Aging method, aging control device and aging system of fault diagnosis equipment

Abstract

The invention provides an aging method, an aging control device and an aging system of fault diagnosis equipment, and relates to the technical field of equipment aging, and the aging method of the fault diagnosis equipment comprises the steps: controlling an aging temperature box to work according to preset environment data, so as to enable the fault diagnosis equipment to run in the aging temperature box for a preset working duration; after the fault diagnosis equipment operates in the aging temperature box for a preset time length, waiting for the temperature of the fault diagnosis equipment to be reduced to room temperature; under the condition that the fault diagnosis equipment is in the room temperature state, connecting the fault diagnosis equipment with the to-be-tested equipment so as to determine the operation state of the fault diagnosis equipment; and if the operation state is normal, the fault diagnosis equipment is put into the aging incubator again, and the next round of aging treatment is carried out until the aging process of the preset round is completed. The real temperature cycle scene is simulated through multiple rounds of aging treatment, the real temperature cycle scene can be simulated, potential defects of the equipment are effectively excited, and the long-term service capacity of the equipment in real working conditions is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of equipment aging, in particular to an aging method of a fault diagnosis device, an aging control device and an aging system. BACKGROUND

[0002] At present, the test environment for aging test of the fault diagnosis device lacks real simulation of temperature rise and fall cycles, so that early failure hidden dangers of the device under the cumulative effect of thermal expansion and cold contraction cannot be effectively triggered and identified. Once put into actual scenes, the diagnosis data may be inaccurate, communication may be interrupted or function may be abnormal due to insufficient release of internal stress, which seriously weakens the long-term service capability of the device in real working conditions. SUMMARY

[0003] The main purpose of the present application is to provide an aging method of a fault diagnosis device, which aims to simulate real temperature cycle scenes, effectively trigger potential defects of the device and improve the long-term service capability of the device in real working conditions.

[0004] To achieve the above purpose, the present application provides an aging method of a fault diagnosis device, which comprises: controlling an aging oven to work according to preset environment data, so that the fault diagnosis device runs in the aging oven for a preset working time length; after the fault diagnosis device runs in the aging oven for a preset time length, waiting for the temperature of the fault diagnosis device to decrease to room temperature; connecting the fault diagnosis device and a to-be-tested device under the condition that the fault diagnosis device is in a room temperature state, to determine the running state of the fault diagnosis device; if the running state is normal, putting the fault diagnosis device into the aging oven again for next round of aging treatment until the preset round of aging process is completed.

[0005] Optionally, the connecting the fault diagnosis device and the to-be-tested device under the condition that the fault diagnosis device is in a room temperature state, to determine the running state of the fault diagnosis device, comprises: controlling a remote management background to establish a communication connection with the fault diagnosis device under the condition that the fault diagnosis device is in a room temperature state; controlling the fault diagnosis device to start a detection program for the to-be-tested device through the remote management background, to obtain detection data of the to-be-tested device and generate a diagnosis report corresponding to the detection data; determining the running state corresponding to the diagnosis report.

[0006] Optionally, when the fault diagnosis device is at room temperature, connecting the fault diagnosis device to the device under test to determine the operating status of the fault diagnosis device includes: With the fault diagnosis device at room temperature, remove the fault diagnosis device from the aging chamber and electrically connect the fault diagnosis device to the device under test according to the test requirements. The fault diagnosis device is controlled to start a detection program on the device under test in order to obtain the detection data of the device under test and generate a diagnostic report corresponding to the detection data; Determine the operating status corresponding to the diagnostic report.

[0007] Optionally, the preset environmental data consists of at least three different temperature values; The controlled aging chamber operates according to preset environmental data, so that the fault diagnosis equipment runs within the aging chamber for a preset duration, including: The aging chamber is controlled to adjust its temperature according to a first temperature value, and the fault diagnosis device is controlled to run at the first temperature value for a first preset time. If the operating status is normal, the fault diagnosis device is placed back into the aging chamber for the next round of aging treatment, until the preset number of aging cycles is completed, including: If the operating status is normal, the aging chamber is controlled to adjust the temperature according to the second temperature value and the third temperature value in sequence, so that the fault diagnosis equipment runs for the second preset time and the third preset time at the corresponding second temperature value and the third temperature value, until the aging process under multiple temperature environments is completed.

[0008] Optionally, the preset environmental data includes a first temperature above zero and a second temperature below zero; The controlled aging chamber operates according to preset environmental data, so that the fault diagnosis equipment runs within the aging chamber for a preset duration, including: The aging chamber is controlled to adjust from room temperature to the first temperature, and the fault diagnosis device is controlled to run for a first preset time at the first temperature; After the first preset time period ends, the aging chamber is controlled to linearly adjust from the first temperature to the second temperature, and after the second temperature is reached, the fault diagnosis device is controlled to run at the second temperature for the second preset time. After the second preset time period ends, the aging chamber is controlled to adjust from the second temperature to room temperature; The step of connecting the fault diagnosis device and the device under test when the fault diagnosis device is at room temperature to determine the operating status of the fault diagnosis device includes: When the fault diagnosis device is at room temperature, the fault diagnosis device is connected to the device under test, the fault diagnosis device is controlled to run the detection program, and the detection data of the fault diagnosis device is collected. The detection data is compared with preset detection data to generate corresponding comparison results; If the comparison results are consistent, it is determined that the fault diagnosis equipment is operating normally; If the comparison results are inconsistent, it is determined that the fault diagnosis equipment is in an abnormal operating state.

[0009] Optionally, the preset environmental data further includes a first humidity and a second humidity, wherein the first humidity is greater than the second humidity; The controlled aging chamber operates according to preset environmental data, so that the fault diagnosis equipment runs within the aging chamber for a preset duration, including: While adjusting the aging chamber to the first temperature, the humidity inside the aging chamber is also adjusted to the first humidity. The fault diagnosis device is controlled to run continuously for a first preset time under the combined environment of the first temperature and the first humidity. After the first preset time period ends, the aging chamber is controlled to linearly adjust the temperature from the first temperature to the second temperature, and the humidity is adjusted from the first humidity to the second humidity. Once the temperature and humidity both reach the second temperature and the second humidity, the fault diagnosis device is controlled to run continuously for a second preset time under the combined environment of the second temperature and the second humidity. After the second preset time period ends, the aging chamber is controlled to adjust the temperature from the second temperature to room temperature, and the humidity from the second humidity to the natural humidity under room temperature conditions.

[0010] Optionally, the controlled aging chamber operates according to preset environmental data, specifically as follows: Obtain the equipment model identification code and production batch information of the fault diagnosis equipment to be aged; Based on the equipment model identification code and production batch information, obtain historical failure environment distribution data and performance degradation curve model related to the equipment model from the aging knowledge database; Based on the historical failure environment distribution data, the key temperature stress points and key humidity stress points that induce potential defects in the equipment model are determined. Based on the performance degradation curve model and the preset aging intensity coefficient, aging environment profile data with key temperature stress points, key humidity stress points, holding time of each stress point, and stress transition rate are generated. The operation of the aging chamber is controlled according to the aging environment profile data.

[0011] Optionally, determining the key temperature stress points and key humidity stress points that induce potential defects in the equipment model based on the historical failure environment distribution data includes: Extract all historical failure event records corresponding to the device model from the aging knowledge database. The historical failure event records shall at least include the ambient temperature value, ambient humidity value and failure mode code corresponding to the time of failure. Using temperature and humidity values ​​as two-dimensional coordinate axes, a scatter distribution model of the historical failure event records is established, and a joint probability density distribution surface of the historical failure environment is generated based on the kernel density estimation algorithm. Identify the first continuous region in the joint probability density distribution surface where the probability density value exceeds a preset threshold, and use the first continuous region as the typical failure environment stress range of the equipment model. From the stress range of the typical failure environment, the boundary extreme points of the temperature dimension are extracted as candidate key temperature stress points, and the boundary extreme points of the humidity dimension are extracted as candidate key humidity stress points. The candidate critical temperature stress points are combined and paired with the candidate critical humidity stress points, and the occurrence frequency of the corresponding failure mode in the historical failure event record is calculated for each combination. The top N temperature and humidity combinations with the highest failure mode occurrence frequency are selected and determined as the key temperature stress points and key humidity stress points used to induce potential defects, respectively, where N is greater than or equal to two. The process of generating aging environment profile data based on the performance degradation curve model and a preset aging intensity coefficient, including key temperature stress points, key humidity stress points, duration of each stress point, and stress transition rate, includes: Based on the performance degradation curve model, the estimated natural aging time required for the performance parameters of the fault diagnosis device to degrade to a preset failure threshold under normal temperature reference environment is calculated. Based on the preset aging intensity coefficient, the target equivalent aging time of the aging process is determined, and the target equivalent aging time is equal to the estimated natural aging time multiplied by the reciprocal of the aging intensity coefficient. For each set of determined key temperature stress points and key humidity stress points, calculate the theoretical accelerated test time required to achieve the unit target equivalent aging time under each set of stress conditions, and use it as the theoretical holding time of that set of stress points. To obtain the equipment's thermal inertia and the material's moisture absorption and release characteristics during adjacent stress switching processes; Based on the theoretical holding time of each stress point, the stress points are proportionally allocated to the target equivalent aging time, and the maximum allowable safe transition rate between adjacent stress points is determined based on the thermal inertia of the equipment and the moisture absorption and release characteristics of the material. Based on the key temperature stress point, the key humidity stress point, the actual holding time of each stress point after proportional allocation adjustment, and the maximum safe transition rate, an aging environment time series containing multiple sets of stress cycles is constructed.

[0012] In addition, to achieve the above objectives, the present invention also provides an aging control device, the aging control device comprising: a memory, a processor, and an aging program for a fault diagnosis device stored in the memory and executable on the processor, the aging program for the fault diagnosis device being configured to implement the aging method for the fault diagnosis device as described above.

[0013] Furthermore, to achieve the above objectives, the present invention also provides an aging system, the aging system comprising: An aging chamber is used to hold a fault diagnosis device to be aged, and the aging chamber is provided with a first through hole; The device under test (DUT) is located outside the aging chamber and is electrically connected to the fault diagnosis device through the first through-hole; and As described above, the aging control device controls the aging chamber to operate according to preset environmental data, so that the fault diagnosis device runs in the aging chamber for a preset working time. After the aging chamber has run for the preset time, the device waits for the temperature of the fault diagnosis device to drop to room temperature. When the fault diagnosis device is at room temperature, the device is connected to the device under test to determine the operating status of the fault diagnosis device. If the operating status is normal, the fault diagnosis device is placed back into the aging chamber for the next round of aging treatment until the preset number of aging cycles is completed.

[0014] This invention controls an aging chamber to operate according to preset environmental data, allowing a fault diagnosis device to run for a preset duration. After the preset duration, the device's temperature is allowed to drop to room temperature. While the device is at room temperature, it is connected to the device under test to determine its operating status. If the operating status is normal, the device is placed back into the aging chamber for the next round of aging treatment, until the preset number of aging cycles is completed. This multi-round aging process simulates real-world temperature cycling scenarios, effectively stimulating potential defects in the device and improving its long-term service capability under real-world operating conditions. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0016] Figure 1 This is a schematic diagram of the aging method of a fault diagnosis device according to an embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of the aging method flow of the first embodiment of step S300 in the middle; Figure 3 for Figure 1 A schematic diagram of the aging method flow for the second embodiment of step S300 in the process; Figure 4 This is a schematic diagram of the aging method of a fault diagnosis device according to another embodiment of the present invention; Figure 5 This is a schematic diagram of the aging method of a fault diagnosis device according to another embodiment of the present invention; Figure 6 for Figure 1 A schematic diagram of the aging method process in step S100; Figure 7 This is a schematic diagram of the aging method of a fault diagnosis device according to another embodiment of the present invention; Figure 8 for Figure 7 A schematic diagram of the aging method process in step S1120; Figure 9 for Figure 7 A schematic diagram of the aging method process in step S1130.

[0017] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Well-known modules, units, and their connections, links, communications, or operations are not shown or described in detail. Furthermore, the described features, architectures, or functions can be combined in any way in one or more embodiments. Those skilled in the art should understand that the various embodiments described below are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. It is also readily understood that the modules, units, or processing methods in the various embodiments shown herein and in the accompanying drawings can be combined and designed in various different configurations. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0019] With the widespread application of blockchain technology, the stability and reliability of blockchain servers, as the core of its underlying computing power, have become crucial. To ensure the long-term stable operation of servers, a multi-functional fixture for diagnosing the health status of blockchain servers—namely, a fault diagnosis device—is widely used in production and maintenance. This device integrates multiple testing functions, including voltage, signal, and protocol consistency testing, and its reliability directly determines the accuracy of the server diagnostic results. Therefore, conducting thorough aging tests on the fault diagnosis device before it leaves the factory to expose potential defects and screen out early-failure products is a key step in ensuring its quality.

