Method and system for correcting light source position of laser direct writing equipment and related equipment

Abstract

The embodiment of the invention provides a light source position correction method and system for laser direct writing equipment and related equipment, which are used for saving the production cost and improving the correction precision of the laser direct writing equipment. The method provided by the embodiment of the invention comprises the following steps: arranging a plurality of groups of binary images to be ranked in the horizontal direction to form an image sequence, and carrying out binarization processing on the image sequence to obtain a position sequence Pref of a laser mark point; writing the image sequence on an optical calibration plate made of a chalcogenide phase change film material by adopting the laser array, wherein the mounting position of the optical calibration plate is relatively fixed with the working space of laser direct writing equipment; acquiring an actual position sequence Pm of the laser mark point on the optical calibration plate; and according to a formula Pm = M * Pref + T, calculating a horizontal-direction step error Sx, a vertical-direction step error Sy and an installation deviation angle theta.

Description

Technical Field

[0001] This invention relates to the field of laser imaging technology, and in particular to a method, system and related equipment for correcting the position of a laser direct writing device. Background Technology

[0002] Modern laser direct writing imaging equipment may experience slight errors (at the micrometer level) in the position of the laser source after vibration or long-term operation. To maintain imaging accuracy, the position of the light source of the laser direct writing imaging equipment needs to be recalibrated.

[0003] In related technologies, recalibrating the light source position of a laser direct-write imaging device requires exposing and developing the production sample (a substrate coated with photoresist) on the production line, measuring the image position, and then calculating the deviation based on the measured value (e.g., the technical solution in publication number CN119668036A).

[0004] In related technologies, the disassembly and reassembly of samples (in new measurement systems) inevitably introduces micron-level mechanical measurement errors, disrupting the original coordinate system reference and making it difficult to achieve calibration accuracy at the sub-micron level. Furthermore, the photoresist consumables used in sample production are irreversible and costly, and the development process involves wet chemical treatment, making the entire process cumbersome and unable to achieve a rapid closed-loop calibration process. Summary of the Invention

[0005] This invention provides a method, system, and related equipment for correcting the position of a laser direct writing device, which can save production costs and improve the correction accuracy and production efficiency of the laser direct writing device.

[0006] The first aspect of this invention provides a method for correcting the position of a light source in a laser direct writing device, which may include:

[0007] Multiple sets of binary images are arranged horizontally to form an image sequence, and the image sequence is binarized to obtain the position sequence P of the laser marker points. ref ;

[0008] The image sequence is written onto an optical calibration plate made of chalcogenide phase change thin film material using the laser array, and the mounting position of the optical calibration plate is relatively fixed relative to the working space of the laser direct writing device;

[0009] Obtain the actual position sequence P of the laser markers on the optical calibration plate. m ;

[0010] According to formula P m =M*P ref +T, calculate the horizontal step error S x Vertical step error S yand installation deviation angle θ; where T is a second-order constant matrix.

[0011] Optionally, as a possible implementation, in this embodiment of the invention, the optical calibration plate further includes an interference enhancement medium layer, which is composed of a ZnS-SiO2 solid film.

[0012] Optionally, as a possible implementation, in this embodiment of the invention, writing the image sequence onto an optical calibration plate made of a chalcogenide phase change thin film material using the laser array may include:

[0013] After the laser-irradiated region of the phase transition layer is excited by the first characteristic pulse modulated by the laser array, a phase transition occurs and the layer is rapidly cooled, generating a preset mark in an amorphous state to form the image sequence.

[0014] Optionally, as a possible implementation, in this embodiment of the invention, the actual position sequence P of the laser marker points on the optical calibration plate is obtained. m It may include:

[0015] The second characteristic pulse of the laser array is modulated and then passes through the interference enhancement medium layer to reduce interference. The resulting image is then captured and reflected in the semiconductor image sensor camera to form the preset mark.

[0016] The pixel-level geometric centroid of each laser marker point in the observed image was extracted using a Gaussian surface fitting algorithm, resulting in the measured coordinate matrix P. m .

