Wafer image acquisition method, device and equipment and storage medium
By utilizing a wafer mapping table and Z-axis motor height calculation in the wafer image acquisition method, efficient image acquisition of wafers of different models is achieved, solving the problems of motor aging and long acquisition time in existing technologies, and improving acquisition efficiency and motor life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-05
- Publication Date
- 2026-03-10
AI Technical Summary
Existing wafer image acquisition methods cannot effectively handle wafers of different models, and frequent Z-axis motor movement leads to motor aging and long processing times, making it difficult to meet mass production requirements.
By detecting whether the image acquisition height corresponding to the model of the wafer to be tested exists in the wafer database, the estimated thickness is determined using the wafer mapping table, and the reference height is calculated by combining the initial height of the Z-axis motor and the camera anti-collision height. Fine-tuning is then performed to determine the target height, thereby achieving clear image acquisition for different models of wafers.
It shortens camera focusing time, improves wafer image acquisition efficiency, extends the lifespan of the Z-axis motor, and ensures image clarity for different wafer models.
Smart Images
Figure CN121644995A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of wafer image acquisition, and in particular to a wafer image acquisition method, device, equipment and storage medium. BACKGROUND
[0002] The existing wafer image acquisition method, such as the wafer image acquisition method based on the fixed Z-axis motor height, can only realize the wafer image acquisition of a single wafer model; for example, the wafer image acquisition method relying on manual step-by-step movement of the Z-axis motor to determine the image acquisition height not only takes a long time and is difficult to meet the mass production demand, but also frequently moves the Z-axis motor, accelerates the aging of the Z-axis motor, and shortens the service life of the Z-axis motor. SUMMARY
[0003] The present application provides a wafer image acquisition method, device, equipment and storage medium to realize image acquisition of different wafer models, shorten the camera focusing time while ensuring the wafer image clarity, improve the wafer image acquisition efficiency, and prolong the service life of the Z-axis motor.
[0004] According to an aspect of the present application, a wafer image acquisition method is provided, which comprises:
[0005] In the case where it is detected that the image acquisition height corresponding to the wafer model to be tested does not exist in the wafer database, the estimated thickness of the wafer to be tested is determined according to the wafer model to be tested based on the corresponding relationship between the wafer model and the wafer thickness in the wafer mapping table;
[0006] The reference height of the Z-axis motor is determined according to the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height;
[0007] After controlling the Z-axis motor to move from the initial height to the reference height, the height of the Z-axis motor is fine-tuned to determine the target height of the Z-axis motor;
[0008] The wafer image to be tested collected at the target height is taken as the target wafer image of the wafer to be tested.
[0009] According to another aspect of the present application, a wafer image acquisition device is provided, which comprises:
[0010] The estimated thickness determination module is configured to determine the estimated thickness of the wafer to be tested according to the wafer model to be tested based on the corresponding relationship between the wafer model and the wafer thickness in the wafer mapping table in the case where it is detected that the image acquisition height corresponding to the wafer model to be tested does not exist in the wafer database;
[0011] The reference height determination module is configured to determine the reference height of the Z-axis motor according to the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height;
[0012] a target height determination module configured to fine-tune the height of the Z-axis motor after the Z-axis motor is controlled to move from the initial height to the reference height, and determine a target height of the Z-axis motor;
[0013] a first wafer image acquisition module configured to acquire the wafer image collected at the target height as a target wafer image of the wafer under test.
[0014] According to another aspect of the present application, there is provided an electronic device, comprising:
[0015] at least one processor;
[0016] and a memory connected in communication with the at least one processor; wherein,
[0017] the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to perform the wafer image acquisition method of any of the embodiments of the present application.
[0018] According to another aspect of the present application, there is provided a computer readable storage medium storing computer instructions for causing a processor to perform the wafer image acquisition method of any of the embodiments of the present application when executed by the processor.
[0019] According to another aspect of the present application, there is provided a computer program product comprising a computer program, the computer program being configured to perform the wafer image acquisition method of any of the embodiments of the present application when executed by a processor.
