Electronic device

Abstract

The invention provides an electronic device which comprises a middle frame, a shell and a circuit board, the middle frame comprises a mounting groove, the circuit board is located in the mounting groove, the circuit board comprises a front face, an electronic device is arranged on the front face, the electronic device further comprises a support and a supporting frame, the support comprises a first body and a first connecting edge, and the first connecting edge is connected to the edge of the first body. The first body comprises a top surface; the supporting frame comprises a second body and a second connecting edge, the second connecting edge is connected with the edge of the second body, and the second body comprises an outer surface and an inner surface; the support covers the electronic device, the electronic device is located between the front face and the first body, the supporting frame is installed on the support, the second connecting edge is stacked on the first connecting edge, and the second connecting edge, the first connecting edge and the circuit board are fixedly connected to the middle frame. A gap is formed between the inner side surface of the second body and the top surface of the first body along the thickness direction of the circuit board; the shell is installed in the middle frame and covers the circuit board, and a bonding layer is connected between the surface, facing the circuit board, of the shell and the outer surface.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the diversification of applications for electronic devices such as mobile phones and tablets, the requirements for their volume and sound effects also vary. For example, playing audio, video, or games in public requires a larger volume, but a large volume can cause the back cover of the phone to vibrate, affecting the stability of the internal components. Summary of the Invention

[0003] This application provides an electronic device that uses a bracket to position the back cover to improve the stability of the internal components of the electronic device.

[0004] In one embodiment of this application, the electronic device includes a mid-frame, a housing, and a circuit board. The mid-frame includes a mounting groove, the circuit board is located in the mounting groove, and the circuit board includes a front side on which electronic components are disposed.

[0005] The electronic device further includes a bracket and a support frame. The bracket includes a first body and a first connecting edge, the first connecting edge being connected to the edge of the first body. The first body includes a top surface. The support frame includes a second body and a second connecting edge, the second connecting edge being connected to the edge of the second body. The second body includes an outer surface and an inner surface disposed opposite to the outer surface.

[0006] The bracket is mounted on the front of the circuit board, and the top surface faces away from the front. The electronic device is located between the front and the first body. The support frame is mounted on the side of the bracket facing away from the circuit board. The second connecting edge is stacked on the first connecting edge and is fixedly connected to the middle frame with the first connecting edge and the circuit board. Along the thickness direction of the circuit board, there is a gap between the inner side of the second body and the top surface of the first body.

[0007] The housing is mounted on the middle frame and covers the circuit board, and an adhesive layer is connected between the surface of the housing facing the circuit board and the outer surface.

[0008] In this embodiment, the bracket is mounted on the electronic device, ensuring its safety and connection stability. The connection between the support frame and the housing reduces housing vibration and improves audio performance. When the electronic device is subjected to external forces such as drop tests or micro-motion tests on the back of the device (one side of the housing), the external stress is transmitted through the housing and adhesive layer to the support frame. This stress is then transmitted through the second connecting edge of the support frame to the middle frame via the screw location. Therefore, the external stress is not transmitted to the connector via the bracket, preventing connector failure due to external stress. Alternatively, brackets and support frames can be installed on various electronic devices on the circuit board. The housing is connected to the support frame via adhesive layer, preventing the devices on the circuit board from being affected by external stress. Moreover, the adhesive layer connects the support frame and the housing; the position of the support frame is not limited to the connector's location. The support frame only needs to be positioned between the housing and the bracket, which is more conducive to the fixation of the housing and the support frame.

[0009] In one embodiment, the electronic device further includes a speaker module, and the mid-frame also includes the speaker module and a battery slot. The battery slot is disposed adjacent to the mounting slot, and the speaker module is located in the mounting slot at the end of the circuit board away from the battery slot. The support frame is closer to the battery slot than the speaker module. In this embodiment, the adhesive layer between the support frame and the housing can be positioned close to the battery, which does not affect the audio performance of the speaker module in the mounting slot and can also reduce the vibration of the housing when the electronic device plays audio, further improving the audio experience.

[0010] In one embodiment, the electronic device further includes a camera assembly, with the electronic components disposed adjacent to the camera assembly. The housing also includes a decorative element that protrudes from the inner side of the housing towards the outer side and forms a groove on the inner side. Both the bracket and the support frame are located within the groove, and an adhesive layer is provided between the bottom wall of the groove and the outer side of the support frame. In this embodiment, the space between the decorative element of the camera assembly and the mid-frame is used to accommodate the support frame, saving space in the thickness direction of the electronic device.