[0017] Optionally, as a possible implementation, the laser direct writing device light source position correction method in this embodiment of the invention may further include:

[0018] Background subtraction or dynamic thresholding methods are used to eliminate background noise generated by repeated erasing and rewriting.

[0019] A second aspect of the present invention provides a laser direct writing device light source position correction system, which may include:

[0020] The first processing module is used to arrange multiple sets of binary images in a horizontal direction to form an image sequence, and to perform binarization processing on the image sequence to obtain the position sequence P of the laser marker points. ref ;

[0021] The second processing module is used to write the image sequence onto an optical calibration plate made of chalcogenide phase change thin film material using the laser array. The mounting position of the optical calibration plate is relatively fixed relative to the working space of the laser direct writing device.

[0022] The third processing module is used to obtain the actual position sequence P of the laser markers on the optical calibration plate. m ;

[0023] The fourth processing module is used to process formula P. m =M*P ref +T, calculate the horizontal step error S x Vertical step error S y and installation deviation angle θ; where T is a second-order constant matrix.

[0024] Optionally, as a possible implementation, in this embodiment of the invention, the third processing module may include:

[0025] The acquisition unit uses the second characteristic pulse of the laser array, modulated and then passed through the interference enhancement medium layer to reduce interference, to acquire the observation image reflected in the semiconductor image sensor camera to form the preset mark;

[0026] The computing unit uses a Gaussian surface fitting algorithm to extract the pixel-level geometric centroid of each laser marker point in the observed image, obtaining the measured coordinate matrix P. m .

[0027] Optionally, as a possible implementation, the laser direct writing device light source position correction system in this embodiment of the invention may further include:

[0028] The fifth processing module uses background subtraction or dynamic thresholding to eliminate background noise generated by repeated erasing and writing.

[0029] A third aspect of the present invention provides a computer device, the computer device including a processor, the processor being configured to execute a computer program stored in a memory to implement the steps of the first aspect and any possible implementation thereof.

[0030] A fourth aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the first aspect and any possible implementation thereof.

[0031] As can be seen from the above technical solutions, the embodiments of the present invention have the following advantages:

[0032] In this embodiment of the invention, a chalcogenide phase change material is used instead of a photosensitive coating for light source position correction. The chalcogenide phase change material can withstand tens of thousands of write and erase cycles, significantly saving material and time costs and improving the production efficiency of the laser direct-write equipment. Furthermore, a preset position sequence P of marked points in an image sequence is formed by horizontally sorting multiple sets of binary images. refand actual location sequence P m Affine transformation model calculations can be performed directly in the same coordinate system to calculate the horizontal step error S. x Vertical step error S y The installation deviation angle θ reduces mechanical measurement errors introduced by disassembly and improves calibration accuracy. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of an embodiment of a laser direct writing device light source position correction method according to an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of a specific application embodiment of the optical calibration plate in this invention;

[0035] Figure 3 This is a schematic diagram of one embodiment of a computer device according to an embodiment of the present invention. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0037] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0038] In the description of this application, unless otherwise stated, "a plurality of" means two or more. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" shall be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; as a direct connection or an indirect connection through an intermediate medium; or as a connection within two components.

[0039] For ease of understanding, the specific processes in the embodiments of the present invention are described below. Please refer to [link / reference]. Figure 1 In one embodiment of the present invention, the laser direct writing device light source position correction method may include:

[0040] S101: Arrange multiple sets of binary images horizontally to form an image sequence (e.g., crosshairs, rotationally symmetric images, etc.), and binarize the image sequence to obtain the position sequence P of the laser marker points. ref ;

[0041] The applicant noted that the positional error of the laser array, which can move relative to the exposure surface in both the horizontal and vertical directions, mainly occurs in: the horizontal step error S. x Vertical step error S y And the installation deviation angle θ. To measure these deviations, multiple sets of binary images can be arranged horizontally to form an image sequence. Then, based on the actual position deviation of the output image corresponding to the image sequence, the position deviation of the light source in the laser array can be mapped and identified.