[0020] The technical scheme of the embodiment of the application, in the case that it is detected that the image acquisition height corresponding to the wafer model to be detected does not exist in the wafer database, determines the estimated thickness of the wafer to be detected according to the wafer model to be detected, and based on the corresponding relationship between the wafer model and the wafer thickness in the wafer mapping table; determines the reference height of the Z-axis motor according to the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height; after controlling the Z-axis motor to move from the initial height to the reference height, fine-tunes the height of the Z-axis motor to determine the target height of the Z-axis motor; and collects the wafer image of the wafer to be detected at the target height as the target wafer image of the wafer to be detected. The above technical scheme determines the reference height of the Z-axis motor according to the wafer model to be detected of the wafer to be detected; and then determines the target height of the Z-axis motor by fine-tuning the height of the Z-axis motor near the reference height, which, compared with the wafer image acquisition method of determining the image acquisition height by gradually moving the Z-axis motor by relying on manual operation, reduces the determination range of the target height (i.e. the image acquisition height) of the Z-axis motor, reduces the mechanical wear of the Z-axis motor, thereby prolonging the service life of the Z-axis motor; at the same time, shortens the camera focusing time, and improves the wafer image acquisition efficiency. Furthermore, compared with the wafer image acquisition method based on the fixed Z-axis motor height, the above technical scheme realizes the image acquisition of different wafer models, guarantees the wafer image clarity of different wafer models, and improves the image acquisition efficiency of different wafer models.
[0021] It should be understood that the content described in this part is not intended to identify key or important features of the embodiments of the application, nor is it used to limit the scope of the application. Other features of the application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0023] Figure 1 is a flow chart of a wafer image acquisition method provided by the first embodiment of the application;
[0024] Figure 2 is a flow chart of a wafer image acquisition method provided by the second embodiment of the application;
[0025] Figure 3 is a structural schematic diagram of a wafer image acquisition device provided by the third embodiment of the application;
[0026] Figure 4This is a schematic diagram of the structure of an electronic device that implements the wafer image acquisition method of this invention. Detailed Implementation
[0027] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.
[0028] It should be noted that the terms "target," "first," and "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0029] Example 1
[0030] Figure 1 This is a flowchart of a wafer image acquisition method provided in Embodiment 1 of the present invention. This embodiment is applicable to image acquisition of wafers of different models. The method can be executed by a wafer image acquisition device, which can be implemented in hardware and / or software and can be configured in an electronic device. Figure 1 As shown, the method includes:
[0031] S101. If the image acquisition height corresponding to the wafer model to be tested does not exist in the wafer database, the estimated thickness of the wafer to be tested is determined based on the wafer model to be tested and the correspondence between wafer model and wafer thickness in the wafer mapping table.
[0032] The wafer database refers to a database specifically used to store wafer data. This wafer data includes, but is not limited to, wafer model, wafer thickness, and image acquisition height. The image acquisition height refers to the height of the motor that ensures a clear image of the wafer when the camera mounted on the Z-axis motor acquires the image; the motor height is the height of the Z-axis motor from the wafer stage. The wafer model under test refers to the model number of the wafer to be tested; optionally, the wafer model under test is obtained from the wafer model number entered by the user in the acquisition control interface. The acquisition control interface refers to the visual interface used by the user to control wafer image acquisition. The estimated thickness refers to the approximate thickness value of the wafer under test. It should be noted that one wafer model corresponds to one image acquisition height. In the wafer mapping table, one wafer model corresponds to one wafer thickness.
[0033] Specifically, if the image acquisition height corresponding to the wafer model to be tested does not exist in the wafer database, the wafer model to be tested is used as an index, and the wafer thickness corresponding to the wafer model to be tested is extracted from the wafer mapping table based on the correspondence between wafer model and wafer thickness, as the estimated thickness of the wafer to be tested.
[0034] S102. Determine the reference height of the Z-axis motor based on the estimated thickness, the initial height of the Z-axis motor, and the camera anti-collision height.
[0035] The initial height refers to the height of the Z-axis motor from the wafer stage before wafer image acquisition. Optionally, the initial height can be determined experimentally based on the working distance of the camera lens mounted on the Z-axis motor, the camera mounting angle, and the vertical distance of the wafer stage surface relative to a preset reference plane. The camera anti-collision height refers to the height at which the camera mounted on the Z-axis motor prevents collisions with the wafer stage. Optionally, the camera anti-collision height can be determined experimentally based on the working distance of the camera lens mounted on the Z-axis motor, the camera mounting angle, and the vertical distance of the wafer stage surface relative to a preset reference plane. The reference height is the height used as a benchmark for subsequent fine-tuning of the Z-axis motor height.