[0020] In real-world deployment environments, such equipment often faces complex and variable operating conditions, including high temperature and humidity, low temperature and extreme cold, and frequent temperature fluctuations. For example, during startup, the equipment experiences a rapid temperature rise, cools naturally to room temperature after completing testing, and may then immediately begin a new round of operation, forming a typical "heat-cool-heat" temperature cycle. This repeated alternation of thermal stress acts on internal components, circuit board solder joints, and structural connections, easily leading to potential defects such as material fatigue, microcrack propagation at solder joints, and drift in electrical connection performance. However, current industry-standard aging test schemes focus only on continuous operation testing under a single constant temperature environment, such as maintaining a fixed operating condition at 60°C or -40°C for extended periods. While such methods can verify the static tolerance of equipment at extreme temperatures, they completely ignore the critical impact of dynamic temperature changes on equipment reliability. Due to the lack of realistic simulation of temperature rise and fall cycles in the test environment, early failure risks arising from the cumulative effect of thermal expansion and contraction cannot be effectively detected and identified. As a result, some equipment that performed well in laboratory constant temperature tests may experience problems such as inaccurate diagnostic data, communication interruptions, or functional abnormalities once it is put into actual temperature alternation scenarios due to insufficient release of internal stress, which seriously weakens the long-term service capability of the equipment in real working conditions.

[0021] The main solution of this application embodiment is: by controlling the aging chamber to work according to preset environmental data, the fault diagnosis device runs in the aging chamber for a preset working time. After the fault diagnosis device runs in the aging chamber for the preset time, the temperature of the fault diagnosis device is waited to drop to room temperature. When the fault diagnosis device is at room temperature, the fault diagnosis device is connected to the device under test to determine the operating status of the fault diagnosis device. If the operating status is normal, the fault diagnosis device is put back into the aging chamber for the next round of aging treatment until the preset round of aging process is completed.

[0022] In this embodiment, for ease of description, the aging control device will be used as the execution subject in the following description.

[0023] This application provides a solution that simulates real temperature cycling scenarios through multiple rounds of aging treatment. This solution can effectively stimulate potential defects in equipment and improve the long-term service capability of equipment under real working conditions.

[0024] Therefore, this invention proposes an aging method for fault diagnosis equipment; it is understood that the aging system is equipped with an aging control device for storing and executing the following method. The aging control device can be implemented using a main controller, such as an MCU (Micro Controller Unit), DSP (Digital Signal Processor), FPGA (Field Programmable Gate Array), or SOC (System-on-Chip).

[0025] In existing aging tests for fault diagnosis equipment, aging methods are typically implemented under constant temperature conditions, failing to adequately simulate the repeated temperature cycling processes in real-world applications. These temperature cycles involve the temperature rise during equipment startup, natural cooling to room temperature after shutdown, and the cycle of restarting. Existing methods neglect the cumulative stress effects of temperature cycling on internal components, solder joints, and the overall structure, resulting in aging test results that do not accurately reflect the long-term reliability of the equipment under alternating temperature conditions. Consequently, some equipment prone to performance drift or connection failures during temperature cycling may not be effectively identified, potentially creating hidden dangers in subsequent use and impacting the stability of the fault diagnosis equipment and production safety assurance capabilities.

[0026] For example, simulating the use of fault diagnosis equipment for blockchain servers at a polar research station near the Arctic Circle, the equipment needs to continuously monitor the operational status of the blockchain server. However, polar research stations experience large temperature differences between day and night, as well as extreme indoor-outdoor temperature variations. Under these extreme conditions, the equipment frequently experiences rapid temperature changes. Moving from the frigid outdoors to a warm indoor environment causes the equipment temperature to rise rapidly; conversely, moving from indoors to outdoors causes a sharp drop in temperature. This rapid temperature fluctuation poses severe challenges to the performance of the internal components, the strength of the solder joints, and the overall structural stability of the fault diagnosis equipment. Existing aging test methods, lacking simulation of such temperature cycles, cannot effectively detect potential problems that may arise in the polar environment, such as component performance degradation and loose solder joints. This, in turn, affects the long-term stable operation of the equipment at polar research stations and negatively impacts the accuracy of fault diagnosis for the blockchain server.

[0027] If the above problems are not addressed, fault diagnosis equipment may experience undetected early failures under actual operating conditions, leading to a decline in its monitoring capabilities for critical systems. Consequently, the reliability of the fault diagnosis equipment will be significantly affected, potentially causing blockchain server malfunctions, data loss, system paralysis, and other serious consequences, resulting in incalculable losses for critical missions such as polar scientific expeditions.

[0028] For example, in the testing scenarios of fault diagnosis equipment in the aerospace field, the equipment needs to continuously monitor the operating status of the aircraft engine during takeoff, cruise, and landing. During takeoff, the engine temperature rises rapidly to its operating temperature; during cruise, the temperature remains relatively stable; and during landing, the temperature gradually decreases to ambient temperature, forming a typical temperature cycle. Existing aging tests are only conducted under constant high-temperature conditions and cannot reproduce this temperature cycle characteristic. In practical applications, microcracks may develop at the weld joints inside the equipment due to repeated thermal expansion and contraction, leading to intermittent signal interruption faults under temperature cycle conditions, which are not detected in constant-temperature tests. This problem may cause the equipment to lose its ability to diagnose engine anomalies during critical flight phases, thereby affecting the overall functionality of the flight safety monitoring system.

[0029] If the aforementioned problems are not addressed, fault diagnosis equipment may experience undetected early failures under actual operating conditions, leading to a decline in its monitoring capabilities for critical systems. This will significantly impact the reliability of the fault diagnosis equipment, increase the risk of unexpected downtime, and potentially trigger safety accidents. Furthermore, unexposed potential defects will accelerate performance degradation of the equipment in environments with alternating temperature variations, thereby weakening the foundation of production safety assurance in fields such as industrial automation, aerospace, and automotive electronics. Therefore, there is an urgent need for an aging test method that can simulate actual temperature cycling environments to effectively expose potential defects in equipment under temperature-varying conditions.

[0030] Therefore, referring to Figure 1 In one embodiment of the present invention, the aging method of the fault diagnosis equipment includes steps S100-S400, wherein: S100: Control the aging chamber to work according to preset environmental data so that the fault diagnosis equipment runs in the aging chamber for a preset working time. S200. After the fault diagnosis equipment has been running in the aging chamber for a preset time, wait for the temperature of the fault diagnosis equipment to drop to room temperature. S300. When the fault diagnosis equipment is at room temperature, connect the fault diagnosis equipment to the device under test to determine the operating status of the fault diagnosis equipment. S400 If the operating status is normal, put the fault diagnosis equipment back into the aging chamber for the next round of aging treatment until the preset aging process is completed.

[0031] Fault diagnosis equipment is an electronic device used to detect the operating status of equipment under test, identify potential faults, and generate diagnostic reports. This equipment typically includes sensors, a data acquisition module, a processing unit, and a communication interface, providing critical operational information in various industrial or professional applications. Aging refers to testing equipment by simulating or accelerating environmental conditions that the equipment might encounter in actual use, in order to assess its long-term reliability, expose potential defects, and screen out products that fail early. An aging chamber is a specialized device capable of precisely controlling internal environmental parameters such as temperature and humidity. This aging chamber provides a simulated harsh working environment for fault diagnosis equipment to be aged, accelerating its aging process. Preset environmental data refers to a series of environmental parameters, such as temperature, humidity, and temperature change rate, pre-set according to the characteristics of the fault diagnosis equipment, the expected working environment, and the aging targets before the aging test begins.

[0032] The preset operating time refers to the length of time the fault diagnosis equipment needs to operate continuously under specific environmental conditions. This preset operating time is an important component of the aging test scheme, used to ensure that the equipment undergoes sufficient stress testing in the simulated environment. The device under test (DUT) refers to the external device connected to the fault diagnosis equipment and subjected to testing and diagnosis by the equipment. During the aging process, the DUT simulates the actual workload and interface environment of the fault diagnosis equipment. The operating status refers to an evaluation result of whether the fault diagnosis equipment functions normally and whether its performance meets design requirements after completing the testing task. The operating status can be normal or abnormal. The preset number of cycles refers to the number of times the entire aging process needs to be repeated. Through multiple cycles of aging treatment, potential problems of the equipment under long-term, repeated stress can be more comprehensively exposed.

[0033] This embodiment aims to more effectively simulate the "work-cool-rework" cyclic stress experienced by equipment in actual use, thereby improving the effectiveness of aging tests. This embodiment first controls the aging chamber to operate according to preset environmental data, causing the fault diagnosis equipment to run within the aging chamber for a preset operating time. In one implementation, the preset environmental data can be set to a single constant high temperature, such as 50°C, and the fault diagnosis equipment can continuously operate at this temperature for the preset time. In another implementation, the preset environmental data can be set to a simple temperature step change, such as first operating at 40°C for a period of time, then switching to 60°C and operating for another period. In this way, the fault diagnosis equipment operates continuously in a controlled temperature environment, simulating its thermal load state in actual applications.

[0034] Secondly, after the fault diagnosis equipment has run for the preset time in the aging chamber, it is necessary to wait for its temperature to drop to room temperature. Specifically, after the aging chamber completes its operation under the preset environment, heating or cooling can be stopped, and the chamber door can be opened to allow the fault diagnosis equipment to cool gradually under natural ventilation. Alternatively, the cooling system inside the aging chamber can be controlled to slowly decrease its temperature until the internal temperature of the fault diagnosis equipment reaches a level close to the external environment. This simulates the natural cooling process of the fault diagnosis equipment after it stops working in actual use, creating conditions for subsequent room temperature functional testing.

[0035] In this process, with the fault diagnosis equipment at room temperature, it is connected to the device under test (DUT) to determine its operational status. One implementation method is to remove the fault diagnosis equipment from the aging chamber and manually connect it to a known, functional DUT, for example, via a data cable or power cord. After connection, the fault diagnosis equipment's self-test program or a simple functional test program can be manually started to observe its indicator light status, screen display information, or output signals, in order to preliminarily determine whether it can start normally and perform basic functions. For example, one can check whether the device can be powered on normally, whether the display interface is complete, and whether the button response is sensitive.

[0036] Finally, if the operating status is normal, the fault diagnosis device is placed back into the aging chamber for the next round of aging treatment, until the preset number of aging cycles is completed. If the above functional test results indicate that the fault diagnosis device is operating normally, it is placed back into the aging chamber. The aging chamber will then start a new aging cycle according to preset environmental data, such as repeating the temperature conditions and duration of the previous cycle, or entering a different temperature condition according to a preset sequence. This cycle will continue until all preset aging cycles are completed. For example, if the preset is five rounds of aging, after the fourth round of aging is completed and tested normally, the device will enter the fifth round of aging, until the fifth round of aging is completed and tested normally.

[0037] In one implementation of this embodiment, suppose a manufacturer needs to conduct aging tests on a batch of new industrial fault diagnosis equipment to ensure its long-term stable operation in actual industrial environments, especially under conditions of frequent start-stop cycles and temperature variations. Existing technologies typically only conduct tests at constant high temperatures, which cannot fully expose potential defects in the equipment under temperature cycling stress. First, technicians will set preset environmental data and preset operating times based on the expected operating environment and design specifications of the fault diagnosis equipment. For example, the aging chamber can be set to run at 60°C for 8 hours to simulate continuous operation of the equipment under high-temperature conditions.

[0038] After the fault diagnosis equipment completes 8 hours of high-temperature operation in the aging chamber, the chamber will stop heating and allow the equipment to cool down naturally to room temperature. This cooling process may last for several hours, simulating the natural heat dissipation of the equipment after shutdown in actual use.

[0039] Once the diagnostic equipment reaches room temperature, technicians remove it from the aging chamber and connect it to a known device under test (DUT). For example, this is done via a dedicated diagnostic interface cable, connecting the equipment to a simulated industrial sensor or controller. The technician then starts the diagnostic equipment and runs a standard testing procedure, such as data acquisition and preliminary analysis of the connected DUT. By observing the equipment's display, indicator lights, and the output of the testing procedure, the technician can determine if the equipment is operating normally. For example, if the equipment starts up normally and the displayed data matches the preset results, it is considered to be operating normally.