[0042] S102: Image sequences are written onto an optical calibration plate made of chalcogenide phase change thin film material using a laser array;

[0043] To avoid the shortcomings of existing technologies that rely on photosensitive coatings for positioning, this application proposes using a laser array to write a preset image sequence onto an optical calibration plate made of a chalcogenide phase change thin film material. The mounting position of the optical calibration plate is relatively fixed within the working space of the laser direct-writing device, allowing for direct position detection within the same coordinate system. This reduces mechanical measurement errors introduced by disassembly and improves calibration accuracy.

[0044] For example, please refer to Figure 2The optical calibration plate in this embodiment may include a phase transition layer 101 and an interference enhancement dielectric layer 102 made of a chalcogenide phase transition material. In this embodiment, the chalcogenide phase transition material may be composed of Ge-Sb-Te or Ag-In-Sb-Te composite elements and their doped alloys, such as Ge2Sb2Te5, and is not specifically limited here. The chalcogenide phase transition material in this application is in a crystalline state under normal conditions. After being irradiated with a specifically modulated laser wave (high power, short pulse), the irradiated area rapidly heats up to an amorphous state within a short time. Then, as the laser irradiation stops, the temperature drops rapidly, and the atoms are "frozen" in the amorphous state to form a mark. This marked state can be maintained for a sufficient time by irradiation with other modulated laser waves (medium power, long pulse) to provide thermal energy for atomic rearrangement, causing it to anneal and recover to a highly reflective crystalline state, thus erasing the mark. The chalcogenide phase transition material can undergo tens of thousands of write and erase cycles without the need for similar photosensitive coatings (e.g., photoresist) in the prior art, greatly saving material and time costs.

[0045] Optionally, the interference enhancement dielectric layer 102 is preferably a solid-state thin film with high light transmittance and tunable refractive index. The specific material can be selected according to requirements and is not limited here. For example, a ZnS-SiO2 solid-state thin film can be used to adaptively adjust the refractive index to match different wavelengths of laser light.

[0046] Preferably, the thickness d of the interference enhancement medium layer 102 satisfies the following condition: 2nd cos(θ)=(m+1 / 2)λ-δ; where n is the refractive index of the interference enhancement medium layer, θ is the refraction angle of the light pulse in the interference enhancement medium layer, m is a non-negative integer constant (m represents the interference order, which is set as a constant according to requirements), λ is the wavelength of the light pulse in vacuum, and δ is an additional optical path difference constant (if only one of the two coherent beams experiences half-wave loss δ=λ / 2, if both beams experience or do not experience half-wave loss δ=0, which is set as a constant according to requirements).

[0047] S103: Obtain the actual position sequence P of the laser markers on the optical calibration plate. m ;

[0048] For example, in this embodiment of the application, the second characteristic pulse of the laser array, after being modulated, passes through an interference enhancement medium layer to reduce interference, and then the observed image reflected in the semiconductor image sensor camera forms a preset mark; the Gaussian surface fitting algorithm is used to extract the pixel-level geometric centroid of each laser mark point in the observed image to obtain the measured coordinate matrix P. m .

[0049] Specifically, in the embodiments of this application, the emitted light from each laser source can be modulated into a first characteristic pulse, a second characteristic pulse, or a third characteristic pulse according to the control instructions of the acousto-optic modulator. For example, the first characteristic pulse can be a high-power, short pulse (rapidly raising the local temperature of the material to above the melting point Tm, then abruptly stopping the laser, rapidly cooling the material, and the atoms not having time to arrange themselves in an orderly manner, being "frozen" in an amorphous state; the specific pulse power and pulse width are adaptively set according to the material selection). The second characteristic pulse can be a low-power continuous wave with energy far below the phase transition threshold, used only for detecting reflectivity. The third characteristic pulse can be a medium-power, long pulse (heating the material to between the crystallization temperature Tg and the melting point Tm, holding it for a sufficient time to provide thermal energy for atomic rearrangement, causing it to anneal and recover to a highly reflective crystalline state; the specific pulse power and pulse width are adaptively set according to the material selection).

[0050] Optionally, before using the Gaussian surface fitting algorithm to extract the pixel-level geometric centroid of each laser marker point in the observed image, a background subtraction method or a dynamic thresholding method can be used to eliminate background noise generated by multiple erasures and rewrites.