[0036] Specifically, based on the estimated thickness, the initial height of the Z-axis motor, and the camera's anti-collision height, the reference height of the Z-axis motor is determined using the following formula:
[0037] ;
[0038] Where a represents the initial height of the Z-axis motor; b represents the camera's anti-collision height; Indicates the estimated thickness of the wafer to be measured; This indicates the reference height of the Z-axis motor.
[0039] S103. After controlling the Z-axis motor to move from the initial height to the reference height, fine-tune the height of the Z-axis motor to determine the target height of the Z-axis motor.
[0040] The target height refers to the height at which the camera mounted on the Z-axis motor can clearly capture an image of the wafer under test. Specifically, in response to the user clicking the "Motor Movement" button on the acquisition control interface, the Z-axis motor is controlled by a motor controller, such as a PLC (Programmable Logic Controller), to move from an initial height to a reference height. Then, in response to a user-sent motor descent or ascent command via the acquisition control interface, the motor controller moves the Z-axis motor down or up a preset distance from the reference height. After the Z-axis motor stops moving, in response to an image acquisition command sent by the user via the acquisition control interface (e.g., the user clicking the "Acquire Image" button), the camera mounted on the Z-axis motor acquires an image of the wafer under test, and this image is fed back to the user via the acquisition control interface. The user then determines whether the image clarity of the wafer under test meets the requirements. If it does, the height of the Z-axis motor at the time of image acquisition is set as the target height of the Z-axis motor. If not, the Z-axis motor continues to move until the user determines that the image clarity of the wafer under test meets the requirements, at which point fine-tuning of the Z-axis motor height stops. The preset distance can be determined experimentally or based on the experience of those skilled in the art; however, this embodiment of the invention does not impose any specific limitations on it.
[0041] Optionally, the target height can be stored in the wafer database as the image acquisition height corresponding to the wafer model under test. This eliminates the need for fine-tuning the Z-axis motor height when acquiring images of wafers with the same model under test in the future. In other words, it eliminates the need for camera focusing and directly moves the Z-axis motor to the image acquisition height, controlling the camera mounted on the Z-axis motor to acquire wafer images, thereby improving the image acquisition efficiency of wafers with the same model under test.
[0042] S104. The image of the wafer to be tested acquired at the target height is used as the target wafer image of the wafer to be tested.
[0043] The target wafer image refers to an image of the wafer under test that meets the user's image clarity requirements. Specifically, the image of the wafer under test captured by the camera mounted on the Z-axis motor when it is at the target height is used as the target wafer image.
[0044] The technical solution of this invention, when it is detected that there is no image acquisition height corresponding to the model of the wafer under test in the wafer database, determines the estimated thickness of the wafer under test based on the model of the wafer under test and the correspondence between the wafer model and the wafer thickness in the wafer mapping table; determines the reference height of the Z-axis motor based on the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height; after controlling the Z-axis motor to move from the initial height to the reference height, the height of the Z-axis motor is finely adjusted to determine the target height of the Z-axis motor; and the image of the wafer under test acquired at the target height is used as the target wafer image of the wafer under test. The above technical solution determines the reference height of the Z-axis motor based on the model of the wafer under test. Then, by fine-tuning the height of the Z-axis motor near the reference height, the target height of the Z-axis motor is determined. Compared to wafer image acquisition methods that rely on manually moving the Z-axis motor step by step to determine the image acquisition height, this narrows the range for determining the target height of the Z-axis motor (i.e., the image acquisition height), reduces mechanical wear on the Z-axis motor, and thus extends its service life. Simultaneously, it shortens the camera focusing time and improves the efficiency of wafer image acquisition. Furthermore, compared to wafer image acquisition methods based on a fixed Z-axis motor height, the above technical solution enables image acquisition of different wafer models, ensuring image clarity for different wafer models while improving the image acquisition efficiency for different wafer models.
