Chip aging test equipment

Abstract

The invention relates to the technical field of chip testing, in particular to chip aging testing equipment, which comprises a detection box and a hot air testing assembly, the hot air testing assembly comprises a hot air piece mounted at the top of the detection box, a plurality of chips are placed on each detection table at equal intervals, and an adjusting piece for adjusting the wind direction is arranged on one side of a carrier; the detection assembly is used for detecting the power-on state of the chip and preventing the chip from absorbing heat when the chip breaks down and comprises a heat conduction plate pressed above the chip, when the chip breaks down, the heat conduction plate bounces, the chip is disconnected with the detection table, a heat insulation piece is arranged on one side of the chip, and when the heat conduction plate bounces, the heat insulation piece prevents hot air from making contact with the chip. The chips are placed on the carrier, the hot air parallel to the surface of the carrier is used for heating, the heating temperature difference of the chips is small, in addition, the detection assembly is arranged on the chips, the heat conduction plate is removed in time when the chips have high-temperature faults, the heat source is blocked by the heat insulation plate, the heating effect is removed in time, and the safety of the detection process is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and more specifically to a chip aging test device. Background Technology

[0002] The development of modern communication equipment technology relies on the design and manufacturing of semiconductor products. As the core component for data processing in communication equipment, chips have high precision. After running for a long time, chips are prone to heat generation. High-precision chips are prone to problems such as lag in high-temperature environments, which can affect the overall working efficiency of the equipment. Therefore, it is necessary to conduct performance tests on chips under high-temperature environments before putting them into use.

[0003] Existing chip aging tests typically involve heating the chip, usually by placing it in an oven. This method limits the number of chips that can be tested due to the fixed location of the heat source, and the significant temperature differences between different locations during testing result in low accuracy. Furthermore, prolonged exposure to high temperatures can cause chip malfunctions, such as short circuits or burnout. In such cases, to protect other components, the chip needs to be disconnected from the test circuit promptly. Current methods generally involve manual disconnection, which is inefficient. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a chip aging test device that can effectively solve the problems of the heating test being affected by the number of chips and the temperature imbalance in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a chip aging test device, including a test chamber, and further comprising: A hot air testing assembly includes a hot air unit installed on the top of a testing chamber. The testing chamber is equipped with a rack, on which multiple testing platforms are provided. Multiple chips are placed equidistantly on each testing platform. An adjustment component for adjusting the airflow direction is provided on one side of the rack, so that the hot airflow direction is parallel to the top surface of the chips. The detection component is used to detect the power-on status of the chip and prevent it from absorbing heat when the chip fails. It includes a heat-conducting plate pressed on top of the chip. When the chip fails, the heat-conducting plate pops up, and the chip is disconnected from the detection station. A heat insulation component is provided on one side of the chip. When the heat-conducting plate pops up, the heat insulation component prevents hot air from contacting the chip.

[0006] Furthermore, the carrier is provided with multiple testing stations, and two limiting frames are symmetrically and elastically installed on the side of each testing station. The chip is positioned directly above the testing station by the two limiting frames.

[0007] Furthermore, the hot air component includes a turbine installed on the top wall inside the testing chamber, a drive motor for driving the turbine to rotate is provided on the top of the testing chamber, and an air inlet is provided on the top of the testing chamber.

[0008] Furthermore, the hot air assembly also includes a heating wire installed directly below the turbine, a right-angle partition is provided between the heating wire and the carrier, and a centrifugal fan is also provided on the top wall of the detection box. The air inlet of the centrifugal fan is connected to an air outlet pipe, and the air inlet and the centrifugal fan are separated by the right-angle partition.

[0009] Furthermore, the adjusting component includes an air direction adjusting plate installed on the top wall of the testing box, and the testing box is also equipped with an adjusting motor for driving the air direction adjusting plate to rotate. The side of the carrying rack away from the centrifugal fan is provided with a flow divider, and the flow divider has multiple flow guides. Each flow guide is slidably mounted with a support frame, and the support frame is provided with a honeycomb flow guide plate. Each honeycomb flow guide plate is composed of two straight plates, and the included angle between the two straight plates is 120 degrees to 150 degrees.