[0040] If the test results show that the fault diagnosis equipment is functioning normally, the technicians will place it back into the aging chamber. At this point, the aging chamber will start the next round of aging treatment. For example, the next round can be set to run at 50°C for 8 hours, or the condition of 60°C can be repeated. This cycle of "high-temperature operation - cooling to room temperature - room temperature testing - high-temperature operation again" will continue until all preset aging rounds are completed, for example, a total of 10 such cycles.

[0041] Through the aforementioned cyclic process, the fault diagnosis equipment not only undergoes continuous operating stress at high temperatures, but more importantly, it repeatedly experiences temperature variation stress from high temperature to room temperature, as well as functional verification at room temperature. This cyclic stress more realistically simulates the frequent start-stop and temperature-alternating conditions of equipment in actual industrial environments, effectively inducing and exposing potential defects that are difficult to detect in a single isothermal test, such as poor soldering caused by thermal expansion and contraction of components, poor connector contact, or performance drift during temperature changes. Each functional test at room temperature ensures that the core functions and performance of the equipment remain stable after temperature cycling.

[0042] In existing technologies, aging tests for fault diagnosis equipment typically involve continuous operation under constant temperature or single environmental conditions. For example, the equipment might be placed in a 60°C incubator and run continuously for several days. While this method can test the equipment's tolerance to sustained high temperatures, its limitation lies in failing to adequately simulate the "work-cool-work" temperature cycle that the equipment frequently experiences in real-world applications. This temperature cycle causes internal components, solder joints, and structural materials to repeatedly endure the mechanical stress of thermal expansion and contraction, potentially inducing latent defects that are difficult to detect under constant temperature conditions, such as microcracks, cold solder joints, loose connectors, or performance drift.

[0043] Compared with existing technologies, this embodiment simulates the actual process of equipment transitioning from a working state (high temperature) to a shutdown state (cooled to room temperature) during actual use. This repeated temperature fluctuation generates more comprehensive thermomechanical stress on the internal structure and materials of the equipment, enabling more effective acceleration of the exposure of potential defects.

[0044] Secondly, after each temperature cycle, the equipment undergoes functional testing at room temperature. This ensures that the equipment's function and performance remain stable and reliable at room temperature after experiencing temperature stress. Existing methods typically only perform a final test after aging, which cannot promptly detect and eliminate products that may have experienced performance degradation or intermittent failures during intermediate temperature cycles. This embodiment's "cyclic aging-room temperature testing" mode can identify products that are sensitive to temperature changes and have insufficient reliability earlier and more accurately.

[0045] The aging method in this embodiment can more realistically reflect the long-term reliability of fault diagnosis equipment under complex operating conditions, effectively screen out equipment that is prone to performance drift or connection failure in environments with alternating temperature changes, thereby significantly improving the overall quality and reliability of the equipment leaving the factory and reducing the failure rate in actual applications.

[0046] This embodiment controls the aging chamber to operate according to preset environmental data, allowing the fault diagnosis equipment to run for a preset duration. After the preset duration, the temperature of the fault diagnosis equipment is allowed to drop to room temperature. While the fault diagnosis equipment is at room temperature, it is connected to the device under test to determine its operating status. If the operating status is normal, the fault diagnosis equipment is placed back into the aging chamber for the next round of aging treatment, until the preset number of aging cycles is completed. In this way, multiple rounds of aging treatment simulate real-world temperature cycling scenarios, effectively stimulating potential defects in the equipment and improving its long-term service capability under real-world operating conditions.

[0047] Optionally, refer to Figure 2Another embodiment of the present invention provides an aging method for a fault diagnosis device, based on the above. Figure 1 The illustrated embodiment connects the fault diagnosis device and the device under test when the fault diagnosis device is at room temperature to determine the operating status of the fault diagnosis device, including steps S3010-S3030, wherein: S3010. When the fault diagnosis equipment is at room temperature, control the remote management backend to establish a communication connection with the fault diagnosis equipment. S3020. The fault diagnosis equipment is controlled by the remote management backend to start the detection program of the device under test, so as to obtain the detection data of the device under test and generate a diagnostic report corresponding to the detection data. S3030, Determine the operating status corresponding to the diagnostic report.

[0048] The remote management backend refers to a centralized software system or platform whose main function is to monitor, configure, control, and manage data of remote devices. This backend can be deployed on a dedicated server, such as a private server within an enterprise, or built on a cloud computing platform, such as cloud services provided by Alibaba Cloud or Tencent Cloud. Its role is to provide a unified interface and management interface, allowing operators to remotely operate and monitor the fault diagnosis equipment without directly touching it. The remote management backend can also be a lightweight management terminal implemented using remote control software, such as an interface built on remote tools like TeamViewer or Sunflower, enabling communication and control without removing the fault diagnosis equipment.

[0049] Establishing a communication connection refers to setting up a data transmission channel between the remote management backend and the fault diagnosis device to achieve information exchange. This can be achieved in various ways, such as using a wired Ethernet connection and communicating via standard network protocols (e.g., TCP / IP); or using wireless communication methods such as Wi-Fi, Bluetooth, or cellular networks (e.g., 4G / 5G) to provide greater deployment flexibility. Establishing a communication connection is fundamental for remote control and data transmission. Controlling the fault diagnosis device to initiate a detection program for the device under test (DUT) aims to trigger preset diagnostic functions within the fault diagnosis device via remote commands. Its function is to automatically initiate the fault diagnosis device to evaluate the performance or function of the external DUT. This can be achieved by sending specific control commands or API calls from the remote management backend. After receiving the command, the fault diagnosis device's built-in firmware or software module will begin executing a pre-programmed detection sequence. Acquiring the detection data of the DUT refers to the various performance parameters, status information, or response data collected by the fault diagnosis device from the DUT during the execution of the detection program. This detection data can be electrical parameters such as voltage, current, and frequency, or sensor readings, error codes, response times, etc. Its function is to provide objective evidence for subsequent evaluation of the operational status of fault diagnosis equipment. Data acquisition can be completed through the internal acquisition module of the fault diagnosis equipment, and the acquired raw data is transmitted to the remote management backend via a communication connection. Generating a diagnostic report corresponding to the test data refers to analyzing, organizing, and formatting the acquired test data to form a document containing test results, abnormal prompts, or performance evaluation conclusions. This can be generated automatically or manually. The purpose of this diagnostic report is to intuitively present the fault diagnosis equipment's diagnostic capabilities for the tested equipment and its own operational status. The diagnostic report can be generated by the fault diagnosis equipment itself according to preset rules, or it can be centrally processed and generated by the remote management backend after receiving the raw data. Determining the operational status corresponding to the diagnostic report means judging whether the fault diagnosis equipment is currently working normally based on the content of the diagnostic report. This usually involves comparing the key indicators in the report with preset pass standards or thresholds. For example, if the report shows that all test items have passed and the key performance parameters are within the allowable range, the operational status is determined to be normal; conversely, if there are any non-compliance issues, the operational status is determined to be abnormal.

[0050] This embodiment automates and remotely determines the operational status of fault diagnosis equipment during the aging process by introducing a remote management backend. After the fault diagnosis equipment completes its preset operating time in the aging chamber and cools to room temperature, the remote management backend actively or passively establishes a communication connection with it. Once the connection is successful, the remote management backend can remotely issue commands to control the fault diagnosis equipment to start its built-in detection program and diagnose the externally connected device under test. During the execution of the detection program, the fault diagnosis equipment acquires various detection data from the device under test in real time and transmits this data back to the remote management backend. After receiving the detection data, the remote management backend automatically generates a detailed diagnostic report based on preset analysis logic and standards. Finally, the aging control system automatically determines whether the current operational status of the fault diagnosis equipment is normal or abnormal based on the content of this diagnostic report, such as comparing whether the key indicators in the report meet preset pass thresholds. This mechanism avoids manual intervention, ensuring the continuity, accuracy, and efficiency of the aging test process, thus effectively solving the problems of low efficiency and error-proneness in traditional manual testing, making the entire aging process smoother.

[0051] In one implementation, after the fault diagnosis device completes high-temperature aging and cools to room temperature, its built-in communication module (e.g., a microcontroller with integrated Wi-Fi functionality) automatically attempts to connect to a preset wireless local area network. A remote management backend (e.g., a web application deployed on a cloud server) continuously monitors available fault diagnosis devices on the network. Once a new device is detected, the remote management backend establishes a communication session with it via HTTP. Subsequently, the remote management backend sends a JSON-formatted command to the fault diagnosis device, instructing it to initiate a testing program for the specific device under test (e.g., a standard signal generator). Upon receiving the command, the fault diagnosis device collects waveform data, frequency, amplitude, and other parameters output by the signal generator through its analog input interface. After collection, the fault diagnosis device packages this raw data and uploads it to the remote management backend via Wi-Fi. Upon receiving the data, the remote management backend invokes its internal data analysis engine to compare this data with preset golden sample data and generates a diagnostic report containing information such as "pass / fail" status and specific parameter deviations. Finally, the operating status of the fault diagnosis equipment can be marked as "normal" or "abnormal" based on the "pass / fail" field in the diagnostic report.

[0052] Through the above technical solution, the operational status of fault diagnosis equipment can be automatically and remotely determined during the aging process. This significantly reduces the need for manual operation, avoids errors that may be introduced by human intervention, and greatly improves the efficiency and reliability of aging tests. Especially in large-scale batch aging test scenarios, this solution can ensure that the status of the fault diagnosis equipment can be quickly and accurately evaluated after each aging cycle, thereby guaranteeing the continuity of the aging process and the objectivity of the test results, effectively solving the technical problems of low efficiency and error-proneness of traditional manual testing.

[0053] In some cases, such as for specific types of fault diagnosis equipment or when more refined and direct testing and verification are required, relying solely on automated testing via a remote management backend may not be sufficient to fully assess the equipment's performance and potential defects, or to meet specific testing specifications.

[0054] Therefore, referring to Figure 3 Another embodiment of the present invention provides an aging method for a fault diagnosis device, based on the above. Figure 1 The illustrated embodiment connects the fault diagnosis device and the device under test when the fault diagnosis device is at room temperature to determine the operating status of the fault diagnosis device, including steps S3040-S3060, wherein: S3040. With the fault diagnosis equipment at room temperature, remove the fault diagnosis equipment from the aging chamber and connect the fault diagnosis equipment to the device under test according to the test requirements. S3050: Control the fault diagnosis equipment to start the detection program of the device under test, so as to obtain the detection data of the device under test and generate a diagnostic report corresponding to the detection data; S3060. Determine the operating status corresponding to the diagnostic report.

[0055] Before conducting operational status testing, the fault diagnosis device needs to be physically removed from the aging chamber. This is typically to facilitate subsequent manual connection operations and testing, or to perform performance verification in a non-chamber environment that better reflects real-world usage scenarios. This can be done manually by opening the aging chamber door and removing the fault diagnosis device; alternatively, in an automated testing system, a robotic arm or conveyor belt system can automatically remove the device after the aging chamber door is opened. The fault diagnosis device is then electrically connected to the device under test (DUT) according to testing requirements to establish a physical pathway for functional testing between them. This electrical connection must strictly adhere to pre-defined testing specifications and requirements to ensure accurate signal transmission and reliable test results. For example, a point-to-point connection can be established manually using dedicated test cables, adapters, and connectors; alternatively, in batch testing scenarios, customized test fixtures or automated connection systems can be used to improve connection efficiency and consistency. Controlling the fault diagnosis device to initiate its detection program on the DUT is crucial for triggering the execution of its core diagnostic functions. The fault diagnosis equipment performs a series of tests on the connected device under test (DUT) according to a preset program. The test program can be started manually via the equipment's built-in user interface (such as a touchscreen or physical buttons) by selecting and activating the corresponding test function; or remotely by sending commands to an external control terminal (such as a personal computer or tablet). Acquiring the test data from the DUT and generating a corresponding diagnostic report is the output of the fault diagnosis equipment after completing its testing task, and the result is a crucial basis for evaluating the equipment's operating status. During the execution of the test program, the fault diagnosis equipment reads various data from the DUT (such as sensor readings, fault codes, system status information, etc.), processes and analyzes it internally, and ultimately generates a structured diagnostic report. This report can be displayed on the equipment's screen, stored in the equipment's memory, or transmitted to an external system via a communication interface. Determining the operating status corresponding to the diagnostic report is the final step in judging the fault diagnosis equipment's working condition based on the test results. The operating status can be determined by a human operator based on the contents of the diagnostic report (e.g., whether the test data is within the normal range, whether there are abnormal fault codes, whether all diagnostic functions have been successfully executed, etc.); or it can be determined automatically by preset software logic, which analyzes the key indicators in the diagnostic report and compares them with preset qualification standards, thereby automatically determining whether the operating status of the fault diagnosis equipment is normal or abnormal.