[0045] Example 2
[0046] Figure 2 This is a flowchart of a wafer image acquisition method provided in Embodiment 2 of the present invention. This embodiment provides an optional implementation scheme based on the above embodiments. It should be noted that parts not described in detail in the embodiments of the present invention can be referred to the relevant descriptions in other embodiments. For example... Figure 2 As shown, the method includes:
[0047] S201. Obtain the wafer model number of the wafer to be tested.
[0048] Specifically, the model number of the wafer under test is obtained from the user input on the acquisition and control interface.
[0049] S202. Check if the image acquisition height corresponding to the model of the wafer to be tested exists in the wafer database.
[0050] Specifically, if the image acquisition height corresponding to the model of the wafer under test is not found in the wafer database, S203-S209 are executed; if the image acquisition height corresponding to the model of the wafer under test is found in the wafer database, S210-S211 are executed.
[0051] S203. Based on the correspondence between wafer model and wafer thickness in the wafer mapping table, determine the estimated thickness of the wafer to be tested.
[0052] S204. Determine the reference height of the Z-axis motor based on the estimated thickness, the initial height of the Z-axis motor, and the camera anti-collision height.
[0053] S205, Control the Z-axis motor to move from the initial height to the reference height.
[0054] S206. In response to the motor control command sent by the user through the acquisition control interface, control the Z-axis motor to move according to the preset movement step size, and after the Z-axis motor stops moving, in response to the image acquisition command sent by the user through the acquisition control interface, control the camera mounted on the Z-axis motor to acquire the image of the wafer under test, and obtain the image of the wafer under test.
[0055] The preset movement step size can be determined based on the experience of those skilled in the art; for example, the preset movement step size can be 0.1 mm. This embodiment of the invention does not specifically limit it. The motor control command refers to the command to control the Z-axis motor to move up and down within a range of [0.3 mm, 0.5 mm] near the reference height; optionally, the motor control command can be a motor descent command or a motor ascent command. The image to be tested refers to the wafer image whose image clarity needs to be checked to see if it meets the image clarity requirements.
[0056] Specifically, after controlling the Z-axis motor to move from the initial height to the reference height, in response to the motor control command sent by the user through the acquisition control interface, such as the user clicking the "Descend" button on the acquisition control interface, the motor controller controls the Z-axis motor to move downward from the reference height by a preset movement step. After the Z-axis motor stops moving, in response to the image acquisition command sent by the user through the acquisition control interface, such as the user clicking the "Acquire Image" button on the acquisition control interface, the camera mounted on the Z-axis motor is controlled to acquire an image of the wafer under test, thus obtaining the image under test.
[0057] S207. Detect whether the image clarity of the image to be tested meets the image clarity requirements.
[0058] The image clarity requirement can be preset by the user according to actual business needs. Specifically, the image to be tested can be fed back to the user through the acquisition control interface, and the user can determine whether the image clarity of the image to be tested meets the requirements; if it meets the requirements, then execute S208; if it does not meet the requirements, then continue to execute S206.
[0059] S208. Set the current height of the Z-axis motor as the target height of the Z-axis motor.
[0060] The current height refers to the height of the Z-axis motor from the wafer stage at the current moment. Specifically, if the image sharpness of the image under test meets the image sharpness requirements, the current height of the Z-axis motor when acquiring the image under test is taken as the target height of the Z-axis motor.
[0061] Optionally, the target thickness of the wafer under test can be determined based on the estimated thickness, the motor control command corresponding to the current movement of the Z-axis motor, the start pulse, and the stop pulse. The start pulse refers to the pulse that starts the Z-axis motor; the stop pulse refers to the pulse that stops the Z-axis motor. The target thickness refers to the actual thickness of the wafer under test.
[0062] Specifically, based on the start and stop pulses corresponding to the current movement of the Z-axis motor, the error thickness is determined using the following formula:
[0063] ;
[0064] in, Indicates the thickness error; This indicates the stop pulse corresponding to the current movement of the Z-axis motor; This indicates the start pulse corresponding to the current movement of the Z-axis motor. Subsequently, if the motor control command corresponding to this movement of the Z-axis motor is a motor descent command, then the difference between the estimated thickness and the error thickness of the wafer under test will be used as the target thickness of the wafer under test, i.e.: .in, Indicates the target thickness of the wafer to be measured; Indicates the estimated thickness of the wafer to be measured; This indicates the error thickness. If the motor control command corresponding to the current movement of the Z-axis motor is a motor rise command, then the sum of the estimated thickness and the error thickness of the wafer under test is taken as the target thickness of the wafer under test, i.e.: .
