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and to facilitate understanding. They are not intended to limit the scope of the invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness or purpose of the invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," and "right" used in this specification are merely for clarity and not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0025] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connection" and "provided with" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] It should be noted that the term "comprising" or any other variation is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Example 1

[0027] like Figures 1 to 6 As shown, this embodiment provides a magnetron sputtering device for functional composite powders, including a vacuum magnetron sputtering coating chamber 1 and a cathode unit 2. The vacuum magnetron sputtering coating chamber 1 is equipped with a pumping system and a filling system. Multiple coating cavities 11 are provided within the vacuum magnetron sputtering coating chamber 1. Multiple cathode units 2 are provided, arranged in a ring within the coating cavities 11 to form a ring-shaped magnetron sputtering region. The device also includes a powder dispersion chamber 3, a buffer eddy current chamber 4, and a powder collection chamber 5. Two vacuum magnetron sputtering coating chambers 1 are provided, and the two vacuum magnetron sputtering coating chambers 1 are vertically aligned. The system is arranged to form a two-stage magnetron sputtering chamber. The two vacuum magnetron coating chambers 1 are connected by a buffer eddy current chamber 4. The powder dispersion chamber 3 is located at the top of the vacuum magnetron coating chamber 1 in the upper part of the multi-stage magnetron sputtering chamber, while the powder collection chamber 5 is located at the bottom of the vacuum magnetron coating chamber 1 in the lower part of the multi-stage magnetron sputtering chamber. The bottom surface of the powder dispersion chamber 3 is provided with a feeding hole 31 corresponding to the annular magnetron area, and the top of the powder dispersion chamber 3 is provided with a conveying pipe connection hole 32 for connecting with the medium gas. The bottom of the powder collection chamber 5 is provided with a gas outlet 51.

[0028] Furthermore, the magnetic control device for functional composite powder provided in this embodiment is adopted, wherein the buffer vortex chamber 4 is a cylindrical structure with openings at both ends, and a stirring device 41 is provided in the buffer vortex chamber 4.

[0029] The powder collection chamber 5 is a conical structure with openings at both ends. An air outlet pipe 52 communicating with an external air extraction unit is provided at the air outlet 51, and a detachable filter screen 53 is also provided at the air outlet 51.

[0030] The cathode unit 2 includes a target cylinder 21 and a target body 22, both of which are hollow cylindrical structures. The target body 22 is fitted onto the target cylinder 21. The target body 22 is a cylindrical structure made of any one of the following materials: metal, alloy, or non-metallic. The target bodies 22 in two adjacent vacuum magnetron sputtering chambers 1 may be made of the same material or different materials. In practical applications, the specific material of the target body 22 can be selected according to needs. Simultaneously, the size of the feed hole 31 on the bottom surface of the powder dispersion chamber 3 is determined based on the actual particle size of the powder. Example 2

[0031] like Figure 7 As shown, this embodiment is based on Embodiment 1. To enable vibration of the powder dispersion chamber 3, it facilitates the smooth entry of the raw powder to be coated into the vacuum magnetic control coating chamber 1. Using the magnetic control device provided in this embodiment, an ultrasonic vibrator 6 is provided on the outer side of the powder dispersion chamber 3, and multiple feeding holes 31 are arranged in a ring on the bottom surface of the powder dispersion chamber 3, corresponding to the annular magnetic control area of ​​the vacuum magnetic control coating chamber 1. Utilizing the configured ultrasonic vibrator 6, the raw powder to be coated in the powder dispersion chamber 3 can smoothly enter the vacuum magnetic control coating chamber 1 under vibration. Example 3

[0032] like Figure 8 As shown, this embodiment is based on Embodiment 2. To achieve the coating of two layers of functional composite powder and expand the application scenarios of functional composite powder, a magnetron sputtering device for functional composite powder provided in this embodiment is adopted. Three vacuum magnetron coating chambers 1 are provided, arranged vertically to form a three-stage magnetron sputtering chamber. Adjacent vacuum magnetron coating chambers 1 are connected by a buffer eddy current chamber 4. By arranging the three vacuum magnetron coating chambers 1 sequentially from top to bottom to form a three-stage magnetron sputtering chamber, it is possible to coat the original powder with two layers of coating. Example 4