[0010] Furthermore, a flow guide plate is movably installed between the bottom wall and the side wall of the testing chamber. The flow guide plate directs hot air to multiple honeycomb flow guide plates. The angle between the flow guide plate and the bottom wall of the testing chamber is 100-110 degrees. The distance between the honeycomb flow guide plate and the flow guide plate gradually decreases from top to bottom. An adjuster for driving the flow guide plate to slide is provided on the inner wall of the testing chamber.

[0011] Furthermore, the rack is equipped with multiple temperature sensors on the side near the centrifugal fan, and the temperature sensors are distributed at equal distances from top to bottom.

[0012] Furthermore, the testing assembly includes a sliding frame located directly above the testing platform. The bottom wall of the sliding frame is provided with multiple testing boxes, and the number of testing boxes is the same as the number of testing stations. The heat-conducting plate is slidably installed in the testing boxes. Each testing station has a connector on its side wall. The bottom wall of the testing box is provided with a connector that is electrically connected to the connector. When the connector and the connector are connected, the heat-conducting plate moves downward.

[0013] Furthermore, the heat-conducting plate is provided with a slider, the inner wall of the detection box is provided with a groove adapted to the slider, and a return spring is provided between the top wall of the slider and the groove. Electromagnets are provided on the slider and the bottom wall of the groove. When the connector and the joint are connected, the two electromagnets attract each other.

[0014] Furthermore, the heat insulation component includes a vertical plate elastically mounted on the outer wall of the detection box, an adjusting plate fixedly mounted on the bottom wall of the vertical plate, a transmission plate fixedly mounted on the top wall of the vertical plate, and both the adjusting plate and the transmission plate movably penetrate the side wall of the detection box. A heat insulation plate is rotatably mounted on the inner wall of the detection box. A transmission groove is formed on the transmission plate, and a wedge block is provided in the transmission groove. A pressing plate is provided on the heat-conducting plate. When the heat-conducting plate moves upward, it drives the vertical plate closer to the detection box by pressing the wedge block.

[0015] Furthermore, a pressure relief valve is provided on the top wall of the testing box.

[0016] Furthermore, the testing box is provided with a door on the outside, and a reinforcing plate is elastically installed on the inner wall of the door. When the door is closed, the reinforcing plate presses against the shelf. The testing box is provided with a control panel on the outside.

[0017] The technical solution provided by this invention has the following advantages compared with the known prior art: By placing the chips on a carrier and heating them with hot air parallel to their surface, the temperature difference between the chips is minimized, improving detection accuracy. Matching adjustment measures are set up to achieve temperature control. In addition, a detection component is set on the chip. In case of chip high temperature failure, the heat-conducting plate is removed in time, and the heat source is blocked by the heat insulation plate to eliminate the heating effect in time and ensure the safety of the detection process. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0019] Figure 1 This is an overall schematic diagram of the present invention; Figure 2 This is a front view of the internal structure of the present invention; Figure 3 This is a top view of the present invention; Figure 4 This is a structural diagram of the auxiliary testing frame. Figure 5 This is a structural diagram of the detection box section; Figure 6 This is a structural schematic diagram of the heat insulation panel. Figure 7 This is a diagram showing the movement of the insulation panel.

[0020] The labels in the diagram represent: 1. Drive motor; 2. Turbine; 3. Airflow adjustment plate; 4. Heating wire; 5. Airflow guide plate; 6. Honeycomb airflow guide plate; 7. Support frame; 8. Detection box; 9. Temperature sensor; 10. Air outlet pipe; 11. Carrier rack; 12. Centrifugal fan; 13. Air inlet; 14. Pressure relief valve; 15. Control panel; 16. Box door; 17. Detection platform; 18. Chip; 19. Connector; 20. Detection box; 21. Heat conduction plate; 22. Heat insulation plate; 23. Adjustment groove; 24. Vertical plate; 25. Adjustment plate; 26. Transmission plate; 27. Transmission groove; 28. Wedge block; 29. ​​Extrusion plate; 30. Regulator. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0022] The present invention will be further described below with reference to embodiments.