[0056] This embodiment addresses the limitations of automated remote testing in certain scenarios by introducing a testing method that combines manual intervention and direct physical connection. Specifically, after the fault diagnosis equipment completes a high-temperature or low-temperature aging cycle and cools to room temperature, it is first physically removed from the aging chamber, facilitating subsequent manual operation and precise connection. Subsequently, the fault diagnosis equipment is electrically connected to the device under test (DUT) manually or semi-automatically, strictly adhering to testing requirements. This ensures the authenticity of the testing environment and the reliability of the connection, which is particularly important for diagnostic equipment requiring high-precision signal transmission or specific physical interface matching. Once the physical connection is established, the fault diagnosis equipment initiates its built-in detection program, enabling it to perform actual diagnostic functions on the connected DUT. During this process, the fault diagnosis equipment acquires the DUT's detection data and generates a detailed diagnostic report based on this data. Finally, by analyzing this diagnostic report, whether through manual interpretation or automatic comparison using preset logic, the operating status of the fault diagnosis equipment can be accurately determined. This direct, physical contact testing process can more comprehensively expose potential defects that may arise in equipment during the aging process, especially in scenarios involving complex signal interactions, specific physical interface performance, or requiring manual observation of equipment behavior. This effectively compensates for the shortcomings of purely automated remote testing and ensures the reliability of fault diagnosis equipment before practical application.

[0057] In one implementation of this embodiment, after the fault diagnosis equipment completes a round of high-temperature aging and cools to room temperature, the tester can open the door of the aging chamber and carefully remove the fault diagnosis equipment from the chamber. Subsequently, the tester places the fault diagnosis equipment on a test bench and uses a dedicated diagnostic cable to electrically connect its diagnostic interface to the computing power board of a blockchain server. After the connection is established, the tester initiates the "Computing Power Board Performance Diagnosis" program on the fault diagnosis equipment. Upon receiving the command, the fault diagnosis equipment begins a comprehensive testing operation on the connected blockchain server computing power board, including reading the operating parameters of the computing power board, detecting its working status, and evaluating its performance indicators. During the testing process, the fault diagnosis equipment acquires various test data from the computing power board in real time, such as computing speed, power consumption, and temperature, and performs preliminary processing and analysis internally. After the testing program is completed, the fault diagnosis equipment generates a detailed diagnostic report based on the collected data and preset diagnostic rules. This report not only includes various test data of the computing power board but also provides an evaluation conclusion on the performance of the computing power board and hints about the existence of faults or potential problems. Testers can review this diagnostic report and compare the data in the report with the preset pass / fail standards to determine whether the fault diagnosis equipment is operating normally after aging when diagnosing the computing board. If all test data are within the normal range and there are no abnormal fault prompts, the fault diagnosis equipment is considered to be operating normally; otherwise, if there are data out of range or fault prompts, the operating status is considered abnormal and further investigation and repair are required.

[0058] In another implementation of this embodiment, after the fault diagnosis equipment completes a round of high-temperature aging and cools to room temperature, the tester can open the aging chamber door and carefully remove the fault diagnosis equipment from the chamber. The tester then places the fault diagnosis equipment on a test bench and uses a dedicated OBD-II diagnostic cable to electrically connect its diagnostic interface to the OBD-II interface of a simulated vehicle. After connection, the tester selects and starts the "Engine System Diagnosis" program through the touchscreen interface on the fault diagnosis equipment. The fault diagnosis equipment then begins communicating with the ECU of the simulated vehicle, reading fault codes, sensor data streams, and other information, and displays the detection progress on the screen in real time. After the detection program is completed, the fault diagnosis equipment automatically generates corresponding diagnostic data, which includes all detected data and diagnostic results. The tester can review the diagnostic data, such as checking for abnormal fault codes, whether the data stream is within the normal range, and whether the diagnostic functions have been fully executed, thereby determining whether the fault diagnosis equipment is operating normally after aging.

[0059] Through the above technical solution, this embodiment provides a more direct and reliable method for determining the operating status of fault diagnosis equipment. By removing the fault diagnosis equipment from the aging chamber and making a physical electrical connection, problems such as communication delays, signal interference, or the inability to simulate real physical interface connections that may exist in remote testing are avoided, ensuring the authenticity of the testing environment and the accuracy of the test results. This manual or semi-automatic connection and testing method is particularly suitable for scenarios with strict requirements on the functional integrity, interface compatibility, and specific physical performance of fault diagnosis equipment. It can more comprehensively expose potential defects that may occur in the equipment during the aging process, thereby significantly improving the thoroughness and reliability of the aging test of fault diagnosis equipment and providing a solid guarantee for the quality control of the equipment.

[0060] Single or simple preset environmental data may not be able to fully simulate the complex temperature changes and stresses that fault diagnosis equipment may face in actual use, which may result in some potential defects not being effectively induced and discovered, affecting the comprehensiveness and effectiveness of aging tests.

[0061] Therefore, referring to Figure 4 Another embodiment of the present invention provides an aging method for a fault diagnosis device, based on the above. Figure 1 In the embodiment shown, the preset environmental data consists of at least three different temperature values.

[0062] The aging chamber is controlled to operate according to preset environmental data, so that the fault diagnosis equipment runs within the aging chamber for a preset operating time, including step S1010, wherein: S1010: Control the aging chamber to adjust the temperature according to the first temperature value, and control the fault diagnosis equipment to run for the first preset time at the first temperature value.

[0063] If the operation is normal, the fault diagnosis equipment is placed back into the aging chamber for the next round of aging treatment until the preset aging process is completed, including step S410, wherein: S410. If the operation is normal, control the aging chamber to adjust the temperature according to the second temperature value and the third temperature value in sequence, so that the fault diagnosis equipment runs for the second preset time and the third preset time at the corresponding second temperature value and the third temperature value, until the aging process under multiple temperature environments is completed.

[0064] The preset environmental data includes at least three different temperature values, such as -60℃, 65℃, and 70℃. This preset environmental data means that the environmental conditions applied to the fault diagnosis equipment during the aging process are no longer limited to a single temperature point but cover multiple discrete temperature stress points. These temperature values ​​can be selected based on the design operating temperature range of the fault diagnosis equipment, industry standards, or historical failure data. For example, the equipment's minimum operating temperature, rated operating temperature, and maximum operating temperature can be selected as three different temperature values. Alternatively, based on accelerated aging test theory, multiple temperature points that can effectively accelerate the equipment failure process can be selected to expose potential defects in a shorter time. The aging chamber is controlled to adjust its temperature according to the first temperature value, and the fault diagnosis equipment is controlled to operate at the first temperature value for a first preset duration to ensure that the fault diagnosis equipment undergoes initial operation and stress accumulation under the first specific temperature stress. The aging chamber can precisely adjust and maintain the internal temperature at the set first temperature value through its built-in heating / cooling unit and temperature sensor, combined with control algorithms such as a PID controller. The fault diagnosis equipment operates at the first temperature value through its own self-test program, a test program simulating actual workload, or specific aging software to ensure its internal components continue to operate under high-temperature stress. If the operating state is normal, the aging chamber is sequentially controlled to adjust its temperature according to the second and third temperature values, causing the fault diagnosis equipment to run for a second preset duration and a third preset duration at the corresponding second and third temperature values, respectively, until the aging process under multiple temperature environments is completed. Its purpose is to continue applying different temperature stresses after the equipment passes the previous stage of testing, forming a multi-temperature cycle aging process to more comprehensively verify the equipment's reliability. The temperature adjustment of the aging chamber can be based on a pre-programmed temperature curve or automatically executed by the aging control device according to a preset aging strategy, ensuring a smooth transition of temperature from one value to another. The running time at each temperature value (the second preset duration and the third preset duration) can be set according to the equipment's characteristics, expected lifespan, acceleration factor, and required aging intensity to ensure sufficient time to induce potential defects under each temperature stress. The aging process under multiple temperature conditions can be a fixed number of cycles, or it can be judged as complete based on the cumulative aging time or cumulative stress exposure.

[0065] This embodiment introduces multiple different temperature values ​​as preset environmental data and sequentially operates the fault diagnosis equipment at these temperature values, thereby extending the single-temperature aging process into a multi-temperature cycle aging process. The method first controls the aging chamber to adjust to a first temperature value and operates the fault diagnosis equipment at that first temperature value for a first preset duration. This step aims to simulate the long-term operating state of the equipment in a specific high or low temperature environment to induce early failures that may occur at that temperature. After the first round of aging treatment, the equipment is removed and allowed to cool to room temperature before its operating status is checked. If the operating status is normal, it indicates that the equipment has passed the test of the first temperature stress. Subsequently, the method no longer simply repeats the aging at the first temperature value, but instead sequentially controls the aging chamber to adjust to a second and third temperature value, and respectively operates the fault diagnosis equipment at the corresponding second and third temperature values ​​for a second and a third preset duration. This multi-temperature cycle design allows the fault diagnosis equipment to experience a wider range of temperature stress, simulating temperature changes that it may encounter in practical applications under different seasons, regions, or operating conditions. By subjecting the equipment to aging at multiple different temperatures and combining this with room temperature testing after each temperature cycle, this approach can more comprehensively expose potential defects in fault diagnosis equipment under varying temperature stresses. For example, some defects may only manifest at high temperatures, while others may only be induced by temperature changes or specific low temperatures. This gradual, multi-temperature stress-addition aging method significantly improves the coverage and effectiveness of aging tests.

[0066] In one implementation of this embodiment, it is assumed that the fault diagnosis device to be aged is a diagnostic fixture for the computing power board of a blockchain server. First, the diagnostic fixture is placed in an aging chamber, initially set to a first temperature of 40°C. The diagnostic fixture operates continuously at this temperature for 36 hours (a first preset duration). During these 36 hours, the diagnostic fixture executes its predetermined operating program, such as performing performance testing and fault diagnosis on the simulated blockchain server computing power unit, or simply powering on and running. After 36 hours, the diagnostic fixture is removed from the aging chamber and allowed to cool naturally to room temperature (e.g., 22°C). At room temperature, the diagnostic fixture is connected to a simulated blockchain server computing power test platform, and the testing program is started. If the diagnostic fixture can accurately identify the test platform, acquire relevant data, and provide correct test results, then its operating status is determined to be normal. If the operation is normal, the diagnostic fixture of the computing board is placed back into the aging chamber, this time set to the second temperature value of 55℃. The diagnostic fixture runs at this temperature for 24 hours (the second preset duration). After 24 hours, the steps of removing, cooling to room temperature, and checking the operation are repeated. If the operation is still normal, the diagnostic fixture of the computing board is placed back into the aging chamber, this time set to the third temperature value of 60℃. The diagnostic fixture runs at this temperature for 12 hours (the third preset duration). After 12 hours, the steps of removing, cooling to room temperature, and checking the operation are repeated again. After completing these three temperature cycles, one round of aging under multi-temperature conditions is completed. The entire aging process can also be set to repeat several rounds, such as two rounds, to ensure that the equipment undergoes sufficient aging testing under different temperature conditions.

[0067] By aging fault diagnosis equipment at multiple different temperature values, the complex temperature environments that the equipment may encounter in actual use can be more comprehensively simulated. This effectively induces and exposes potential defects that are difficult to detect under a single temperature condition, significantly improving the coverage and depth of aging tests. This allows fault diagnosis equipment to undergo more rigorous reliability verification before leaving the factory, thereby improving the overall quality of the product and its stable operation under various temperature environments.

[0068] Aging treatment of fault diagnosis equipment may be limited to a single or limited temperature environment, which may not fully expose potential defects of the equipment under extreme temperature changes.