[0065] Understandably, in the process of determining the target height of the Z-axis motor, the actual thickness of the wafer under test is automatically determined, avoiding measurement errors caused by manual measurement of the wafer thickness, ensuring the accuracy of the wafer thickness, and thus improving the accuracy of the data collected from the wafer under test.
[0066] Optionally, to facilitate subsequent tracking of relevant data of the wafer under test, the wafer model and target thickness can also be stored in the wafer database.
[0067] S209. The image of the wafer to be tested acquired at the target height is used as the target wafer image of the wafer to be tested.
[0068] S210: In response to the motor motion command sent by the user through the acquisition control interface, control the Z-axis motor to move from the initial height to the image acquisition height.
[0069] The motor motion command refers to the instruction that moves the Z-axis motor from the initial height to the image acquisition height. Specifically, if the image acquisition height corresponding to the model of the wafer under test is detected in the wafer database, the Z-axis motor is controlled to move from the initial height to the image acquisition height in response to the motor motion command sent by the user through the acquisition control interface.
[0070] S211. In response to the image acquisition command sent by the user through the acquisition control interface, control the camera mounted on the Z-axis motor to acquire images of the wafer under test and obtain the target wafer image of the wafer under test.
[0071] Specifically, after controlling the Z-axis motor to move from the initial height to the image acquisition height, in response to the image acquisition command sent by the user through the acquisition control interface, such as when the user clicks the "Acquire Image" button on the acquisition control interface, the camera mounted on the Z-axis motor is controlled to acquire an image of the wafer under test, thus obtaining the target wafer image.
[0072] The technical solution of this invention involves: acquiring the model number of the wafer under test; detecting whether an image acquisition height corresponding to the wafer model exists in the wafer database; if no image acquisition height corresponding to the wafer model is found in the wafer database, determining the estimated thickness of the wafer under test based on the correspondence between wafer model and wafer thickness in the wafer mapping table; determining the reference height of the Z-axis motor based on the estimated thickness, the initial height of the Z-axis motor, and the camera anti-collision height; controlling the Z-axis motor to move from the initial height to the reference height; responding to the motor control command sent by the user through the acquisition control interface, controlling the Z-axis motor to move according to a preset movement step size; and after the Z-axis motor stops moving, responding to the user's command sent through the acquisition control interface. The system sends an image acquisition command to control the camera mounted on the Z-axis motor to acquire an image of the wafer under test, thus obtaining the image under test. It then checks whether the image clarity of the image under test meets the requirements. If it does, the current height of the Z-axis motor is used as the target height for the Z-axis motor. If not, the Z-axis motor continues to move. If an image acquisition height corresponding to the wafer model under test is detected in the wafer database, the system responds to a motor movement command sent by the user through the acquisition control interface, controlling the Z-axis motor to move from the initial height to the image acquisition height. Finally, in response to an image acquisition command sent by the user through the acquisition control interface, the system controls the camera mounted on the Z-axis motor to acquire an image of the wafer under test, thus obtaining the target wafer image. The above technical solution determines the reference height of the Z-axis motor based on the model of the wafer under test. Then, by fine-tuning the height of the Z-axis motor near the reference height, the target height of the Z-axis motor is determined. Compared to wafer image acquisition methods that rely on manually moving the Z-axis motor step by step to determine the image acquisition height, this narrows the range for determining the target height of the Z-axis motor (i.e., the image acquisition height), reduces mechanical wear on the Z-axis motor, and thus extends its service life. Simultaneously, it shortens the camera focusing time and improves the efficiency of wafer image acquisition. Furthermore, compared to wafer image acquisition methods based on a fixed Z-axis motor height, the above technical solution enables image acquisition of different wafer models, ensuring image clarity for different wafer models while improving the image acquisition efficiency for different wafer models.