[0023] Example 1: refer to Figure 1 A chip aging test device includes a test chamber 8 with a pressure relief valve 14 on its top wall. It also includes a hot air test assembly, comprising a hot air component mounted on the top of the test chamber 8. The hot air component includes a turbine 2 (300mm in size) mounted on the inner top wall of the test chamber 8. A drive motor 1, a 380V high-temperature resistant turbine motor, is mounted on the top of the test chamber 8. An air inlet 13 (with an air inlet valve) is located on the top of the test chamber 8. The hot air assembly also includes a heating wire 4 (4kW in power) mounted directly below the turbine 2. A right-angle partition is provided between the heating wire 4 and the support frame 11. A centrifugal fan 1 is also mounted on the top wall of the test chamber 8. 2. The air inlet of the centrifugal fan 12 is connected to the air outlet pipe 10. The air inlet 13 and the centrifugal fan 12 are separated by a right-angle partition. The test box 8 is equipped with a rack 11. The test box 8 is equipped with a door 16 on the outside. A reinforcing plate is elastically installed on the inner wall of the door 16. When the door 16 is closed, the reinforcing plate presses against the rack 11. The test box 8 is equipped with a control panel 15 on the outside. Multiple test platforms 17 are provided on the rack 11. Multiple chips 18 are placed equidistantly on each test platform 17. Multiple test stations are provided on each test platform 17. Two limiting frames are symmetrically and elastically installed on the side of each test station. The two limiting frames are used to position the chip 18 so that it is directly above the test station (e.g., ...). Figure 4As shown, located below the detection box 20, the shelf 11 has an adjustment component on one side for adjusting the airflow direction. The adjustment component makes the hot airflow direction parallel to the top surface of the chip 18. The adjustment component includes an airflow adjustment plate 3 installed on the top wall inside the detection box 8. The detection box 8 is also equipped with an adjustment motor for driving the airflow adjustment plate 3 to rotate. The shelf 11 has a flow divider on the side away from the centrifugal fan 12. The flow divider has multiple flow guides. Each flow guide is slidably mounted on a support frame 7. The support frame 7 has a honeycomb flow guide plate 6. Each honeycomb flow guide plate 6 consists of two straight plates, and the included angle between the two straight plates is 120 degrees to 150 degrees.

[0024] A flow guide plate 5 is movably installed between the bottom wall and the side wall of the testing box 8. The flow guide plate 5 directs hot air to multiple honeycomb guide plates 6. The angle between the flow guide plate 5 and the inner bottom wall of the testing box 8 is 100-110 degrees. The distance between the honeycomb guide plates 6 and the flow guide plate 5 gradually decreases from top to bottom. An adjuster 30 is provided on the inner wall of the testing box 8 to drive the flow guide plate 5 to slide. Multiple temperature sensors 9 are provided on the side of the rack 11 near the centrifugal fan 12. The temperature sensors 9 are evenly distributed from top to bottom.

[0025] like Figure 2 As shown, hot air is input into the detection chamber 8 through the turbine 2 and heating wire 4, and guided to each honeycomb guide plate 6 by the deflector plate 5, so that the hot air is guided to a horizontal state and directed to each layer of the shelf 11. It is worth noting that the angle between the deflector plate 5 and the bottom wall of the detection chamber 8 is 100 degrees-110 degrees. Because the temperature gradually decreases with distance, it is necessary to reduce the ventilation area at the bottom, so as to increase the wind speed and further reduce the temperature difference. The temperature sensor 9 provides real-time feedback, and the angle of the deflector plate 5 is adjusted by the regulator 30 according to the temperature difference.

[0026] The equipment performs high-temperature aging tests on chips up to 10W using air cooling mode. The test range is from 10℃ above room temperature to 150℃. When the equipment is unloaded, the temperature uniformity is within 1℃ of the maximum and minimum values, with a uniformity of ±0.5℃. Under load, it can achieve a chip uniformity of ±2℃, which is higher than the performance of chip aging test equipment currently on the market.

[0027] When the equipment needs to heat up, the air inlet valve and exhaust inverter fan will not open. When the equipment reaches a temperature 1°C before the target temperature, the exhaust inverter fan will turn on and adjust the airflow using an internal temperature control algorithm (existing technology will not be elaborated here) to regulate the internal temperature uniformity. When the equipment needs to cool down, the air inlet and outlet vents will open simultaneously, and the exhaust inverter fan will run at full speed to cool the equipment.