[0069] Therefore, referring to Figure 5 The present invention also provides an aging method for a fault diagnosis device, based on the above. Figure 1 In the embodiment shown, the preset environmental data includes a first temperature above zero degrees and a second temperature below zero degrees. The aging chamber is controlled to operate according to preset environmental data, so that the fault diagnosis equipment runs within the aging chamber for a preset operating time, including steps S1020-S1040, wherein: S1020: Control the aging chamber to adjust from room temperature to the first temperature, and control the fault diagnosis equipment to run for the first preset time at the first temperature; S1030 After the first preset time period ends, control the aging chamber to linearly adjust from the first temperature to the second temperature, and after reaching the second temperature, control the fault diagnosis equipment to run at the second temperature for the second preset time. S1040 After the second preset time period ends, control the aging chamber to adjust from the second temperature to room temperature; With the fault diagnosis equipment at room temperature, connect the fault diagnosis equipment to the device under test to determine the operating status of the fault diagnosis equipment, including steps S3070-S3100, wherein: S3070. When the fault diagnosis equipment is at room temperature, connect the fault diagnosis equipment to the device under test, control the fault diagnosis equipment to run the detection program, and collect the detection data of the fault diagnosis equipment. S3080. Compare the detection data with the preset detection data and generate the corresponding comparison results; S3090. If the comparison results are consistent, the fault diagnosis equipment is confirmed to be operating normally. S3100. If the comparison results are inconsistent, it is determined that the operating status of the fault diagnosis equipment is abnormal.

[0070] The preset environmental data includes a first temperature above zero, such as 60°C, and a second temperature below zero, such as -60°C. This simulates the extreme high and low temperature environments that the fault diagnosis equipment may encounter in actual use, thereby providing a more comprehensive evaluation of its performance and reliability over a wide temperature range. The first and second temperatures can be set based on the equipment's designed operating temperature range, industry standards, or through analysis of historical failure data. The aging chamber is controlled to adjust from room temperature to the first temperature, and the fault diagnosis equipment is controlled to run at the first temperature for a first preset duration. The purpose is to ensure continuous operation of the fault diagnosis equipment under high-temperature stress, accelerating the exposure of potential defects such as material aging, component performance drift, or solder joint fatigue that may occur under high-temperature conditions. The aging chamber can employ a high-precision temperature control system, using heating elements to stabilize the temperature inside the chamber at the first temperature. Simultaneously, the fault diagnosis equipment can perform its core functional tests or simulate actual workloads. After the first preset duration, the aging chamber is linearly adjusted from a first temperature to a second temperature. Upon reaching the second temperature, the fault diagnosis device is operated at that temperature for a second preset duration to simulate the thermal shock stress of the device under rapid temperature changes and the continuous operating stress in a low-temperature environment. Linear adjustment ensures a controllable and uniform rate of temperature change, avoiding the introduction of unexpected stress due to rapid temperature fluctuations. At the second temperature, the fault diagnosis device can perform low-temperature start-up tests, low-temperature performance tests, or communication stability tests to verify its functional integrity under low-temperature conditions. After the second preset duration, the aging chamber is adjusted from the second temperature to room temperature. This step allows the fault diagnosis device to return to a stable normal temperature state before performance testing, eliminating the instantaneous impact of temperature stress on the test results and ensuring the objectivity and accuracy of the tests.

[0071] With the fault diagnosis equipment at room temperature, it is connected to the device under test (DUT). The fault diagnosis equipment is controlled to run a detection program and collect detection data. The purpose is to comprehensively verify the core functions of the equipment after it has undergone temperature cycling stress. The detection program may include equipment self-test, data interaction with the DUT, and execution of specific diagnostic functions. The collected detection data may cover key performance indicators such as measurement accuracy, response time, communication stability, and data processing capabilities. The detection data is compared with preset detection data to generate corresponding comparison results, thereby automatically and objectively evaluating whether the performance of the fault diagnosis equipment meets preset standards. The preset detection data may be a set of standard output data, performance parameter ranges, or ideal data obtained through simulation models from known qualified equipment. Comparison methods may include numerical difference analysis, threshold judgment, and statistical methods. If the comparison results are consistent, the fault diagnosis equipment is determined to be operating normally; if the comparison results are inconsistent, the fault diagnosis equipment is determined to be operating abnormally. This step directly determines whether the equipment has passed the current round of aging test based on the comparison results, achieving automated decision-making and fault identification. Normal operating status indicates that the equipment can maintain its expected performance after experiencing temperature stress and can enter the next round of aging; abnormal operating status indicates that the equipment has potential defects or has failed and requires further analysis or treatment.

[0072] This embodiment introduces preset environmental data including a first temperature above zero and a second temperature below zero, and precisely controls the aging chamber to linearly adjust and maintain these extreme temperatures, enabling the fault diagnosis equipment to undergo more rigorous and comprehensive thermal cycling stress. This temperature cycling stress effectively accelerates the exposure of potential defects inside the equipment caused by factors such as mismatched thermal expansion coefficients of materials, solder joint fatigue, and component performance drift. After each temperature cycle, the equipment is conditioned to room temperature and connected to the device under test in a stable environment to run the testing program and collect test data. Subsequently, by automatically comparing the collected test data with preset test data, the operating status of the fault diagnosis equipment can be objectively and accurately determined. This strategy, which combines extreme temperature cycling stress with standardized performance verification, significantly improves the effectiveness and efficiency of aging testing, ensuring the long-term reliability and stability of the fault diagnosis equipment in real-world complex working environments.

[0073] As one implementation method, the computing board fault diagnosis equipment can undergo aging treatment. First, the equipment is placed in an aging chamber. Preset environmental conditions are a high temperature of 85°C and a low temperature of -40°C to fully simulate extreme working environments. At the start of the aging process, the ambient temperature inside the chamber rises from room temperature (approximately 23°C) to 85°C at a rate of 3°C per minute and remains at this high temperature for 6 hours. During this period, the equipment performs corresponding simulated tests or normal operation to verify its stability and performance at high temperatures. Next, the aging environment rapidly decreases from 85°C to -40°C at a rate of 5°C per minute and is maintained at this low temperature for 4 hours. During this low-temperature phase, the equipment continues to operate to evaluate its ability to function under extreme low temperatures. After the -40°C holding phase ends, the ambient temperature rises back to room temperature at a rate of 3°C per minute. Once the equipment temperature reaches equilibrium with the environment, it is connected to a computing board or a simulated fault injection test platform via a preset test interface. This platform can simulate various hardware and software fault scenarios that the computing board may encounter. The fault diagnosis equipment initiates a comprehensive diagnostic mode to identify, locate, and attempt to repair simulated faults, while simultaneously recording various performance indicators during the diagnostic process. Ultimately, these diagnostic results and performance indicators are transmitted to the central monitoring system for comparison and analysis against preset pass / fail standards. If the equipment can accurately identify and handle all simulated faults, and the performance indicators meet the standards, its aging test is deemed passed, and it can proceed to practical application or the next stage of the aging cycle. If unidentified faults or substandard performance exist, the problem points are recorded in detail and used as a basis for subsequent improvements and optimizations.

[0074] Through the aforementioned technical solution, the fault diagnosis equipment is subjected to a wide range of temperature cycling stress, including a first temperature above zero and a second temperature below zero. This helps to more effectively expose potential defects that may arise in the equipment under extreme temperature changes, such as thermal expansion mismatch of components, solder joint fatigue, or low-temperature start-up performance issues. Furthermore, after each temperature cycle, standardized functional testing is performed at room temperature, and the test data is automatically compared, enabling an objective and accurate assessment of performance degradation or functional abnormalities after thermal stress. This method significantly improves the coverage and efficiency of aging tests, ensuring that the fault diagnosis equipment maintains its expected diagnostic accuracy and reliability in real-world usage environments, especially under extreme temperature conditions. This effectively improves the overall quality and reliability of the fault diagnosis equipment and reduces the risk of premature failure during market use.

[0075] Many electronic devices, especially those operating in humid or extreme environments, often experience failure modes that are not only influenced by temperature but also closely related to humidity stress. Simple temperature cycling aging may not fully expose all potential moisture-related defects, thus affecting a comprehensive assessment of the device's long-term reliability.

[0076] Therefore, referring to Figure 6 Another embodiment of the present invention provides an aging method for a fault diagnosis device, based on the above. Figure 1 In the embodiment shown, the preset environmental data also includes a first humidity and a second humidity, wherein the first humidity is greater than the second humidity.

[0077] The aging chamber is controlled to operate according to preset environmental data, so that the fault diagnosis equipment runs within the aging chamber for a preset operating time, including steps S1050-S1090, wherein: S1050: While adjusting the aging chamber to the first temperature, adjust the humidity inside the aging chamber to the first humidity. S1060. Control the fault diagnosis equipment to run continuously for a first preset time under the combined environment of the first temperature and the first humidity; S1070 After the first preset time period ends, the aging chamber is controlled to linearly adjust the temperature from the first temperature to the second temperature, and the humidity is adjusted from the first humidity to the second humidity. S1080: When the temperature and humidity both reach the second temperature and the second humidity, control the fault diagnosis equipment to continue running for the second preset time under the combined environment of the second temperature and the second humidity. S1090 After the second preset time period ends, the aging chamber is controlled to adjust the temperature from the second temperature to room temperature, and the humidity from the second humidity to the natural humidity under room temperature conditions.

[0078] The first humidity and the second humidity represent different humidity stress levels applied to the fault diagnosis equipment during the aging process. The first humidity is usually set to a higher value, such as 95% relative humidity, to simulate a high-temperature and high-humidity environment, accelerating failure mechanisms such as moisture penetration, corrosion, or material hygroscopic expansion. The second humidity is usually set to a lower value, such as 0% relative humidity (i.e., a dry environment), to simulate a low-temperature and dry environment, or alternate with a high-temperature and high-humidity environment, to induce stress caused by moisture adsorption / desorption cycles. These humidity values ​​can be precisely controlled by humidifiers (such as steam generators and ultrasonic atomizers) and dehumidifiers (such as condensation dehumidification and adsorption dehumidification) inside the aging chamber. Controlling the aging chamber to adjust to the first temperature while simultaneously adjusting the humidity inside the chamber to the first humidity level aims to simultaneously establish a combined high-temperature and high-humidity stress environment. Its function is to immediately introduce high humidity stress as the equipment reaches a high-temperature state, thereby more effectively simulating certain extreme working conditions and accelerating the exposure of moisture- and heat-sensitive defects. One implementation method is for the controller of the aging chamber to simultaneously activate the heating and humidifying elements upon receiving a command, and perform closed-loop control according to preset temperature and humidity curves to ensure that the temperature and humidity reach the target values ​​synchronously. Controlling the fault diagnosis equipment to continuously operate under the combined environment of the first temperature and first humidity for a first preset duration allows the equipment to be fully exposed to this stress combination, giving potential moisture-sensitive defects (such as encapsulation delamination, solder joint corrosion, PCB moisture absorption and expansion) sufficient time to be induced or accelerated. This preset duration is typically determined based on empirical data, accelerated aging models (such as the Eyring model), or product reliability requirements to ensure sufficient aging intensity is achieved. Controlling the aging chamber to linearly adjust the temperature from the first temperature to the second temperature and the humidity from the first humidity to the second humidity is to avoid introducing unexpected transient stresses or causing unnecessary impact damage to the equipment during stress transition due to sudden temperature or humidity changes. Furthermore, linear adjustment can more smoothly simulate the gradual change process of temperature and humidity in the actual environment, making the expansion, contraction, moisture absorption, and dehumidification processes of the materials inside the equipment more controllable and uniform. This is typically achieved through the programmable controller of the aging chamber, which precisely controls the temperature and humidity according to a preset incline (heating / cooling rate, humidity / cooling rate). The fault diagnosis device is controlled to run continuously for a second preset duration under the combined environment of the second temperature and the second humidity, designed to simulate another extreme environmental stress, such as a cold, dry environment. This environment may induce defects related to material shrinkage, embrittlement, or electrostatic sensitivity. Similar to the high temperature and high humidity stage, the duration of this stage also needs to be set according to specific failure mechanisms and reliability targets to ensure sufficient stress exposure.The aging chamber is controlled to adjust the temperature from the second temperature to room temperature and the humidity from the second humidity level to the natural humidity under room temperature conditions. After completing the low temperature and low humidity stage, the temperature and humidity of the aging chamber are restored to room temperature and natural humidity conditions. Its main function is to provide a stable and standardized environment for subsequent fault diagnosis and equipment function testing. This helps to avoid measurement errors or equipment performance abnormalities that may be introduced by testing under extreme temperature and humidity conditions, ensuring the accuracy and repeatability of test results. At the same time, a smooth restoration to room temperature conditions also avoids the equipment being subjected to additional thermal or moisture shocks before testing.

