Active heat dissipation device based on graphene aluminum fins and semiconductor refrigeration wafer

Abstract

The invention discloses heat dissipation equipment and method based on a semiconductor refrigeration wafer, belongs to the technical field of heat dissipation of hydraulic systems, and aims to solve the technical problem that heat dissipation of a vehicle-mounted hydraulic system is difficult to implement effectively due to space limitation. The heat dissipation equipment comprises a heat dissipation unit, a power unit and a connecting unit, the power unit comprises an oil pumping opening and an oil conveying opening, and the oil pumping opening and the oil conveying opening communicate with the oil tank and the heat dissipation unit correspondingly. The heat dissipation unit comprises at least one heat dissipation assembly, the heat dissipation assembly comprises a semiconductor refrigeration wafer and a heat dissipation piece, and the semiconductor refrigeration wafer is attached to the outer surface of the heat dissipation piece; a heat dissipation channel is formed in the heat dissipation piece, and the two ends of the heat dissipation channel communicate with the oil conveying opening and the oil tank correspondingly; the power unit can drive oil in the oil tank to flow through the heat dissipation channel for active heat dissipation. The heat dissipation equipment is compact in structure, small in occupied space and high in heat dissipation efficiency, and the heat dissipation requirement of the vehicle-mounted hydraulic system is met.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of heat dissipation of hydraulic systems, and relates to a heat dissipation device and method based on semiconductor refrigeration chips. BACKGROUND

[0002] As an important equipment component of special vehicles or engineering vehicles, the hydraulic equipment needs to have good heat dissipation effect to ensure stable operation of the system. Since the heat dissipation device of the ordinary hydraulic pump station needs to occupy a large space and a large power, it is not suitable for use in the vehicle-mounted hydraulic system.

[0003] Therefore, the existing vehicle-mounted hydraulic system can only not add a heat dissipation device, or a passive heat dissipation device is arranged between the oil return pipelines of the hydraulic system. Since the passive heat dissipation device is arranged between the oil return pipelines, the oil needs to be subjected to the action of the executing element, and can only enter the passive heat dissipation device for oil heat dissipation during the oil return process. If the vehicle-mounted hydraulic system is debugged, tested and operated under the condition that the ambient temperature is relatively high, the oil temperature rise will be accelerated. In order to avoid the influence of the oil temperature rise on the stable operation of the system, the hydraulic system often needs to be stopped and wait for the oil temperature to drop to the operable range before starting again. SUMMARY

[0004] In view of the above analysis, the application aims to provide a heat dissipation device and method based on semiconductor refrigeration chips, which are used to solve the technical problem that the vehicle-mounted hydraulic system is difficult to effectively implement heat dissipation due to space limitation.

[0005] The main purpose of the application is achieved by the following technical solutions.

[0006] The application provides a heat dissipation device based on semiconductor refrigeration chips, which comprises a heat dissipation unit, a power unit and a connecting unit. The power unit comprises an oil extraction port and an oil delivery port, and the oil extraction port and the oil delivery port are respectively connected with an oil tank and the heat dissipation unit. The heat dissipation unit comprises at least one group of heat dissipation components, and the heat dissipation components comprise a semiconductor refrigeration chip and a heat dissipation piece, and the semiconductor refrigeration chip is attached to the outer surface of the heat dissipation piece. The heat dissipation piece is provided with a heat dissipation channel, and the two ends of the heat dissipation channel are respectively connected with the oil delivery port and the oil tank. The power unit can drive the oil in the oil tank to flow through the heat dissipation channel for active heat dissipation.

[0007] Further, the heat dissipation piece comprises a heat dissipation shell and a plurality of heat dissipation fins, and the heat dissipation shell is open at both ends, and the plurality of heat dissipation fins are fixed on the inner wall of the heat dissipation shell.

[0008] Further, the plurality of heat dissipation fins separate the space in the heat dissipation shell into a plurality of heat dissipation channels.

[0009] Further, the heat dissipation channel is linear along the flow direction.

[0010] Further, the cross section of the heat dissipation channel is honeycomb or grid.

[0011] Further, the heat dissipation shell and the heat dissipation fin are both made of aluminum alloy.

[0012] Further, the surface of the heat dissipation shell and the heat dissipation fin is provided with a graphene coating.