[0011] In one embodiment, the electronic device further includes a camera assembly and a main support. The main support includes a bracket and a protrusion. The main support has a clearance opening. The protrusion is connected to the bracket, and the bracket and the protrusion are adjacent to the clearance opening, or the protrusion extends into the clearance opening. The camera assembly passes through the clearance opening, and the protrusion is adjacent to the camera assembly. Along the thickness direction of the main support, the protrusion protrudes from the surface of the main support, and the height of the support frame protruding from the surface of the main support is less than or equal to the height of the protrusion protruding from the surface of the main support. In this embodiment, the height difference between the protrusion on the main support and the bracket is used to set the support frame, which does not occupy additional space on the back of the electronic device and facilitates miniaturization. The protrusion can be used to position electronic components or camera assemblies, etc.

[0012] In one embodiment, the surface of the first connecting edge is provided with a recess, and the second connecting edge is located within the recess. In this embodiment, the second connecting edge of the support frame is accommodated within the thickness space of the support frame, which can save the thickness space of the electronic device.

[0013] In one embodiment, the first connecting edge is connected to opposite sides of the first body, and the second connecting edge is connected to opposite sides of the second body. The second body also has a receiving cavity, the opening of which faces away from the outer surface, and the inner surface is the cavity wall of the receiving cavity. The second connecting edge is located on the opening side of the receiving cavity, and the first body of the bracket is housed within the receiving cavity. In this embodiment, the bracket and support frame have simple and similar structures, which facilitates installation, and the second body has sufficient area to support the adhesive layer, thereby ensuring the stability of the connection with the shell.

[0014] In one embodiment, the first connecting edge is connected to opposite sides of the first body, and the second connecting edge is connected to both sides of one side of the second body. The second body includes a support segment and a connecting segment, which are connected at an angle. The second connecting edge is connected to the end of the connecting segment away from the support segment and to the first connecting edge of the bracket. The connecting segment is located on one side of the first body along the thickness direction of the circuit board. A gap is formed between the support segment and the top surface of the first body, and the support segment is opposite to a portion of the top surface and connected by the adhesive layer. A space exists between the other portion of the top surface and the housing. In this embodiment, the support frame covers a portion of the bracket, sufficient to separate the housing and the bracket. The space between the first body of the bracket and the housing can be reserved for devices on the circuit board next to the bracket, or other structures, or structures on the inner surface of the housing, thus saving internal space in the electronic device.

[0015] In one embodiment, the first body of the bracket includes a limiting groove, the opening of which faces away from the top surface. The first connecting edge is located on the opening side. The electronic device is housed in the limiting groove and abuts against the groove wall facing the front and the front surface. In this embodiment, the electronic device can be a battery connector, camera connector, speaker connector, etc. The connector is confined in the limiting groove of the bracket to ensure its insertion stability.

[0016] In one embodiment, the electronic device further includes a camera assembly. The electronic components include a first electronic component and a second electronic component. The camera assembly includes a main camera and an auxiliary camera. The first electronic component is located between the main camera and the auxiliary camera, and the second electronic component is located between the camera assembly and the battery compartment. In this embodiment, the connector is installed using the gaps in the camera assembly and the gaps at the edge of the battery compartment, which makes full use of the internal space of the electronic components and facilitates the installation of a support frame.

[0017] In one embodiment, the second connecting edge, the first connecting edge, and the circuit board are fixedly connected to the middle frame by screws. In this embodiment, the support frame, bracket, and circuit board are fixed to the middle frame by screws, simplifying the fixing structure. Attached Figure Description

[0018] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0020] Figure 2 for Figure 1 The diagram shows a partial exploded structural diagram of the electronic device.

[0021] Figure 3 for Figure 1 A schematic diagram of the internal structure of one embodiment of the electronic device shown;

[0022] Figure 4 for Figure 1 A schematic diagram of the internal structure of another embodiment of the electronic device shown;

[0023] Figure 5 for Figure 4 A partially enlarged schematic diagram of a portion of the structure of the electronic device shown;

[0024] Figure 6for Figure 1 A schematic diagram of the internal structure of another embodiment of the electronic device shown;

[0025] Figure 7a for Figure 1 A schematic diagram of the structure of one embodiment of the main support of the electronic device shown;

[0026] Figure 7b for Figure 7a An enlarged schematic diagram of the structure within the dashed area;

[0027] Figure 8 for Figure 1 A schematic diagram of the internal structure of another embodiment of the electronic device. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0029] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 2 for Figure 1 The diagram shows a partial exploded view of one embodiment of the electronic device.