[0051] S104: According to formula P m =M*P ref +T, calculate the horizontal step error S x Vertical step error S y And the installation deviation angle θ.

[0052] The applicant discovered that related technologies (e.g., publication number CN116560198A) require phase transformation between different coordinate systems, which is computationally complex. In the embodiments of this application, the horizontal step error S x Vertical step error S y The installation deviation angle θ is a coordinate system on the same plane outside the binary image coordinate system on the exposure plane. To achieve the fusion of the two different coordinate systems, the applicant fitted and modeled the errors in the horizontal and vertical step sizes of the laser array and the graphic transformation caused by the installation deviation angle θ as a scaled and rotated third-order affine transformation model, the calculation formula of which is as follows:

[0053]

[0054] After simplification to a second-order matrix, the result is: P m =M*P ref +T, where

[0055] T is a second-order constant matrix. The global scaling factor S can be calculated using the least squares method. x S y and installation deviation angle θ. Based on the above horizontal step error Sx Vertical step error S y By determining the installation deviation angle θ, further image correction of the laser direct writing device can be performed. For details, please refer to relevant technologies, which will not be elaborated here.

[0056] As can be seen from the above disclosure, in this embodiment, a chalcogenide phase change material is used instead of a photosensitive coating for light source position correction. The chalcogenide phase change material can withstand tens of thousands of write and erase cycles, significantly saving material and time costs and improving the production efficiency of the laser direct-write equipment. Furthermore, a preset position sequence P of marked points in an image sequence is formed by horizontally sorting multiple sets of binary images. ref and actual location sequence P m Affine transformation model calculations can be performed directly in the same coordinate system to calculate the horizontal step error S. x Vertical step error S y The installation deviation angle θ reduces mechanical measurement errors introduced by disassembly and improves calibration accuracy.

[0057] This application embodiment also provides a laser direct writing device light source position correction system, which may include:

[0058] The first processing module is used to arrange multiple sets of binary images in a horizontal direction to form an image sequence, and to perform binarization processing on the image sequence to obtain the position sequence P of the laser marker points. ref ;

[0059] The second processing module is used to write the image sequence onto an optical calibration plate made of chalcogenide phase change thin film material using the laser array. The mounting position of the optical calibration plate is relatively fixed relative to the working space of the laser direct writing device.

[0060] The third processing module is used to obtain the actual position sequence P of the laser markers on the optical calibration plate. m ;

[0061] The fourth processing module is used to process formula P. m =M*P ref +T, calculate the horizontal step error S x Vertical step error S y and installation deviation angle θ; where T is a second-order constant matrix.

[0062] Optionally, as a possible implementation, in this embodiment of the invention, the third processing module may include:

[0063] The acquisition unit uses the second characteristic pulse of the laser array, modulated and then passed through the interference enhancement medium layer to reduce interference, to acquire the observation image reflected in the semiconductor image sensor camera to form the preset mark;

[0064] The computing unit uses a Gaussian surface fitting algorithm to extract the pixel-level geometric centroid of each laser marker point in the observed image, obtaining the measured coordinate matrix P. m .

[0065] Optionally, as a possible implementation, the laser direct writing device light source position correction system in this embodiment of the invention may further include:

[0066] The fifth processing module uses background subtraction or dynamic thresholding to eliminate background noise generated by repeated erasing and writing.

[0067] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0068] The laser direct writing device light source position correction system in this invention has been described above from the perspective of modular functional entities. Please refer to [link to relevant documentation]. Figure 3 The computer device in the embodiments of the present invention will now be described from the perspective of hardware processing:

[0069] The computer device 1 may include a memory 11, a processor 12, and an input / output bus 13. The processor 12 executes the computer program to implement the above-described... Figure 1 The steps in the method embodiments shown, for example Figure 1 Steps 101 to 104 are shown. Alternatively, the processor executes a computer program to implement the functions of each module or unit in the above-described device embodiments.

[0070] The memory 11 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 11 can be an internal storage unit of the computer device 1, such as the hard disk of the computer device 1. In other embodiments, the memory 11 can be an external storage device of the computer device 1, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the computer device 1. Furthermore, the memory 11 can include both internal storage units and external storage devices of the computer device 1. The memory 11 can be used not only to store application software and various types of data installed on the computer device 1, such as computer program code, but also to temporarily store data that has been output or will be output.