[0079] This embodiment, based on the aging method that only considers temperature stress cycling, introduces humidity stress cycling to construct a more comprehensive temperature and humidity combined stress aging environment. Specifically, by simultaneously adjusting the humidity to a first temperature and a first humidity level, the fault diagnosis equipment first undergoes a high-temperature, high-humidity combined stress stage. In this stage, the high temperature accelerates the penetration of moisture into the equipment's interior, while the high humidity directly affects the equipment's packaging materials, solder joints, PCB, etc., inducing potential moisture-heat related defects such as hygroscopic expansion, corrosion, electromigration, and packaging delamination. Subsequently, the aging chamber linearly adjusts the temperature from the first temperature to a second temperature and the humidity from the first humidity to a second humidity level. This controlled linear transition process avoids unintended stresses that may occur when the equipment experiences drastic temperature and humidity changes, while allowing stress release or redistribution of the internal materials under the temperature and humidity gradient. Once the temperature and humidity reach the second temperature and second humidity levels, the fault diagnosis equipment continues to operate in a low-temperature, low-humidity combined environment. The low-temperature stress in this stage may induce defects such as material shrinkage and embrittlement, while the low humidity helps assess the equipment's performance stability in a dry environment. By alternating cycles of high temperature and high humidity with low temperature and low humidity, and supplemented by controlled temperature and humidity transitions, this solution can more comprehensively simulate the working state of equipment in real complex environments, induce a wider range of potential failure modes, thereby improving the effectiveness of aging tests and the reliability assessment accuracy of fault diagnosis equipment.

[0080] As one implementation, the preset environmental data may include a first temperature of 60°C, a second temperature of -40°C, a first humidity of 95% relative humidity, and a second humidity of 10% relative humidity. During the aging process, the aging chamber is first controlled to adjust the temperature from room temperature to 60°C, and simultaneously adjust the humidity inside the chamber to 95% relative humidity. The fault diagnosis equipment operates continuously for 4 hours in this combined 60°C / 95% relative humidity environment. Subsequently, the aging chamber linearly adjusts the temperature from 60°C to -40°C and the humidity from 95% relative humidity to 10% relative humidity; for example, the adjustment rate can be set to 5°C per minute and 5% relative humidity per minute. When both temperature and humidity reach -40°C / 10% relative humidity, the fault diagnosis equipment operates continuously for 4 hours in this environment. Finally, the aging chamber adjusts the temperature from -40°C to room temperature and the humidity from 10% relative humidity to the natural humidity under room temperature conditions to prepare for functional testing. The entire temperature and humidity cycle constitutes one round of aging treatment, which can be repeated until the preset number of rounds is reached.

[0081] The above technical solution introduces humidity stress cycling on top of the existing temperature cycling aging method, achieving simultaneous and precise control of temperature and humidity stress. This allows fault diagnosis equipment to undergo more rigorous and comprehensive environmental stress testing, effectively inducing and exposing potential defects sensitive to humidity and heat, such as encapsulation delamination, solder joint corrosion, PCB moisture absorption and expansion, and electromigration. Compared to aging methods that only involve temperature cycling, this solution can more comprehensively simulate the failure mechanisms of equipment in real-world complex working environments, significantly improving the ability of aging tests to detect potential product defects. This allows for a more accurate assessment of the long-term reliability and environmental adaptability of fault diagnosis equipment, providing more comprehensive data support for product design improvement and quality control.

[0082] In practical applications, if general or empirical preset environmental data is used for aging, it may not be able to efficiently and accurately induce the potential defects of specific model fault diagnosis equipment, resulting in low aging efficiency or failure to fully expose the risk of early product failure.

[0083] Therefore, referring to Figure 7 Another embodiment of the present invention provides an aging method for a fault diagnosis device, based on the above. Figure 1 The embodiment shown controls the aging chamber to operate according to preset environmental data, specifically in steps S1100-S1140, wherein: S1100: Obtain the equipment model identification code and production batch information of the fault diagnosis equipment to be aged; S1110. Based on the equipment model identification code and production batch information, obtain historical failure environment distribution data and performance degradation curve model related to the equipment model from the aging knowledge database. S1120. Based on historical failure environment distribution data, determine the key temperature stress points and key humidity stress points that induce potential defects in the equipment corresponding to the equipment model. S1130. Based on the performance degradation curve model and the preset aging strength coefficient, generate aging environment profile data with key temperature stress points, key humidity stress points, holding time of each stress point, and stress transition rate. S1140. Control the operation of the aging chamber according to the aging environment profile data.

[0084] The purpose of obtaining the equipment model identification code and production batch information of the fault diagnosis equipment to be aged is to identify the specific identity of the equipment. This can be achieved in various ways, such as automatically reading the barcode or QR code attached to the equipment by scanning it, or manually entering the information on the equipment nameplate. Alternatively, radio frequency identification (RFID) technology can be used to automatically acquire the identification information when the equipment enters the aging area. Based on the equipment model identification code and production batch information, the core of obtaining historical failure environment distribution data and performance degradation curve models related to the equipment model from the aging knowledge database lies in using historical data and models to guide the aging process. The aging knowledge database can be a centralized data storage system, such as a relational database or a non-relational database, which stores a large number of failure records, failure modes, and performance degradation patterns over time for different equipment models under various environmental conditions. This data can be automatically collected or manually entered. The acquisition process can be completed by sending a query request to the database to retrieve historical data and models that precisely match or are highly relevant to the current equipment model. Based on the historical failure environment distribution data, identifying the key temperature stress points and key humidity stress points that induce potential defects in the corresponding equipment model aims to extract the most effective environmental conditions for triggering potential equipment defects from a large amount of historical failure data. This can be achieved through statistical analysis of temperature and humidity data at the time of historical failure events, for example, identifying the temperature and humidity ranges of high-incidence areas of failure events. Another approach is to utilize data mining or machine learning algorithms to automatically discover environmental stress combinations strongly correlated with specific failure modes from complex historical data. Based on the performance degradation curve model and the preset aging intensity coefficient, generating aging environment profile data with key temperature stress points, key humidity stress points, duration of each stress point, and stress transition rate aims to transform the identified key stress points into an executable aging test plan. The performance degradation curve model describes the law of equipment performance change with time or stress. Combined with the preset aging intensity coefficient (e.g., the expected simulated actual service life), the required accelerated aging time at different stress points can be calculated. Determining the stress transition rate requires consideration of the equipment's physical characteristics, such as thermal inertia, to ensure that the equipment is not subjected to unnecessary mechanical stress damage when temperature or humidity changes rapidly, while ensuring the efficiency of the aging process. Controlling the operation of the aging chamber according to the aging environment profile data is the final execution step of the aging program. The controller of the aging chamber can receive the generated aging environment profile data and convert it into specific control commands, such as setting the target temperature, humidity, holding time, and heating / humidification rates. This is typically achieved through a programmable logic controller (PLC) or an embedded system, which can precisely adjust the environmental parameters inside the chamber to strictly adhere to the preset aging profile.

[0085] This embodiment significantly optimizes the basic aging method by introducing an intelligent aging environment profile generation mechanism. First, by acquiring the equipment model identification code and production batch information of the equipment to be aged for fault diagnosis, the aging control device can accurately identify the equipment type. Based on this identification result, the aging control device retrieves historical failure environment distribution data and performance degradation curve models related to the equipment model from the aging knowledge database. These data and models form the basis of the customized aging strategy, containing the vulnerabilities and performance degradation patterns exhibited by the equipment model in past operation. Subsequently, the aging control device intelligently determines the key temperature stress points and key humidity stress points most likely to induce potential defects in the equipment model using the historical failure environment distribution data, thereby avoiding the inefficiency problems that may result from blind or generic aging. Based on this, combined with the performance degradation curve model and preset aging intensity coefficients, the system can accurately calculate the required holding time at each key stress point and, considering factors such as the equipment's thermal inertia, generate a reasonable stress transition rate, ultimately forming a highly customized, scientifically effective aging environment profile. The aging chamber operates strictly according to this aging environment profile data, ensuring that the aging process accurately simulates and accelerates the harsh environments that the equipment may encounter in actual use, thereby efficiently exposing potential defects. This data-driven, customized aging strategy means that the operation of fault diagnosis equipment in the aging chamber is no longer a simple preset duration, but rather the application of targeted stress, greatly improving the effectiveness and efficiency of aging testing. This ensures that the equipment can withstand more rigorous testing that better matches actual application scenarios before leaving the factory, thereby improving product reliability.

[0086] In one implementation of this embodiment, it is assumed that an aging process needs to be performed on a batch of new model fault diagnosis equipment. First, the aging control device scans the equipment's QR code to obtain its equipment model identification code "FD-V2023-A" and production batch information "P20230801". Based on this information, the aging control device queries the aging knowledge database to retrieve historical failure environment distribution data for the "FD-V2023-A" model. For example, this model is prone to solder joint fatigue failure in high temperature and high humidity environments (e.g., 85℃, 90%RH) and component cracking failure in low temperature impact environments (e.g., -40℃). Simultaneously, the performance degradation curve model of this model is also obtained. Based on this historical data, the aging control device determines 85℃ and -40℃ as critical temperature stress points and 90%RH as a critical humidity stress point. Next, combining the performance degradation curve model and a preset equivalent aging intensity coefficient (e.g., simulating a five-year actual service life), the aging control device calculates that it needs to be maintained for 24 hours at 85℃ / 90%RH and for 12 hours at -40℃. Considering the potential thermal shock caused by the rapid transition from high temperature and humidity to low temperature, the aging control device sets the maximum allowable temperature transition rate to 5℃ / minute and the humidity transition rate to 10%RH / minute. Finally, the aging control device generates an aging environment profile that includes a series of steps such as high temperature and humidity maintenance, rapid cooling, low temperature maintenance, and reheating to room temperature. After receiving this profile data, the controller of the aging chamber will precisely adjust and maintain the temperature and humidity according to these parameters, thereby performing customized accelerated aging of this batch of fault diagnosis equipment.

[0087] Through the above technical solution, this embodiment overcomes the shortcomings of traditional aging methods, which suffer from the limitation of broad applicability but insufficient specificity of preset environmental data. By acquiring the equipment's model and batch information, and based on historical failure data and performance degradation models in the aging knowledge database, it can intelligently identify key stress points for specific equipment models and generate customized aging environment profile data. This makes the aging process no longer blind or empirical, but highly targeted and scientific, enabling more efficient and accurate induction of potential equipment defects, thereby significantly improving the aging efficiency and defect detection rate of fault diagnosis equipment. Ultimately, this helps improve the overall reliability and stability of fault diagnosis equipment, reduces the risk of early product failure in actual use, and provides users with more reliable products.

[0088] In practice, how to accurately identify the key environmental stress points that truly induce potential defects in equipment from a large amount of historical failure data, and scientifically generate efficient and accurate aging environment profile data in combination with performance degradation models, so as to ensure the effectiveness and representativeness of aging tests.

[0089] Therefore, referring toFigure 8 Another embodiment of the present invention provides an aging method for a fault diagnosis device, based on the above. Figure 1 The embodiment shown identifies key temperature stress points and key humidity stress points that induce potential defects in the equipment model based on historical failure environment distribution data, including steps S1121-S1126, wherein: S1121. Extract all historical failure event records corresponding to the equipment model from the aging knowledge database. The historical failure event records shall at least include the ambient temperature value, ambient humidity value and failure mode code corresponding to the time of failure. S1122. Using temperature and humidity values ​​as two-dimensional coordinate axes, establish a scatter distribution model of historical failure event records, and generate a joint probability density distribution surface of historical failure environments based on the kernel density estimation algorithm. S1123. Identify the first continuous region in the joint probability density distribution surface where the probability density value exceeds a preset threshold, and take the first continuous region as the typical failure environment stress range of the equipment model. S1124. From the stress range of typical failure environments, extract the boundary extreme points of temperature dimension as candidate key temperature stress points, and extract the boundary extreme points of humidity dimension as candidate key humidity stress points. S1125. Combine and pair candidate critical temperature stress points with candidate critical humidity stress points, and calculate the frequency of occurrence of the corresponding failure mode in the historical failure event record for each combination. S1126. Select the top N temperature and humidity combinations with the highest failure mode occurrence frequency, and determine them as the key temperature stress points and key humidity stress points for inducing potential defects, where N is greater than or equal to two.