[0033] This embodiment provides a multi-layer coating method for functional composite powders using the above-mentioned magnetron sputtering device. The multi-layer coating method includes the following steps: S1. The raw powder to be coated is placed in the powder dispersion chamber 3 in advance. The raw powder enters the vacuum magnetic control coating chamber 1 through the feeding hole 31 at the bottom of the powder dispersion chamber 3. At the same time, during the feeding process, the ultrasonic vibrator 6 set on the outer side of the powder dispersion chamber 3 needs to be started so that the raw powder in the powder dispersion chamber 3 enters the vacuum magnetic control coating chamber 1 evenly through the feeding hole 31. In addition, during the feeding process, a medium gas is connected to the external medium gas through the conveying pipe connection hole 32 set on the top of the powder dispersion chamber 3. The medium gas is an inert gas, which can be any one of nitrogen, argon and helium. The pressure of the inert gas is 0.3 to 1.5 MPa, and the flow rate of the inert gas is required to be 0.3 to 0.8 L / min. S2. Before the raw powder enters the vacuum magnetron coating chamber 1, the pumping system and the gas filling system configured in the vacuum magnetron coating chamber 1 are started in advance to make the vacuum magnetron coating chamber 1 a vacuum environment; then the power supply configured in the cathode unit 2 is started to sputter the atoms or molecules in the target body 22 to achieve one magnetron sputtering. After sputtering deposition, one coated powder is obtained. S3. The primary coated powder obtained by sputtering deposition enters the buffer vortex chamber 4, and then enters the vacuum magnetron coating chamber 1 from the buffer vortex chamber 4. At the same time, the power supply configured in the cathode unit 2 is turned on, so that the atoms or molecules in the target body 22 are sputtered out to achieve secondary magnetron sputtering. After sputtering deposition, secondary coated powder is obtained. Before the primary coated powder enters the vacuum magnetron coating chamber 1, the pumping system and gas filling system configured in the vacuum magnetron coating chamber 1 are turned on in advance to make the vacuum magnetron coating chamber 1 a vacuum environment. After sputtering deposition from top to bottom until the coating layer meets the specified particle size, it finally enters the powder collection chamber 5. S4. Activate the external gas extraction unit connected to the powder collection chamber 5, so that the coated powder entering the powder collection chamber 5 settles and the functional composite powder product is obtained.

[0034] In the specific coating method, the vacuum environment in steps S2 and S3 is maintained at a vacuum level of 0.3–1 Pa in the vacuum magnetron sputtering chamber 1 by controlling the pumping and filling systems. The magnetron sputtering is achieved by controlling the current of the cathode unit 2 to 5–15 A, causing atoms or molecules in the target material 22 to be sputtered out. These sputtered atoms or molecules then fly to the powder surface and accumulate there, thus achieving sputtering deposition and forming the coating layer. During the sputtering process, the thickness of the resulting coating layer can be controlled by adjusting the sputtering time and power. Example 5

[0035] According to the coating method provided in Example 4, this example provides a method of coating two layers of stainless steel metal powder material on the surface of copper-gold powder to obtain a stainless steel functional composite powder with two coating layers. By forming a dense metal barrier layer, it can significantly block the diffusion of water, oxygen and corrosive media to the core of copper-gold powder, reduce the risk of oxygen absorption corrosion and discoloration in humid and weakly alkaline environments, and thus expand the application scenarios of this functional composite powder.

[0036] This embodiment utilizes the magnetron sputtering device provided in Embodiment 2. The vacuum magnetron sputtering coating chamber 1 has two chambers, from top to bottom, namely a primary coating chamber and a secondary coating chamber. It is used to prepare two layers of stainless steel functional composite powder. The specific coating method includes the following steps: S1. The copper-gold powder to be coated is placed in the powder dispersion chamber 3 in advance. The raw powder enters the primary coating chamber through the feeding hole 31 at the bottom of the powder dispersion chamber 3. At the same time, during the feeding process, the ultrasonic vibrator 6 set on the outer side of the powder dispersion chamber 3 needs to be started so that the raw powder in the powder dispersion chamber 3 enters the primary coating chamber evenly through the feeding hole 31. In addition, during the feeding process, a medium gas is connected to the external medium gas through the conveying pipe connection hole 32 set on the top of the powder dispersion chamber 3. The medium gas is an inert gas, the inert gas is argon, the pressure of the inert gas is 1.2MPa, and the flow rate of the inert gas is required to be 0.8L / min. S2. Before the raw powder enters the primary coating chamber, the pumping and filling systems of the vacuum magnetron coating chamber 1 are activated in advance to make the coating chamber a vacuum environment; then the power supply of the cathode unit 2 is activated to sputter the atoms or molecules in the target body 22 to achieve one magnetron sputtering. After sputtering deposition, a primary coated powder is obtained. S3. The primary coated powder obtained by sputtering deposition enters the buffer vortex chamber 4, and then enters the secondary coated chamber from the buffer vortex chamber 4. At the same time, the power supply configured in the cathode unit 2 is turned on, so that the atoms or molecules in the target body 22 are sputtered out to achieve secondary magnetron sputtering. After sputtering deposition, secondary coated powder is obtained. Before the primary coated powder enters the secondary coated chamber, the pumping system and gas filling system configured in the vacuum magnetron coated chamber 1 are turned on in advance to make the vacuum magnetron coated chamber 1 a vacuum environment. After two sputtering depositions from top to bottom, until the coating layer meets the specified particle size, it finally enters the powder collection chamber 5. S4. Activate the external gas extraction unit connected to the powder collection chamber 5, so that the coated powder entering the powder collection chamber 5 settles and the stainless steel functional composite powder product is obtained.