[0030] Electronic devices include, but are not limited to, cellphones, notebook computers, tablet personal computers, personal digital assistants, and mobile devices. For ease of description, the width direction of the electronic device 100 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. The X-axis, Y-axis, and Z-axis are mutually perpendicular.

[0031] Continue to refer to Figure 1 and Figure 2 In this embodiment of the application, the electronic device 100 is a mobile phone as an example for illustration.

[0032] The electronic device 100 includes a housing 10, a mid-frame 20, a screen 30, a circuit board 40, a battery (not shown), a main bracket (not shown), and a processor (not shown), as well as a camera assembly 50, a speaker module 70, a connector assembly, and other electronic components. The housing 10 and the screen 30 are located on opposite sides of the mid-frame 20 in the thickness direction. The circuit board 40, camera assembly 50, multiple connectors 60, battery (not shown), circuit board bracket (not shown), and processor (not shown) are all mounted on the mid-frame 20 and covered by the housing 10. The speaker module 70, connectors 60, bracket (not shown), and processor can be mounted on the circuit board 40. The processor can be the CPU (central processing unit) of the electronic device 100. A power module provides power to the screen 30, circuit board 40, and processor, among other electronic components.

[0033] In this embodiment, the middle frame 20 includes a middle plate 21 and a side frame, with the side frame surrounding the middle plate. The middle frame 20 also includes a battery slot 22 and a mounting slot 23, which are arranged adjacent to each other. The middle plate 21 and the side frame form the battery slot 22 and the mounting slot 23. The battery is housed in the battery slot 22. The circuit board 40, the camera assembly 50, and the speaker module 70 are located in the mounting slot 23. The circuit board 40 is fixedly connected to the middle plate 21, and it can be fixed with screws. The camera assembly 50 is mounted on the middle plate 21, and the circuit board 40 has holes cut out to avoid the camera assembly 50. Of course, if necessary, the camera assembly 50 can also be located on the circuit board 40. The camera assembly 50 includes a main camera and an auxiliary camera. The speaker module 70 is located on the side of the circuit board 40 away from the battery slot 22.

[0034] The circuit board 40 includes a front side 41 and a back side (not shown). The camera assembly 50, multiple connectors 60, a circuit board bracket, and a processor are located on the front side 41. The connectors 60 are used to connect the electronic components of the electronic device to the circuit board 40 and the power supply. The multiple connectors 60 can be screen connectors, camera connectors, and power connectors, etc. In this embodiment, the housing 10 is the rear housing of the electronic device 100. The housing 10 includes an outer surface 101 and an inner surface 102, which are disposed opposite to each other along the thickness direction of the housing 10.

[0035] like Figure 3 As shown, Figure 3 for Figure 1The diagram illustrates the internal structure of one embodiment of the electronic device; that is, only a portion of the internal structure of the electronic device 100 is shown. The main support can be connected to a circuit board or a battery. The main support can include one or more supports, and support 80 can be several independent structures. Support 80 can also be a single structure capable of supporting the periphery and front of the circuit board 40; support 80 can also be part of a main support capable of simultaneously covering the battery and the periphery of the circuit board, such as covering the battery portion, defining a speaker module, or supporting peripheral components of the circuit board.

[0036] In this embodiment, only one bracket 80 located on the front side 41 is described as an example, and the structure of the bracket 80 in this embodiment is just an example. Other parts of the bracket 80 are not shown in this embodiment and are not limited thereto. In this embodiment, the bracket 80 is fixed to the circuit board 40 located on the front side 41. The camera group 50 and the processor are arranged adjacent to the bracket 80. There is a limiting space between the bracket 80 and the front side 41, and the connector 60 is located within the limiting space. The bracket 80 and the front side 41 limit the connector 60 in the thickness direction of the electronic device 100, preventing the connector 60 from loosening and failing during the use of the electronic device. In one embodiment, the recess of the decorative part can accommodate part or all of the connectors, and can also accommodate the bracket covering the connector 60. In another embodiment, the decorative part does not form a recess. The bracket 80 is connected to the inner side.