[0013] Further, the heat dissipation unit further comprises a fan assembly.

[0014] Further, the power unit is a low-pressure large-flow battery pump.

[0015] Further, the connecting unit comprises a quick connector capable of being quickly connected with the oil inlet and outlet pipe of the oil tank.

[0016] Further, the heat dissipation channel is in a curve shape along the flow direction of the oil.

[0017] Further, the heat dissipation piece is in an "arch" shape along the flow direction of the oil, and the two sides of the heat dissipation piece are both provided with a semiconductor refrigeration wafer.

[0018] Further, the heat dissipation channel is in a spiral shape along the flow direction of the oil.

[0019] Further, the heat dissipation shell is provided with a heat-conducting silicone grease between the heat-conducting silicone grease and the semiconductor refrigeration wafer.

[0020] Further, the heat dissipation assembly further comprises a local heat-conducting piece, and the heat dissipation shell and the semiconductor refrigeration wafer are attached through the local heat-conducting piece.

[0021] Further, the local heat-conducting piece comprises a sealing frame, the number of the sealing frame is the same as that of the semiconductor refrigeration wafer, and one end of the sealing frame is sealingly sleeved on the outer periphery of the semiconductor refrigeration wafer.

[0022] Further, the other end of the sealing frame is sealingly connected with the heat dissipation piece.

[0023] Further, the sealing frame is provided with a drainage port and a backflow port, and the drainage port and the third oil outlet are respectively connected with the outlet of the heat dissipation channel and the oil tank.

[0024] Further, the fan assembly comprises a heat dissipation fan, and the rotating shaft of the heat dissipation fan is parallel to the semiconductor refrigeration wafer and perpendicular to the heat dissipation channel.

[0025] The second aspect of the present application provides an active heat dissipation method based on a semiconductor refrigeration wafer, which adopts the heat dissipation device based on the semiconductor refrigeration wafer in the first aspect to dissipate heat.

[0026] Further, the heat dissipation method based on the semiconductor refrigeration wafer comprises the following steps:

[0027] S1 the power unit 2 continuously extracts oil from the oil tank and transports to the heat dissipation unit;

[0028] S2 the heat dissipation unit carries out heat dissipation to the inflow oil;

[0029] S3 the oil continuously flows out of the heat dissipation unit and flows back into the oil tank.

[0030] Compared with the prior art, the present application can achieve at least one of the following beneficial effects:

[0031] (1) The heat dissipation device of the present application can realize oil circulation and active heat dissipation by setting the power unit to drive the oil in the oil tank to flow into the heat dissipation unit, without waiting for the hydraulic system to passively dissipate heat during the oil return process, thereby improving the heat dissipation efficiency and continuously ensuring the stable working environment of the hydraulic system.

[0032] (2) The heat dissipation device of the present application, by setting the heat dissipation channel in the heat dissipation member and adhering the semiconductor refrigeration wafer outside the heat dissipation member, makes the structure of the vehicle-mounted heat dissipation device very compact, realizes the beneficial effect of high-efficiency oil heat dissipation in a very small space, and meets the requirements of vehicle-mounted hydraulic system heat dissipation.

[0033] (3) The heat dissipation device of the present application, by using semiconductor refrigeration wafer to carry out refrigeration, has better heat dissipation effect than general fan heat dissipation or air conditioner heat dissipation device, and does not produce condensate water to pollute the oil.

[0034] (4) The heat dissipation device of the present application, by setting multiple heat dissipation fins on the inner wall of the heat dissipation shell, can increase the contact area of the oil and the heat dissipation fins, increase the heat transfer area of the oil, and realize faster heat dissipation effect.

[0035] (5) The heat dissipation device of the present application, by setting multiple heat dissipation channels, can make the surface area of the heat dissipation fins larger, so that the oil and the heat dissipation fins are more fully contacted, and the heat dissipation speed is faster.

[0036] (6) The heat dissipation device of the present application, by increasing the graphene coating on the surface of the heat dissipation member, improves the heat dissipation efficiency of the surface of the heat dissipation member and the heat dissipation speed.

[0037] (7) The heat dissipation device of the present application, by setting the heat dissipation channel with a curved flow direction, can increase the length of the heat dissipation channel without increasing the length of the heat dissipation member in the case of limited space of the vehicle-mounted hydraulic system, thereby increasing the contact area of the oil and the heat dissipation member and improving the heat dissipation efficiency.