[0073] Example 3
[0074] Figure 3 This is a schematic diagram of a wafer image acquisition device provided in Embodiment 3 of the present invention. This embodiment is applicable to image acquisition of wafers of different models. The device can be implemented in hardware and / or software and can be configured in an electronic device. Figure 3 As shown, the device includes:
[0075] The thickness estimation module 301 is used to determine the estimated thickness of the wafer under test based on the wafer model and the correspondence between wafer model and wafer thickness in the wafer mapping table when the image acquisition height corresponding to the wafer model under test is not found in the wafer database.
[0076] The reference height determination module 302 is used to determine the reference height of the Z-axis motor based on the estimated thickness, the initial height of the Z-axis motor, and the camera anti-collision height.
[0077] The target height determination module 303 is used to fine-tune the height of the Z-axis motor after controlling the Z-axis motor to move from the initial height to the reference height, and to determine the target height of the Z-axis motor.
[0078] The first wafer image acquisition module 304 is used to acquire the image of the wafer under test at the target height as the target wafer image of the wafer under test.
[0079] The technical solution of this invention, when it is detected that there is no image acquisition height corresponding to the model of the wafer under test in the wafer database, determines the estimated thickness of the wafer under test based on the model of the wafer under test and the correspondence between the wafer model and the wafer thickness in the wafer mapping table; determines the reference height of the Z-axis motor based on the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height; after controlling the Z-axis motor to move from the initial height to the reference height, the height of the Z-axis motor is finely adjusted to determine the target height of the Z-axis motor; and the image of the wafer under test acquired at the target height is used as the target wafer image of the wafer under test. The above technical solution determines the reference height of the Z-axis motor based on the model of the wafer under test. Then, by fine-tuning the height of the Z-axis motor near the reference height, the target height of the Z-axis motor is determined. Compared to wafer image acquisition methods that rely on manually moving the Z-axis motor step by step to determine the image acquisition height, this narrows the range for determining the target height of the Z-axis motor (i.e., the image acquisition height), reduces mechanical wear on the Z-axis motor, and thus extends its service life. Simultaneously, it shortens the camera focusing time and improves the efficiency of wafer image acquisition. Furthermore, compared to wafer image acquisition methods based on a fixed Z-axis motor height, the above technical solution enables image acquisition of different wafer models, ensuring image clarity for different wafer models while improving the image acquisition efficiency for different wafer models.
[0080] Optionally, the target height determination module 303 is specifically used for:
[0081] In response to the motor control command sent by the user through the acquisition control interface, the Z-axis motor is controlled to move according to the preset movement step size. After the Z-axis motor stops moving, in response to the image acquisition command sent by the user through the acquisition control interface, the camera mounted on the Z-axis motor is controlled to acquire the image of the wafer under test and obtain the image of the wafer under test.
[0082] The image sharpness of the image under test is checked to see if it meets the image sharpness requirements.
[0083] If the conditions are met, the current height of the Z-axis motor will be used as the target height of the Z-axis motor.
[0084] If the condition is not met, continue to control the Z-axis motor to move.
[0085] Optionally, the device may also include:
[0086] The target thickness determination module is used to determine the target thickness of the wafer under test based on the estimated thickness, the motor control command, start pulse, and stop pulse corresponding to the current movement of the Z-axis motor, when the image clarity of the detected image meets the image clarity requirements.
[0087] Optionally, the device may also include:
[0088] The target thickness storage module is used to store the wafer model and target thickness of the wafer under test into the wafer database after the target thickness of the wafer under test is determined.
[0089] Optionally, the device may also include:
[0090] The target height storage module is used to store the target height as the image acquisition height corresponding to the model of the wafer under test in the wafer database after determining the target height of the Z-axis motor.
[0091] Optionally, the device may also include:
[0092] The Z-axis motor movement module is used to control the Z-axis motor to move from the initial height to the image acquisition height in response to the motor movement command sent by the user through the acquisition control interface when the image acquisition height corresponding to the model of the wafer to be tested is detected in the wafer database.
[0093] The second wafer image acquisition module is used to respond to the image acquisition command sent by the user through the acquisition control interface, control the camera mounted on the Z-axis motor to acquire images of the wafer under test, and obtain the target wafer image of the wafer under test.
[0094] The wafer image acquisition device provided in the embodiments of the present invention can execute the wafer image acquisition method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects for executing each wafer image acquisition method.
[0095] According to embodiments of the present invention, the present invention also provides an electronic device, a readable storage medium, and a computer program product.