[0037] Electronic device 100 uses speaker module 70 to play audio, and when the speaker module 70 plays loudly, it causes the housing 10 to vibrate. For example, if the speaker module 70 adopts an open rear acoustic chamber design, it can improve some audio characteristics, which will affect the housing 10. To reduce the vibration of the housing 10, an adhesive layer 15 is formed between the housing 10 and the bracket 80 to position the housing 10. This can reduce the vibration of the housing 10 and improve the audio effect. However, since the adhesive layer 15 is located on the bracket 80 of the limiting connector 60, when the housing 10 of electronic device 100 is subjected to force such as being dropped or subjected to micro-motion testing, the external stress will be transmitted to the connector 60 through the housing 10, the adhesive layer 15, and the bracket 80, which may easily cause the connector 60 to malfunction. To prevent the stress from being transmitted to the connector 60 through the housing 10, the electronic device 100 of this application is also provided with a support frame, which is disposed between the housing 10 and the bracket 80.

[0038] Please participate together Figure 2 and Figure 4 As shown, Figure 4 for Figure 1 A schematic diagram of the internal structure of another embodiment of the electronic device shown; in this embodiment, the electronic device 100 includes, in addition to, Figure 3 The bracket 80 of the illustrated embodiment further includes a support frame 90. The bracket 80 includes a first body 81 and a first connecting edge 82, the first connecting edge 82 being connected to the edge of the first body 81. The first body 81 includes a top surface 83 facing away from the first connecting edge 82. The first body 81 also has a limiting groove 84, with the opening of the limiting groove 84 facing away from the top surface, and the first connecting edge 82 located on the opening side of the limiting groove 84. Specifically, the bracket 80 is Z-shaped, the first body 81 is an n-shaped groove or a rectangular groove, and the limiting groove 84 can be formed by four side walls or two side walls. The bracket 80 can be understood as a semi-enclosed cover structure. The first connecting edge 82 is connected to opposite sides of the first body 81. The bracket 80 is mounted on the front side of the circuit board 40, with the first body 81 facing the connector 60, and the connector 60 located within the limiting groove 84; in the thickness direction of the electronic device 100, the first body 81 and the front side 41 clamp the connector 60. The first connecting edge 82 is connected to the front side and fixed to the circuit board 40 by screws, wherein the screws can directly fix the circuit board 40, the bracket 80 and the middle plate 21.

[0039] The support frame 90 includes a second body 91 and a second connecting edge 92, the second connecting edge 92 being connected to the edge of the second body 91; the second connecting edge 92 is set at an angle to the second body 91. The second body 91 includes an outer surface 901 and an inner surface 902, the outer surface 901 and the inner surface 902 being arranged opposite to each other along the thickness direction of the electronic device 100. The support frame 90 also has a receiving cavity 93. In this embodiment, the opening of the receiving cavity 93 faces away from the outer surface 901, and the inner surface is the cavity wall of the receiving cavity 93. The second connecting edge 92 is located on the opening side of the receiving cavity 93. The first body 81 of the bracket 80 can be accommodated in the receiving cavity 93. Specifically, the second connecting edge is connected to opposite sides of the second body. The second body 91 is an n-shaped groove or a rectangular groove, and the receiving cavity 93 can be formed by four side walls or by two opposite side walls, with the second connecting edge 92 connected to the side walls. The form of the support frame 90 is not limited to that described in the embodiment.

[0040] like Figure 5 As shown, Figure 5 for Figure 4The diagram shows a partially enlarged view of a portion of the structure of the electronic device. Taking a connector as an example, it illustrates the assembly relationship between the bracket and the connector. The bracket 80 is mounted on the front side 41 of the circuit board 40, and the first connecting edge 82 is connected to the front side 41. The first connector 60a is located within the limiting groove 84, and the connector 60 abuts against the front side 41 and the first body 81. A support frame 90 is mounted on the bracket 80, and the bracket 80 is housed within the receiving cavity 93 of the second body 91. The second connecting edge 92 is stacked on top of the first connecting edge 82, and the second connecting edge 92, the first connecting edge 82, and the circuit board 40 are fixedly connected to the middle plate 21 by screws. Along the thickness direction of the circuit board 40, the inner surface 902 of the second body 91 is spaced apart from the top surface 83 of the first body 81, i.e., there is a gap A between the second body 91 and the first body 81 along the thickness direction of the circuit board 40. In this embodiment, there is a gap between the second body 91 and the first body 81 along the direction perpendicular to the thickness of the circuit board 40. The housing 10 is mounted on the mid-frame 20, with its inner side 102 facing the circuit board 40. An adhesive layer 95 is formed between the inner side 102 and the outer surface 901, connecting the inner side 102 and the outer surface 901, thereby connecting the housing 10 to the support frame 90. The support frame 90 does not necessarily need to completely cover the first body 81 of the bracket 80; the support frame 90 only needs to be able to support between the housing 10 and the bracket 80. Along the length of the mid-frame 20, the adhesive layer 95 is closer to the battery compartment 22 than the speaker module 70, that is, closer to the battery side.