[0038] (8) The heat dissipating device of the present application, by setting the local heat conducting member, not only ensures the sufficient contact between the semiconductor refrigeration chip and the heat dissipating plate, improves the heat conduction efficiency of the heat dissipating device, but also can fully utilize the existing oil resources for recycling, without considering the failure and replacement problems, with simple structure and reliable function.

[0039] The technical solutions of the present application can be combined with each other to achieve more preferred combination solutions. Other features and advantages of the present application will be described in the subsequent specification, and some advantages will become apparent from the specification, or will be understood by implementing the present application. The purposes and other advantages of the present application can be achieved and obtained through the contents specifically indicated in the specification examples and the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 It is a schematic diagram of the overall structure of the heat dissipating device of the present application embodiment 1.

[0041] Figure 2 It is a schematic diagram of the structure of the heat dissipating assembly of the present application embodiment 1.

[0042] Figure 3 It is a schematic diagram of the structure of the heat dissipating member of the present application embodiment 1.

[0043] Figure 4 It is a schematic diagram of the structure of the heat dissipating unit of the present application embodiment 1.

[0044] Figure 5 It is a schematic diagram of the structure of the heat dissipating assembly of the present application embodiment 2.

[0045] Figure 6 It is a schematic diagram of the structure of the heat dissipating assembly of the present application embodiment 3.

[0046] Figure 7 It is a schematic diagram of the steps of the active heat dissipating method of the present application embodiment 4.

[0047] REFERENCE NUMERALS:

[0048] 1-heat dissipating unit; 11-heat dissipating assembly; 111-semiconductor refrigeration chip; 112-heat dissipating member; 1121-heat dissipating shell; 11211-heat dissipating plate; 1122-heat dissipating channel; 11221-heat dissipating channel inlet; 11222-heat dissipating channel outlet; 1123-heat dissipating fin; 113-local heat conducting member; 1131-sealing frame; 1132-drainage port; 1133-backflow port; 12-fan assembly; 121-heat dissipating fan; 122-fan bracket; 2-power unit; 21-oil extraction port; 22-oil delivery port; 3-connection unit; 31-oil inlet joint; 32-oil return joint; 33-oil pipe. DETAILED DESCRIPTION

[0049] The preferred embodiments of the present application will be described in detail below with reference to the drawings, in which the figures constitute a part of the present application and illustrate the principles of the present application together with embodiments thereof, but are not intended to limit the scope of the present application.

[0050] Embodiment 1

[0051] The present embodiment provides a heat dissipation device based on semiconductor refrigeration wafer, as shown in Figure 1 and Figure 2 The heat dissipation device comprises a heat dissipation unit 1, a power unit 2 and a connecting unit 3; the connecting unit 3 comprises an oil inlet joint 31, an oil return joint 32 and an oil pipe 33, the oil inlet joint 31 and the oil return joint 32 are connected with the oil outlet pipe and the oil inlet pipe of the oil tank respectively; the power unit 2 comprises an oil extraction port 21 and an oil delivery port 22, the oil extraction port 21 and the oil delivery port 22 are respectively connected with the oil tank and the heat dissipation unit 1; the heat dissipation unit 1 comprises at least one set of heat dissipation assembly 11, the heat dissipation assembly 11 comprises a semiconductor refrigeration wafer 111 and a heat dissipation piece 112, the semiconductor refrigeration wafer 111 is attached to the outer surface of the heat dissipation piece 112; the heat dissipation piece 112 is internally provided with a heat dissipation channel 1122, the two ends of the heat dissipation channel 1122 are respectively connected with the oil delivery port 22 and the oil tank; the power unit 2 can drive the oil in the oil tank to flow through the heat dissipation channel 1122 for active heat dissipation.