[0037] In the specific coating method, the target body 22 in both the primary and secondary coating chambers uses a metal target, specifically stainless steel. The vacuum environment in steps S2 and S3 is achieved by controlling the pumping and filling systems to maintain a vacuum level of 0.5 Pa in the coating chamber. The magnetron sputtering involves controlling the current of the cathode unit 2 to 5–10 A, causing atoms or molecules in the target body 22 to be sputtered. These sputtered atoms or molecules then fly to the powder surface and accumulate there, thus achieving sputtering deposition and forming a coating layer. During the sputtering process, the thickness of the resulting coating layer can be controlled by adjusting the sputtering time and power. The products before and after coating are shown... Figure 9 As shown. Example 6

[0038] According to the coating method provided in Example 4, this example provides a method of coating a copper nanolayer on the surface of aluminum powder particles, then coating a Fe2O3 nanolayer on the copper nanolayer, and finally coating a SiC nanolayer on the Fe2O3 nanolayer to form a three-layer coating, thereby obtaining a silicon carbide functional composite powder with a three-layer coating, which can broaden the application field of the material.

[0039] This embodiment utilizes the magnetron sputtering device provided in Embodiment 3. The vacuum magnetron sputtering coating chamber 1 is provided with three chambers, from top to bottom, namely a primary coating chamber, a secondary coating chamber, and a tertiary coating chamber, for preparing silicon carbide functional composite powder with three coating layers. The specific coating method includes the following steps: S1. The copper-gold powder to be coated is placed in the powder dispersion chamber 3 in advance. The raw powder enters the primary coating chamber through the feeding hole 31 at the bottom of the powder dispersion chamber 3. At the same time, during the feeding process, the ultrasonic vibrator 6 set on the outer side of the powder dispersion chamber 3 needs to be started so that the raw powder in the powder dispersion chamber 3 enters the primary coating chamber evenly through the feeding hole 31. In addition, during the feeding process, a medium gas is connected to the external medium gas through the conveying pipe connection hole 32 set on the top of the powder dispersion chamber 3. The medium gas is an inert gas, the inert gas is argon, the pressure of the inert gas is 1.5MPa, and the flow rate of the inert gas is required to be 0.5L / min. S2. Before the raw powder enters the primary coating chamber, the pumping and filling systems of the vacuum magnetron coating chamber 1 are activated in advance to make the primary coating chamber a vacuum environment; then the power supply of the cathode unit 2 is activated to sputter the atoms or molecules in the target body 22 to achieve one magnetron sputtering, and after sputtering deposition, a primary coated powder is obtained; the target body 22 is made of stainless steel. S3. The primary coated powder obtained by sputtering deposition enters the buffer vortex chamber 4, and then enters the secondary coated chamber from the buffer vortex chamber 4. At the same time, the power supply configured in the cathode unit 2 is turned on, so that the atoms or molecules in the target body 22 are sputtered out to achieve secondary magnetron sputtering. After sputtering deposition, the secondary coated powder is obtained. S4. The secondary coated powder obtained by sputtering deposition enters the buffer vortex chamber 4, and then enters the tertiary coating chamber from the buffer vortex chamber 4. At the same time, the power supply configured in the cathode unit 2 is turned on to sputter the atoms or molecules in the target body 22, realizing three-stage magnetron sputtering. After sputtering deposition, the three-stage coated powder is obtained. Meanwhile, before the primary coated powder enters the secondary coated chamber, and before the secondary coated powder enters the tertiary coated chamber, the pumping and filling systems of the vacuum magnetically controlled coated chamber 1 need to be activated in advance to ensure that the corresponding coated chamber is in a vacuum environment. After three sputtering depositions from top to bottom until the coated layer meets the specified particle size, it finally enters the powder collection chamber 5. S5. Activate the external gas extraction unit connected to the powder collection chamber 5, so that the coated powder entering the powder collection chamber 5 will settle and the copper-gold functional composite powder product will be obtained.