[0028] Example 2: refer to Figure 4The detection assembly, used to detect the power-on status of the chip and prevent it from absorbing heat when the chip fails, includes a heat-conducting plate 21 pressing on top of the chip 18. When the chip 18 fails, the heat-conducting plate pops up, disconnecting the chip 18 from the detection platform 17. A heat insulation component is provided on one side of the chip 18. When the heat-conducting plate 21 pops up, the heat insulation component prevents hot air from contacting the chip 18. The detection assembly includes a sliding frame located directly above the detection platform 17, with multiple detection boxes 20 provided on the bottom wall of the sliding frame, such as... Figure 4 As shown, the detection boxes 20 in the same row are connected end to end, so that the honeycomb guide plate 6 can guide the air into the detection box 20 located on one side. The interior of the detection box 20 is relatively smooth, which also has the function of guiding the airflow. The number of detection boxes 20 is the same as the number of detection stations. A heat-conducting plate 21 is slidably installed in the detection box 20. Each detection station has a connector 19 on its side wall. The bottom wall of the detection box 20 has a connector that is electrically connected to the connector 19. When the connector 19 and the connector are connected, the heat-conducting plate 21 moves down. A slider is provided on the heat-conducting plate 21. A groove adapted to the slider is opened on the inner wall of the detection box 20, and a return spring is provided between the top wall of the slider and the groove. Electromagnets are provided on the slider and the bottom wall of the slide groove. When the connector 19 and the joint are connected, the two electromagnets attract each other. A vertical plate 24 is elastically installed on the outer wall of the detection box 20. An adjusting plate 25 is fixedly installed on the bottom wall of the vertical plate 24. A transmission plate 26 is fixedly installed on the top wall of the vertical plate 24. Both the adjusting plate 25 and the transmission plate 26 can move through the side wall of the detection box 20. A heat insulation plate 22 is rotatably installed on the inner wall of the detection box 20. A transmission groove 27 is opened on the transmission plate 26. A wedge block 28 is provided in the transmission groove 27. A pressing plate 29 is provided on the heat-conducting plate 21. When the heat-conducting plate 21 moves upward, it drives the vertical plate 24 to approach the detection box 20 by pressing the wedge block 28.

[0029] After chip 18 is placed, the sliding frame is lowered. The sliding motion can be achieved using an electric push rod, etc. After lowering, multiple detection boxes 20 cover the chip 18 below, ensuring full contact between the connector and the joint 19. During equipment operation, the electromagnets on the inner wall of the slide and those connected to the heat-conducting plate 21 are activated. Under magnetic attraction, the heat-conducting plate 21 moves downwards and presses down on the chip 18. It is important to note that chip 18 only connects to the detection port below when compressed, as it is supported by the elasticity of the limiting frame and will not directly contact the detection port. After pressing, testing begins. An external program can monitor the chip's aging status in real time and observe its various data. If the chip burns out or other problems occur after prolonged high-temperature aging testing, or if a malfunction or other situation arises, the two electromagnets are immediately de-energized. Under the elastic force of the reset spring, the slider quickly moves upwards, and the heat-conducting plate 21 quickly moves upwards. Figure 7As shown, when the heat-conducting plate 21 moves upward, it will press the wedge block 28 above through the pressing plate 29, driving the vertical plate 24 to approach the detection box 20, thereby driving the adjusting plate 25 to push the heat insulation plate 22 to rotate (a coil spring is provided at the rotating connection to help reset). An adjusting groove 23 is opened on the heat insulation plate 22, with the same depth as the thickness of the adjusting plate 25. In this way, the adjusting plate 25 can be located in the adjusting groove 23 of the rotated heat insulation plate 22, which can not only insulate heat, but also prevent the heat insulation plate 22 from pressing the chip 18 below. When the chip 18 is disconnected, the heat insulation plate 22 blocks the heat, improving the safety of the detection.

[0030] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip burn-in test apparatus comprising a test box, characterized by, Also include: Hot air test assembly, including hot air parts installed on the top of the detection box, the detection box is provided with a carrier, the carrier is provided with a plurality of detection tables, each detection table is provided with a plurality of chips, the carrier is provided with an adjusting part for adjusting the direction of the wind, the adjusting part is parallel to the top surface of the chip. The detection assembly is used to detect the power state of the chip and prevent the chip from absorbing heat when the chip fails. The heat conduction plate is placed above the chip. When the chip fails, the heat conduction plate is lifted, the chip is disconnected from the detection table, and the chip is provided with a heat insulation part. When the heat conduction plate is lifted, the heat insulation part blocks the contact between the hot air and the chip.