[0052] The heat dissipation device based on semiconductor refrigeration wafer disclosed in the present embodiment can realize the circulating active heat dissipation of the oil by setting the power unit 2 to drive the oil in the oil tank to flow into the heat dissipation unit 1, without waiting for the passive heat dissipation in the process of oil return of the hydraulic system, thereby improving the heat dissipation efficiency and continuously ensuring the stable working environment of the hydraulic system. The heat dissipation device of the present embodiment further comprises the structure that the semiconductor refrigeration wafer 111 is attached to the outside of the heat dissipation piece 112 internally provided with the heat dissipation channel 1122, so that the structure of the vehicle-mounted heat dissipation device is very compact, light in weight, noiseless and pollution-free, and the beneficial effects of completing the efficient heat dissipation of the oil in a very small occupied space are realized, thereby meeting the heat dissipation requirements of the vehicle-mounted hydraulic system. In addition, the semiconductor refrigeration wafer 111 is based on the Seebeck effect and the Peltier effect, and the temperature difference and heat are generated on the semiconductor material by the direct current voltage to realize the refrigeration effect, so that the heat dissipation effect is better than that of the general fan heat dissipation or air conditioner heat dissipation device, and the condensate water does not cause pollution to the oil.

[0053] The heat transfer process of the active bulk device of the embodiment is as follows: after the oil inlet joint 31 and the oil return joint 32 are connected with the oil outlet pipe and the oil inlet pipe of the oil tank, the power unit 2 continuously extracts the oil in the oil tank, so that the oil enters the heat dissipation unit 1. When the oil flows in the heat dissipation channel 1122, the oil contacts the heat dissipation piece 112 and exchanges heat. The heat dissipation piece 112 transmits the heat of the oil to the outside of the heat dissipation shell 1121 through the heat conduction effect. Since at least two heat dissipation plates 11211 on the heat dissipation shell 1121 are externally attached with semiconductor refrigeration chips 111, the heat dissipated to the outside of the heat dissipation plate 11211 is absorbed by the semiconductor refrigeration chip 111 through the heat conduction effect. Finally, the heat transferred by the oil is transmitted from the heating surface of the semiconductor refrigeration chip 111 to the air. Since the device can circulate oil absorption, heat dissipation and oil return, the oil in the oil tank can be continuously cooled through the above heat transfer process.

[0054] As shown in the examples of FIGS. 1 and 2, the heat dissipation piece 112 is a rectangle, which is made of aluminum alloy material with good heat conduction performance to ensure the heat conduction efficiency. The aluminum alloy material also has the advantages of good corrosion resistance, light weight and easy processing. Figure 1 Figure 2 The heat dissipation piece 112 includes a heat dissipation shell 1121, which is a rectangle with open ends. The heat dissipation shell 1121 includes at least two opposite heat dissipation plates 11211, the outer surfaces of which are attached with semiconductor refrigeration chips 111. The heat dissipation plates 11211 are provided with a heat dissipation channel 1122 therebetween. The two ends of the heat dissipation channel 1122 are respectively provided with a heat dissipation channel inlet 11221 and a heat dissipation channel outlet 11222. The heat dissipation channel inlet 11221 and the heat dissipation channel outlet 11222 are respectively connected with the oil inlet port 22 and the oil return joint 32 through the oil pipe 33. The heat dissipation channel 1122 in the heat dissipation shell 1121 is linear along the length L direction. The distance between the two heat dissipation plates 11211 is the width W parameter of the heat dissipation shell 1121. The length and height of the heat dissipation plates 11211 are the length L and the height H of the heat dissipation shell 1121. The length L and the height H of the heat dissipation shell 1121 have large parameter values, and the width W has a small parameter value. On the one hand, the smaller the distance between the two refrigeration surfaces of the semiconductor refrigeration chip 111, the stronger the cooling effect on the oil. On the other hand, the increase of the height H and the length L can increase the contact area of the oil with the heat dissipation shell 1121.

[0055] It should be noted that due to the limited product size of the semiconductor refrigeration chip 111, multiple semiconductor refrigeration chips 111 can be attached side by side on each heat dissipation plate 11211 along the length L direction as needed, so that the outer surface of the heat dissipation plate 11211 can be covered by the semiconductor refrigeration chip 111 in the flow direction of the oil.