[0071] In some embodiments, processor 12 may be a central processing unit (CPU), controller, microcontroller, microprocessor or other data processing chip, used to run program code stored in memory 11 or process data, such as executing computer programs.

[0072] The input / output bus 13 can be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus, etc. This bus can be divided into address bus, data bus, control bus, etc.

[0073] Furthermore, the computer device may also include a wired or wireless network interface 14, which may optionally include a wired interface and / or a wireless interface (such as a Wi-Fi interface, a Bluetooth interface, etc.), typically used to establish communication connections between the computer device 1 and other electronic devices.

[0074] Optionally, the computer device 1 may further include a user interface, which may include a display, an input unit such as a keyboard, and optionally, a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, or an OLED (Organic Light-Emitting Diode) touchscreen, etc. The display may also be appropriately referred to as a screen or display unit, used to display information processed in the computer device 1 and to display a visual user interface.

[0075] Figure 3 Only computer device 1 with components 11-14 and computer programs is shown; those skilled in the art will understand that... Figure 3 The structure shown does not constitute a limitation on the computer device 1, and may include fewer or more components than shown, or combine certain components, or have different component arrangements.

[0076] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, can perform the functions described above. Figure 1 The steps in the method embodiments shown, for example Figure 1 Steps 101 to 104 are shown. Alternatively, the processor executes a computer program to implement the functions of each module or unit in the above-described device embodiments.

[0077] In the embodiments provided in this application, it should be understood that the disclosed systems, modules, and units can be implemented in other ways. For example, the system embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0078] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0079] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0080] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0081] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method of correcting a position of a light source of a laser direct writing apparatus, characterized by, The method is applied to a laser array movable relative to an exposure surface in a horizontal direction and a vertical direction, and comprises the following steps: The multiple sets of binary images are arranged in a horizontal direction to form an image sequence, and the image sequence is binarized to obtain a position sequence P of the laser marking points ref ; The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; acquiring a sequence of actual positions P of the laser marking points on the optical calibration plate m ; According to the formula P m = M * P ref + T, the horizontal step error S x , the vertical step error S y and the installation deviation angle θ are calculated; wherein T is a 2-order constant matrix.

2. The method of claim 1, wherein, The optical calibration plate further comprises an interference enhancement medium layer composed of a ZnS-SiO2 solid film.

3. The method of claim 2, wherein, The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; 4. The method according to claim 1 or 2, characterized in that, acquiring a sequence of actual positions P of the laser marking points on the optical calibration plate m comprising: The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; A Gaussian surface fitting algorithm is used to extract the pixel-level geometric centroid of each laser mark point in the observation image to obtain a measured coordinate matrix P m .

5. The method of claim 4, wherein, The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; 6. A laser direct writing apparatus light source position correction system characterized by, The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The first processing module is configured to arrange multiple groups of binary images in a horizontal direction to form an image sequence, and perform binaryzation on the image sequence to obtain a position sequence P of laser marking points ref ; The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The third processing module is configured to acquire an actual position sequence P of a laser marking point on the optical calibration board m ; a fourth processing module configured to calculate horizontal step error S m , vertical step error S ref and installation deviation angle θ according to formula P x = M*P y + T, wherein T is a 2-order constant matrix.

7. The system of claim 6, wherein, The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The computing unit extracts the pixel-level geometric centroid of each laser mark point of the observation image by using a Gaussian surface fitting algorithm to obtain a measured coordinate matrix P m .

8. The system of claim 7, wherein, The laser array is used to write the image sequence on an optical calibration plate composed of a chalcogenide phase-change film material, and a position of the optical calibration plate is fixed relative to a working space of a laser direct writing device; The computer program is executed by the processor to implement the method according to any one of claims 1 to 5.

9. A computer apparatus, comprising: The computer program is executed by the processor to implement the method according to any one of claims 1 to 5.

10. A computer readable storage medium having stored thereon a computer program, characterized in that: ​

Images