[0090] Reference Figure 9 Based on the performance degradation curve model and the preset aging strength coefficient, aging environment profile data is generated, including steps S1131-S1136, which include key temperature stress points, key humidity stress points, holding time of each stress point, and stress transition rate. S1131. Based on the performance degradation curve model, calculate the estimated natural aging time required for the performance parameters of the fault diagnosis equipment to decay to the preset failure threshold under normal temperature reference environment. S1132. Based on the preset aging strength coefficient, determine the target equivalent aging time of the aging process. The target equivalent aging time is equal to the estimated natural aging time multiplied by the reciprocal of the aging strength coefficient. S1133. For each group of determined key temperature stress points and key humidity stress points, calculate the theoretical accelerated test time required to achieve the unit target equivalent aging time under each stress environment, and use it as the theoretical holding time of the stress point group. S1134. Obtain the thermal inertia of the equipment and the moisture absorption and release characteristics of the material during the adjacent stress switching process; S1135. Based on the theoretical holding time of each stress point, allocate it proportionally to the target equivalent aging time, and determine the maximum allowable safe transition rate between adjacent stress points based on the thermal inertia of the equipment and the moisture absorption and release characteristics of the material. S1136. Based on the key temperature stress points, key humidity stress points, the actual holding time of each stress point after proportional allocation adjustment, and the maximum safe conversion rate, construct an aging environment time series containing multiple sets of stress cycles.

[0091] First, extract all historical failure event records corresponding to the equipment model from the aging knowledge database. These records include at least the ambient temperature, humidity, and failure mode code at the time of failure. Historical failure event records refer to detailed accounts of equipment malfunctions or performance degradation caused by various environmental factors during actual operation or testing. These records are typically collected and stored by equipment manufacturers, maintenance service providers, or third-party testing organizations, and may include the equipment serial number, failure time, failure location, environmental parameters at the time of failure (such as temperature, humidity, vibration, etc.), a description of the failure phenomenon, and a preliminary analysis of the failure cause. These records are crucial for analyzing equipment reliability and identifying potential defects.

[0092] Next, a scatter distribution model of historical failure event records is established using temperature and humidity values ​​as two-dimensional coordinate axes. A joint probability density distribution surface of historical failure environments is then generated based on a kernel density estimation algorithm. The scatter distribution model, by representing the temperature and humidity values ​​in each historical failure event record as a point in a two-dimensional coordinate system, intuitively shows the distribution of failure events under different temperature and humidity combinations. The kernel density estimation algorithm is a non-parametric statistical method used to estimate the probability density function of random variables. Here, it is used to smooth the scatter distribution model. By assigning a kernel function (e.g., a Gaussian kernel) to each failure point and superimposing all kernel functions, a continuous joint probability density distribution surface is generated that reflects the probability of failure events occurring under different temperature and humidity combinations. This surface clearly reveals under which temperature and humidity conditions the probability of equipment failure is higher.

[0093] Subsequently, the first continuous region in the joint probability density distribution surface where the probability density value exceeds a preset threshold is identified. This first continuous region is then used as the typical failure environment stress range for the equipment model. The preset threshold is a pre-defined probability density value used to distinguish between high-failure-risk and low-failure-risk areas. This threshold can be determined based on historical data analysis, expert experience, or statistical methods (such as confidence intervals). The first continuous region refers to the area on the joint probability density distribution surface where all probability density values ​​are higher than the preset threshold and are interconnected. This region represents the temperature and humidity combination range where the equipment is most prone to failure in actual use, and is therefore defined as the typical failure environment stress range.

[0094] Based on this, boundary extreme points in the temperature dimension are extracted from the typical failure environment stress range as candidate critical temperature stress points, and boundary extreme points in the humidity dimension are extracted as candidate critical humidity stress points. Boundary extreme points refer to the maximum and minimum values ​​in the temperature or humidity dimension within the typical failure environment stress range. For example, if the typical failure environment stress range covers 40℃ to 80℃ in the temperature dimension, then 40℃ and 80℃ are the boundary extreme points in the temperature dimension. These extreme points represent the most extreme temperature and humidity conditions that the equipment may withstand under typical failure environments.

[0095] Then, candidate critical temperature stress points are paired with candidate critical humidity stress points, and the frequency of occurrence of the corresponding failure mode in the historical failure event records for each pair is calculated. Pairing involves cross-combining all candidate critical temperature stress points with all candidate critical humidity stress points to form a series of potential critical temperature and humidity stress combinations. For each combination, the number of times a specific failure mode occurs under that temperature and humidity combination is counted by querying historical failure event records, and its frequency in all failure events is calculated, thereby quantifying the tendency of that combination to induce failure.

[0096] The top N temperature and humidity combinations with the highest failure mode occurrence frequency are then selected and identified as the critical temperature and humidity stress points for inducing potential defects, respectively, where N is greater than or equal to two. By sorting the failure mode occurrence frequencies and selecting the top N temperature and humidity combinations, it is ensured that the selected critical stress points represent the environmental conditions most likely to cause equipment failure in reality. The setting of N being greater than or equal to two ensures that the aging test covers at least two major failure-inducing environments, thereby improving the comprehensiveness of the test.

[0097] After identifying the critical stress points, the estimated natural aging time required for the performance parameters of the fault diagnosis equipment to decay to a preset failure threshold under a normal temperature reference environment is calculated based on the performance degradation curve model. The performance degradation curve model describes the changes in equipment performance parameters over time, such as resistance drift and response time increase. This model can be obtained through long-term monitoring, accelerated life testing, or theoretical analysis. The preset failure threshold is the critical value at which the equipment performance parameters are considered to fail. The estimated natural aging time refers to the time required for the equipment performance to naturally decay to the failure threshold under normal operating conditions (such as room temperature and normal pressure), providing a benchmark for accelerated aging testing. Based on a preset aging intensity coefficient, the target equivalent aging time of the aging process is determined. This target equivalent aging time is equal to the estimated natural aging time multiplied by the reciprocal of the aging intensity coefficient. The preset aging intensity coefficient is a value greater than 1, representing the acceleration factor of accelerated aging testing relative to natural aging. For example, if the aging intensity coefficient is 100, it means that 1 hour of accelerated aging testing is equivalent to 100 hours of natural aging. The target equivalent aging time is the total equivalent natural aging time that accelerated aging tests need to achieve. This time ensures that accelerated aging tests can fully expose the potential defects of the equipment.

[0098] For each set of identified critical temperature and humidity stress points, the theoretical accelerated testing time required to achieve the equivalent aging time per unit target under each stress environment is calculated. This theoretical accelerated testing time is used as the theoretical retention time for that set of stress points. The theoretical accelerated testing time refers to the operating time required for the equipment to achieve the same effect as the equivalent aging time per unit target under a specific combination of critical temperature and humidity stresses. This calculation can be performed using reliability physical models such as the Arrhenius accelerated model (primarily for temperature stress) and the Peck humidity accelerated model (primarily for humidity stress). These models predict the equipment's lifespan under accelerated stress conditions by establishing a mathematical relationship between environmental stress and failure rate.

[0099] In addition, the thermal inertia of the equipment and the moisture absorption and release characteristics of the materials are obtained during adjacent stress switching processes. Equipment thermal inertia refers to the rate at which the equipment's temperature responds to changes in the external ambient temperature, and is affected by factors such as equipment mass, specific heat capacity, and thermal conductivity. Material moisture absorption and release characteristics refer to the rate and ability of the materials inside the equipment to absorb or release moisture when the ambient humidity changes. These characteristics are crucial for determining the safe rate during stress switching to avoid additional stress damage or reduced testing efficiency due to switching that is too fast or too slow.

[0100] Based on the theoretical holding time of each stress point, it is proportionally allocated to the target equivalent aging time. Furthermore, considering the equipment's thermal inertia and the material's moisture absorption and release characteristics, the maximum permissible safe transition rate between adjacent stress points is determined. Proportionally allocating the theoretical holding time ensures that each critical stress point contributes its due accelerated aging effect to the overall aging process. The maximum safe transition rate refers to the fastest rate at which temperature and humidity can change from one stress point to another without causing additional damage to the equipment or affecting the accuracy of test results. This requires comprehensive consideration of the equipment's physical characteristics to prevent thermal shock or moisture shock.

[0101] Finally, based on the key temperature stress points, key humidity stress points, the actual holding time of each stress point after proportional allocation adjustment, and the maximum safe transition rate, an aging environment time series containing multiple stress cycles is constructed, i.e., aging environment profile data. The aging environment time series is a detailed test plan that specifies how the aging chamber should precisely control temperature, humidity, and the transition rates and holding times between them throughout the aging process. This profile data serves as the direct execution instruction for the aging test, ensuring the scientific rigor, repeatability, and effectiveness of the aging process.

[0102] This embodiment systematically analyzes historical failure data to accurately identify key environmental stress points that induce potential defects in equipment. Combined with a reliability physical model and equipment characteristics, it scientifically generates representative and efficient aging environment profile data.

[0103] In one implementation of this embodiment, it is assumed that an aging test needs to be performed on the fault diagnosis equipment of the computing board. First, historical failure data related to the computing board is extracted from an aging knowledge database. This data records in detail the failure modes and frequencies of the computing board under different environmental stresses. Using this data, a scatter plot of failure events is drawn with temperature and humidity as coordinate axes, and a kernel density estimation algorithm is used to generate a two-dimensional joint probability density distribution surface. This surface visually displays the failure probability distribution of the fault diagnosis equipment of the computing board under different temperature and humidity combinations. By setting a preset threshold (e.g., a region where the failure probability density exceeds 0.05), continuous regions with high probability density on the surface are identified and determined as the typical failure environmental stress range of the fault diagnosis equipment. For example, this range may cover extreme conditions such as high temperature and high humidity (e.g., 80℃, 90%RH) and low temperature and low humidity (e.g., -40℃, 10%RH). From this range, boundary extreme points in the temperature dimension (e.g., 85℃ and -45℃) and the boundary extreme points in the humidity dimension (e.g., 95%RH and 5%RH) are extracted as candidate key stress points. These candidate points are combined and paired (e.g., 85℃ / 95%RH, -45℃ / 5%RH, 85℃ / 5%RH, -45℃ / 95%RH), and the frequency at which each combination induces a specific failure mode (such as capacitor failure, solder joint cracking) in historical records is calculated. The top three combinations with the highest frequencies are selected as the final critical temperature stress points and critical humidity stress points.

[0104] Next, based on the performance degradation curve model of the fault diagnosis equipment (e.g., the capacitance degradation model of its internal capacitors), the estimated natural aging time required for the performance of the fault diagnosis equipment to degrade to a preset failure threshold (e.g., a 20% decrease in capacitance) under normal temperature (25℃) conditions is calculated, assumed to be 10,000 hours. A preset aging strength coefficient of 100 is set, then the target equivalent aging time is 10,000 hours / 100 = 100 hours. For the three previously identified key stress points, the theoretical accelerated testing time required to reach 100 hours of equivalent aging under each stress environment is calculated using the Arrhenius model and the Peck model. For example, it may take 5 hours under 85℃ / 95%RH conditions, and 8 hours under -45℃ / 5%RH conditions. Simultaneously, the thermal inertia parameters (e.g., heating rate, cooling rate) and moisture absorption / desorption characteristics of the materials of the fault diagnosis equipment are obtained. Based on this data, the actual holding time for each stress point is allocated proportionally, and the maximum permissible safe transition rate between adjacent stress points is determined (e.g., temperature change rate not exceeding 10°C / minute, humidity change rate not exceeding 20%RH / hour). Finally, an aging environment time series containing multiple sets of stress cycles is constructed, for example: from room temperature to 85°C / 95%RH and held for 5 hours, then at a safe rate to -45°C / 5%RH and held for 8 hours, then at a safe rate to another critical stress point and held, and so on until a total of 100 hours of equivalent aging is completed.

[0105] The above technical solution enables refined management and optimization of the aging process of fault diagnosis equipment. Based on historical failure data, this method, through scientific statistical analysis and a reliability physical model, accurately identifies the key environmental stress points most likely to induce potential equipment defects and rationally plans the holding time and transition rate of each stress point. This not only improves the targeting and efficiency of aging tests, avoiding blind or excessive testing, but also ensures the representativeness and validity of aging test results. This allows for earlier and more accurate detection and elimination of potential faults in actual use, significantly improving the reliability of fault diagnosis equipment and product quality.

[0106] The present invention also proposes an aging control device, which includes: a memory, a processor, and an aging program for a fault diagnosis device stored in the memory and executable on the processor. The aging program for the fault diagnosis device is configured to implement the aging method of the fault diagnosis device as described above.