[0056] ​In order to make the oil in the heat dissipation channel 1122 to be in full contact with the heat dissipation member 112, as shown in Figure 3 the inner wall of the heat dissipation shell 1121 is provided with a plurality of heat dissipation fins 1123, so that the oil can not only exchange heat with the heat dissipation shell 1121, but also contact the surfaces of the plurality of heat dissipation fins 1123 in the heat dissipation channel 1122 and exchange heat. The shape of the heat dissipation fins 1123 is strip-shaped, arc-shaped, semi-cylindrical or other shapes, the axial direction is the same as the direction of the heat dissipation channel 1122, and the size and number can be adaptively adjusted according to the space layout, so that the contact area of the oil and the heat dissipation fins 1123 can be increased, the heat transfer area of the oil is increased, and a faster heat dissipation effect is achieved.

[0057] Optionally, the heat dissipation fins 1123 are integrally formed with the heat dissipation shell 1121, and the plurality of heat dissipation fins 1123 divide the space in the heat dissipation shell 1121 into a plurality of heat dissipation channels 1122. As shown in Figure 3 , the cross section of the heat dissipation channel 1122 is honeycomb-shaped or grid-shaped. The plurality of honeycomb-shaped or grid-shaped heat dissipation channels 1122 structure can make the surface area of the heat dissipation fins 1123 larger, so that the oil is in more sufficient contact with the heat dissipation fins 1123, and a faster heat dissipation speed is achieved.

[0058] Optionally, as shown in Figure 1 and Figure 4 , the heat dissipation unit 1 can also be provided with a plurality of groups of heat dissipation assemblies 11. The plurality of groups of heat dissipation assemblies 11 are arranged in parallel to each other, and the two ends are connected to the oil pipe 33 through the multi-way joint. The semiconductor refrigeration chips 111 between the two adjacent groups of heat dissipation assemblies 11 are provided with a spacing, so that the heat generating end of the semiconductor refrigeration chip 111 exchanges heat with the surrounding air.

[0059] In order to further enhance the heat conduction effect, the surfaces of the heat dissipation shell 1121 and the heat dissipation fins 1123 are provided with a graphene coating, so as to increase the heat dissipation efficiency of the surface of the heat conduction material of the heat dissipation member 112 and improve the heat dissipation speed.

[0060] In order to quickly spread the heat around the heat dissipation unit 1, the heat dissipation unit 1 also includes a fan assembly 12. As shown in Figure 4 , the fan assembly 12 includes a heat dissipation fan 121 and a fan bracket 122, and a plurality of heat dissipation fans 121 are installed on the heat dissipation assembly 11 through the fan bracket 122. The rotation shaft of the heat dissipation fan 121 is parallel to the semiconductor refrigeration chip 111 and perpendicular to the flow direction of the oil, so as to blow away the heat absorbed by the semiconductor refrigeration chip 111 from the other side of the semiconductor refrigeration chip 111 to the air through air convection.

[0061] Furthermore, the power unit 2 is a low-pressure, high-flow battery pump, which can ensure the extraction and output of oil at a high flow rate and low oil pressure. Using a battery pump will not consume the power of the vehicle's hydraulic system.

[0062] To make the cooling device more portable, the oil inlet connector 31 and oil return connector 32 of the connection unit 3 are quick connectors, which can be quickly connected to the oil inlet and outlet pipes of the oil tank, making it convenient for vehicle transport.

[0063] Example 2

[0064] The difference between the heat dissipation device based on the semiconductor cooling chip in this embodiment and Embodiment 1 is that the heat dissipation channel 1122 is curved along the flow direction of the oil. By setting the curved heat dissipation channel 1122, this embodiment can increase the length of the heat dissipation channel 1122 without increasing the length of the heat sink 112, even in the case of limited space in the vehicle hydraulic system, thereby increasing the contact area between the oil and the heat sink 112 and improving the heat dissipation efficiency.

[0065] For example, such as Figure 5 As shown, the curved heat dissipation channel 1122 is achieved by setting a curved heat dissipation shell 1121. The heat dissipation shell 1121 and the heat dissipation channel 1122 are in the shape of an "arch" along the flow direction. Both sides of the heat dissipation channel 1122 are provided with heat dissipation plates 11211, that is, the heat dissipation shell 1121 has semiconductor cooling wafers 111 attached to both the horizontal and vertical sides of the "arch" shape. Since the "arch" shape can greatly increase the contact area between the oil and the heat dissipation shell 1121 when the length of the heat dissipation channel 1122 is limited, it can significantly improve the cooling effect when the oil flows out of the heat dissipation device.