[0040] In the specific coating process, the target body 22 in the primary coating chamber uses a copper target, the target body 22 in the secondary coating chamber uses an iron target, and the target body 22 in the tertiary coating chamber uses a non-metallic SiC nano-target. The vacuum environment in steps S2, S3, and S4 is maintained at a vacuum level of 0.8 Pa by controlling the pumping and filling systems. The magnetron sputtering is performed by controlling the current of the cathode unit 2 to 10–15 A, thereby sputtering atoms or molecules from the target body 22. These sputtered atoms or molecules fly to the powder surface and accumulate there, thus achieving sputtering deposition and forming the coating layer. During the sputtering process, the thickness of the resulting coating layer can be controlled by adjusting the sputtering time and power.

[0041] Therefore, by employing the magnetron sputtering device and multilayer coating method described in this invention, multiple coating cavities are provided within the vacuum magnetron sputtering chamber, and cathode units are configured within these cavities. These cathode units form an annular magnetron sputtering region, and magnetron sputtering is achieved using these multiple coating cavities. Simultaneously, through the configured powder dispersion chamber, buffer eddy current chamber, and powder collection chamber, the original powder in the powder dispersion chamber enters the vacuum magnetron sputtering chamber through the feed hole. Utilizing the cathode units within the vacuum magnetron sputtering chamber, a single magnetron sputtering is achieved, thereby coating the surface of the original powder with a layer of... The thin film is then passed through a buffer eddy current chamber and re-enters the vacuum magnetron sputtering chamber for secondary magnetron sputtering. By connecting multiple magnetron sputtering processes, the coating speed and uniformity can be greatly improved, thereby achieving multi-layer coating and meeting the preparation requirements of functional composite powders. The multi-layer coated product enters the powder collection chamber to obtain the functional composite powder product. Since the entire preparation process is carried out in a sealed environment, without introducing impurities and harmful substances, it can effectively improve the coating rate and deposition uniformity of the functional composite powder.

[0042] In summary, the magnetron sputtering device and multilayer coating method described in this invention enable magnetron sputtering in a vacuum environment using a coating cavity. This not only allows for continuous processing, meeting the multilayer coating requirements of different materials and powder particle sizes, but also ensures a more uniform film thickness distribution, avoiding segregation problems caused by uneven distribution. This expands the application range of the product to meet the requirements of functional composite powder products. Its overall structural design is reasonable, convenient for operation and control, and suitable for widespread application.

[0043] Other aspects of this invention that are not detailed herein are all conventional techniques known to those skilled in the art.

[0044] The scope of protection of this invention is not limited to the technical solutions disclosed in the specific embodiments. The above description is only a preferred embodiment of this invention and does not limit this invention. Any minor modifications, equivalent substitutions and improvements made based on the technical solutions of this invention should be included within the scope of protection of the technical solutions of this invention.

Claims

1. A magnetron device for functional composite powder, comprising a vacuum magnetron coating chamber (1) and a cathode unit (2), wherein the vacuum magnetron coating chamber (1) is provided with a gas extraction system and a gas supply system, characterized in that: The vacuum magnetron coating chamber (1) is provided with a plurality of coating cavities (11), and the cathode unit (2) is provided with a plurality of cathode units (2) arranged in the coating cavities (11) in a ring shape to form a ring-shaped magnetron region, and further comprising a powder dispersing chamber (3), a buffer vortex chamber (4) and a powder collecting chamber (5), the vacuum magnetron coating chamber (1) is provided with a plurality of vacuum magnetron coating chambers (1), and the plurality of vacuum magnetron coating chambers (1) are arranged in a vertical state to form a multi-stage magnetron sputtering chamber, and the adjacent two vacuum magnetron coating chambers (1) are connected through the buffer vortex chamber (4), the powder dispersing chamber (3) is arranged on the top of the vacuum magnetron coating chamber (1) at the upper part of the multi-stage magnetron sputtering chamber, and the powder collecting chamber (5) is arranged at the bottom of the vacuum magnetron coating chamber (1) at the lower part of the multi-stage magnetron sputtering chamber; the powder dispersing chamber (3) is provided with a discharging hole (31) corresponding to the ring-shaped magnetron region on the bottom surface, and a conveying connector (32) for connecting with a medium gas is arranged on the top of the powder dispersing chamber (3); and the powder collecting chamber (5) is provided with an air outlet hole (51) at the bottom.