[0096] Example 4
[0097] Figure 4 A schematic diagram of an electronic device 10, which can be used to implement embodiments of the present invention, is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.
[0098] like Figure 4 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded into the RAM 13 from storage unit 18. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.
[0099] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.
[0100] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as wafer image acquisition methods.
[0101] In some embodiments, the wafer image acquisition method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the wafer image acquisition method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the wafer image acquisition method by any other suitable means (e.g., by means of firmware).
[0102] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.
[0103] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.
[0104] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.
[0105] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).
[0106] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.
[0107] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.
[0108] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.
[0109] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.
Claims
1. A wafer image acquisition method, characterized by, The method comprises the following steps: In the case of detecting that the wafer database does not exist the image acquisition height corresponding to the wafer type to be tested, according to the wafer type to be tested, based on the corresponding relationship between the wafer type and the wafer thickness in the wafer mapping table, the estimated thickness of the wafer to be tested is determined; According to the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height, the reference height of the Z-axis motor is determined; After controlling the Z-axis motor to move from the initial height to the reference height, the height of the Z-axis motor is fine-tuned to determine the target height of the Z-axis motor; The wafer image collected at the target height is taken as the target wafer image of the wafer to be tested.
2. The method of claim 1, wherein, Fine-tuning the height of the Z-axis motor to determine the target height of the Z-axis motor comprises: In response to the motor control instruction sent by the user through the acquisition control interface, the Z-axis motor is controlled to move according to the preset moving step, and after the Z-axis motor stops moving, in response to the image acquisition instruction sent by the user through the acquisition control interface, the camera mounted on the Z-axis motor is controlled to perform image acquisition on the wafer to be tested to obtain a test image; Detect whether the image clarity of the test image meets the image clarity requirement; If it meets, the current height of the Z-axis motor is taken as the target height of the Z-axis motor; If it does not meet, the Z-axis motor continues to move.
3. The method of claim 2, wherein, In the case of detecting that the image clarity of the test image meets the image clarity requirement, the method further comprises: According to the estimated thickness, and the motor control instruction, the start pulse and the stop pulse corresponding to the current movement of the Z-axis motor, the target thickness of the wafer to be tested is determined.
4. The method of claim 3, wherein, After determining the target thickness of the wafer to be tested, the method further comprises: The wafer type to be tested and the target thickness of the wafer to be tested are stored in the wafer database.
5. The method of claim 1, wherein, After determining the target height of the Z-axis motor, the method further comprises: The target height is stored in the wafer database as the image acquisition height corresponding to the wafer type to be tested.
6. The method of claim 1, wherein, The method further comprises: In the case of detecting that the wafer database exists the image acquisition height corresponding to the wafer type to be tested, in response to the motor movement instruction sent by the user through the acquisition control interface, the Z-axis motor is controlled to move from the initial height to the image acquisition height; In response to the image acquisition instruction sent by the user through the acquisition control interface, the camera mounted on the Z-axis motor is controlled to perform image acquisition on the wafer to be tested to obtain the target wafer image of the wafer to be tested.
7. A wafer image acquisition apparatus, comprising: The method comprises the following steps: The estimated thickness determination module is used for detecting that the wafer database does not exist the image acquisition height corresponding to the wafer type to be tested, according to the wafer type to be tested, based on the corresponding relationship between the wafer type and the wafer thickness in the wafer mapping table, the estimated thickness of the wafer to be tested is determined; The reference height determination module is used for determining the reference height of the Z-axis motor according to the estimated thickness, the initial height of the Z-axis motor and the camera anti-collision height; a target height determination module configured to fine-tune the height of the Z-axis motor after the Z-axis motor is controlled to move from the initial height to the reference height, and determine a target height of the Z-axis motor; a first wafer image acquisition module configured to acquire a wafer image of the wafer to be measured at the target height as a target wafer image of the wafer to be measured.
8. An electronic device, comprising: The electronic device comprises: at least one processor; and a memory connected to the at least one processor in communication; wherein the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the wafer image acquisition method of any one of claims 1-6.
9. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for causing the processor to execute the wafer image acquisition method of any one of claims 1-6 when executed.
10. A computer program product comprising a computer program which, when executed by a processor, implements the wafer image acquisition method of any one of claims 1-6.