2. The chip burn-in test apparatus of claim 1, wherein The carrier is provided with a plurality of detection stations, and two limiting frames are symmetrically and elastically installed on the side of each detection station. The two limiting frames are used to position the chip above the detection station.

3. The chip burn-in test apparatus of claim 1, wherein The hot air part includes a turbine installed on the inner top wall of the detection box, and the top of the detection box is provided with a driving motor for driving the turbine to rotate. The top of the detection box is provided with an air inlet.

4. The chip burn-in test apparatus of claim 3, wherein The hot air assembly further comprises a heating wire installed below the turbine, a right-angle partition plate is arranged between the heating wire and the carrier, and a centrifugal fan is further arranged on the top wall of the detection box. The air outlet tube is connected to the air inlet end of the centrifugal fan. The air inlet and the centrifugal fan are separated by the right-angle partition plate.

5. The chip burn-in test apparatus of claim 4, wherein The adjusting part includes a wind direction adjusting plate installed on the inner top wall of the detection box, and the detection box is further provided with an adjusting motor for driving the wind direction adjusting plate to rotate. The carrier is provided with a flow distribution frame on the side away from the centrifugal fan. A plurality of guide openings are formed in the flow distribution frame, and a support frame is slidably installed in each guide opening. The support frame is provided with a honeycomb guide plate. Each honeycomb guide plate is composed of two straight plates, and the included angle between the two straight plates is 120-150 degrees.

6. The chip burn-in test apparatus of claim 5, wherein The drainage plate is movably installed between the bottom wall and the side wall of the detection box. The hot air is guided to the plurality of honeycomb guide plates by the drainage plate. The included angle between the drainage plate and the inner bottom wall of the detection box is 100-110 degrees. The distance between the honeycomb guide plates and the drainage plate gradually decreases from top to bottom. The inner wall of the detection box is provided with an adjuster for driving the drainage plate to slide.

7. The chip burn-in test apparatus of claim 6, wherein The carrier is provided with a plurality of temperature sensors on the side close to the centrifugal fan, and the temperature sensors are equally distributed from top to bottom.

8. The chip burn-in test apparatus of claim 2, wherein The detection assembly includes a sliding frame above the detection table. The bottom wall of the sliding frame is provided with a plurality of detection boxes, and the number of detection boxes is the same as the number of detection stations. The heat conduction plate is slidably installed in the detection box. Each side wall of the detection station is provided with a connector. The bottom wall of the detection box is provided with a connector electrically connected to the connector. When the connector and the connector are connected, the heat conduction plate moves downward.

9. The chip burn-in test apparatus of claim 8, wherein The heat conduction plate is provided with a sliding block, and the inner wall of the detection box is provided with a sliding groove matched with the sliding block. The top wall between the sliding block and the sliding groove is provided with a reset spring. The sliding block and the sliding groove are provided with electromagnets. When the connector and the connector are connected, the two electromagnets are attracted.

10. The chip burn-in test apparatus of claim 9, wherein The heat insulation piece comprises a vertical plate elastically mounted on the outer wall of the detection box, a regulating plate fixedly mounted on the bottom wall of the vertical plate, a transmission plate fixedly mounted on the top wall of the vertical plate, and the regulating plate and the transmission plate both movably penetrating the side wall of the detection box, a heat insulation plate rotatably mounted on the inner wall of the detection box, a transmission groove formed in the transmission plate, a wedge-shaped block arranged in the transmission groove, and an extrusion plate arranged on the heat conduction plate, wherein the vertical plate is driven to approach the detection box by extruding the wedge-shaped block when the heat conduction plate moves.

11. The apparatus of claim 1, wherein The detection box is provided with a pressure relief valve on the top wall.

12. The apparatus of claim 1, wherein The detection box is provided with a box door outside, a reinforcing plate elastically mounted on the inner wall of the box door, the reinforcing plate extruding the object support when the box door is closed, and a control panel arranged outside the detection box.

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