[0041] In this embodiment, when the electronic device 100 is subjected to external forces such as drop tests or micro-motion tests on the back of the device, i.e., one side of the housing 10, the external stress will be transmitted through the housing 10 to the support frame 90 via the adhesive layer 95. The stress will then be transmitted through the second connecting edge 92 of the support frame 90 to the middle frame 20 via the screw position. Therefore, the external stress will not be transmitted to the connector 60 via the bracket 80, thereby preventing the connector 60 from failing due to external stress. It can also be understood that brackets 80 and support frames 90 can be provided on various electronic components on the circuit board 40. The housing 10 is connected to the support frame 90 via the adhesive layer 95, which can prevent the components on the circuit board from being affected by external stress. Moreover, in this embodiment, the adhesive layer 95 connects the support frame 90 and the housing 10. The position of the support frame 90 is not limited to the position of the connector 60; the support frame 90 only needs to be able to support between the housing 10 and the bracket 80. The speaker module is located at the end of the circuit board 40 away from the battery compartment 22, and the support frame 90 is closer to the battery compartment 22 than the speaker module. Therefore, the adhesive layer 95 can be positioned close to the battery, which can reduce the vibration of the housing 10 when the electronic device plays audio, and further improve the audio experience.

[0042] It should be noted that in this embodiment, if the limiting groove 84 of the bracket 80 contains electronic devices such as chips, resistors, capacitors, and inductors, a clearance should be reserved between the first body 81 of the bracket 80 and the electronic devices such as chips, resistors, capacitors, and inductors to prevent external impact from damaging these devices.

[0043] In one embodiment of this application, such as Figure 2 and Figure 6 , Figure 6 for Figure 1 The diagram shows the internal structure of the electronic device in another embodiment. The housing 10 also includes a decorative element 12, which protrudes from the inner side 102 of the housing 10 toward the outer side 101, and forms a groove 122 on the inner side 102. The decorative element 12 has several light-transmitting holes 121 for the camera assembly 50 to allow light to pass through. The housing 10 is mounted on the middle frame 20 and covers one side of the circuit board 40 and the battery. The inner side 102 faces the bracket 80. The decorative element 12 covers the camera assembly 50, and the light-transmitting holes 121 correspond to the cameras within the camera assembly 50.

[0044] In this embodiment, three connectors 60 are used as an example: a first connector 60a, a second connector 60b, and a third connector 60c. The first connector 60a is located between the main camera and the auxiliary camera. The second connector 60b and the third connector 60c are adjacent to the camera group 50 and located between the camera group 50 and the battery compartment. Correspondingly, there are three brackets 80, each covering the first connector 60a, the second connector 60b, and the third connector 60c. The three brackets 80 can be connected to each other or distributed independently. Each bracket 80 is provided with a support frame 90.

[0045] The positional relationship between bracket 80 and support frame 90 and their corresponding connector 60 can be found in [reference]. Figure 5 The specific details of the described embodiments are as follows: Figure 6 The image only illustrates a connector and a bracket. This embodiment is similar to... Figure 5 The difference in the illustrated embodiment is that at least two of the first connector 60a, the second connector 60b, and the third connector 60c are located within the groove 122 of the decorative member 12. For example, the first connector 60a, and the bracket 80 and support frame 90 supporting the first connector 60a are both located within the groove 122. An adhesive layer is provided between the bottom wall of the groove 122 and the outer surface of the support frame 90. In this embodiment, the space between the support frame 90 and the gap A in the thickness direction of the electronic device 100 utilizes the space of the groove 122, thus not occupying additional thickness space of the electronic device.