2. The functional composite powder magnetron device according to claim 1, wherein: An ultrasonic vibration machine (6) is arranged on the outer side of the powder dispersing chamber (3), the discharging hole (31) is provided with a plurality of discharging holes (31) arranged in a circular ring shape on the bottom surface of the powder dispersing chamber (3) and corresponding to the ring-shaped magnetron region of the vacuum magnetron coating chamber (1).

3. The functional composite powder magnetron device of claim 1, wherein: The buffer vortex chamber (4) is a cylindrical structure with open ends, and a stirring device (41) is arranged in the buffer vortex chamber (4).

4. The functional composite powder magnetron device of claim 1, wherein: The powder collecting chamber (5) is a conical structure with open ends, an air outlet pipe (52) connected with an external air extraction unit is arranged at the air outlet hole (51), and a detachable filter screen (53) is further arranged at the air outlet hole (51).

5. The functional composite powder magnetron device of claim 1, wherein: The vacuum magnetron coating chamber (1) is provided with at least two vacuum magnetron coating chambers (1), the two vacuum magnetron coating chambers (1) are connected through the buffer vortex chamber (4), the cathode unit (2) comprises a target cylinder (21) and a target body (22), the target cylinder (21) and the target body (22) are both hollow cylindrical structures, and the target body (22) is sleeved on the target cylinder (21).

6. A functional composite powder magnetron device according to claim 5, characterized in that: The target body (22) is made of any one of metal target material, alloy target material or non-metal target material in a cylindrical structure, and the target bodies (22) in the adjacent two vacuum magnetron coating chambers (1) are made of the same material or different materials.

7. The multi-layer coating method for functional composite powders using the magnetron device according to any one of claims 1 to 6, characterized in that, The multi-layer coating method comprises the following steps: S1. The original powder to be coated is placed in the powder dispersing chamber (3) in advance, and the original powder enters the vacuum magnetron coating chamber (1) through the discharging hole (31) at the bottom of the powder dispersing chamber (3); S2. Before the original powder enters the vacuum magnetron coating chamber (1), the vacuum environment of the vacuum magnetron coating chamber (1) is established by starting the air extraction system and the air charging system of the vacuum magnetron coating chamber (1) in advance, and then the power supply of the cathode unit (2) is started to make the atoms or molecules in the target body (22) sputter to realize the first magnetron sputtering, and the first coated powder is obtained through sputtering deposition; S3. The primary coated powder obtained by sputtering deposition enters the buffer vortex chamber (4), and then enters the vacuum magnetic coating chamber (1) from the buffer vortex chamber (4), at the same time, the power supply arranged in the cathode unit (2) is started to make the atoms or molecules in the target body (22) sputter, so as to realize secondary magnetron sputtering deposition, and obtain secondary coated powder; and before the primary coated powder enters the vacuum magnetic coating chamber (1), the vacuum magnetic coating chamber (1) is started in advance to make the vacuum magnetic coating chamber (1) in a vacuum environment; after sputtering deposition from top to bottom, until the coating layer meets the specified particle size, finally enter the powder collecting chamber (5); S4. The external gas extraction unit connected with the powder collecting chamber (5) is started, so that the coated powder in the powder collecting chamber (5) is obtained after settling, and the functional composite powder product is obtained.

8. The multi-layer coating method of claim 7, wherein: In the process of transporting the raw powder into the vacuum magnetic coating chamber (1) in the step S1, the ultrasonic vibrator (6) arranged on the outer side of the powder dispersion chamber (3) is started to make the raw powder in the powder dispersion chamber (3) uniformly enter the vacuum magnetic coating chamber (1) through the discharge hole (31); at the same time, the medium gas is connected to the conveying pipe joint hole (32) arranged at the top of the powder dispersion chamber (3) during the discharging process, and the medium gas is conveyed to the powder dispersion chamber (3) through the conveying pipe joint hole (32), and the medium gas is inert gas.

9. The multi-layer coating method of claim 8, wherein: The inert gas is any one of nitrogen, argon and helium, the pressure of the inert gas is 0.3-1.5 MPa, and the flow rate of the inert gas is 0.3-0.8 L / min.

10. The multi-layer coating method of claim 9, wherein: The vacuum environment in the steps S2 and S3 is obtained by controlling the gas extraction system and the gas charging system, so that the vacuum degree of the vacuum magnetic coating chamber (1) is 0.3-1 Pa; and the magnetron sputtering is controlled by controlling the current of the cathode unit (2) to be 5-15 A, so that the atoms or molecules in the target body (22) sputter, and the sputtered atoms or molecules fly to the powder surface and accumulate on the surface, so as to realize sputtering deposition and form a coating layer.

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