[0066] For example, the curved heat dissipation channel 1122 can also be achieved by setting spiral heat dissipation fins 1123. The heat dissipation fins 1123 are spiral fins along the flow direction, thereby forming a spiral heat dissipation channel 1122. The spiral heat dissipation channel 1122 can increase the relative length of the heat dissipation channel 1122 and allow each heat dissipation channel 1122 to be directly adjacent to the heat dissipation plate 11211, so that the oil in each heat dissipation channel 1122 can directly exchange heat with the heat dissipation plate 11211 to achieve a high-efficiency and balanced heat dissipation effect. In addition, the spiral heat dissipation channel 1122 can also make the oil have better fluidity, reducing the resistance of the heat dissipation fins 1123 to the oil while ensuring heat dissipation efficiency.

[0067] Example 3

[0068] The heat dissipation device based on the semiconductor cooling chip in this embodiment differs from that in Embodiments 1 and 2 in that the heat dissipation component 11 further includes a local heat-conducting element 113, and the heat dissipation plate 11211 and the semiconductor cooling chip 111 are tightly bonded together through the local heat-conducting element 113.

[0069] For example, such as Figure 6 As shown, the local heat-conducting component 113 includes a sealing frame 1131. One end of the sealing frame 1131 is sealed and fitted around the outer periphery of the semiconductor cooling wafer 111 and bonded together with glass glue or other adhesives. The other end of the local heat-conducting component 113 is fixed and sealed to the heat dissipation plate 11211 by welding, sealing ring or other means, so that the gap between the semiconductor cooling wafer 111 and the heat dissipation plate 11211 that are in contact with each other is sealed within the sealing frame 1131.

[0070] Furthermore, the sealing frame 1131 is provided with a drain port 1132 and a return port 1133, which are respectively connected to the heat dissipation channel outlet 11222 and the oil tank. The drain port 1132 can guide a small amount of cooling oil from the heat dissipation channel outlet 11222 into the sealing frame 1131 through the draining action, serving as a filler between the semiconductor cooling chip 111 and the heat dissipation plate 11211 to ensure sufficient heat transfer.

[0071] Considering that the close contact between the semiconductor cooling chip 111 and the heat dissipation plate 11211 may result in uneven surfaces due to manufacturing tolerances, leading to insufficient contact and affecting heat conduction, the local heat-conducting component 113 in this embodiment can guide a small amount of cooling oil from the inlet 1132 into the gap between the two surfaces, and then flow back to the oil tank from the return outlet 1133. Since the gap is extremely small and the required amount of oil is minimal, the temperature rise of the oil after heat transfer has little impact on the overall oil temperature in the tank, and the heat dissipation of this small amount of oil is no longer considered.

[0072] In this embodiment, the cooling oil in the local heat-conducting component 113 can act as a heat transfer medium, ensuring sufficient contact between the semiconductor cooling chip 111 and the heat dissipation plate 11211. Since the local heat-conducting component 113 makes full use of existing oil resources for recycling, it can improve the heat conduction efficiency of the heat dissipation equipment, eliminate the need to consider the failure and replacement of the heat transfer medium, and has a simple structure and reliable function.

[0073] Example 4

[0074] One embodiment of the present invention discloses a heat dissipation method based on a semiconductor cooling chip, such as... Figure 1 As shown, the specific steps include:

[0075] S1 power unit 2 continuously draws oil from the oil tank and delivers it to the cooling unit 1;

[0076] S2 heat dissipation unit 1 dissipates heat from the incoming oil;

[0077] S3 oil continuously flows out of the heat dissipation unit 1 and back into the oil tank.

[0078] The heat dissipation method of this embodiment, through the continuous operation of the power unit 2 in step S1, can achieve continuous circulating active heat dissipation of the oil in the oil tank, without having to wait for the hydraulic system to return oil before passive heat dissipation can be carried out, thereby improving heat dissipation efficiency and continuously ensuring a stable working environment for the hydraulic system.

[0079] Furthermore, step S2 includes the following heat dissipation process:

[0080] When the S201 oil flows through the heat dissipation channel 1122, it comes into contact with the heat dissipation component 112 and exchanges heat.