[0046] In one embodiment of this example, such as Figure 7a As shown, Figure 7a for Figure 1The diagram illustrates a structural design of an embodiment of the main support frame of an electronic device. The main support frame 80A includes a support 80 and a protrusion 806. The main support frame 80A has a clearance opening 807. The protrusion 806 is connected to the support 80, and the support 80 and the protrusion 806 are adjacent to the clearance opening 807. When there are multiple protrusions 806, some protrusions 806 extend into the clearance opening 807. The camera assembly 50 passes through the clearance opening 807, and the protrusion 806 is adjacent to the camera assembly 50. Along the thickness direction of the main support frame 80A, the protrusion 806 protrudes from the surface of the main support frame 80A, and the height of the support frame 90 protruding from the surface of the main support frame 80A is less than or equal to the height of the protrusion 806 protruding from the surface of the main support frame 80A. It can be understood that the height of the protrusion 806 is equal to or lower than the height of the camera assembly 50, and can be used to provide fabrication or auxiliary positioning for the camera assembly 50.

[0047] In this embodiment, a portion of the main bracket is located in the mounting slot 23 and around the periphery of the circuit board 40. The camera assembly 50 protrudes through a clearance opening. The clearance opening also serves to expose components on the circuit board 40 that do not require support or protection. It is understood that the portion of the main bracket 80A located in the mounting slot can support the housing 10. Another portion of the main bracket (not shown) is located in the battery slot 22 and covers the battery, allowing the battery to be positioned within the battery slot. The specific structure of the main bracket in this embodiment is merely an example.

[0048] Please see Figure 7b , Figure 7b for Figure 7a An enlarged schematic diagram of the structure within the dashed area. In one embodiment, the bracket 80 and the support frame 90 are n-shaped, with a first connecting edge 82 connecting to opposite sides of the first body 81 and forming a limiting groove 84. The surface of the first connecting edge 82 has a recess 821. A second connecting edge 92 connects to opposite sides of the second body 91 and forms the receiving cavity 93 with the second body 91. The support frame 90 is connected to the bracket 80, and the second connecting edge 92 is located within the recess 821. The total thickness of the second connecting edge 92 and the first connecting edge is reduced, allowing the support frame 90 to utilize part of the thickness space of the bracket 80, thus reducing the space occupied by the support frame 90 in the thickness direction of the electronic device. It can be understood that the limiting groove 84 can be formed jointly by the first connecting edge 82 and the first body 81, or it can be formed by the first body itself. The receiving cavity 93 can be formed jointly by the second body 91 and the second connecting edge 92, or it can be constituted by the second body 91.

[0049] In any of the above embodiments, the area of ​​the outer surface 901 of the second body 91 can be greater than or equal to the area of ​​the top surface 83, which can increase the bonding area of ​​the adhesive layer. Of course, depending on the actual position of the bracket, the area of ​​the outer surface 901 of the second body 91 can be smaller than the area of ​​the top surface 83, mainly to achieve a supporting function.

[0050] In one embodiment, such as Figure 8 , Figure 8 for Figure 1 This is a schematic diagram of the internal structure of another embodiment of the electronic device. The support frame 90 is an irregularly shaped frame, such as a Z-shape. The second body 91 of the support frame 90 includes a support section 911 and a connecting section 912, which are connected at an angle. The second body 91 is an L-shaped plate. The second connecting edge 92 is connected to the end of the connecting section 912 away from the support section 911, and the second connecting edge 92 is at an angle to the connecting section 912. The second connecting edge 92 is connected to the first connecting edge 82 of the bracket 80. The connecting section 912 is located on one side of the first body 81, along the thickness direction of the circuit board. The support section 911 is spaced apart from the top surface 83 of the first body 81, and the support section 911 only covers a portion of the top surface 83 of the first body 81, that is, the support section 911 is opposite to a portion of the top surface. The space between the other part of the top surface 83 of the first body 81 and the inner side of the housing 10 can be used to accommodate other structures, such as decorative parts of the housing 10 or other devices extending from the circuit board. In this way, the space within the electronic device 100 can be fully utilized.