[0107] It is worth noting that since the aging control device of the present invention is based on the aging method of the above-mentioned fault diagnosis equipment, the embodiments of the aging control device of the present invention include all the technical solutions of all embodiments of the aging method of the above-mentioned fault diagnosis equipment, and the technical effects achieved are exactly the same, which will not be repeated here.

[0108] The present invention also proposes an aging system, which includes an aging chamber, a fault diagnosis device, a device under test, and an aging control device as described in the above embodiments, wherein: An aging chamber is used to house the fault diagnosis equipment to be aged. The aging chamber has a first through hole. The device under test (DUT) is located outside the aging chamber and is electrically connected to the fault diagnosis equipment through the first through hole. An aging control device is used to control the aging chamber to operate according to preset environmental data, so that the fault diagnosis equipment runs in the aging chamber for a preset working time. After the aging chamber has run for the preset time, the temperature of the fault diagnosis equipment is allowed to drop to room temperature. When the fault diagnosis equipment is at room temperature, the fault diagnosis equipment and the DUT are connected to determine the operating status of the fault diagnosis equipment. If the operating status is normal, the fault diagnosis equipment is put back into the aging chamber for the next round of aging treatment until the preset number of aging cycles is completed.

[0109] The aging chamber is a device capable of simulating specific environmental conditions (such as temperature and humidity) for accelerated aging tests on electronic products and components to evaluate their performance and reliability under extreme environments. The aging chamber can be a sealed cavity with precise temperature and humidity control, and a circulating fan, with sufficient internal space to accommodate the fault diagnosis equipment to be aged. Alternatively, the aging chamber can be a test chamber with rapid heating and cooling capabilities, programmable environmental parameter settings, and data recording functions, capable of automatically adjusting the internal environment according to a preset aging curve. The first through-hole refers to one or more through holes provided on the wall of the aging chamber. Its main function is to allow cables, signal lines, or other connectors to pass through, thereby enabling electrical connections or signal transmission between devices inside and outside the chamber without compromising the airtightness of the internal environment. The first through-hole can be a circular hole with a sealing ring or plug, ensuring the stability of the internal environment of the chamber through compression or tightening. Alternatively, the first through-hole can also be an opening equipped with a dedicated cable guide or multi-pin connector interface, which provides good airtightness and insulation while facilitating cable insertion and removal. The device under test (DUT) refers to an external device that interacts with the fault diagnosis equipment to verify its operational status. In aging test scenarios, the DUT typically simulates the working object of the fault diagnosis equipment in practical applications, thereby triggering the equipment's functions and acquiring its test data. The DUT can be a load module simulating a real-world application scenario, such as a computing board for a blockchain server, or a signal generator simulating an industrial sensor. Alternatively, the DUT can be a test object with specific fault modes, used to verify the diagnostic capabilities of the fault diagnosis equipment under different fault conditions. The aging control device is the core of the entire aging system, responsible for coordinating and managing all aspects of the aging process, including setting and adjusting environmental parameters, controlling the operation of the fault diagnosis equipment, monitoring its status, and processing data. This device achieves automated control of the aging chamber and fault diagnosis equipment through software programs and hardware interfaces. The aging control device can be an automated control system built on an industrial PC or embedded controller, running dedicated aging test management software and communicating with the aging chamber and fault diagnosis equipment through standard communication interfaces (such as RS485 and Ethernet). Alternatively, the aging control device can also be a control cabinet that integrates a programmable logic controller (PLC) and a human-machine interface (HMI), which can achieve precise control and real-time monitoring of the aging process through preset program logic.

[0110] It is worth noting that since the aging system of the present invention is based on the above-mentioned aging control device, the embodiments of the aging system of the present invention include all the technical solutions of all the embodiments of the above-mentioned aging control device, and the technical effects achieved are exactly the same, which will not be repeated here.

[0111] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. An aging method of a failure diagnostic device, characterized by, The aging method comprises: controlling an aging oven to work according to preset environment data, so that the fault diagnosis equipment runs in the aging oven for a preset working duration; after the fault diagnosis equipment runs in the aging oven for a preset duration, waiting for the temperature of the fault diagnosis equipment to decrease to room temperature; in the case that the fault diagnosis equipment is in a room temperature state, connecting the fault diagnosis equipment with a device to be tested, to determine the running state of the fault diagnosis equipment; if the running state is normal, putting the fault diagnosis equipment into the aging oven again for next round of aging treatment, until a preset round of aging process is completed.

2. The burn-in method of a failure diagnostic device according to claim 1, wherein The method comprises: in the case that the fault diagnosis equipment is in a room temperature state, controlling a remote management background to establish a communication connection with the fault diagnosis equipment; controlling the fault diagnosis equipment to start a detection program for the device to be tested through the remote management background, to obtain detection data of the device to be tested, and to generate a diagnosis report corresponding to the detection data; determining a running state corresponding to the diagnosis report.

3. The burn-in method of a failure diagnostic device according to claim 1, wherein The method comprises: in the case that the fault diagnosis equipment is in a room temperature state, taking the fault diagnosis equipment out of the aging oven, and electrically connecting the fault diagnosis equipment with the device to be tested according to test requirements; controlling the fault diagnosis equipment to start a detection program for the device to be tested, to obtain detection data of the device to be tested, and to generate a diagnosis report corresponding to the detection data; determining a running state corresponding to the diagnosis report.

4. The burn-in method of a failure diagnostic device according to claim 1, wherein The preset environment data is at least three different temperature values; The method comprises: controlling the aging oven to be adjusted to a first temperature value, and controlling the fault diagnosis equipment to run at the first temperature value for a first preset duration; The method comprises: if the running state is normal, controlling the aging oven to be adjusted to a second temperature value and a third temperature value in sequence, and controlling the fault diagnosis equipment to run at the corresponding second temperature value and third temperature value for a second preset duration and a third preset duration respectively, until a plurality of rounds of aging process in temperature environment are completed.

5. The burn-in method of a failure diagnostic device according to claim 1, wherein The preset environment data comprises a first temperature higher than zero degrees and a second temperature lower than zero degrees; The method comprises: controlling the aging oven to be adjusted from room temperature to the first temperature, and controlling the fault diagnosis equipment to run at the first temperature for a first preset duration; After the first preset time length ends, the aging oven is controlled to linearly adjust from the first temperature to the second temperature, and after reaching the second temperature, the fault diagnosis equipment is controlled to run at the second temperature for a second preset time length; After the second preset time length ends, the aging oven is controlled to adjust from the second temperature to room temperature; In the case that the fault diagnosis equipment is in a room temperature state, the fault diagnosis equipment is connected with the to-be-tested equipment to determine the running state of the fault diagnosis equipment, including: In the case that the fault diagnosis equipment is in a room temperature state, the fault diagnosis equipment is connected with the to-be-tested equipment, the fault diagnosis equipment is controlled to run a detection program, and detection data of the fault diagnosis equipment is collected; The detection data is compared with preset detection data to generate a corresponding comparison result; If the comparison result is consistent, it is determined that the running state of the fault diagnosis equipment is normal; If the comparison result is inconsistent, it is determined that the running state of the fault diagnosis equipment is abnormal.

6. The burn-in method of a failure diagnostic device according to claim 5, wherein The preset environmental data further includes a first humidity and a second humidity, and the first humidity is greater than the second humidity; The aging oven is controlled to work according to the preset environmental data, so that the fault diagnosis equipment runs in the aging oven for a preset working time length, including: The aging oven is controlled to adjust the humidity in the aging oven to the first humidity while adjusting to the first temperature; The fault diagnosis equipment is controlled to continuously run for a first preset time length in a combined environment of the first temperature and the first humidity; After the first preset time length ends, the aging oven is controlled to linearly adjust the temperature from the first temperature to the second temperature, and adjust the humidity from the first humidity to the second humidity; When the temperature and humidity both reach the second temperature and the second humidity, the fault diagnosis equipment is controlled to continuously run for a second preset time length in a combined environment of the second temperature and the second humidity; After the second preset time length ends, the aging oven is controlled to adjust the temperature from the second temperature to room temperature, and adjust the humidity from the second humidity to the natural humidity under the condition of room temperature.

7. The burn-in method of a failure diagnostic device according to Claim 1, wherein The aging oven is controlled to work according to the preset environmental data, specifically: An equipment model identification code and production batch information of the fault diagnosis equipment to be aged are acquired; Based on the equipment model identification code and the production batch information, historical failure environmental distribution data and a performance attenuation curve model related to the equipment model in an aging knowledge database are acquired; According to the historical failure environmental distribution data, key temperature stress points and key humidity stress points that induce potential defects of the equipment corresponding to the equipment model are determined; According to the performance attenuation curve model and a preset aging intensity coefficient, aging environmental profile data with the key temperature stress points, the key humidity stress points, the time length of each stress point, and the stress conversion rate are generated; The aging oven is controlled to run according to the aging environmental profile data.

8. The burn-in method of a failure diagnostic device according to claim 1, wherein According to the historical failure environmental distribution data, key temperature stress points and key humidity stress points that induce potential defects of the equipment corresponding to the equipment model are determined, including: extracting all historical failure event records corresponding to the device model from the aging knowledge database, the historical failure event records at least containing environmental temperature values, environmental humidity values and failure mode codes corresponding to the time of failure occurrence; establishing a scatter plot distribution model of the historical failure event records with temperature values and humidity values as two-dimensional coordinate axes, and generating a historical failure environmental joint probability density distribution surface based on a kernel density estimation algorithm; identifying a first continuous region with a probability density value exceeding a preset threshold value in the joint probability density distribution surface, and taking the first continuous region as a typical failure environmental stress interval of the device model; extracting boundary extreme points of the temperature dimension in the typical failure environmental stress interval as candidate key temperature stress points, and extracting boundary extreme points of the humidity dimension as candidate key humidity stress points; combining and pairing the candidate key temperature stress points and the candidate key humidity stress points, and calculating the failure mode occurrence frequency corresponding to each combination in the historical failure event records; screening out the top N temperature and humidity combinations with the highest failure mode occurrence frequency, and determining the key temperature stress points and the key humidity stress points used for inducing potential defects as the final key temperature stress points and the final key humidity stress points, where N is greater than or equal to two; generating aging environmental profile data with key temperature stress points, key humidity stress points, the duration of each stress point and the stress transition rate based on the performance degradation curve model and a preset aging intensity coefficient, including: calculating the estimated natural aging duration required for the performance parameter of the fault diagnosis device to degrade to a preset failure threshold under a normal temperature reference environment based on the performance degradation curve model; determining a target equivalent aging duration of the aging process according to the preset aging intensity coefficient, where the target equivalent aging duration is equal to the product of the estimated natural aging duration and the inverse of the aging intensity coefficient; calculating the theoretical acceleration test duration required to reach a unit target equivalent aging duration under each group of stress environment as the theoretical duration of each group of stress points, for each group of determined key temperature stress points and key humidity stress points; obtaining the device thermal inertia and material moisture absorption and desorption characteristics in the adjacent stress switching process; allocating the theoretical duration of each group of stress points to the target equivalent aging duration in proportion according to the theoretical duration of each group of stress points, and determining the maximum safe transition rate allowed between adjacent stress points according to the device thermal inertia and the material moisture absorption and desorption characteristics; constructing an aging environmental time sequence containing multiple stress cycles according to the key temperature stress points, the key humidity stress points, the actual duration of each stress point after proportional allocation adjustment, and the maximum safe transition rate.

9. An aging control device characterized by comprising: The aging control device includes a memory, a processor, and an aging program of a fault diagnosis device stored on the memory and executable on the processor, and the aging program of the fault diagnosis device is configured to implement the aging method of the fault diagnosis device according to any one of claims 1 to 8.

10. An aging system, characterized by, The aging system includes: An aging oven for placing a fault diagnosis device to be aged, the aging oven being provided with a first through hole; A device to be tested, the device to be tested being arranged outside the aging oven, and the device to be tested being electrically connected with the fault diagnosis device through the first through hole; and The aging control device of claim 9, wherein the aging control device is configured to control the aging oven to work according to preset environmental data, so that the fault diagnosis device runs in the aging oven for a preset working time length, and after the aging oven runs for the preset time length, the temperature of the fault diagnosis device is reduced to room temperature, and under the condition that the fault diagnosis device is at room temperature, the fault diagnosis device is connected with the device to be tested to determine the running state of the fault diagnosis device, if the running state is normal, the fault diagnosis device is placed into the aging oven again for the next round of aging treatment, until the preset number of rounds of aging process is completed.

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