[0081] S202 heat sink 112 transfers the heat of the oil to the outer surface of the heat sink 112 through the thermal conduction effect;

[0082] In step S201 of this embodiment, on the one hand, the graphene coating can improve the heat dissipation efficiency and speed of the material, and can quickly and efficiently exchange heat with the oil in contact with the surface of the heat sink 112; on the other hand, the aluminum alloy material has the property of fast thermal conductivity, which can quickly transfer heat to the outer surface of the heat sink 112 in S202.

[0083] Furthermore, step S2 also includes the following heat dissipation process:

[0084] The heat transferred from S203 to the outer surface of the heat sink 112 is absorbed by the semiconductor cooling chip 111 through the thermal conduction effect;

[0085] The S204 semiconductor cooling chip 111 absorbs heat and transfers it to the air.

[0086] Since the semiconductor cooling chip 111 is based on the Seebeck effect and Pilz effect, and achieves the cooling effect by generating temperature difference and heat on the semiconductor material through DC voltage, the heat dissipation process in steps S203 and S204 of this embodiment has a better heat dissipation effect than general fan cooling or air conditioning cooling methods, and does not produce condensate water to contaminate the oil.

[0087] Furthermore, in step S204, the heat absorbed by the semiconductor cooling chip 111 is transferred to the air through the heat convection conduction generated by the cooling fan 121.

[0088] In step S204 of this embodiment, by utilizing the heat convection conduction effect of the cooling fan 121, the heat absorbed by the semiconductor cooling chip 111 can be quickly dissipated into the air, which helps to reduce the ambient temperature around the heat dissipation device and achieve a highly efficient and rapid heat dissipation effect.

[0089] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat dissipating apparatus based on semiconductor refrigeration chip, characterized by, The heat dissipation unit (1), the power unit (2) and the connecting unit (3) are included. The power unit (2) includes an oil suction port (21) and an oil delivery port (22), which are respectively connected with an oil tank and the heat dissipation unit (1); The heat dissipation unit (1) includes at least one set of heat dissipation components (11), which include a semiconductor refrigeration wafer (111) and a heat dissipation piece (112), and the semiconductor refrigeration wafer (111) is attached to the outer surface of the heat dissipation piece (112); The heat dissipation piece (112) is provided with a heat dissipation channel (1122), and the two ends of the heat dissipation channel (1122) are respectively connected with the oil delivery port (22) and the oil tank; The power unit (2) can drive the oil in the oil tank to flow through the heat dissipation channel (1122) for active heat dissipation.

2. The semiconductor refrigeration chip-based heat dissipating device according to claim 1, characterized in that, The heat dissipation piece (112) includes a heat dissipation shell (1121) and a heat dissipation fin (1123), and the heat dissipation shell (1121) is open at both ends, and a plurality of heat dissipation fins (1123) are fixed on the inner wall of the heat dissipation shell (1121).

3. The semiconductor refrigeration chip-based heat dissipating device according to claim 2, characterized in that, A plurality of heat dissipation fins (1123) divide the space in the heat dissipation shell (1121) into a plurality of heat dissipation channels (1122).

4. The semiconductor refrigeration chip-based heat dissipating device according to claim 3, characterized in that, The heat dissipation channel (1122) is linear along the flow direction.

5. The semiconductor refrigeration chip-based heat dissipating device according to claim 3, characterized in that, The cross section of the heat dissipation channel (1122) is honeycomb or grid.

6. The semiconductor refrigeration chip-based heat dissipating device according to any one of claims 2 to 5, characterized in that, The heat dissipation shell (1121) and the heat dissipation fin (1123) are both made of aluminum alloy.

7. The semiconductor refrigeration chip-based heat dissipating device according to claim 6, characterized in that, The surfaces of the heat dissipation shell (1121) and the heat dissipation fin (1123) are both provided with a graphene coating.

8. The semiconductor refrigeration chip-based heat dissipating device according to any one of claims 1 to 5, characterized in that, The heat dissipation unit (1) further includes a fan assembly (12).

9. The semiconductor refrigeration chip-based heat dissipating device according to any one of claims 1 to 5, characterized in that, The connecting unit (3) includes a quick connector which can be quickly connected with an oil inlet and outlet pipe of an oil tank.

10. A heat dissipation method based on a semiconductor refrigeration wafer, characterized by, The heat dissipation device based on the semiconductor refrigeration wafer is used for heat dissipation.

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