[0051] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electronic device, comprising: The electronic device comprises a middle frame, a shell and a circuit board, the middle frame comprises a mounting groove, the circuit board is located in the mounting groove, the circuit board comprises a front surface, and electronic devices are arranged on the front surface; The electronic device further comprises a support and a supporting frame, the support comprises a first body and a first connecting edge, the first connecting edge is connected to the edge of the first body, and the first body comprises a top surface; the supporting frame comprises a second body and a second connecting edge, the second connecting edge is connected to the edge of the second body, and the second body comprises an outer surface and an inner surface arranged opposite to the outer surface; The support is arranged on the front surface of the circuit board, the top surface faces away from the front surface, the electronic devices are located between the front surface and the first body, the supporting frame is arranged on the side of the support facing away from the circuit board, the second connecting edge is arranged on the first connecting edge, and the first connecting edge, the second connecting edge and the circuit board are fixedly connected to the middle frame; along the thickness direction of the circuit board, there is a gap between the inner surface of the second body and the top surface of the first body; The shell is arranged on the middle frame and covers the circuit board, and an adhesive layer is arranged between the surface of the shell facing the circuit board and the outer surface.

2. The electronic device of claim 1, wherein, The electronic device further comprises a loudspeaker module, the middle frame further comprises a loudspeaker module and a battery slot, the battery slot is arranged adjacent to the mounting groove, the loudspeaker module is located in the mounting groove, the loudspeaker module is located at the end of the circuit board away from the battery slot, and the supporting frame is closer to the battery slot than the loudspeaker module.

3. The electronic device of claim 1, wherein, The electronic device further comprises a camera group, the electronic devices are arranged adjacent to the camera group, the shell comprises an inner surface and an appearance surface arranged opposite to the inner surface, The shell further comprises a decorative piece, the decorative piece is protruded from the inner surface of the shell to the direction of the appearance surface, and a groove is formed on the inner surface; the support and the supporting frame are located in the groove, and the adhesive layer is arranged between the groove bottom wall and the outer surface of the supporting frame.

4. The electronic device of claim 1, wherein, The electronic device further comprises a camera group and a main support, the main support comprises the support and a protruding part, the main support is provided with a avoiding opening, the protruding part is connected to the support, the support and the protruding part are adjacent to the avoiding opening, or the protruding part extends into the avoiding opening, the camera group passes through the avoiding opening, and the protruding part is adjacent to the camera group; along the thickness direction of the main support, the protruding part protrudes from the surface of the main support, and the height of the supporting frame protruding from the surface of the main support is less than or equal to the height of the protruding part protruding from the surface of the main support.

5. The electronic device of any of claims 1-4, wherein, The surface of the first connecting edge is provided with a recess, and the second connecting edge is located in the recess.

6. The electronic device of any of claims 1-3, wherein, The first connecting edge is connected to opposite sides of the first body, and the second connecting edge is connected to two sides of one side of the second body. The second body further comprises a receiving cavity, and the opening of the receiving cavity faces away from the outer surface. The inner surface is a cavity wall of the receiving cavity, and the second connecting edge is located on the opening side of the receiving cavity. The first body of the bracket is accommodated in the receiving cavity.

7. The electronic device of any of claims 1-3, wherein, The first connecting edge is connected to opposite sides of the first body, and the second connecting edge is connected to two sides of one side of the second body. The second body comprises a support section and a connecting section, and the support section and the connecting section are connected at an angle. The second connecting edge is connected to one end of the connecting section away from the support section. The second connecting edge is connected to the first connecting edge of the bracket. The connecting section is located on one side of the first body. In the thickness direction of the circuit board, the support section and the top surface of the first body form the gap, and the support section is opposite to part of the top surface and is connected through the bonding layer. The other part of the top surface has space with the shell.

8. The electronic device of claim 1, wherein, The first body of the bracket comprises a limiting groove, and the opening of the limiting groove faces away from the top surface. The first connecting edge is located on the opening side. The electronic device is accommodated in the limiting groove. The electronic device is located between the groove wall of the limiting groove facing the front surface and the front surface. When the electronic device is a connector, the electronic device abuts against the groove wall and the front surface.

9. The electronic device of claim 2, wherein, The electronic device further comprises a camera group, and the electronic device comprises a first electronic device and a second electronic device. The camera group comprises a main camera and an auxiliary camera. The first electronic device is located between the main camera and the auxiliary camera. The second electronic device is located between the camera group and the battery slot.

10. The electronic device of any of claims 1-3, wherein, The second connecting edge, the first connecting edge, and the circuit board are fixedly connected to the middle frame through screws.

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